JP4867150B2 - Manufacturing method of IC tag for cleaning - Google Patents

Description

  The present invention relates to a cleaning IC tag to be attached to a cleaning garment and the like, and in particular, to automatically identify the cleaning garment and the like and to be used for process management, sorting work and inventory management in a laundry factory. The present invention relates to a cleaning IC tag having excellent solvent resistance and heat resistance.

  In recent years, RF (with a built-in data carrier system capable of non-contact writing and reading of various data by radio wave communication from the outside as a tag for identifying and managing the article by attaching it to an article such as a product or baggage Individual identification systems using radio frequency (ID) tags are known, and management of goods such as logistics, distribution, FA (Factory automation), products, goods such as luggage, or individual identification information such as unique identification numbers It has come to be widely used for traceability and security, such as identifying authenticity and identifying distribution channels.

  In particular, record information such as cleaning clothes received from customers (request date, client, contents of clothes, return date, request for cleaning, etc.), transmit it to the laundry factory, and after washing is finished Management of a series of operations until returning to a customer is performed by an identification device attached to a cleaning garment or the like (see, for example, Patent Document 1).

However, in the identification device, a bag-shaped film container for accommodating the identification device is attached in advance to a predetermined place such as clothing, and then the identification device is accommodated in the film container.
In this way, if the identification device and the storage container into which the identification device is placed are separated, the both end openings are sealed by bonding, sewing, etc. after putting the identification device (data carrier) in the storage container, Problems may occur in water resistance and solvent resistance depending on the time and effort required for sealing and depending on how to bond and sew.
JP-A-11-180545

  The present invention automatically identifies clothes for cleaning, etc., and is used for cleaning of a monolithic structure excellent in water resistance, solvent resistance, and heat resistance used for process management, sorting work and inventory management in a laundry factory. An object is to provide an IC tag.

In order to solve the above-mentioned problems in the present invention, first, in claim 1, at least a film or sheet-like flexible insulating base material (21) is provided with an IC chip (26) and an antenna coil (25) for wireless communication. And an IC tag inlet (20) in which an opening (22) is provided in the insulating base (21) on the inner peripheral portion of the antenna coil (25), an attachment portion (11), and a storage portion ( 13) and a cleaning IC tag comprising a tray (10) having a side wall (12) surrounding the storage portion (14), and an embedded resin (30), wherein the tray (10) the set of the IC tag inlet (20) in the housing portion (14), manufacture of cleaning IC tag, which comprises an integral structure to form the buried resin (30) by pouring liquid resin On the way There are, an adhesive layer is formed on the housing portion of the tray (10) (13) is obtained by the manufacturing method of cleaning IC tag which is characterized in that a bonding reinforcing layer heat cured to.

According to a second aspect of the present invention, the cleaning IC tag manufacturing method according to the first aspect is characterized in that the storage portion (13) of the tray (10) is roughened.

Further, in claim 3, a mounting portion (11) for attaching to clothing or the like is provided around the tray (10), for cleaning according to any one of claims 1 to 3. This is an IC tag manufacturing method .

By attaching the cleaning IC tag of the present invention to clothes and the like and performing a series of operations such as cleaning, it becomes possible to automatically identify, manage and sort the cleaning clothes and the like.
In addition, since the cleaning IC tag of the present invention is excellent in water resistance, solvent resistance, and heat resistance, the IC tag recognition work after the washing work can be performed in a stable state.

FIG. 1 is an explanatory view showing an embodiment of the cleaning IC tag of the present invention.
1A is a plan view of the cleaning IC tag 100 of the present invention, and FIG. 1B is a schematic configuration in which the cleaning IC tag 100 of the present invention of FIG. 1A is cut along the line AA ′. Cross-sectional views are shown respectively.
FIG. 2 is an explanatory view showing an embodiment of the tray.
2A is a plan view of the tray 10, and FIG. 2B is a schematic cross-sectional view of the tray 10 cut along the line AA ′.
FIG. 3 is an explanatory view showing an embodiment of the IC tag inlet.
3A is a plan view of the IC tag inlet 20, and FIG. 3B is a schematic cross-sectional view of the IC tag inlet 20 cut along the line AA ′.

  The cleaning IC tag 100 of the present invention includes a tray 10 including an attachment portion 11, a side wall 12, and a storage portion 13 (see FIGS. 2A and 2B), an antenna coil 25 and an IC on an insulating base 21. The IC tag inlet 20 including the chip 26 and an embedded resin 30 are configured. The IC tag inlet 20 is set in the storage portion 13 of the tray 10, and a liquid resin is poured to form the embedded resin 30. Integrated structure.

The tray 10 is made by melting and kneading a resin composition comprising a polyamide resin, a polyester resin, a silicon resin, a polystyrene resin, a polyphenine ether resin and the like and a non-conductive inorganic filler to produce pellets, injection molding, A tray 10 having a mounting part 11, a side wall 12, and a storage part 13 is prepared.
By mixing the non-conductive inorganic filler, the heat resistance and dimensional stability of the tray 10 can be improved. As the non-conductive inorganic filler, talc, mica, glass fiber, silica alumina, calcium carbonate and the like can be used, and the blending amount is preferably 30 to 60 parts by weight with respect to 100 parts by weight of the resin composition.

Further, in the invention according to claim 5, the attachment portion 11 for clothing or the like is provided in the peripheral portion of the tray 10 so that it can be easily attached to the cleaning IC tag 100 of the present invention by sewing or the like. As a structure of the attachment part 11 to clothes etc., the groove | channel 11a was formed in the predetermined position of the attachment part 11 as shown in FIG. 4 so that it might be easy to sew to clothing etc., or the attachment part 11 as shown in FIG. There is one in which a hole 11b is formed at a predetermined position. The groove 11a and the hole 11b are produced when the trays 10a and 10b are molded.

The IC tag inlet 20 is obtained by forming an antenna coil 25 on a flexible insulating substrate 21 made of a film or sheet of polyester resin, epoxy resin, polyimide resin or the like and mounting an IC chip 26.
The antenna coil 25 and the IC chip 26 are electrically connected to form a resonance circuit so that individual identification information can be exchanged with an external reader / writer.
Furthermore, a rectangular opening 22 is formed in the substantially central portion of the IC tag inlet 20. Regarding the function and effect of the opening 22, the IC tag inlet 20 is set in the storage portion 13 of the tray 10, and the liquid resin can easily enter between the IC tag inlet 20 and the storage portion when the liquid resin is poured. Thus, a uniform resin film can be easily formed.

As a method for forming the antenna coil 25, for example, a resist pattern is formed on a copper foil of a polyimide tape with a copper foil, and the copper foil is etched with a corrosive solution made of iron chloride solution or the like using the resist pattern as a mask. The resist pattern is peeled off to form the antenna coil 25 on the insulating base material 21. Here, in order to align the electrodes at both ends of the antenna coil 25 and the bump electrodes of the IC chip, an insulating layer, vias, and conductor wiring are formed in a build-up process to bridge one electrode of the antenna coil, An operation for aligning the electrodes at both ends of the antenna coil 25 at the IC chip mounting position is performed. Further, nickel and a gold film are formed on the electrodes at both ends of the antenna coil 25.
The size (number of turns, width, thickness, etc.) of the antenna coil is appropriately set in consideration of the design of the resonance circuit.

As another method for forming the antenna coil 25, for example, a conductive paste is printed on the insulating base material 21 made of polyimide tape or the like by screen printing, an ink jet method, or the like, and then heated and cured to form the antenna coil 25. To do. Here, in order to align the electrodes on both ends of the antenna coil 25 and the IC chip bump, an insulating layer, vias, and conductor wiring are formed by a build-up process to bridge one electrode of the antenna coil, and the IC chip The operation of aligning the electrodes on both ends of the antenna coil 25 at the mounting position of is performed. Further, nickel and a gold film are formed on the electrodes at both ends of the antenna coil 25.
The size (number of turns, width, thickness, etc.) of the antenna coil is appropriately set in consideration of the design of the resonance circuit.

  As another method for forming the antenna coil 25, for example, a loop-shaped coil is produced with an insulated conductor, and the loop-shaped coil is fixed on an insulating base material 21 made of polyimide tape or the like with an adhesive or the like. Thus, the antenna coil 25 is formed. Here, nickel and a gold film are formed on the electrodes at both ends of the antenna coil 25, and the electrode positions at both ends of the antenna coil 25 are formed at the same pitch as the bumps of the IC chip.

In order to electrically connect the electrode of the antenna coil 25 and the bump of the IC chip 26 on the insulating substrate 21, the IC chip 26 is mounted by face-down bonding or wire bonding, and finished to a predetermined size, The IC tag inlet 20 in which the opening 22 is formed is produced.
Here, the opening 22 is formed by die cutting or the like during the outer shape finishing process, but a laser process such as a carbon dioxide laser, an excimer laser, or a UV-YAG laser processing machine may be used.

The IC tag inlet 20 is set in the storage portion 13 of the tray 10, a liquid resin is poured into the storage portion 13 of the tray 10, and the resin is heated and cured at a predetermined temperature to form the embedded resin 30. Is sealed in a tray, and the cleaning IC tag 100 of the present invention is used.
Can be obtained (see FIGS. 1A and 1B).
Here, examples of the liquid resin include silicon resin, epoxy resin, polyimide resin, phenol resin, polyurethane resin, furan resin, aniline resin, and polyolefin resin.

Here, the IC tag inlet 20 in which the opening 22 is formed is set in the storage portion 13 of the tray 10, a liquid resin is poured into the storage portion 13 of the tray 10, and is heated and cured at a predetermined temperature to be embedded resin 30. The behavior of the IC tag inlet 20 and the resin when the IC tag inlet 20 is resin-sealed in the tray will be described.
Here, the IC tag inlet 20a having no opening is set in the storage portion 13 of the tray 10, a liquid resin is poured into the storage portion 13 of the tray 10, and the resin is heated and cured at a predetermined temperature to form the embedded resin 30. When the IC tag inlet 20 is resin-sealed in the tray, a bubble or an air layer is formed between the IC tag inlet 20a and the storage portion 13 of the tray 10 as shown in FIG. When the IC tag is heated, the bubbles or air layer expands, and the embedded resin 30 is cracked, so that the solvent resistance may be deteriorated or the IC tag may be damaged.

  On the other hand, in the invention according to claim 2, since the IC tag inlet 20 used in the cleaning IC tag of the present invention has the opening 22 at substantially the center of the IC tag inlet 20, the IC tag inlet 20 When the liquid resin is poured into the storage portion 13 of the tray 10, the liquid resin is infiltrated almost uniformly from the periphery of the IC tag inlet 20 and the periphery of the opening portion 22. A resin layer is formed between the storage portion 13 and the IC tag inlet 20 and the storage portion 13 of the tray 10 so that no bubbles or the like are generated.

In the invention according to claim 3, the storage portion 13 of the tray 10 is roughened in order to improve the adhesive strength between the embedded resin 30 and the storage portion 13 of the tray 10.
Examples of the surface roughening treatment include roughening the surface corresponding to the mold storage unit 13 for producing the tray 10 in advance, or roughening the storage unit 13 of the tray 10 by sandblasting, liquid honing, or the like. .
In the invention according to claim 4, an adhesive reinforcing layer is formed on the surface of the storage portion 13 of the tray 10 in order to improve the adhesive strength between the embedded resin 30 and the storage portion 13 of the tray 10. As a method for producing the adhesive reinforcing layer, a liquid resin solution using polyester-isocyanate, phenol resin-butyral, phenol resin-nitrolyl rubber, modified epoxy resin, silicon-based RTV or the like as a main material is brush-coated on the storage portion 13 of the tray 10. Alternatively, a transfer film on which an adhesive layer having a predetermined thickness is separately formed is prepared, and the adhesive layer is formed by a method such as transferring the adhesive layer of the transfer film to the storage portion 13 of the tray 10, and then heated and cured. Then, an adhesion reinforcing layer is formed.
The thickness of the adhesive reinforcing layer is about 0.5 to 3 μm.

First, a rubber compound is mixed with a cross-linking material or a pigment, and the thickness is adjusted while heating with an oven roll, and then cut into strips. This small piece was formed by an injection molding machine to produce a tray 10a comprising an attachment portion 11 having a groove 11a, a side wall 12, and a storage portion 13 (see FIGS. 4A and 4B).
Furthermore, the storage unit 13 was roughened by sandblasting.

Next, a 16 μm-thick copper foil with an adhesive is laminated on an insulating base material 21 made of a polyester film having a thickness of 10 to 100 μm, a dry film is stuck on the copper foil to form a photosensitive layer, pattern exposure, A series of patterning processes such as development were performed to form a resist pattern. Using the resist pattern as a mask, the copper foil was etched with an etching solution made of ferric chloride to produce an antenna coil 25. Furthermore, an insulating layer, a via, and a conductor wiring were formed by a build-up process to bridge one electrode of the antenna coil, and an antenna coil 25 in which nickel and gold plating were applied to both ends of the antenna coil was formed. Then, the IC chip 26 was mounted by face-down bonding, and the outer size and the opening 22 were formed by die cutting to produce the IC tab inlet 20 (see FIGS. 3A and 3B).

  Next, the IC tab inlet 20 is set in the storage portion 13 of the tray 10a, and a liquid resin made of any one of silicon resin, epoxy resin, polyimide resin, phenol resin, polyurethane resin, furan resin, aniline resin, polyolefin resin, and the like. The embedded resin 30 was formed by heating and curing at a predetermined temperature, and the IC tag inlet 20 was resin-sealed in the tray to obtain the cleaning IC tag 100 of the present invention.

  As a result of having the cleaning IC tag 100 of the present invention attached to a cleaning item such as a Y-shirt, trousers, skirt, coat, jacket, etc., and performing a laundry operation in a laundry factory, the reader / writer is selected before, during, and after washing. It was confirmed that the individual information recognition of the IC tag without contact can be performed without any trouble, and it was confirmed that the cleaning IC tag 100 of the present invention has sufficient water resistance, solvent resistance, and heat resistance.

It is explanatory drawing which shows one Example of the IC tag for cleaning of this invention. (A) is a top view which shows IC tag 100 for cleaning of this invention. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows one Example of the tray which is a component of the IC tag for cleaning of this invention. FIG. 2A is a plan view of the tray 10. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows one Example of the IC tag inlet which is a component of the IC tag for cleaning of this invention. FIG. 3A is a plan view of the IC tag inlet 20. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows the other Example of the tray which is a component of the IC tag for cleaning of this invention. (A) is a top view of tray 10a. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows the other Example of the tray which is a component of the IC tag for cleaning of this invention. (A) is a top view of tray 10b. (B) is a schematic cross-sectional view taken along line A-A ′ of (a). It is explanatory drawing which shows one Example of the IC tag for cleaning using IC tag inlet 20a which does not have an opening part.

Explanation of symbols

10, 10a, 10b ... Tray 11 ... Mounting portion 11a ... Groove 11b ... Hole 12 ... Side wall 13 ... Storage portion 20 ... IC tag inlet 20a ... IC tag inlet 21 without opening ... Insulating base material 22 ... opening 25 ... antenna coil 26 ... IC chip 30 ... embedded resin

Claims (3)

An IC chip (26) and an antenna coil (25) for wireless communication are mounted on at least a film or sheet-like flexible insulating substrate (21), and the insulation of the inner peripheral portion of the antenna coil (25) is performed. An IC tag inlet (20) in which an opening (22) is provided in a base material (21), a mounting part (11), a storage part (13), and a side wall (12) surrounding the storage part (14). A cleaning IC tag comprising a tray (10) and an embedding resin (30), wherein the IC tag inlet (20) is set in a storage portion (14) of the tray (10), and is liquid the manufacturing method of cleaning IC tag, which comprises an integral structure to form the buried resin (30) by pouring a resin, an adhesive layer on the housing portion of the tray (10) (13) Forming and heating Manufacturing method of cleaning IC tag which is characterized in that a bonding reinforcing layer turned into. 2. The method of manufacturing an IC tag for cleaning according to claim 1, wherein the storage portion (13) of the tray (10) is subjected to a surface roughening treatment. The method of manufacturing an IC tag for cleaning according to claim 1 or 2 , further comprising an attachment portion (11) for attaching to clothing or the like around the tray (10).

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