CN200990725Y

CN200990725Y - Printed circuit board

Info

Publication number: CN200990725Y
Application number: CN 200620016273
Authority: CN
Inventors: 朱佳昌
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd
Priority date: 2006-12-15
Filing date: 2006-12-15
Publication date: 2007-12-12
Anticipated expiration: 2016-12-15

Abstract

The utility model relates to a printing circuit board, comprises a housing region, a first welding plate applied to encapsulate a first component, a second welding plate applied to encapsulate a second component and a chip installing area are arranged in a housing region, the first component and the second component are the kindred component with the same function and encapsulated in the housing region in the alternatively way, the first welding plate is far from the chip installing area compared with the second welding plate. The printing circuit board can encapsulate different components in the same housing region.

Description

Printed circuit board (PCB)

Technical field

The utility model is about a kind of printed circuit board (PCB), refers to a kind of printed circuit board (PCB) of saving wiring space especially.

Technical background

Electronic component with identical function has multiple different size usually, motherboard is when design, in order to satisfy the flexibility of making and using, usually on motherboard, lay a plurality of encapsulation circuits of the multiple size of corresponding provided as one homogeneous element, then according to the actual component size that mounts and with component mounter to one of correspondence encapsulation circuit, and other encapsulation circuit can't be used.Motherboard 100 as shown in Figure 1 is provided with the diverse location that one first packaging area 10 of the read-only memory element that can be used for mounting different size and one second packaging area, 40, the first packaging areas 10 and second packaging area 40 are laid in motherboard 100 respectively; First packaging area 10 comprises one first chip installation area territory 20 and is positioned at some first pads 30 of 20 both sides, the described first chip installation area territory, the pin of the read-only memory element of correspondingly-sized can be welded on first pad 30,20 bottoms, the first chip installation area territory are provided with a triangle indicator 21 of being convenient to installation elements, 50 bottoms, some second pad, 60, the second chip installation area territories that second packaging area 40 comprises one second chip installation area territory 50 and is positioned at 50 both sides, the described second chip installation area territory are provided with a triangle indicator 51 of being convenient to installation elements.When the size of read-only memory element of encapsulation and first packaging area 10 big or small corresponding, this read-only memory element is packaged into first packaging area, 10, the second packaging areas 40 to be kept; When the size of the size of read-only memory element of encapsulation and second packaging area 40 at once, this read-only memory element is packaged into second packaging area, 40, the first packaging areas 10 to be kept.

Very limited because of the wiring space on the motherboard, as if the diverse location on motherboard, then can reduce the wiring space on the motherboard with above-mentioned first packaging area 10 and second packaging area, 40 difference layouts, influence the wiring of other element on the motherboard.

Summary of the invention

In view of above content, be necessary to provide a kind of printed circuit board (PCB) of saving the mainboard wiring space.

A kind of printed circuit board (PCB), it comprises a packaging area, be provided with first pad that is used to encapsulate one first element, second pad and a chip installation area territory that is used to encapsulate one second element in the described packaging area, described first, second element is the provided as one homogeneous element with identical function, and be packaged in the described packaging area to select one mode, more described second pad of described first pad is away from described chip installation area territory.

Compared to prior art, described printed circuit board (PCB) can be selected one the multiple provided as one homogeneous element of encapsulation in same packaging area, saves wiring space.

Description of drawings

The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.

Fig. 1 is the layout of integrated chip on motherboard of existing two kinds of different sizes.

Fig. 2 is the layout of the utility model printed circuit board (PCB) better embodiment.

Embodiment

Please refer to Fig. 2, it is the layout of the utility model printed circuit board (PCB) better embodiment.One packaging area 70 comprises a chip installation area territory 80 and is positioned at some pads 90 of 80 both sides, described chip installation area territory that this packaging area 70 can be used to optionally encapsulate the read-only memory element of a large-size or the read-only memory element of a reduced size.

First packaging area 10 among described Fig. 1 is added on second packaging area 40, the indicator 21 of first packaging area 10 is overlapped fully with the indicator 51 of second packaging area 40, then chip installation area territory 80, the first pads 30 among the 50 formation Fig. 2 of the second chip installation area territory and second pad 60 are overlapped and are formed pad 90.

When read-only memory element at packaging area 70 encapsulation one reduced size, the pin of read-only memory element is welded to the position in close chip installation area territory 80 in the pad 90, when the read-only memory element at packaging area 70 encapsulation one large-size, the pin of read-only memory element is welded in the pad 90 position away from chip installation area territory 80.

Because first packaging area 10 among Fig. 1 and second packaging area 40 all are used for encapsulating read-only memory element, after a kind of read-only memory element of size is installed in the packaging area, another packaging area can't be used, present embodiment is by forming a new packaging area 70 with above-mentioned two packaging area mutual superposition, the new packaging area 70 that forms both can be used for encapsulating the read-only memory element of a reduced size, also can be used for encapsulating the read-only memory element of a large-size.

Above-mentioned Wiring architecture of printed circuit board also can be applicable to the element of other functions on other circuit boards, if need to be provided with a plurality of packaging areas with the multiple provided as one homogeneous element of correspondence on the circuit board with identical function, and only need select in these packaging areas one in order to an element to be installed, can these packaging areas are overlapped and form a packaging area that can encapsulate a plurality of provided as one homogeneous element, to save the wiring space of circuit board.

Claims

1. printed circuit board (PCB), it comprises a packaging area, be provided with first pad that is used to encapsulate one first element, second pad and a chip installation area territory that is used to encapsulate one second element in the described packaging area, described first, second element is the provided as one homogeneous element with identical function, and be packaged in the described packaging area to select one mode, it is characterized in that: more described second pad of described first pad is away from described chip installation area territory.

2. printed circuit board wiring structure as claimed in claim 1 is characterized in that: described first pad and described second pad portion are overlapping.

3. printed circuit board wiring structure as claimed in claim 1 is characterized in that: described first, second pad is positioned at the periphery in described chip installation area territory.