CN102129936B - Process for manufacturing thin-type temperature fuse with cushion layer - Google Patents
Process for manufacturing thin-type temperature fuse with cushion layer Download PDFInfo
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- CN102129936B CN102129936B CN201110027599.4A CN201110027599A CN102129936B CN 102129936 B CN102129936 B CN 102129936B CN 201110027599 A CN201110027599 A CN 201110027599A CN 102129936 B CN102129936 B CN 102129936B
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- Prior art keywords
- carrier band
- fusible core
- cushion layer
- temperature fuse
- metal pins
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 238000003466 welding Methods 0.000 claims abstract description 33
- 230000001680 brushing effect Effects 0.000 claims abstract description 4
- 230000004907 flux Effects 0.000 claims description 28
- 238000005476 soldering Methods 0.000 claims description 21
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- -1 polybutylene terephthalate Polymers 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 6
- 239000000956 alloy Substances 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 241000567030 Ampulloclitocybe clavipes Species 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 206010043101 Talipes Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 201000011228 clubfoot Diseases 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Abstract
The invention relates to a process for manufacturing a thin-type temperature fuse with a cushion layer. The thin-type temperature fuse with the cushion layer comprises a pair of metal pins, wherein the metal pins are opposite to each other and are in linear arrangement; spacing is reserved between end parts; the cushion layer is arranged on the spacing part; a lower carrier band is arranged below the end parts of the metal pins; the cushion layer separates the two end parts from each other horizontally and separates a fusible core from the lower carrier band longitudinally; the two end parts are connected by welding the fusible core; a fluxing agent is coated on the fusible core by brushing; an upper carrier band covers from the top; the upper carrier band and the lower carrier band form closed space; and the end parts of the metal pins, the fusible core and the fluxing agent are sealed in the closed space, wherein the fusible core is welded on the pins from the back. By the process, the fusible core is protected by back welding; the defects of appearance damage, oxide layer increment, and general secondary crystals accompanied by crystal growth in the fusible core in conventional alloy positive welding are overcome; and the abnormal rise, caused by excessive welding heat of the fusible core, of a fusing temperature is reduced greatly.
Description
Technical field
The present invention relates to the manufacturing process of the thin temperature fuse with bed course that use for electronic products overheat protector slim element, especially battery of mobile phone use.
Background technology
In recent years, communications industry was increasingly flourishing, especially aspect radio communication, the market of mobile phone oneself to spread to be almost staff one machine.Popularizing of mobile phone directly driven the especially expansion of battery of mobile phone market scale of mobile phone parts.
But in the market high speed development process intermediate frequency raw quality problems that take place frequently, as all parts of the world battery of mobile phone, blast is hurted sb.'s feelings, the Nokia whole world recalls battery that 4,600 ten thousand Panasonics manufacture etc., makes battery of mobile phone become safely focus.In addition, along with 3G(third generation communication) development of technology makes mobile phone to multifunction future development, multifunction requires battery of mobile phone capacity further to increase, capacity is from the 200mAh in the past maximum 3600mAh(model DB736 up till now that increases sharply), so the brisance of high-capacity battery has some idea of.
The imperfection of lithium battery manufacturing technology is to cause the unsafe key factor of battery of mobile phone.The professor Wakihara of Tokyo Polytechnics just points out, the Floor layer Technology of the lithium ion battery that most of notebook and mobile phone use all exists potential hazard.
For this reason, the present patent application people has applied for that in 2009 one about " with the thin temperature fuse of cushion layer structure " publication No. CN101763982, is improved structural stability and is reduced fusing-off temperature by cushion layer structure.
But applicant finds by production over one year, welding procedure also has a significant impact fusing-off temperature, so far, the welding of all fusible cores about thin temperature fuse is all directly to contact fusible core upper surface (what contact with pin end is lower surface, parallel upper surface with it) front welding, and great majority are that hot mode is welded, very large to the damage of fusible core, surface severe oxidation, fusible core inside is easy to secondary crystallization and follows crystal to grow up.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of manufacturing process of the thin temperature fuse with bed course, by the improvement of welding procedure, improves the product quality of the thin temperature fuse with bed course.
The present invention solves the problems of the technologies described above taked technical scheme: a kind of manufacturing process of the thin temperature fuse with cushion layer structure, comprise pair of metal pin with the thin temperature fuse of cushion layer structure, metal pins be relatively arranged in a linear and end between leave spacing, and portion is provided with bed course in spacing, below metal pins end, be provided with lower carrier band, this bed course laterally intercepts both ends mutually, and will between fusible core and lower carrier band, mutually longitudinally intercept, between both ends, be weldingly connected by fusible core, on fusible core, brushing has flux, upper carrier band covers from top, upper carrier band and lower carrier band form a confined space, by metal pins end, fusible core and flux are sealed in the inside of this confined space, wherein, fusible core is to be welded on pin from the back side.
On such scheme basis, the described back side is welded as hot weld, or cold welding.
On such scheme basis, be plane for the soldering tip top fusible core back side being welded on pin, this soldering tip and lower carrier band plane contact, carry out hot weld; Or soldering tip top has medial recess, this soldering tip contacts with lower carrier band, and its intermediate recess strides across the position that bed course arranges, and carries out hot weld.
On such scheme basis, while welding overleaf, smooth heat conduction plane is set in the front of thin temperature fuse, this heat conduction plane is the one in metal, nonmetallic materials, metal and nonmetallic composite material.
On such scheme basis, described fuse gross thickness is less than 1.0mm, comprise carrier band on plastics, intermediate layer carrier band, lower carrier band, pair of metal pin, flux, fusible core, wherein flux wraps up fusible core, under plastics, on carrier band and plastics, carrier band, by flux, bed course, fusible core and part pin parcel, makes whole fluxs and fusible core in an environment that sealing is fixing.
On such scheme basis, for convenient processing, described bed course is made up of the bed course part of intermediate layer carrier band.
On such scheme basis, described carrier band material is PBT(polybutylene terephthalate (PBT)), PC(Merlon), PET(PETG) in one.
On such scheme basis, bed course partial width s is not less than the minimum range d between two pins end.
On such scheme basis, the thickness of described bed course part equals the thickness of two pins end.
On such scheme basis, after two pins and lower carrier band and intermediate layer carrier band weld, bed course part upper surface and two pins end upper surface are in same level.
On such scheme basis, use for convenience of client, apart from uploading belt edge at least outside 1mm, pin has step or bending.
The invention has the beneficial effects as follows:
The present invention welds to protect fusible core by the back side; overcome in the positive welding of current alloy on pattern, destroy, oxide layer increases the weight of, generally there is secondary crystallization fusible core inside follows crystal to grow up defect, reduce greatly because of the fusible core improper rising of fusing-off temperature that excessively welding is heated and is caused.
Brief description of the drawings
Fig. 1 is process chart of the present invention.
Fig. 2 is the structural representation of pin of the present invention.
Fig. 3 is the structural representation of carrier band under the present invention.
Fig. 4 is the structural representation that pin of the present invention is combined with lower carrier band.
Fig. 5 is the structural representation of intermediate layer of the present invention carrier band.
Fig. 6 is that intermediate layer of the present invention carrier band covers the structural representation at Fig. 4 superstructure.
Fig. 7 is the structural representation of the present invention at Fig. 6 superstructure welding fusible core.
Fig. 8 is the cross-sectional view of the thin temperature fuse of band bed course of the present invention.
Fig. 9 is the cross-sectional view of the existing thin temperature fuse without bed course.
Figure 10 is that top is the structural representation that the soldering tip of plane contacts with lower carrier band.
Figure 11 is that top has the structural representation that umbilicate soldering tip contacts with lower carrier band.
Attached number in the figure explanation
1,2-pin; 11,21-end;
Carrier band under 3-; 31-lug;
4-intermediate layer carrier band; 41-lug; 42-bed course part;
5-fusible core; 6-flux; The upper carrier band of 7-;
8-soldering tip;
9-soldering tip; 91-medial recess;
10-heat conduction plane.
Embodiment
Refer to the structural representation that Fig. 2 is pin of the present invention, Fig. 3 is the structural representation of carrier band under the present invention, Fig. 4 is the structural representation that pin of the present invention is combined with lower carrier band, Fig. 5 is the structural representation of intermediate layer of the present invention carrier band, Fig. 6 is that intermediate layer of the present invention carrier band covers the structural representation at Fig. 4 superstructure, Fig. 7 is the present invention is shown in the cross-sectional view of thin temperature fuse of band bed course of the present invention at the structural representation of Fig. 6 superstructure welding fusible core and Fig. 8, thin temperature fuse gross thickness with cushion layer structure is less than 1.0mm, comprise carrier band 7 on plastics, intermediate layer carrier band 4, lower carrier band 3, pair of metal pin 1, 2, flux 6, fusible core 5.
Pair of metal pin 1, 2 are arranged in a linear and end 11 relatively, 21 are left spacing, and portion is provided with bed course in spacing, bed course part 42 by intermediate layer carrier band 4 forms, in metal pins end 11, 21 below is provided with lower carrier band 3, this bed course is by both ends 11, 21 laterally intercept mutually, and will between fusible core 5 and lower carrier band 3, mutually longitudinally intercept, both ends 11, between 21, be weldingly connected by fusible core 5, on fusible core 5, brushing has flux 6, fusible core 5 is wrapped up, upper carrier band 7 covers from top, upper carrier band 7 forms a confined space with lower carrier band 3, by metal pins end 11, 21, bed course part 42, fusible core 5 and flux 6 are sealed in the inside of this confined space, make whole flux 6 and fusible core 5 seal fixing environment in one.
Referring to Fig. 1 is process chart of the present invention, Figure 10 is that top be the structural representation that contacts with lower carrier band of the soldering tip of plane is that top has shown in the structural representation that umbilicate soldering tip contacts with lower carrier band with Figure 11, a manufacturing process for thin temperature fuse with cushion layer structure, described fusible core 5 is to be welded on pin 1,2 from the back side.Fusible core 5 upper surfaces support with smooth material, and back side weldering can be hot weld, can be also cold welding (simple depended on pressure are by fusible core and the pressing of pin end).
Be plane for soldering tip 8 tops that fusible core 5 back sides are welded on pin 1,2, this soldering tip 8 and lower carrier band 3 plane contact, carry out hot weld; Or soldering tip 9 tops have medial recess 91, this soldering tip 9 contacts with lower carrier band 3, and its intermediate recess 91 strides across the position that bed course arranges, and carries out hot weld.
Owing to being finally lower surface and the fusion of pin end of fusible core, avoid not needing the fusible core upper surface of welding, directly transfer energy to the fusible core lower surface that needs welding.
When weld at the back side, smooth heat conduction plane 10 is set in the front of thin temperature fuse, wherein, if soldering tip 8 or 9 is heating soldering tips, smooth heat conduction plane 10 has conductive force, the heat that conducts to fusible core at back can be derived, and plays the effect of cooling fusible core, the least possible oxidized of protection fusible core, and allow the least possible secondary crystallization of its crystal grain and grain growth; If soldering tip 8 or 9 is pressure planes, be not with temperature, smooth heat conduction plane 10 is pressure loading ends, makes the rear upper surface of fusible core welding keep smooth.
In the time that thin temperature fuse does not have bed course, fusible core 5 is at flux 6, surface tension, under the acting in conjunction of gravity, there is the fusible core central region sinking as shown in the cross-sectional view that Fig. 9 is the existing thin temperature fuse without bed course, when fusing, the wetting power of end will divide a part out the alloy subsiding to be pulled upwardly again, and actual fusing-off temperature will be lagged behind.
The present invention, by cushion layer structure, makes fusible core 5 subside at the Shi Buhui that is heated, and fusible core 5 is on a horizontal line always, and end wetting power can farthest play a role.
Refer to shown in Fig. 3 and Fig. 4, all there is the lug of extending 31,41 lower carrier band 3 and intermediate layer carrier band 4 both sides, are mainly the contacts area that increases carrier band and pin, make the more firm of their welding, and flux is not easy outwards to overflow.
As shown in Figure 8, metal pins 1,2 is directly made band step and bending shape, more adapts to client's actual use, has also saved the auxiliary clubfoot of spot welding simultaneously.
Embodiment 1
Referring to Fig. 1 is shown in process chart of the present invention, upper carrier band 7, intermediate layer carrier band 4 and lower carrier band 3 are all selected PET(PETG), thickness is 100～125um, pair of metal pin 1,2 is welded with lower carrier band 3 and intermediate layer carrier band 4 by precalculated position (Fig. 2), then weld with the back side of fusible core 5 (as shown in Fig. 8, Figure 10, Figure 11), brush flux 6, with carrier band on plastics 7, flux 6, fusible core 5 are wrapped up and high-precision seal welding again to finished product after cutting, cleaning, inspection.
Embodiment 2
Referring to Fig. 1 is shown in process chart of the present invention, upper carrier band 7 and lower carrier band 3 are all selected PET(PETG), thickness is 100～125um, pair of metal pin 1,2 is welded with lower carrier band 3 by precalculated position (Fig. 2), then weld (shown in Fig. 9, Figure 10, Figure 11) with fusible core 5 back sides, brush flux 6, then carrier band on plastics 7 is wrapped up flux 6, fusible core 5 high-precision seal welding, finished product after cutting, cleaning, inspection.
Embodiment 3
Referring to Fig. 1 is shown in process chart of the present invention, upper carrier band 7, intermediate layer carrier band 4 and lower carrier band 3 are all selected PET(PETG), thickness is 100～125um, by pair of metal pin 1,2 weld with lower carrier band 3 and intermediate layer carrier band 4 by precalculated position (Fig. 2), then connect (as shown in Fig. 8, Figure 10, Figure 11) with fusible core 5 face bondings, brush flux 6, again carrier band on plastics 7 is wrapped up flux 6, fusible core 5 high-precision seal welding to finished product after cutting, cleaning, inspection.
Embodiment 4
Referring to Fig. 1 is shown in process chart of the present invention, upper carrier band 7 and lower carrier band 3 are all selected PET(PETG), thickness is 100～125um, pair of metal pin 1,2 is welded with lower carrier band 3 by precalculated position (Fig. 2), then fusible core 5 face bondings are connected to (as shown in Fig. 9, Figure 10, Figure 11), brush flux 6, then flux 6, fusible core 5 wrapped up and high-precision seal welding with carrier band on plastics 7, cutting, clean, finished product after inspection.
Embodiment 5
Referring to Fig. 1 is shown in process chart of the present invention, upper carrier band 7, intermediate layer carrier band 4 and lower carrier band 3 are all selected PET(PETG), thickness is 100～125um, pair of metal pin 1,2 is welded with lower carrier band 3 and intermediate layer carrier band 4 by precalculated position (Fig. 2), then connect (as shown in Fig. 8, Figure 10, Figure 11) with fusible core 5 back side cold weldings, brush flux 6, again carrier band on plastics 7 is wrapped up flux 6, fusible core 5 high-precision seal welding to finished product after cutting, cleaning, inspection.
Below by table 1 in embodiment 1 to 5 because of the welding manner of fusible core and pin and have or not the visual data of bed course on fuse performance impact.
From table 1, we can find out, under same heating rate and equivalent constructions, and back side cold welding than positive heat weldable average fusing-off temperature low 2.3 degree, back side hot weld than the average fusing-off temperature of positive hot weld low 1.7 degree; No matter be back side welding or positive welding, have bed course than without the average fusing-off temperature of bed course low 0.9 degree, illustrate while adopting back side bond pattern, the surface oxidation of fusible core significantly reduces, amount of crystals to its inside and pattern too much do not destroy and change, and " wet tensile strength " to fusible core of pin end farthest brought into play under the effect of bed course simultaneously.
Claims (8)
1. the manufacturing process of the thin temperature fuse with cushion layer structure, comprise pair of metal pin (1 with the thin temperature fuse of cushion layer structure, 2), metal pins (1, 2) be relatively arranged in a linear and end (11, 21) between, leave spacing, and portion is provided with bed course in spacing, in metal pins end (11, 21) below is provided with lower carrier band (3), this bed course is by both ends (11, 21) mutually laterally intercept, and will between fusible core (5) and lower carrier band (3), mutually longitudinally intercept, both ends (11, 21) between, be weldingly connected by fusible core (5), there is flux (6) in the upper brushing of fusible core (5), upper carrier band (7) covers from top, upper carrier band (7) forms a confined space with lower carrier band (3), by metal pins end (11, 21), fusible core (5) and flux (6) are sealed in the inside of this confined space, it is characterized in that: described fusible core (5) is to be welded on metal pins (1 from the back side, 2) on, the described back side is welded as hot weld or cold welding, wherein, for fusible core (5) back side is welded on to metal pins (1, 2) soldering tip (8) top on is plane, this soldering tip (8) and lower carrier band (3) plane contact, carry out hot weld, or soldering tip (9) top has medial recess (91), this soldering tip (9) contacts with lower carrier band (3), and its intermediate recess (91) strides across the position that bed course arranges, and carries out hot weld.
2. the manufacturing process of the thin temperature fuse with cushion layer structure according to claim 1, it is characterized in that: while welding overleaf, smooth heat conduction plane (10) is set in the front of thin temperature fuse, and this heat conduction plane is the one in metal, nonmetallic materials, metal and nonmetallic composite material.
3. the manufacturing process of the thin temperature fuse with cushion layer structure according to claim 1, it is characterized in that: described fuse gross thickness is less than 1.0mm, comprise carrier band (7), intermediate layer carrier band (4), lower carrier band (3), pair of metal pin (1, 2), flux (6), fusible core (5), wherein, flux (6) wraps up fusible core (5), lower carrier band (3) and upper carrier band (7) are by flux (6), bed course, fusible core (5) and part metals pin parcel, make whole flux (6) and fusible core (5) seal fixing environment in one.
4. the manufacturing process of the thin temperature fuse with cushion layer structure according to claim 3, is characterized in that: described bed course is made up of the bed course part (42) of intermediate layer carrier band (4).
5. the manufacturing process of the thin temperature fuse with cushion layer structure according to claim 4, is characterized in that: described upper carrier band (7), intermediate layer carrier band (4), lower carrier band (3) material are the one in polybutylene terephthalate (PBT), Merlon, PETG.
6. the manufacturing process of a kind of thin temperature fuse with cushion layer structure according to claim 4, is characterized in that: bed course part (42) width s is not less than the minimum range d between two metal pins ends (11,21).
7. the manufacturing process of the thin temperature fuse with cushion layer structure according to claim 6, is characterized in that: the thickness of described bed course part (42) equals the thickness of two metal pins ends (11,21).
8. the manufacturing process of the thin temperature fuse with cushion layer structure of stating according to claim 4, it is characterized in that: when two metal pins (1,2) after welding well with lower carrier band (3) and intermediate layer carrier band (4), bed course part (42) upper surface and two metal pins ends (11,21) upper surface is in same level, carrier band in distance (7) edge is at least outside 1mm, and described two metal pins (1,2) have step or bending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110027599.4A CN102129936B (en) | 2011-01-26 | 2011-01-26 | Process for manufacturing thin-type temperature fuse with cushion layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110027599.4A CN102129936B (en) | 2011-01-26 | 2011-01-26 | Process for manufacturing thin-type temperature fuse with cushion layer |
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| Publication Number | Publication Date |
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| CN102129936A CN102129936A (en) | 2011-07-20 |
| CN102129936B true CN102129936B (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110027599.4A Active CN102129936B (en) | 2011-01-26 | 2011-01-26 | Process for manufacturing thin-type temperature fuse with cushion layer |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047497B (en) * | 2015-08-20 | 2018-02-13 | 武汉标迪电子科技有限公司 | Batteries of electric automobile group single battery core protection fuse |
| CN105047498A (en) * | 2015-08-20 | 2015-11-11 | 武汉标迪电子科技有限公司 | Fuse for protecting aluminum-case cells of battery pack of electric car |
| CN110957459A (en) * | 2019-11-13 | 2020-04-03 | 新盛力科技股份有限公司 | Battery module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1218344C (en) * | 2000-07-21 | 2005-09-07 | 松下电器产业株式会社 | Temp. fuse, battery and temp. fuse mfg. method |
| CN1698152A (en) * | 2003-07-01 | 2005-11-16 | 松下电器产业株式会社 | Fuse, battery pack using the fuse, and method of manufacturing the fuse |
| CN101763982A (en) * | 2009-12-31 | 2010-06-30 | 上海长园维安电子线路保护股份有限公司 | Thin temperature fuse with cushion layer structure and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1196886A (en) * | 1997-09-16 | 1999-04-09 | Matsuo Electric Co Ltd | Chip-type fuse and its manufacture |
-
2011
- 2011-01-26 CN CN201110027599.4A patent/CN102129936B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1218344C (en) * | 2000-07-21 | 2005-09-07 | 松下电器产业株式会社 | Temp. fuse, battery and temp. fuse mfg. method |
| CN1698152A (en) * | 2003-07-01 | 2005-11-16 | 松下电器产业株式会社 | Fuse, battery pack using the fuse, and method of manufacturing the fuse |
| CN101763982A (en) * | 2009-12-31 | 2010-06-30 | 上海长园维安电子线路保护股份有限公司 | Thin temperature fuse with cushion layer structure and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2005-26036A 2005.01.27 |
| JP特开平11-96886A 1999.04.09 |
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Address after: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Applicant after: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. Address before: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Applicant before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: SHANGHAI CHANGYUAN WEIAN ELECTRONIC LINE PROTECTION CO., LTD. TO: SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO., LTD. |
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Address after: 200083 806, floor 8, No. 125, Liuying Road, Hongkou District, Shanghai Patentee after: Shanghai Wei'an Electronic Co.,Ltd. Address before: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Patentee before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Patentee after: Shanghai Weian Electronics Co.,Ltd. Address before: 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Patentee before: Shanghai Wei'an Electronic Co.,Ltd. |