CN101118888A - Inner pin jointing tape coiling and tape coiling support packaging structure using the same - Google Patents
Inner pin jointing tape coiling and tape coiling support packaging structure using the same Download PDFInfo
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- CN101118888A CN101118888A CNA2006101092415A CN200610109241A CN101118888A CN 101118888 A CN101118888 A CN 101118888A CN A2006101092415 A CNA2006101092415 A CN A2006101092415A CN 200610109241 A CN200610109241 A CN 200610109241A CN 101118888 A CN101118888 A CN 101118888A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 37
- 238000004804 winding Methods 0.000 claims description 122
- 230000002787 reinforcement Effects 0.000 claims description 53
- 238000003466 welding Methods 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000003550 marker Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 59
- 230000000694 effects Effects 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 230000002968 anti-fracture Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a connecting coiling tape with inner pins and the coiling bearing packaging structure using the coiling tape. For the connecting coiling tape with inner pins, the bendable dielectric layer of a component hole is provided with plural pins used for connecting the wafer and plural compensation pins. Each compensation pin is a contraposition marker in a crossing or T shape, and the contraposition markers are positioned on the outside of the component hole and glued on the bendable dielectric layer. Thereby, the contraposition markers have advantages of cooperating contraposition for inner lend connecting, easy manufacturing and ensuring non-distorting for the coiling tape.
Description
Technical field
The present invention relates to a kind of soft chip carrier (flexible chip carrier), particularly relate to a kind of have in interior drawing assist contraposition when engaging, make easily and can guarantee that interior pin that this winding is not easy the torsional deformation effect engages winding and uses the winding support packaging structure of this winding.
Background technology
In the semiconductor packages field, the kind of chip carrier is mainly divided into rigid and soft, and rigid chip carrier can't be done the coil type transmission in respect of rigid printed circuit board, lead frame, ceramic substrate etc.; Soft chip carrier then has interior pin to engage winding, metallic film, cover brilliant film etc., can do the coil type transmission, reaches the continous way encapsulation procedure.Generally speaking, it is to have a component hole (device hole) at each encapsulation unit that interior pin engages winding, is extended with unsettled interior pin in the hole, engages for interior pin.
Interior pin engages (Inner Lead Bonding, ILB) be a kind of existing wafer joining technique, after the winding of pin joint moves to fixed point in one, oppress the unsettled pin of pin joint winding in this with an elevated temperature heat pressing head, make it be engaged to the plurality of bump of a wafer, usually made semiconductor package product be referred to as the winding support packaging structure (Tape Carrier Package, TCP).Along with high-density development, show the contraposition day that interior pin engages important.Contraposition mode in the past is to engage the contraposition pin that winding additionally has additional elongated strip at interior pin, and it is to be hanging shape, and is to form with etching as pin, causes contraposition incorrect because of etching is bad with displacement easily.
TaiWan, China patent of invention card I245396 " the winding carrying base plate for packaging that pin is strengthened " has disclosed a kind of interior pin and has engaged winding, it is that pin partly is designed to the loop pin, in order to strengthen pin intensity, the incorrect problem of contraposition when pin engages in still still can't solving.
This shows that above-mentioned existing interior pin joint winding and winding support packaging structure obviously still have inconvenience and defective, and demand urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found the winding support packaging structure that a kind of novel interior pin engages winding and uses this winding, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because above-mentioned existing interior pin engages winding and the existing defective of winding support packaging structure, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge thereof, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding the winding support packaging structure that a kind of novel interior pin engages winding and uses this winding, can improve general existing interior pin and engage winding and winding support packaging structure, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing interior pin engages winding and the existence of winding support packaging structure, and provide a kind of novel interior pin to engage winding and use the winding support packaging structure of this winding, technical problem to be solved is to make it can strengthen the torsional deformation repellence of pin joint winding in this, each reinforcement pin is to have to be the cross or the alignment mark of T font without exception again, contraposition and making shaping easily were very suitable for practicality when pin engaged in can assisting.
Of the present invention time a purpose is, provide a kind of novel interior pin to engage winding and use the winding support packaging structure of this winding, technical problem to be solved is to make wherein that the corner, four corners of the component hole of this pliability dielectric layer is to be arc angle, and each alignment mark is to have a plurality of arc-shaped bend bars corresponding to those corners, and can strengthen anti-twist repellence, thereby be suitable for practicality more.
A further object of the present invention is, provide a kind of novel interior pin to engage winding and use the winding support packaging structure of this winding, technical problem to be solved is that to make wherein the welding resisting layer at this pliability dielectric layer be to have a perforate, and make those alignment marks is to be positioned within this perforate and for appearing shape, form a bright surface layer and can help plating, be beneficial to identification, thereby be suitable for practicality more.
An also purpose of the present invention is, provide a kind of novel interior pin to engage winding and use the winding support packaging structure of this winding, technical problem to be solved is to make this adhesive body wherein more coat the alignment mark of those reinforcement pins, and can promote the anti-fracture characteristics of those pins, thereby be suitable for practicality more at this wafer corner place.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of interior pin that proposes according to the present invention engages winding, and it comprises: a pliability dielectric layer, and it has a component hole; A plurality of pins, each pin have a junction surface that is suspended in this component hole; And a plurality of reinforcement pins (stiffening lead), each reinforcement pin has and is the cross or the alignment mark of T font without exception, and those alignment marks are to be positioned at the outer of this component hole and to be attached at this pliability dielectric layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Pin engages winding in aforesaid, and wherein said component hole is generally rectangular, and those alignment marks are the corner places that are positioned at this component hole.
Pin engages winding in aforesaid, and the corner, four corners of wherein said component hole is to be arc angle, and each alignment mark is to have a plurality of arc-shaped bend bars corresponding to those corners.
Pin engages winding in aforesaid, and it includes a welding resisting layer in addition, covers those pins and those reinforcement pins with the part.
Pin engages winding in aforesaid, and wherein said welding resisting layer is to have a perforate, and its size is to be slightly larger than this component hole, is to be positioned within this perforate and for appearing shape and make those alignment marks.
Pin engages winding in aforesaid, and wherein said those reinforcement pins and those pins are to be a same layer structure.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of winding support packaging structure that the present invention proposes, it comprises: pin engages winding in one, and it comprises: a pliability dielectric layer, and it has a component hole; A plurality of pins, each pin have a junction surface that is suspended in this component hole; And a plurality of reinforcement pins (stiffening lead), each reinforcement pin is to have to be the cross or the alignment mark of T font without exception, those alignment marks are to be positioned at outside this component hole and to be attached at this pliability dielectric layer; One wafer, it is in alignment with this component hole of this pliability dielectric layer, and this wafer has plurality of bump, and those junction surfaces of those pins are to be engaged to those projections; And an adhesive body, it is formed in this component hole of this pliability dielectric layer, to seal those junction surfaces and those projections.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid winding support packaging structure, wherein said component hole are generally rectangular, and those alignment marks are the corner places that are positioned at this component hole.
Aforesaid winding support packaging structure, the corner, four corners of wherein said component hole is to be arc angle, and each alignment mark is to have a plurality of arc-shaped bend bars corresponding to those corners.
Aforesaid winding support packaging structure, wherein said interior pin engages winding and includes a welding resisting layer in addition, covers those pins and those reinforcement pins with the part.
Aforesaid winding support packaging structure, wherein said welding resisting layer has a perforate, and its size is to be slightly larger than this component hole, is to be positioned within this perforate and for appearing shape and make those alignment marks.
Aforesaid winding support packaging structure, wherein said those reinforcement pins and those pins are to be a same layer structure.
Aforesaid winding support packaging structure, wherein said adhesive body more coats the alignment mark of those reinforcement pins.
The object of the invention to solve the technical problems also realizes in addition by the following technical solutions.A kind of interior pin that proposes according to the present invention engages winding, and it comprises: a pliability dielectric layer, and it has a chip bonding district; A plurality of pins, it is formed on this pliability dielectric layer, and each pin has a junction surface that extends in this chip bonding district; And a plurality of reinforcement pins (stiffeninglead), it is formed on this pliability dielectric layer, each reinforcement pin is to have to be the cross or the alignment mark of T font without exception, and those alignment marks are to be positioned at outside this chip bonding district and to be attached at this pliability dielectric layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Pin engages winding in aforesaid, and wherein said chip bonding district is generally rectangular, and those alignment marks are the corner places that are positioned at this chip bonding district.
Pin engages winding in aforesaid, and it includes a welding resisting layer in addition, covers those pins and those reinforcement pins with the part.
Pin engages winding in aforesaid, and wherein said welding resisting layer has a perforate, and its size is greater than this chip bonding district, is to be positioned within this perforate and for appearing shape and make those alignment marks.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, in order to achieve the above object, engage winding, mainly comprise one and have the pliability dielectric layer of component hole, a plurality of pin and a plurality of reinforcement pin according to a kind of interior pin of the present invention.Each pin has a junction surface that is suspended in this component hole, to be engaged to a wafer.Each reinforcement pin has and is the cross or the alignment mark of T font without exception, those alignment marks are to be positioned at outside this component hole and to be attached at this pliability dielectric layer, have assist in pin engage contraposition, make the effect that is shaped and promotes the anti-twist deformability of this winding easily.
By technique scheme, pin engages winding and uses the winding support packaging structure of this winding to have following advantage at least in the present invention:
1, the present invention is formed with a plurality of reinforcement pins (sfiffening lead) on the pliability dielectric layer of a tool component hole, and can strengthen the torsional deformation repellence that pin in this engages winding, each reinforcement pin is to have to be the cross or the alignment mark of T font without exception again, those alignment marks are to be positioned at outside this component hole and to be attached at this pliability dielectric layer, and contraposition and making easily is shaped when pin engages in can assisting, and is very suitable for practicality.
2, among the present invention, the corner, four corners of the component hole of this pliability dielectric layer is to be arc angle, and each alignment mark is to have a plurality of arc-shaped bend bars corresponding to those corners, and can strengthen anti-twist repellence, thereby is suitable for practicality more.
3, among the present invention, be to have a perforate at a welding resisting layer of this pliability dielectric layer, its size is to be slightly larger than this component hole, and make those alignment marks is to be positioned within this perforate and for appearing shape, form a bright surface layer and can help electroplating, be beneficial to identification, thereby be suitable for practicality more.
4, adhesive body of the present invention more coats the alignment mark of those reinforcement pins, and can promote the anti-fracture characteristics of those pins at this wafer corner place, thereby is suitable for practicality more.
In sum, the invention relates to a kind of in pin engage winding and use the winding support packaging structure of this winding.Should engage winding by interior pin, on the pliability dielectric layer of a tool component hole, be formed with a plurality of pin and a plurality of reinforcement pins in order to joint wafer.Each reinforcement pin is to have to be the cross or the alignment mark of T font without exception, and those alignment marks are to be positioned at outside this component hole and to be attached at this pliability dielectric layer.Therefore, those alignment marks are to have in interior drawing when engaging to assist contraposition, make easily and guarantee that this winding is difficult for the effect of torsional deformation.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and pin joint winding and winding support packaging structure have the outstanding effect of enhancement in more existing, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 (a), Fig. 1 (b) are according to a specific embodiment of the present invention, and a kind of interior pin engages the schematic top plan view of winding.
Fig. 2 is according to a specific embodiment of the present invention, and pin engages winding in the local schematic top plan view of reinforcement pin in this.
Fig. 3 is according to a specific embodiment of the present invention, along the cross-sectional schematic of 3-3 hatching among Fig. 2.
Fig. 4 is according to a specific embodiment of the present invention, a kind of schematic cross-section that uses the winding support packaging structure of pin joint winding in this.
Fig. 5 is according to another specific embodiment of the present invention, and another kind of interior pin engages the schematic top plan view of winding.
100: interior pin engages winding 110: the pliability dielectric layer
111: component hole 120: pin
121: junction surface 130: the reinforcement pin
131: alignment mark 132: the arc-shaped bend bar
133: bright surface layer 140: welding resisting layer
141: perforate 150: dummy pin
210: wafer 211: projection
220: adhesive body 300: interior pin engages winding
310: pliability dielectric layer 311: the chip bonding district
320: pin 321: junction surface
330: reinforcement pin 331: alignment mark
340: welding resisting layer 341: perforate
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, the interior pin that foundation the present invention is proposed engages winding and uses its embodiment of winding support packaging structure, structure, feature and the effect thereof of this winding, describe in detail as after.
See also Fig. 1 (a), Fig. 1 (b), Fig. 2 and shown in Figure 3, be according to a specific embodiment of the present invention, Fig. 1 is the schematic top plan view that a kind of interior pin engages winding, Fig. 2 is that pin engages winding in the local schematic top plan view of reinforcement pin in this, and Fig. 3 is that pin engages the wherein cross-sectional schematic of a reinforcement pin of winding edge in this.
The interior pin of the present invention's one concrete preferred embodiment engages winding 100, mainly comprises pliability dielectric layer 110, a plurality of pin 120 and a plurality of reinforcement pin 130 with component hole 111 (device hole).This pliability dielectric layer 110 is to be a kind of electrical insulating property film, PI (polyimides) for example, and its thickness is about 8～40 microns and have the pliability of any bending, carries in order to coil type.And these component hole 111 its sizes of this pliability dielectric layer 110 are roughly corresponding to a projection wafer 210 (as shown in Figure 1), for interior pin 120 engage (Inner Lead Bonding, ILB).In the present embodiment, the shape of this component hole 111 is generally rectangular.
Those pins 120 are to be formed on the pliability dielectric layer 110 with those reinforcement pins 130.Preferably, those reinforcement pins 130 are to can be with layer structure with those pins 120, can be by the same Copper Foil of same mask pattern etching to be shaped, so that the interval location of those reinforcement pins 130 and those pins 120 is for fixing.Each pin 120 has a junction surface 121 toward interior extension, and it is to be suspended in this component hole 111, with the plurality of bump 211 (as Fig. 1 and shown in Figure 4) that is engaged to this wafer 210, with the input and the output of this wafer 210 of electrical transmission.
As shown in Figures 2 and 3, each reinforcement pin 130 has and is the cross or the alignment mark 131 of T font without exception, those alignment marks 131 are to be positioned at outside this component hole 111 and to be attached at this pliability dielectric layer 110, can when engaging, interior pin 120 be caught its coordinate position, so above-mentioned reinforcement pin 130 with alignment mark 131 is to have the effect that pin 120 engages contrapositions, makes shaping and promote the anti-twist deformability of this winding easily in the assistance by a camera (figure does not draw).In the present embodiment, those alignment marks 131 are to be approximate cross, and the one end is little this component hole 111 of charging into.Usually those alignment marks 131 can be positioned at the corner place of this component hole 111, to avoid the design space of those pins 120.Preferably, the corner, four corners of this component hole 111 is to be arc angle, and each alignment mark 131 is to have a plurality of arc-shaped bend bars 132 (as shown in Figure 2) corresponding to those corners, becomes area of stress concentration and is easy to warpage with the corner place that avoids this component hole 111.
Again as shown in Figures 2 and 3, should engage winding 100 by interior pin, it also includes a welding resisting layer 140 in addition, as liquid photosensitive welding cover layer (liquid photoimagable solder mask, or claim LPI) or photosensitive cover lay (photoimagable cover layer, or title PIC), also can be the non-conductive printing ink or the cover layer (cover layer) of general non-photosensitive dielectric material, cover those pins 120 and those reinforcement pins 130 with the part.This welding resisting layer 140 has a perforate 141, its size is for being slightly larger than this component hole 111, and make those alignment marks 131 is to be positioned within this perforate 141 and for appearing shape, and all the other positions of those reinforcement pins 130 are covered by this welding resisting layer 140, to strengthen the anchorage of those alignment marks 131.In addition, winding 100 of pin joint can include a plurality of dummy pin 150 (dummy lead) in addition in this.Those dummy pin 150 be positioned at this component hole 111 wherein one than minor face, can promote the structural strengthening effect that pin in this engages winding 100.
Again as shown in Figure 3, those alignment marks 131 are to be formed with a bright surface layer 133 on the surface that is revealed in outside this welding resisting layer 140, for example electroplate to form and have the nickel-Jin layer, tin layer, silver layer on bright metal surface or the like, are beneficial to by the camera identification.
See also Fig. 1 and shown in Figure 4, Fig. 4 is according to a kind of schematic cross-section that uses the winding support packaging structure of pin joint winding in this of a specific embodiment of the present invention.The present invention further discloses the winding support packaging structure that uses the winding 100 of above-mentioned interior pin joint, and (Tape CarrierPackage, TCP), the winding 100 of pin joint more comprised a wafer 210 and an adhesive body 220 as chip carrier in it utilized and is somebody's turn to do.This wafer 210 has plurality of bump 211, and for example golden projection or other conductive projection are as the external output/input of this wafer 210.Utilize those reinforcement pins 130, can prevent that this component hole 111 that pin in this engages winding 100 is in the distortion that is distorted of corner or other stress raiser.And, utilize those alignment marks 131 of those reinforcement pins 130, when interior pin 120 engaged, this wafer 210 can be in alignment with this component hole 111 of this pliability dielectric layer 110, and those junction surfaces 121 of those pins 120 are accurately to be engaged to those projections.And this adhesive body 220 is to use the gluing mode to be formed in this component hole 111 solidified forming again, to seal those junction surfaces 121 and those projections 211 of those pins 120.Preferably, this adhesive body 220 more coats the alignment mark 131 of those reinforcement pins 130, can promote the anti-fracture characteristics of those pins 120 at these wafer 210 corner places.
Seeing also shown in Figure 5ly, is according to another specific embodiment of the present invention, another kind of in pin engage the schematic top plan view of winding.In addition, interior pin of the present invention engages winding except being used in the TCP encapsulation field, but also equivalence is used in membrane of flip chip (COF, chip-on-film) encapsulation.As shown in Figure 5, a kind of interior pin engages winding 300, mainly comprises a pliability dielectric layer 310, a plurality of pin 320 and a plurality of reinforcement pin 330.Can define a chip bonding district 311 at the wafer joint of this pliability dielectric layer 310, and not need component hole.Those pins 320 are to be formed on this pliability dielectric layer 310, and each pin 320 is to have a junction surface 321 that extends in this chip bonding district 311, to be engaged to the projection of a wafer.Those reinforcement pins 330 also are to be formed on this pliability dielectric layer 310, each reinforcement pin 330 is to have to be the cross or the alignment mark 331 of T font without exception, those alignment marks 331 are to be positioned at outside this chip bonding district 311 and to be attached at this pliability dielectric layer 310, have assist in pin engage contraposition, make the effect that is shaped and can promotes the anti-twist deformability of this winding easily.In the present embodiment, this chip bonding district 311 is generally rectangular, and its size is corresponding to a wafer active surface, and those alignment marks 331 are the corner places that are positioned at this chip bonding district 311.In addition, winding 300 of pin joint can include a welding resisting layer 340 in addition in this, covers those pins 320 and those reinforcement pins 330 with the part.This welding resisting layer 340 is to have a perforate 341, and its size is greater than this chip bonding district 311, is to be positioned within this perforate 341 for appearing shape, to be beneficial to the contraposition identification and make those alignment marks 331.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (17)
1. pin engages winding in one kind, it is characterized in that it comprises:
One pliability dielectric layer, it has a component hole;
A plurality of pins, each pin have a junction surface that is suspended in this component hole; And
A plurality of reinforcement pins (stiffening lead), each reinforcement pin are to have to be the cross or the alignment mark of T font without exception, and those alignment marks are to be positioned at the outer of this component hole and to be attached at this pliability dielectric layer.
2. pin engages winding in according to claim 1, it is characterized in that wherein said component hole is generally rectangular, and those alignment marks are the corner places that are positioned at this component hole.
3. pin engages winding in according to claim 2, it is characterized in that the corner, four corners of wherein said component hole is to be arc angle, and each alignment mark is to have a plurality of arc-shaped bend bars corresponding to those corners.
4. pin engages winding in according to claim 1, it is characterized in that it includes a welding resisting layer in addition, covers those pins and those reinforcement pins with the part.
5. pin engages winding in according to claim 4, it is characterized in that wherein said welding resisting layer is to have a perforate, and its size is to be slightly larger than this component hole, is to be positioned within this perforate and for appearing shape and make those alignment marks.
6. pin engages winding in according to claim 1, it is characterized in that wherein said those reinforcement pins and those pins are to be a same layer structure.
7. winding support packaging structure is characterized in that it comprises:
Pin engages winding in one, and it comprises:
One pliability dielectric layer, it has a component hole;
A plurality of pins, each pin have a junction surface that is suspended in this component hole; And
A plurality of reinforcement pins (stiffening lead), each reinforcement pin are to have to be the cross or the alignment mark of T font without exception, and those alignment marks are to be positioned at outside this component hole and to be attached at this pliability dielectric layer;
One wafer, it is in alignment with this component hole of this pliability dielectric layer, and this wafer has plurality of bump, and those junction surfaces of those pins are to be engaged to those projections; And
One adhesive body, it is formed in this component hole of this pliability dielectric layer, to seal those junction surfaces and those projections.
8. winding support packaging structure according to claim 7 is characterized in that wherein said component hole is generally rectangular, and those alignment marks are the corner places that are positioned at this component hole.
9. winding support packaging structure according to claim 8 it is characterized in that the corner, four corners of wherein said component hole is to be arc angle, and each alignment mark is to have a plurality of arc-shaped bend bars corresponding to those corners.
10. winding support packaging structure according to claim 7 is characterized in that wherein said interior pin engages winding and includes a welding resisting layer in addition, covers those pins and those reinforcement pins with the part.
11. winding support packaging structure according to claim 10 is characterized in that wherein said welding resisting layer has a perforate, its size is to be slightly larger than this component hole, is to be positioned within this perforate and for appearing shape and make those alignment marks.
12. winding support packaging structure according to claim 7 is characterized in that wherein said those reinforcement pins and those pins are to be a same layer structure.
13. winding support packaging structure according to claim 7 is characterized in that wherein said adhesive body more coats the alignment mark of those reinforcement pins.
14. pin engages winding in one kind, it is characterized in that it comprises:
One pliability dielectric layer, it has a chip bonding district;
A plurality of pins, it is formed on this pliability dielectric layer, and each pin has a junction surface that extends in this chip bonding district; And
A plurality of reinforcement pins (stiffening lead), it is formed on this pliability dielectric layer, each reinforcement pin is to have to be the cross or the alignment mark of T font without exception, and those alignment marks are to be positioned at outside this chip bonding district and to be attached at this pliability dielectric layer.
15. pin engages winding in according to claim 14, it is characterized in that wherein said chip bonding district is generally rectangular, those alignment marks are the corner places that are positioned at this chip bonding district.
16. pin engages winding in according to claim 14, it is characterized in that it includes a welding resisting layer in addition, covers those pins and those reinforcement pins with the part.
17. pin engages winding in according to claim 16, it is characterized in that wherein said welding resisting layer has a perforate, its size is greater than this chip bonding district, is to be positioned within this perforate and for appearing shape and make those alignment marks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101092415A CN100481429C (en) | 2006-08-03 | 2006-08-03 | Inner pin jointing tape coiling and tape coiling support packaging structure using the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101092415A CN100481429C (en) | 2006-08-03 | 2006-08-03 | Inner pin jointing tape coiling and tape coiling support packaging structure using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101118888A true CN101118888A (en) | 2008-02-06 |
| CN100481429C CN100481429C (en) | 2009-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006101092415A Expired - Fee Related CN100481429C (en) | 2006-08-03 | 2006-08-03 | Inner pin jointing tape coiling and tape coiling support packaging structure using the same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101847617B (en) * | 2009-03-23 | 2011-09-21 | 南茂科技股份有限公司 | Packaging substrate and chip packaging structure |
| CN106601721A (en) * | 2016-12-21 | 2017-04-26 | 颀中科技（苏州）有限公司 | Flip chip packaging structure |
| CN108735850A (en) * | 2017-04-19 | 2018-11-02 | 中国科学院上海微系统与信息技术研究所 | Superconducting nano-wire single-photon detectors with subring and preparation method thereof |
| WO2021027076A1 (en) * | 2019-08-09 | 2021-02-18 | Tcl华星光电技术有限公司 | Chip on film assembly and display panel assembly |
-
2006
- 2006-08-03 CN CNB2006101092415A patent/CN100481429C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101847617B (en) * | 2009-03-23 | 2011-09-21 | 南茂科技股份有限公司 | Packaging substrate and chip packaging structure |
| CN106601721A (en) * | 2016-12-21 | 2017-04-26 | 颀中科技（苏州）有限公司 | Flip chip packaging structure |
| CN106601721B (en) * | 2016-12-21 | 2020-02-04 | 颀中科技（苏州）有限公司 | Flip chip package structure |
| CN108735850A (en) * | 2017-04-19 | 2018-11-02 | 中国科学院上海微系统与信息技术研究所 | Superconducting nano-wire single-photon detectors with subring and preparation method thereof |
| WO2021027076A1 (en) * | 2019-08-09 | 2021-02-18 | Tcl华星光电技术有限公司 | Chip on film assembly and display panel assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100481429C (en) | 2009-04-22 |
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