CN218352813U - Pad structure of printed circuit board, printed circuit board and electronic equipment - Google Patents
Pad structure of printed circuit board, printed circuit board and electronic equipment Download PDFInfo
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- CN218352813U CN218352813U CN202222025524.9U CN202222025524U CN218352813U CN 218352813 U CN218352813 U CN 218352813U CN 202222025524 U CN202222025524 U CN 202222025524U CN 218352813 U CN218352813 U CN 218352813U
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Abstract
The application relates to the technical field of electronics, and provides a pad structure of a printed circuit board, the printed circuit board and electronic equipment, the pad structure of the printed circuit board provided by the embodiment of the application comprises a first pad group and a second pad group, and the first pad group and the second pad group are adjacently arranged or oppositely arranged; the first bonding pad group comprises first bonding pads and second bonding pads which are arranged at intervals, and the second bonding pad group comprises third bonding pads and fourth bonding pads which are arranged at intervals; the first pad group is used for installing a target component of a first packaging structure, the second pad group is used for installing a target component of a second packaging structure, and the target component of the first packaging structure and the target component of the second packaging structure have the same function. The pad structure that this application embodiment provided can compatible different encapsulation components and parts, avoids because the condition that needs redesign printed circuit board is not matchd with the components and parts encapsulation to the pad structure, practices thrift manufacturing cost.
Description
Technical Field
The utility model relates to the field of electronic technology, especially, relate to a printed circuit board's pad structure, printed circuit board and electronic equipment.
Background
When designing a Printed Circuit Board (PCB), pads of corresponding structures need to be disposed on the PCB for packaging structures of different components, so that the components of the packaging structures can be soldered to the pads to complete assembly. However, in the actual production process, due to factors such as material supply or cost consideration, the situation that components of similar types need to be used to replace the existing components may occur, so that the pad on the pre-designed printed circuit board is not matched with the packaging structure of the components used in the actual production, the printed circuit board needs to be redesigned and produced, and additional production cost is increased.
SUMMERY OF THE UTILITY MODEL
The application provides a printed circuit board's pad structure, printed circuit board and electronic equipment for solve the unmatched technical problem of pad structure and components and parts encapsulation.
The first aspect of the present application provides a pad structure of a printed circuit board, where the pad structure includes a first pad group and a second pad group, and the first pad group and the second pad group are adjacently or oppositely disposed;
the first bonding pad group comprises first bonding pads and second bonding pads which are arranged at intervals, and the second bonding pad group comprises third bonding pads and fourth bonding pads which are arranged at intervals;
the first pad group is used for installing a target component of a first packaging structure, the second pad group is used for installing a target component of a second packaging structure, and the target component of the first packaging structure and the target component of the second packaging structure have the same function.
A second aspect of the present application provides a printed circuit board, the circuit board comprising: a substrate, and the pad structure according to the first aspect, the pad structure being disposed on the substrate.
A third aspect of the application provides an electronic device comprising a printed circuit board according to the second aspect.
The pad structure of the printed circuit board, the printed circuit board and the electronic device provided by the embodiment of the application, wherein the pad structure of the printed circuit board comprises a first pad group and a second pad group, and the first pad group and the second pad group are adjacently arranged or oppositely arranged; the first bonding pad group comprises first bonding pads and second bonding pads which are arranged at intervals, and the second bonding pad group comprises third bonding pads and fourth bonding pads which are arranged at intervals; the first pad group is used for installing a target component of the first packaging structure, the second pad group is used for installing a target component of the second packaging structure, the target component of the first packaging structure and the target component of the second packaging structure have the same function, the pad structure of the target component which can be compatible with different packages improves the flexibility of using the components in the production process, avoids the situation that a printed circuit board needs to be redesigned due to component replacement, and reduces the production cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic diagram of a pad structure of a printed circuit board according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram illustrating a pad structure of a printed circuit board according to an embodiment of the present application;
fig. 3 is a schematic diagram illustrating a pad structure of a printed circuit board according to an embodiment of the present application;
fig. 4 is a schematic diagram illustrating a pad structure of a printed circuit board according to an embodiment of the present application;
fig. 5 is a schematic diagram illustrating a pad structure of a printed circuit board according to an embodiment of the present application;
FIG. 6 is a schematic diagram illustrating a pad structure of a printed circuit board according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram of a pad structure of a printed circuit board according to an embodiment of the present application.
Description of reference numerals: 101. a first pad; 102. a second pad; 201. a third pad; 202. a fourth pad; 301. a fifth pad; 302. and a sixth pad.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
The flow diagrams depicted in the figures are merely illustrative and do not necessarily include all of the elements and operations/steps, nor do they necessarily have to be performed in the order depicted. For example, some operations/steps may be decomposed, combined or partially combined, so that the actual execution sequence may be changed according to the actual situation.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
In some embodiments, a pad structure of a printed circuit board includes: the first pad group and the second pad group are adjacently arranged or oppositely arranged; the first bonding pad group comprises first bonding pads and second bonding pads which are arranged at intervals, and the second bonding pad group comprises third bonding pads and fourth bonding pads which are arranged at intervals; the first pad group is used for installing a target component of a first packaging structure, the second pad group is used for installing a target component of a second packaging structure, and the target component of the first packaging structure and the target component of the second packaging structure have the same function.
For example, due to parameter differences, there may be packages of different sizes for components with the same function, for example, 0805, 0603, 0402 and other packages of different sizes for chip components with different powers. In actual production, especially when the size of power consumption of components is not sensitive, the conditions such as component shortage of specific parameters can occur, components and parts packaged by other components need to replace originally planned components and parts, and the pad structure provided by the application can be compatible with components and parts packaged by different components and parts, thereby improving the flexibility of production and reducing the production cost.
For example, the pad structure may also include more pad groups, for example, the pad structure may also include a third pad group, which is also not limited thereto.
For example, the first pad group and the second pad group may be adjacently disposed on the same surface of the printed circuit board, or may be oppositely disposed on different surfaces of the printed circuit board, which is not limited herein.
In some embodiments, the first pad group and the second pad group are adjacently disposed on the same surface of the printed circuit board, and a space between the first pad and the second pad in the first pad group is larger than a size of the second pad group.
Illustratively, the first pad set may be, for example, a 0804 pad set, and the second pad set may be, for example, a 0603 pad set. Optionally, the pad structure may further include a third pad group, which may be, for example, an 0402 pad group.
Referring to fig. 1 to 3, fig. 1 to 3 are schematic diagrams illustrating a pad structure of a printed circuit board according to an embodiment of the present disclosure.
As shown in fig. 1, the first pad group includes a first pad 101 and a second pad 102, and the second pad group includes a third pad 201 and a fourth pad 202.
Illustratively, the pad structure may further include a third pad group, where the third pad group includes a fifth pad 301 and a sixth pad 302, but is not limited thereto, and the pad structure may also include more pad groups, which is not limited herein.
In some embodiments, as shown in fig. 1, the second pad group is disposed between the first and second pads of the first pad group.
For example, the pad structure can be used for mounting a target component of a first package structure, and can also be used for mounting a target component of a second package structure. Specifically, when the target component of the first packaging structure is in shortage, the pad structure can be compatible with the target component of the first packaging structure and the target component of the second packaging structure, so that the target component of the second packaging structure can be directly used for replacement, and a printed circuit board does not need to be manufactured again.
For example, a third pad group may be disposed between the third pad 201 and the fourth pad 202 of the second pad group, which is not limited herein.
In some embodiments, the first pad group and the second pad group have the same center of symmetry, as shown in fig. 1.
Illustratively, the second pad group is centrally located between the first pad 101 and the second pad 102 of the first pad group.
In some embodiments, as shown in fig. 2 and 3, one side of the first pad group is collinear with one side of the second pad group.
For example, the second pad group can be collinear with any side of the first pad group, for example, as shown in fig. 2, the second pad group can be collinear with the first side of the first pad group, or, as shown in fig. 3, the second pad group can be collinear with the second side of the first pad group, and is not limited herein.
Referring to fig. 4-6, fig. 4-6 are schematic diagrams illustrating a pad structure of a printed circuit board according to an embodiment of the present disclosure.
In some embodiments, as shown in fig. 4, the second pad group is disposed close to one side of the first pad group, and a length direction of the second pad group is parallel to a length direction of the first pad group.
For example, under the condition that the area of the printed circuit board is relatively sufficient, the second pad group may be disposed at one side of the first pad group, the second pad group is disposed close to the first pad group, and the length direction of the second pad group is parallel to the length direction of the first pad group.
For example, a third pad group may be disposed on one side of the first pad group in the same manner, and the third pad group and the second pad group may be disposed on the same side of the first pad group, or may be disposed on different sides of the first pad group, which is not limited herein.
In some embodiments, as shown in fig. 5, the third pad of the second pad group is disposed within the first pad of the first pad group, and the fourth pad of the second pad group is spaced apart from the third pad by a side away from the second pad of the second pad group.
Illustratively, one pad of the second pad group is arranged in one pad of the first pad group, for example, the third pad 201 is arranged in the first pad 101, and the fourth pad 202 is arranged on the side of the second pad group away from the second pad 102 at an interval with the first pad 101, so that the space occupied by the pad structure on the surface of the printed circuit board is saved.
For example, one pad of the third pad group may also be disposed in one pad of the first pad group in the same manner, which is not limited herein.
As shown in fig. 6, in some embodiments, the second pad group is disposed close to one side of the first pad group, and a length direction of the second pad group is perpendicular to a length direction of the first pad group.
For example, the third pad group may also be disposed in the same manner, where the third pad group and the second pad group may be disposed on the same side of the first pad group, or may be disposed on different sides of the first pad group, which is not limited herein.
Referring to fig. 7, fig. 7 is a schematic diagram of a pad structure of a printed circuit board according to an embodiment of the present disclosure.
In some embodiments, as shown in fig. 7, the first pad group and the second pad group are oppositely disposed on different surfaces of the printed circuit board, and the second pad group is located between the first pad and the second pad of the first pad group.
Illustratively, in fig. 7, the first pad 101 and the second pad 102 of the first pad group are disposed on a different surface of the printed circuit board than the third pad 201 and the fourth pad 202 of the second pad group. For example, the first pad 101 and the second pad 102 are disposed on a first surface of the printed circuit board, and the third pad 201 and the fourth pad 202 are disposed on a second surface of the printed circuit board.
Illustratively, the third pad group may also be provided in the same manner. For example, the third pad group is disposed on the second surface of the printed circuit board, which is not limited to this, and the third pad group may also be disposed on the first surface of the printed circuit board, which is not limited to this.
In some embodiments, the present application further provides a printed circuit board comprising: the bonding pad structure comprises a substrate and the bonding pad structure, wherein the bonding pad structure is arranged on the substrate.
For example, the printed circuit board may include one or more pad structures provided in the foregoing embodiments, and a plurality of pad structures may be provided according to actual requirements, for example, the plurality of pad structures may be provided in the same embodiment, or may be provided in different embodiments, and are not limited herein.
For example, the shape of the printed circuit board may be rectangular, or square, or trapezoid, or other regular shape, or other irregular shape; the shape of the printed circuit board is not limited herein.
The printed circuit board may be a single-sided board, or a double-sided board, or a multi-layered board, for example, and is not limited thereto.
For example, the printed circuit board may further include other components, such as a plurality of operation chips, which is not limited herein.
In some embodiments, the present application further provides an electronic device comprising a printed circuit board as described above.
For example, the electronic device may include one or more printed circuit boards as described above, but is not limited thereto.
For example, the electronic device may be a supercomputing device, and is certainly not limited thereto, and is not limited thereto.
It should be noted that the descriptions relating to "first", "second", etc. in this application are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting.
It should also be understood that the term "and/or" as used in this application and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The pad structure of the printed circuit board is characterized by comprising a first pad group and a second pad group, wherein the first pad group and the second pad group are adjacently arranged or oppositely arranged;
the first bonding pad group comprises first bonding pads and second bonding pads which are arranged at intervals, and the second bonding pad group comprises third bonding pads and fourth bonding pads which are arranged at intervals;
the first pad group is used for installing a target component of a first packaging structure, the second pad group is used for installing a target component of a second packaging structure, and the target component of the first packaging structure and the target component of the second packaging structure have the same function.
2. The pad structure of the printed circuit board according to claim 1, wherein the first pad set and the second pad set are adjacently disposed on the same surface of the printed circuit board, and a space between the first pad and the second pad in the first pad set is larger than a size of the second pad set.
3. The land structure of the printed circuit board according to claim 2, wherein the second land group is disposed between the first land and the second land of the first land group.
4. The pad structure of the printed circuit board according to claim 3, wherein the first pad group and the second pad group have the same symmetrical center; or
One side of the first pad group is collinear with one side of the second pad group.
5. The land structure of claim 2, wherein the second land group is disposed adjacent to one side of the first land group, and a length direction of the second land group is parallel to a length direction of the first land group.
6. The pad structure of the printed circuit board according to claim 2, wherein the third pad of the second pad group is disposed within the first pad of the first pad group, and the fourth pad of the second pad group is spaced apart from the third pad at a side away from the second pad of the second pad group.
7. The land structure of claim 2, wherein the second land group is disposed adjacent to one side of the first land group, and a length direction of the second land group is perpendicular to a length direction of the first land group.
8. The pad structure of the printed circuit board according to claim 1, wherein the first pad set and the second pad set are disposed opposite to each other on different surfaces of the printed circuit board, and the second pad set is located between the first pad and the second pad of the first pad set.
9. A printed circuit board, comprising: a substrate, and a pad structure according to any of claims 1-8, the pad structure being provided on the substrate.
10. An electronic device, characterized in that it comprises a printed circuit board according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222025524.9U CN218352813U (en) | 2022-08-02 | 2022-08-02 | Pad structure of printed circuit board, printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222025524.9U CN218352813U (en) | 2022-08-02 | 2022-08-02 | Pad structure of printed circuit board, printed circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218352813U true CN218352813U (en) | 2023-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222025524.9U Active CN218352813U (en) | 2022-08-02 | 2022-08-02 | Pad structure of printed circuit board, printed circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218352813U (en) |
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- 2022-08-02 CN CN202222025524.9U patent/CN218352813U/en active Active
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