CN115151016A - Plastic packaging power supply product and plastic packaging method thereof - Google Patents
Plastic packaging power supply product and plastic packaging method thereof Download PDFInfo
- Publication number
- CN115151016A CN115151016A CN202110342931.XA CN202110342931A CN115151016A CN 115151016 A CN115151016 A CN 115151016A CN 202110342931 A CN202110342931 A CN 202110342931A CN 115151016 A CN115151016 A CN 115151016A
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- China
- Prior art keywords
- plastic
- product
- pins
- metal
- pin
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- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 56
- 238000003466 welding Methods 0.000 claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 238000007689 inspection Methods 0.000 abstract 1
- 238000005493 welding type Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 2
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Multi-Conductor Connections (AREA)
- Packages (AREA)
Abstract
The invention provides a plastic-packaged power supply product and a packaging method thereof, wherein the plastic-packaged power supply product comprises a PCB (printed circuit board), a top-layer plastic-packaged body, a bottom-layer plastic-packaged body, discrete devices, magnetic devices and pins, the discrete devices are distributed on the upper side and the lower side of the PCB, the magnetic devices are assembled on the PCB, the pins are connected to the two sides of the plastic-packaged power supply product, the pins comprise metal pins and plastic bodies, parts of the metal pins are wrapped by the plastic bodies, metal pads in the parts are exposed to the surface of the plastic bodies due to first grooves formed in the surface of the plastic bodies, the metal pads are used for enabling the pins to be connected into the packaged power supply product, through holes are formed in the middle of the metal pads, third grooves are formed in the plastic bodies at positions corresponding to the through holes, the through holes are communicated with the third grooves and used for observing welding conditions from the outside of the product, and the parts of the metal pins which are not wrapped by the plastic bodies are used as product pins. The invention fully utilizes the through holes of the metal pins, facilitates the inspection of the pins after welding, and increases the types of welding process methods of the pins.
Description
Technical Field
The invention relates to the field of plastic package power supplies, in particular to a pin structure of a power supply product and a pin assembling method.
Background
The pin is drawn forth to current two-sided plastic envelope power product edgewise, and in the pin structure, as with the metal pin part of pad welding, generally 2:
one is that the plastic body covers the metal pin of the part completely, after the pin is welded with the product, the welding effect of the welding part can not be checked, and the pin structure limits the welding scheme, and only the whole product can be heated, such as reflow welding;
the other is that the metal pins of the part are completely exposed outside the plastic body, welding spots can be seen on the surface of the product after the pin structure is welded, the welding effect is convenient to check, however, if the welding spots have appearance problems, the integral appearance of the product is directly influenced, and the pin structure is inconvenient for adding solder paste.
Disclosure of Invention
The invention aims to solve the technical problem of providing a power supply product with double-sided plastic package, wherein after welding, welding spots are not exposed on the surface of a pin plastic body and can be detected. The pin welding mode can be used for laser welding besides reflow welding.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a plastic envelope power supply product includes the PCB board, the top layer plastic-sealed body, the bottom plastic-sealed body, discrete device, magnetic device and pin, discrete device distributes on the upper and lower both sides of PCB board, magnetic device assembles on the PCB board, the pin is connected in plastic envelope power supply product both sides, the pin includes metal pin and plastic body, metal pin's part is wrapped up by the plastic body, and the metal pad in this part exposes in the plastic body surface because of the first recess that the plastic body surface was seted up, the metal pad is used for making pin access encapsulation power supply product, there is the through-hole in the middle of the metal pad, it has the third recess to open on the plastic body that the through-hole position corresponds the department, through-hole and third recess communicate with each other, be used for observing the welding condition from the product outside, the part that metal pin did not wrap up by the plastic body is as the product pin.
Preferably, the length and the width of the cross section of the first groove are both larger than those of the metal pad, and the depth of the metal pad is larger than or equal to 0.
Preferably, the third groove has a larger diameter than the through hole.
Preferably, portions of the metal pins are wrapped by the plastic body and bent for reinforcement.
Preferably, the metal pins are partially wrapped by the plastic body and have a vertical shape without bending.
As an embodiment of the part of the vertical-shaped metal pins, there are through holes or protrusions or grooves for reinforcing the connection of the metal pins with the plastic body.
Preferably, the surface of the plastic body is further provided with a second groove, and the second groove and the first groove are located on the same surface and used for coating adhesive to enable the pins to be adhered into the packaged power supply product.
Preferably, the pins are connected to two sides of the plastic package power supply product through reflow soldering or laser welding, and when the laser welding is adopted, laser energy is transmitted to solder paste through the through holes.
Preferably, the product pins are pin packages of a package or a patch.
The invention also provides a power supply product packaging method, wherein the power supply product comprises a PCB, a top layer plastic package body, a bottom layer plastic package body, a discrete device, a magnetic device and a pin, and the method comprises the following steps:
discrete devices are distributed on the upper side and the lower side of the PCB;
assembling a magnetic device, namely assembling the magnetic device on a PCB;
a pin packaging step, namely wrapping the metal pin part by a plastic body, forming a first groove on the surface of the plastic body, exposing a metal pad in the metal pin part to the surface of the plastic body, forming a through hole in the middle of the metal pad, and forming a third groove on the plastic body at the position corresponding to the through hole, so that the through hole is communicated with the third groove;
and a pin assembling step, wherein the pin is connected into a packaged power supply product through reflow soldering or laser welding, and when the laser welding is adopted, laser energy is transmitted to solder paste through the through hole.
The scheme of the invention has the following beneficial effects:
1. after the pin is welded, the welding condition of a welding spot can be detected through the through holes of the plastic body and the metal pin, the welding spot is sunken in the plastic body and is difficult to see on the appearance of the welding pad, and the attractiveness of the appearance of a product is ensured;
2. can add the tin cream for the pin through the through-hole of the plastic body and the through-hole of metal pin, then carry out laser welding, laser energy passes through the through-hole of the plastic body and gives the tin cream transmission energy, accomplishes the welding of tin cream to pin and product.
Drawings
FIG. 1 is a front view of a product according to an embodiment of the present invention;
FIG. 2 is a front view of a product pin according to an embodiment of the present invention;
FIG. 3 is a perspective view of a product pin according to an embodiment of the invention;
FIG. 4 is a perspective view of a product according to an embodiment of the invention;
FIG. 5 is a cross-sectional view of a product pin according to an embodiment of the present invention;
fig. 6 is a cross-sectional view of a product pin according to an embodiment of the invention.
Detailed Description
The technical scheme of the invention is explained in detail with reference to the attached drawings.
Referring to fig. 1, the product of the embodiment of the invention is composed of a PCB 4, a top plastic package 5, a bottom plastic package 6, a discrete device 8, a magnetic device 7 and a pin 1. Discrete devices 8 are distributed on the upper and lower sides of the PCB 4, and magnetic devices 7 are assembled on the PCB. As shown in fig. 2, the lead 1 is composed of a metal lead 2 and a plastic body 3. The plastic body 3 wraps the portion of the metal pin 2, and the metal pad 202 in the portion is exposed to the surface of the plastic body due to the first groove 301 formed on the surface of the plastic body 3, as shown in fig. 3. The surface of the plastic body 3 is further provided with a second groove 302 for printing adhesive or dispensing adhesive for assembling into a power product. As shown in fig. 4, a through hole 203 is formed in the middle of the metal pad 202, a third groove 303 is formed in the plastic body 3 corresponding to the through hole 203, the through hole 203 is communicated with the third groove 303, so that the welding condition can be observed from the outside of the product, the pin 201 in the metal pin is used as a mounting pin of the product, and the product can be in a plug-in type or a patch type. The plastic body can be designed into a limiting structure for a product, so that the deviation tolerance of the pins can be controlled after the pins are assembled.
First embodiment
As shown in fig. 5, the portion of the metal pin 2 wrapped by the plastic body 3 is bent to ensure that the metal pin 2 can be fixed in the plastic body 3, thereby avoiding the occurrence of movement.
As shown in fig. 4, after the pin of the embodiment is installed in the power supply product, the specific assembly process is as follows:
solder paste is printed on the metal pad 202, meanwhile, adhesive glue is printed or dispensed on the second groove 302, then the pin 1 is installed in a power supply product by the steps, then, soldering can be completed through reflow soldering, and the soldered solder joint is in the third groove 303 and can be checked through the condition of the third groove 303;
welding can also be completed by laser welding, and the focus point of the laser welding is adjusted to enable the laser beam to reach the solder paste through the third groove 303 and the through hole 203, so that the solder paste is heated to finally complete welding.
Second embodiment
Referring to fig. 6, the difference between the present embodiment and the first embodiment is that the portion of the metal lead 2 wrapped by the plastic body 3 is vertical and is not bent. The leads of the structure are easier to manufacture, and the thickness of the plastic body 2 corresponding to the structure can be thinner than that of the first embodiment. In order to fix the metal pins 2 in the plastic body 3, a fool-proof design can be opened at the wrapped part of the metal pins 2, for example, via holes or side wings are added, so that the metal pins 2 can be ensured to be fixed in the plastic body 3.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and it will be apparent to those skilled in the art that several modifications and decorations can be made without departing from the spirit and scope of the present invention, and these modifications and decorations should also be considered as the protection scope of the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims.
Claims (10)
1. The utility model provides a plastic envelope power product includes PCB board, top layer plastic-sealed body, bottom plastic-sealed body, discrete device, magnetic device and pin, and discrete device distributes in the upper and lower both sides of PCB board, and magnetic device assembles on the PCB board, and the pin is connected in plastic envelope power product both sides, its characterized in that: the pin includes metal pin and the plastic body, metal pin's part is wrapped up by the plastic body, and the metal pad in this part exposes in the plastic body surface because of the first recess that the plastic body surface was seted up, the metal pad is used for making the pin insert the encapsulation power product, there is the through-hole in the middle of the metal pad, it has the third recess to open on the plastic body that the through-hole position corresponds the department, through-hole and third recess communicate with each other for observe the welding condition from the product outside, metal pin does not regard as the product pin by the part of plastic body parcel.
2. The packaged power product of claim 1, wherein: the length and the width of the cross section of the first groove are both larger than those of the metal bonding pad, and the depth of the metal bonding pad is larger than or equal to 0.
3. The packaged power product of claim 1, wherein: the diameter of the third groove is larger than that of the through hole.
4. The packaged power product of claim 1, wherein: the metal pins are partially wrapped by the plastic body and bent for reinforcement.
5. The packaged power product of claim 1, wherein: the metal pins are wrapped by the plastic body, are vertical and are not bent.
6. The packaged power product of claim 5, wherein: the metal pin part is provided with a through hole or a bulge or a groove for reinforcing the connection of the metal pin and the plastic body.
7. The packaged power product of claim 1, wherein: and a second groove is formed on the surface of the plastic body, and the second groove and the first groove are positioned on the same surface and used for coating bonding glue so that the pins are bonded into a packaged power supply product.
8. The packaged power product of claim 1, wherein: the pins are connected to two sides of the plastic package power supply product through reflow soldering or laser welding, and when the laser welding is adopted, laser energy is transmitted to solder paste through the through holes.
9. The packaged power product of claim 1, wherein: the product pins are pin packages of a plug-in or a patch.
10. A power supply product packaging method comprises a PCB, a top layer plastic package body, a bottom layer plastic package body, a discrete device, a magnetic device and pins, and is characterized by comprising the following steps:
discrete devices are distributed on the upper side and the lower side of the PCB;
assembling the magnetic device, namely assembling the magnetic device on the PCB;
a pin packaging step, namely wrapping the metal pin part by a plastic body, forming a first groove on the surface of the plastic body, exposing a metal pad in the metal pin part to the surface of the plastic body, forming a through hole in the middle of the metal pad, and forming a third groove on the plastic body at the position corresponding to the through hole, so that the through hole is communicated with the third groove;
and assembling the pins, namely connecting the pins into a packaged power supply product through reflow soldering or laser welding, wherein when the laser welding is adopted, laser energy is transmitted to solder paste through the through holes.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110342931.XA CN115151016A (en) | 2021-03-30 | 2021-03-30 | Plastic packaging power supply product and plastic packaging method thereof |
| PCT/CN2022/082180 WO2022206469A1 (en) | 2021-03-30 | 2022-03-22 | Plastic-packaged power supply product and plastic packaging method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110342931.XA CN115151016A (en) | 2021-03-30 | 2021-03-30 | Plastic packaging power supply product and plastic packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115151016A true CN115151016A (en) | 2022-10-04 |
Family
ID=83403634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110342931.XA Pending CN115151016A (en) | 2021-03-30 | 2021-03-30 | Plastic packaging power supply product and plastic packaging method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115151016A (en) |
| WO (1) | WO2022206469A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115547964A (en) * | 2022-11-29 | 2022-12-30 | 广东汇芯半导体有限公司 | Power device with discrete pins and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2891315B2 (en) * | 1992-10-13 | 1999-05-17 | 三菱電機株式会社 | Integrated circuit device |
| KR102580836B1 (en) * | 2018-11-14 | 2023-09-20 | 삼성전기주식회사 | Interposer and package structure having the same |
| CN110752197B (en) * | 2019-09-30 | 2022-09-16 | 华为技术有限公司 | Lead frame, packaged integrated circuit board, power supply chip and packaging method of circuit board |
| CN112839437B (en) * | 2020-12-31 | 2022-04-15 | 广州金升阳科技有限公司 | Double-sided plastic package power supply product |
-
2021
- 2021-03-30 CN CN202110342931.XA patent/CN115151016A/en active Pending
-
2022
- 2022-03-22 WO PCT/CN2022/082180 patent/WO2022206469A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115547964A (en) * | 2022-11-29 | 2022-12-30 | 广东汇芯半导体有限公司 | Power device with discrete pins and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022206469A1 (en) | 2022-10-06 |
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