CN219960939U - PCB (printed circuit board) co-packaging structure applicable to LDOs (low dropout regulator) with different packages - Google Patents
PCB (printed circuit board) co-packaging structure applicable to LDOs (low dropout regulator) with different packages Download PDFInfo
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- CN219960939U CN219960939U CN202320972454.XU CN202320972454U CN219960939U CN 219960939 U CN219960939 U CN 219960939U CN 202320972454 U CN202320972454 U CN 202320972454U CN 219960939 U CN219960939 U CN 219960939U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 42
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 4
- 230000004308 accommodation Effects 0.000 description 6
- 101100028477 Drosophila melanogaster Pak gene Proteins 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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Abstract
The utility model relates to a PCB co-packaging structure suitable for different packaging LDOs, and relates to the technical field of PCB packaging. The structure comprises a first component accommodating area and a second component accommodating area, wherein the first component accommodating area and the second component accommodating area are stacked; the first component accommodating area corresponds to the first body accommodating area and the first pin accommodating area, and the second component accommodating area corresponds to the second body accommodating area and the second pin accommodating area; the boundary of the second component accommodating area does not exceed the first component accommodating area; the lower boundary of the first body accommodating area does not exceed the upper boundary of the second pin accommodating area. The accommodating areas corresponding to the two components are arranged in the common packaging structure, the new packaging is compatible with the packaging of the two components, and in the use process, when certain materials are in shortage, the other materials can be directly replaced without setting and adjusting the packaging structure again, so that the development cost is reduced.
Description
Technical Field
The utility model relates to the technical field of printed circuit board (Printed circuit boards, PCB) design, in particular to a PCB co-packaging structure suitable for different packaging LDOs.
Background
Electronic components are currently used in various industries, wherein surface mount devices (Surface Mount Technology, SMD) are present in small volumes and in various circuit boards.
In the related art, materials of different manufacturers with the same specification are inevitably replaced in a large environment of electronic component supply shortage.
However, in the process of the related art using the mutual replacement, when it is assumed that the SMD material on a certain PCB needs to be replaced with another material, the original PCB package design needs to be modified, in which case the cost of designing the PCB package structure increases.
Disclosure of Invention
The utility model relates to a PCB co-packaging structure suitable for different packaging LDOs, which can be adapted to multi-type SMD material structures, and reduce packaging design modification cost;
the first component accommodating area and the second component accommodating area are bilaterally symmetrical in center, and the first component accommodating area is aligned with a bilaterally symmetrical center line of the second component accommodating area;
the first component accommodating area corresponds to the first body accommodating area and the first pin accommodating area, and the second component accommodating area corresponds to the second body accommodating area and the second pin accommodating area;
the boundary of the second component accommodating area does not exceed the first component accommodating area;
more specifically, the boundary of the second body accommodating area does not exceed the boundary of the first body accommodating area;
the lower boundary of the second pin accommodating area does not exceed the lower boundary of the first pin accommodating area.
The lower boundary of the first body accommodating area does not exceed the upper boundary of the second pin accommodating area.
In one possible implementation, the first body accommodating area includes at least a first sub-pad, and the first pin accommodating area includes a second sub-pad, a third sub-pad, and a fourth sub-pad;
the second body accommodating area at least comprises a fifth sub-bonding pad, and the second pin accommodating area comprises a sixth sub-bonding pad and a seventh sub-bonding pad;
in one possible implementation, the surfaces of the first, second, third, fourth, fifth, sixth, and seventh sub-pads are coated with solder paste.
In one possible implementation, the size of the first sub-pad is larger than the size of the fifth sub-pad.
In one possible implementation, the lower boundary of the first sub-pad is flush with the lower boundary of the fifth sub-pad, forming a first lower boundary;
the lower boundaries of the second sub-bonding pad, the third sub-bonding pad and the fourth sub-bonding pad are flush, so that a second lower boundary is formed;
the upper boundary and the lower boundary of the sixth sub-bonding pad and the upper boundary and the lower boundary of the seventh sub-bonding pad are respectively flush to form a first upper boundary and a third lower boundary;
the first lower boundary is located above the second lower boundary;
passing the first lower boundary not lower than the first upper boundary;
the third lower boundary is not lower than the second lower boundary.
In one possible implementation, the first sub-pad, the second sub-pad, the third sub-pad, and the fourth sub-pad are used to solder the first component;
the fifth sub-pad, the sixth sub-pad and the seventh sub-pad are used for soldering the second component.
In one possible implementation, the PCB co-packaging structure applicable to different packaging LDOs further comprises a steel mesh;
the steel mesh comprises at least two openings;
the position of the opening corresponds to the position of the bonding pad of the first component accommodating area and the second component accommodating area.
The technical scheme provided by the utility model has the beneficial effects that at least:
the accommodating areas corresponding to the two components are arranged in the common packaging structure, the new packaging is compatible with the packaging of the two components, and in the use process, when certain materials are in shortage, the other materials can be directly replaced without setting and adjusting the packaging structure again, so that the development cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows a schematic diagram of a PCB co-package structure suitable for LDOs with different packages according to the present utility model.
Fig. 2 shows a schematic structural view of a steel mesh according to the present utility model.
The reference numerals in the drawings are as follows:
11-a first body accommodating area, 12-a first pin accommodating area, 21-a second body accommodating area, 22-a second pin accommodating area;
111-first sub-pad, 121-second sub-pad, 122-third sub-pad, 123-fourth sub-pad, 211-fifth sub-pad, 221-sixth sub-pad, 222-seventh sub-pad;
3-steel mesh.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the embodiments of the present utility model will be described in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic diagram of a PCB co-packaging structure suitable for LDOs with different packages according to an exemplary embodiment of the present utility model, referring to fig. 1, the apparatus includes a first component accommodating area and a second component accommodating area, where the first component accommodating area and the second component accommodating area are stacked; the first component accommodating area and the second component accommodating area are bilaterally symmetrical in center, and the first component accommodating area is aligned with a bilaterally symmetrical center line of the second component accommodating area; the first component accommodating area corresponds to a first body accommodating area 11 and a first pin accommodating area 12, and the second component accommodating area corresponds to a second body accommodating area 21 and a second pin accommodating area 22; the boundary of the second component accommodation area does not exceed the boundary of the first component accommodation area, more specifically, the boundary of the second body accommodation area 21 does not exceed the boundary of the first body accommodation area 11;
the lower boundary of the second pin receiving area 22 does not exceed the lower boundary of the first pin receiving area 12.
The lower boundary of the first body accommodating area does not exceed the upper boundary of the second pin accommodating area.
In the embodiment of the utility model, the first component accommodating area and the second component accommodating area are both realized as solid areas, and the solid areas are defined in position through the outer frame body or defined in position through the circuit board. The present utility model is not limited to the limited form of the area.
In the embodiment of the utility model, the first component accommodating area is used for accommodating standard TO263-3 packaging, and the second component accommodating area is used for accommodating standard DPAK packaging. In this case, the co-packaging structure provided by the utility model can realize co-packaging of TO263-3 and DPAK.
In this case, referring TO fig. 1, corresponding TO the package form of the standard TO263-3 package, the first body accommodating area 11 includes a first sub-pad 111, and the first pin accommodating area 12 includes a second sub-pad 121, a third sub-pad 122, and a fourth sub-pad 123; the second body receiving area 21 includes a fifth sub-pad 211 and the second pin receiving area 22 includes a sixth sub-pad 221 and a seventh sub-pad 222 corresponding to the form of the standard DPAK package.
In this case, the surfaces of the first, second, third, fourth, fifth, sixth, and seventh sub-pads 111, 121, 122, 123, 211, 221, and 222 are coated with solder paste, and have soldering characteristics.
In one possible implementation, referring to fig. 1, the size of the first sub-pad 111 is larger than the size of the fourth sub-pad 211. In one possible implementation, the lower boundary of the first sub-pad 111 is flush with the lower boundary of the fifth sub-pad 211, forming a first lower boundary;
the lower boundaries of the second sub-pad 121, the third sub-pad 122 and the fourth sub-pad 123 are flush to form a second lower boundary;
the upper boundary and the lower boundary of the sixth sub-pad 221 and the seventh sub-pad 222 are respectively flush to form a first upper boundary and a third lower boundary;
the first lower boundary is located above the second lower boundary;
passing the first lower boundary not lower than the first upper boundary;
the third lower boundary is not lower than the second lower boundary.
In one possible implementation, the first sub-pad 111, the second sub-pad 121, the third sub-pad 122, and the fourth sub-pad 123 are used to solder the first component;
the fifth sub-pad 211, the sixth sub-pad 221, and the seventh sub-pad 222 are used for soldering the second component.
In one possible implementation, the PCB co-packaging structure suitable for different packaging LDOs further includes a steel mesh, referring TO fig. 2, the steel mesh 3 includes at least two openings, the positions of the openings correspond TO the positions of the pads of the first component TO263-3 packaging accommodation area and the second component DPAK packaging accommodation area, and the opening area covers the spatial area of all the pads. More specifically, since the fifth sub-pad 211 is located in the first sub-pad 111 and the pad coverage area is larger, the steel mesh hole location shown in fig. 2 is formed according to the locations of the first sub-pad 111, the second sub-pad 121, the third sub-pad 122, the fourth sub-pad 123, the sixth sub-pad 221 and the seventh sub-pad 222, and the hole area covers the first sub-pad 111 (including the fifth sub-pad 211), the second sub-pad 121, the third sub-pad 122, the fourth sub-pad 123, the sixth sub-pad 221 and the seventh sub-pad 222.
In summary, in the device provided by the embodiment of the utility model, the accommodating areas corresponding to the two components are arranged in the co-packaging structure, and the new packaging is compatible with the packaging of the two components, so that when a certain material is in shortage in the use process, the other material can be directly replaced without setting and adjusting the packaging structure again, thereby reducing the development cost.
The foregoing description of the preferred embodiments of the present utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements within the spirit and principles of the present utility model.
Claims (7)
1. The PCB co-packaging structure suitable for the LDOs with different packages is characterized by comprising a first component accommodating area and a second component accommodating area, wherein the first component accommodating area and the second component accommodating area are stacked;
the first component accommodating area and the second component accommodating area are both bilaterally symmetrical in center, and the first component accommodating area is aligned with a bilaterally symmetrical center line of the second component accommodating area;
the first component accommodating area corresponds to a first body accommodating area (11) and a first pin accommodating area (12), and the second component accommodating area corresponds to a second body accommodating area (21) and a second pin accommodating area (22); the second component receiving area is bounded by no more than the first component receiving area, more specifically,
the boundary of the second body accommodating area (21) does not exceed the boundary of the first body accommodating area (11);
the lower boundary of the second pin accommodating area (22) does not exceed the lower boundary of the first pin accommodating area (12);
the lower boundary of the first body accommodating area (11) does not exceed the upper boundary of the second pin accommodating area (22).
2. The PCB co-packaging structure adapted for different packaging LDOs according to claim 1, wherein the first body accommodating area (11) comprises at least a first sub-pad (111), the first pin accommodating area (12) comprises a second sub-pad (121), a third sub-pad (122), a fourth sub-pad (123);
the second body accommodating area (21) at least comprises a fifth sub-pad (211), and the second pin accommodating area (22) comprises a sixth sub-pad (221) and a seventh sub-pad (222).
3. The PCB co-packaging structure adapted for different package LDOs according to claim 2, wherein the surfaces of the first sub-pad (111), the second sub-pad (121), the third sub-pad (122), the fourth sub-pad (123), the fifth sub-pad (211), the sixth sub-pad (221) and the seventh sub-pad (222) are coated with solder paste.
4. The PCB co-packaging structure adapted for different packaged LDOs according to claim 2, wherein the size of the first sub-pad (111) is larger than the size of the fifth sub-pad (211).
5. The PCB co-packaging structure adapted for different packaged LDOs according to claim 4, wherein the lower boundary of the first sub-pad (111) is flush with the lower boundary of the fifth sub-pad (211), forming a first lower boundary;
-the lower boundaries of the second sub-pad (121), the third sub-pad (122) and the fourth sub-pad (123) are flush, forming a second lower boundary;
the upper boundary and the lower boundary of the sixth sub-bonding pad (221) and the upper boundary and the lower boundary of the seventh sub-bonding pad (222) are respectively flush to form a first upper boundary and a third lower boundary;
the first lower boundary is located above the second lower boundary;
the first lower boundary is not lower than the first upper boundary;
the third lower boundary is not lower than the second lower boundary.
6. The PCB co-packaging structure adapted for different packaged LDOs according to claim 2, wherein the first sub-pad (111), the second sub-pad (121), the third sub-pad (122) and the fourth sub-pad (123) are used for soldering a first component;
the fifth sub-pad (211), the sixth sub-pad (221) and the seventh sub-pad (222) are used for welding a second component.
7. The PCB co-packaging structure adapted for different packaged LDOs according to claim 1, wherein the PCB co-packaging structure adapted for different packaged LDOs further comprises a steel mesh (3);
the steel mesh (3) comprises at least two openings;
the positions of the openings correspond to the positions of the bonding pads of the first component accommodating area and the second component accommodating area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320972454.XU CN219960939U (en) | 2023-04-25 | 2023-04-25 | PCB (printed circuit board) co-packaging structure applicable to LDOs (low dropout regulator) with different packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320972454.XU CN219960939U (en) | 2023-04-25 | 2023-04-25 | PCB (printed circuit board) co-packaging structure applicable to LDOs (low dropout regulator) with different packages |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219960939U true CN219960939U (en) | 2023-11-03 |
Family
ID=88550292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320972454.XU Active CN219960939U (en) | 2023-04-25 | 2023-04-25 | PCB (printed circuit board) co-packaging structure applicable to LDOs (low dropout regulator) with different packages |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219960939U (en) |
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2023
- 2023-04-25 CN CN202320972454.XU patent/CN219960939U/en active Active
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