CN207148889U - smart card - Google Patents
smart card Download PDFInfo
- Publication number
- CN207148889U CN207148889U CN201721043520.6U CN201721043520U CN207148889U CN 207148889 U CN207148889 U CN 207148889U CN 201721043520 U CN201721043520 U CN 201721043520U CN 207148889 U CN207148889 U CN 207148889U
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- China
- Prior art keywords
- substrate
- chip
- smart card
- pad
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of smart card, including：First substrate；The second substrate for facing and being spaced with first substrate；And the circuit board between first substrate and second substrate, the side of circuit board, which is sticked, chip and pad, and pad is surrounded on the periphery of chip.Smart card provided by the utility model; the periphery of chip is provided with the pad for avoiding chip from being bent over damage; the any position that chip can be set on circuit boards is protected by pad, solves the problems, such as that the pin position of chip during chip stress and pad are easily separated from.
Description
Technical field
The utility model belongs to IC-card field, is to be related to a kind of smart card more specifically.
Background technology
Smart card is a kind of card-like product common and closely related in people's daily life, as telecommunications card (GSM card,
SIM card, CDMA cards etc.), bank card, transportation card, the contact intelligent card such as city one-card, have become in people's daily life
Indispensable article.For example, only a kind of product of telecommunications card, Chinese output are about annual all more than 800,000,000 according to statistics.
In the prior art, chip is generally located on the center line of the length and width of smart card, or length and width located at smart card
The approximate centerline of degree, now chip is easiest to be bent over damaging, and the placement position of chip also receives constraint.
Utility model content
The purpose of this utility model is to provide a kind of smart card, easily rolled over solving chip present in prior art
Curved damage, and the placement position of chip also receives the technical problem of constraint.
To achieve the above object, the technical solution adopted in the utility model is：A kind of smart card is provided, including：First base
Plate；The second substrate for facing and being spaced with the first substrate；And located at the first substrate and the second substrate it
Between circuit board, the side of the circuit board, which is sticked, chip and pad, and the pad is surrounded on the periphery of the chip.
Further, it is connected between the first substrate, the circuit board, the second substrate by encapsulating.
Further, offered on the circuit board and lead glue hole.
Further, the side of the pad has some breach for being used to lead glue.
Further, the section for leading glue hole is circle.
Further, the chip and the pad are respectively positioned between the circuit board and the first substrate.
Further, there is gap between the pad and the chip.
Further, the through hole for accommodating IC modules is offered on the first substrate, and the size of the through hole is more than institute
State the size of IC modules.
Further, the IC modules are the contact module of the smart card.
Further, center, the center and described first are folded between the first substrate and the second substrate
Substrate and the second substrate form the holding tank for accommodating the circuit board together.
The beneficial effect of smart card provided by the utility model is：Compared with prior art, the utility model smart card,
Be sticked chip on circuit board between first substrate and second substrate, and the periphery of chip is provided with and avoids chip from being bent over damaging
Bad pad, any position that can be set chip on circuit boards is protected by pad, when solving chip stress
The problem of pin position of chip and pad are easily separated from.
Brief description of the drawings
, below will be to embodiment or prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
The required accompanying drawing used is briefly described in description.It should be evident that drawings in the following description are only that this practicality is new
Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the main structure diagram for the smart card that the utility model embodiment provides；
Fig. 2 is the sectional structure chart of the line A-A along Fig. 1；
Fig. 3 be the utility model embodiment used by circuit board structural representation.
Wherein, each reference in figure：
1- first substrates；2- second substrates；3- circuit boards；4- centers；5- holding tanks；6- colloids；11- through holes；12-IC moulds
Block；31- chips；32- pads；33- leads glue hole；321- breach.
Embodiment
In order that technical problem to be solved in the utility model, technical scheme and beneficial effect are more clearly understood, with
Lower combination drawings and Examples, the utility model is further elaborated.It is it should be appreciated that described herein specific real
Example is applied only to explain the utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of and describes the utility model and simplified description, rather than the device or element of instruction or hint meaning is necessary
With specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In description of the present utility model, " multiple " are meant that two or two
More than, unless otherwise clearly specifically defined.
Also referring to Fig. 1 to Fig. 3, now smart card provided by the utility model is illustrated.Smart card, including first
Substrate 1；The second substrate 2 for facing and being spaced with first substrate 1；And the electricity between first substrate 1 and second substrate 2
Road plate 3, the side of circuit board 3, which is sticked, chip 31 and pad 32, and pad 32 is surrounded on the periphery of chip 31, is opened on circuit board 3
Provided with leading glue hole 33.
Smart card provided by the utility model, compared with prior art, the electricity between first substrate 1 and second substrate 2
Be sticked chip 31 on road plate 3, and the periphery of chip 31 is provided with the pad 32 for avoiding chip 31 from being bent over damage, passes through pad 32
Protection chip 31 can be arranged on to any position on circuit board 3, the pin position of chip 31 when solving 31 stress of chip
The problem of being easily separated from pad.
Specifically, first substrate 1 and second substrate 2 be arranged in parallel relatively, and circuit board 3 is arranged on the He of first substrate 1
Inner space between second substrate 2, chip 31 are sticked on the conformable region reserved on circuit board 3, and pad 32 is to be arranged on
The annular of the periphery of chip 31 or the pad 32 of frame-type, the pad 32 by being looped around the outside of chip 31 can be to chip 31 around
Circuit board 3 play a part of strengthen intensity, so as to avoid the damage of chip 31.Wherein, circuit board 3 typically uses FPC
(Flexible Printed Circuit) circuit board, as flexible PCB.Preferably, chip 31 be shaped as it is square, pad
Piece 32 is the framework for being looped around the outside of chip 31.Certainly, according to actual conditions and real needs, in other realities of the present utility model
Apply in example, the shape of chip 31 can also be circular or ellipse etc., then pad 32 is annular ring body or oval ring body
Deng not limiting uniquely herein.
Further, referring to Fig. 2, a kind of embodiment as smart card provided by the utility model, first
It is connected between substrate 1, circuit board 3, second substrate 2 by encapsulating.Specifically, encapsulating is i.e. in first substrate 1, circuit board 3, the
Glue is filled between two substrates 2 and forms colloid 6.Due to the presence of pad 32, in the manufacturing process of smart card, to make glue
It can be fully filled around chip 31, be not in that glue causes the pin position of chip 31 and pad to be easily separated from without solidification
Cause situation about can not be used after the glue solidifies, therefore setting is led glue hole 33 and passed through for glue, ensures that glue can pour into chip
So that chip 31 be fixed around 31.Certainly, according to actual conditions and real needs, in other implementations of the present utility model
In example, the other machinery connected mode such as bonding can also be used to carry out between first substrate 1, circuit board 3 and second substrate 2
Connection, is not limited uniquely herein.
Further, referring to Fig. 3, a kind of embodiment as smart card provided by the utility model, pad
32 side has the breach 321 for being used for leading glue.Specifically, the pad 32 is looped around the outside of chip 31.Preferably, pad 32
Shape and the shape of chip 31 are consistent, and the main purpose for setting breach 321 is to avoid the component on circuit board 3.Wherein,
The framework for being shaped as three faces and enclosing of when being shaped as square of chip 31, now pad 32；When being shaped as circle of chip 31, this
When pad 32 be shaped as incomplete annular.
Further, referring to Fig. 2, a kind of embodiment as smart card provided by the utility model, circuit
Offered on plate 3 and lead glue hole 33.By leading the setting in glue hole 33 by the gap between circuit board 3 and first substrate 1 and circuit
Gap between plate 3 and second substrate 2 is conducted, and is advantageous to glue when encapsulating is laminated by leading glue hole 33 and flows into chip 31
Around, avoid because the setting of pad 32 causes that glue can not be filled around chip 31, chip 31 when solving 31 stress of chip
Pin position and pad the problem of being easily separated from.
Preferably, refering to Fig. 2 and Fig. 3, as a kind of embodiment of smart card provided by the utility model, glue is led
The quantity in hole 33 is two, and two are led the opposite sides that glue hole 33 is located at breach 321 respectively.Specifically, setting for glue hole 33 is led
It is to enable glue to be fully filled around chip 31 to put, and is not in that glue does not solidify, causes the pin position of chip 31
The situation for causing can not to be used after the glue solidifies is easily separated from pad.Two lead that glue hole 33 is separately positioned on breach 321 two
Side, it can ensure that glue can avoid the occurrence of chip 31 1 by being filled uniformly with after leading glue hole 33 to around chip 31
Side is not by the complete filling of phenomenon of glue.Certainly, according to actual conditions and real needs, in other embodiment of the present utility model
In, lead glue hole 33 and may be arranged as optional positions that are multiple, and being separately positioned on the periphery of pad 32, do not limit uniquely herein
It is fixed.
Further, referring to Fig. 3, a kind of embodiment as smart card provided by the utility model, leads glue
The section in hole 33 is circle.Specifically, joining place is not present in circular glue hole 33 of leading, and can effectively ensure that circuit board 3 is being rolled over
The presence in glue hole 33 will not be led when curved because of circle reduces bending intensity.Certainly, according to actual conditions and real needs, in this reality
Can also be the shape such as square, triangle or ellipse with the cross sectional shape in glue hole in new other embodiment, is led, herein not
Make unique limit.
Further, refering to Fig. 2, as a kind of embodiment of smart card provided by the utility model, chip 31
And pad 32 is respectively positioned between circuit board 3 and first substrate 1.Specifically, the chip 31 and the pad 32 are all disposed within circuit board 3
The same side.During normal use, second substrate 2 is located at the downside of first substrate 1, and chip 31 and pad 32 are located at circuit board 3 and carried on the back
From the side of second substrate 2, i.e. chip 31 and pad 32 is located at the upside of circuit board 3.Certainly, according to actual conditions and specific need
Ask, in other embodiment of the present utility model, it is relative with second substrate 2 that chip 31 and pad 32 may be located on circuit board 3
Side, do not limit uniquely herein.
Further, referring to Fig. 2, a kind of embodiment as smart card provided by the utility model, pad
There is gap between 32 and chip 31.Specifically, chip 31 and pad 32 are all disposed within circuit board 3 close to the one of first substrate 1
Side.When thering is the gap to enable to the encapsulating to operate between first substrate 1 and pad 32, glue can by pad 32 and chip 31 it
Between gap pour into around chip 31；Gap between pad 32 and chip 31 can prevent pad 32 and the pin position of chip 31 from connecing
Touch and cause the short circuit of chip 31, be also beneficial to glue and fill up chip 31, it is equal around chip 31 so as to effectively ensure
Even filling.
Further, refering to Fig. 1, as a kind of embodiment of smart card provided by the utility model, IC modules
12 be the contact module of smart card.Specifically, function of the function of IC modules 12 equivalent to 7816 interface units in the prior art.
The through hole 11 for accommodating IC modules 12 is offered on first substrate 1, the size of through hole 11 is more than the size of IC modules 12.By IC modules
12 are placed on through hole 11, and are directly welded on circuit board 3, and IC modules 12 are connected with chip 31 and are fabricated to smart card.
Further, a kind of embodiment as smart card provided by the utility model, IC modules 12 are intelligence
The contact module of card.Specifically, function of the function of IC modules 12 equivalent to the contact module of 7816 interface units in the prior art.
The conducting medium of IC modules 12 and the lead terminal of circuit board 3 is welded, and IC modules 12 connect system with the chip 31 on circuit board 3
It is made smart card.Preferably, standard card is used in smart card made from the present embodiment, IC modules 12 are in the position of first substrate 1
Meet standard card code requirement.Certainly, according to actual conditions and real needs, in other embodiment of the present utility model, intelligence
The specification and IC modules 12 that can block can also not meet the code requirement of standard card in the position of first substrate 1, not make herein only
One limits.
Further, referring to Fig. 2, a kind of embodiment as smart card provided by the utility model, first
Center 4 is folded between substrate 1 and second substrate 2, center 4 is formed together with first substrate 1 and second substrate 2 for accommodating electricity
The holding tank 5 of road plate 3.Specifically, holding tank 5 is that center 4 is combined the framework to be formed with first substrate 1 and second substrate 2
Internal receiving space.Center 4 is used to carry out circuit board 3 spacing and protection, is easy to process for filling colloid, realizes overall assembling.In
The outer rim shape of frame 4 is adapted with the outer rim shape of first substrate 1.The shape of the first substrate 1 is the shape of standard card, in square
Shape.Circuit board 3 is rectangular, and the outer rim of center 4 is rectangular, the rectangular in cross-section of holding tank 5.The outer rim shape of circuit board 3 is with accommodating
The section of groove 5 is adapted, compact-sized.Certainly, the smart card in the present embodiment is alternatively nonstandard card, without limit first substrate 1,
Center 4, circuit board 3 are rectangle, can freely customize its shape.
Preferred embodiment of the present utility model is these are only, it is all in this practicality not to limit the utility model
All any modification, equivalent and improvement made within new spirit and principle etc., should be included in guarantor of the present utility model
Within the scope of shield.
Claims (10)
1. smart card, it is characterised in that including：
First substrate；
The second substrate for facing and being spaced with the first substrate；And
Circuit board between the first substrate and the second substrate, the side of the circuit board are sticked and have chip and pad
Piece, the pad are arranged at the periphery of the chip.
2. smart card as claimed in claim 1, it is characterised in that：The first substrate, the circuit board, the second substrate
Between be connected by encapsulating.
3. smart card as claimed in claim 1, it is characterised in that：The side of the pad has some for leading lacking for glue
Mouthful.
4. smart card as claimed in claim 1, it is characterised in that：Offered on the circuit board and lead glue hole.
5. smart card as claimed in claim 4, it is characterised in that：The section for leading glue hole is circle.
6. smart card as claimed in claim 1, it is characterised in that：The chip and the pad be respectively positioned on the circuit board and
Between the first substrate.
7. smart card as claimed in claim 1, it is characterised in that：There is gap between the pad and the chip.
8. smart card as claimed in claim 1, it is characterised in that：Offered on the first substrate and accommodate the logical of IC modules
Hole, and the size of the through hole is more than the size of the IC modules.
9. smart card as claimed in claim 8, it is characterised in that：The IC modules are the contact module of the smart card.
10. smart card as claimed in claim 1, it is characterised in that：Sandwiched between the first substrate and the second substrate
There is center, the center forms the receiving for accommodating the circuit board together with the first substrate and the second substrate
Groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721043520.6U CN207148889U (en) | 2017-08-18 | 2017-08-18 | smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721043520.6U CN207148889U (en) | 2017-08-18 | 2017-08-18 | smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207148889U true CN207148889U (en) | 2018-03-27 |
Family
ID=61666972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721043520.6U Expired - Fee Related CN207148889U (en) | 2017-08-18 | 2017-08-18 | smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207148889U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108510041A (en) * | 2018-04-28 | 2018-09-07 | 厦门英诺尔电子科技股份有限公司 | A kind of high temperature resistant pressure resistance electronic tag |
-
2017
- 2017-08-18 CN CN201721043520.6U patent/CN207148889U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108510041A (en) * | 2018-04-28 | 2018-09-07 | 厦门英诺尔电子科技股份有限公司 | A kind of high temperature resistant pressure resistance electronic tag |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180327 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |