CN217591211U - Chip assembly and LED module with same - Google Patents

Abstract

The utility model provides a chip module and have its LED module, the LED module includes the control panel, be equipped with first pad group on the control panel, the chip module is including replacing chip and keysets, wherein, the keysets includes chip connecting portion, control panel connecting portion and connecting circuit, it is connected with chip connecting portion to replace the chip, the control panel connecting portion include second pad group, the pin of replacement chip passes through connecting circuit and second pad group electric connection, second pad group is corresponding with first pad group, on being connected to the control panel with control panel connecting portion through second pad group and the welding of first pad group. The technical scheme of the application can effectively solve the problem that the cost is high when the PCB is redesigned for adapting to the pins of the substitute chip in the related technology.

Description

Chip assembly and LED module with same

Technical Field

The utility model relates to a LED shows technical field, particularly, relates to a chip module and have its LED module.

Background

In the related art, with the updating of electronic products, the improvement of process requirements, the influence of trade and the like, some chips have the situations of production stop, price increase and the like.

For the chips with high production stop or price increase, substitute chips capable of substituting the chips are available in the market, but pins of some substitute chips are not consistent with those of the chips, so that the substitute chips cannot be directly welded to corresponding positions on the PCB. In this case, the PCB board needs to be redesigned to accommodate the pins of the replacement chip, but the cost of redesigning the PCB board is high.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a chip module and have its LED module to solve among the correlation technique for the pin redesign PCB board of adaptation substitution chip is with higher problem of cost.

In order to realize the above object, according to the utility model discloses an aspect provides a chip module of LED module, the LED module includes the control panel, be equipped with first pad group on the control panel, the chip module includes replacement chip and keysets, wherein, the keysets includes the chip connecting portion, control panel connecting portion and connecting circuit, the replacement chip is connected with the chip connecting portion, the control panel connecting portion include second pad group, the pin of replacement chip passes through connecting circuit and second pad group electric connection, second pad group is corresponding with first pad group, in order to be connected to the control panel through second pad group and the welding of first pad group with the control panel connecting portion.

Furthermore, the chip connecting portion includes a first board body and a third bonding pad set disposed on the first board body, the third bonding pad set is electrically connected to the second bonding pad set through a connecting circuit, and a pin of the replacement chip is welded to the third bonding pad set to connect the replacement chip to the first board body.

Further, the control panel connecting portion includes a second plate body, and the second pad group is disposed on the second plate body, wherein the third pad group and the second pad group are respectively disposed on two surfaces of the adapter plate opposite to each other.

Further, the connection circuit includes a first wire and a second wire, the first pad and the second pad of the third pad group are connected to the first pad of the second pad group through the first wire, the first pin of the replacement chip is connected to the first pad of the third pad group by welding, the second pin of the replacement chip is connected to the second pad of the third pad group by welding, the third pad and the fourth pad of the third pad group are connected to the second pad of the second pad group through the second wire, the third pin of the replacement chip is connected to the third pad of the third pad group by welding, and the fourth pin of the replacement chip is connected to the fourth pad of the third pad group by welding, wherein the first pin and the second pin are input pins, and the third pin and the fourth pin are output pins.

Further, the connection circuit includes a filter circuit, the filter circuit is connected between the fifth pad, the sixth pad and the seventh pad of the third pad group and the third pad of the second pad group, the fifth pad, the sixth pad of the third pad group and the third pad of the second pad group are all connected with the first end of the filter circuit, the seventh pad of the third pad group is connected with the second end of the filter circuit, the fifth pin of the replacement chip is connected with the fifth pad of the third pad group by welding, the sixth pin of the replacement chip is connected with the sixth pad of the third pad group by welding, and the seventh pin of the replacement chip is connected with the seventh pad of the third pad group by welding.

Furthermore, the connection circuit includes a third wire and a fourth wire, an eighth pad of the third pad group is connected to a fourth pad of the second pad group through the third wire, an eighth lead of the replacement chip is connected to an eighth pad of the third pad group by welding, a ninth pad of the third pad group is connected to a fifth pad of the second pad group through the fourth wire, and a ninth lead of the replacement chip is connected to the ninth pad of the third pad group by welding.

Further, the first plate body and the second plate body are both made of flexible materials.

Further, the width of the chip connection part is greater than that of the control board connection part.

According to the utility model discloses an on the other hand provides a LED module, including the control panel and set up the chip subassembly on the control panel, the chip subassembly is foretell chip subassembly.

Further, the chip connection portion is arranged above the control board in a suspended manner.

Use the technical scheme of the utility model, second pad group on the control panel connecting portion is corresponding with first pad group, can be connected the chip subassembly to the control panel of LED module through the welded connection of first pad group and second pad group like this, and the chip connecting portion on replacement chip and the keysets are connected, and the pin of replacement chip passes through second pad group electric connection on connecting circuit and the control panel connecting portion. That is, the pins of the replaced chip can be connected with the first bonding pad group on the control board through the connecting circuit and the second bonding pad group, so that the first bonding pad group on the control board does not need to be adjusted, and the replaced chip also has the same function as the replaced chip. The replacement chip is connected to the control panel through the adapter plate, so that corresponding functions can be realized, a PCB does not need to be redesigned, and the cost can be effectively reduced. Therefore, the technical scheme of the application can effectively solve the problem that the cost is high when the PCB is redesigned to adapt to the pins of the substitute chip in the related technology.

Drawings

The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the scope of the invention. In the drawings:

fig. 1 shows a schematic structural view of an embodiment of a chip assembly according to the present invention;

fig. 2 shows a schematic structural diagram of a replaced chip according to an embodiment of the chip assembly of the present invention; and

fig. 3 shows a schematic diagram of an alternative chip of the chip assembly of fig. 1.

Wherein the figures include the following reference numerals:

10. replacing the chip; 11. a first pin; 12. a second pin; 13. a third pin; 14. a fourth pin; 15. a fifth pin; 16. a sixth pin; 17. a seventh pin; 18. an eighth pin; 19. a ninth pin; 20. an adapter plate; 21. a chip connection portion; 211. a first plate body; 212. a third pad group; 2121. a first bonding pad; 2122. a second pad; 2123. a third pad; 2124. a fourth pad; 2125. a fifth pad; 2126. a seventh pad; 2127. an eighth pad; 2128. a ninth pad; 22. a control panel connection part; 221. a second plate body; 222. a second pad group; 2221. a first bonding pad; 2222. a second pad; 2223. a third pad; 2224. a fourth pad; 2225. a fifth pad; 2226. a sixth pad; 231. a filter circuit; 30. the chip is replaced.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

Fig. 1 shows a schematic structural diagram of a chip assembly of the LED module according to this embodiment, the LED module includes a control board, a first pad set is disposed on the control board, and the chip assembly includes: replacing the chip 10 and the interposer 20. The interposer 20 includes a chip connection portion 21, a control board connection portion 22 and a connection circuit, the replacement chip 10 is connected to the chip connection portion 21, the control board connection portion 22 includes a second pad set 222, a pin of the replacement chip 10 is electrically connected to the second pad set 222 through the connection circuit, the second pad set 222 corresponds to the first pad set, and the control board connection portion 22 is connected to the control board through the second pad set 222 and the first pad set by welding.

By applying the technical solution of the present embodiment, the second bonding pad group 222 on the control board connecting portion 22 corresponds to the first bonding pad group, so that the chip assembly can be connected to the control board of the LED module by welding the first bonding pad group and the second bonding pad group 222, the replacement chip 10 is connected to the chip connecting portion 21 on the interposer 20, and the pins of the replacement chip 10 are electrically connected to the second bonding pad group 222 on the control board connecting portion 22 through the connection circuit. That is, the pins of the replacement chip 10 can be connected to the first pad group on the control board through the connection circuit and the second pad group 222, so that the first pad group on the control board does not need to be adjusted, and the same function as the replaced chip 30 is also achieved. The replacing chip 10 is connected to the control board through the adapter board 20, so that corresponding functions can be realized, a PCB (printed circuit board) does not need to be redesigned, and the cost can be effectively reduced. Therefore, the technical scheme of the embodiment can effectively solve the problem that the redesign of the PCB for adapting to the pins of the substitute chip in the related art is high in cost.

As shown in fig. 1, the chip connection portion 21 includes a first board body 211 and a third pad set 212 disposed on the first board body 211, the third pad set 212 is electrically connected to the second pad set 222 through a connection circuit, and the pins of the replacement chip 10 are soldered to the third pad set 212, so as to connect the replacement chip 10 to the first board body 211. The replacement chip 10 is connected to the interposer 20 through the third pad group 212 and connected to the control board of the LED module through the interposer 20, so that not only can the corresponding function be realized, but also the PCB does not need to be redesigned, and the cost can be effectively reduced.

As shown in fig. 1, the control board connecting portion 22 includes a second board body 221, and the second pad set 222 is disposed on the second board body 221, wherein the third pad set 212 and the second pad set 222 are respectively located on two surfaces of the interposer 20 facing away from each other. The third pad group 212 is disposed on the first surface of the interposer 20 and connected to the replacement chip 10, the second pad group 222 is disposed on the second surface of the interposer 20 and connected to the control board of the LED module, and the first surface and the second surface are opposite sides of the interposer 20, so that the replacement chip 10 can be prevented from interfering with other chips or components on the control board.

In this embodiment, as shown in fig. 1 to fig. 3, the replacing chip 10 is a TPL910ADJ _ DF6R chip, and the replaced chip 30 is a TLV75901PDRV chip. The replaced chip 30 is a 2mm × 2mm LDO (low dropout regulator) chip. The replaced chip 30 is a non-domestic chip, and the price of the chip is increased nearly 100 times at present. The replacement chip 10 is a 3mm × 3mm LDO chip, which is relatively inexpensive, but the size of the replacement chip 10 cannot be directly matched with the corresponding pad set (i.e., the first pad set) on the control board, and the replaced chip 30 cannot be directly replaced with the replacement chip 10. In the present embodiment, the adaptor board 20 is used as a bridge to connect the replacement chip 10 to the control board, and the same function as that of the replaced chip 30 is achieved.

Specifically, the connection circuit includes a first conductive line and a second conductive line, the first pad 2121 and the second pad 2122 of the third pad group 212 are connected to the first pad 2221 of the second pad group 222 through the first conductive line, the first lead 11 of the replacement chip 10 is connected to the first pad 2121 of the third pad group 212 by welding, the second lead 12 of the replacement chip 10 is connected to the second pad 2122 of the third pad group 212 by welding, the third pad 2123 and the fourth pad 2124 of the third pad group 212 are connected to the second pad 2222 of the second pad group 222 through the second conductive line, the third lead 13 of the replacement chip 10 is connected to the third pad 2123 of the third pad group 212 by welding, and the fourth lead 14 of the replacement chip 10 is connected to the fourth pad 2124 of the third pad group 212 by welding, where the first lead 11 and the second lead 12 are both input leads, and the third lead 13 and the fourth lead 14 are both output leads. The connection circuit includes a filter circuit 231, the filter circuit 231 is connected between the fifth pad 2125, the sixth pad and the seventh pad 2126 of the third pad group 212 and the third pad 2223 of the second pad group 222, the fifth pad 2125, the sixth pad of the third pad group 212 and the third pad 2223 of the second pad group 222 are all connected to the first end of the filter circuit 231, the seventh pad 2126 of the third pad group 212 is connected to the second end of the filter circuit 231, the fifth lead 15 of the replacement chip 10 is connected to the fifth pad 2125 of the third pad group 212 by welding, the sixth lead 16 of the replacement chip 10 is connected to the sixth pad of the third pad group 212 by welding, and the seventh lead 17 of the replacement chip 10 is connected to the seventh pad 2126 of the third pad group 212 by welding. The connection circuit includes a third conductive line and a fourth conductive line, the eighth pad 2127 of the third pad group 212 is connected to the fourth pad 2224 of the second pad group 222 through the third conductive line, the eighth lead 18 of the replacement chip 10 is connected to the eighth pad 2127 of the third pad group 212 by welding, the ninth pad 2128 of the third pad group 212 is connected to the fifth pad 2225 of the second pad group 222 through the fourth conductive line, and the ninth lead 19 of the replacement chip 10 is connected to the ninth pad 2128 of the third pad group 212 by welding. The positions of the respective pads in the second pad group 222 and the third pad group 212 may refer to fig. 1, wherein the sixth pad of the third pad group 212 is shielded by the replacement chip 10 and thus is not shown in the figure. The connection circuit can electrically connect each pin of the replacement chip 10 with a corresponding pad in the second pad group 222, so that the chip assembly can perform the same function as the replaced chip 30 after being soldered to the control board of the LED module.

It should be noted that the first pad group on the control board of the LED module is originally used for soldering the pins of the replaced chip 30, therefore, the arrangement manner of the pads of the first pad group is the same as the distribution manner of the pins of the replaced chip 30, and in order to implement the connection between the chip assembly and the control board, the arrangement manner of the pads of the second pad group 222 and the pads of the first pad group should be the same. Referring to fig. 1 and 2, a first pad 2221 of the second pad group 222 in the present embodiment corresponds to pin 1 of the replaced chip 30, a second pad 2222 of the second pad group 222 corresponds to pin 2 of the replaced chip 30, a third pad 2223 of the second pad group 222 corresponds to pin 3 of the replaced chip 30, a fourth pad 2224 of the second pad group 222 corresponds to pin 4 of the replaced chip 30, a fifth pad 2225 of the second pad group 222 corresponds to pin 5 of the replaced chip 30, and a sixth pad 2226 of the second pad group 222 corresponds to pin 6 of the replaced chip 30.

Specifically, as shown in fig. 1, in the present embodiment, the width of the chip connection portion 21 is larger than the width of the control board connection portion 22. Most of the lines and components (filter capacitor C1) connecting the circuits are disposed on the chip connection part 21 so that the control board connection part 22 has a shape and size equivalent to or less different from the replaced chip 30, so that the chip assembly can correspond to the corresponding pad assembly on the control board, so that the chip assembly can be soldered to the control board.

The application also provides an LED module, the embodiment according to the LED module of this application includes the control panel and sets up the chip subassembly on the control panel, and wherein, the chip subassembly is foretell chip subassembly. The chip assembly can effectively solve the problem that the cost for redesigning the PCB to adapt to the pins of the replaced chip is high in the related art. The LED module with the chip assembly also has the advantages.

In the present embodiment, the chip connecting portion 21 is arranged to be suspended above the control board. That is, the chip connection portions 21 are arranged in a suspended manner with respect to the control board connection portions 22, so that the chip connection portions 21 can be prevented from interfering with other chips or components on the control board.

In the present embodiment, since the size of the replacement chip 10 is larger than that of the replaced chip 30, the chip connection portion 21 needs to be arranged in a suspended manner. In the embodiment not shown in the drawings, when the size of the replacement chip is smaller than that of the replaced chip, the chip connection portion and the control board connection portion may be disposed to be overlapped, that is, the replacement chip is located at the middle position of the interposer, and the second pad group connected to the control board is disposed at the edge position of the interposer.

Specifically, the first plate body 211 and the second plate body 221 are both made of a flexible material. The flexible material may be polyimide, mylar, or the like. The first board body 211 and the second board body 221 made of polyimide or mylar are flexible board bodies on which a printed circuit can be formed, and the flexible board can be freely bent or folded. This allows the chip connection portion 21 to be suspended above other chips or components provided on the control board.

In the description of the present invention, it should be understood that the directions or positional relationships indicated by the directional terms such as "front, back, upper, lower, left, right", "horizontal, vertical, horizontal" and "top, bottom", etc. are usually based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, and in the case of not making a contrary explanation, these directional terms do not indicate and imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore, should not be construed as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

For ease of description, spatially relative terms such as "over 8230," "upper surface," "above," and the like may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; 'above" may include both orientations "at 8230; \8230;' above 8230; 'at 8230;' below 8230;" above ". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms do not have special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a chip assembly of LED module, the LED module includes the control panel, be equipped with first pad group on the control panel, its characterized in that, chip assembly is including replacing chip (10) and keysets (20), wherein, keysets (20) include chip connecting portion (21), control panel connecting portion (22) and connecting circuit, replace chip (10) with chip connecting portion (21) are connected, control panel connecting portion (22) include second pad group (222), the pin of replacing chip (10) passes through connecting circuit with second pad group (222) electric connection, second pad group (222) with first pad group is corresponding, with through second pad group (222) with first pad group welding will control panel connecting portion (22) are connected to on the control panel.

2. The die assembly of claim 1, wherein the die attach portion (21) comprises a first board body (211) and a third pad set (212) disposed on the first board body (211), the third pad set (212) is electrically connected to the second pad set (222) through the connecting circuit, and the leads of the replacement die (10) are soldered to the third pad set (212) to connect the replacement die (10) to the first board body (211).

3. Chip assembly according to claim 2, wherein the control board connection portion (22) comprises a second board body (221), the second pad set (222) being arranged on the second board body (221), wherein the third pad set (212) and the second pad set (222) are respectively located on two surfaces of the interposer (20) facing away from each other.

4. The die assembly of claim 3, wherein the connecting circuit comprises a first lead and a second lead, the first pad (2121) and the second pad (2122) of the third pad group (212) are connected to the first pad (2221) of the second pad group (222) through the first lead, the first lead (11) of the replacement die (10) is connected to the first pad (2121) of the third pad group (212) by welding, the second lead (12) of the replacement die (10) is connected to the second pad (2122) of the third pad group (212) by welding, the third pad (2123) and the fourth pad (2124) of the third pad group (212) are connected to the second pad (2222) of the second pad group (222) through the second lead, the third lead (13) of the replacement die (10) and the third pad (2123) of the third pad group (212) are connected to each other, the third lead (13) of the replacement die (10) and the fourth pad (2124) are connected to each other, and the third lead (13) and the fourth lead (12) are connected to the input pad (14) of the third pad group (212), and the fourth lead (2124), and the input of the input pad (14).

5. The die assembly according to claim 3, characterized in that the connecting circuit comprises a filter circuit (231), the filter circuit (231) being connected between the fifth (2125), sixth and seventh (2126) pads of the third pad group (212) and the third (2223) pad of the second pad group (222), the fifth (2125), sixth and third (2223) pads of the third pad group (212) each being connected to a first end of the filter circuit (231), the seventh (2126) pad of the third pad group (212) being connected to a second end of the filter circuit (231), the fifth lead (15) of the replacement die (10) being solder connected to the fifth (2125) pad of the third pad group (212), the sixth lead (16) of the replacement die (10) being solder connected to the sixth pad of the third pad group (212), and the seventh lead (16) of the replacement die (10) being solder connected to the seventh lead (2126) pad of the seventh pad group (212).

6. The die assembly of claim 3, wherein the connection circuit comprises a third conductive line and a fourth conductive line, the eighth pad (2127) of the third pad group (212) is connected to the fourth pad (2224) of the second pad group (222) through the third conductive line, the eighth lead (18) of the replacement die (10) is connected to the eighth pad (2127) of the third pad group (212) by welding, the ninth pad (2128) of the third pad group (212) is connected to the fifth pad (2225) of the second pad group (222) through the fourth conductive line, and the ninth lead (19) of the replacement die (10) is connected to the ninth pad (2128) of the third pad group (212) by welding.

7. The chip assembly according to any of claims 3 to 6, wherein the first board body (211) and the second board body (221) are both made of a flexible material.

8. Chip assembly according to one of claims 1 to 6, characterized in that the width of the chip connection (21) is greater than the width of the control board connection (22).

9. An LED module comprising a control board and a chip assembly disposed on the control board, wherein the chip assembly is the chip assembly of any one of claims 1 to 8.

10. The LED module according to claim 9, characterized in that the chip connection (21) is suspended above the control board.

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