JP2000048162A - Module for ic card, manufacture thereof, hybrid integrated circuit module and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve voltage resistant characteristics and moisture resistance by making an insulating substrate for IC card integrally molded with a first supporting member and a thermoplastic resin, to be injected thereby covering the back face of the substrate. SOLUTION: A first supporting member is preliminarily molded, and a hybrid integrated circuit substrate 1 is placed thereon, and the first supporting member on which the hybrid integrated circuit substrate 1 is placed is arranged in a metallic mold, and molded with thermoplastic resin 2 again. The injected high- temperature thermoplastic resin 2 comes into contact with the first supporting member, and the surface of the contact part is melted. Therefore, full mold covering the back face of the substrate can be attained. Also, epoxypotting is applied to the leading part of a semiconductor chip and a coil.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, a hybrid integrated circuit device employing a thermoplastic resin having a particularly short solidification time, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Recently, IC cards have been used in various places. For example, starting with a credit card, a ski lift ticket, a train ticket, a swimming pool coupon and the like are also required, and it is desirable that they can be used even under severe conditions.

[0003] However, two types of sealing methods are generally adopted from the viewpoint of cost merit. One is a method in which a lid is put on an insulating substrate on which a circuit element such as a semiconductor element is mounted, which is generally sealed by employing what is called a case. This structure has a hollow structure and a resin is separately injected therein.

[0004] The second is transfer molding, which is famous as a molding method for semiconductor ICs. This transfer mold generally employs a thermosetting resin, raises the mold to about 180 degrees, maintains the temperature to cure (hereinafter, refers to the phenomenon of reacting with heat and polymerizing and solidifying), and thereafter. It is taken out of the mold to form a sealed body. Here, solder is used for mounting the IC chip on the lead frame, but it is generally high-temperature solder, and there is no problem of solder melting.

[0005] However, the sealing structure using the case material has a problem that a margin is provided on the substrate so that the element in the case material does not come in contact with the element in the case material, and the external size becomes large.

On the other hand, the transfer mold has a problem that, as can be understood from the above description, a long time is required for this step because it is cured while applying heat, so that productivity cannot be improved.

Accordingly, the present applicant has focused on a thermoplastic resin which does not take much time. This does not cause a curing reaction,
It melts when heat is applied, and solidifies when cooled (refers to the phenomenon of solidifying without reacting). Therefore, if it cools after injection | pouring, it will solidify and can implement | achieve sealing in a short time. However, when the thermoplastic resin is sealed with, for example, an injection mold, the resin temperature at the time of injection is as high as about 300 ° C., and the solder is melted, thereby causing a failure in the electrical connection of the circuit element mounted on the insulating substrate. There was a problem.

Here, a high-temperature solder may be used, but considering the deterioration of the insulating resin under the conductive pattern, a low-melting-point solder is preferable. Therefore, the present invention will be described below on the assumption that solder of about 180 to 250 degrees is employed.

[0009]

Generally, the back surface of the insulating substrate is exposed, and there is a problem in the insulation between the insulating substrate for the IC card and the mounting chassis (the mounting body of the module for the IC card). Was. I also exposed
At the interface between the back surface of the insulating substrate for the C card and the thermoplastic resin sealing the periphery, there was a problem in moisture resistance due to infiltration of moisture.

When a substrate having poor heat conductivity, for example, a printed substrate, a flexible sheet, a glass substrate, a ceramic substrate, or the like is used, there is a problem that the solder melts.

Further, in the case of full molding using transfer molding, a space is provided between the back surface of the substrate and the mold in order to allow the resin to flow around the back surface of the insulating substrate.
For this reason, the interval is provided by using a pin or sandwiched by a mold. However, in an injection mold using a thermoplastic resin, since the injection pressure is as high as 50 to 200 kg / cm 2, the insulating substrate may be bent or a bonding wire may be used. However, there were problems such as cutting.

Further, there is a problem that the trace of the pin remains at the place supported by the pin and the appearance is deteriorated.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional drawbacks, and firstly, a first support made of a thermoplastic resin having at least an area where a substrate is placed on an upper surface. The problem is solved by having a member and a sealing member made of a thermoplastic resin in which the exposed portion of the first support member is melted and integrated.

Second, a first support member made of a thermoplastic resin having a first groove and a second groove on which the substrate and the coil are mounted on the upper surface, and a substrate is substantially sealed. The problem is solved by having a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated.

In each of the first and second embodiments, the thermoplastic resin is a material which melts when a certain temperature is reached and solidifies when it cools down. Then, it is melted and integrated by receiving the heat of the injected thermoplastic resin. Therefore, the insulating substrate for IC card is
The first support member and the injected thermoplastic resin are integrally molded to cover the back surface of the substrate, thereby improving withstand voltage characteristics and moisture resistance.

Third, the thermosetting resin provided so as to cover the solder and the first substrate so as to substantially seal the substrate.
This problem is solved by having a sealing member made of a thermoplastic resin in which the exposed portion of the supporting member is melted and integrated.

The melting temperature of the thermoplastic resin is about 3
Although the temperature is as high as 00 degrees, by applying the resin to the solder portion, the heat of the directly injected molten resin is not transmitted, and the melting of the solder can be prevented.

Fourth, a first support member made of a thermoplastic resin having a first groove and a second groove on which the substrate and the coil are mounted on the upper surface, and a first support member mounted on the first groove. A substrate having a semiconductor IC electrically connected to a conductive pattern provided on the surface, a coil mounted in the second groove and electrically connected to the conductive pattern on the substrate; Embedded thermosetting resin,
The problem is solved by providing a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated so as to substantially seal the substrate.

In addition to the above-described solder melting prevention, the injection pressure of the thermoplastic resin is, for example, about 50 to 2 for PPS resin.
Although the displacement of the coil and the insulating substrate is as large as 00 kg / cm 2, the displacement can be prevented because the coil and the insulating substrate are buried in the grooves.

Fifth, a first support member made of a thermoplastic resin having at least a region where the substrate is placed on the upper surface and having a means for abutting the mold with the surface, line or point is provided on the side surface. This problem can be solved by providing a sealing member made of a thermoplastic resin in which the exposed portion of the first support member is melted and integrated so as to substantially seal the substrate.

The back surface of the substrate is integrally molded with a thermoplastic resin, so that the withstand voltage characteristics and the moisture resistance can be improved. In addition, if the contact means is provided on the side surface of the first support member, the injected resin can be extended to the side surface or the back surface of the support member, and the exposed area of the first support means can be reduced, and the moisture resistance can be further improved. Can be improved.

Sixth, at least a first groove and a second groove on which the substrate and the coil are mounted on the upper surface, and a side surface having a means for contacting the mold with a surface, a line or a point. A first support member made of a plastic resin, the substrate having a semiconductor IC mounted in the first groove and electrically connected to a conductive pattern provided on the surface, and a substrate mounted in the second groove. A coil electrically connected to the conductive pattern of the substrate, and the first coil so as to substantially seal the substrate.
This problem is solved by having a sealing member made of a thermoplastic resin in which the exposed portion of the supporting member is melted and integrated.

In addition to the above-described effects, a groove is formed and a component is mounted therein, so that there is no deviation of the component even at a high injection pressure peculiar to the thermoplastic resin, and it is possible to prevent defects and the like.

Seventh, the thicknesses of the first support member and the sealing member can be solved by reducing the thickness of the sealing member so as to prevent the first support member from warping. is there.

Even if the molten thermoplastic resin contracts when it solidifies, the strength of the first support member can prevent the IC card module from warping.

Eighth, a substrate having a surface provided with a conductive pattern provided thereon and a semiconductor element or a passive element electrically connected to the conductive pattern is prepared. And the molds and surfaces on the sides,
A first support member made of a thermoplastic resin having means for abutting at a line or a point is held so that the back surface thereof abuts on one mold, and is formed by the one mold and the other mold. The problem is solved by injecting a melted thermoplastic resin into the space, melting the exposed portion of the first support member by the melted heat, and integrally molding the exposed portion.

In order to prepare the first support member in advance,
It is not necessary to adopt a complicated structure such as providing a space on the back surface of the component. Therefore, it is possible to prevent a defect caused by a pressure applied to the insulating substrate, the coil, or the like due to a high injection pressure of the resin. Ninth, a substrate having a conductive pattern provided thereon and having a conductive pattern provided thereon and a semiconductor element or a passive element electrically connected to the conductive pattern is prepared. A first support member made of a thermoplastic resin is held so that the back surface thereof is in contact with one mold, and a molten thermoplastic resin is injected into a space formed by the one mold and the other mold. In order to prevent the warp of the first support member, the problem is solved by integrally forming the first support member so as to be thinner than the thickness of the first support member.

As described above, even if the molten thermoplastic resin contracts when it is solidified, the strength of the first supporting member causes the present thermoplastic resin to shrink.
Tenth and eleventh parts that can prevent warpage of the C card module
The problem can be solved by potting with a first resin that reacts with a material to be sealed (a semiconductor bare chip, a thin metal wire or a coil), and sealing with the thermoplastic resin including this.

Since the first resin reacts with the element to be sealed,
Even if the first support member warps due to heat, no slip occurs.

Twelfth, by subjecting the surface of the sealing member facing the bottom surface of the first support member to satin finish, even if a slight sink occurs due to a groove provided in the support member. , Making it difficult to visually confirm.

Thirteenth, the problem is solved by providing a second groove and installing a coil therein.

Fourteenth, a potting resin for covering the bare chip is provided, a second resin for covering the first groove is provided so that the potting resin surface is not exposed, and the first support member is disposed in a mold. By sealing the first support member with a thermoplastic resin, the injection pressure at the time of sealing directly presses the potting resin to prevent the insulating substrate from being distorted and leading to chip breakage. it can.

[0033]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing embodiments of the present invention, an IC card will be briefly described. Generally, a storage device such as a flash memory and its peripheral circuits are sealed in a thin plastic card in the form of an IC chip or a hybrid. Alternatively, there is an IC in which an IC without a memory is sealed. The memory includes a memory for rewriting and storing data, and a memory for supplying data to a processing device.

Some cards have electrodes exposed by exchanging signals with the processing device, some have connectors attached thereto, and some have a coil sealed and electrodes are not exposed.

Here, description will be made on the case where the last coil is mounted. However, it is needless to say that the present invention can be carried out also on the case where the electrode is exposed or the connector is attached.

Next, the points to focus on when molding with a thermoplastic resin as a plastic card will be briefly described.

Injection molding time The epoxy resin used in the transfer mold needs to be left in the mold during the thermosetting reaction, but the thermoplastic resin can be cooled by simply cooling the resin, and the molding time can be shortened. . In the literature, one cycle of epoxy is 30-18
The time is 0 to 10 seconds for the thermoplastic resin of PPS.

Resin yield The thermosetting type cannot be reused, but the thermoplasticity can be reused by applying heat, and the yield can be improved by collecting and reusing the resin in a runner or the like.

Injection molding conditions Cylinder temperature: substantially the same as the melting temperature of the resin, about 290 to 320 degrees.

Mold temperature: about 140 to 1 for solidification
50 degrees.

If the problem caused by the injection pressure of 50 to 200 kg / cm 2 can be solved, the cost can be greatly reduced.

PPS (polyphenylene sulfide): One of thermoplastic resins This resin has no hydrophilic group and therefore has a water absorption rate that is half of that of epoxy resin, but its adhesion to leads and elements is inferior to that of epoxy resin. .

Here, in the conventional transfer molding, a gap must be provided between the back surface of the substrate and the mold in order to allow the resin to flow around the back surface of the substrate. However, when the thermoplastic resin is molded in this manner, there is a problem that the substrate is warped by the injection pressure. Therefore, as shown in FIG.
Is preliminarily molded, an IC card insulating substrate 2 is mounted thereon, and the first supporting member 1 on which the IC card insulating substrate 2 is mounted is placed in a mold. Then, molding was performed again with the thermoplastic resin 3. The injected high-temperature molten thermoplastic resin 3 hits the first support member 1, and the surface of the hit portion melts. Therefore, full molding covering the back surface of the substrate 2 becomes possible. Hereinafter, an IC card module according to a first embodiment of the present invention will be described with reference to FIGS.

FIG. 1 shows a state in which the IC card insulating substrate 2 and the coil 4 are mounted on the first support member 1.
Shows a cross-sectional view taken along line AA of FIG. FIG. 3 is similar to FIG.
2 shows a state in which a sealing member 3 made of a thermoplastic resin is provided.

First, the first supporting member 1 is molded in advance with a thermoplastic resin, and the coil 4 and an insulating substrate (at least a substrate on which a surface on which a conductive pattern is formed is insulated) are formed thereon. 2 are implemented at least. These mounting components may be fixed by applying an adhesive or the like to the back surface, but here, the first groove 5 and the second groove 6 are formed at the time of molding the first support member 1, The insulating substrate 2 is mounted in the groove 5, the coil 4 is mounted in the second groove 6,
A thermosetting resin, for example, an epoxy resin 7 is applied and protected and fixed. The coil 4 is connected to the electrode 8 of the insulating substrate 2 via solder, and the first groove 5 and the second groove 6 are connected to the lead portion 9 to form the lead portion 9 of the coil. Is continuous through.

The size of the coil (the entire planar area including the hollow portion) differs depending on whether the coil generates a magnetic flux and sends a signal to the other party or receives the magnetic flux and takes a signal. That is, in this case, since the signal is received by the coil, the size of the link formed by the dashed line indicating the coil increases the amount of passing magnetic flux, so that the signal can be easily obtained. For this reason, both the groove and the coil are configured so that a coil having a size as large as possible can be mounted on the substantially rectangular first support member 1. First
If the corners are square as in the case of the support member described above, the insulating coating film of the coil is likely to be broken. Therefore, some corners are chamfered. Here, since the corners are chamfered once, the shape is octagonal.

Here, the insulating substrate for an IC card may be a ceramic, metal, printed board, glass substrate, flexible sheet or the like.

In particular, when a metal substrate or an insulating substrate close to the thermal conductivity of the metal substrate is used as the insulating substrate 2 for an IC card, the temperature of the substrate in the mold is reduced because the injection temperature of the thermoplastic resin 2 is high. Although the temperature rises, it acts as a heat sink, so that the temperature rise on the IC card insulating substrate 2 can be suppressed and the solder formed on the insulating substrate 2 can be prevented from melting.

Although not shown in the drawings, a conductive pattern made of, for example, Cu is formed on the insulating substrate 2, and active elements such as transistors and ICs, and passive elements such as chip resistors and chip capacitors are connected via solder. It is mounted and a predetermined circuit is realized. Here, the solder may be partially connected and may be electrically connected with a silver paste or the like. When the semiconductor element or the like is mounted face-up, it may be connected via a thin metal wire by bonding.

Subsequently, the state shown in FIG. 2 is mounted on a mold, and the molten thermoplastic resin 3 is injected and molded.
Here, the thermoplastic resin 3 for sealing is realized by, for example, injection molding, the injection temperature of the resin is as high as about 300 ° C., and the insulating substrate 2 for IC card having the circuit elements mounted by solder is formed of gold. In the case of being integrally molded by being inserted into a mold, there is a problem that the solder is melted by the injected high-temperature resin and solder failure of the element occurs. In particular, a resin-based printed circuit board is remarkable because of its low thermal conductivity. However, in the present application, since it is covered with the thermosetting resin 7, the heat transfer to the solder can be suppressed, and the melting of the solder can be prevented. Moreover, the use of an epoxy resin can prevent the thin metal wires from slipping. This will be described later. Further, when the first support member 1 is molded with a filler for improving heat conduction in the thermoplastic resin, the first support member 1 itself absorbs heat as a heat sink, and thus further soldering is performed. Can be prevented from melting.

The thermoplastic resin employed here is called PPS (polyphenyl sulfide). The mold temperature is much lower than the mold temperature of the transfer mold, about 130 ° C. or less. The mold is filled with 300 ° C. liquid resin, and quickly cooled and solidified by the lower temperature mold. This cycle is
It takes about 10 to 20 seconds, and can be greatly reduced as compared with the transfer mold cycle (30 to 180 seconds).

As described above, when the IC card insulating substrate 2 on which the circuit elements are mounted is molded with the thermoplastic resin 3,
It is preferable to previously pot the solder joint, the bonding wire and the bare chip with a thermosetting resin 7 (for example, epoxy resin). Further, the thermosetting resin preferably has the same thermal expansion coefficient as that of the insulating substrate for an IC card.

In other words, the above-mentioned countermeasure is that when the thermoplastic resin 3 is molded, the metal wire (100 μm
This is effective to prevent the following) from falling down or breaking. In general, if a thermoplastic resin is used as a sealing material, it is usually considered that the potting resin is also a thermoplastic resin. However, the thermoplastic resin 3 is in close contact with the IC card insulating substrate 2 after molding. It only reacts with the substrate and does not adhere. Therefore, the thermal shock caused the thermoplastic resin 3
Due to the mismatch between the thermal expansion coefficient of the insulating substrate 2 for IC card and the thermoplastic resin 3, stress is generated in the solder connection portion, the wire connection portion including the thin wire and the thick wire,
In particular, since the wire has not reacted with the thermoplastic resin,
Although a wire slip occurs due to the warpage of the substrate and a disconnection or the like occurs, when an epoxy resin is used as the potting resin 7, the slip is prevented because the epoxy resin itself strongly reacts and adheres to the contents of the sealing. Control and solve these problems. Further, at the time of molding, the molten thermoplastic resin 2 does not directly contact the solder, so that a rise in the temperature of the solder portion can be suppressed. When a metal substrate is employed as described above, it acts as a heat sink, but if the resin is further coated on the solder, the melting of the solder can be more reliably prevented. In the case of printed circuit boards and ceramic substrates with poor conductivity, resin is coated on the solder, and by adjusting the thickness of the resin and adjusting the resin injection temperature, the melting of the solder can also be prevented. Enable implementation.

The thermosetting resin 7 also has the following advantages. In other words, if the resin 7 is not provided in the groove, when molded with the thermoplastic resin 3, the surface of the molding member 3 corresponding to the groove will be dented, and a phenomenon called so-called sink will occur, resulting in poor appearance. Further, the strength of the first support member 1 decreases. That is, when the molten thermoplastic resin 3 is injected and solidified, a problem occurs in that the entire apparatus is warped due to shrinkage.
However, since the grooves are covered with the thermosetting resin, sinks can be suppressed and the strength can be improved, and these problems can be solved.
In addition, when sink marks occur and are unsightly, the entire area of one side where the sink marks occur is matted to make it difficult to make a visual judgment.

As is apparent from FIG. 2, a step 9 is provided around the back surface of the first support member 1 to improve the adhesiveness with the injected thermoplastic resin 3.

Further, the first support member 1 which comes into contact with the side surface of the lower mold is provided with means for making surface, line or point contact. In FIG. 3, a semicircular contact means 10 is provided. This contact means 10 has two advantages. One is that a gap is formed between the side surface of the first support member and the side surface of the mold, and there is an advantage that a good resin injection passage is secured in the sealing including the step 9 and the side surface. The second is,
Without the abutting means, not only the gap cannot be formed, but also the side surface is not covered with the thermoplastic resin. That is, when sealing is performed without providing the contacting means, the interface between the first support member and the sealing member 3 made of a thermoplastic resin becomes d, leaving a problem in moisture resistance.
However, as shown in FIG. 3, when the mold is brought into contact with the mold at points and lines, the side surface of the first support member is almost covered with the sealing member. it can. Reference numeral 11 shown in FIG. 4 shows an exaggerated trace of the abutting means after sealing with the sealing member 3. If it is completely a sphere, it is exposed at a substantial point. If a small gap is formed, the portion exposed at the point can be covered thinly.

FIG. 5 shows that the contact means of the first support member 1 is
The type is shown. 10A has a rectangular parallelepiped shape, and is in surface contact with the mold. 10B is obtained by cutting this cube in half and making the side surface triangular, and makes line contact. 10C is obtained by slightly cutting the corner of 10B and making a slight surface contact.

In any case, if there is no contact means, no resin can be formed on the side surface or the step 9. That is, if the contact means is omitted to form a gap, the first support member 1
When the resin is placed in a mold, play occurs, and good molding cannot be performed due to high resin injection pressure.

The thickness of the first support member 1 and the sealing member 3 also becomes a problem. Although the first support member 1 is formed in advance, the sealing member 3 contacts and solidifies with the first support member 1 in the mold. At the time of this solidification, the sealing member shrinks. Therefore, it is necessary to increase the thickness of the first supporting member so that the first supporting member does not bend due to the shrinkage. Conversely, it is necessary to make the sealing member 3 thin.

Next, a second embodiment will be briefly described with reference to FIGS. The former shows the shape of the support member 1, and FIG. 7 shows a case where the coil 4 and the IC 7 are mounted thereon and sealed with a thermoplastic resin. In the first embodiment,
Although the first groove and the second groove having a substantially rectangular parallelepiped cross section are formed, in the present embodiment, the groove is formed by providing the protruding wall 20 such as a castle wall. With such an uneven shape, the contact surface with the sealing resin is widened, and the sealing strength and the moisture resistance can be improved. However, because of the unevenness, sink marks are generated. To prevent this, it is necessary to apply a thermosetting resin to the entire surface.

As can be said in both embodiments, the step 9
Is provided, the adhesiveness with the resin to be injected is improved. However, since the first support member 1 is made of a thermoplastic resin, when the resin is attached to a mold and injected with a resin, the stepped portion here is formed. Due to the presence of the gap, a problem of deformation may occur. Therefore, the problem can be solved by attaching the protrusion having the same plane as the back surface of the first support member, that is, the warp preventing means to the step. The size, shape and number of IC
The size is determined in consideration of the size of the card module, the injection pressure, and the like.

In addition, in order to cope with the need for the external heat radiation, the filler for improving the thermal conductivity is mixed in the first support member in consideration of the temperature rise of the substrate due to the injected resin 3. Is also good. For example, alumina, Si or the like is mixed. Further, like the transfer mold of the transistor chip, the resin is also turned on the back surface of the island fixed to the transistor.
If a gap is provided on the back surface and the resin for the first support member is injected by trying to integrally mold the insulating substrate for C card 2 and the mold together, heat is excellent and the heat is absorbed by the mold during molding.
There is also a problem that it does not cover the entire back surface of the substrate. Therefore, it is important to prepare the first support member in advance and mount the mounting component on the first support member. In addition, the injection resin 3 has this problem, and conversely, a thermoplastic resin into which no filler is mixed is used. This is because the heat of the injected resin 3 is removed by the mold and solidified in the middle of the IC card insulating substrate.

Finally, the mold will be briefly described with reference to FIG. The upper drawing is a perspective view of the completed IC card module, and the lower drawing shows a drawing pushed out by the protruding pins of the surface pressing structure. Code 3
Reference numeral 0 denotes a lower mold, and the contact means 10 attached to the first support member is in contact with the mold side surface 31. Then, an upper mold (not shown) is closed to form a sealed space, into which a molten thermoplastic resin is injected. The injected resin is injected from between the contacting means 10 and 10 to the step 9 and is solidified by the temperature of the mold. The extrusion pin is a pin 32 having a surface-pushed structure, since a trace is left if it is a thin pin. Although the contact means 10 has a semi-circular shape, some traces remain, but the matte finish can make the traces inconspicuous. The recess 33 is a portion where a seal or the like used by the user is stuck.

FIG. 8 shows a structure in which the mounting area of the insulating substrate 2 of FIG. 1 is arranged at a corner of the first support member, and has a structure in which a bending force is not applied to the insulating substrate. For example, if the completed module is placed in the back pocket, it will bend, and will almost always bend in the center. Therefore, this one-quarter of the area inside the coil (the square area
If the insulating substrate can be arranged smaller than / 4, even if the module is bent, the insulating substrate which is a circuit board is not affected. 40 is a potting resin covering the semiconductor chip, 41 is a potting resin covering the lead-out area of the coil, and 42 is a guide for preventing the lead-out coil from being short-circuited. Reference numeral 43 denotes a stopper that restricts the movement of the coil.

FIG. 9 is a sectional view taken along line AA of FIG. 8, in which the potting resin 40 covers the semiconductor chip 45 and the grooves are further covered with the epoxy resin 44. Here, if the epoxy resin 44 does not completely cover the potting resin 40, when sealing the thermoplastic resin, a pressure peculiar to the injection is applied at a portion indicated by an arrow, and a phenomenon that the semiconductor chip is broken occurs. That is, the pressure is concentrated on the potting portion indicated by the arrow, and when the potting portion is completely covered with the epoxy resin 44, the pressure does not concentrate only on the potting portion, so that cracking of the chip could be prevented.

[0066]

As described above, first, since the thermoplastic resin is a material that melts when it reaches a certain temperature and solidifies when it cools down, it is molded by the thermoplastic resin that is placed in a mold in advance. The first support member is melted and integrated by receiving the heat of the injected thermoplastic resin. Therefore, the insulating substrate for the IC card is integrally molded with the first support member and the injected thermoplastic resin, and can cover the back surface of the substrate,
Withstand voltage characteristics and moisture resistance can be improved.

Second, although the injection pressure of the thermoplastic resin is large, the mounting parts do not shift or break due to the formation of the grooves.

Third, since the solder of the conductive pattern on the insulating substrate for IC is covered with the resin, the melting temperature of the thermoplastic resin is:
Although the temperature is as high as about 300 degrees, the heat of the directly injected molten resin is not transmitted, so that the melting of the solder can be prevented.

Fourth, in addition to the above-described prevention of solder melting,
The injection pressure of the thermoplastic resin is, for example, about 50 to 200 Kg / cm2 in the case of PPS resin, and a displacement of the coil and the insulating substrate is generated. Can be stopped.

Fifth, since the thermoplastic resin is a material that melts when it reaches a certain temperature and solidifies when it cools down, the first support member that is molded from the thermoplastic resin that has been placed in the mold in advance It is melted and integrated by receiving the heat of the injected thermoplastic resin.

Accordingly, the insulating substrate for the IC card is integrally molded with the first supporting member and the injected thermoplastic resin, can cover the back surface of the substrate, and can improve withstand voltage characteristics and moisture resistance.

Sixth, although the injection pressure of the thermoplastic resin is large, the formation of the groove prevents the mounted component from shifting or breaking.

Seventh, since the solder of the conductive pattern of the insulating substrate for IC is covered with the resin, the melting temperature of the thermoplastic resin is:
Although the temperature is as high as about 300 degrees, the heat of the directly injected molten resin is not transmitted, so that the melting of the solder can be prevented.

Eighth, in addition to the above-described prevention of solder melting,
The injection pressure of the thermoplastic resin is, for example, about 50 to 200 Kg / cm2 in the case of PPS resin, and a displacement of the coil and the insulating substrate is generated. Can be stopped.

Ninth, since the thermoplastic resin is a material that melts when it reaches a certain temperature and solidifies when it cools down, the first support member that is molded from the thermoplastic resin that has been placed in the mold beforehand, It is melted and integrated by receiving the heat of the injected thermoplastic resin. Therefore, the insulating substrate for an IC card is integrally molded with the first support member and the injected thermoplastic resin, can cover the back surface of the substrate, and can improve withstand voltage characteristics and moisture resistance.

Tenth, although the injection pressure of the thermoplastic resin is large, since the grooves are formed, the mounted components do not shift or break.

Eleventh, since the solder of the conductive pattern of the insulating substrate for IC is covered with the resin, the melting temperature of the thermoplastic resin is as high as about 300 ° C., but the heat of the directly injected molten resin is transmitted. And melting of the solder can be prevented.

Twelfth, in addition to the above-described prevention of melting of the solder, the injection pressure of the thermoplastic resin is, for example, about 50 to 200 Kg / cm 2 in the case of a PPS resin. Since it is buried in the groove, the gap can be prevented and sealing can be performed.

Thirteenth, potting is performed with a first resin (here, epoxy resin) that reacts with a material to be sealed (semiconductor bare chip, metal thin wire, or coil), and the potting is performed by sealing with the thermoplastic resin. Therefore, no slip occurs even if the first support member warps due to heat.

Fourteenth, by applying a satin finish to the surface of the sealing member where sink marks are generated, which face the bottom surface of the first support member, it is possible to make it difficult to visually confirm.

Fifteenth, a potting resin for covering the bare chip is provided, a second resin for covering the first groove is provided so that the surface of the potting resin is not exposed, and the first support member is disposed in a mold. And the first resin is made of a thermoplastic resin.
By sealing the supporting member, the injection pressure at the time of sealing does not directly press the potting resin, so that breakage of the chip can be prevented.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a first embodiment of the present invention, in which a mounted component is attached to a first support member.

FIG. 2 is a cross-sectional view taken along line AA of FIG.

FIG. 3 is a view illustrating a hybrid integrated circuit module according to the first embodiment of the present invention, in which the first support member in FIG. 2 is molded with a sealing member.

FIG. 4 is a diagram illustrating a state in which a first support member is mounted on a mold.

FIG. 5 is a view for explaining a contact means.

FIG. 6 is a view illustrating a first support member according to a second embodiment of the present invention.

FIG. 7 is a diagram of a hybrid integrated circuit module using the first support member of FIG. 6;

FIG. 8 is a diagram illustrating a support member obtained by slightly modifying the first support member of FIG. 1;

FIG. 9 is a diagram illustrating a problem that occurs in the potting structure of the semiconductor chip.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 first support member 2 insulating substrate 3 sealing member 4 coil 5 first groove 6 second groove 7 thermosetting resin 8 electrode on insulating substrate 9 coil lead-out part 10 contact means 11 contact Traces of means 40 Potting resin

Continued on front page F term (reference) 2C005 MA10 MA11 NA36 NB34 PA27 RA07 4M109 AA02 BA04 BA05 CA02 CA21 DA07 DB07 EA02 EA12 EB12 GA02 GA03 5B035 AA04 BA05 BB09 CA23 5F061 AA02 BA04 BA05 CA02 CA21 CB03 CB04 FA02 FA03

Claims (14)

[Claims] A first support member made of a thermoplastic resin having at least a region where the substrate is placed on the upper surface; and a first support member mounted on the region and electrically connected to a conductive pattern provided on the surface. A substrate having a semiconductor IC; and a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated so as to substantially seal the substrate. Module for IC card. 2. A first support member made of a thermoplastic resin having at least a first groove and a second groove on which a substrate and a coil are mounted on an upper surface; and a first support member mounted on the first groove and having a surface. A substrate having a semiconductor IC electrically connected to the conductive pattern provided on the substrate; a coil mounted in the second groove and electrically connected to the conductive pattern on the substrate; And a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated. 3. A first support member made of a thermoplastic resin having at least a first groove and a second groove on which a substrate and a coil are mounted on an upper surface, and a first support member mounted on the first groove and having a surface. A substrate having a semiconductor IC electrically connected to the conductive pattern provided on the substrate; a coil mounted in the second groove and electrically connected to the conductive pattern of the substrate via solder; A thermosetting resin provided to cover the solder; and a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated so as to substantially seal the substrate. An IC card module, characterized in that: 4. A first support member made of a thermoplastic resin having at least a first groove and a second groove on which a substrate and a coil are mounted on an upper surface, and a first support member mounted on the first groove and having a surface. A substrate having a semiconductor IC electrically connected to the conductive pattern provided on the substrate; a coil mounted in the second groove and electrically connected to the conductive pattern on the substrate; And a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated so as to substantially seal the substrate. IC card module. 5. A first support member made of a thermoplastic resin having at least a region where the substrate is placed on the upper surface, and having, on a side surface thereof, means for contacting the mold with a surface, a line or a point, The substrate having a semiconductor IC mounted on the region and electrically connected to the conductive pattern provided on the surface; and an exposed portion of the first support member being fused and integrated so as to substantially seal the substrate. And a sealing member made of a thermoplastic resin. 6. A thermoplastic resin having at least a first groove and a second groove on which a substrate and a coil are mounted on an upper surface, and having means for abutting a surface, a line, or a point on a mold on a side surface. A first support member comprising: a substrate having a semiconductor IC mounted in the first groove and electrically connected to a conductive pattern provided on a surface; and a substrate mounted in the second groove; A coil electrically connected to the conductive pattern of the substrate, and a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated so as to substantially seal the substrate. A module for an IC card, comprising: 7. The thickness of the first support member and the sealing member is set so that warpage of the first support member can be prevented.
7. The device according to claim 6, wherein the thickness of the sealing member is reduced.
The module for an IC card described in the above. 8. A substrate whose surface is insulated, and a substrate having a conductive pattern provided thereon and a semiconductor element or a passive element electrically connected to the conductive pattern is prepared, and the substrate is mounted, On the side surface, a first support member made of a thermoplastic resin having means for abutting on a surface, a line, or a point with the mold is held so that the back surface of the first support member abuts on the one mold. A molten thermoplastic resin is injected into a space defined by the mold and the other mold, and the exposed portion of the first support member is melted and molded integrally with the melted heat. Manufacturing method of card module. 9. A substrate whose surface is insulated, and a substrate having a conductive pattern provided thereon and a semiconductor element or a passive element electrically connected to the conductive pattern is prepared, and the substrate is mounted. First made of thermoplastic resin
Holding the supporting member so that its back surface is in contact with one of the molds, injecting a molten thermoplastic resin into a space formed by the one mold and the other mold, A method for manufacturing a hybrid integrated circuit module, comprising: integrally molding the support member so as to be thinner than the first support member so as to prevent the support member from warping. 10. A first support member made of a thermoplastic resin having at least a region where a substrate is placed on an upper surface, and a first support member mounted on the region and electrically connected to a conductive pattern provided on a surface. A substrate having a semiconductor IC; and a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated so as to substantially seal the substrate. The mounted semiconductor bare chip is mounted face-up or face-down, and in the case of face-up, the chip including the thin metal wire connected to the conductive path is potted with a first resin that reacts with the material to be sealed, A hybrid integrated circuit module in which a chip is potted with a first resin in a face-down mode, and the chip is sealed with the thermoplastic resin including the chip. 11. A first support member made of a thermoplastic resin having a first groove and a second groove on which at least a substrate and a coil are mounted on an upper surface, and a first member mounted on the first groove and having a surface. A substrate having a semiconductor bare chip electrically connected to the conductive pattern provided on the substrate; a coil mounted in the second groove and electrically connected to the conductive pattern on the substrate; And a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated, and a connection portion of the coil and a lead portion of the coil in the conductive pattern are provided. A hybrid integrated circuit module, wherein the module is potted with a first resin that reacts with a material to be sealed. 12. A first support member made of a thermoplastic resin having a first groove on which a substrate is mounted on an upper surface, and a conductive pattern mounted on the first groove and provided on a surface thereof, and And a sealing member made of a thermoplastic resin in which an exposed portion of the first support member is melted and integrated so as to substantially seal the substrate. The surface of the sealing member facing the bottom surface of the first support member is matte-finished. 13. The hybrid integrated circuit module according to claim 12, wherein said first support member has a second groove in which a coil is mounted. 14. A semiconductor bare chip having a first support member made of a thermoplastic resin having a first groove on which a substrate is mounted on an upper surface and electrically connected to a conductive pattern provided on the surface. Is mounted on the first support member, a potting resin is provided to cover the bare chip, and the first resin is so exposed that the surface of the potting resin is not exposed.
Providing a second resin covering the groove of (a), disposing the first support member in a mold, and sealing the first support member with a thermoplastic resin. .