CN205812494U - A kind of circuit board assembly - Google Patents

A kind of circuit board assembly Download PDF

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Publication number
CN205812494U
CN205812494U CN201620795463.6U CN201620795463U CN205812494U CN 205812494 U CN205812494 U CN 205812494U CN 201620795463 U CN201620795463 U CN 201620795463U CN 205812494 U CN205812494 U CN 205812494U
Authority
CN
China
Prior art keywords
radome
circuit board
board assembly
pad
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620795463.6U
Other languages
Chinese (zh)
Inventor
曾永聪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Tinno Wireless Technology Co Ltd
Original Assignee
Shenzhen Tinno Wireless Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Tinno Wireless Technology Co Ltd filed Critical Shenzhen Tinno Wireless Technology Co Ltd
Priority to CN201620795463.6U priority Critical patent/CN205812494U/en
Application granted granted Critical
Publication of CN205812494U publication Critical patent/CN205812494U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The application relates to a kind of circuit board assembly.This circuit board assembly includes pcb board and radome, being provided with pad on described PCB, described radome includes that body, described body are welded on described pad and form shielding space, described radome also includes that connection reinforcement portion, described connection reinforcement portion are connected with described pcb board.The program can reduce the incidence rate that radome comes off.

Description

A kind of circuit board assembly
Technical field
The application relates to electronic components technical field, particularly relates to a kind of circuit board assembly.
Background technology
At present, the electronic equipment on market often relates to EMC (Electro Magnetic Compatibility, electricity Magnetic is compatible) and wireless RF (Radio Frequency, radio frequency) performance, it is therefore desirable in hardware designs, use screen Cover cover to prevent to external radiation with by radiation interference.Welding pin it is provided with, with PCB (Printed Circuit on radome Board, printed circuit board) corresponding pad is weldingly connected by SMT (Surface Mounted Technology) on plate, rise To shielding action.
In the related, radome is by characterizing the surface of its thickness and PCB pad solder, due to the thickness of radome Spend less, therefore, the least with the bonding area of PCB pad.When mobile phone falls, under radome is easy to come off from pad Come, cause the faults such as internal short-circuit.
It is, therefore, desirable to provide a kind of improved plan solves drawbacks described above.
Utility model content
This application provides a kind of circuit board assembly, the incidence rate that radome comes off can be reduced.
This application provides a kind of circuit board assembly, including pcb board and radome, described PCB is provided with pad, institute Stating radome and include that body, described body are welded on described pad and are formed shielding space, described radome also includes connecting Rib, described connection reinforcement portion is connected with described pcb board.
Preferably, described connection reinforcement portion is extension board, and described extension board extends out from least side of described body, And described extension board is connected with described pad.
Preferably, the bearing of trend of described extension board is dorsad and/or towards described shielding space.
Preferably, the quantity of described extension board is multiple, and multiple described extension boards are evenly distributed on the week of described radome To and with described pad solder.
Preferably, described extension board and described body are integral type structure.
Preferably, described extension board and described pad solder form the first solder side, described body and described pad solder Forming the second solder side, described pad includes that main weld zone and weld zone, edge, described main weld zone are used for welding electronic device, Weld zone, described edge is used for welding the width sum of described radome, described first solder side width and described second solder side Width equal to weld zone, described edge.
Preferably, described main weld zone extends circumferentially and form continuous print welding region along described radome.
Preferably, also including welding auxiliary agent, described radome is welded to connect by the described auxiliary agent that welds with described pcb board.
Preferably, described radome is made up of metal alloy compositions.
Preferably, described radome is integrated punch forming.
The technical scheme that the application provides can reach following beneficial effect:
This application provides a kind of circuit board assembly, this circuit board assembly includes pcb board and radome, on the one hand, shielding The body of cover is fixed with the pad solder on pcb board;On the other hand, connection reinforcement portion is also set on radome, and will connect Rib is connected with pcb board.Use the program so that the bonding strength between pcb board and radome is strengthened, when mobile phone falls When falling, reduce the risk that radome comes off from pcb board.
It should be appreciated that it is only exemplary that above general description and details hereinafter describe, can not be limited this Application.
Accompanying drawing explanation
The partial schematic diagram of the pcb board that Fig. 1 is provided by the embodiment of the present application;
Fig. 2 weld with pcb board by the radome that embodiments herein is provided after sectional view I;
Fig. 3 weld with pcb board by the radome that embodiments herein is provided after sectional view II.
Reference:
10-PCB plate;
101-pad;
The main weld zone of 1011-;
Weld zone, 1012-edge;
20-radome;
201-body;
2011-the second solder side;
202-extension board;
2021-the first solder side.
Accompanying drawing herein is merged in description and constitutes the part of this specification, it is shown that meet the enforcement of the application Example, and for explaining the principle of the application together with description.
Detailed description of the invention
Below by specific embodiment and combine accompanying drawing the application is described in further detail.
As Figure 1-3, this application provides a kind of circuit board assembly, this circuit board assembly includes pcb board 10 and screen Cover cover 20.Pcb board 10, also known as printed circuit board, is the important carrier of electronic devices and components realization electrical connection.Electronic equipment is often Relate to EMC (Electro Magnetic Compatibility, Electro Magnetic Compatibility) and wireless RF (Radio Frequency, radio frequency) performance, therefore, in hardware designs in the electronic device, it is often necessary to by radome 20 Prevent electronic equipment to external radiation and this electronic equipment by extraneous radiation interference.
Being provided with pad 101 on pcb board 10, radome 20 includes that body 201, body 201 are welded on pad 101 and shape Become shielding space.This shielding space by the electron device package that is mounted on pcb board 10 within it, to prevent the right of electronic equipment External radiation or by extraneous radiation interference.
In the application, on the one hand body 201 is welded to connect with pad 101;On the other hand, the radome 20 also company of including Connecing rib, radome 20 is connected with pcb board 10 also by this connection reinforcement portion.It follows that pcb board 10 and radome 20 it Between bonding strength be reinforced.When mobile phone falls, the risk that radome 20 departs from from pcb board 10 reduces.
In this area, the embodiment in connection reinforcement portion has multiple.For example, it is possible to arrange a plate on body 201, This connecting plate and pcb board 10 are bolted fastening.And for example, body 201 arranges buckle, by buckle and pcb board 10 are fixed.In the present embodiment, preferably connection reinforcement portion is extension board 202, and extension board 202 is from least the one of body 201 Side extends out, and extension board 202 is welded to connect with pad 101.The most above-mentioned scheme of the program is compared, and decreases threaded The use of part, it is to avoid buckle is set so that attachment structure is simpler, it is easy to accomplish.
And more preferably, it is also possible to being provided with multiple extension board 202, multiple extension boards 202 are evenly distributed on radome 20 Circumference, and each extension board 202 is all welded to connect with pad 101.This scheme, by increasing the quantity of extension board 202, increases The bonding area of radome 20 and pad 101 so that the bonding strength of radome 20 and pcb board 10 is strengthened further, both it Between connection reliability promote further.
According to the application, bearing of trend when extension board 202 extends out from body 201 is not limited.Such as, multiple In extension board 202, wherein having several extension board 202 to extend to the inside of shielding space, the most several extension boards 202 are to shielding sky Between outside extension.
In the present embodiment, as shown in figures 2-3, the most multiple extension boards 202 all extend in shielding space, or all to screen Covering and extend outside space, such setting can be reduced radome 20 and added the difficulty in man-hour, saves manufacturing procedure and convenient to operate.
Further, pad 101 includes that main weld zone 1011 and weld zone, edge 1012, main weld zone 1011 are used for welding electronics Device, weld zone, edge 1012 is used for welding radome 20.When extension board 202 welds with pad 101, form between the two One solder side 2021, when body 201 welds with pad 101, forms the second solder side 2011 between the two.In the present embodiment, excellent Select the width of the first solder side 2021 and the width sum of the second solder side 2011 width equal to weld zone, edge 1012.As After this is arranged so that radome 20 increases further with the bonding area of weld zone, edge 1012, it is ensured that enough Weld strength.
Further, the weld zone, edge 1012 welded with radome 20 can be continuous print, it is also possible to interruption.This reality Executing in example, preferably weld zone, edge 1012 extends circumferentially and form continuous print welding region along radome 20.The program is permissible Facilitate the setting of extension board 202, it is to avoid cause that cannot weld to lack owing to weld zone, edge 1012 does not aligns with extension board 202 Fall into.
Further, the circuit board assembly that the application provides also includes welding auxiliary agent, and welding auxiliary agent can dissolve by weldering mother metal table The oxide-film in face, prevent from being welded the reoxidation of mother metal and reducing the surface tension of fusion welding.The above-mentioned merit of welding auxiliary agent Welding quality good between radome 20 and pcb board 10 can be can ensure that, reduce the generation causing the defect such as rosin joint, sealing-off. Welding auxiliary agent can select solder(ing) paste etc..
Additionally, in the present embodiment, further preferably body 201 and extension board 202 are integral type structure.Integral structure can simplify The process for machining and manufacturing of radome 20, reduces production cost.The integral structure of radome 20 can use integrated punching molding, also Can be obtained by modes such as castings.
On the other hand, the material of radome 20 has multiple choices.Such as, radome 20 can be made of stainless steel.This reality Executing in example, preferable mask cover 20 is made up of metal alloy compositions.Such as copper-nickel alloy etc., copper-nickel alloy has a good corrosion resistance, and easily In plastic working and welding.
The foregoing is only the preferred embodiment of the application, be not limited to the application, for the skill of this area For art personnel, the application can have various modifications and variations.All within spirit herein and principle, that is made any repaiies Change, equivalent, improvement etc., within should be included in the protection domain of the application.

Claims (10)

1. a circuit board assembly, including pcb board and radome, described pcb board is provided with pad, and described radome includes Body, described body is welded on described pad and forms shielding space, it is characterised in that
Described radome also includes that connection reinforcement portion, described connection reinforcement portion are connected with described pcb board.
Circuit board assembly the most according to claim 1, it is characterised in that described connection reinforcement portion is extension board, described in prolong Stretch plate to extend out from least side of described body, and described extension board is connected with described pad.
Circuit board assembly the most according to claim 2, it is characterised in that the bearing of trend of described extension board dorsad and/or Towards described shielding space.
4. according to the circuit board assembly described in Claims 2 or 3, it is characterised in that the quantity of described extension board is multiple, multiple Described extension board be evenly distributed on described radome circumference and with described pad solder.
Circuit board assembly the most according to claim 4, it is characterised in that described extension board and described body are integral type knot Structure.
Circuit board assembly the most according to claim 5, it is characterised in that described extension board and described pad solder form the One solder side, described body and described pad solder form the second solder side, and described pad includes main weld zone and edge welding District, described main weld zone is used for welding electronic device, and weld zone, described edge is used for welding described radome, described first welding The width sum of the width in face and described second solder side is equal to the width of weld zone, described edge.
Circuit board assembly the most according to claim 6, it is characterised in that described main weld zone is along the circumference of described radome Extend and formed continuous print welding region.
Circuit board assembly the most according to claim 1, it is characterised in that also include welding auxiliary agent, described radome and institute State pcb board to be welded to connect by described welding auxiliary agent.
Circuit board assembly the most according to claim 1, it is characterised in that described radome is made up of metal alloy compositions.
Circuit board assembly the most according to claim 1, it is characterised in that described radome is integrated punch forming.
CN201620795463.6U 2016-07-26 2016-07-26 A kind of circuit board assembly Expired - Fee Related CN205812494U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620795463.6U CN205812494U (en) 2016-07-26 2016-07-26 A kind of circuit board assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620795463.6U CN205812494U (en) 2016-07-26 2016-07-26 A kind of circuit board assembly

Publications (1)

Publication Number Publication Date
CN205812494U true CN205812494U (en) 2016-12-14

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CN201620795463.6U Expired - Fee Related CN205812494U (en) 2016-07-26 2016-07-26 A kind of circuit board assembly

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106028627A (en) * 2016-07-26 2016-10-12 深圳天珑无线科技有限公司 Circuit board assembly
CN113347788A (en) * 2021-06-16 2021-09-03 维沃移动通信有限公司 Printed circuit board structure and electronic equipment
WO2024011893A1 (en) * 2022-07-13 2024-01-18 荣耀终端有限公司 Circuit board, circuit board assembly, and electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106028627A (en) * 2016-07-26 2016-10-12 深圳天珑无线科技有限公司 Circuit board assembly
CN113347788A (en) * 2021-06-16 2021-09-03 维沃移动通信有限公司 Printed circuit board structure and electronic equipment
WO2024011893A1 (en) * 2022-07-13 2024-01-18 荣耀终端有限公司 Circuit board, circuit board assembly, and electronic device

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161214

Termination date: 20180726

CF01 Termination of patent right due to non-payment of annual fee