CN211481602U

CN211481602U - Welding auxiliary circuit board

Info

Publication number: CN211481602U
Application number: CN202020233307.7U
Authority: CN
Inventors: 彭国宾; 陈波
Original assignee: CHENGDU INFOEASY TECHNOLOGY CO LTD
Current assignee: CHENGDU INFOEASY TECHNOLOGY CO LTD
Priority date: 2020-02-29
Filing date: 2020-02-29
Publication date: 2020-09-11
Anticipated expiration: 2030-02-28

Abstract

The utility model relates to a circuit board welding assists the field, discloses a welding auxiliary circuit board, including the keysets that is used for covering thing networking chip welding position on the water gauge mainboard, the keysets includes the chip place position that is used for installing thing networking chip, be provided with a plurality of pin welding positions that are used for with thing networking chip pin one-to-one around the chip place position; a plurality of stamp holes which correspond to the pin welding positions one by one are respectively formed in two sides of the adapter plate; the pin soldering locations extend to the edge of the stamp hole. The utility model discloses effectively solved because weld the thing networking chip repeatedly and lead to contact failure scheduling problem.

Description

Welding auxiliary circuit board

Technical Field

The utility model relates to a circuit board welding auxiliary field, concretely relates to welding auxiliary circuit board.

Background

The current NB _ IOT Internet of things water meter is generally provided with a patch-type QFN packaged SIM card in order to save the size of a board and reduce the problem of poor contact caused by plugging and pulling of the traditional SIM card and waterproof encapsulation, but each tap water company requires the SIM card to be provided, so that the production side is inconvenient to stock, for example, the same batch of boards are used as one card when the patch is produced, but after the SIM card is taken down, the SIM card is taken down and then the other is welded, due to the particularity of the QFN package, the problem that the patch-type SIM card is easy to be subjected to virtual welding and short circuit is solved, and the failure rate of the product is increased.

SUMMERY OF THE UTILITY MODEL

The utility model provides a welding auxiliary circuit board for solve the complicated and contact failure problem of operation that current water gauge leads to because of welding thing networking chip repeatedly.

The welding auxiliary circuit board comprises a switching board used for covering the welding position of the chip of the Internet of things on the water meter mainboard, the switching board comprises a chip placing position used for installing the chip of the Internet of things, and a plurality of pin welding positions which are in one-to-one correspondence with the pins of the chip of the Internet of things are arranged on the periphery of the chip placing position; a plurality of stamp holes which correspond to the pin welding positions one by one are respectively formed in two sides of the adapter plate; the pin soldering locations extend to the edge of the stamp hole.

The noun explains:

water meter main board: the circuit board is used for mounting main electronic components of the water meter and is generally used for welding an Internet of things chip.

Stamp hole punching: the half-hole of the printed circuit board is named as a stamp with the shape of the periphery.

The utility model has the advantages of, through the stamp hole, can connect the thing networking chip of being connected with pin welding position through connecting the pin welding position that extends to stamp hole department, need not pull out repeatedly like this and insert the welding SIM card, just can directly pass through the keysets, accomplish the change to thing networking chip, effectively solved directly weld the thing networking chip and dismantle and the various troubles that arouse.

Further, the adapter plate is of a rectangular block structure.

The plate with the structure is preferably processed and saves cost.

Furthermore, the number of stamp holes on one side of the adapter plate is four, and the number of pin welding positions corresponding to the stamp holes on the side is also four.

The pin welding positions are directly related to the pin distribution of the Internet of things chip, and the stamp holes correspondingly arranged can facilitate welding connection.

Further, the edges of the stamp hole are coated with a metal layer.

The stamp hole and the adapter plate on the main board are convenient to weld by spot welding.

Further, a metal layer is coated on the pin welding position.

The lead is formed at the pin welding position through the metal layer, so that the chip of the Internet of things can be welded and communicated at the pin welding position, and the connecting pin welding position can be communicated with the chip of the Internet of things.

Furthermore, the diameter of each stamp hole is larger than the welding point of the adapter plate on the corresponding water meter main board.

The welding of the adapter plate welding point and the stamp hole is facilitated.

Drawings

Fig. 1 is a schematic view of the connection structure between the transit plate and the water meter main board of the present invention.

Detailed Description

The following is further detailed by way of specific embodiments:

reference numerals in the drawings of the specification include: the water meter comprises an adapter plate 10, a chip placing position 11, a pin welding position 12, a water meter mainboard 20 and an adapter plate welding point 21.

Example one

The embodiment is basically as shown in the attached figure 1: the auxiliary welding circuit board comprises an adapter plate 10 for covering the welding position of the chip of the internet of things on the water meter main board 20, wherein adapter plate welding points 21 for connecting the adapter plate 10 are distributed on the periphery of the welding position of the chip of the internet of things; a first chip placing position 11 for welding an internet of things chip is arranged in the middle of the adapter plate 10, pin welding positions 12 for connecting pins of the internet of things chip are distributed around the chip placing position 11, and stamp holes of the adapter plate 10 connected with the pin welding positions 12 are distributed around the pin welding positions 12; the stamp holes of the adapter plate 10 correspond to the adapter plate welding points 21 on the internet of things mainboard one by one.

The existing internet of things chip usually adopts a SIM card form.

When the chip of the internet of things is welded through the auxiliary welding board, the following auxiliary welding method is adopted:

s1, welding the chip of the Internet of things to the adapter plate 10; respectively welding different chips of the internet of things on different adapter plates 10; after determining which internet of things the water meter will access, the adapter plate 10 provided with the corresponding internet of things chip is welded to the water meter mainboard 20. The chip of the internet of things is placed on the chip placing position 11, pins of the chip of the internet of things are respectively aligned to the pin welding positions 12, and then the corresponding pins of the chip of the internet of things are welded on the corresponding pin welding positions 12 through the welding agent. The welding agent can be the existing welding material, such as tin paste, tin bar and the like.

Step two, corresponding the stamp hole of the adapter plate 10 to each adapter plate welding point 21 on the water meter mainboard 20; the pin welding position 12 has a vacant position after welding the internet of things chip pin. Through the vacant position, conveniently be connected with adapter plate welding point 21 with the welding flux, avoid with the contact of thing networking chip. Each pin welding position 12 is located in the middle of the arc of the corresponding stamp hole, the center line of each pin welding position 12 is located on the diameter extension line of the corresponding stamp hole, and the stamp hole and the adapter plate welding point 21 are aligned by aligning the center line of the pin welding position 12 and the diameter of the adapter plate welding point 21 wrapped by the stamp hole.

And step three, welding the corresponding adapter plate welding point 21 and the pin welding position 12.

The specific implementation process is as follows:

in order to save the size of a board and reduce the problem of poor contact caused by the plugging and the waterproof encapsulation of a traditional SIM card, the prior NB _ IOT Internet of things water meter generally adopts a patch type QFN encapsulated SIM card, which solves the problems, but because each tap water company requires the SIM card to be provided, the production party is inconvenient to stock, for example, one batch of boards are used, when the patch is produced, one card is used, but after the SIM card is taken down and welded, the other card is required to be replaced, due to the particularity of the QFN encapsulation, the problem that the patch type SIM card is easy to be welded in a virtual welding mode and a short circuit mode is determined, the failure rate of the product is improved, a method is provided for solving the problem, even if one switching circuit is used, the switching circuit is convenient to arrange the board and is equivalent to the SIM card in area, the welding is put on and taken off, and the following mode is adopted for convenience:

firstly, designing a circuit board with double rows of stamp holes, reserving a component with the size of the circuit board on a mainboard for packaging, and in the process of producing a patch on the mainboard, regardless of the SIM card part, meeting the requirement of stock; then the SIM cards of different manufacturers are pasted on the adapter plate 10 in the later stage, the adapter plate 10 and the mainboard are just the connection relation of the double-row chip with stamp holes, and an electric soldering flux is assisted during welding to facilitate welding, so that the problems of insufficient soldering and short circuit caused by directly welding the card of QFN are avoided, and the adapter plate 10 with the SIM card is used to facilitate material supply by supplying tap water in the using process.

Example two

The difference between the first embodiment and the second embodiment is that the pin soldering position 12 includes an oval connecting portion for connecting with the chip placed on the chip placement position 11 and a bar-shaped connecting portion extending to the stamp hole, and the area of the oval connecting portion per unit length is larger than that of the bar-shaped connecting portion, so that the pins of the chip can be completely placed on the oval connecting portion, chip soldering is facilitated, and meanwhile, the coverage of the metal layer on the bar-shaped connecting portion can be reduced, and a certain cost-saving effect can be achieved.

EXAMPLE III

In this embodiment, the total number of the pin soldering positions 12 is eight, and the pin soldering positions 12 are respectively distributed on two sides of the chip soldering position, and the positions of the pin soldering positions correspond to the positions of the stamp holes, so that the pin soldering positions 12 can be conveniently connected to the stamp holes in the shortest distance. The inner side of the circular arc of the stamp hole is coated with a metal layer communicated with the pin position, which is beneficial to quickly finishing welding through the stamp hole and a welding point on the mainboard. In this embodiment, the length of the pin welding position 12 is 1.5 times to 2 times the diameter of the stamp hole, and within this length range, the cost can be reduced as much as possible on the basis of ensuring the communication effect.

Example four

In this embodiment, the top surface of the adapter plate 10 is a smooth plane, and the bottom surface of the adapter plate 10 is a frosted plane with a certain roughness, so that the operation is simple, that is, only the top surface of the adapter plate 10 is a smooth painted surface, which is beneficial to quickly positioning the adapter plate 10 due to the friction between the adapter plate 10 and the motherboard when the adapter plate 10 is placed on the motherboard, and is beneficial to welding the adapter plate 10.

The descriptions in the above embodiments and the like can be used to explain the contents of the claims.

Claims

1. A welding auxiliary circuit board is characterized in that: the water meter comprises a patch panel for covering the welding position of an Internet of things chip on a water meter mainboard, wherein the patch panel comprises a chip placing position for mounting the Internet of things chip, and a plurality of pin welding positions which are in one-to-one correspondence with the pins of the Internet of things chip are arranged on the periphery of the chip placing position; a plurality of stamp holes which correspond to the pin welding positions one by one are respectively formed in two sides of the adapter plate; the pin soldering locations extend to the edge of the stamp hole.

2. The soldering assist circuit board according to claim 1, wherein: the adapter plate is of a rectangular block structure.

3. The soldering assist circuit board according to claim 1, wherein: the number of the stamp holes on one side of the adapter plate is four, and the number of the pin welding positions corresponding to the stamp holes on the side is also four.

4. The soldering assist circuit board according to claim 1, wherein: the edges of the stamp holes are coated with a metal layer.

5. The soldering assist circuit board according to claim 4, wherein: and a metal layer is coated on the pin welding position.

6. The soldering assist circuit board according to claim 4, wherein: the diameter of each stamp hole is larger than the welding point of the adapter plate on the corresponding water meter mainboard.