CN217064106U - PCB packaging structure compatible with crystal oscillators of different sizes - Google Patents
PCB packaging structure compatible with crystal oscillators of different sizes Download PDFInfo
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- CN217064106U CN217064106U CN202220900042.0U CN202220900042U CN217064106U CN 217064106 U CN217064106 U CN 217064106U CN 202220900042 U CN202220900042 U CN 202220900042U CN 217064106 U CN217064106 U CN 217064106U
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Abstract
The application provides a compatible not unidimensional crystal oscillator's PCB packaging structure relates to PCB encapsulation technical field, includes: the packaging structure comprises a first packaging bonding pad, a second packaging bonding pad, a third packaging bonding pad, a fourth packaging bonding pad, a fifth packaging bonding pad and a sixth packaging bonding pad; the first packaging bonding pad, the second packaging bonding pad and the third packaging bonding pad are obtained by dividing the first original packaging bonding pad, and the fourth bonding pad, the fifth bonding pad and the sixth bonding pad are obtained by dividing the second original packaging bonding pad. This application has improved the flexibility of crystal oscillator material lectotype, can solve original compatible scheme and be difficult for the management and control when PCB pastes dress components and parts, appear the false soldering easily, go up tin skew, short circuit between components and parts pin, crystal oscillator signal quality variation scheduling problem.
Description
Technical Field
The application relates to the technical field of vehicle-mounted equipment, in particular to a PCB packaging structure compatible with crystal oscillators of different sizes.
Background
At present, the PCB packages corresponding to the crystal oscillators with the same specification are various, and in order to realize the compatible design of various package sizes, PCB package pads are usually directly overlapped to achieve the compatible design of various sizes.
The existing PCB packaging bonding pad superposition can realize various packaging compatible design structures, but is not easy to control when a PCB is used for mounting components. The problems of false soldering, tin coating deviation, short circuit between pins of components, poor quality of crystal oscillator signals and the like are easy to occur.
SUMMERY OF THE UTILITY MODEL
In view of this, the present application provides a PCB package structure compatible with different sizes of crystal oscillators to solve the above technical problems.
The embodiment of the application provides a PCB packaging structure of compatible not unidimensional crystal oscillator, includes: the packaging structure comprises a first packaging bonding pad, a second packaging bonding pad, a third packaging bonding pad, a fourth packaging bonding pad, a fifth packaging bonding pad and a sixth packaging bonding pad; the first packaging bonding pad, the second packaging bonding pad and the third packaging bonding pad are obtained by dividing the first original packaging bonding pad, and the fourth bonding pad, the fifth bonding pad and the sixth bonding pad are obtained by dividing the second original packaging bonding pad.
Further, the size of the first original packaging pad is the same as the size of the second original packaging pad.
Further, the size of the first package pad is the same as that of the sixth package pad, and both are: 1.4mm X2.0 mm.
Further, the size of the second package pad is the same as that of the fifth package pad, and both are: 2.6mm X2.0 mm.
Further, the size of the third package pad is the same as the size of the fourth package pad, and both are: 1.1mm X2.0 mm.
This application has improved the flexibility of crystal oscillator material lectotype, can solve original compatible scheme and be difficult for the management and control when PCB pastes the dress components and parts, appear the false soldering easily, go up tin skew, short circuit between components and parts pin, crystal oscillator signal quality variation scheduling problem.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings used in the detailed description or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic diagram of a conventional PCB package structure according to an embodiment of the present application;
fig. 2 is a schematic diagram of a PCB package structure compatible with different sizes of crystal oscillators provided in the embodiment of the present application;
fig. 3 is a schematic diagram of a chip of a large-size crystal oscillator according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram of a patch of a small-sized crystal oscillator according to an embodiment of the present application.
The attached drawings are as follows:
11-first original package pad, 12-second original package pad, 1-first package pad,
2-second package pad, 3-third package pad, 4-fourth package pad,
5-fifth package pad, 6-sixth package pad.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
First, a brief introduction is made to the design idea of the embodiment of the present application.
As shown in fig. 1, when a component is mounted on a PCB in the prior art, solder paste is applied to a first primitive package pad 11 and a second primitive package pad 12 in cooperation with a steel mesh. A first pin of the crystal oscillator is attached to the first original packaging bonding pad 11; the second leads of the crystal oscillator are attached to the second original package pads 12, respectively.
The stacking of the existing PCB packaging bonding pads can realize various packaging compatible design structures, but the PCB packaging bonding pads are difficult to control when being used for mounting components. The problems of false soldering, tin coating deviation, short circuit between pins of components, poor quality of crystal oscillator signals and the like are easy to occur.
In order to solve the technical problem, a first original packaging bonding pad 11 and a second original packaging bonding pad 12 in the existing scheme are divided into 6 small bonding pads; during surface mounting, tin paste is coated on the upper surface of the selected small bonding pad; satisfy two kinds of encapsulation size crystal oscillator paster demands from this, under the condition that the crystal oscillator material is in short supply, improved the flexibility of crystal oscillator material lectotype.
After introducing the application scenario and the design concept of the embodiment of the present application, the following describes a technical solution provided by the embodiment of the present application.
As shown in fig. 2, the embodiment of the present application provides a PCB package structure compatible with crystal oscillators of different sizes, which can be adapted to the package of the same type but with different sizes; the method comprises the following steps: first package pads 1, second package pads 2, third package pads 3, fourth package pads 4, fifth package pads 5 and sixth package pads 6. The first package pad 1, the second package pad 2 and the third package pad 3 are obtained by dividing the first original package pad 11, and the fourth package pad 4, the fifth package pad 5 and the sixth package pad 6 are obtained by dividing the second original package pad 12. The size of the first original package pads 11 is the same as the size of the second original package pads 12.
The size of the first packaging bonding pad is the same as that of the sixth packaging bonding pad, and the sizes are as follows: 1.4mm X2.0 mm. The size of the second packaging bonding pad is the same as that of the fifth packaging bonding pad, and the sizes are as follows: 2.6mm X2.0 mm. The size of the third packaging bonding pad is the same as that of the fourth packaging bonding pad, and the third packaging bonding pad and the fourth packaging bonding pad are both: 1.1mm X2.0 mm.
As shown in fig. 3, a first lead of a large-sized crystal oscillator is attached to a combination of the first package pad 1 and the second package pad 2, and a second lead of the large-sized crystal oscillator is attached to a combination of the fifth package pad 5 and the sixth package pad 6.
When a large-size crystal oscillator is used for the chip mounting, large-size packaging steel meshes are selected for matching, and solder paste is coated on the first packaging bonding pad 1, the second packaging bonding pad 2, the fifth packaging bonding pad 5 and the sixth packaging bonding pad 6. When the PCB is pasted with components, a first pin of the large-size crystal oscillator is simultaneously attached to the first packaging bonding pad 1 and the second packaging bonding pad 2; and the second pin of the large-size crystal oscillator is simultaneously attached to the fifth packaging welding pad 5 and the sixth packaging welding pad 6.
As shown in fig. 4, a first lead of the small-sized crystal oscillator is attached to a combination of the second package pad 2 and the third package pad 3, and a second lead of the small-sized crystal oscillator is attached to a combination of the fourth package pad 4 and the fifth package pad 5.
When the small-size crystal oscillator is used for the patch, the steel mesh of the small-size package is selected for matching, and only the second package bonding pad 2, the third package bonding pad 3, the fourth package bonding pad 4 and the fifth package bonding pad 5 are coated with the solder paste. When the PCB is pasted with components, the first pin of the small-size crystal oscillator is simultaneously attached to the second packaging bonding pad 2 and the third packaging bonding pad 3; and the second pin of the small-size crystal oscillator is simultaneously attached to the fourth packaging bonding pad 4 and the fifth packaging bonding pad 5.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (5)
1. A PCB packaging structure compatible with crystal oscillators of different sizes is characterized by comprising: the packaging structure comprises a first packaging bonding pad, a second packaging bonding pad, a third packaging bonding pad, a fourth packaging bonding pad, a fifth packaging bonding pad and a sixth packaging bonding pad; the first packaging bonding pad, the second packaging bonding pad and the third packaging bonding pad are obtained by dividing the first original packaging bonding pad, and the fourth bonding pad, the fifth bonding pad and the sixth bonding pad are obtained by dividing the second original packaging bonding pad.
2. The PCB package structure compatible with different sizes of crystal oscillators according to claim 1, wherein the size of the first original package pad and the size of the second original package pad are the same.
3. The PCB packaging structure compatible with crystal oscillators of different sizes as claimed in claim 2, wherein the first packaging bonding pad and the sixth packaging bonding pad have the same size, and are both: 1.4mm X2.0 mm.
4. The PCB packaging structure compatible with different sizes of crystal oscillators according to claim 2, wherein the size of the second packaging bonding pad is the same as that of the fifth packaging bonding pad, and the sizes of the second packaging bonding pad and the fifth packaging bonding pad are both: 2.6mm X2.0 mm.
5. The PCB packaging structure compatible with crystal oscillators of different sizes as claimed in claim 2, wherein the size of the third packaging pad is the same as the size of the fourth packaging pad, and both the sizes are as follows: 1.1mm X2.0 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220900042.0U CN217064106U (en) | 2022-04-18 | 2022-04-18 | PCB packaging structure compatible with crystal oscillators of different sizes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220900042.0U CN217064106U (en) | 2022-04-18 | 2022-04-18 | PCB packaging structure compatible with crystal oscillators of different sizes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217064106U true CN217064106U (en) | 2022-07-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220900042.0U Active CN217064106U (en) | 2022-04-18 | 2022-04-18 | PCB packaging structure compatible with crystal oscillators of different sizes |
Country Status (1)
| Country | Link |
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| CN (1) | CN217064106U (en) |
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- 2022-04-18 CN CN202220900042.0U patent/CN217064106U/en active Active
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