CN211406438U - Vehicle-mounted system SIP module component - Google Patents
Vehicle-mounted system SIP module component Download PDFInfo
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- CN211406438U CN211406438U CN201922305194.7U CN201922305194U CN211406438U CN 211406438 U CN211406438 U CN 211406438U CN 201922305194 U CN201922305194 U CN 201922305194U CN 211406438 U CN211406438 U CN 211406438U
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- pcb board
- sip module
- chip
- pin
- mainboard
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Abstract
The utility model discloses a vehicle-mounted system SIP module subassembly, including SIP module and MB mainboard, PIN pad on the PCB board in the SIP module is connected the foots end and is semi-circular, and PIN pad on the PCB board is connected the foots end and is software tin cream in the MB mainboard, and PIN pad on the PCB board is connected the foots end and is connected the paster contact connection that suits on the PCB board in the PIN pad on the PCB board in the SIP module and the MB mainboard and switch on. The utility model discloses a SIP module PCB board is difficult to appear warping and leads to SMT to weld bad phenomenon, has reduced PCB board manufacturing cost in the system simultaneously.
Description
Technical Field
The utility model relates to a SIP module technical field especially relates to a vehicle-mounted system SIP module subassembly.
Background
The SIP (system-in-package) is formed by internally packaging electronic system core devices such as a CPU, DDR3/4, EMMC, PMIC and the like on a small PCB; the design of the system device in the market at present is to configure modules with different functions on a large PCB, and has the following disadvantages:
the cost of the PCB and the repeated design cost of products with different forms are increased;
the common modules in the current market are generally applied to a part of single-function modules with the area less than 45mm plus 45mm, and are connected in a B2B (board to board) mode, so that the design of most of vehicle-mounted SOC systems cannot be met, and when the area of the modules is more than or equal to 60mm plus 60mm, the SIP module PCB is easy to deform, so that the SMT welding reject ratio is high;
the BGA tin ball mode adopted in the module adopting the BGA process by using the SIP process is complex in production process and high in cost.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the technical problem solved by the utility model is how to solve the problem that when the area of the SIP module is more than or equal to 60mm and 60mm, the PCB board of the SIP module is easy to deform, which leads to high defective rate of SMT welding and reduces the manufacturing cost.
For solving the technical problem, the utility model discloses a technical scheme be an on-vehicle system SIP module subassembly, including SIP module and MB mainboard, PIN pad on the PCB board in the SIP module connects the foot top and is semi-circular, PIN pad on the PCB board connects the foot top and is the software tin cream in the MB mainboard, PIN pad on the PCB board connect the foot top in the SIP module with PIN pad on the PCB board connects foot top software tin cream and suits the paster contact connection and switches on in the MB mainboard.
The SIP module comprises a PCB board with the size of 60mm multiplied by 60mm, a PIN PIN, a CPU chip, a DDR3/4 chip, a PMIC chip and an EMMC chip, wherein the CPU chip, the DDR3/4 chip, the PMIC chip and the EMMC chip are fixedly connected with the PCB board through the PIN PIN.
Compared with the prior art, the utility model discloses a SIP module PCB board is difficult to appear warping and leads to SMT to weld bad phenomenon, has reduced PCB board manufacturing cost in the system simultaneously.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a SIP module structure;
fig. 3 is a schematic view of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings, but the present invention is not limited thereto.
FIG. 1 shows a vehicle-mounted system SIP module component, including SIP module 1 and MB mainboard 2, PIN pad on the PCB board in SIP module 1 connects the foot 101 top and is semi-circular, and PIN pad on the PCB board connects the foot 201 top and is the software tin cream in MB mainboard 2, and PIN pad on the PCB board connects foot 101 top and PIN pad on the PCB board in SIP module 1 and MB mainboard 2 on the soft tin cream in 201 top and the paster contact connection that suits of PCB board is switched on.
As shown in fig. 2, the SIP module 1 includes a PCB board 11 with a size of 60mm × 60mm, a PIN 12, a CPU chip 13, a DDR3/4 chip 14, a PMIC chip 15, and an EMMC chip 16, wherein the CPU chip 13, the DDR3/4 chip 14, the PMIC chip 15, and the EMMC chip 16 are connected and fixed on the PCB board 11 through the PIN 12.
As shown in fig. 3, when in use, the components at the PCB end of the SIP module are attached, and the PIN pad is produced into a semicircle according to the process requirements of the steel mesh manufacturing data shown in fig. 1, so that the SIP module becomes a complete SIP module component equivalent to one component, and can be attached to the PCB of the MB mainboard 2 along with the PCB patch on the MB mainboard 2.
Compared with the prior art, the utility model discloses a SIP module PCB board is difficult to appear warping and leads to SMT to weld bad phenomenon, has reduced PCB board manufacturing cost in the system simultaneously.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention.
Claims (2)
1. The utility model provides a vehicle-mounted system SIP module subassembly, includes SIP module and MB mainboard, its characterized in that, PIN pad on the PCB board in the SIP module connects the foot top and is semi-circular, PIN pad on the PCB board connects the foot top and is the software tin cream in the MB mainboard, PIN pad on the PCB board connect the foot top in the SIP module with PIN pad on the PCB board connects foot top software tin cream and suits the paster contact connection and switches on in the MB mainboard.
2. The SIP module assembly of claim 1, wherein the SIP module comprises a PCB board with dimensions of 60mm x 60mm, a PIN PIN, a CPU chip, a DDR3/4 chip, a PMIC chip and an EMMC chip, and the CPU chip, the DDR3/4 chip, the PMIC chip and the EMMC chip are fixed on the PCB board through the PIN PIN connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922305194.7U CN211406438U (en) | 2019-12-19 | 2019-12-19 | Vehicle-mounted system SIP module component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922305194.7U CN211406438U (en) | 2019-12-19 | 2019-12-19 | Vehicle-mounted system SIP module component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211406438U true CN211406438U (en) | 2020-09-01 |
Family
ID=72231433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922305194.7U Active CN211406438U (en) | 2019-12-19 | 2019-12-19 | Vehicle-mounted system SIP module component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211406438U (en) |
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2019
- 2019-12-19 CN CN201922305194.7U patent/CN211406438U/en active Active
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