JP2008310387A - Ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag which can be used even under a harsh environment which is heavily damaged by heat than a conventional use environment. <P>SOLUTION: This IC tag is provided with an IC inlet 3 including an IC chip 14 storing electronic information; a resin-made sealing member 30 for sealing the IC inlet; and an inorganic material-based heat-insulating member 40 formed so that the resin-made sealing member can be covered as a whole, and configured of an inorganic material-based powder. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC tag in which electronic information about an article is stored. More particularly, the present invention relates to an IC tag used in an environment that is thermally harsher than the environment in which the IC tag is generally used.

  Conventionally used general IC tags are attached to resin tableware, containers, trays, and the like, and are in a thermally harsh environment of about −20 ° C. to + 80 ° C., that is, relatively mild. It is designed to be used in an environment. Therefore, there is an aspect that heat resistance in IC tags has not been a problem. On the other hand, when embedding IC tags in tableware, containers, trays, etc. by in-mold molding, even if temporary, IC tags are exposed to relatively severe environments thermally by in-mold molding. It is necessary to consider heat resistance in a short time.

  In-mold molding is to integrally mold a resin-molded article and an IC inlet by injecting molten resin with the IC inlet set in a mold for resin molding. At the time of in-mold molding, the IC inlet is required to have a certain degree of heat resistance because the IC inlet is exposed to a high-temperature molten resin even for a short time.

  In order to give heat resistance to the IC inlet, tableware is produced by in-mold molding with the IC inlet embedded in the resin coating layer (see, for example, Patent Document 1) or in contact with the molten resin. There has been proposed an IC tag (see, for example, Patent Document 2) in which a protective layer is provided on the surface of the side IC inlet so as to avoid direct contact with the molten resin.

  In any of the conventional techniques, it is configured for the purpose of avoiding thermal damage that occurs when a high-temperature molten resin comes into contact with the IC inlet for a relatively short time, and a coating layer made of a resin, The IC inlet is protected by a protective layer made of resin film or paper.

  However, since such a covering layer and a protective layer are basically composed of a material having poor heat resistance such as a resin material, when exposed to a high temperature around 200 ° C. for a long time, the heat insulating member Does not work as effectively.

Japanese Patent Laid-Open No. 08-56799 JP-A-2005-332116

  Therefore, a technical problem to be solved by the present invention is to provide an IC tag that can be used even in a harsh environment in which thermal damage is greater than that in the conventional usage environment.

Means for solving the problems and their actions and effects

  In order to solve the above technical problem, the IC tag according to the present invention has the following features.

That is, the IC tag according to the present invention is
An IC inlet including an IC chip in which electronic information is stored;
A resin sealing member for sealing the IC inlet;
And an inorganic material heat insulating member made of an inorganic material powder, which is formed so as to entirely cover the resin sealing member.

  Since the inorganic material-based heat insulating member is composed of inorganic material-based powder, generally, a slurry is prepared by mixing inorganic material-based powder with water and binder, and molded to cover the IC inlet entirely with the slurry. A step of solidifying them in a state of being carried out. Therefore, the IC inlet may come into contact with water in the manufacturing process of the inorganic material heat insulating member. In addition, since it is extremely difficult to completely eliminate the generation of pores and cracks in the completed inorganic material-based heat insulating member, water may enter the inside from time to time. However, it is never preferable that the IC inlet contacts water. Therefore, in the present invention, in addition to providing the inorganic material heat insulating member, the IC inlet is sealed with a resin sealing member in order to prevent the IC inlet from coming into contact with water. By covering the IC inlet sealed with the resin sealing member with an inorganic material heat insulating member, an IC tag having heat resistance and water resistance can be provided. The heat resistance in this application means that it can withstand a high temperature of about + 200 ° C. for 10 hours or more (withstand high heat), and can withstand a low temperature of about −80 ° C. for 10 hours or more (withstand cold). Means.

  The IC inlet is sealed by a resin sealing member. In-mold molding of a resin that integrally forms a molten resin and an IC inlet in a mold, a resin film in which an IC inlet is placed in a resin film bag and the mouth of the bag is welded It is preferably performed by welding and embedding in a bag or by embedding in a resin-molded capsule in which an IC inlet is placed in a pair of resin-molded capsules and the molded capsule is sealed.

  In order to impart high heat insulating properties, the inorganic material-based powder is preferably a powder containing independent fine bubbles.

As inorganic material powder, xonotlite (6CaO · 6SiO ₂ · H ₂ 0), which is crystalline calcium silicate hydrate, can be used, but it is widely used as an ALC building material and is easily available. For this reason, the powder is preferably tobermolite crystals (tobermolite: crystalline calcium silicate hydrate: 5CaO · 6SiO ₂ · 5H ₂ O).

  If the surface of the IC inlet is covered with a metal component, the communication function of the IC inlet is hindered. Therefore, the inorganic material heat insulating member preferably does not contain a metal component as an additive.

  In order to increase the mechanical strength of the IC tag, the inorganic material-based heat insulating member preferably includes a reinforcing member.

  Preferably, the reinforcing member is selected from carbon fiber, glass fiber, non-woven fabric, cloth, bag or paper.

  Hereinafter, application of the IC tag 1 to the IC tag 1 and the foamed concrete according to the first embodiment of the present invention will be described in detail with reference to FIG.

  As shown in FIG. 1, an IC tag 1 according to the present invention has an IC inlet 3 including an IC chip 14 mounted on a breathable base material 10, and the IC inlet 3 is a thermoplastic resin by a skin pack method. It is configured to be covered and fixed with a film 16. Then, the pre-processed body of the IC tag 1 is folded back into two (that is, folded into a valley fold) with reference to the cut line provided on the side of the breathable substrate 10, and the IC inlet is formed by the breathable substrate 10. The thermoplastic resin films 16 are joined together so as to sandwich 3.

  The IC chip 14 is attached to each arm constituting a large crane as a tag, or is embedded in an ALC plate manufactured by autoclaving, as electronic information related to an object subject to high temperature. Electronic information relating to a target article including a high-temperature manufacturing process is stored. Such electronic information is, for example, manufacturer identification information, user identification information, production area identification information, production management information, product number information, product characteristic information, material information, or delivery destination information. Such an IC chip 14 is an IC chip which is a semiconductor integrated circuit or an LSI chip with a higher degree of integration.

  The antenna circuit substrate 12 is made of a material having flexibility or flexibility, for example, a resin material such as polyethylene, polypropylene, polyester, polyamide, or paper.

  An antenna pattern (not shown) is formed on the front surface of the antenna circuit substrate 12 on which the IC chip 14 made of a silicon chip is placed. The connection terminals of the IC chip 14 are electrically connected to the center side electrode terminals of the antenna pattern. Antenna patterns having various shapes can be used depending on the wavelength of the radio wave to be used. The antenna pattern is formed by printing or transfer using a low-resistance paste containing a conductive filler having conductivity close to that of a conventionally used copper foil.

The breathable substrate 10 is made of a material selected from a mount, a nonwoven fabric, a cloth fabric, or a resin sheet. And the air permeable base material 10 is provided with the thickness and waist | hip | lumbar of the grade which does not generate | occur | produce a curvature by the thermal contraction of the thermoplastic resin film 16. FIG. The mount used as the air-permeable base material 10 is preferably a sufficiently dry paper or a synthetic paper so that moisture contained in the paper is not evaporated rapidly and a blister does not occur. Examples of such synthetic paper include YUPO (registered trademark of YUPO Corporation) formed by a biaxially stretched film method by adding an additive to a polypropylene resin. The synthetic paper (YUPO) used is preferably about 200 g / m ² . In addition, since synthetic paper (YUPO) itself does not have air permeability, a through hole is formed in the sewing machine blade or by a needle-like body having a sharp tip. As will be described later, when the ink layer 18 (display portion) is formed, a vent hole is provided at a place avoiding the ink layer 18 (display portion).

  A non-woven fabric is a fabric formed by bonding or intertwining fibers by thermal, mechanical or chemical action, and has a certain level of air permeability. A fabric woven by twisting fibers into a yarn also has a certain degree of air permeability. However, when the air permeability of the nonwoven fabric or the cloth fabric is insufficient, as in the above, a through-hole formed by a sewing machine blade or a needle-like body with a sharp tip is provided in them.

  When a resin sheet is used as the breathable substrate 10, a tough transparent heat-resistant sheet that has been stretched can be used. For example, polyethylene terephthalate (PET), polypropylene (PP), polycarbonate resin, polyethylene naphthalate (PEN), polyamide resin, hard vinyl chloride, etc. can be used. Since the resin sheet itself does not have air permeability, similarly to the above, a through hole formed by a sewing machine blade or a needle-like body with a sharp tip is provided in them.

  By the way, the air permeability required for the air permeable base material 10 is that the high temperature / high pressure molten resin at the time of in-mold molding comes into contact with the IC tag 1 and the heat from the molten resin is contained in the IC tag 1. This means that the expanded air can escape to the outside through the breathable substrate 10, but the molten resin does not enter the inside through the breathable substrate 10. In particular, in the case of the skin pack method, the vent holes of the breathable base material 10 are for vacuum suction during skin packing and for deaeration of thermally expanded air during in-mold molding.

  The vent hole of the breathable base material 10 varies depending on the viscosity of the molten resin used for in-mold molding. As a specific example, a vent hole having a diameter of 100 to 500 μm is formed randomly or regularly. Illustrated. More preferably, those in which 250 to 500 μm through holes are formed randomly or regularly are exemplified. Further, a round hole, an elongated hole or a broken line-like cut is formed by the sewing machine blade. Examples of the sewing machine pitch include a cut portion of 0.5 mm and a connecting portion of 0.5 mm to a cut portion of 1.0 mm and a connecting portion of 1.0 mm. More preferably, a cut portion of 0.5 mm and a connecting portion of 0.5 mm to a cut portion of 0.6 mm and a connecting portion of 0.6 mm are exemplified. The cross section of the penetrating air hole can be a straight shape. In order to facilitate the deaeration of the encapsulated air and prevent the intrusion of the molten resin, the cross section of the vent hole that penetrates from the non-mounting side of the IC chip 14 toward the mounting side of the IC chip 14. It is preferable that the taper shape has a wide end. Such a tapered shape is easily formed by punching from the mounting side of the IC chip 14.

  The thermoplastic resin film 16 is a variety of thermoplastic resin films suitable for so-called skin packs, such as soft vinyl chloride film, ionomer film, polyethylene film, polypropylene film, ethylene-vinyl acetate copolymer film, ethylene / acrylic acid copolymer film. A coalesced film, an ethylene / ethyl acrylate film or the like is used. More specifically, an ionomer resin obtained by cross-linking an ethylene-methacrylic acid copolymer with a metal ion, which is a trade name “Himiran (registered trademark)” of Mitsui DuPont Polychemical Co., Ltd., is used. The thickness is, for example, 150 μm.

  A heat seal material as a fixing member is applied to the peripheral portion of the thermoplastic resin film 16 and / or the breathable base material 10. The heat seal material is appropriately selected depending on the material of the thermoplastic resin film 16, and examples thereof include a vinyl chloride resin, a vinyl acetate resin, an acrylic resin, an olefin resin, and an ethylene-vinyl acetate copolymer. Emulsion or solvent type adhesive.

  The IC inlet 3 is placed in accordance with a positioning mark (not shown) or a positioning pin hole formed on the air-permeable substrate 10, and the IC inlet 3 is made of a thermoplastic resin film 16 softened by heating in advance. While covering, it exhausts from the back surface (surface on the opposite side to the mounting side of IC inlet 3) of the air permeable base material 10 using a vacuum suction apparatus, and vacuum deaerates, for example at 600 mmHg. As a result, the IC inlet 3 is packed in a state where the heat-softened thermoplastic resin film 16 is in close contact with the outer shape of the IC inlet 3. At this time, the heat sealing material as a fixing member is heat-sealed by the remaining heat of the heat-softened thermoplastic resin film 16, so that the thermoplastic resin film 16 is fixed to the breathable substrate 10.

  When the display characteristics as a label are to be imparted to the IC tag 1, after the thermoplastic resin film 16 is fixed to the breathable substrate 10 by the skin pack method, the back surface (IC inlet) of such a breathable substrate 10 is used. 3), the ink layer 18 (display portion) having a desired pattern is formed by printing ink. On the ink layer 18 (display portion), a logo mark, an owner display, a barcode, and the like are displayed. Furthermore, on the ink layer 18 (display portion), a surface protective layer 22 is formed by OP (overprint) varnishing (oxidation polymerization type) in order to protect the ink layer 18 (display portion).

  When the IC tag 1 has a bent structure as shown in FIG. 1, a preliminary processed body having a size approximately twice as large as the external dimension of the desired IC tag 1 is prepared. Here, the pre-processed body includes the IC inlet 3, the air permeable base material 10, and the thermoplastic resin film 16, and is a skin pack method. The IC inlet 3 is formed of the thermoplastic resin film 16, the air permeable base material 10, and the like. Between the two.

  The preliminary processed body has a placement site on the left side and a dummy site on the right side. It is possible to provide a cut line so that the pre-processed body is roughly divided into two parts, and the right dummy site can be configured to have the same external dimensions as the left mounting site. In order to secure a larger bonding area between the sealing member 30 and the resin sealing member 30, the right dummy site is sized to be larger than the left mounting site.

  The cut line formed from the side of the breathable substrate 10 in the preliminary processed body is provided in a part or all of the thickness direction of the breathable substrate 10. In addition, after preliminarily applying a heat seal material on the surface of the thermoplastic resin film 16 and folding the pre-processed body with reference to the score line, the heat seal bar heated to an appropriate temperature is folded. The two-fold IC tag 1 shown in FIG. 1 is created by pressing against the workpiece and adhesively bonding the thermoplastic resin films 16 together. Since the IC chip 14 of the IC inlet 3 is sandwiched between the folded breathable base materials 10, a structure in which the IC chip 14 is sandwiched between the breathable base materials 10 (that is, a substantially two-layer structure). Thus, the mechanical strength is higher than when the breathable base material 10 is formed of a single sheet.

  For such an IC tag 1, a resin sealing member 30 and an inorganic material heat insulating member 40 are provided.

  Sealing of the IC inlet 3 by the resin sealing member 30 is performed by in-mold molding of a resin that integrally molds the molten resin and the IC inlet 3 in a mold, and the IC inlet 3 is placed in the resin film bag body to open the mouth of the bag body. It is performed by welding and embedding in a resin film bag to be welded, or by embedding in a resin-molded capsule in which the IC inlet 3 is placed in a pair of resin-molded capsules and the molded capsule is sealed.

  In the case of in-mold molding, when the in-mold molded resin is welded and embedded in a resin film bag, the resin molded capsule is embedded in a resin molded capsule. These correspond to the resin sealing member 30, respectively.

  After the valley-folded IC tag 1 is set at a predetermined position of the in-mold mold, molten resin is injected and injected from the injection port into the mold. Resin used for injection molding is general-purpose resin such as polypropylene (PP), polyethylene (PE) and ABS, general-purpose engineering plastic such as polycarbonate (PC) and polyamide (PA), liquid crystal polymer (LCD) and polyphenylene sulfide (PPS) Super engineering plastic with excellent heat resistance. The IC tag 1 sealed with the injection molding resin is taken out from the in-mold molding die.

  The IC tag 1 sealed with injection molded resin is entirely covered with an inorganic material heat insulating member 40.

  The inorganic material heat insulating member 40 is prepared by mixing main raw materials such as ceramic powder, diatomaceous earth, and foamed silica with a binder such as gypsum and cement at an appropriate ratio, and kneading while adding water to create a slurry. The slurry is poured into a mold on which the IC tag 1 sealed with injection molding resin is placed, and solidified integrally with the IC tag 1. If the surface of the IC inlet 3 is covered with a metal component, the communication function of the IC inlet 3 is hindered. Therefore, the inorganic material heat insulating member 40 preferably does not contain a metal component as an additive. If the IC tag 1 requires a fixing part such as a screw fixing hole, the fixing part can be provided by appropriately processing the mold.

  The material and thickness of the inorganic material heat insulating member 40 are appropriately determined according to the use conditions of the IC tag 1. When used in a high temperature region (about 160 ° C. to 220 ° C.), the inorganic material heat insulating member 40 is composed of a porous body containing a large amount of air that functions as a heat insulating portion. Further, when used in an intermediate temperature range (about 100 ° C. to 160 ° C.), the inorganic material heat insulating member 40 may be formed of a solid body that does not contain much air.

  The porous inorganic material-based heat insulating member 40 used in a high temperature region (about 160 ° C. to 220 ° C.) is so-called foamed concrete, and a foaming agent is added to the slurry in advance to create the inorganic material-based heat insulating member 40. In the process, it can also be created by foaming a foaming agent. However, a porous body with little variation in characteristics due to the fact that the uniform dispersion degree and the uniform bubble size depend on various production conditions such as foaming temperature and stirring state, and it is difficult to manage these conditions. Is difficult to create. Therefore, a porous body having stable characteristics can be produced by using ceramic powder containing independent fine bubbles as the main raw material ceramic powder.

As a ceramic powder containing independent fine bubbles, xonotlite (xonotlite: 6CaO · 6SiO ₂ · H ₂ 0), which is crystalline calcium silicate hydrate, can be used, but it is widely used as an ALC building material. Therefore, the powder is preferably tobermolite crystals (tobermolite: crystalline calcium silicate hydrate: 5CaO · 6SiO ₂ · 5H ₂ O). That is, tobermorite crystals are widely available as ALC building materials and are therefore available at low cost. In addition to that, it is sometimes treated as industrial waste because it comes out in large quantities as scrap at manufacturing sites and construction sites, so it can be obtained at a lower cost than new ones. The thermal conductivity of the tobermorite crystal powder is approximately 0.17 W / (m · K).

  The solid inorganic material-based heat insulating member 40 used in the medium temperature range (about 100 ° C. to 160 ° C.) has, for example, almost no voids such as bubbles and pores by using Portland cement as the main ceramic powder. It is possible to create a solid entity that does not exist.

(Example)
IC inlet JE-100 manufactured by Nippon Information was fixed by the skin pack method described above. The size of the IC inlet is approximately 10 mm long × 46 mm wide × 0.15 mm high. At the same time, in-mold molding was performed using a polypropylene (PP) resin manufactured by Riken Technos Co., Ltd., and the IC inlet 3 was sealed with the in-mold molding resin 30. The size of the IC inlet 3 sealed with the in-mold molding resin 30 is approximately 18 mm long × 64 mm wide × 2 mm high. Therefore, the thickness of the in-mold molding resin 30 is approximately 1.85 mm.

  Portland cement powder and tobermorite crystal powder (Asahi Kasei Hebel's powder) are mixed at a weight ratio of 1: 1, and about 30% water is added to the mixture to mix well. Thus, a slurry was prepared. The slurry is poured in a state where the IC inlet 3 sealed with the in-mold molding resin 30 is placed in the resin mold, and the mold is removed after maintaining the state as it is for two days. The solidified IC tag 1 was further dried for about one week in the sun, so that the block-shaped IC tag 1 having a sufficient mechanical strength was obtained which was entirely covered with the inorganic material heat insulating member 40. The size of the IC tag 1 covered with the inorganic material heat insulating member 40 is approximately 57 mm long × 93 mm wide × 15 mm high. Therefore, the thickness of the inorganic material-based heat insulating member 40 is approximately 13 mm.

  The IC tag 1 covered with the inorganic material heat insulating member 40 is embedded in a foamed concrete body (ALC plate) used for building construction. Foamed concrete body (ALC board) is made by adding aluminum powder of foaming agent and water to silica stone, cement, quick lime, gypsum and the like to form a slurry, and then the IC tag 1 and the slurry covered with the inorganic material heat insulating member 40 Is injected into the mold and foamed and solidified. Then, steam baking treatment (autoclave curing treatment) was performed at 180 ° C. and 10 atm under high temperature and high pressure for 10 hours to obtain a foamed concrete body (ALC plate) in which the IC tag 1 was embedded.

  When the radio wave transmission performance of the foamed concrete body (ALC board) in which the IC tag 1 is embedded was confirmed by a reader (type S512HD, 2.45 GHz band, 2ch multi-scanner) manufactured by Japan Information, it was 20 cm or more. There was a communication distance, and it was confirmed that the IC tag 1 can be used sufficiently.

  Although it is required to carry building materials into the building site in just-in-time, managing the storage of materials for foam concrete bodies (ALC boards) by embedding IC tags 1 in foam concrete bodies (ALC boards) Can meet the above needs. Needless to say, the embedded IC tag 1 can also be used for production management of foamed concrete (ALC plate).

  Next, application of the IC tag 1 according to the second embodiment of the present invention and the arm of the building crane will be described in detail with reference to FIG. A description will be given centering on differences from the IC tag 1 of the first embodiment described above.

  That is, the IC tag 1 according to the second embodiment is used in a straight shape without bending the pre-processed body of the IC tag 1, and the resin sealing member 30 is welded and embedded in the resin film bag body. It is characterized in that the inorganic material-based heat insulating member 40 includes a reinforcing member 50.

  As shown in FIG. 2, the IC tag 1 according to the present invention has an IC inlet 3 including an IC chip 14 mounted on a breathable base material 10, and the IC inlet 3 is made of a thermoplastic resin by a skin pack method. It has a straight shape covered and fixed with a film 16.

  The IC inlet 3 is welded and embedded in the resin film bag 30 by placing the IC inlet 3 in the resin film bag 30 and welding the mouth of the bag. Therefore, the IC inlet 3 enclosed in the resin film bag body 30 by the resin film bag body as the resin sealing member 30 has water resistance.

  The IC tag 1 sealed with the resin film bag 30 is entirely covered with an inorganic material heat insulating member 40.

  The inorganic material heat insulating member 40 is prepared by mixing main raw materials such as ceramic powder, diatomaceous earth, and foamed silica with a binder such as gypsum and cement at an appropriate ratio, and kneading while adding water to create a slurry. The slurry is poured into a mold frame on which the IC tag 1 sealed with injection molding resin is placed, and is solidified integrally with the IC tag 1.

  The reinforcing member 50 such as carbon fiber, glass fiber, non-woven fabric, cloth, bag or paper can be mixed when creating the slurry, or the reinforcing member 50 can be arranged in layers when the slurry is poured into the mold. .

(Example)
IC inlet JE-100 manufactured by Nippon Information was fixed by the skin pack method described above. The size of the IC inlet is approximately 10 mm long × 47 mm wide × 0.15 mm high. At the same time, the IC inlet 3 was sealed with the resin film bag 30 using a resin film bag 30 (thickness approximately 0.1 mm) made of a low density polyethylene (PE) resin made of Japanese polyethylene. The size of the IC inlet 3 sealed with the resin film bag 30 is approximately 20 mm long × 55 mm wide × 0.25 mm high.

  A powder of quick-drying cement with a hardening accelerator (House Chemical Industry Co., Ltd.) and a powder of tobermorite crystals (a powder of Asahi Kasei's Hebel's end material) are mixed at a weight ratio of 1: 2, About 25% of water by weight was added and kneaded well to prepare a slurry. The slurry is poured in a state where the IC inlet 3 sealed with the resin film bag body 30 is placed in the resin mold, and the mold is removed after maintaining the state for one day. The solidified IC tag 1 was further dried indoors for one day, whereby the block-shaped IC tag 1 having a sufficient mechanical strength with the entire surface covered with the inorganic material heat insulating member 40 was obtained. The size of the IC tag 1 covered with the inorganic material heat insulating member 40 is approximately 40 mm long × 95 mm wide × 17 mm high. Therefore, the thickness of the inorganic material heat insulating member 40 is approximately 16.8 mm.

  So-called tower cranes are used in the construction of high-rise buildings. A crane that has been used at one construction site is disassembled and transported to another construction site. Since the required crane length varies from site to site, the appropriate arm is selected and combined. Although it is necessary to select a desired arm from many arms, if the IC tag 1 is attached to the arm, the management of the arm becomes very easy. And due to the regulations of the Aviation Law, each arm is required to be colored red and white, but because it is exposed to humid places such as outdoors, sunlight and wind and rain, the coloring of the arm is made of acrylic resin paint etc. It is done by baking painting. The baking coating is performed at a baking temperature of 160 ° C. to 200 ° C., for example. In such baking coating, it is desired that the IC tag 1 has heat resistance. Therefore, the arm management is facilitated by baking and painting the IC tag 1 covered with the inorganic material heat insulating member 40 in a state of being attached to the arm.

  With the IC tag 1 covered with the inorganic material-based heat insulating member 40 adhered and fixed to the arm, an acrylic resin-based paint is applied and then kept in a hot air oven at 180 ° C. for 20 minutes, so that the coating film Harden. As a result, an arm for a tower crane in which the IC tag 1 was embedded inside the baking finish was obtained.

When the radio wave transmission performance of the arm embedded with the IC tag 1 was confirmed by a Japanese information reader (type S512HD, 2.45 GHz band, 2ch multi-scanner), there was a communication distance of 20 cm or more. It was confirmed that the tag 1 can be used sufficiently.
Next, the application of the IC tag 1 according to the third embodiment of the present invention and the arm of the building crane will be described in detail. The description will focus on the differences from the IC tag 1 of the second embodiment described above.

  That is, the IC tag 1 according to the third embodiment is characterized by being a chip with a built-in antenna, and the resin sealing member 30 being embedded in a resin molded capsule.

  The IC tag 1 according to the present invention uses a non-contact IC chip with a built-in antenna as the IC inlet 3.

  The IC inlet 3 is sealed and embedded in the resin-molded capsule 30 by sealing the mouth of the resin-molded capsule 30 after being placed in the pair of resin-molded capsules 30. Therefore, the IC inlet 3 enclosed in the resin-made capsule 30 by the resin-made capsule as the resin-made sealing member 30 has water resistance.

  The IC tag 1 sealed with the resin-made capsule 30 is entirely covered with an inorganic material heat insulating member 40.

  The inorganic material heat insulating member 40 is prepared by mixing main raw materials such as ceramic powder, diatomaceous earth, and foamed silica with a binder such as gypsum and cement at an appropriate ratio, and kneading while adding water to create a slurry. Then, the slurry is poured into a mold on which the IC tag 1 sealed with a resin-molded capsule is placed, and is solidified integrally with the IC tag 1.

  The reinforcing member 50 such as carbon fiber, glass fiber, non-woven fabric, cloth, bag or paper can be mixed when creating the slurry, or the reinforcing member 50 can be arranged in layers when the slurry is poured into the mold. .

(Example)
As the IC inlet 3, a non-contact IC chip mu chip manufactured by Hitachi, Ltd. was used. The size of the IC inlet 3 is approximately 2 mm long × 65 mm wide × 60 μm high. At the same time, the IC inlet 3 was sealed with the resin-molded capsule 30 using a resin-molded capsule (thickness approximately 3 mm) made of Polypropylene (PP) resin made by Riken Technos. The size of the IC inlet 3 sealed with the resin-made capsule 30 is approximately 7 mm long × 75 mm wide × 3 mm high.

  Powder of quick-drying cement with hardening accelerator (House Chemical Industry Co., Ltd.) and powder of tobermorite crystals (Hybel's powder of Asahi Kasei building material) are blended at a weight ratio of 2: 3. About 25% of water by weight was added and kneaded well to prepare a slurry. The slurry is poured in a state in which the IC inlet 3 sealed with the resin-molded capsule 30 is placed in the resin mold, and the mold is removed after maintaining the state for one day. The solidified IC tag 1 was further dried indoors for one day, whereby the block-shaped IC tag 1 having a sufficient mechanical strength with the entire surface covered with the inorganic material heat insulating member 40 was obtained. The size of the IC tag 1 covered with the inorganic material heat insulating member 40 is approximately 38 mm long × 90 mm wide × 17 mm high. Therefore, the thickness of the inorganic material-based heat insulating member 40 is approximately 14 mm.

  In recent years, in the fisheries industry, the price of fishery products has risen due to the depletion of fishery resources and the consumer's brand orientation. Since the value of the product varies greatly depending on where the seafood is taken, products that are disguised as production areas are on the market. There is a strong demand for traceability of marine products in order to eliminate impersonation of local brands. In particular, tuna, which has a high commercial value, is strongly required to be traceable. However, since the tuna that was picked up was frozen immediately at a low temperature of -60 ° C or lower, the IC tag was not guaranteed to operate at low temperatures. It was difficult to use for frozen tuna. If it becomes possible to attach an IC tag to the frozen tuna, the production management and quality control of the frozen tuna becomes very easy.

  The above-mentioned mu chip was sealed with a resin-made capsule 30 and covered with an inorganic material heat insulating member 40, and the IC tag 1 was embedded in a special holder made of resin. The special holder made of resin is configured to have a removal preventing shape having a return portion at the tip so that it can be attached to the tuna before freezing but cannot be attached to the tuna after freezing. The resin special holder to which the IC tag 1 was attached was attached to the tail portion of the tuna before freezing. After that, the tuna embedded with the IC tag 1 was quickly frozen in a quick freezing room at -65 ° C. After holding for 1 month in a cold storage at -55 ° C, when the radio wave transmission performance of the frozen tuna embedded with the IC tag 1 was confirmed with a muchip reader, there was a communication distance of 20 cm or more. It was confirmed that the tag 1 can be used sufficiently.

  In addition, as an example to which the IC tag of the present invention can be applied, manufacturing management, inventory management, combination management, production control of frozen tuna, etc. of foamed concrete plates and crane arms have been described. It can also be used by embedding it in concrete molded products such as U-shaped tubes and side grooves, historic site management, wave-dissipating blocks and the like.

It is sectional drawing of the IC tag which concerns on 1st embodiment of this invention. It is sectional drawing of the IC tag which concerns on 2nd embodiment of this invention.

Explanation of symbols

1: IC tag 3: IC inlet 10: Breathable substrate 12: Antenna circuit substrate 14: IC chip 16: Thermoplastic resin film 18: Ink layer (display section)
30: Resin sealing member 40: Inorganic material-based heat insulating member 50: Reinforcing member

Claims (7)

An IC inlet including an IC chip in which electronic information is stored;
A resin sealing member for sealing the IC inlet;
An IC tag comprising: an inorganic material heat insulating member formed of an inorganic material powder formed so as to entirely cover the resin sealing member.   The IC inlet is sealed by the resin sealing member by performing in-mold molding of a resin, welding and embedding in a resin film bag, or embedding in a resin-molded capsule. IC tag.   2. The IC tag according to claim 1, wherein the inorganic material-based powder is a powder containing independent fine bubbles.   4. The IC tag according to claim 3, wherein the powder is a tobermorite crystal.   The IC tag according to claim 1, wherein the inorganic material-based heat insulating member does not contain a metal component as an additive.   The IC tag according to claim 1, wherein the inorganic material heat insulating member includes a reinforcing member.   The IC tag according to claim 6, wherein the reinforcing member is selected from carbon fiber, glass fiber, non-woven fabric, cloth, bag or paper.

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