CN108334929A - Electronic label - Google Patents
Electronic label Download PDFInfo
- Publication number
- CN108334929A CN108334929A CN201810454752.3A CN201810454752A CN108334929A CN 108334929 A CN108334929 A CN 108334929A CN 201810454752 A CN201810454752 A CN 201810454752A CN 108334929 A CN108334929 A CN 108334929A
- Authority
- CN
- China
- Prior art keywords
- antenna
- chip
- electronic tag
- substrate
- medium substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 101
- 238000004806 packaging method and process Methods 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000005030 aluminium foil Substances 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 239000006071 cream Substances 0.000 claims description 8
- 239000004568 cement Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000011162 core material Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
Abstract
The invention discloses an electronic tag, comprising: an antenna structure and a chip packaging structure; the antenna structure comprises an antenna substrate and an antenna; the antenna is arranged on the antenna substrate; the chip packaging structure comprises a medium substrate, a chip and a packaging layer; the dielectric substrate is arranged on one surface of the antenna substrate and is electrically connected with the antenna; the chip is arranged on the medium substrate, at least one first bonding point of the chip is connected with at least one second bonding point of the medium substrate in a one-to-one correspondence mode through a bonding wire, and the chip is packaged on the medium substrate through the packaging layer. The invention can improve the packaging efficiency of the electronic tag, reduce the packaging difficulty of the electronic tag and reduce the manufacturing cost of the electronic tag.
Description
Technical field
The present invention relates to radio frequency arts, more particularly, to a kind of electronic tag.
Background technology
Electronic tag is also known as RF tag, is a kind of data medium being stored with specific information, can play mark identification, object
Product tracking, information collection effect.Electronic tag, which is divided into, passively to be sent out the passive electronic label of signal and actively sends out signal
Active electronic label, either passive electronic label or active electronic label, their structure include antenna and and antenna electric
This two parts of the chip of connection.
Currently, electronic tag generally uses flip-chip packaging techniques, specially：When chip package, first in chip
Gold-plated formation salient point, then corresponding with the conductiving point on medium substrate by way of conducting resinl by the salient point on chip on electrode
Then electrical connection notes epoxy resin to the outer surface of chip to form the encapsulated layer of encapsulation chip.Due to the solidification of conducting resinl
The long period is needed, the packaging efficiency of the chip of electronic tag can be influenced in this way, and then influences the packaging efficiency of electronic tag；
And it is gold-plated to form salient point and need the conducting resinl using higher price on the electrode of chip due to needing, it makes
Complex process and cost of manufacture is higher.
Invention content
In view of the above-mentioned problems, the purpose of the present invention is to provide a kind of electronic tag, the envelope of electronic tag can be improved
Dress efficiency, the cost of manufacture for reducing the encapsulation difficulty of electronic tag and reducing electronic tag.
To achieve the goals above, an embodiment of the present invention provides a kind of electronic tags comprising：Antenna structure and chip
Encapsulating structure；
The antenna structure includes antenna substrate and antenna；The antenna is set on the antenna substrate；
The chip-packaging structure includes medium substrate, chip and encapsulated layer；The medium substrate is set to the antenna base
In the one side of plate, and it is electrically connected with the antenna；The chip be set to the medium substrate on, the chip have at least one
First bonding point is connected one to one by bonding line and at least one second bonding point that the medium substrate has, the envelope
Layer is filled by the chip package on the medium substrate.
As the improvement of said program, the antenna has the interconnecting piece in the one side of the antenna substrate,
The one side of the direction antenna substrate of the medium substrate is equipped with weld part, and the weld part and interconnecting piece welding are solid
It is fixed.
As the improvement of said program, the interconnecting piece and the weld part are pad structure.
As the improvement of said program, conductive layer is coated on the interconnecting piece, the solderability of the conductive layer is than the company
The solderability of socket part is good, and the conductive capability of the conductive layer is stronger than the conductive capability of the interconnecting piece.
As the improvement of said program, the conductive layer is equipped with tin cream.
As the improvement of said program, the chip is set to by insulating cement or conductive gluing on the medium substrate.
As the improvement of said program, at least one first bonding point is pad structure, at least one second key
Chalaza is pin configuration.
As the improvement of said program, the medium substrate is BT substrates or PPA substrates.
As the improvement of said program, the antenna substrate is pet substrate or PI substrates.
As the improvement of said program, the antenna is aluminium foil antenna or copper foil antenna.
The electronic tag provided by the invention, since at least one first bonding point that the chip has passes through bonding
Line connects one to one at least one second bonding point that the medium substrate has, to realize chip and medium substrate
Electrical connection, therefore compared with the prior art, the embodiment of the present invention need to only be realized by the relatively low bonding line of material cost
The conduction of medium substrate and chip, manufacture craft is simple, without on the electrode of chip it is gold-plated with formed salient point and without
Conducting resinl, so the embodiment of the present invention can improve the packaging efficiency of electronic tag, reduce the encapsulation difficulty of electronic tag
And reduce the cost of manufacture of electronic tag.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of structural schematic diagram of electronic tag provided in an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram of the antenna structure of electronic tag provided in an embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of the chip-packaging structure of electronic tag provided in an embodiment of the present invention；
Fig. 4 is a kind of stereogram of the chip-packaging structure of electronic tag provided in an embodiment of the present invention；
Fig. 5 is a kind of partial structural diagram of the chip-packaging structure of electronic tag provided in an embodiment of the present invention；
Fig. 6 is a kind of structural schematic diagram of circuit layout being formed with mutiple antennas provided in an embodiment of the present invention；
Fig. 7 is a kind of structural schematic diagram of steel mesh provided in an embodiment of the present invention.
Reference sign：
1. antenna substrate；2. antenna；3. interconnecting piece；4. medium substrate；5. chip；6. encapsulated layer；7. bonding line；8. first
Bonding point；9. the second bonding point；10. insulating cement/conducting resinl；11. weld part；12. circuit layout；13. steel mesh.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In conjunction with Fig. 1 to Fig. 5, an embodiment of the present invention provides a kind of electronic tags comprising：Antenna structure and chip package
Structure；The chip-packaging structure includes medium substrate 4, chip 5 and encapsulated layer 6；The chip 5 is set to the medium substrate 4
On, at least one first bonding point 8 that the chip 5 has have by bonding line 7 and the medium substrate 4 at least 1 the
Two bonding points 9 connect one to one, to realize being electrically connected for the chip 5 and the medium substrate 4；The encapsulated layer 6 will
The chip 5 is packaged on the medium substrate 4, to realize the encapsulation of the chip 5 and the medium substrate 4.The day
Cable architecture includes antenna substrate 1 and antenna 2；The antenna 2 is set on the antenna substrate 1, and specifically, the antenna 2 can
To be printed on the antenna substrate 1, it can also be etched and be formed by the antenna substrate 1.The antenna structure and chip envelope
When both assembling structures are packaged together to form the electronic tag, the medium substrate 4 is set to the one side of the antenna substrate 1
On, and be electrically connected with the antenna 2.
Wherein, the encapsulation process of the chip-packaging structure is specially：The chip 5 is positioned over or is fixed on and is given an account of
On matter substrate 4, then the medium substrate 4 equipped with the chip 5 is put into bonding apparatus, bonding apparatus can be in the chip 5
Corresponding with the medium substrate 4 the second bonding point of the first bonding point 89 between be bonded out the bonding line 7, finally by
The chip 5 is packaged on the medium substrate 4 by the encapsulated layer 6.
Accordingly, the packaging method of the electronic tag is specially：When the chip-packaging structure and the antenna structure
After packaged, the medium substrate 4 is positioned on the antenna substrate 1, then the two is welded, so that antenna
2 are electrically connected with medium substrate 4, so that antenna 2 is electrically connected with chip 5.
In embodiments of the present invention, at least one first bonding point 8 having due to the chip 1 by bonding line 7 with
At least one second bonding point 9 that the medium substrate 4 has connects one to one, to realize chip 5 and medium substrate 4
Electrical connection, therefore compared with the prior art, the embodiment of the present invention need to only be realized by the relatively low bonding line 7 of material cost
The conduction of medium substrate 4 and chip 5, manufacture craft is simple, without gold-plated to form salient point and without adopting on the electrode of chip 5
With conducting resinl, so the embodiment of the present invention can improve the packaging efficiency of electronic tag, the encapsulation that reduces electronic tag is difficult
Spend and reduce the cost of manufacture of electronic tag.
In embodiments of the present invention, optionally, Fig. 1 and Fig. 3 are referred to, the chip 5 passes through insulating cement 10 or conducting resinl
10 is viscous on the medium substrate 4, and chip 5 is fixed on the medium substrate 4 to be realized when encapsulating chip 5
On.Certainly, the chip 5 can also be fixed on by the fixed forms such as being clamped or welding on the medium substrate 4, not done herein
It is specific to limit.
In the above-described embodiments, illustratively, the bonding line 7 can be copper bonding line 7, gold bonding wire 7, silver-colored bonding line
7 or alloy bonding line 7 etc., are not specifically limited herein.
In the above-described embodiments, illustratively, at least one first bonding point 8 is pad structure.Preferably, described
At least one second bonding point 9 is pin configuration.Certainly, first bonding point 8 can also be pin configuration or bump structure
It can also be pad structure or bump structure etc. Deng, second bonding point 9, be not specifically limited herein.
In the above embodiment, it is preferable that the encapsulated layer 6 is that (i.e. encapsulating material is asphalt mixtures modified by epoxy resin to epoxy encapsulation layer 6
Fat material).Certainly, the material of the encapsulated layer 6 can also be that organosilicon encapsulating material or polyimides encapsulating material etc. are various
Encapsulating material is not specifically limited herein.
In the above-described embodiments, illustratively, the medium substrate 4 is BT substrates or PPA substrates etc..
In the above-described embodiments, preferably, referring to Fig. 2, the antenna 2 has positioned at the described of the antenna substrate 1
The one side of interconnecting piece 3 on one side, the direction of the medium substrate 4 antenna substrate 1 is equipped with weld part 11, the welding
Portion 11 is welded and fixed with the interconnecting piece 3.
In embodiments of the present invention, it is preferable that conductive layer (not shown) is coated on the interconnecting piece 3, the conductive layer
Solderability is better than the solderability of the interconnecting piece 3, and the antenna 2 described in this way is described when the chip with electronic tag is welded
Conductive layer can be welded effectively with the weld part 11, so that it is guaranteed that the antenna 2 can be with the electronic tag
Chip 5 effectively welds together.
Preferably, being coated with conductive layer (not shown) on the interconnecting piece 3, the conductive capability of the conductive layer is than the connection
The conductive capability in portion 3 is strong, and can enhance the interconnecting piece 3 and the electronic chip in this way is conductively connected performance.Also, due to
The general material cost of the good material of electric conductivity is higher, therefore described lead only is coated on the interconnecting piece 3 of the antenna 2
Electric layer, and the other parts of the antenna 2 are made of the general material of electric conductivity, can reduce the encapsulation of the antenna 2 in this way
The material cost of structure, so as to reduce the production cost of the electronic tag.
Both in the above-described embodiments, preferably, the interconnecting piece 3 and the weld part 11 are pad structure, in this way
Well with weld together.Certainly, the interconnecting piece 3 and the weld part 11 can also be pin configuration or bump structure
Deng being not specifically limited herein.
In the above-described embodiments, further, tin cream (not shown) is brushed on the conductive layer, in this way by the antenna
2 with the chip of electronic tag when being welded, it is only necessary to by the weld part 11 of the chip-packaging structure of the electronic tag
It is directed at the interconnecting piece 3, then realizes the interconnecting piece 3 and the weld part 11 by tin cream fusing by solder reflow techniques
Welding, entire welding process are efficiently simple and reliable.
In the above-described embodiments, it preferably, the antenna substrate 1 can be pet substrate or PI substrates etc., does not do have herein
Body limits.
In the above-described embodiments, preferably, the antenna 2 is aluminium foil antenna 2 (being the antenna 2 made of aluminium foil), tool
Body, the aluminium foil antenna 2 is etched on the antenna substrate 1.
In the above embodiment, it is preferable that the conductive layer is layers of copper, that is, the conductive layer is made of copper product, in this way
It can not only make the solderability of the conductive layer good and conductive shape is good, while material cost is lower thans silver layer or layer gold etc..
In the present embodiment, for example, the concrete structure of the antenna structure of the electronic tag is preferably following two：
1, the antenna structure of the electronic tag includes：Above-mentioned aluminium foil antenna 2 and the PET equipped with the aluminium foil antenna 2
The interconnecting piece 3 of substrate, the aluminium foil antenna 2 is coated with above-mentioned layers of copper.It more preferably, can also be in remaining of the antenna 2
Partial outer surface is coated with layers of copper (i.e. 2 entire copper facing of antenna).
2, the antenna structure of the electronic tag includes：Above-mentioned aluminium foil antenna 2 and the PI bases equipped with the aluminium foil antenna 2
The interconnecting piece 3 of plate, the aluminium foil antenna 2 is coated with above-mentioned layers of copper.It more preferably, can also be in its remaining part of the antenna 2
The outer surface divided is coated with layers of copper (i.e. 2 entire copper facing of antenna).
Both specific antenna structures not only can make due to being designed using the copper-plated antennas 2 of aluminium foil antenna 2+
The good conductive that the antenna 2 can effectively weld with the chip of electronic tag and ensure the two is obtained, is also possible that simultaneously
The material cost and cost of manufacture of the antenna 2 substantially reduce (for antenna 2 is entirely made by copper).
It should be noted that the antenna 2 can also be copper foil antenna, so there is no need to be plated on the interconnecting piece 3
Copper.
Following citing is carried out to above embodiment：
The structure of the electronic tag is specially：Including the chip-packaging structure and the antenna structure, the chip
Encapsulating structure includes the medium substrate 4, the chip 5 and the encapsulated layer 6；The chip 5 is set to the medium substrate 4
On, the chip 5 is set to by the way that insulating cement 10 is viscous on the medium substrate 4；At least one first bonding point that the chip 5 has
8 are connected one to one by bonding line 7 and at least one second bonding point 9 that the medium substrate 4 has.The antenna structure
Including antenna substrate 1 and antenna 2；The antenna 2 is set on the antenna substrate 1；The antenna 2, which has, is located at the antenna
The one side of interconnecting piece 3 in the one side of substrate 1, the direction of the medium substrate 4 antenna substrate 1 is equipped with weld part
11, the weld part 11 is welded and fixed with the interconnecting piece 3；It is coated with conductive layer on the interconnecting piece 3, is brushed on the conductive layer
Tin cream.
The packaging method of electronic tag is divided into following three parts：
(1) encapsulation process of the chip-packaging structure is specially：The chip 5 is positioned over and by the insulating cement
It is fixed on the medium substrate 4, then the medium substrate 4 equipped with the chip 5 is put into bonding apparatus, bonding apparatus meeting
It is bonded out the bonding between corresponding with the medium substrate 4 the second bonding point of the first bonding point 89 of the chip 5
The chip 5 is packaged on the medium substrate 4 by line 7 finally by the encapsulated layer 6.
(2) encapsulation process of the antenna structure is specially：Fig. 6 and Fig. 7 are referred to, (circuit is arranged in a circuit layout 12
Version 12 can become the antenna substrate 1 by cutting in subsequent technique) on produce mutiple antennas 2, then in each antenna
It is coated with conductive layer on interconnecting piece 3 (preferably pad structure), then, with 12 corresponding steel mesh 13 of circuit layout (on steel mesh 13
Offer the one-to-one trepanning of interconnecting piece with each antenna on circuit layout) it is pressed together on circuit layout 12, use scraper plate
Tin cream is brushed by the trepanning on steel mesh 13 on the corresponding interconnecting piece 3 of each antenna 2.
(3) encapsulation process of the electronic tag is specially：When the chip-packaging structure and the antenna structure are each
From after packaged, the encapsulating structure of each chip 5 and the circuit layout 12 brushed with tin cream are put into togerther patch device, to allow
The two carries out surface mount, and (specially every piece of medium substrate 4 for being packaged with chip 5 is mounted on circuit layout 12, and each day
The interconnecting piece 3 of line 2 is directed at attachment one by one with the weld part 11 of every piece of medium substrate 4), being then fed into solder reflow device makes tin cream melt
Change, to complete the connection of antenna 2 and chip 5, and label core material finished product has been made.Then the label core material finished product is answered
The processes such as conjunction, cross cutting, test, quality inspection, so that the label core material finished product forms multiple electronic tags.
It is led it can be seen that the encapsulation process of the electronic tag of the present embodiment is not necessarily to and use gold-plated in the electrode of chip
Electric glue, therefore be conducive to improve the packaging efficiency of electronic tag, reduce the encapsulation difficulty of electronic tag and reduce electronic tag
Packaging cost.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those skilled in the art in technical scope disclosed by the invention, all answer by the change or replacement that can be readily occurred in
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of the claims
It is accurate.
Claims (10)
1. a kind of electronic tag, which is characterized in that including：Antenna structure and chip-packaging structure；
The antenna structure includes antenna substrate and antenna；The antenna is set on the antenna substrate；
The chip-packaging structure includes medium substrate, chip and encapsulated layer；The medium substrate is set to the antenna substrate
On on one side, and it is electrically connected with the antenna；The chip be set to the medium substrate on, the chip have at least one first
Bonding point is connected one to one by bonding line and at least one second bonding point that the medium substrate has, the encapsulated layer
By the chip package on the medium substrate.
2. electronic tag according to claim 1, which is characterized in that the antenna has the institute positioned at the antenna substrate
The interconnecting piece in one side is stated, the one side of the direction antenna substrate of the medium substrate is equipped with weld part, the weld part
It is welded and fixed with the interconnecting piece.
3. electronic tag according to claim 2, which is characterized in that the interconnecting piece and the weld part are pad knot
Structure.
4. electronic tag according to claim 2, which is characterized in that be coated with conductive layer, the conduction on the interconnecting piece
The solderability of layer is better than the solderability of the interconnecting piece, and the conductive capability of the conductive layer is than the conductive capability of the interconnecting piece
By force.
5. electronic tag according to claim 4, which is characterized in that the conductive layer is equipped with tin cream.
6. electronic tag according to claim 1, which is characterized in that the chip is set to by insulating cement or conductive gluing
On the medium substrate.
7. electronic tag according to claim 1, which is characterized in that at least one first bonding point is pad knot
Structure, at least one second bonding point is pin configuration.
8. electronic tag according to claim 1, which is characterized in that the medium substrate is BT substrates or PPA substrates.
9. electronic tag according to claim 1, which is characterized in that the antenna substrate is pet substrate or PI substrates.
10. according to claim 1 to 9 any one of them electronic tag, which is characterized in that the antenna is aluminium foil antenna or copper
Foil antenna.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810454752.3A CN108334929A (en) | 2018-05-11 | 2018-05-11 | Electronic label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810454752.3A CN108334929A (en) | 2018-05-11 | 2018-05-11 | Electronic label |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108334929A true CN108334929A (en) | 2018-07-27 |
Family
ID=62935054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810454752.3A Pending CN108334929A (en) | 2018-05-11 | 2018-05-11 | Electronic label |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108334929A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786932A (en) * | 2019-01-29 | 2019-05-21 | 上海安费诺永亿通讯电子有限公司 | A kind of preparation method of encapsulating antenna, communication equipment and encapsulating antenna |
| CN112216200A (en) * | 2020-11-02 | 2021-01-12 | 上海华力微电子有限公司 | Calibration label and manufacturing method thereof |
| CN117273050A (en) * | 2023-11-17 | 2023-12-22 | 赛维精密科技(广东)有限公司 | Electronic tag and production process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214589A (en) * | 2011-05-31 | 2011-10-12 | 华亚平 | Electronic packing method of vertical chips |
| CN102222262A (en) * | 2011-02-19 | 2011-10-19 | 上海祯显电子科技有限公司 | Novel non-contact intelligent card |
| KR101483553B1 (en) * | 2013-09-06 | 2015-01-21 | 주식회사 바른전자 | Semiconductor package comprising ferrite antenna for near filed communication and manufacturing method thereof |
| CN208207884U (en) * | 2018-05-11 | 2018-12-07 | 木林森股份有限公司 | Electronic label |
-
2018
- 2018-05-11 CN CN201810454752.3A patent/CN108334929A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102222262A (en) * | 2011-02-19 | 2011-10-19 | 上海祯显电子科技有限公司 | Novel non-contact intelligent card |
| CN102214589A (en) * | 2011-05-31 | 2011-10-12 | 华亚平 | Electronic packing method of vertical chips |
| KR101483553B1 (en) * | 2013-09-06 | 2015-01-21 | 주식회사 바른전자 | Semiconductor package comprising ferrite antenna for near filed communication and manufacturing method thereof |
| CN208207884U (en) * | 2018-05-11 | 2018-12-07 | 木林森股份有限公司 | Electronic label |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786932A (en) * | 2019-01-29 | 2019-05-21 | 上海安费诺永亿通讯电子有限公司 | A kind of preparation method of encapsulating antenna, communication equipment and encapsulating antenna |
| CN109786932B (en) * | 2019-01-29 | 2021-08-13 | 上海安费诺永亿通讯电子有限公司 | Packaged antenna, communication equipment and preparation method of packaged antenna |
| CN112216200A (en) * | 2020-11-02 | 2021-01-12 | 上海华力微电子有限公司 | Calibration label and manufacturing method thereof |
| CN117273050A (en) * | 2023-11-17 | 2023-12-22 | 赛维精密科技(广东)有限公司 | Electronic tag and production process thereof |
| CN117273050B (en) * | 2023-11-17 | 2024-02-20 | 赛维精密科技(广东)有限公司 | Electronic tag and production process thereof |
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