CN109887850A - A kind of method and device, equipment and the storage medium of 3D encapsulation multi-point welding - Google Patents
A kind of method and device, equipment and the storage medium of 3D encapsulation multi-point welding Download PDFInfo
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- CN109887850A CN109887850A CN201910120689.4A CN201910120689A CN109887850A CN 109887850 A CN109887850 A CN 109887850A CN 201910120689 A CN201910120689 A CN 201910120689A CN 109887850 A CN109887850 A CN 109887850A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4941—Connecting portions the connecting portions being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The embodiment of the present application discloses method and device, equipment and the storage medium of a kind of 3D encapsulation multi-point welding.This method includes determining in 3D encapsulation to need M wiring interconnected；The M wiring is welded on interconnected same combination pad, forms N number of pad；Wherein, M and N is the positive integer more than or equal to 2, and N is less than or equal to M.The a plurality of wiring welded together is grouped in the encapsulation of 3D disclosed in the embodiment of the present application, is respectively welded on different pads, to effectively improve the reliability of welding, prevents rosin joint from falling off.
Description
Technical field
The invention relates to semiconductor processing technology, relate to, but are not limited to a kind of 3D encapsulation multi-point welding method and
Device, equipment and storage medium.
Background technique
In field of semiconductor manufacture, 3D is encapsulated as the stacking form of multilayer, it usually needs the shape by a plurality of wiring to accumulate
Formula is welded on a pad, and the technology difficulty of this mode is larger, is easy to produce stress deformation, bad mechanical strength, is easy
There is a situation where rosin joint or fall off, poor reliability, so as to cause the decline of yields.
Summary of the invention
In view of this, the embodiment of the present application be solves the problems, such as it is existing in the prior art at least one and a kind of 3D is provided and is sealed
Fill method and device, equipment and the storage medium of multi-point welding.
The technical solution of the embodiment of the present application is achieved in that
The embodiment of the present application provides a kind of method of 3D encapsulation multi-point welding, this method comprises:
It determines in 3D encapsulation and needs M wiring interconnected；
The M wiring is welded on interconnected same combination pad, forms N number of pad；Wherein, M and N are
Positive integer more than or equal to 2, N are less than or equal to M.
The embodiment of the present application also provides a kind of device of 3D encapsulation multi-point welding, which includes:
Determination unit is configured to determine that 3D needs M wiring interconnected in encapsulating；
Welding unit is configured to for the M wiring being welded on interconnected same combination pad, forms N number of weldering
Contact；Wherein, M and N is the positive integer more than or equal to 2, and N is less than or equal to M.
The embodiment of the present application also provides a kind of 3D equipment of encapsulation multi-point welding, the equipment include: memory, processor and
Operating member, stores the computer program that can be run on a memory and on a processor, and the processor executes described program
When control the method that the operating member realizes above-mentioned 3D encapsulation multi-point welding.
The embodiment of the present application also provides a kind of computer readable storage medium, is stored in the computer readable storage medium
Computer executable instructions, the computer executable instructions are configured to the method for executing above-mentioned 3D encapsulation multi-point welding.
In the embodiment of the present application, a plurality of wiring for needing to weld together in 3D encapsulation is grouped, and is respectively welded at not
On same pad, the reliability of welding is effectively improved, prevents rosin joint from falling off.
Detailed description of the invention
Figure 1A is the Fundamentals of Welding schematic diagram of 3D encapsulation；
Figure 1B is the scanning electron microscope image being welded on a plurality of wiring on one pad；
Fig. 2 is the method implementation process schematic diagram that a kind of 3D provided by the embodiments of the present application encapsulates multi-point welding；
Fig. 3 A is a kind of composed structure schematic diagram of the combination pad of the embodiment of the present application；
Fig. 3 B is another composed structure schematic diagram of the combination pad of the embodiment of the present application；
Fig. 4 A is a kind of Fundamentals of Welding schematic diagram of situation of the embodiment of the present application；
Fig. 4 B is the Fundamentals of Welding schematic diagram of another situation of the embodiment of the present application；
Fig. 4 C is the Fundamentals of Welding schematic diagram of another situation of the embodiment of the present application；
Fig. 5 is the composed structure schematic diagram that a kind of 3D of the embodiment of the present application encapsulates the device of multi-point welding；
Fig. 6 is the entity schematic diagram that a kind of 3D of the embodiment of the present application encapsulates the equipment of multi-point welding.
Specific embodiment
The technical solution of the application is further elaborated on reference to the accompanying drawings and examples.
Usually 3 or more wiring are welded on a pad in the related technology, as shown in Figure 1A, 3D stacked structure
Chip, it will usually there is the demand by a plurality of wiring welding 11 on a pad 10.Figure 1B is that 3 wiring are welded on a weldering
Scanning electron microscope image on disk, as shown in Figure 1B, 3 stackings of wiring 11 are welded on pad 10.Such case wiring need to
Different directions bending, solder joint are easy to produce deformation, and mechanical strength is poor, the case where being easy to happen rosin joint, or even fall off.
The embodiment of the present application provides a kind of method of 3D encapsulation multi-point welding, and Fig. 2 is a kind of 3D encapsulation of the embodiment of the present application
The implementation process schematic diagram of the method for multi-point welding, as shown in Fig. 2, this method comprises:
Step S101, it determines in 3D encapsulation and needs M wiring interconnected；
Step S102, the M wiring is welded on interconnected same combination pad, forms N number of pad；Its
In, M and N are the positive integer more than or equal to 2, and N is less than or equal to M.
When there is M wiring to need to be connected with same pin, in the related technology, M wiring is welded on same pad,
Form a pad.Here, M wiring is separately welded on different pads, and be connected to one by combining pad
It rises.All be welded on the same pad of same pad in this way, avoiding M wiring, caused by be easy to fall off show
As improving the reliability of welding.
In other embodiments, the combination pad includes P pad；P is the integer more than or equal to 1.
Here, M wiring is welded on a combination pad, which can be multiple welderings interconnected
Disk is also possible to the biggish pad of area, such as oblong pad.On the combination pad, it is capable of forming at least two
Pad.
The embodiment of the present application provides the another kind 3D method of encapsulation multi-point welding, this method comprises:
Step S201, it determines in 3D encapsulation and needs M wiring interconnected；
Step S202, the M wiring is welded on interconnected same combination pad, forms N number of pad；Its
In, M and N are the positive integer more than or equal to 2, and N is less than or equal to M.
The combination pad includes P pad, and P is more than or equal to 2；The P pad is connected to by conductive material；Its
In, it is able to form at least one pad on each pad；As shown in Figure 3A, pad 21 and pad 22 pass through conductive material
Connection forms combination pad, is able to form a pad 30 on pad 21 and pad 22.
Here, combination pad is made up of by least two the pad that conductive material is connected to.M wiring is welded respectively
It connects on different pads, forms N number of pad altogether, to reduce technology difficulty, promote yields and reliability.
The embodiment of the present application provides the another kind 3D method of encapsulation multi-point welding, this method comprises:
Step S301, it determines in 3D encapsulation and needs M wiring interconnected；
Step S302, M wiring is divided into P group, respectively corresponds the P pad；
Step S303, every group of wiring is respectively welded on corresponding pad, forms at least one on each pad
A pad is welded on the M wiring on the combination pad, forms N number of pad；Wherein, on each pad
Wiring quantity is less than or equal to 3；Wherein, M and N is the positive integer more than or equal to 2, and N is less than or equal to M.
The combination pad includes P pad, and P is more than or equal to 2；The P pad is connected to by conductive material；Its
In, it is able to form at least one pad on each pad.
Here, a pad is included at least on each pad, and every group of wiring is respectively welded on each pad, it is conformal
At N number of pad, the quantity of wiring is less than or equal to 3 on each pad.In this way, can flexibly be set according to actual needs
It sets, less wiring is welded on each pad, guarantee yields and reliability.
In other embodiments, the difference of the quantity of wiring described in every group is less than 2.
Here, the wiring quantity welded on each pad using the principle of mean allocation and connecing on other pads
Line number amount is identical or difference is 1.
The embodiment of the present application provides the another kind 3D method of encapsulation multi-point welding, this method comprises:
Step S401, it determines in 3D encapsulation and needs M wiring interconnected；
Step S402, the M wiring is welded on interconnected same combination pad, forms N number of pad；Its
In, M and N are the positive integer more than or equal to 2, and N is less than or equal to M.
The combination pad includes P pad, and wherein P is equal to 1.At least two pads are capable of forming on the pad,
Its area is sufficiently large, can be oblong pad, is also possible to the biggish square pad of area or circular pad.Such as Fig. 3 B institute
Show, two pads 30 are capable of forming on rectangular pad 23.
Here, include a pad by combination pad, at least two pads can be accommodated on the pad.Actually answering
In, the design of oblong pad can be used.M wiring is respectively welded on multiple pads, simple process, reliability
Height can effectively improve yields.
The embodiment of the present application provides the another kind 3D method of encapsulation multi-point welding, this method comprises:
Step S501, it determines in 3D encapsulation and needs M wiring interconnected；
Step S502, M wiring is divided into N group, the quantity of every group of wiring is less than or equal to 3；
Step S503, same group of wiring is welded on a pad, the M wiring is made to be welded on the combination weldering
On disk, N number of pad is formed；Wherein, M and N is the positive integer more than or equal to 2, and N is less than or equal to M.
The combination pad includes P pad, and wherein P is equal to 1.At least two pads are capable of forming on the pad.
Here, include a pad by combination pad, at least two pads can be accommodated on the pad.Actually answering
In, the design of oblong pad can be used.M wiring is respectively welded on multiple pads, is protected on each pad
The quantity of card wiring is all not more than 3, to effectively improve yields.
In other embodiments, the difference of the quantity of wiring described in every group is less than 2.
Here, the wiring quantity welded on each pad using the principle of mean allocation and connecing on other pads
Line number amount is identical or difference is 1.
The embodiment of the present application provides a kind of method of 3D encapsulation multi-point welding, this method comprises:
Increase dummy pad or changes shape, the size of pad, it will the case where at least two pair of connecting wires answer same pad
The case where being decomposed into corresponding different pads.
At least two pads are set, and are connected to conductive material, it is near when having that at least two wiring need to connect
Few two wiring are respectively welded at least two pads.
In other embodiments, when at least two pair of connecting wires answer same pad, rectangle is set by corresponding pad,
At least two wiring are respectively welded on rectangular pad, and form at least two pads.
In one embodiment, as shown in Figure 4 A, the corresponding same pad 10 of wiring 11, wiring 12 and wiring 13.Setting is mutual
Two pads of connection are respectively pad 21 and pad 22, and wiring 11 and wiring 12 are welded on pad 21；Wiring 13 is welded
It connects on pad 22.
In another embodiment, as shown in Figure 4 B, the corresponding same pad 10 of wiring 11, wiring 12, wiring 13 and wiring 14.
Two interconnected pads, respectively pad 21 and pad 22 are set, wiring 11 and wiring 12 are welded on pad 21；It will
Wiring 13 and wiring 14 are welded on pad 22.
In another embodiment, as shown in Figure 4 C, there are a large amount of wiring, such as ten wiring to need to be welded on pad 10
On, at this point, rectangular pad 31 and pad 32 is arranged, will wherein 5 wiring it be welded on pad 31, and form two welding
Point, pad 311 is for connecting 3 wiring, and pad 312 is for connecting 2 wiring；Other 5 wiring are welded on pad
On 32, and two pads are formed, pad 321 is for connecting 2 wiring, and pad 322 is for connecting 3 wiring；Again will
Pad 312 and pad 321 are connected by wiring.
Based on embodiment above-mentioned, the embodiment of the present application provides a kind of device of 3D encapsulation multi-point welding, as shown in figure 5,
Described device 500 includes determining component 501 and welding assembly 502, in which:
It determines component 501, is configured to determine that 3D needs M wiring interconnected in encapsulating；
Welding assembly 502 is configured to for the M wiring being welded on interconnected same combination pad, is formed N number of
Pad；Wherein, M and N is the positive integer more than or equal to 2, and N is less than or equal to M.
The description of apparatus above embodiment, be with the description of above method embodiment it is similar, have same embodiment of the method
Similar beneficial effect.For undisclosed technical detail in the application Installation practice, the application embodiment of the method is please referred to
Description and understand.
It should be noted that in the embodiment of the present application, if realizing above-mentioned 3D encapsulation in the form of software function module
The method of multi-point welding, and when sold or used as an independent product, it also can store in a computer-readable storage
In medium.Based on this understanding, the technical solution of the embodiment of the present application substantially in other words contributes to the prior art
Part can be embodied in the form of software products, which is stored in a storage medium, if including
Dry instruction is with so that the equipment of a 3D encapsulation multi-point welding executes the whole or portion of each embodiment the method for the application
Point.And storage medium above-mentioned include: USB flash disk, mobile hard disk, read-only memory (Read Only Memory, ROM), magnetic disk or
The various media that can store program code such as person's CD.In this way, the embodiment of the present application be not limited to any specific hardware and
Software combines.
Accordingly, the embodiment of the present application provides a kind of equipment of 3D encapsulation multi-point welding, including memory, processor and behaviour
Make component, the computer program that can be run on a memory and on a processor is stored, when the processor executes described program
It controls the operating member and realizes that the 3D provided in above-described embodiment encapsulates the step in multi-point welding method.Wherein, operation portion
Part may include determination component and welding assembly etc. in above-mentioned apparatus.
Accordingly, the embodiment of the present application provides a kind of computer readable storage medium, is stored thereon with computer program,
It is characterized in that, which realizes when being executed by processor in the 3D encapsulation multi-point welding method provided in above-described embodiment
The step of.
It need to be noted that: the description of medium stored above and apparatus embodiments, with retouching for above method embodiment
It is similar for stating, and has with embodiment of the method similar beneficial effect.For in the application storage medium and apparatus embodiments not
The technical detail of disclosure please refers to the description of the application embodiment of the method and understands.
It should be noted that Fig. 6 is a kind of hardware entities signal for the equipment that the embodiment of the present application 3D encapsulates multi-point welding
Figure, as shown in fig. 6, the hardware entities of the equipment 600 include: memory 601, processor 602, communication interface 603 and operation portion
Part 604, in which:
The overall operation of the usually control equipment 600 of processor 602.
Communication interface 603 can make the equipment 600 pass through network and other terminals or server communication.
Operating member 604 may include determination component and welding assembly etc. in above-mentioned apparatus, for executing actual behaviour
Make step.
Memory 601 is configured to store the instruction and application that can be performed by processor 602, can also cache device to be processed
602 and operating member 604 in each module it is to be processed or processed data (for example, image data, audio data, voice
Communication data and video communication data), flash memory (FLASH) or random access storage device (Random Access can be passed through
Memory, RAM) it realizes.
It should be understood that " one embodiment " or " embodiment " that specification is mentioned in the whole text mean it is related with embodiment
A particular feature, structure, or characteristic includes at least one embodiment of the application.Therefore, occur everywhere in the whole instruction
" in one embodiment " or " in one embodiment " not necessarily refer to identical embodiment.In addition, these specific features, knot
Structure or characteristic can combine in any suitable manner in one or more embodiments.It should be understood that in the various implementations of the application
In example, magnitude of the sequence numbers of the above procedures are not meant that the order of the execution order, the execution sequence Ying Yiqi function of each process
It can be determined with internal logic, the implementation process without coping with the embodiment of the present application constitutes any restriction.Above-mentioned the embodiment of the present application
Serial number is for illustration only, does not represent the advantages or disadvantages of the embodiments.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
In several embodiments provided herein, it should be understood that disclosed device and method can pass through it
Its mode is realized.Apparatus embodiments described above are merely indicative, for example, the division of the unit, only
A kind of logical function partition, there may be another division manner in actual implementation, such as: multiple units or components can combine, or
It is desirably integrated into another system, or some features can be ignored or not executed.In addition, shown or discussed each composition portion
Mutual coupling or direct-coupling or communication connection is divided to can be through some interfaces, the INDIRECT COUPLING of equipment or unit
Or communication connection, it can be electrical, mechanical or other forms.
Above-mentioned unit as illustrated by the separation member, which can be or may not be, to be physically separated, aobvious as unit
The component shown can be or may not be physical unit；Both it can be located in one place, and may be distributed over multiple network lists
In member；Some or all of units can be selected to achieve the purpose of the solution of this embodiment according to the actual needs.
In addition, each functional unit in each embodiment of the application can be fully integrated in one processing unit, it can also
To be each unit individually as a unit, can also be integrated in one unit with two or more units；It is above-mentioned
Integrated unit both can take the form of hardware realization, can also realize in the form of hardware adds SFU software functional unit.
Those of ordinary skill in the art will appreciate that: realize that all or part of the steps of above method embodiment can pass through
The relevant hardware of program instruction is completed, and program above-mentioned can store in computer-readable storage medium, which exists
When execution, step including the steps of the foregoing method embodiments is executed；And storage medium above-mentioned includes: movable storage device, read-only deposits
The various media that can store program code such as reservoir (Read Only Memory, ROM), magnetic or disk.
If alternatively, the above-mentioned integrated unit of the application is realized in the form of software function module and as independent product
When selling or using, it also can store in a computer readable storage medium.Based on this understanding, the application is implemented
Substantially the part that contributes to existing technology can be embodied in the form of software products the technical solution of example in other words,
The computer software product is stored in a storage medium, and is used including some instructions so that a 3D encapsulates multi-point welding
Equipment executes all or part of each embodiment the method for the application.And storage medium above-mentioned includes: that mobile storage is set
The various media that can store program code such as standby, ROM, magnetic or disk.
The above, only presently filed embodiment, but the protection scope of the application is not limited thereto, it is any to be familiar with
Those skilled in the art within the technical scope of the present application, can easily think of the change or the replacement, and should all cover
Within the protection scope of the application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.
Claims (10)
1. a kind of method of 3D encapsulation multi-point welding, which is characterized in that the described method includes:
It determines in 3D encapsulation and needs M wiring interconnected；
The M wiring is welded on interconnected same combination pad, forms N number of pad；Wherein, M and N be greater than
Positive integer equal to 2, N are less than or equal to M.
2. the method according to claim 1, wherein the combination pad includes P pad；P is more than or equal to 1
Integer.
3. according to the method described in claim 2, it is characterized in that, the P pad passes through conduction material when P is more than or equal to 2
Material is connected to；Wherein, it is able to form at least one pad on each pad.
4. according to the method described in claim 3, it is characterized in that, it is described the M wiring is welded on it is interconnected same
On one combination pad, the step of forming N number of pad, comprising:
M wiring is divided into P group, respectively corresponds the P pad；
Every group of wiring is respectively welded on corresponding pad, at least one pad is formed on each pad, makes institute
It states M wiring to be welded on the combination pad, forms N number of pad.
5. according to the method described in claim 2, it is characterized in that, the pad is oblong pad, described when P is equal to 1
At least two pads are capable of forming on pad.
6. according to the method described in claim 5, it is characterized in that, it is described the M wiring is welded on it is interconnected same
On one combination pad, the step of forming N number of pad, comprising:
M wiring is divided into N group；
Same group of wiring is welded on a pad, is welded on the M wiring on the combination pad, is formed N number of
Pad.
7. the method according to claim 4 or 6, which is characterized in that the difference of the quantity of wiring described in every group is less than 2.
8. a kind of device of 3D encapsulation multi-point welding, which is characterized in that described device includes:
It determines component, is configured to determine that 3D needs M wiring interconnected in encapsulating；
Welding assembly is configured to for the M wiring being welded on interconnected same combination pad, forms N number of pad；
Wherein, M and N is the positive integer more than or equal to 2, and N is less than or equal to M.
9. a kind of equipment of 3D encapsulation multi-point welding, which is characterized in that the equipment includes: memory, processor and operation portion
Part, stores the computer program that can be run on a memory and on a processor, and the processor controls when executing described program
The operating member realizes the method that any one of the claims 1 to 7 provide.
10. a kind of computer readable storage medium, which is characterized in that be stored with computer in the computer readable storage medium
Executable instruction, the computer executable instructions are configured to execute the method that any one of the claims 1 to 7 provide.
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