CN216313496U

CN216313496U - PCB board

Info

Publication number: CN216313496U
Application number: CN202122005335.0U
Authority: CN
Inventors: 常正中; 肖国良; 雷建波
Original assignee: Nanjing Weizhi New Technology Co ltd
Current assignee: Nanjing Weizhi New Technology Co ltd
Priority date: 2021-08-24
Filing date: 2021-08-24
Publication date: 2022-04-15
Anticipated expiration: 2031-08-24

Abstract

The utility model relates to the technical field of electronic circuits, and discloses a PCB (printed circuit board), wherein the surface of the PCB comprises: the first bonding pad is used for the first type of switch tube device to carry out surface mounting, and the second bonding pad is used for the second type of switch tube device to carry out surface mounting; the first bonding pad and the second bonding pad are overlapped in the area of the board surface; the first bonding pad and the second bonding pad have the same number of conductive pins, and the areas of the conductive pins corresponding to the first bonding pad and the second bonding pad are mutually overlapped. According to the utility model, the corresponding bonding pads are reserved for the switching tube devices of different types in advance on the board surface, and when the switching tube device of one type is short of material, the switching tube device of the other type can be switched to be used immediately, so that the production stagnation of the PCB is avoided.

Description

PCB board

Technical Field

The utility model relates to the technical field of electronic circuits, in particular to a PCB (printed circuit board).

Background

Printed Circuit boards (PCBs for short) are important electronic components in modern industry, and can support electronic components and serve as carriers for electrical connection of the electronic components, so as to finally realize functions of various connected circuits.

Various types of circuits are provided on the PCB, and switching circuits, amplifying circuits, and the like are common, and switching devices are widely used in these circuits. There are many types of switching devices, each having a different structure and packaging.

The inventor finds that in the existing PCB production process, the demand for various switching tube devices is generally large, the purchasing quantity of enterprises for various switching tube devices of different types is limited, and the switching tube devices of a certain type are often short of materials in the normal production process, so that the production is stopped.

Accordingly, there is a need for improvement in response to the problems of the prior art.

Disclosure of Invention

In view of the above, there is a need to provide a PCB, in which corresponding pads are reserved on a board surface of the PCB in advance for different types of switching device, and when a material shortage occurs in one type of switching device, another type of switching device can be switched to be used immediately, so that production stoppage of the PCB is not caused.

In order to solve the above technical problem, the present invention provides a PCB, wherein the surface of the PCB comprises: the first bonding pad is used for the first type of switch tube device to carry out surface mounting, and the second bonding pad is used for the second type of switch tube device to carry out surface mounting; the first bonding pad and the second bonding pad are overlapped in the area of the board surface; the first bonding pad and the second bonding pad have the same number of conductive pins, and the areas of the conductive pins corresponding to the first bonding pad and the second bonding pad are mutually overlapped.

Optionally, the areas of the conductive pins corresponding to the first pad and the second pad are completely overlapped or at least partially overlapped in area.

Optionally, the first pad is a first pad for mounting a MOS device.

Optionally, the package of the MOS device is SOT-23.

Optionally, the second pad is a second pad for mounting a triode device.

Optionally, the package of the triode device is SOT-523.

Optionally, the PCB is mounted with one of the first type switching device and the second type switching device at the position of the first pad.

Optionally, the PCB includes a switching circuit, an amplifying circuit, or an audio circuit, and the switching circuit, the amplifying circuit, or the audio circuit includes one of the first type switching device and the second type switching device.

The technical scheme of the embodiment of the utility model has the beneficial effects that:

the PCB provided by the embodiment of the utility model comprises the following components on the surface: the first bonding pad is used for the first type of switch tube device to carry out surface mounting, and the second bonding pad is used for the second type of switch tube device to carry out surface mounting; the first bonding pad and the second bonding pad are overlapped in the area of the board surface; the first bonding pad and the second bonding pad have the same number of conductive pins, the areas where the conductive pins corresponding to the first bonding pad and the second bonding pad are located are overlapped, when the first type of switch device or the second type of switch device is short of materials, the other type of switch device can be switched to be used immediately, and therefore production stagnation of the PCB is avoided.

Drawings

Fig. 1 is a schematic structural diagram of a PCB board according to an embodiment of the present invention.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that the description relating to "first", "second", etc. in the present invention is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

In the description of the embodiments of the present invention, it is to be understood that, in the description of the present invention, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that three relationships may exist, e.g., A and/or B. Can represent that: a exists alone, A and B exist simultaneously, and B exists alone.

It will also be understood that when an element is referred to as being "fixed" or "disposed" or "connected" to another element, it can be directly or indirectly secured to the other element. The terms "upper", "lower", "outer", "distal", "far away", and the like, refer to an orientation or position based on that shown in the drawings, which is for convenience of description only and is not to be construed as limiting the present disclosure.

Referring to fig. 1, an embodiment of the present invention provides a PCB, where a board surface of the PCB includes: a first pad 110 for a first type of switching device to be mounted, and a second pad 120 for a second type of switching device to be mounted; the areas of the first pad 110 and the second pad 120 on the board surface are overlapped according to a predetermined overlapping mode; the first pad 110 and the second pad 120 have the same number of conductive pins, and the areas of the conductive pins corresponding to the first pad and the second pad overlap each other.

Specifically, the predetermined overlapping manner may be: the first bonding pad 110 and the second bonding pad 120 have the same size, and the areas on the board surface are completely overlapped; or the area of the first pad 110 is smaller than that of the second pad 120, and the area of the first pad 110 on the board surface falls within the area of the second pad 120 on the board surface; or the area of the second pad 120 is smaller than that of the first pad 110, and the area of the second pad 120 on the board surface is included in the area of the first pad 110 on the board surface; alternatively, the area of the first pad 110 on the board surface overlaps with a partial area of the second pad 120 on the board surface. In this embodiment, the predetermined overlapping manner is as follows: the first pads 110 and the second pads 120 are identical in size and completely overlap in the area of the board surface. The "overlap" refers to: the overlapping of the orthographic projections of the regions is not described herein. The phrase "the area of the first pad 110 on the board falls within the area of the second pad 120 on the board" means that: the orthographic projection of the area of the first pad 110 on the board surface is included in the orthographic projection of the area of the second pad 120 on the board surface, which is not described herein again.

Typically, the bond pad includes an insulating structure and conductive leads for making electrical connections to the electronic circuit. The conductive pins in the pads are implemented with a regular area of conductive metal deposited.

In this embodiment, the first pad 110 and the second pad 120 have the same number of conductive pins, and the areas of the corresponding conductive pins on the board surface are also overlapped with each other. More specifically, similar to the overlapping manner of the pads, the overlapping manner of the regions where the conductive pins are located also includes a plurality of similar situations, which are not repeated herein, and in short, the regions where the conductive pins corresponding to the first pad 110 and the second pad 120 are located are completely overlapped or at least partially overlapped on the regions. Taking fig. 1 as an example, the first pad 110 has

conductive leads

111, 112 and 113, and correspondingly, the second pad 120 has a conductive lead 121 corresponding to the conductive lead 111, a conductive lead 122 corresponding to the conductive lead 112 and a conductive lead 123 corresponding to the conductive lead 113, wherein the region of the conductive lead 121 falls within the region of the conductive lead 111, and the conductive lead 122 overlaps with a part of the region of the conductive lead 112.

In the present embodiment, the first pad 110 is used for mounting a MOS (Metal-Oxide-Semiconductor Field-Effect Transistor) device, and generally, in the electronic device industry, the MOS device is manufactured as an SOT-23 packaged IC device.

In the present embodiment, the second pads 120 are used for mounting a triode device, and the package of the triode device is SOT-523.

The first pad and the second pad in the embodiment of the present invention are overlapped in area, and only one of the first type switching device and the second type switching device needs to be attached in the process of attaching the PCB, and since the conductive pin of the first type switching device is overlapped with the corresponding conductive pin of the second type switching device, electrical equivalence is achieved, and the conductive pins belong to the same switching device, so that a similar switching control function can be achieved in a circuit. In general, the first type switching device or the second type switching device may be applied in a switching circuit, an amplifying circuit or an audio circuit.

In the PCB provided in the embodiment of the present invention, the board surface includes a first pad for a first type of switching device to perform a chip mounting, and a second pad for a second type of switching device to perform a chip mounting; the first bonding pad and the second bonding pad are overlapped in the area of the board surface; the first bonding pad and the second bonding pad have the same number of conductive pins, the areas where the conductive pins corresponding to the first bonding pad and the second bonding pad are located are overlapped, when the first type of switch device or the second type of switch device is short of materials, the other type of switch device can be switched to be used immediately, and therefore production stagnation of the PCB is avoided.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof.

The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims shall not be construed as limiting the claim concerned.

Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. A plurality of units or means recited in the system claims may also be implemented by one unit or means in software or hardware. The terms second, etc. are used to denote names, but not any particular order.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. The utility model provides a PCB board, its characterized in that, include on the face of PCB board: the first bonding pad is used for the first type of switch tube device to carry out surface mounting, and the second bonding pad is used for the second type of switch tube device to carry out surface mounting; the first bonding pad and the second bonding pad are overlapped in the area of the board surface; the first bonding pad and the second bonding pad have the same number of conductive pins, and the areas of the conductive pins corresponding to the first bonding pad and the second bonding pad are mutually overlapped.

2. The PCB board of claim 1, wherein the areas of the conductive pins corresponding to the first pad and the second pad are completely overlapped or at least partially overlapped in area.

3. The PCB board of claim 2, wherein the first bonding pad is a first bonding pad for mounting of a MOS device.

4. The PCB board of claim 3, wherein the package of MOS device is SOT-23.

5. The PCB board of claim 2, wherein the second pads are second pads for mounting a triode device.

6. The PCB board of claim 5, wherein the package of the triode device is SOT-523.

7. The PCB board of claim 1, wherein the PCB board is mounted with one of the first type switching device and the second type switching device at a location of the first pad.

8. The PCB of claim 7, wherein the PCB comprises a switching circuit, an amplifying circuit or an audio circuit, and the switching circuit, the amplifying circuit or the audio circuit comprises one of the first type switching device and the second type switching device.