CN106304687B - A kind of circuit board carrier - Google Patents
A kind of circuit board carrier Download PDFInfo
- Publication number
- CN106304687B CN106304687B CN201610719086.2A CN201610719086A CN106304687B CN 106304687 B CN106304687 B CN 106304687B CN 201610719086 A CN201610719086 A CN 201610719086A CN 106304687 B CN106304687 B CN 106304687B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- steel disc
- welding
- fitting
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Abstract
The present invention provides a kind of circuit board carrier, and for fixed to realize the welding between circuit board, the circuit board carrier includes matrix and pressing steel disc；Wherein, described matrix is equipped at least one holding area for being used to place the first circuit board and second circuit board after fixed fitting；Described matrix is additionally provided with connector, and described matrix is realized by the connector and is bonded with pressing steel disc fixation, so that the first circuit board after the fitting is fixed on each holding area with second circuit board.It may be implemented first to be bonded formation entirety between circuit board and circuit board by the auxiliary of the circuit board carrier, then complete paste solder printing, patch and cross furnace welding procedure；Process flow can be greatly reduced, and solve the problems, such as that welding quality is bad.
Description
Technical field
The present invention relates to surface mounting technology (SMT, Surface Mount Technology) more particularly to surface mounts
Used circuit board carrier in technology.
Background technique
When being produced in batches using surface mounting technology, fixing circuit board usually is placed by circuit board carrier, then lead to
It crosses print solder paste, attachment component and crosses the process flows such as furnace.
Circuit board can be divided into PCB and FPCB two major classes；Being welded as of usual circuit board and circuit board realizes PCB's and FPCB
Welding.
Current PC B and the existing two types of FPCB bond pattern:
Class1: the two is weldingly connected by PCB and FPCB by tin soldering machine or hot press:
Disadvantage: 1) because of rapid heating-cooling, its solder is easy to produce tin sweat(ing) in welding process, so as to cause functional shunt with
And the protective film on the surface FPCB is easy scald；2) solder joint consistency is poor, and quality is unstable；3) after the completion of the welding of PCB mount components
It is welded offline with FPCB again, two procedures operation, therefore production efficiency bottom need to be divided, manufacturing cost is high；4) investment buying is needed to weld
Tin machine or hot press device.
Type 2: then FPCB is mounted on tin cream reflow soldering together by the print solder paste on PCB pad:
Disadvantage: 1) it mounts FPCB and is easily destroyed tin cream molding in the process, tin sweat(ing) is generated, to cause functional shunt；2)
Only FPCB bottom land eats tin to easily form rosin joint and single-sided welding its solder joint is easy to be stripped.
To sum up, the prior art totality problem: process is complex, and welding effect is bad.
Summary of the invention
The purpose of the present invention is to provide a kind of circuit board carrier, can assist realizing first circuit board and second circuit board
Between first fitting formed whole, then by paste solder printing, patch and cross the techniques such as furnace welding and realize first circuit board and second circuit
The welding of plate；Process flow can be greatly reduced, and solve the problems, such as that welding quality is bad.
To achieve the above object, the present invention provides a kind of circuit board carrier, for fixed to realize the weldering between circuit board
It connects, the circuit board carrier includes matrix and pressing steel disc；Wherein, after described matrix is equipped at least one for placing fitting
The holding area of first circuit board and second circuit board；Described matrix is additionally provided with connector, and described matrix is real by the connector
It is now bonded with pressing steel disc fixation, so that the first circuit board after the fitting is fixed on each institute with second circuit board
It states on holding area.
Compared with prior art, the present invention is used in SMT technique, and first circuit board and second circuit board are placed on base
On body, and first circuit board and second circuit board can be made to post and fix on matrix by placing pressing steel disc, make two
Circuit board fits to be formed integrally carries out the techniques such as paste solder printing, patch and welding again, to make first circuit board and the second electricity
The welding of welding and electronic component between the plate of road can synchronize progress, greatly reduce process flow, and save the cost mentions
The high quality of product.
Preferably, the connector includes several high temperature magnet being embedded in described matrix, and the pressing steel disc is
Can magnetically attractive steel disc, the pressing steel disc using magnetism fixation fit in described matrix.
Preferably, several described high temperature magnet are distributed in position of the described matrix for being bonded with the pressing steel disc.
Preferably, the present invention is embedded with high temperature magnet in matrix, when pressing steel disc is placed on matrix, high temperature
Magnet and pressing steel disc are attracting because of magnetic action, and pressing steel disc can realize that fixation is bonded with matrix, to make first circuit board
It is securely fixed on matrix with second circuit board；Which is easy to operate, and is easy to the taking-up after the completion of welding circuit board.
Preferably, described matrix is used to cover the institute on each holding area with the position that the pressing steel disc is bonded
The position that first circuit board and second circuit board after stating fitting fit.
Further, the pressing steel disc is equipped with welding window, and the welding window corresponds to the first circuit board
And/or the second circuit board and the pad of the pressing steel disc joint place are arranged.
Further, the holding area is groove, and each groove is for placing the first circuit after the fitting
Plate and second circuit board.
Corresponding groove is set on matrix for placing first circuit board and second circuit board, on the one hand, can correspond to
The position of first circuit board and second circuit board on matrix is positioned, makes to be welded to each other between first circuit board and second circuit board
Locate accurate contraposition；On the other hand, circuit board can be made to position the corresponding position being placed on matrix by groove, be conducive to automatic welding
The procedures of tin printing and attachment component.
Further, described matrix is additionally provided with two notches, and two notches are respectively arranged on all accommodating areas
Domain is integrally formed outside two opposite side in space.
Two notches are set on matrix, convenient for placement and taking-up of the circuit board on matrix.
Further, the first circuit board is PCB, and the second circuit board is FPCB；Or, the first circuit board is
FPCB, the second circuit board are PCB.
Detailed description of the invention
Fig. 1 is a kind of 1 top view of matrix of the preferred embodiment of circuit board carrier of the present invention；
Fig. 2 is a kind of 1 bottom view of matrix of the preferred embodiment of circuit board carrier of the present invention；
Fig. 3 is a kind of 1 main view of matrix of the preferred embodiment of circuit board carrier of the present invention；
Fig. 4 is a kind of 1 pictorial diagram of matrix of the preferred embodiment of circuit board carrier of the present invention；
Fig. 5 is the structure chart of the pressing steel disc 2A of preferred embodiment of circuit board carrier of the present invention a kind of；
Fig. 6 is the structure chart of the pressing steel disc 2B of preferred embodiment of circuit board carrier of the present invention a kind of；
Fig. 7 is that a kind of fixation of the preferred embodiment of circuit board carrier of the present invention is fitted with first circuit board and second circuit
The circuit board carrier pictorial diagram of plate；
Fig. 8 is a kind of circuit board carrier structure chart of the preferred embodiment of circuit board carrier of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of circuit board carrier, for fixed to realize the welding between circuit board.This implementation
The circuit board carrier that example provides includes matrix 1.Fig. 1, Fig. 2 and Fig. 3 are respectively the top view, bottom view and main view of matrix 1；Figure
4 be the pictorial diagram of matrix 1.Wherein, matrix 1 is equipped with several grooves 11, for place the first circuit board after fixed fitting with
Second circuit board；Specifically, the first circuit board after fitting and second circuit board are referred to by by first circuit board and second
The integrated circuit plate that circuit board needs the place of being welded to each other to be superimposed together constituted.
In the present embodiment first circuit board and second circuit board, each groove 11 can be placed and positioned for realization groove 11
Both sides be equipped with positioning side 111 and position gap 112.
Matrix 1 is embedded with several high temperature magnet.
Matrix 1 is additionally provided with two notches 12, and two notches 12 are respectively arranged on the space being made of all grooves 11
Outside two opposite side.
Circuit board carrier provided in this embodiment further includes pressing steel disc 2, and referring to figs. 5 and 6, Fig. 5 and Fig. 6 respectively can
It is placed on the pressing steel disc 2A of different location and pressing steel disc 2B on same matrix 1；It presses steel disc 2A and presses what steel disc 2B was placed
Specific location can be found in Fig. 7 and Fig. 8.It is consistent with pressing steel disc 2B structure to press steel disc 2A.
Pressing steel disc 2 be used for by after fitting first circuit board and second circuit board be integrally attached to matrix 1, pressing
Steel disc 2 be equipped with welding window 21, welding window 21 correspond to fitting after first circuit board and second circuit board entirety with
Press the pad locations setting of 2 joint place of steel disc.
Press steel disc 2 be can magnetically attractive steel disc, pressing steel disc 2 with the magnetic action of the high temperature magnet in matrix 1 using being bonded
In on matrix 1.
In actual production design, reliably it is fitted on matrix 1 to make to press steel disc 2, the high-temp magnetic that matrix 1 embeds
Iron is specifically distributed in position of the matrix 1 for being bonded with pressing steel disc 2.
In addition, in the present embodiment, the position covering first circuit board and second that pressing steel disc 2 is used to be bonded with matrix 1
Position is located in fitting for circuit board, can be maximum on the basis of guaranteeing that the circuit board joint place for needing mutually to weld fits closely
Material needed for saving to degree pressing steel disc 2.
The present embodiment, second circuit board are used for the pad that be bonded with first circuit board equipped with through-hole, first circuit board and the
When two circuit boards are bonded, second circuit board is overlayed on first circuit board；Realize that first circuit board and second circuit board pass through this
After the auxiliary fitting of circuit board carrier provided by embodiment, when carrying out paste solder printing and welding, it is printed on second circuit board and is used for
The tin cream on pad being bonded with first circuit board is penetrated on the pad of bottom by through-hole, makes first circuit board and the second electricity
Road plate is closely attached together by tin cream.Or, the pad that first circuit board is used to be bonded with second circuit board is equipped with through-hole,
When first circuit board and second circuit board are bonded, first circuit board is stacked on the second circuit board, the first circuit board and the
The auxiliary for the circuit board carrier that the structure of two circuit boards can also provide through this embodiment realizes welding effect.
Referring to Fig. 7, the present embodiment is PCB with first circuit board, provided in this embodiment for second circuit board is FPCB
Circuit board carrier is designed using symmetrical structure, improves circuit board carrier circuit board saturation.This sentences the half of circuit board carrier
Be illustrated: groove 11 folded by every two positioning side 111 positions PCB for placing PCB, and by positioning side 111；Every two positioning
Groove 11 folded by gap 112 fits place for placing PCB and FPCB；It can be real to make PCB and FPCB need to be bonded to each other place
Now accurate fitting, the pedestal that can also be equipped with positioning steel disc by one in practice, matrix 1 can be placed on pedestal,
Positioning steel disc can pass through corresponding position gap 112 one by one and form deep groove to accommodate and position the mutual patch of PCB and FPCB
At conjunction.
Pressing steel disc 2 be placed in PCB and FPCB fit place position above, matrix 1 using it is magnetic with press 2 phase of steel disc
It is attracted, to realize that PCB and FPCB after fitting are integrally attached on matrix 1.
Matrix 1 is additionally provided with two notches 12, and two notches 12 are respectively arranged on the space being made of all grooves 11
Outside two opposite side, after the space that all grooves 11 are constituted is convenient for the placement and welding of PCB jigsaw entirety by the notch 12
PCB and FPCB overall structure multiple-printed-panel for circuit board taking-up.
The welding process between PCB and FPCB realized by the circuit board carrier: will be fixed with fitting after PCB and
The circuit board carrier of FPCB is placed in steel mesh bottom, wherein and the onboard lamps structure of steel mesh corresponding circuits is designed as two-sided stairstepping, and
The pad setting of PCB and FPCB after the corresponding fitting of the aperture of steel mesh；By the aperture of steel mesh by paste solder printing after fitting
In the pad locations of PCB and FPCB.Upper corresponding electronic component is mounted in corresponding pad locations again, it will be onboard by circuit
Tool realizes that the PCB of fitting and FPCB are put into reflux furnace apparatus welding, and FPCB is used to be bonded the tin cream of the pad upper surface fusing of PCB
It is penetrated by through-hole on the pad of bottom PCB, makes to realize between PCB and FPCB by tin cream and weld；Meanwhile on other pads
Tin cream fusing, realize being weldingly connected for electronic component and corresponding other pads.Finally, PCB and FPCB are integrally taken out,
PCB and FPCB completes welding.
It is FPCB according to first circuit board on the basis of the principle of the present invention, second circuit board designs circuit for PCB's
The embodiment of the structure of onboard tool is also in protection scope.
When it is implemented, circuit board carrier is equipped with the groove for placing first circuit board and second circuit board after being bonded
11, position on matrix 1 of first circuit board and second circuit board is positioned by the groove 11 and makes first circuit board and the
Two circuit boards, which fit, locates accurate correspondence；And fix first circuit board and second circuit board after fitting using pressing steel disc 2
On matrix 1；The welding window that steel disc 2 is equipped with the pad setting of corresponding first circuit board and second circuit board is pressed, so as to
The paste solder printing of pad.
Two circuit boards can be made to fit to be formed and whole carry out paste solder printing, patch and weldering again by the circuit board carrier
Technique is connect, is carried out to realize that the welding of electronic component on welding and two circuit boards between two circuit boards is synchronous,
Greatly reduce process flow, save the cost；By the welding for two circuit boards that the circuit board carrier is realized, welding effect is more
It is good, improve product quality.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principle of the present invention, several improvement and deformations can also be made, these improvement and deformations are also considered as
Protection scope of the present invention.
Claims (6)
1. a kind of circuit board carrier, for fixed to realize the welding between circuit board, which is characterized in that the circuit board carrier
Including matrix and pressing steel disc；Wherein, described matrix be equipped at least one be used to place first circuit board after fixed fitting with
The holding area of second circuit board；Described matrix is additionally provided with connector, and described matrix is realized and the pressing by the connector
The fixed fitting of steel disc, so that the first circuit board after the fitting is fixed on each holding area with second circuit board
On；The holding area is groove, and each groove is for the first circuit board and second circuit board after placement fitting；Often
The both sides of one groove are equipped with positioning side and position gap；The pressing steel disc is equipped with welding window, the welding window pair
First circuit board described in Ying Yu and/or the second circuit board and the pad of the pressing steel disc joint place are arranged；
By in the pad locations of the first circuit board and second circuit board of the welding window by paste solder printing after fitting；
Upper corresponding electronic component is mounted in corresponding pad locations again, first electricity of fitting will be realized by circuit board carrier
Road plate and second circuit board are put into reflux furnace apparatus welding, and the pad upper surface that first circuit board is used to be bonded second circuit board is molten
The tin cream of change is penetrated by through-hole on the pad of bottom second circuit board, makes to pass through tin between first circuit board and second circuit
Cream realizes welding；Meanwhile the tin cream fusing on other pads, realize the welding phase of electronic component and corresponding other pads
Even.
2. circuit board carrier as described in claim 1, which is characterized in that the connector includes being embedded in described matrix
Several high temperature magnet, the pressing steel disc be can magnetically attractive steel disc, the pressing steel disc fits in the base using magnetic fix
On body.
3. circuit board carrier as claimed in claim 2, which is characterized in that several described high temperature magnet are distributed in described matrix
Position for being bonded with the pressing steel disc.
4. circuit board carrier as claimed in claim 3, which is characterized in that described matrix was used to be bonded with the pressing steel disc
Position covers the position that the first circuit board after the fitting on each holding area and second circuit board fit.
5. circuit board carrier as described in claim 1, which is characterized in that described matrix is additionally provided with two notches, described in two
Notch is respectively arranged on all holding areas and is integrally formed outside two opposite side in space.
6. circuit board carrier as claimed in any one of claims 1 to 5, which is characterized in that the first circuit board is PCB, institute
Stating second circuit board is FPCB；Or, the first circuit board is FPCB, the second circuit board is PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719086.2A CN106304687B (en) | 2016-08-24 | 2016-08-24 | A kind of circuit board carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719086.2A CN106304687B (en) | 2016-08-24 | 2016-08-24 | A kind of circuit board carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106304687A CN106304687A (en) | 2017-01-04 |
| CN106304687B true CN106304687B (en) | 2019-01-04 |
Family
ID=57615052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610719086.2A Active CN106304687B (en) | 2016-08-24 | 2016-08-24 | A kind of circuit board carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304687B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793565A (en) * | 2017-01-06 | 2017-05-31 | 昆山圆裕电子科技有限公司 | The easy plates of FPC stick up the welding procedure of electron-like component |
| CN113015351B (en) * | 2019-12-19 | 2022-10-21 | 北京小米移动软件有限公司 | Press welding equipment |
| CN112382713A (en) * | 2020-10-27 | 2021-02-19 | 浙江英特来光电科技有限公司 | SMD full-color LED packaging structure based on flip-chip technology |
| CN114289814A (en) * | 2021-12-31 | 2022-04-08 | 东莞华贝电子科技有限公司 | Circuit board welding method and jig |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN103630551A (en) * | 2013-12-05 | 2014-03-12 | 无锡市同步电子制造有限公司 | PCB (Printed Circuit Board) bracket for automatic optic inspection device |
| CN105307420A (en) * | 2015-10-13 | 2016-02-03 | 惠州市蓝微电子有限公司 | PCB and FPC welding method and surface mounting jig |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008205132A (en) * | 2007-02-19 | 2008-09-04 | Nec Corp | Printed wiring board, and solder connection structure and method between the structure and flexible printed board |
-
2016
- 2016-08-24 CN CN201610719086.2A patent/CN106304687B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN101720172A (en) * | 2009-12-11 | 2010-06-02 | 惠州市数码特信息电子有限公司 | Method for assembly and reflow soldering of PCB and FPC and special positioning fixture thereof |
| CN103630551A (en) * | 2013-12-05 | 2014-03-12 | 无锡市同步电子制造有限公司 | PCB (Printed Circuit Board) bracket for automatic optic inspection device |
| CN105307420A (en) * | 2015-10-13 | 2016-02-03 | 惠州市蓝微电子有限公司 | PCB and FPC welding method and surface mounting jig |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106304687A (en) | 2017-01-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106304688B (en) | The welding structure and its welding method of PCB and FPCB | |
| CN106304687B (en) | A kind of circuit board carrier | |
| CN105307420B (en) | A kind of PCB and FPC welding method and bonding tool | |
| CN104507271B (en) | The PCBA processing methods and PCBA board combined based on plug-in element technique and paster technique | |
| CN204221244U (en) | The manual welding fixture of electronic component | |
| CN103934537B (en) | Plug-in unit welding procedure and welding carrier on a kind of pcb board | |
| CN103313527A (en) | Furnace-through fixture for reflow soldering | |
| CN102783257A (en) | Electrical contact arrangement | |
| CN204094281U (en) | The fixture of optic module PCB plate contact pin welding | |
| CN210202353U (en) | Thin printed circuit board paster frock | |
| CN106304686B (en) | A kind of circuit board laminating apparatus | |
| CN109202200A (en) | A kind of microwave components integration welding method | |
| CN105120602A (en) | Small and medium-sized PCB components mixed installing technology | |
| CN206952317U (en) | Wave soldering carrier | |
| CN211240289U (en) | PCB convenient to paster | |
| CN204470756U (en) | Through-hole reflow positioning fixture | |
| JP2009218358A5 (en) | ||
| CN102658410A (en) | Printed circuit board (PCB) and via hole element soldering method and PCB soldered by the method | |
| JP2009141273A (en) | Screen mask, printing method of conductive joint material, packaging parts packaging method, and packaging substrate | |
| CN211162281U (en) | Optical module PCB welding fixing device for reflow oven | |
| CN105491815A (en) | Reflow soldering template, template component, tin paste printing device and reflow soldering method | |
| CN217693921U (en) | OSP process jig | |
| US7943860B2 (en) | Material board for producing hybrid circuit board with metallic terminal plate and method for producing hybrid circuit board | |
| CN216123431U (en) | SMT positioning jig | |
| CN210328439U (en) | Paster clamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 510670 Guangzhou High-tech Industrial Development Zone Science City, Guangdong Province, South Yun Road 39 (1) Building, the first, second and third floors Applicant after: Guangzhou new energy Co. Ltd. Address before: 510663 No. 39 (1), South Yun three road, science and Technology City, Guangzhou high tech Industrial Development Zone, Guangdong Applicant before: GUANGZHOU LIANGSHI COMMUNICATION APPLIANCE CO., LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 510670 Guangzhou High-tech Industrial Development Zone Science City, Guangdong Province, South Yun Road 39 (1) Building, the first, second and third floors Patentee after: Guangzhou Mingmei new energy Co., Ltd Address before: 510670 Guangzhou High-tech Industrial Development Zone Science City, Guangdong Province, South Yun Road 39 (1) Building, the first, second and third floors Patentee before: GUANGZHOU TWS NEW ENERGY Co.,Ltd. |