CN208111433U - A kind of space wire bonding structure - Google Patents
A kind of space wire bonding structure Download PDFInfo
- Publication number
- CN208111433U CN208111433U CN201820773382.5U CN201820773382U CN208111433U CN 208111433 U CN208111433 U CN 208111433U CN 201820773382 U CN201820773382 U CN 201820773382U CN 208111433 U CN208111433 U CN 208111433U
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- China
- Prior art keywords
- image sensor
- optical image
- pcb board
- pad
- wire bonding
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Abstract
The utility model relates to wire bonding processing technique field more particularly to a kind of space wire bonding structures.Including wirebonding device, optical image sensor, pcb board, bearing seat and conducting wire；The optical image sensor is stacked on pcb board, and the bearing seat is fixed on pcb board, and the optical image sensor is located on the inside of bearing seat, and the optical image sensor and pcb board are electrically connected by wirebonding device and conducting wire.Compared with prior art, the utility model is by, in mutually perpendicular plane, reducing the mould group length on the direction XY, to realize the miniaturization of mould group for two pads setting of lead key closing process.
Description
Technical field
The utility model relates to wire bonding processing technique field more particularly to a kind of space wire bonding structures.
Background technique
Wire bonding refers to the technique for connecting sensor or chip by way of being bonded with substrate, with technique
Simply, low in cost, be suitble to a variety of Electronic Packaging forms and occupy an leading position in connection type.
The intelligent displays mobile device height screen accounting such as mobile phone is increasingly becoming trend of the market, but traditional lead key closing process is
It being carried out in a plane or two mutually horizontal planes, reserved wirebonding region occupies mould group XY size significantly,
Hinder the miniaturization of mobile device.
Utility model content
The utility model in order to overcome at least one of the drawbacks of the prior art described above, provides a kind of space wire bonding knot
Structure.
In order to solve the above technical problems, the technical solution of the utility model is as follows：
A kind of space wire bonding structure, including wirebonding device, optical image sensor, pcb board, bearing seat and lead
Line；The optical image sensor is stacked on pcb board, and the bearing seat is fixed on pcb board, the optical image sensor
On the inside of bearing seat, the optical image sensor and pcb board are electrically connected by wirebonding device and conducting wire.
The utility model key is will to occupy the area of XY size originally in the enterprising line lead bonding of two not parallel planes
Domain is extended to Z-direction, to reduce the size in the direction mould group XY.
Further, the wirebonding device includes the first pad, gold thread and the second pad；Described in the gold thread connection
First pad and second pad.
Further, first pad and second pad are located on bearing seat and optical image sensor.
Further, first pad is mutually perpendicular to the plane where second pad.
Further, second pad is electrically connected by conducting wire with pcb board.
Compared with prior art, the space wire bonding structure of the utility model is by welding two of lead key closing process
Disk setting reduces the mould group length on the direction XY in mutually perpendicular plane, thus the characteristics of realizing the miniaturization of mould group.
Detailed description of the invention
Fig. 1 is the utility model embodiment lead key closing process structure chart（One）；
Fig. 2 is the utility model embodiment lead key closing process structure chart（Two）；
Wherein：1 wirebonding device, 2 optical image sensors, 3PCB plate, 4 bearing seats, 5 conducting wires, 11 first pads, 12
Gold thread, 13 second pads.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, with reference to the accompanying drawings and examples to the technical solution of the utility model
It is described further.
Embodiment one
- Fig. 2 refering to fig. 1, a kind of space wire bonding structure, including wirebonding device, optical image sensor, PCB
Plate, bearing seat and conducting wire；The optical image sensor is stacked on pcb board, and the bearing seat is fixed on pcb board, described
Optical image sensor is located on the inside of bearing seat, and the optical image sensor and pcb board pass through wirebonding device and conducting wire
Electrical connection.
Embodiment two
- Fig. 2 refering to fig. 1, the present embodiment are similar to embodiment one, and further, the wirebonding device includes first
Pad, gold thread and the second pad；The gold thread connects first pad and second pad.
First pad and second pad are located on bearing seat and optical image sensor.
First pad is mutually perpendicular to the plane where second pad.
Second pad is electrically connected by conducting wire with pcb board.
Lead key closing process product can reduce the width having a size of pad compared with common process product, mould group in the present embodiment
（Typically larger than 0.15mm）In addition safe spacing between pad and bearing seat（Typically larger than 0.10mm）, there are lead key in usual two sides
Molding group, therefore lead key closing process product can reduce size 0.50mm than common process product.
Obviously, the above embodiments of the present invention is merely examples for clearly illustrating the present invention, and simultaneously
Non- is limitations of the embodiments of the present invention.For those of ordinary skill in the art, above explained
On the basis of can also make other variations or changes in different ways.There is no need and unable to give thoroughly all embodiments
It lifts.Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention etc. should be included in this
Within the protection scope of utility model claims.
Claims (5)
1. a kind of space wire bonding structure, which is characterized in that including wirebonding device（1）, optical image sensor（2）,
Pcb board（3）, bearing seat（4）And conducting wire（5）；The optical image sensor（2）It is stacked in pcb board（3）On, the bearing seat
（4）It is fixed on pcb board（3）On, the optical image sensor（2）Positioned at bearing seat（4）Inside, the optical image sensor
（2）And pcb board（3）Pass through wirebonding device（1）And conducting wire（5）Electrical connection.
2. wire bonding structure in space according to claim 1, which is characterized in that the wirebonding device（1）Including
First pad（11）, gold thread（12）With the second pad（13）；The gold thread（12）Connect first pad（11）With described
Two pads（13）.
3. wire bonding structure in space according to claim 2, which is characterized in that first pad（11）With described
Two pads（13）It is located at bearing seat（4）With optical image sensor（2）On.
4. wire bonding structure in space according to claim 3, which is characterized in that first pad（11）With described
Two pads（13）The plane at place is mutually perpendicular to.
5. wire bonding structure in space according to claim 3, which is characterized in that second pad（13）Pass through conducting wire
（5）With pcb board（3）Electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820773382.5U CN208111433U (en) | 2018-05-23 | 2018-05-23 | A kind of space wire bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820773382.5U CN208111433U (en) | 2018-05-23 | 2018-05-23 | A kind of space wire bonding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208111433U true CN208111433U (en) | 2018-11-16 |
Family
ID=64125503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820773382.5U Active CN208111433U (en) | 2018-05-23 | 2018-05-23 | A kind of space wire bonding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208111433U (en) |
-
2018
- 2018-05-23 CN CN201820773382.5U patent/CN208111433U/en active Active
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