JP4548074B2 - IC tag for cleaning - Google Patents

Description

  The present invention relates to a cleaning IC tag to be attached to a cleaning garment and the like, and in particular, to automatically identify the cleaning garment and the like and to be used for process management, sorting work and inventory management in a laundry factory. The present invention relates to a cleaning IC tag having excellent solvent resistance and heat resistance.

  In recent years, RF (with a built-in data carrier system capable of non-contact writing and reading of various data by radio wave communication from the outside as a tag for identifying and managing the article by attaching it to an article such as a product or baggage Individual identification systems using radio frequency (ID) tags are known, and management of goods such as logistics, distribution, FA (Factory Automation), products, goods such as luggage, or individual identification information such as unique identification numbers It has come to be widely used for traceability and security, such as identifying authenticity and identifying distribution channels.

  In particular, record information such as cleaning clothes received from customers (request date, requester, contents of clothes, return date, request for cleaning, etc.) and transmit it to the laundry factory. Management of a series of operations until returning to a customer is performed by an identification device attached to a cleaning garment or the like (see, for example, Patent Document 1).

However, in the identification device, a bag-shaped film container for accommodating the identification device is attached in advance to a predetermined place such as clothing, and then the identification device is accommodated in the film container.
In this way, if the identification device and the storage container into which the identification device is placed are separated, the both end openings are sealed by bonding, sewing, etc. after putting the identification device (data carrier) in the storage container, Problems may occur in water resistance and solvent resistance depending on the time and effort required for sealing and depending on how to bond and sew.
JP-A-11-180545

  The present invention automatically identifies clothes for cleaning, etc., and is used for cleaning of a monolithic structure excellent in water resistance, solvent resistance, and heat resistance used for process management, sorting work and inventory management in a laundry factory. An object is to provide an IC tag.

In order to solve the above-mentioned problems in the present invention, first, in claim 1, an IC chip (26) and a radio communication antenna coil (25) are mounted on at least an insulating base material (21), and an opening is formed in the central portion. An IC tag inlet (20) provided with a portion (22), a storage portion (14) for storing the IC tag inlet (20), a side wall (12) surrounding the storage portion (14), and a side wall (12) A cleaning IC tag comprising a tray (10) having a projection (13) and an attachment portion (11) provided on the inside, and an embedded resin (30), wherein the tray (10) The IC tag inlet (20) is set so as to be sandwiched between the storage portion (14) and the protrusion (13), and a liquid resin is poured into the embedded resin (30) to form an integrated structure. Characteristic It is obtained by the Ningu for IC tag.

According to a second aspect of the present invention, the cleaning IC tag according to the first aspect is characterized in that the storage portion (14) is roughened .

According to a third aspect of the present invention , there is provided the cleaning IC tag according to the first or second aspect, wherein an adhesive reinforcing layer is provided on the surface of the storage portion (14) .

By attaching the cleaning IC tag of the present invention to clothes and the like and performing a series of operations such as cleaning, it becomes possible to automatically identify, manage and sort the cleaning clothes and the like.
Further, since the protrusion for preventing the warping of the IC tag inlet is provided inside the side wall of the tray, a stable set state can be reproduced when the IC tag inlet is set in the tray storage portion.
In addition, since the cleaning IC tag of the present invention is excellent in water resistance, solvent resistance, and heat resistance, the IC tag recognition work after the washing work can be performed in a stable state.

FIG. 1 is an explanatory view showing an embodiment of the cleaning IC tag of the present invention.
1A is a plan view of the cleaning IC tag 100 of the present invention, and FIG. 1B is a schematic configuration in which the cleaning IC tag 100 of the present invention of FIG. 1A is cut along the line AA ′. Cross-sectional views are shown respectively.
FIG. 2 is an explanatory view showing an embodiment of the tray.
2A is a plan view of the tray 10, and FIG. 2B is a schematic cross-sectional view of the tray 10 cut along the line AA ′.
FIG. 3 is an explanatory view showing an embodiment of the IC tag inlet.
3A is a plan view of the IC tag inlet 20, and FIG. 3B is a schematic cross-sectional view of the IC tag inlet 20 cut along the line AA ′.

  The cleaning IC tag 100 according to the present invention includes a mounting portion 11, a side wall 12, a tray 10 including a protrusion 13 and a storage portion 14 inside the side wall 12 (see FIGS. 2A and 2B), an insulating base material. 21 includes an IC tag inlet 20 including an antenna coil 25 and an IC chip 26, and an embedded resin 30. The IC tag inlet 20 is set in the storage portion 14 of the tray 10, and a liquid resin is poured therein. Thus, it has an integrated structure in which the embedded resin 30 is formed.

The tray 10 is made by melting and kneading a resin composition made of polyamide resin, polyester resin, silicon resin, polystyrene resin, polyphenine ether resin, and the like and a non-conductive inorganic filler, and producing pellets by injection molding. The tray 10 having the attachment portion 11 for attachment to the side wall 12, the side wall 12, the protrusion 13 and the storage portion 14 inside the side wall 12 is produced.
By mixing the non-conductive inorganic filler, the heat resistance and dimensional stability of the tray 10 can be improved. As the non-conductive inorganic filler, talc, mica, glass fiber, silica alumina, calcium carbonate and the like can be used, and the blending amount is preferably 30 to 60 parts by weight with respect to 100 parts by weight of the resin composition.

  In addition, an attachment portion 11 for clothing or the like is provided on the peripheral portion of the tray 10 so that the cleaning IC tag 100 of the present invention can be easily attached when it is attached by sewing or the like. As a structure of the attachment part 11 to clothes etc., the groove | channel 11a was formed in the predetermined position of the attachment part 11 as shown in FIG. 4 so that it might be easy to sew to clothing etc., or the attachment part 11 as shown in FIG. There is one in which a hole 11b is formed at a predetermined position. The groove 11a and the hole 11b are produced when the trays 10a and 10b are molded.

The IC tag inlet 20 is formed by forming an antenna coil 25 on a flexible insulating substrate 21 made of a film or sheet of polyester resin, epoxy resin, polyimide resin or the like and mounting an IC chip 26.
The antenna coil 25 and the IC chip 26 are electrically connected to form a resonance circuit so that individual identification information can be exchanged with an external reader / writer.
Furthermore, a rectangular opening 22 is formed in the substantially central portion of the IC tag inlet 20. Regarding the function and effect of the opening 22, the IC tag inlet 20 is set in the storage portion 14 of the tray 10, and when the liquid resin is poured, the liquid resin can easily enter between the IC tag inlet 20 and the storage portion. Thus, a uniform resin film can be easily formed.

As a method for forming the antenna coil 25, for example, a resist pattern is formed on a copper foil of a polyimide tape with a copper foil, and the copper foil is etched with a corrosive solution made of iron chloride solution or the like using the resist pattern as a mask. The resist pattern is peeled off to form the antenna coil 25 on the insulating base material 21. Here, in order to align the electrodes at both ends of the antenna coil 25 and the bump electrodes of the IC chip, an insulating layer, vias, and conductor wiring are formed in a build-up process to bridge one electrode of the antenna coil, An operation for aligning the electrodes at both ends of the antenna coil 25 at the IC chip mounting position is performed. Further, nickel and a gold film are formed on the electrodes at both ends of the antenna coil 25.
The size (number of turns, width, thickness, etc.) of the antenna coil is appropriately set in consideration of the design of the resonance circuit.

As another method for forming the antenna coil 25, for example, a conductive paste is printed on the insulating base material 21 made of polyimide tape or the like by screen printing, an ink jet method, or the like, and then heated and cured to form the antenna coil 25. To do. Here, in order to align the electrodes on both ends of the antenna coil 25 and the IC chip bump, an insulating layer, vias, and conductor wiring are formed by a build-up process to bridge one electrode of the antenna coil, and the IC chip The operation for aligning the electrodes on both ends of the antenna coil 25 at the mounting position of is performed. Further, nickel and a gold film are formed on the electrodes at both ends of the antenna coil 25.
The size (number of turns, width, thickness, etc.) of the antenna coil is appropriately set in consideration of the design of the resonance circuit.

  As another method for forming the antenna coil 25, for example, a loop-shaped coil is produced with an insulated conductor, and the loop-shaped coil is fixed on an insulating base material 21 made of polyimide tape or the like with an adhesive or the like. Thus, the antenna coil 25 is formed. Here, nickel and a gold film are formed on the electrodes at both ends of the antenna coil 25, and the electrode positions at both ends of the antenna coil 25 are formed at the same pitch as the bumps of the IC chip.

In order to electrically connect the electrode of the antenna coil 25 and the bump of the IC chip 26 on the insulating substrate 21, the IC chip 26 is mounted by face-down bonding or wire bonding, and finished to a predetermined size, The IC tag inlet 20 in which the opening 22 is formed is produced.
Here, the opening 22 is formed by die cutting or the like during the outer shape finishing process, but a laser process such as a carbon dioxide laser, an excimer laser, or a UV-YAG laser processing machine may be used.

The IC tag inlet 20 is set in the storage section 14 of the tray 10, a liquid resin is poured into the storage section 14 of the tray 10, and the resin is heated and cured at a predetermined temperature to form the embedded resin 30. Can be sealed in a tray to obtain the cleaning IC tag 100 of the present invention (see FIGS. 1A and 1B).
Here, examples of the liquid resin include silicon resin, epoxy resin, polyimide resin, phenol resin, polyurethane resin, furan resin, aniline resin, and polyolefin resin.
In the present invention, since the protrusion 13 for preventing the warping of the IC tag inlet 20 is provided inside the side wall 12 of the tray 10, the IC tag inlet 20 can be mounted even if the IC tag inlet 20 is warped. It can be held in a stable state in the tray and sealed with resin.

Here, the IC tag inlet 20 having the opening 22 is set in the storage portion 14 of the tray 10, a liquid resin is poured into the storage portion 14 of the tray 10, and the resin is heated and cured at a predetermined temperature to form the embedded resin 30. The behavior of the IC tag inlet 20 and the resin when the IC tag inlet 20 is resin-sealed in the tray will be described.
Here, the IC tag inlet 20a having no opening is set in the storage portion 14 of the tray 10, a liquid resin is poured into the storage portion 14 of the tray 10, and the resin is heated and cured at a predetermined temperature to form the embedded resin 30. When the IC tag inlet 20 is resin-sealed in the tray, a bubble or an air layer is formed between the IC tag inlet 20a and the storage portion 14 of the tray 10 as shown in FIG. When the IC tag is heated, the air bubbles or the air layer expands, and the embedded resin 30 is cracked, so that the solvent resistance may be deteriorated or the IC tag may be damaged.

On the other hand , since the IC tag inlet 20 used in the cleaning IC tag of the present invention has an opening 22 at substantially the center of the IC tag inlet 20, the IC tag inlet 20 is set and the tray 10 is stored. When the liquid resin is poured into the portion 14, the liquid resin is almost uniformly infiltrated from the periphery of the IC tag inlet 20 and the periphery of the opening portion 22, and between the IC tag inlet 20 and the storage portion 14 of the tray 10. A resin layer is formed, and bubbles or the like are not generated between the IC tag inlet 20 and the storage portion 14 of the tray 10.

Further, in order to improve the adhesive strength between the embedded resin 30 and the storage portion 14 of the tray 10, the storage portion 14 of the tray 10 is roughened.
Examples of the surface roughening treatment include roughening the surface corresponding to the storage portion 14 of the mold for producing the tray 10 in advance, or roughening the storage portion 14 of the tray 10 by sandblasting, liquid honing, or the like. .

Further, in order to improve the adhesive strength between the embedded resin 30 and the storage portion 14 of the tray 10, an adhesive reinforcing layer can be formed on the surface of the storage portion 14 of the tray 10.
As a method for preparing the adhesion reinforcing layer, a liquid resin solution using polyester-isocyanate, phenol resin-butyral, phenol resin-nitrolyl rubber, modified epoxy resin, silicon-based RTV or the like as a main material is brush-coated on the storage portion 14 of the tray 10. Alternatively, a transfer film in which an adhesive layer having a predetermined thickness is separately formed is prepared, and the adhesive layer is formed by a method such as transferring the adhesive layer of the transfer film to the storage portion 14 of the tray 10, and then heated and cured. Then, an adhesion reinforcing layer is formed.
The thickness of the adhesive reinforcing layer is about 0.5 to 3 μm.

First, a rubber compound is mixed with a cross-linking material or a pigment, and the thickness is adjusted while heating with an oven roll, and then cut into strips. This small piece was formed by an injection molding machine, and a mounting portion 11 having a groove 11a, a side wall 12, and a tray 10a including a projection 13 and a storage portion 14 inside the side wall 12 were produced (FIGS. 4A and 4B). )reference).
Further, the storage unit 14 was roughened by sandblasting.

Next, a 16 μm thick copper foil with an adhesive is laminated on an insulating base material 21 made of a polyester film having a thickness of 10 to 200 μm, a dry film is stuck on the copper foil to form a photosensitive layer, pattern exposure, A series of patterning processes such as development were performed to form a resist pattern. Using the resist pattern as a mask, the copper foil was etched with an etching solution made of ferric chloride to produce an antenna coil 25. Furthermore, an insulating layer, a via, and a conductor wiring were formed by a build-up process to bridge one electrode of the antenna coil, and nickel and gold plating were applied to the electrode portion of the antenna coil.

  Next, the IC chip 26 is mounted by face-down bonding, and the outside size processing and the opening 22 are formed by die cutting to produce the IC tab inlet 20 (see FIGS. 3A and 3B). ).

Next, the IC tab inlet 20 is set in the storage portion 14 of the tray 10a, and a liquid resin made of any one of silicon resin, epoxy resin, polyimide resin, phenol resin, polyurethane resin, furan resin, aniline resin, polyolefin resin, and the like. The embedded resin 30 was formed by heating and curing at a predetermined temperature, and the IC tag inlet 20 was resin-sealed in the tray to obtain the cleaning IC tag 100 of the present invention.
Here, compression molding may be performed.

  As a result of having the cleaning IC tag 100 of the present invention attached to cleaning items such as Y-shirts, trousers, skirts, coats, jackets, etc. received from customers and performing laundry in a laundry factory, before washing, during washing, after selection It was confirmed that the individual information recognition of the IC tag by non-contact by the reader / writer can be performed without any problem, and the cleaning IC tag 100 of the present invention was confirmed to have sufficient water resistance, solvent resistance, and heat resistance. .

It is explanatory drawing which shows one Example of the IC tag for cleaning of this invention. (A) is a top view which shows IC tag 100 for cleaning of this invention. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows one Example of the tray which is a component of the IC tag for cleaning of this invention. FIG. 2A is a plan view of the tray 10. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows one Example of the IC tag inlet which is a component of the IC tag for cleaning of this invention. FIG. 3A is a plan view of the IC tag inlet 20. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows the other Example of the tray which is a component of the IC tag for cleaning of this invention. (A) is a top view of tray 10a. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows the other Example of the tray which is a component of the IC tag for cleaning of this invention. (A) is a top view of tray 10b. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows an example of the IC tag for cleaning using IC tag inlet 20a which does not have an opening part.

Explanation of symbols

10, 10a, 10b ... Tray 11 ... Mounting part 11a ... Groove 11b ... Hole 12 ... Side wall 13 ... Protrusion 14 ... Storage part 20 ... IC tag inlet 20a ... IC tag having no opening Inlet 21 ... Insulating substrate 22 ... Opening 25 ... Antenna coil 26 ... IC chip 30 ... Embedded resin

Claims (3)

An IC tag inlet (20) in which an IC chip (26) and an antenna coil (25) for wireless communication are mounted on at least an insulating base (21), and an opening (22) is provided in the center ;
A storage part (14) for storing the IC tag inlet (20), a side wall (12) surrounding the storage part (14), a protrusion (13) provided on the inner side of the side wall (12), and a mounting part (11) A cleaning IC tag composed of a tray (10) having an embedded resin and an embedded resin (30),
The IC tag inlet (20) is set so as to be sandwiched between the storage portion (14) of the tray (10) and the protrusion (13), and a liquid resin is poured to form the embedded resin (30). A cleaning IC tag characterized by an integrated structure.  The cleaning IC tag according to claim 1, wherein the storage portion (14) is roughened. The cleaning IC tag according to claim 1 or 2, wherein an adhesive reinforcing layer is provided on a surface of the storage portion (14) .

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