CN103929876A - Printed circuit board (PCB) combination pad - Google Patents
Printed circuit board (PCB) combination pad Download PDFInfo
- Publication number
- CN103929876A CN103929876A CN201310010940.4A CN201310010940A CN103929876A CN 103929876 A CN103929876 A CN 103929876A CN 201310010940 A CN201310010940 A CN 201310010940A CN 103929876 A CN103929876 A CN 103929876A
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- pcb
- pad
- connecting part
- electric connecting
- via hole
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a printed circuit board (PCB) combination pad. A first kind of PCB combination pad comprises a pad and further comprises an electric connection part and a through hole. The electric connection part is respectively connected with the pad and the through hole, and the electric connection part, the pad and the through hole constitute a conductive integral body. A second kind of PCB combination pad comprises a PCB substrate. The PCB substrate is provided with a through hole. In a packaging design, another pad and the PCB pad are connected by use of an electric connection part to form a conductive integral body. A third kind of PCB combination pad comprises a pad and further comprises an electric connection part. The idle end of the electric connection part is taken as the position indication of a through hole during wiring to unify a wiring mode. By using the PCB combination pad provided by the invention, the functions of partial wiring connection or complete wiring connection can be finished on the pad, the defect of wiring quality control difficulty caused by the randomness of a lead wire and the through hole during manual wiring is avoided, and the PCB design efficiency and PCB wiring quality are improved.
Description
Technical field
The present invention relates to electronic device field, relate in particular to a kind of printed circuit board (Printed CircuitBoard, referred to as PCB) combination pad (Pad).
Background technology
Traditional device PCB (Printed Circuit Board, printed circuit board) encapsulates (Footprint), is according to the pad array of device manufacturer recommended size, realizes the reliable connection that device was welded on PCB device and pcb board when upper.
The essential element that forms encapsulation is pad.Pad is generally regular shape, and modal bond pad shapes is the shapes such as square, rectangle or circle.As shown in Fig. 1 (a), 1 pad that is PCB encapsulation, comprising: pad 11 and welding resistance (the soldermask opening) 12 that window.Wherein, the material of pad 11 adds electro-coppering for adding the base copper in man-hour at PCB, and then covering surfaces is processed coating; The region that welding resistance is windowed outside 12 is covered by solder resist material, is commonly called as green oil.It is 12 as broad as long with traditional pad that welding resistance is windowed, and follow-uply no longer mentions.Fig. 1 (b) is the sectional view of this pad on PCB, and wherein 3 is PCB substrates.
The PCB encapsulation of device refers to the array of pad.The chip device of take with two pins is example, and encapsulation as shown in Figure 2, is comprised of two pads 1.
Traditional packaged type is only given device assembling or the function of welding and the corresponding relation of encapsulation welding tray and device principle schematic symbol pin.
Summary of the invention
The object of this invention is to provide a kind of PCB combination pad, to overcome existing packaged type, only there is the defect of the installation function of device.
For addressing the above problem, the invention provides a kind of printed circuit board (PCB) combination pad, comprise pad, also comprise:
Electric connecting part and via hole; Wherein, described electric connecting part is connected with described via hole with described pad respectively, and described electric connecting part, described pad and described via hole form a conductivity integral.
Further,
Described electric connecting part is copper cash or copper sheet.
Further,
A described combination pad forms the PCB encapsulation of device.
Further,
Plural described combination pad is arranged in any way, forms the PCB encapsulation of device.
Further,
Described pad and described via hole are associated with the same pin of device symbolic library in PCB design software.
The present invention also provides a kind of printed circuit board (PCB) combination pad, comprises PCB substrate;
Described PCB substrate is provided with via hole; In package design, another pad is connected with electric connecting part with described PCB substrate, forms a conductivity integral.
Further,
Described electric connecting part is copper cash or copper sheet.
Further,
In the schematic library symbol of PCB design software, there is one corresponding to the pin of described via hole.
The present invention also provides a kind of printed circuit board (PCB) combination pad, comprises pad; Also comprise:
Electric connecting part, when the free time of described electric connecting part holds as wiring, wire laying mode is indicated to unify in the position of via hole.
Further,
Described electric connecting part is copper cash or copper sheet.
Adopt after the present invention, can on pad, complete the function that part wiring connects or all wiring connects, designer lead-in wire and add the randomness of via hole and the defect that causes wiring difficult quality to control while having avoided manual routing, has improved efficiency and the PCB layout quality of PCB design.
Accompanying drawing explanation
Fig. 1 (a) and Fig. 1 (b) are respectively existing PCB pad schematic diagram and cross sectional representation;
Fig. 2 is existing PCB encapsulation schematic diagram;
Fig. 3 (a) and Fig. 3 (b) are respectively floor map and the schematic perspective view of PCB pad in the embodiment of the present invention;
Fig. 4 (a) and Fig. 4 (b) are respectively floor map and the schematic perspective view of PCB encapsulation in the embodiment of the present invention;
Fig. 5 is decoupling capacitor encapsulation schematic diagram in the embodiment of the present invention;
Fig. 6 is another kind of PCB pad structure figure in the embodiment of the present invention.
Embodiment
Hereinafter in connection with accompanying drawing, embodiments of the invention are elaborated.It should be noted that, in the situation that not conflicting, the embodiment in the application and the feature in embodiment be combination in any mutually.
As shown in Fig. 3 (a), in PCB combination pad 6 in the present embodiment, except comprising traditional PCB pad 61, also comprise and realize electric connecting part (as copper cash (trace) or copper sheet (shape)) 64 and the via hole (via) 65 being electrically connected to.61,64,65 form a conductivity integral, the 3-D view as shown in Fig. 3 (b).This combination pad can be corresponding to a pin of device principle schematic symbol.
EDA (Electronic Design Automation, electric design automation) software only allows a corresponding pad of pin or a combination pad in device principle picture library symbol.Therefore pad 61 and via hole 65 can be associated with simultaneously to the same pin of device symbolic library.Can also be by increase a virtual pin in device principle Symbol Database, pad 61 and the via hole 65 in corresponding diagram 3 (a), connects 61 and 65 with electric connecting part respectively.
In addition, can also upgrade to eda software, eda software after upgrading allows the corresponding a plurality of pads of pin in device principle picture library symbol, i.e. pin pad 61 and via hole 65 in corresponding diagram 3 (a) simultaneously.
The chip device of two pins of take is example, and as shown in Fig. 4 (a), the PCB of device encapsulation is by adopting two combination pads 6 and 6 ' of said structure to form.6 and 6 ' in this example, be mirror to relation.The combination number of pads of using in actual design can change with relative position relationship, and quantity can be more than one or 2, and when using more than 2 pad, the position of each pad can be consistent relation or arbitrarily angled.It should be noted that, the PCB encapsulation of this device can be called by PCB design software as traditional PCB encapsulation.
When above-mentioned PCB is encapsulated in while applying in board design, can improve wiring efficiency and cloth line mass.As shown in Figure 5, suppose this encapsulation as POWER (power supply) and GND () the decoupling capacitor encapsulation of network, two pads of decoupling capacitor are connected respectively to POWER and GND network.In multi-layer PCB board, the POWER plane 31 and the GND plane 32 that conventionally have decoupling capacitor to connect.When above-mentioned PCB encapsulation is placed in PCB POWER and GND network plane region, PCB design software can be connected to the via hole 65 in the PCB encapsulation of decoupling capacitor in the plane that GND network is corresponding automatically, and 65 use of the via hole with plane consolidated network are spent to pads 33 or are entirely connected to plane 32; When pad network is different from plane, PCB design software can be from the isolation of employing base material circle or anti-pad (anti-pad) 34 and realize via hole in PCB encapsulation 65 and plane 32.In this example, the encapsulation of decoupling capacitor is exactly a kind of decoupling capacitor encapsulation of exempting from wiring in fact, thereby greatly improves wiring efficiency.Certainly, above-mentioned PCB encapsulation is not limited only to decoupling capacitor, to other devices, also can adopt.
While stating in design PCB encapsulation, can, by choosing of electric connecting part shape and size being reached to the effect that promotes signal quality, by via hole is reached to the effect of assurance signal or power quality apart from the design of the distance of pad, thereby guarantee cloth line mass.
In another embodiment of the present invention, a kind of PCB combination pad, comprises PCB substrate;
This PCB substrate is provided with via hole; In package design, another pad is connected with electric connecting part with this PCB substrate, forms a conductivity integral.Wherein, electric connecting part can be copper cash or copper sheet.
In another embodiment of the present invention, as shown in Figure 6, can only on PCB pad 61, set up electric connecting part 64, these parts indicate to unify wire laying mode as the position of when wiring via hole, save the bracing wire time.The unified starting point of bracing wire when these parts also can be used as wiring.
One of ordinary skill in the art will appreciate that all or part of step in said method can come instruction related hardware to complete by program, described program can be stored in computer-readable recording medium, as read-only memory, disk or CD etc.Alternatively, all or part of step of above-described embodiment also can realize with one or more integrated circuits.Correspondingly, each the module/unit in above-described embodiment can adopt the form of hardware to realize, and also can adopt the form of software function module to realize.The present invention is not restricted to the combination of the hardware and software of any particular form.
The foregoing is only the preferred embodiments of the present invention, be not intended to limit protection scope of the present invention.According to summary of the invention of the present invention; also can there be other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art are when making according to the present invention various corresponding changes and distortion; within the spirit and principles in the present invention all; any modification of doing, be equal to replacement, improvement etc., within protection scope of the present invention all should be included in.
Claims (10)
1. printed circuit board (PCB) combination pad, comprises pad, also comprises:
Electric connecting part and via hole; Wherein, described electric connecting part is connected with described via hole with described pad respectively, and described electric connecting part, described pad and described via hole form a conductivity integral.
2. PCB as claimed in claim 1 combines pad, it is characterized in that:
Described electric connecting part is copper cash or copper sheet.
3. PCB as claimed in claim 1 combines pad, it is characterized in that:
A described combination pad forms the PCB encapsulation of device.
4. PCB as claimed in claim 1 combines pad, it is characterized in that:
Plural described combination pad is arranged in any way, forms the PCB encapsulation of device.
5. PCB as claimed in claim 1 combines pad, it is characterized in that:
Described pad and described via hole are associated with the same pin of device symbolic library in PCB design software.
6. printed circuit board (PCB) combination pad, comprises PCB substrate;
Described PCB substrate is provided with via hole; In package design, another pad is connected with electric connecting part with described PCB substrate, forms a conductivity integral.
7. PCB as claimed in claim 6 combines pad, it is characterized in that:
Described electric connecting part is copper cash or copper sheet.
8. PCB as claimed in claim 6 combines pad, it is characterized in that:
In the schematic library symbol of PCB design software, there is one corresponding to the pin of described via hole.
9. printed circuit board (PCB) combination pad, comprises pad; Also comprise:
Electric connecting part, when the free time of described electric connecting part holds as wiring, wire laying mode is indicated to unify in the position of via hole.
10. PCB as claimed in claim 9 combines pad, it is characterized in that:
Described electric connecting part is copper cash or copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310010940.4A CN103929876A (en) | 2013-01-11 | 2013-01-11 | Printed circuit board (PCB) combination pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310010940.4A CN103929876A (en) | 2013-01-11 | 2013-01-11 | Printed circuit board (PCB) combination pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103929876A true CN103929876A (en) | 2014-07-16 |
Family
ID=51147904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310010940.4A Pending CN103929876A (en) | 2013-01-11 | 2013-01-11 | Printed circuit board (PCB) combination pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103929876A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887850A (en) * | 2019-02-18 | 2019-06-14 | 长江存储科技有限责任公司 | A kind of method and device, equipment and the storage medium of 3D encapsulation multi-point welding |
| CN110730557A (en) * | 2019-09-05 | 2020-01-24 | 光为科技(广州)有限公司 | High-speed flexible circuit board, optical assembly and optical module |
| CN110740589A (en) * | 2019-09-29 | 2020-01-31 | 苏州浪潮智能科技有限公司 | Design method, device and medium for multi-layer PCB |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040070956A1 (en) * | 2002-10-11 | 2004-04-15 | International Business Machines Corporation | Method and apparatus for providing improved loop inductance of decoupling capacitors |
| CN1842248A (en) * | 2005-01-25 | 2006-10-04 | 阿尔卡特公司 | Off-grid decoupling device and method of ball grid array (BGA) |
| CN101932192A (en) * | 2009-06-18 | 2010-12-29 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN102724807A (en) * | 2012-06-08 | 2012-10-10 | 加弘科技咨询(上海)有限公司 | Printed circuit board |
-
2013
- 2013-01-11 CN CN201310010940.4A patent/CN103929876A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040070956A1 (en) * | 2002-10-11 | 2004-04-15 | International Business Machines Corporation | Method and apparatus for providing improved loop inductance of decoupling capacitors |
| CN1842248A (en) * | 2005-01-25 | 2006-10-04 | 阿尔卡特公司 | Off-grid decoupling device and method of ball grid array (BGA) |
| CN101932192A (en) * | 2009-06-18 | 2010-12-29 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN102724807A (en) * | 2012-06-08 | 2012-10-10 | 加弘科技咨询(上海)有限公司 | Printed circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887850A (en) * | 2019-02-18 | 2019-06-14 | 长江存储科技有限责任公司 | A kind of method and device, equipment and the storage medium of 3D encapsulation multi-point welding |
| CN109887850B (en) * | 2019-02-18 | 2021-10-01 | 长江存储科技有限责任公司 | Method, device, equipment and storage medium for 3D packaging multi-point welding |
| CN110730557A (en) * | 2019-09-05 | 2020-01-24 | 光为科技(广州)有限公司 | High-speed flexible circuit board, optical assembly and optical module |
| CN110740589A (en) * | 2019-09-29 | 2020-01-31 | 苏州浪潮智能科技有限公司 | Design method, device and medium for multi-layer PCB |
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Application publication date: 20140716 |
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