CN109887850B - Method, device, equipment and storage medium for 3D packaging multi-point welding - Google Patents
Method, device, equipment and storage medium for 3D packaging multi-point welding Download PDFInfo
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- CN109887850B CN109887850B CN201910120689.4A CN201910120689A CN109887850B CN 109887850 B CN109887850 B CN 109887850B CN 201910120689 A CN201910120689 A CN 201910120689A CN 109887850 B CN109887850 B CN 109887850B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4941—Connecting portions the connecting portions being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The embodiment of the application discloses a method, a device, equipment and a storage medium for 3D packaging multi-point welding. The method comprises the steps of determining M connecting wires which need to be connected with each other in the 3D packaging; welding the M connecting wires on the same combined bonding pad which is mutually communicated to form N welding points; wherein M and N are positive integers more than or equal to 2, and N is less than or equal to M. Many wiring that weld together are grouped in the disclosed 3D encapsulation of this application embodiment, weld respectively on different welding points to effectively promoted welded reliability, prevented that the rosin joint from droing.
Description
Technical Field
The embodiment of the application relates to the semiconductor manufacturing technology, in particular to a method, a device, equipment and a storage medium for 3D packaging multi-spot welding.
Background
In the field of semiconductor manufacturing, 3D packaging is a multilayer stacked form, and usually a plurality of wires need to be welded on a pad in a stacked form, and this method has a high process difficulty, is prone to stress deformation, has poor mechanical strength, is prone to insufficient soldering or dropping, and has poor reliability, thereby causing a decrease in yield.
Disclosure of Invention
In view of the above, embodiments of the present application provide a method and apparatus for 3D package multi-spot welding, a device and a storage medium to solve at least one problem in the prior art.
The technical scheme of the embodiment of the application is realized as follows:
the embodiment of the application provides a method for 3D packaging multi-point welding, which comprises the following steps:
determining M connecting wires which need to be connected with each other in the 3D packaging;
welding the M connecting wires on the same combined bonding pad which is mutually communicated to form N welding points; wherein M and N are positive integers more than or equal to 2, and N is less than or equal to M.
The embodiment of the present application further provides a device for 3D encapsulation multipoint welding, the device includes:
a determining unit configured to determine M wirings required to be connected to each other in the 3D package;
the welding unit is configured to weld the M connecting wires on the same combined welding disc which is communicated with each other to form N welding points; wherein M and N are positive integers more than or equal to 2, and N is less than or equal to M.
The embodiment of the present application further provides a device for 3D package multi-spot welding, which includes: the device comprises a memory, a processor and an operating component, and a computer program stored on the memory and capable of running on the processor, wherein the processor controls the operating component to realize the 3D packaging multi-spot welding method when executing the program.
Embodiments of the present application also provide a computer-readable storage medium having computer-executable instructions stored therein, the computer-executable instructions being configured to perform the method for 3D package multi-spot welding.
In this application embodiment, need many wiring of welding together to divide into groups in the 3D encapsulation, weld respectively on different welding points, effectively promoted welded reliability, prevent that the rosin joint from droing.
Drawings
FIG. 1A is a schematic view of a soldering principle of a 3D package;
FIG. 1B is a scanning electron microscope image of a plurality of wires soldered to a pad;
fig. 2 is a schematic flow chart of a 3D package multi-spot welding method according to an embodiment of the present disclosure;
FIG. 3A is a schematic view of a composite pad structure according to an embodiment of the present disclosure;
FIG. 3B is a schematic view of another exemplary combination pad structure according to the present disclosure;
FIG. 4A is a schematic view of a welding principle in one aspect of an embodiment of the present application;
FIG. 4B is a schematic view of another aspect of the exemplary embodiment of the present application;
FIG. 4C is a schematic view of a welding principle in yet another aspect of an embodiment of the present application;
fig. 5 is a schematic structural diagram illustrating a 3D package multi-spot welding apparatus according to an embodiment of the present disclosure;
fig. 6 is a schematic physical diagram of an apparatus for 3D package multi-spot welding according to an embodiment of the present disclosure.
Detailed Description
The technical solution of the present application is further elaborated below with reference to the drawings and the embodiments.
In the related art, more than 3 wires are usually bonded to one pad, as shown in fig. 1A, in a 3D stacked chip, there is usually a need to bond a plurality of wires 11 to one pad 10. Fig. 1B is a scanning electron microscope image of 3 wires soldered to one pad, and 3 wires 11 are stacked and soldered to the pad 10 as shown in fig. 1B. The wiring in this situation needs to be bent towards different directions, the welding spot is easy to deform, the mechanical strength is poor, and cold joint and even falling are easy to occur.
The embodiment of the present application provides a method for 3D package multi-spot welding, and fig. 2 is a schematic view of an implementation flow of the method for 3D package multi-spot welding according to the embodiment of the present application, and as shown in fig. 2, the method includes:
s101, determining M connecting wires which need to be connected with each other in 3D packaging;
s102, welding the M connecting wires on the same combined bonding pad which is mutually communicated to form N welding points; wherein M and N are positive integers more than or equal to 2, and N is less than or equal to M.
When M connection wires need to be connected with the same pin, in the related art, the M connection wires are welded on the same pad to form a welding point. Here, M wires are separately soldered to different solder points and connected together by a composite pad. Therefore, the phenomenon that all M connecting wires are welded on the same welding point of the same bonding pad and are easy to fall off is avoided, and the welding reliability is improved.
In other embodiments, the combination pad includes P pads; p is an integer of 1 or more.
Here, the M bonding wires are bonded to a single build-up pad, which may be a plurality of pads connected to each other, or a pad having a large area, for example, a rectangular pad. On the composite pad, at least two bonding pads can be formed.
The embodiment of the application provides another 3D packaging multi-spot welding method, which comprises the following steps:
step S201, determining M connecting wires which need to be connected with each other in 3D packaging;
s202, welding the M connecting wires on the same combined bonding pad which is mutually communicated to form N welding points; wherein M and N are positive integers more than or equal to 2, and N is less than or equal to M.
The combined bonding pad comprises P bonding pads, and P is more than or equal to 2; the P pads are communicated through a conductive material; wherein, each bonding pad can be respectively provided with at least one welding point; as shown in fig. 3A, the pad 21 and the pad 22 are connected by a conductive material to form a combined pad, and one bonding pad 30 can be formed on each of the pad 21 and the pad 22.
Here, the composite pad is composed of at least two pads that are communicated by the conductive material. The M connecting wires are respectively welded on different welding pads, N welding points are formed by the M connecting wires, and therefore the process difficulty is reduced, and the yield and the reliability are improved.
The embodiment of the application provides another 3D packaging multi-spot welding method, which comprises the following steps:
s301, determining M connecting wires which need to be connected with each other in the 3D packaging;
step S302, dividing the M connecting wires into P groups, and respectively corresponding to the P bonding pads;
step S303, welding each group of connecting wires on corresponding bonding pads respectively, forming at least one welding point on each bonding pad, and welding the M connecting wires on the combined bonding pad to form N welding points; the number of the connecting wires on each welding point is less than or equal to 3; wherein M and N are positive integers more than or equal to 2, and N is less than or equal to M.
The combined bonding pad comprises P bonding pads, and P is more than or equal to 2; the P pads are communicated through a conductive material; wherein, at least one welding point can be respectively formed on each welding pad.
Here, each bonding pad comprises at least one welding point, each group of wires is respectively welded on each bonding pad to form N welding points, and the number of the wires on each welding point is less than or equal to 3. Like this, can carry out nimble setting according to the actual demand, all weld less wiring on every welding point, guarantee yields and reliability.
In other embodiments, the difference in the number of said connections per group is less than 2.
Here, the principle of even distribution is adopted, and the number of wires bonded to each bonding point is the same as or different from the number of wires bonded to other bonding points by 1.
The embodiment of the application provides another 3D packaging multi-spot welding method, which comprises the following steps:
s401, determining M connecting wires which need to be connected with each other in 3D packaging;
s402, welding the M connecting wires on the same combined bonding pad which is mutually communicated to form N welding points; wherein M and N are positive integers more than or equal to 2, and N is less than or equal to M.
The combination pad includes P pads, where P equals 1. At least two welding points can be formed on the bonding pad, the area of the welding points is large enough, the welding points can be rectangular bonding pads, and square bonding pads or circular bonding pads with large areas can also be formed. As shown in fig. 3B, two bonding pads 30 can be formed on the rectangular bonding pad 23.
Here, the through-composite pad includes a pad on which at least two bonding pads can be accommodated. In practical applications, a rectangular pad design may be used. The M connecting wires are respectively welded on the welding points, the process is simple, the reliability is high, and the yield can be effectively improved.
The embodiment of the application provides another 3D packaging multi-spot welding method, which comprises the following steps:
s501, determining M connecting wires which need to be connected with each other in 3D packaging;
step S502, dividing M connecting wires into N groups, wherein the number of each group of connecting wires is less than or equal to 3;
step S503, welding the same group of connecting wires on a welding point, so that the M connecting wires are welded on the combined welding pad to form N welding points; wherein M and N are positive integers more than or equal to 2, and N is less than or equal to M.
The combination pad includes P pads, where P equals 1. At least two bonding pads can be formed on the bonding pad.
Here, the through-composite pad includes a pad on which at least two bonding pads can be accommodated. In practical applications, a rectangular pad design may be used. Weld M wiring respectively on a plurality of welding points, guarantee on each welding point that the quantity of wiring is not more than 3 to effectively improve the yields.
In other embodiments, the difference in the number of said connections per group is less than 2.
Here, the principle of even distribution is adopted, and the number of wires bonded to each bonding point is the same as or different from the number of wires bonded to other bonding points by 1.
The embodiment of the application provides a method for 3D packaging multi-point welding, which comprises the following steps:
the dummy pads are added or the shapes and the sizes of the pads are changed, and the condition that at least two wires correspond to the same pad is decomposed into the condition that the wires correspond to different pads.
At least two bonding pads are arranged and are communicated with each other through a conductive material, and when at least two connecting wires need to be connected, the at least two connecting wires are respectively welded on the at least two bonding pads.
In other embodiments, when at least two wires correspond to the same pad, the corresponding pad is configured to be rectangular, the at least two wires are respectively soldered to the rectangular pad, and at least two soldering points are formed.
In one embodiment, as shown in fig. 4A, the wiring 11, the wiring 12, and the wiring 13 correspond to the same pad 10. Arranging two mutually communicated bonding pads which are respectively a bonding pad 21 and a bonding pad 22, and welding the wiring 11 and the wiring 12 on the bonding pad 21; the wiring 13 is soldered to the pad 22.
In another embodiment, as shown in fig. 4B, the wiring 11, the wiring 12, the wiring 13, and the wiring 14 correspond to the same pad 10. Arranging two mutually communicated bonding pads, namely a bonding pad 21 and a bonding pad 22, and welding the wiring 11 and the wiring 12 on the bonding pad 21; the wirings 13 and 14 are soldered on the pads 22.
In yet another embodiment, as shown in fig. 4C, there are a large number of wires, for example, ten wires need to be soldered to the pad 10, in this case, a rectangular pad 31 and a rectangular pad 32 are provided, 5 wires are soldered to the pad 31, and two soldering points are formed, the soldering point 311 is used for connecting 3 wires, and the soldering point 312 is used for connecting 2 wires; welding the other 5 connecting wires on the bonding pad 32 to form two welding points, wherein the welding point 321 is used for connecting 2 connecting wires, and the welding point 322 is used for connecting 3 connecting wires; then, the bonding pad 312 and the bonding pad 321 are connected by a wire.
Based on the foregoing embodiments, the present application provides a device for 3D package multi-spot welding, as shown in fig. 5, the device 500 includes a determining component 501 and a welding component 502, wherein:
a determining part 501 configured to determine M wirings required to be connected to each other in the 3D package;
a welding part 502 configured to weld the M bonding wires on the same combined bonding pad communicated with each other, forming N welding points; wherein M and N are positive integers more than or equal to 2, and N is less than or equal to M.
The above description of the apparatus embodiments, similar to the above description of the method embodiments, has similar beneficial effects as the method embodiments. For technical details not disclosed in the embodiments of the apparatus of the present application, reference is made to the description of the embodiments of the method of the present application for understanding.
It should be noted that, in the embodiment of the present application, if the method for 3D package multi-spot welding is implemented in the form of a software functional module and is sold or used as a stand-alone product, it may also be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a 3D package multi-spot welding apparatus to perform all or part of the methods according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read Only Memory (ROM), a magnetic disk, or an optical disk. Thus, embodiments of the present application are not limited to any specific combination of hardware and software.
Correspondingly, the embodiment of the present application provides a 3D package multi-spot welding device, which includes a memory, a processor, and an operating component, and a computer program stored in the memory and executable on the processor, wherein the processor controls the operating component to implement the steps in the 3D package multi-spot welding method provided in the above embodiment when executing the program. The operation member may include a determination member, a welding member, and the like in the above-described apparatus.
Correspondingly, the present application provides a computer-readable storage medium, on which a computer program is stored, wherein the computer program is executed by a processor to implement the steps in the 3D package multi-spot welding method provided in the above embodiments.
Here, it should be noted that: the above description of the storage medium and device embodiments is similar to the description of the method embodiments above, with similar advantageous effects as the method embodiments. For technical details not disclosed in the embodiments of the storage medium and apparatus of the present application, reference is made to the description of the embodiments of the method of the present application for understanding.
It should be noted that fig. 6 is a schematic hardware entity diagram of an apparatus for 3D package multi-spot welding according to an embodiment of the present application, and as shown in fig. 6, the hardware entity of the apparatus 600 includes: memory 601, processor 602, communication interface 603, and operational components 604, wherein:
the processor 602 generally controls the overall operation of the device 600.
The communication interface 603 enables the apparatus 600 to communicate with other terminals or servers via a network.
The operation part 604 may include a determination part and a welding part, etc. in the above-described apparatus for performing actual operation steps.
The Memory 601 is configured to store instructions and applications executable by the processor 602, and may also buffer data (e.g., image data, audio data, voice communication data, and video communication data) to be processed or already processed by the processor 602 and modules in the operating section 604, and may be implemented by a FLASH Memory (FLASH) or a Random Access Memory (RAM).
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units; can be located in one place or distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, all functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may be separately regarded as one unit, or two or more units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
Those of ordinary skill in the art will understand that: all or part of the steps for realizing the method embodiments can be completed by hardware related to program instructions, the program can be stored in a computer readable storage medium, and the program executes the steps comprising the method embodiments when executed; and the aforementioned storage medium includes: various media that can store program codes, such as a removable Memory device, a Read Only Memory (ROM), a magnetic disk, or an optical disk.
Alternatively, the integrated units described above in the present application may be stored in a computer-readable storage medium if they are implemented in the form of software functional modules and sold or used as independent products. Based on such understanding, the technical solutions of the embodiments of the present application may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a 3D package multi-spot welding apparatus to perform all or part of the methods according to the embodiments of the present application. And the aforementioned storage medium includes: a removable storage device, a ROM, a magnetic or optical disk, or other various media that can store program code.
The above description is only for the embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (6)
1. A method of 3D package multi-spot welding, the method comprising:
determining M connecting wires which are required to be connected with each other in different layers of stacked structures in a 3D packaged multi-layer stacked structure;
welding the M connecting wires on the same combined welding pad which is mutually communicated to form N welding points so as to prevent the M connecting wires from generating stress deformation when being welded on the same welding point; wherein M is a positive integer greater than or equal to 4; n is a positive integer greater than or equal to 2, and is less than or equal to M;
the combination bonding pad comprises P bonding pads; p is an integer greater than or equal to 2;
the P bonding pads are directly communicated through a connecting wire; wherein, at least one welding point is respectively formed on each welding pad.
2. The method of claim 1, wherein said step of bonding said M wires to the same interconnected bond pads to form N bonding pads comprises:
dividing the M connecting wires into P groups, and respectively corresponding to the P bonding pads;
and respectively welding each group of connecting wires on the corresponding bonding pads, forming at least one welding point on each bonding pad, and welding the M connecting wires on the combined bonding pad to form N welding points.
3. The method of claim 2, wherein the difference in the number of wires per group is less than 2.
4. An apparatus for 3D package multi-spot welding, the apparatus comprising:
a determining component configured to determine M wirings which are required to be connected with each other in different layers of stacked structures of the 3D package;
the welding component is configured to weld the M connecting wires on the same combined welding disc which is mutually communicated to form N welding points so as to prevent the M connecting wires from generating stress deformation when being welded on the same welding point; wherein M is a positive integer greater than or equal to 4; n is a positive integer greater than or equal to 2, and is less than or equal to M;
the combination bonding pad comprises P bonding pads; p is an integer greater than or equal to 2;
the P bonding pads are directly communicated through a connecting wire; wherein, at least one welding point is respectively formed on each welding pad.
5. An apparatus for 3D encapsulation multi-spot welding, the apparatus comprising: memory, a processor and operating means, a computer program stored on the memory and executable on the processor, the processor controlling the operating means to implement the method as provided by any of the preceding claims 1 to 3 when executing the program.
6. A computer-readable storage medium having computer-executable instructions stored thereon, the computer-executable instructions configured to perform the method provided by any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910120689.4A CN109887850B (en) | 2019-02-18 | 2019-02-18 | Method, device, equipment and storage medium for 3D packaging multi-point welding |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910120689.4A CN109887850B (en) | 2019-02-18 | 2019-02-18 | Method, device, equipment and storage medium for 3D packaging multi-point welding |
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| Publication Number | Publication Date |
|---|---|
| CN109887850A CN109887850A (en) | 2019-06-14 |
| CN109887850B true CN109887850B (en) | 2021-10-01 |
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| CN201910120689.4A Active CN109887850B (en) | 2019-02-18 | 2019-02-18 | Method, device, equipment and storage medium for 3D packaging multi-point welding |
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| US8963312B2 (en) * | 2010-05-11 | 2015-02-24 | Xintec, Inc. | Stacked chip package and method for forming the same |
| KR101963314B1 (en) * | 2012-07-09 | 2019-03-28 | 삼성전자 주식회사 | Semiconductor package and method for fabricating the same |
| US9627367B2 (en) * | 2014-11-21 | 2017-04-18 | Micron Technology, Inc. | Memory devices with controllers under memory packages and associated systems and methods |
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| CN1802742A (en) * | 2003-06-09 | 2006-07-12 | 飞思卡尔半导体公司 | Semiconductor package having optimized wire bond positioning |
| CN201655790U (en) * | 2010-04-17 | 2010-11-24 | 四川大雁微电子有限公司 | Copper-aluminum wire hybrid-bonded semiconductor chip package |
| CN103929876A (en) * | 2013-01-11 | 2014-07-16 | 中兴通讯股份有限公司 | Printed circuit board (PCB) combination pad |
| US9209144B1 (en) * | 2014-09-29 | 2015-12-08 | Freescale Semiconductor, Inc. | Substrate with electrically isolated bond pads |
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