CN102164473B

CN102164473B - Element mounting device and element mounting method

Info

Publication number: CN102164473B
Application number: CN201110040291.3A
Authority: CN
Inventors: 中川义之; 三宅祥史
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2010-02-16
Filing date: 2011-02-16
Publication date: 2014-04-30
Anticipated expiration: 2031-02-16
Also published as: KR20110095124A; CN102164473A; JP2011171343A; KR101192729B1; JP4751948B1

Abstract

The invention provides an element mounting device and an element mounting method. The element mounting device comprises a head assembly and a control part. Elements are installed on a substrate by the head assembly. The motion of the head assembly is controlled by the control part. Meanwhile, the mounting position of elements is adjusted according to the printing offset of the solder with respect to the electrode. When the printing offset is within a correction permissible range, the elements are installed on the substrate with the offset position of the solder on the substrate as a reference. The correction permissible range is set according to the self-correction effect exhibited by the fused solder, so that the mounting position of the elements is corrected to be at the electrode side. When the printing offset exceeds the correction permissible range, the elements are installed with the specified position close to the electrode as a reference within the offset range of the solder on the substrate. Therefore, the mounting position of the elements is adjusted according to the offset, so that the bad welding is prevented and the elements are satisfactorily installed on the substrate.

Description

Element fixing apparatus and component mounting method

Technical field

The present invention relates to be printed with element fixing apparatus and the component mounting method of the substrate installation elements of scolder on electrode.

Background technology

The substrate (hereinafter referred to as " component mounting substrate ") of electronic component to be installed in order manufacturing, need to carry out successively following operation: electrode solder printing being formed on substrate by printing equipment, be the printing process on so-called electrode of substrate (or pad); By element fixing apparatus to being printed with the installation procedure of the substrate installation elements of scolder; Make to be provided with the substrate of element by the reflow process of reflow ovens.In printing process in these operations, making to be formed with under the template of the peristome corresponding with electrode of substrate pattern and the state of substrate accurate contraposition, the scolder of paste is printed onto to the surface of substrate via the peristome of template.Like this, in printing process, carry out the contraposition of template and substrate, and take scolder with respect to the position skew of electrode of substrate, print side-play amount as zero being target.But in actual printing process, it is zero very difficult making to print side-play amount.

In addition, in reflow process, the melt solder between the so-called element electrodes such as the electrode forming on the electrode of substrate of substrate and the shell of electronic component or lead-in wire and flowing.Now, by electronic component based on flow of solder material and to center side shifting, the so-called self-correcting effect of electrode of substrate, the installation site of electronic component can be revised.Therefore, for example, in No. 2007-110170 (patent documentation 1) disclosed invention of Japanese Patent Publication Publication Laid-Open (with reference to Figure 20, Figure 21), according to printing shift state, judge the size of self-correcting effect, and the installation site of switching electronic component according to this result of determination.More specifically, when self-correcting effect is larger, take solder printing position carrys out installing electronic elements as benchmark, and when self-correcting effect hour, the electrode position of substrate of take carrys out installing electronic elements as benchmark.

In the disclosed invention of patent documentation 1, when self-correcting effect hour, for example, when the state that scolder deflects away from significantly with the electrode from being formed on substrate is printed, be judged to be self-correcting effect less, the electrode position of substrate of usining carrys out installing electronic elements as benchmark.Therefore, as described later, the scolder deflecting away from from electrode is based on reflow treatment, can melting and be attached to the end face of electronic component, and then infiltrate significantly along this end face, thereby produce failure welding.

Summary of the invention

The present invention does in view of the above problems, thereby its object is to provide by suitably adjust the installation site of element corresponding to printing side-play amount and can prevents the generation of failure welding and element can be arranged on well to element fixing apparatus and the component mounting method on substrate.

Element fixing apparatus involved in the present invention is that in order to reach above-mentioned purpose, it comprises: head assembly, is installed to described element on described substrate to being formed with electrode and being printed with the device of the substrate installation elements of scolder on this electrode, control part, controls the action of described head assembly, according to described scolder, with respect to the printing side-play amount of described electrode, adjusts the installation site of described element, wherein, described control part is in the situation that described printing side-play amount is in revising allowed band, take the position of deflecting away from substrate of described scolder carrys out installation elements as benchmark, described correction allowed band is the self-correcting effect presenting by the melting based on described scolder and the installation site of described element can be adapted to the correction allowed band of described electrode side, described control part is in the situation that described printing side-play amount exceeds described correction allowed band, with than the more close electrode in the printing position of scolder, and the assigned address leaving to the position side being printed with the substrate of described scolder in described correction allowed band from the position of electrode is that benchmark is installed described element.

Component mounting method involved in the present invention, to being formed with electrode and being printed with the method for the substrate installation elements of scolder on this electrode, to achieve these goals, it is characterized in that comprising the following steps: obtain described scolder with respect to the step of the printing side-play amount of described electrode; By described printing side-play amount and the step of revising allowed band and contrasting, described correction allowed band is the self-correcting effect presenting by the melting based on described scolder and the installation site of described element can be adapted to the correction allowed band of described electrode side; In the situation that described printing side-play amount is in described correction allowed band, take the position of deflecting away from substrate of described scolder installs described element as benchmark, and in the situation that described printing side-play amount exceeds described correction allowed band, with than the more close electrode in the printing position of scolder, and the assigned address leaving to the position side being printed with the substrate of described scolder in described correction allowed band from the position of electrode is the step that benchmark is installed described element.

In the present invention's (element fixing apparatus and component mounting method) who so forms, according to scolder, with respect to the printing side-play amount that is formed on the electrode on substrate, adjust the position of installation elements.More specifically, in the situation that printing side-play amount is in can by self-correcting effect, the installation site of element being adapted in the correction allowed band of electrode side, installation elements is carried out as benchmark in the position that the scolder of take deflects away from substrate.By so utilizing self-correcting effect, element can be arranged on substrate well.On the other hand, in printing side-play amount, exceed revise allowed band in the situation that, in the situation that cannot expecting calibration result, in the scope that the scolder of take is deflected away from substrate for the assigned address of correction allowed band carrys out installation elements as benchmark.Whereby, on substrate, to adjacent electrode, infiltrate the amount of the scolder of expansion when reducing reflow treatment, can prevent the generation of failure welding, and element can be installed to and take on the tram that the position of electrode of substrate is benchmark.Relevant details of the present invention, will describe in detail for concrete example later.

As mentioned above, due to according to scolder with respect to the printing side-play amount of electrode whether in can the installation site of element being adapted in the correction allowed band of electrode side by self-correcting effect, adjust the position reference that carries out element installation, therefore, can prevent the generation of failure welding, and element can be installed to and take on the tram that the position of electrode of substrate is benchmark.

Accompanying drawing explanation

Fig. 1 means the block diagram of the production system of the component mounting substrate that element is installed on substrate.

Fig. 2 means the schematic diagram to the relation between the scolder state after configuration state and reflow treatment while there is relatively large printing skew, in element installation process.

Fig. 3 means the schematic diagram (Fig. 3 (A)) and the figure that represents the chart (Fig. 3 (B)) of the information relevant to this element of an example of element.

Fig. 4 means and the schematic diagram that prints the corresponding element installation of side-play amount form.

Fig. 5 means the vertical view of an execution mode of fitting machine involved in the present invention (element fixing apparatus).

Fig. 6 means the block diagram of the main electrical structure of the fitting machine shown in Fig. 5.

Fig. 7 means the ER figure of the configuration example of the control parameter that the fitting machine shown in Fig. 5 is relevant.

Fig. 8 means at the flow chart of producing the setting processing of being carried out by printing equipment before component mounting substrate.

Fig. 9 means at the flow chart of producing the setting processing of being carried out by control device before component mounting substrate.

Figure 10 means the flow chart of the printing treatment that printing equipment carries out.

Figure 11 means the flow chart of the printing treatment that fitting machine carries out.

Figure 12 means the flow chart of the element installation process that fitting machine carries out.

Figure 13 means the flow chart of the element installation process that fitting machine carries out.

Embodiment

< prints the > that is related between side-play amount and self-correcting effect

Before the execution mode of element fixing apparatus involved in the present invention and component mounting method is described in detail in detail, to using the printing skew occurring in the production system of component mounting substrate of present embodiment and this production system to describe, and the printing side-play amount that draws of explanation this case inventor and the relation between self-correcting effect.

Fig. 1 means the block diagram of the production system of the component mounting substrate that element is installed on substrate.In this production system, be provided with: printing equipment 10, to the electrode forming on substrate, be so-called electrode of substrate printing solder; Printing inspection apparatus 20, checks by the printed substrate of printing equipment 10 to obtain printing side-play amount; Fitting machine (being equivalent to " element fixing apparatus " of the present invention) 30, to being printed with the substrate installation elements of scolder; And reflow ovens 40, to being installed, the substrate of element implements reflow treatment.These

devices

10,20,30,40 are connected in local area network (LAN) (Local Area Network, LAN).And, on this LAN, connecting the control device (server computer) 50 of controlling whole production system.And, between control device 50 and each

device

10,20,30,40, can carry out the various main information of information, substrate or the element relevant to printing or the communication of printing the various process informations that side-play amount is representative of take via LAN.In addition, in this production system, by wired lan, carry out control device 50 and install communicating by letter between 10,20,30,40 with each, but communication mode or form are not limited thereto.

In the production system so forming, according to each specification being set by control device 50, by printing equipment 10, carry out the scolder to substrate printing paste.That is, in printing equipment 10, utilize substrate travelling carriage to clamp the substrate of being moved into by the substrate portion of moving into, and contraposition is after the assigned address under template, and this substrate is carried out to solder printing.When this solder printing, sometimes to the solder printing of electrode of substrate, can be offset.Therefore, in the production system of Fig. 1, after printing treatment and before installation process, by printing inspection apparatus 20, check, to carrying out each position of element installation, obtain printing side-play amount.

If printing side-play amount is relatively little, disclosed in patent documentation 1, can utilize self-correcting effect that element is welded in to electrode of substrate well.Now, if take solder printing position, element is installed on substrate as benchmark, by the reflow treatment of carrying out after this installation process, melt solder between the so-called element electrode such as the electrode forming on the shell of electrode of substrate and element or lead-in wire and flowing, element moves to electrode of substrate center by self-correcting effect.Like this, if the self-correcting effect of printing side-play amount in presenting by the melting by scolder is adapted to the installation site of element in the correction allowed band of electrode of substrate side, comparatively it is desirable to take solder printing position and element is installed on to substrate as benchmark.

On the other hand, if printing side-play amount exceeds correction allowed band, if take solder printing position as benchmark, or take electrode of substrate position as benchmark carries out element installation, problem as described below occurs sometimes.Below, illustrate printing skew only one determine to occur on direction X in the situation that, the element installation process of being carried out with said reference and the situation of reflow treatment.

Fig. 2 means the schematic diagram to the relation between the scolder state after configuration state and reflow treatment while there is relatively large printing skew, in element installation process.Herein, as shown in Fig. 2 (A), with respect to the electrode of substrate 1a being formed on substrate 1, being printed on of the scolder 2 of paste has been offset Δ X(scolder 2 thickness in X-direction is the H0 roughly the same with template thickness), do not arrive adjacent electrode of substrate 1a'(Δ Xb > 0), but the printing offset Δ X of X-direction is relatively large, the maximum Xa(that has exceeded correction allowed band is contained in the correction permissible value Xa in the component information hereinafter illustrating).Now, for example, as shown in Fig. 2 (A), if the position amount of the staggering Δ X1 of element 3 is made as with to print offset Δ X identical, thereby take the solder printing position of printing offset Δ X aligns with it as benchmark makes element electrode 3a, by element 3 with respect to electrode of substrate staggered positions (act on the malleation of element 3 or the deadweight of element 3 owing to carrying element 3 after carrying substrate 1, the thickness of the scolder 2 between element 3 and substrate 1 becomes and is less than H0) carry out reflow treatment, as shown in Fig. 2 (B), a part for the scolder 2 of melting is along electrode of substrate 1a surface infiltration and to the left expansion of Fig. 2 (B), under the surface tension of the scolder 2 of this expansion, want to figure left tractive element electrode 3a, but X is larger due to printing offset Δ, therefore the infiltration of fusion welding expansion does not arrive this figure left end of electrode of substrate 1a, even if surface tension is had an effect, also cannot make element 3 to this figure left, move to the position of element electrode 3a and electrode of substrate 1a complete matching.On the other hand, when element 3 is carried on substrate 1, the thickness of the scolder 2 between element 3 and substrate 1 becomes and is less than H0, thus, with respect to element 3 to figure the right-hand scolder 2a deflecting away from because of reflow treatment melting, thereby want further to right-hand expansion, but due to element 3 tractives that are subject to slightly moving to figure left, therefore can not arrive the distance, delta Xb > 0 of adjacent electrode of substrate 1a'(from scolder 2a to adjacent electrode of substrate 1a').That is, although can not be known as the failure welding of weldering bridge after reflow treatment, can occur element 3 cannot be installed to that to take such installation site, tram that the electrode position of substrate is benchmark bad.

In addition, for example, as shown in Fig. 2 (C), if take electrode of substrate position, after carrying the element electrode 3a of element 3 substrate 1, implements benchmark reflow treatment, although can not occur element 3 cannot be installed to, to take such installation site, tram that the electrode position of substrate is benchmark bad, and problem as described below can occur.; if take electrode of substrate position as benchmark; the basis of the scolder deflecting away from from electrode of substrate 1a 2 in printed scolder 2; when element 3 is carried on substrate 1; as shown in Fig. 2 (D); because becoming, the thickness of the scolder 2 between element 3 and substrate 1 is less than H0, therefore also increased the right-hand scolder deflecting away to Fig. 2 (D) with respect to element 3.Like this, the area that the scolder 2a deflecting away from from electrode of substrate 1a contacts with element electrode 3a is roughly zero or few, and the scolder 2a deflecting away from from electrode of substrate 1a almost can flow with free state.On the other hand, even owing to implementing reflow treatment, element 3 can not move yet, and therefore flowable scolder 2a can not move to figure left.Therefore, can adjacent electrode of substrate 1a' will be arrived with the mobile scolder 2a of free state.That is, can form weldering bridge and failure welding occurs.

Relative with these situations, as shown in Fig. 2 (E), if make when mounted the position of element 3 with respect to the more close electrode of substrate 1a in position of the printing offset Δ X of printing solder 2, and the amount of the staggering Δ X1 of the position of this element 3 is set as revising the maximum Xa that permissible value Xa(=revises allowed band) carry out installation elements 3, be clipped in scolder 2 melting past two electrode 1a in reflow treatment between electrode of substrate 1a and

element electrode

3a, 3a infiltrates and expands to figure left, under the capillary effect of the scolder 2 being expanded at this, element electrode 3a is pulled to the left of (E) of Fig. 2, because the position amount of staggering with respect to electrode of substrate 1a of element electrode 3a is wanted little correction permissible value Xa than the position amount of staggering of Fig. 2 (A), therefore element 3 moves to element electrode 3a and the electrode of substrate 1a complete matching of this element 3 to the left of Fig. 2 (E), as shown in Fig. 2 (F), after reflow treatment, element 3 can be installed to the tram overlapping with the electrode position of substrate 1.In addition, on the basis of the scolder deflecting away from respect to element 32 in printed scolder 2, when element 3 is carried on substrate 1, because the thickness of the scolder 2 between element 3 and substrate 1 becomes, be less than H0 and increased (E) right-hand scolder deflecting away to Fig. 2 with respect to element 3, the scolder 2a deflecting away from respect to element 3 forming is therefrom because of reflow treatment melting, thereby want further to right-hand expansion, but the tractive due to the element 3 that is subject to moving to the left of Fig. 2 (F), therefore can not arrive adjacent electrode of substrate 1a'(Δ Xb > 0), thereby can not weld the failure weldings such as bridge.

In addition, the scolder 2a deflecting away from respect to electrode of substrate 1a before reflow treatment shown in Fig. 2 (C) flows because of reflow treatment, as shown in Fig. 2 (D), it arrives electrode of substrate 1a' and the coincidence length on electrode of substrate 1a' reaches Δ Xc, now, as this coincidence length Δ, Xc is relatively little, by the installation site of element 3 is left to the assigned address that surpasses Δ Xc with respect to the electrode of substrate position as benchmark in revising allowed band, whereby, element electrode 3a with respect to the position amount of staggering of electrode of substrate 1a in less correction allowed band, therefore pass through reflow treatment, element 3 moves to element electrode 3a and the electrode of substrate 1a complete matching of this element 3 to figure left, element 3 can be installed to and take the tram that the electrode position of substrate 1 is benchmark.Because the amount of movement of this element 3 surpasses Δ Xc, therefore, the scolder 2a deflecting away from respect to element 3 before reflow treatment is subject to element 3 tractives that move to figure left and can arrive adjacent electrode of substrate 1a' under molten condition, thereby can not cause weldering bridge.

Above, just along X-direction, situation about being offset occurring to print investigates, but, when the Y direction with X-direction quadrature (with respect to the paper of Fig. 2 and vertical direction) is upper, there is printing skew, or while there is printing skew on the two-dimensional surface of X-direction and Y direction, also can similarly investigate with above-mentioned.That is, revise the impact of the direction that allowed band is subject to element (two element electrode 3a side by side time length direction (the YA direction of Fig. 3 (A)) or Width (the XA direction of Fig. 3 (A))).

On length direction (the YA direction of Fig. 3 (A)) at two element electrode 3a side by side time, during scolder 2 melting, on electrode of substrate 3a, infiltrate expansion, because the surface tension of the scolder 2 of generation effect between electrode of substrate 3a and element electrode works at Liang Chu, therefore easily obtain self-correcting effect, revise allowed band wider than Width (the XA direction of Fig. 3 (A)).

In addition, revise the big or small impact that allowed band is also subject to element 3.For example relatively large-scale element 3, because deadweight is also large, is therefore difficult to obtain self-correcting effect.Comparatively it is desirable to, for example, shown in Fig. 3 (B), in the component information in being stored in control device 50, " the scolder reference mark " that represent to take that solder printing position allows or forbids carrying out element installation as benchmark is set.In addition, comparatively it is desirable to, as the correction allowed band of each element, the correction boundary value of the printing skew on the correction boundary value of the printing skew on component orientation XA " correction permissible value Xa " and component orientation YA " is revised to permissible value Ya " pre-stored in preserving the element table of component information." scolder reference mark " can utilize for example attribute of boolean (Boolean) type to specialize.Before element is installed, " scolder reference mark " in component information is set to " 1 " and allows (True) time take solder printing position to carry out element installation as benchmark, and as shown in Fig. 4 (A), in revising allowed band, (the printing offset Δ X of X-direction is for revising below permissible value Xa when printing side-play amount, the printing offset Δ Y of Y direction is following for revising permissible value Ya) time, as shown in Fig. 4 (B), can take solder printing position as benchmark, utilize calibration result to carry out compensating element loading position.On the other hand, although " scolder reference mark " is set to " 1 " and allows take the element that solder printing position is benchmark to install, if but as shown in Fig. 4 (C), printing side-play amount exceeds revises allowed band (in Fig. 4 (C), the printing offset Δ Y of Y direction surpasses correction permissible value Ya), as shown in Fig. 4 (D), take the position of correction allowed band that is the position of correction permissible value Ya as benchmark carries out element installation, can effectively prevent failure welding thus.

In addition, if as shown in Fig. 4 (E), for identity element 3 in the situation that the installation direction on substrate 1 is different, by the coordinate system of element 3 (XA, YA) being converted to the coordinate system (X, Y) of fitting machine 30 judgement printing side-play amount whether in revising allowed band.For example, while being installed on substrate 1 when make element 3 rotation 90 ゜ as shown in Fig. 4 (E) after, whether the printing offset Δ X based on X-direction is that element 3 " is revised permissible value Ya " below (with reference to (B) of Fig. 3), or whether the printing side-play amount of Y direction is that " revising permissible value Xa " of element 3, below (with reference to (B) of Fig. 3), can determine whether and can obtain calibration result.

Owing to so there is above-mentioned relation between printing side-play amount and self-correcting effect, therefore comparatively it is desirable in judgement printing side-play amount whether on the basis in revising allowed band, take scolder position or permission position carries out element installation as benchmark.And, revise allowed band and comparatively it is desirable to optimize according to the kind of element 3 or the installation direction on substrate 1.

Therefore, in the execution mode of next explanation, the printing side-play amount drawing based on above-mentioned this case inventor and the relation between self-correcting effect and this case inventor's investigation, in judgement printing side-play amount whether on the basis in revising allowed band, take scolder position or allow position to carry out element installation as benchmark.But, in ensuing execution mode, not by printing inspection apparatus 20, obtain printing side-play amount, but correction value based on being detected by printing equipment 10 is obtained printing side-play amount.That is,, in the execution mode of next explanation, by not comprising the production system of printing inspection apparatus 20, produce component mounting substrate.

< execution mode >

Fig. 5 means the vertical view of fitting machine of an execution mode of element fixing apparatus involved in the present invention.Fig. 6 means the block diagram of the main electrical structure of the fitting machine shown in Fig. 5.In this fitting machine 30, on base station 311, be provided with substrate transferring mechanism 302, can by printing equipment 10, have been printed the printed base plate 1 of paste scolder along the conveyance direction (+X-direction) conveyance of appointment.More specifically, substrate transferring mechanism 302 has on base station 311 a pair of conveyance band 321,321 from the right side conveyance of Fig. 5 to left side by substrate 1.Conveyance band 321,321 is moved into after substrate 1, and the installation exercise position (position of the substrate 1 shown in this figure) making it in appointment stops, and utilization figure holding device slightly fixes maintenance substrate 1.Then, from the electronic component 3(of element supply department 304 supply with reference to Fig. 2～Fig. 4) by mounting head 361 transfers that are equipped on head assembly 306 to substrate 1.Now, the hold mode of 361 pairs of electronic components 3 of 307 pairs of mounting heads of component recognition video camera of installing on head assembly 306 is carried out image recognition, and its recognition result is outputed to the controller (control part) 340 of controlling whole fitting machine 30.On the other hand, controller 340 is controlled move loading action based on image recognition result and the information relevant to substrate, take like that as described later and carries out electronic component 3 to the installation of substrate 1 with the printing corresponding position of side-play amount as benchmark.Then, when being installed to after the installation process of all elements on substrate 1 completes, substrate transferring mechanism 302 takes out of substrate 1.

Front side (+Y direction side) and rear side (Y direction side) in the substrate transferring mechanism 302 so forming, be provided with said elements supply department 304.These element supply departments 304 possess a plurality of belt feeder 304a.And, on each belt feeder 304a, be provided with the reel (omitting diagram) of the material strip of being collected in winding manner/maintenance electronic component 3, electronic component 3 can be supplied to head assembly 306.That is,, on each material strip, separate appointed interval and take in, keeping the scutellate chip electronic elements 3 such as integrated circuit (IC), transistor, capacitor.And belt feeder 304a sends material strip from reel to head assembly 306 sides, whereby, the electronic component 3 in this material strip is intermittently sent successively, its result, the picking up of 361 pairs of electronic components 3 of mounting head that can realize head assembly 306.

This head assembly 306 is being mounted 361 absorption and is keeping under the state of electronic components 3 its conveyance to substrate 1, and transfer is to the position of being indicated by user.This head assembly 306 has in front side and is arranged in 6 mounting head 361F of row and at rear side, along X-direction, is arranged in 6 mounting head 361R of row along X-direction, amounts to 12 mounting heads 361.

In head assembly 306, on vertical Z, extend 6 mounting head 361F that arrange upper with spaced set shape in column in X-direction (the conveyance directions of substrate transferring mechanism 302 conveyance substrates 1).And, with respect to mounting head 361F, in rear side (Y direction side), be also provided with the rank rear similarly forming with prostatitis.That is 6 mounting head 361R that, extend to arrange on vertical Z in X-direction with spaced set shape in column.

In addition, distal portion in each mounting head 361 is provided with element suction nozzle (omitting diagram), each element suction nozzle can be communicated with any one of same depression generator, same malleation generating means and atmosphere via figure dynamoelectric switching valve slightly, by the control of controller 340, negative-pressure adsorption power from depression generator is supplied to element suction nozzle, whereby, upper surface the holding element of the adsorbable electronic component 3 of the lower end of this element suction nozzle (distal portion).On the contrary, if by the control of controller 340, the malleation from malleation generating means is supplied to element suction nozzle, just the absorption of 361 pairs of electronic components 3 of mounting head keeps being disengaged, and utilize malleation by 3 moments of electronic component be installed on substrate 1.Then, after installing electronic component 3, element suction nozzle is open in atmosphere.Like this, in head assembly 306, by controller 340, control the supply of negative-pressure adsorption power and malleation, can realize the installation/disengaging of electronic component 3.

In addition, each mounting head 361 can be with respect to head assembly 306 liftings (movement of Z-direction) by take the driving of the suction nozzle lift drive mechanism that Z axis motor 381 is drive source, and can rotate around suction nozzle central shaft by take the driving of the suction nozzle rotary drive mechanism that the R axle motor 382 that rotates around Z axis is drive source.Lifting between lifting position when the suction nozzle lift drive mechanism in these driving mechanisms makes the down position of mounting head 361 when adsorbing or install and carries out conveyance or take.On the other hand, suction nozzle rotary drive mechanism is element suction nozzle optionally to be rotated so that the direction of electronic component 3 is consistent with installation direction or the mechanism of the axial absorption hour offset of modified R etc., the position on the R direction of principal axis of the appointment in the time of can electronic component 3 being positioned at install by rotary actuation.

In addition, head assembly 306 is for conveyance is adsorbed by these mounting heads 361 between element supply department 304 and substrate 1 electronic component 3 and be installed on substrate 1, can be mobile along X-direction and Y direction (with the direction of X-axis and Z-direction quadrature) in the specified scope of base station 311.That is head assembly 306 can be supported along X-axis movably with respect to the mounting head support component 363 extending in X-direction.And the both ends of mounting head support component 363 are supported on the trapped orbit 364 of Y direction, can in Y direction, move along this trapped orbit 364.And this head assembly 306 is driven along X-direction via ball-screw 366 by X-axis motor 365, mounting head support component 363 is driven along Y direction via ball-screw 368 by Y-axis motor 367.

Like this, head assembly 306 can be by the electronic component being adsorbed by mounting head 361 3 from 304 conveyances of element supply department to target location.And, in the present embodiment, component recognition video camera 307 is installed on head assembly 306, so that in element conveyance process, the absorption hold mode of the electronic component 3 in mounting head 361 is taken successively and carried out image recognition.And, on head assembly 306, except component recognition video camera 307, substrate identification video camera 308 is also installed.This substrate identification video camera 308 has to be taken being positioned at a plurality of reference marks subsidiary on the locational substrate 1 of installation exercise, with the function that substrate position, orientation substrate are carried out to image recognition.And, by making head assembly 306 move to the element supply position top of feed appliance 304a, can identify video camera 308 by substrate and take from top to the element incorporating section of the element of being sent here by feed appliance 304a or material strip etc.

In the fitting machine 30 so forming, be provided with the controller 340 of controlling whole fitting machine.This controller 340 possesses storage part 342, motor control part 343, image processing part 344 and the server communication control parts 345 such as arithmetic processing section 341, hard disk drive.This arithmetic processing section 341 consists of CPU etc., according to pre-stored installation procedure in storage part 342, controls each portion of fitting machine, take and carries out element installation with the printing corresponding position of side-play amount as benchmark.And, in storage part 342, can store fitting machine 30 and carry out installation exercise required various main information and process information.In addition, these main information and process information are through the controller 510 of control device 50 or the information after the processing of other computers.

Motor control part 343 is electrically connected to X-axis motor 365, Y-axis motor 367, Z axis motor 381 and R axle motor 382, so that each motor is driven to control.And, on these motor 365,367,381,382, set up respectively the encoder (omitting diagram) of the corresponding pulse signal of rotary state of output and motor.From the pulse signal of each encoder output, be imported into controller 340, receive that the arithmetic processing section 341 of these signals obtains the information relevant to the rotation amount of each axle motor 365,367,381,382, and together control each axle motor 365,367,381,382 with motor control part 343, thereby element suction nozzle can be moved to the optional position on base station 311.

In addition, image processing part 344 is electrically connected to component recognition video camera 307 and substrate identification video camera 308, and the image pickup signal of these video camera 307,308 outputs is imported respectively image processing part 344.Then, the image pickup signal of image processing part 344 based on imported, carries out respectively the analysis of part drawing picture and the analysis of substrate image.Whereby, the kind of the electronic component 3 on element suction nozzle, absorption situation, absorption position, absorption direction are carried out to image recognition, detect electronic component 3 on suction nozzle whether suitable, adsorb good no, absorption hour offset, in addition, substrate position, orientation substrate are carried out to image recognition.And, can recognition component or element incorporating section and element supply position between position relationship, whereby, can detecting element etc. with respect to the position skew of element supply position, or detecting element whether by conveyance to element supply position.

In this fitting machine 30, be provided with demonstration/operating unit 350, to show main information or process information etc.And demonstration/operating unit 350 is also inputted the information such as various data or instruction for operator to controller 340.In addition, in fitting machine 30, be provided with server communication control part 345, for and control device 50 between carry out the exchange of the various data such as main information or process information.

In addition, control device 50 has as mentioned above the controller 510 that can process main information or process information.In this controller 510, be provided with storage part 512 and the communication control units 513 such as the arithmetic processing section 511 that formed by CPU etc., hard disk drive, can process main information or process information, and enactment document when generate/editor's printing equipment 10 or fitting machine 30 work, and can control whole production system.And, in storage part 512, store the table of the required various information of preservation printing treatment or installation process.Herein, so-called table, refers to two-dimensional matrix and protects stored one or more data acquisition systems.In the following description, copy the definition of E.F.Codd, the row (data items) of table are called to attribute (Attribute), the row (one group of information) of table is called to tuple (Tuple).In addition, the combination in any of attribute and tuple is called to data set.

As shown in Figure 7, in storage part 512, store printing table (T10～T14), substrate table (T20～T23) and element table (T30) etc.And, as next illustrated, according to the main information of preserving in these printing tables, substrate table and element table and/or process information, carry out the production of executive component installation base plate.

Printing table comprises template master data T10, the T11 of template opening portion, printed data T12 and peristome data T14.Table T10, T11 comprise the main information of the template that printshop needs.

Template master data T10 comprises coordinate X, the Y of the reference mark of each template, based on these coordinate datas, can calculate template solid timing offset Δ X1, the Δ Y1, the Δ R1 that in when printing, produce during fixed form.In the present embodiment, in template master data T10, can login contraposition hour offset amount Δ X3, Δ Y3, Δ R3 and contraposition hour offset correction value Δ X3, Δ Y3, Δ R3.During printing contraposition position offset Δ X3, Δ Y3, Δ R3 be to each template renewal for revising substrate with respect to the deal with data of the side-play amount of template, initial value is set to 0.And contraposition hour offset correction value Δ X3, Δ Y3, Δ R3 are the values being updated when printed base plate.Because moving substrate 1 carries out the contraposition with template, so contraposition hour offset correction value is positive value (Δ X3, Δ Y3, Δ R3).

In addition, the T11 of template opening portion preserves and the relevant master data of peristome for the printing forming in template by peristome described in each.

Various deal with data when printed data T12 preserves printing by each produced substrate.Printed data T12 can preserve above-mentioned template solid timing offset Δ X1, Δ Y1, Δ R1, substrate solid timing offset Δ X2, the Δ Y2, the Δ R2 that when substrate is fixed on to print station, produce, contraposition hour offset amount Δ X2 while making substrate and template contraposition, Δ Y2, Δ R2, and the correction value corresponding with these side-play amounts.

Peristome data T14 preserves deal with data by each peristome of produced substrate.In the illustrated embodiment, the coordinate of reference mark that can be based on template master data T10, preserves template opening skew by each peristome of template.

Substrate table comprises substrate master data T20, element installation master data T21, installation data T22 and detailed data T23 is installed.Substrate master data T20 preserves the various master datas (coordinate of numbering, size, reference mark etc.) of substrate.Element is installed master data T21 and for each substrate, is preserved the information of the element of installing.This element is installed master data T21 and is also preserved element mounting coordinate Xp, Yp, Rp.The control part 340 of fitting machine 30 is installed master data T21 by consulting these substrate master data T20 and element, can consult element mounting coordinate Xp, Yp, Rp for each element carrying on substrate.

Installation data T22 preserves process information for each produced substrate.In this installation data, can preserve the substrate producing when substrate is fixed on to installation site solid timing offset Δ X4, Δ Y4, Δ R4 and its correction value Δ X4, Δ Y4, Δ R4.Detailed data is installed and for each element of produced substrate, is preserved deal with data.In illustrated example, element absorption hour offset amount Δ X5, Δ Y5, Δ R5 and its correction value Δ X5, Δ Y5, the Δ R5 that in the time of can preserving by element suction nozzle absorptive element, produce.And, detailed data T23 is installed and can preserves details solder printing position reference described later coordinate Xq, Yq, Rq.In addition, in the illustrated embodiment, in order to determine the direction of similar elements, in attribute, include Directional Sign.

Element table comprises element master data T30.As shown in Fig. 3 (B), element master data T30, except comprising the numbering for definite element, also comprises that scolder reference mark, XA revise permissible value and YA revises permissible value.

In Fig. 7, each is shown T10～T30 and comprises respectively the outside keyword (FK) of determining uniquely the primary keyword (PK) of tuple and consulting primary keyword.Thereby, by outside keyword being appended to the value of primary keyword, can carry out the association of data.Whereby, as shown in the arrow of Fig. 7, for example, element mounting coordinate can be associated with each element of produced substrate.And, the association (relationship) between the arrow in Fig. 7 represents.In addition, each correction value by shown in * in Fig. 7 is the derivation attribute that can by side-play amount, value be derived by computing, may not sign in in corresponding table.In the present embodiment, the initial value of each correction value is all 0.

In addition, the table shown in Fig. 7 is theoretic formation, may not physically be present in same position.Therefore, not only can in the storage part 512 of control device 50, store all data as in this embodiment, also can make each data physical property disperse.The data of preserving in the table shown in Fig. 7 in either case, all can be by printing equipment 10, fitting machine 30 and control device 50 in theory as consulting, upgrade as single database.As the method for consulting of concrete data, need only the data set in enactment document inediting necessity, and exchange between device.For example, in the present embodiment, shifted by delta X0 in each template opening portion of enactment document inediting, position offset Δ X3 when Δ Y0 and printing contraposition, Δ Y3, Δ R3, and directly send fitting machine 30 to from printing equipment 10, but also can transmit via the storage part of control device 50, now, the storage part of control device 50 is as the shifted by delta X0 of each template opening portion, position offset Δ X3 when Δ Y0 and printing contraposition, Δ Y3, the buffer memory of Δ R3 plays a role, printing equipment 10 and fitting machine 30 can be with the shifted by delta X0 of suitable opportunity in each template opening portion of enactment document inediting, position offset Δ X3 when Δ Y0 and printing contraposition, Δ Y3, Δ R3 also receives and dispatches.Or, also can construct data base management system (DBMS) to each device, each installs 10,30,50 tables that can consult, upgrade Fig. 7.Now, when printing equipment 10, fitting machine 30 and control device 50 consult, more during new data, DBMS guarantees the serializability (Serializable) of data.Therefore, can prevent that fitting machine 30 from consulting the mismatch problems of printing equipment 10 data before upgrading.Data consult or upgrade can each device in event rules or SQL are carried out sequencing and be specialized.

In addition, the symbol 520 of Fig. 6 is for showing the chart etc. of the data that the table shown in Fig. 7 is preserved, or the demonstration/operating unit of the information such as the various data of the table shown in controller 510 input Fig. 7 being preserved for operator or instruction.

Next, with reference to Fig. 8 to Figure 13, to produce the action of component mounting substrate by the production system (printing equipment 10+ fitting machine 30+ reflow ovens 40+ control device 50) that comprises the fitting machine 30 forming as described above, describe.

Fig. 8 means the flow chart of producing the setting processing of being carried out by printing equipment before component mounting substrate.Fig. 9 means the flow chart of producing the setting processing of being carried out by control device before component mounting substrate.Figure 10 means the flow chart of the printing treatment that printing equipment carries out.In addition, Figure 11 to Figure 13 means the flow chart of the element installation process that fitting machine carries out.

When producing component mounting substrate by above-mentioned production system, before this is produced, by printing equipment 10 and control device 50, carry out for being adapted to the setting of the production of this component mounting substrate and process.First, in printing equipment 10, the setting shown in set controller (omitting diagram) execution graph 8 is processed.That is this controller is controlled each portion of printing equipment 10 as described below with editor's printing table.First, in step S10, read the data set corresponding with said elements installation base plate in the table of Fig. 7, and in writing controller in set storage part (omitting diagram).

In printing equipment 10, in template maintaining part, be fixed wtih the template with the peristome corresponding with the electrode pattern forming on substrate 1, but the fixed position of template is fixed on sometimes and departs from predefined position.Therefore, in following step S11, by template identification video camera, template lower surface being marked to the reference mark of paying takes, based on this photographed images, calculate and the X-direction of fitting machine 30, Y direction and R direction of principal axis template solid timing offset Δ X1, Δ Y1, the Δ R1(step S12 on X-direction, Y direction and the R direction of principal axis of corresponding printing equipment 10 respectively).In the printing equipment 10 printing come moving substrate 1 to carry out contraposition with respect to fixing template, the amount of movement of the substrate 1 of the constant offset of the template in this contraposition by way of compensation, that is " template is hour offset correction value fixedly ", be the identical Δ X1 of the constant offset amount of the template with in the axial all directions of X-direction, Y direction and R, Δ Y1, Δ R1.(step S14).

Then, by template identification video camera, whole template is taken to (step S15).Due to the template image pickup result so obtaining, be in formwork integral image, include reference mark and template opening portion, therefore, based on this template image pickup result, calculate and take the information such as the center of each template opening portion that reference mark is benchmark and size, and these data are saved in the printed data T12 of printing table (step S16).

In control device 50, the setting shown in controller 510 execution graphs 9 is processed.That is, from storage part 512 by showing relevant data set to printing and be written to operation memory area printing equipment 10 editor, and read the tuple corresponding with said elements installation base plate in the substrate table of storing in storage part 512, and memory area (step S20) for write operation.Then, counting is initialized as to 1(step S21 by variable i), read the element of substrate table element mounting coordinate Xp, Yp, the Rp(step S22 setting in master data T21 is installed).Next, from the peristome data T14 of printing table, read centre coordinate and the dimension information (step S23) that the reference mark template opening portion corresponding with read element mounting coordinate Xp, Yp, Rp, that take template is benchmark.Then,, based on take the position of the template opening portion that the lift-launch coordinate of the element that the reference mark of substrate is benchmark and the reference mark of template of take be benchmark, calculate template opening portion with respect to shifted by delta X0, the Δ Y0 of the lift-launch coordinate of element.The shifted by delta X0 that opening mismachining tolerance with respect to this template is caused, Δ Y0 as the X-direction of fitting machine 30 and template opening shifted by delta X0, Δ Y0 in Y direction and with carry coordinates correlation connection and preserve (step S24).Subsequently, increase variable i (step S25), and judge whether all processing finish (step S26).Like this, for all lift-launch coordinates, carry out the skew X0 of step S22～S24, the calculation process of Y0.When being judged to be all processing having finished in step S26, end process.By the processing of Fig. 9, for each element mount message of the substrate of logining in substrate table, the skew X0, the Y0 that in the peristome data T14 of printing table, login and element mounting coordinate Xp, Yp, Rp are logined explicitly.

When the finishing dealing with of Fig. 9, the controller of printing equipment 10 is controlled each portion of printing equipment 10 according to the information of upgrading in printing table, carries out the printing treatment shown in Figure 10.In this printing treatment, each table that printing equipment 10 is stored from storage part 512 is consulted the required data set of printing treatment (step S30).

The substrate 1 that is formed with electrode pattern is moved into the substrate fixed position of appointment and is fixed, when substrate 1 is fixed on substrate fixed position, there is sometimes the position skew of substrate 1, therefore printing equipment 10 identify video camera by substrate the reference mark of substrate 1 is taken, and the substrate that the image based on captured is obtained on X-direction, Y direction and the R direction of principal axis of printing equipment 10 is consolidated timing offset Δ X2, Δ Y2, Δ R2(step S31).In the tuple of the substrate of calculating solid timing offset Δ X2, Δ Y2, Δ R2 the is logged printed data T12 corresponding with the substrate of processing object.In the printing machine that comes moving substrate 1 to carry out contraposition with respect to fixing template and print, the constant offset of substrate 1 is compensated contraposition time the amount of movement of substrate 1, that is the value (Δ X2 ,-Δ Y2 ,-Δ R2) that " substrate is hour offset correction value fixedly " can be used as after the substrate making in the axial all directions of X-direction, Y direction and R solid timing offset Δ X2, Δ Y2, the positive and negative reverse of Δ R2 is calculated (step S32).

Then, by fixedly fixedly hour offset correction value-Δ X2 ,-Δ Y2 ,-Δ R2 addition of hour offset correction value Δ X1, Δ Y1, Δ R1 and substrate of the template on the X-direction of the printing equipment 10 of setting in the printed data T12 of printing table, Y direction and R direction of principal axis, contraposition hour offset amount Δ X3, the Δ Y3, the Δ R3(step S33 that store in accumulative total (renewal) template master data T10).Contraposition hour offset amount Δ X3, Δ Y3, the Δ R3 of printing equipment 10 based on after upgrading, makes substrate 1 move along X-direction, Y direction and R direction of principal axis, makes substrate 1 and Template Location, so that the reference mark of template lower surface and the reference mark of substrate are alignd.And, when the location of substrate 1 and template starts, make substrate 1 increase towards template, under the completed state in location of substrate 1 and template, make substrate 1 be close to template lower surface.Subsequently, the scolder to template upper surface supply paste, controls printing loading, translational speed, makes scraper plate move along Y direction simultaneously.Whereby, on the electrode that the peristome by template forms solder printing on substrate 1 (step S34).

In addition, in present embodiment, in template, be provided with contraposition confirmation opening, by the substrate 1 after 1 pair of printing of substrate identification video camera, taken, according to the position by the printing solder of opening printing via contraposition confirmation on substrate 1, calculate contraposition hour offset amount Δ X3, Δ Y3, Δ R3(step S35), and it is upgraded to (step S36) as contraposition hour offset correction value Δ X3, Δ Y3, Δ R3.When this upgrades operation, the data after renewal are provided for fitting machine with the form of the enactment document of the database matching with control device 50.

After the printing treatment of substrate 1 is completed, substrate 1 is moved down, and make its loopback in order to carry out substrate 1 amount mobile with the location of template, thereby turn back to home position.Then, after removing substrate 1 fixing, by conveyance Dai Deng substrate transferring mechanism, to fitting machine 30, take out of the substrate 1(step S37 having printed).

In having been sent here the fitting machine 30 of the substrate 1 having printed, controller 340 is controlled each portion of fitting machine 30 according to the installation procedure of storage in storage part 342, carry out the element installation process shown in Figure 11 to Figure 13.

In this installation procedure, first set up and communicate by letter with control device 50, consult the required data set of installation process (step S40).Now, can take batch as the disposable reception data set of unit and be saved in storage part 342, then finishing communication, or also can receive upgraded data by each substrate.And, consult at this moment shifted by delta X0, the Δ Y0 of each template opening portion and contraposition hour offset amount Δ X3, Δ Y3, Δ R3.

The data set of controller 340 based on consulted, moves into the substrate 1 coming from printing equipment 10 conveyances, and is fixed (step S41).Particularly, make substrate 1 in predetermined position of readiness standby, in the time can carrying out element installation process by fitting machine 30, by substrate transferring mechanism 302, moved into the substrate 1 of the not installation elements of standby, the installation exercise position (position of the substrate 1 shown in Fig. 5) making it in appointment is located to stop, and utilization figure holding device slightly fixes and keeps substrate 1.At this substrate fixedly time, there is sometimes the position skew of substrate 1, therefore controller 340 is identified video camera 308 by substrate the reference mark of substrate 1 is taken, and constant offset amount Δ X4, Δ Y4, Δ R4 that the image calculation based on captured goes out the substrate 1 on X-direction, Y direction and the R direction of principal axis at fitting machine 30 using as " substrate is hour offset correction value fixedly ", and be saved in (step S42, S43) in installation data T22.

In following step S44, variable G is initialized as to 1.This variable G represents the group (element group) of the element that element suction nozzle once adsorbs.Then, for the information relevant to each set of pieces is processed, in step S45, variable P is initialized as to 1.Variable P represents the number of processes of the element in G group.

Like this, when element install be ready to complete time, (step S46) such as information relevant to the element of installation group that belongs to the G group in the element group that should be installed on substrate 1 is provided from the enactment document being provided by printing equipment 10.This component information refers to for being installed to the various information on substrate 1, as shown in Fig. 3 (B) or Fig. 7, except component size etc., also comprise scolder reference mark, comprise that in addition the correction permissible value Xa of component orientation XA and the YA of component orientation YA revise the attributes such as permissible value Ya.In addition, if in this stage, in the storage part 342 of fitting machine 30, during memory element information etc., as long as the serializability of data is maintained, use these information.

In following step S46, increase variable P, and repeatedly carry out step S46, S47, until obtain the information of all elements in G group in step S48.

With reference to Figure 12, after obtaining all component information, fitting machine 30 makes head assembly 306 move to element supply department 304, by being arranged on the element suction nozzle of the distal portion of mounting head 361, carrys out stick electronic components 3(step S50).Then, fitting machine 30 is initialized as 1(step S51 again by variable P), and from component information, consult the Directional Sign (step S52) conforming to P element.If the value of sign is 1(True), fitting machine 30 is carried out and is processed (step S53) revising after 90 ° of the coordinate transforms of permissible value Xa, Ya in following processing.

Then, mounting head 30 is by the adsorbed state of component recognition video camera 307 capturing element suction nozzles to element 3, and based on this image pickup result, calculate absorption hour offset amount Δ X5, Δ Y5, Δ R5 on X-direction, Y direction and R direction of principal axis, and be saved in the installation detailed data T23 of Fig. 7 (step S54).In addition, calculate its positive and negative reverse of sening as an envoy to-Δ X5 ,-Δ Y5 ,-Δ R5 be as " absorption hour offset correction value ", and be saved in the installation detailed data T23 of Fig. 7 (step S55).

Herein, when element according to substrate table, the element mounting coordinate Xp, Yp, the Rp that in master data T21, set being installed directly drives control head parts 306 when carrying on substrate 1, the impact of the skew when skew due to aforesaid substrate fixedly time and element absorption, the electronic component 3 that element suction nozzle can be adsorbed carries the position different from the electrode forming on substrate 1.Therefore, in present embodiment, in step S56, the constant offset correction value Δ X4, Δ Y4, the Δ R4 that in step S43, calculate and absorption hour offset correction value-Δ X5 ,-Δ the Y5 ,-Δ R5 that in step S55, calculate are added to respectively to element mounting coordinate Xp, Yp, Rp, with compensating element carry coordinate Xp, Yp, Rp(are called this corrected Calculation " coordinate calculates A ").By element 3 is carried to revised element mounting coordinate Xp like this, Yp, Rp, the electrode of substrate 1a contraposition of formation on the lead-in wire 3a that can make electronic component 3 and substrate 1.That is, element 3 is carried to calculate element mounting coordinate Xp, Yp, Rp that A obtains by coordinate upper, mean that take electrode position is installed to element 3 on substrate 1 as benchmark.

Herein, if scolder 2 is accurately printed in the upper and printing side-play amount of electrode of substrate 1a while being zero, comparatively it is desirable to carry element 3 calculating by coordinate on element mounting coordinate Xp that A obtains, Yp, Rp.But, do not produce printing skew completely and carry out printing treatment more difficult.Therefore, in the present embodiment, determine whether " scolder reference mark " contained in component information is set to " 1 ", to allow to take solder printing position to carry out element installation (step S57) as benchmark.If this result of determination is " True ", scolder reference mark is 1, carries out a series of processing (step S58～S66) that next will illustrate, on the basis of further compensating element lift-launch coordinate Xp, Yp, Rp, executive component carries (step S69).On the other hand, if this result of determination is " False ", be that scolder reference mark is 0 or Null, at the coordinate by step S56, calculate on element mounting coordinate Xp that A obtains, Yp, Rp and carry element 3, the electrode position of take carries element 3(step S69 as benchmark on substrate 1).

In step S58 in above-mentioned a series of processing, that at coordinate by step S56, calculates that A obtains calculates to such an extent that coordinate (the element mounting position in the coordinate system of setting on the base station 311 of fitting machine 30) Xp, Yp, Rp are upper, considers that template opening shifted by delta X0, Δ Y0 and contraposition hour offset amount Δ X3, Δ Y3, Δ R3 calculate coordinate (center of the printed scolder pattern that the welding to the element that conforms in the coordinate system of setting on the base station 311 of fitting machine 30 is relevant) Xq, Yq, Rq(is called this calculating " coordinate calculating B ").That is, according to following numerical expression (1)

Xq＝Xp＋ΔX0＋ΔX3

Yq＝Yp＋ΔY0＋ΔY3 （1）

Rq＝Rp＋ΔR3

Obtain coordinate Xq, Yq, Rq.

With reference to Figure 13, in step S60, obtain calculating of obtaining in step S58 difference (=Δ X0+ Δ X3) between the X-axis coordinate Xp of the element mounting coordinate obtained in the X-axis coordinate Xq of coordinate and step S56, judge whether the absolute value of this difference is more than the correction permissible value Xa setting in component information.Like this, in the present embodiment, by obtaining the difference of X-axis coordinate Xq and X-axis coordinate Xp, obtain printing side-play amount, if surpassing, it revises permissible value Xa, i.e. printing is offset relatively large and cannot expects calibration result (with reference to Fig. 2), will revise permissible value Xa and be added on the X-axis coordinate Xp of the element mounting coordinate of obtaining in step S56 (if difference is for negative, for deducting), with compensating element lift-launch coordinate (step S61).Now, by carrying out step S69 described later, element 3, as shown in Fig. 2 (E), be take and is allowed position to be installed on substrate 1 as benchmark in X-direction.

On the other hand, if printing side-play amount is for revising below permissible value Xa, also can obtain self-correcting effect, the value of the X-axis coordinate Xp of the element mounting coordinate of obtaining in step S56 is rewritten as to the value (step S62) of the X-axis coordinate Xq calculating in step S58.Now, by carrying out step S69 described later, element 3 be take solder printing position and is installed on substrate 1 as benchmark in X-direction.

In addition, for Y direction, with the Y-axis coordinate Yp(step S63～S65 of similarly compensating element lift-launch of X-direction coordinate).That is that obtains in determining step S58 calculates to obtain the absolute value of difference of Y-axis coordinate Yp of the element mounting coordinate obtained in the Y-axis coordinate Yq of coordinate and step S56, whether the printing side-play amount in Y direction is to revise permissible value Ya above (step S63).Then, if surpassing, the printing side-play amount in Y direction revises permissible value Ya, that is printing is offset relatively large and cannot expects calibration result, will revise permissible value Ya and be added on the Y-axis coordinate Yp of the element mounting coordinate of obtaining in step S56 (if difference is for negative, for deducting), with compensating element lift-launch coordinate (step S64).On the other hand, if this printing side-play amount is for revising below permissible value Ya, also can obtain self-correcting effect, the value of the Y-axis coordinate Yp of the element mounting coordinate of obtaining in step S56 is rewritten as to the value (step S65) of the Y-axis coordinate Yq calculating in step S58.

In addition, for R direction of principal axis, no matter print the size of side-play amount, all the value of the R axial coordinate Rp of the element mounting coordinate of obtaining in step S56 is rewritten as to the value (step S66) of the R axial coordinate Rq calculating in step S58.

Fitting machine 30 increases variable P(step S67), for all elements in G group, whether the correcting process that judgment component is carried coordinate Xp, Yp, Rp finishes (step S68).If untreated element is r, repeatedly carry out the processing below step S52.On the other hand, if the element mounting coordinate Xp of all elements in G group, the correcting process of Yp, Rp have finished, fitting machine 30 makes after element suction nozzle moves, the element being kept by the absorption of element suction nozzle to be installed to (step S69) on substrate 1.When this is installed, if being set as " 1 ", scolder reference mark allow take solder printing position to carry out element installation as benchmark, corresponding to printing side-play amount, come compensating element to carry coordinate Xp, Yp, Rp.In addition, if scolder reference mark is set to 0 or Null, directly use the element mounting coordinate Xp, Yp, the Rp that in step S56, calculate.

When the installation of G set of pieces finishes, fitting machine 30 increases variable G(step S70), and determine whether that the installation process of all groups completes (step S71).If the such element installation that is not all elements completes (while being judged to be "No" in step S71), repeatedly carries out the later processing of step S45 of Figure 11.

If all elements complete to the installation of substrate 1, Ze You substrate transferring mechanism 302 takes out of fitting machine 30(step S72 by the substrate of element installation 1), and implement reflow treatment by ensuing reflow ovens 40.

As mentioned above, if printing side-play amount (is less than and revises permissible value Xa in revising allowed band in X-direction, in Y direction, be less than and revise permissible value Ya), take solder printing position carrys out installation elements 3 as benchmark, and effectively present self-correcting effect by carry out reflow treatment after element installation process, thereby element 3 can be installed on substrate well.In addition, if printing side-play amount exceeds correction allowed band, (in X-direction, be greater than and revise permissible value Xa, in Y direction, be greater than and revise permissible value Ya) and cannot expect calibration result, take that to allow limit positions (be the position of correction permissible value Xa in X-direction, in Y direction for revising the position of permissible value Ya) for benchmark by element 3 lift-launchs to substrate 1, therefore as mentioned above, can prevent the generation of failure welding, and element 3 can be installed on substrate 1 well.

In addition, the present invention is not limited to above-mentioned execution mode, only otherwise depart from its purport, except above-mentioned, also can carry out various changes.For example in the above-described embodiment, except contraposition hour offset amount Δ X3, Δ Y3, Δ R3, also consider that the template opening shifted by delta X0, the Δ Y0 that based on template image, obtain obtain printing side-play amount, but also can only consider that either party obtains printing side-play amount.In addition, also can in production system, group enter printing inspection apparatus 20, and utilize by the detected printing side-play amount of printing inspection apparatus 20.In addition, if only consider that the template opening shifted by delta X0, the Δ Y0 that obtain based on template image obtain printing side-play amount, the step S35 in Figure 10 can be omitted, thereby time that video camera takes etc. can be saved.

In addition, when as embodiment described above, printing skew is for more than revising allowed band, by making to carry out the position of the element 3 of element installation, be made as correction permissible value, or in revising allowed band, the position that makes element 3 from the electrode of substrate position deviation that becomes benchmark to assigned address (, in the scope deflecting away from scolder, escape to by electrode of substrate 1a and for revising the assigned address of allowed band, as Fig. 2 (E), guarantee Δ X1), thus, be clipped in scolder 2 between electrode of substrate 1a and element electrode 3a in reflow treatment melting to two electrode 1a, 3a infiltrates and to the left expansion of Fig. 2 (E), under the capillary effect of the scolder 2 of this expansion, left tractive element electrode 3a to Fig. 2 (E), as shown in Fig. 2 (F), element 3 aligns the element electrode 3a that moves to this element 3 to figure left with electrode of substrate 1a, thereby can after reflow treatment, element 3 be installed to and take the tram that the electrode position of substrate 1 is benchmark.In addition, the scolder 2a deflecting away from respect to element 3 before refluxing is because of reflow treatment melting, thereby wish is further to right-hand expansion, but due to element 3 tractives that are subject to moving to figure left, therefore can not arrive adjacent electrode of substrate 1a', thereby can not weld the failure weldings such as bridge.

In addition, utilization object of the present invention is not limited to the fitting machine of said structure, can totally apply to the element fixing apparatus of installation elements on substrate.In addition, can use element fixing apparatus of the present invention to be not limited to group and enter the device in production system, for the fitting machine working independently, also can use the present invention.

Claims

1. an element fixing apparatus, is characterized in that, to being formed with electrode and being printed with the substrate installation elements of scolder on this electrode, described element fixing apparatus comprises:

Head assembly, is installed to described element on described substrate;

Control part, controls the action of described head assembly, according to described scolder, with respect to the printing side-play amount of described electrode, adjusts the installation site of described element; Wherein,

Described control part is in the situation that described printing side-play amount is in revising allowed band, take the position of deflecting away from substrate of described scolder installs described element as benchmark, described correction allowed band is the self-correcting effect presenting by the melting based on described scolder and the installation site of described element can be adapted to the correction allowed band of described electrode side

Described control part is in the situation that described printing side-play amount exceeds described correction allowed band, with than the more close electrode in the printing position of scolder, and the assigned address leaving to the position side being printed with the substrate of described scolder in described correction allowed band from the position of electrode is that benchmark is installed described element.

2. element fixing apparatus according to claim 1, is characterized in that:

Described control part is described assigned address by the set positions of the maximum of described correction allowed band that is correction permissible value.

3. element fixing apparatus according to claim 1, is characterized in that:

Described control part is set described correction allowed band according to the kind of described element.

4. element fixing apparatus according to claim 1, is characterized in that:

Described control part is set described correction allowed band according to the direction of described element.

5. element fixing apparatus according to claim 1, is characterized in that:

Described control part considers that the solid timing offset of substrate controls the action of described head assembly, and the solid timing offset of described substrate is the side-play amount that the substrate that element is installed is produced fixedly time.

6. element fixing apparatus according to claim 1, is characterized in that:

Described control part considers that element absorption hour offset amount controls the action of described head assembly, and described element absorption hour offset amount is the side-play amount producing during by the element absorption being installed on substrate.

7. a component mounting method, is characterized in that, to being formed with electrode and being printed with the substrate installation elements of scolder on this electrode, described component mounting method comprises the following steps:

Obtain described scolder with respect to the step of the printing side-play amount of described electrode;

By described printing side-play amount and the step of revising allowed band and contrasting, described correction allowed band is the self-correcting effect presenting by the melting based on described scolder and the installation site of described element can be adapted to the correction allowed band of described electrode side;

In the situation that described printing side-play amount is in described correction allowed band, take the position of deflecting away from substrate of described scolder installs described element as benchmark, and in the situation that described printing side-play amount exceeds described correction allowed band, with than the more close electrode in the printing position of scolder, and the assigned address leaving to the position side being printed with the substrate of described scolder in described correction allowed band from the position of electrode is the step that benchmark is installed described element.