CN108510041A - A kind of high temperature resistant pressure resistance electronic tag - Google Patents
A kind of high temperature resistant pressure resistance electronic tag Download PDFInfo
- Publication number
- CN108510041A CN108510041A CN201810399530.6A CN201810399530A CN108510041A CN 108510041 A CN108510041 A CN 108510041A CN 201810399530 A CN201810399530 A CN 201810399530A CN 108510041 A CN108510041 A CN 108510041A
- Authority
- CN
- China
- Prior art keywords
- hole
- chip
- electronic tag
- antenna stack
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
- G06K19/07764—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement making the record carrier attachable to a tire
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
Abstract
The present invention provides a kind of high temperature resistant pressure resistance electronic tag, including substrate layer, antenna stack, chip, chip protection layer, strengthening course and glue-line, and substrate layer is equipped at least one first through hole；Antenna stack is set on substrate layer, and the cabling of antenna stack avoids first through hole setting；Chip is electrically connected with antenna stack, and chip protection layer wraps up chip；Strengthening course is equipped with hollow-out parts and at least one second through-hole, strengthening course are covered on antenna stack, and the position of hollow-out parts is overlapped with the position of chip protection layer, and the second through-hole is connected to first through hole, and first through hole and the second through-hole are for accommodating reinforcing body；Glue-line is coated on the one side far from antenna stack on strengthening course.The present invention can prevent the stabilization that electronic tag detaches with rubber product, can keep Electronic Tag Structure, can tolerate external impact, and strengthening course has good protective effect to chip.
Description
Technical field
The present invention relates to electronic label technology field, more particularly to a kind of high temperature resistant pressure resistance electronic tag.
Background technology
Currently, in order to reach anti-fake and identification product needs, electronic tag package can be arrived by way of vulcanization
In other rubber products, such as tire.
In the prior art, it is combined generally by the technique of pressing between the level of electronic tag, and electronics mark
In the environment of label briefly can be exposed to high temperature and high pressure in the sulfidation of rubber product, and get the bid in the use of product
Label are also possible to by external impacts, the structure of electronic tag itself after high temperature, high pressure and impact there are level deformation and
The problem of dislocation, causes the performance of electronic tag to decline and even fails, and this requires apply the electronic tag in these products
Must have certain pressure resistance and impact resistance characteristic, it is therefore desirable to structure design enhancing protection is carried out to electronic tag, and it is existing
The scheme that structural strengthening is carried out to electronic tag, such as application No. is 201320090820.5,201710813173.9,
The patents such as 201720570515.4, be only applicable to label be in often bending in the environment of, and be not suitable for label construction fix but
It need to be to the environment of pressure tolerance.
Invention content
The technical problem to be solved by the present invention is to：There is provided one kind holding structure can stablize in high temperature, hyperbaric environment
High temperature resistant pressure resistance electronic tag.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is：A kind of high temperature resistant pressure resistance electronic tag, packet
Substrate layer, antenna stack, chip, chip protection layer, strengthening course and glue-line are included, substrate layer is equipped at least one first through hole；Antenna
Layer is set on substrate layer, and the cabling of antenna stack avoids first through hole setting；Chip is electrically connected with antenna stack, chip protection layer packet
Wrap up in chip；Strengthening course is equipped with hollow-out parts and at least one second through-hole, strengthening course and is covered on antenna stack, the position of hollow-out parts with
The position of chip protection layer overlaps, and the second through-hole is connected to first through hole, and first through hole and the second through-hole are for accommodating reinforcing body；
Glue-line be coated on strengthening course far from antenna stack or be coated on substrate layer far from antenna stack while.
The beneficial effects of the present invention are：The high temperature resistant pressure resistance electronic tag of this programme is in use, first by electronic tag
It is fitted in unvulcanized rubber product surface on one side equipped with glue-line, electronic tag and rubber product are then subjected to sulphur jointly
Change, the rubber in molten condition can successively flow into the second through-hole and first through hole in sulfidation, after cured
The rivet-like structure of self-assembling formation and rubber product one in two through-holes, this can reinforce the knot between label and rubber product
With joint efforts, it on the one hand can prevent electronic tag from being detached with rubber product, on the other hand can also keep the stabilization of Electronic Tag Structure, this
Just overcome the problem of connection relation between electronic tag level is deformed and dislocated after high pressure-temperature；Meanwhile after vulcanization
Product, in use also because reinforcing body there are due to can be resistant to external impact, avoid Electronic Tag Structure, particularly day
The damage of line layer；Finally, compared with the prior art in strengthening course be all provided in the antenna back side, this programme exists strengthening course setting
The front of antenna is located at the same face with chip, the hollow-out parts of strengthening course concede chip position, in electronic tag in use, mending
Strong layer bears the external impacts that reason chip is directly born, and plays a protective role to chip.
Description of the drawings
Fig. 1 is the exploded view of the high temperature resistant pressure resistance electronic tag of the embodiment of the present invention one；
Fig. 2 is the sectional view of the high temperature resistant pressure resistance electronic tag of the embodiment of the present invention one.
Fig. 3 is the sectional view of the high temperature resistant pressure resistance electronic tag of the embodiment of the present invention two.Label declaration：
1, glue-line；2, substrate layer；21, first through hole；3, antenna stack；4, chip；5, chip protection layer；6, strengthening course；61、
Hollow-out parts；62, the second through-hole.
Specific implementation mode
To explain the technical content, the achieved purpose and the effect of the present invention in detail, below in conjunction with embodiment and coordinate attached
Figure is explained.
The design of most critical of the present invention is：Strengthening course is located at antenna stack and protects chip on one side equipped with chip；
Through-hole is set to accommodate reinforcing body to enhance the structural stability of label simultaneously.
Please refer to Fig. 1 to Fig. 3, a kind of high temperature resistant pressure resistance electronic tag, including glue-line 1, substrate layer 2, antenna stack 3, chip
4, chip protection layer 5, strengthening course 6；
Substrate layer 2 is equipped at least one first through hole 21；
Antenna stack 3 is set on substrate layer 2, and the cabling of antenna stack 3 avoids the setting of first through hole 21；
Chip 4 is electrically connected with antenna stack 3, and chip protection layer 5 wraps up chip 4；
Strengthening course 6 is equipped with hollow-out parts 61 and at least one second through-hole 62, strengthening course 6 are covered on antenna stack 3, hollow-out parts
61 position is overlapped with the position of chip protection layer 5, and the second through-hole 62 is connected to first through hole 21, and first through hole 21 and second is logical
Hole 62 is for accommodating reinforcing body；
Glue-line 1 be coated on the one side on strengthening course 6 far from antenna stack 3 or be coated on substrate layer 2 far from 3 layers of antenna one
Face.
As can be seen from the above description, the beneficial effects of the present invention are：The pressure-resistant electronic tag of this programme is in use, first will
What electronic tag was equipped with glue-line is fitted in unvulcanized rubber product surface on one side, then that electronic tag and rubber product is common
Vulcanized, the rubber in molten condition can successively flow into the second through-hole and first through hole in sulfidation, to be solidified
Afterwards can in two through-holes self-assembling formation rivet-like structure reinforcing body, on the one hand can prevent electronic tag and rubber product point
From another aspect can also keep the stabilization of Electronic Tag Structure, this connection relation just overcome between electronic tag level to exist
The problem of deforming and dislocate after high pressure-temperature；Meanwhile the product after vulcanization, in use also because reinforcing body there are due to can be with
Impact outside tolerance, avoids the damage of Electronic Tag Structure, particularly antenna stack；Finally, compared with the prior art in reinforcement
Layer is all provided in the antenna back side, and strengthening course is arranged in the front of antenna this programme, i.e., is located at the same face, strengthening course with chip
Hollow-out parts concede chip position, in electronic tag in use, strengthening course bears the external impacts that reason chip is directly born,
It plays a protective role to chip.
Further, the glue-line 1 is coated on the one side far from antenna stack 3 on the strengthening course 6, the first through hole 21
Cross-sectional area be not less than second through-hole 62 cross-sectional area.
Further, the glue-line 1 is coated on the one side far from antenna stack 3 on the substrate layer 2, second through-hole 62
Cross-sectional area be not less than the first through hole 21 cross-sectional area.
Seen from the above description, since glue-line is for Nian Jie with rubber product, glue-line is arranged in different positions, mark
Label are just different from the relative position of rubber product, it is therefore desirable to the cross-sectional area between corresponding adjustment first through hole and the second through-hole
Magnitude relationship, just can ensure that form the reinforcing body with rivet form in this way, preferably stablize label construction.
Further, the glue-line 1 is at least one of polyacrylic acid, half finished rubber and epoxy resin material.
Seen from the above description, it can ensure that label is preferably bonded with rubber material using the glue-line of above-mentioned material.
Further, the substrate layer 2 is FPC layers.
Seen from the above description, FPC is flexible PCB, and electronic tag can be allowed easily to be fitted in the surface of different shape
On.
Substrate layer is also feasible using PCB layer (printed wiring board), only uses electronics mark of the pcb board as substrate layer
Label are not suitable for nonplanar product.
Further, the antenna stack 3 is metallic antenna layer.
Seen from the above description, high temperature and high pressure can tolerate using metallic antenna layer.
Further, the chip protection layer 5 wraps up the company between the chip 4 and the chip 4 and the antenna stack 3
Binding structure.
Seen from the above description, the connection structure between chip and chip and antenna stack is used into chip protection layer packet together
It wraps up in, other than it can protect chip, moreover it is possible to protect the connection structure between chip and antenna stack.
Further, the chip protection layer 5 is epoxy resin semi-curing glue.
Seen from the above description, high temperature can be obstructed to chip preferably in high temperature using the chip protection layer of above-mentioned material
Diffusion.
Chip protection layer is also feasible using the two-sided colloid of other high temperature resistants.
Further, the strengthening course 6 is PI layers.
Seen from the above description, PI is polyimides, and with high temperature resistant, low-heat is led and high impact resistance, using PI layers
It can preferably produce and protection chip and antenna stack in use environment.
Strengthening course is also feasible using the general stiffening plate of other industry.
Referring to Fig.1 and 2, the embodiment of the present invention one is：
A kind of high temperature resistant pressure resistance electronic tag is used for the identification as automobile tire and antifalsification label, in automobile tire sulphur
It is fitted in the inside of sidewall before change, sulphur is carried out together in the environment of 180 DEG C of curing temperature, 100 kilograms of pressure with tire
Change, electronic tag can be tightly attached in tire later, not easily to fall off.The information of storage and the tire in the pressure resistance electronic tag
The coding of unique match, conveniently in the future in tyre service, guardian reads label to determine the tire by label reader
Whether certified products.
The pressure-resistant electronic tag includes glue-line 1, substrate layer 2, antenna stack 3, chip 4, chip protection layer 5 and strengthening course
6；Substrate layer 2 be FPC layer, substrate layer 2 set there are two first through hole 21；Antenna stack 3 is metallic antenna layer, and antenna stack 3 is set to base
On material layer 2, first through hole 21 is located in the antenna of the impedance loop section of antenna stack 3, avoids the position of cabling；Chip 4 and day
Line layer 3 is electrically connected, and chip protection layer 5 wraps up the connection structure between chip 4 and chip 4 and antenna stack 3, chip protection layer 5
For epoxy resin semi-curing glue；Strengthening course 6 be PI layer, strengthening course 6 set there are one hollow-out parts 61 and two the second through-holes 62, reinforcement
Layer 6 is covered on antenna stack 3, and the position of hollow-out parts 61 is overlapped with the position of chip protection layer 5, and the thickness of strengthening course 6 is higher than core
5 height of piece protective layer, the second through-hole 62 are connected to first through hole 21, and the cross-sectional area of first through hole 21 is more than the second through-hole 62
Cross-sectional area, first through hole 21 and the second through-hole 62 form rubber rivet knot for being contained in flow into tyre vulcanization in through-hole
The reinforcing body of structure；Glue-line 1 is coated on the one side far from antenna stack 3 on strengthening course 6.Please refer to Fig. 3, the embodiment of the present invention two
For：
A kind of high temperature resistant pressure resistance electronic tag, purposes are identical as embodiment one.
The present embodiment and the distinctive points of embodiment one are：The glue-line 1 is coated on substrate layer 2 far from antenna stack 3
One side, corresponding, the cross-sectional area of the second through-hole 62 is more than the cross-sectional area of first through hole 62, so as to tire
Form the reinforcing body with the rivet-like of tire one after vulcanization in label together.
In conclusion the present invention provides a kind of pressure-resistant electronic tag, can in production and use holding structure and chip
It is intact, high temperature resistant, high pressure resistant and impact resistance reliably can provide product identification and antiforge function for rubber product.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalents made by bright specification and accompanying drawing content are applied directly or indirectly in relevant technical field, include similarly
In the scope of patent protection of the present invention.
Claims (9)
1. a kind of high temperature resistant pressure resistance electronic tag, which is characterized in that including substrate layer, antenna stack, chip, chip protection layer, benefit
Strong layer and glue-line,
Substrate layer is equipped at least one first through hole；
Antenna stack is set on substrate layer, and the cabling of antenna stack avoids first through hole setting；
Chip is electrically connected with antenna stack, and chip protection layer wraps up chip；
Strengthening course is equipped with hollow-out parts and at least one second through-hole, strengthening course are covered on antenna stack, the position of hollow-out parts and core
The position of piece protective layer overlaps, and the second through-hole is connected to first through hole, and first through hole and the second through-hole are for accommodating reinforcing body；
Glue-line be coated on strengthening course far from antenna stack or be coated on substrate layer far from antenna stack while.
2. a kind of high temperature resistant pressure resistance electronic tag according to claim 1, which is characterized in that the glue-line is coated on described
One side far from antenna stack on strengthening course, the cross-sectional area of the first through hole are not less than the cross-sectional area of second through-hole.
3. a kind of high temperature resistant pressure resistance electronic tag according to claim 1, which is characterized in that the glue-line is coated on described
One side far from antenna stack on substrate layer, the cross-sectional area of second through-hole are not less than the cross-sectional area of the first through hole.
4. a kind of high temperature resistant pressure resistance electronic tag according to claim 1, which is characterized in that the glue-line is polypropylene
At least one of acid, half finished rubber and epoxy resin material.
5. a kind of high temperature resistant pressure resistance electronic tag according to claim 1, which is characterized in that the substrate layer is FPC layers.
6. a kind of high temperature resistant pressure resistance electronic tag according to claim 1, which is characterized in that the antenna stack is metal day
Line layer.
7. a kind of high temperature resistant pressure resistance electronic tag according to claim 1, which is characterized in that the chip protection layer package
Connection structure between the chip and the chip and the antenna stack.
8. a kind of high temperature resistant pressure resistance electronic tag according to claim 1, which is characterized in that the chip protection layer is ring
Oxygen resin semi-curing glue.
9. a kind of high temperature resistant pressure resistance electronic tag according to claim 1, which is characterized in that the strengthening course is PI layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810399530.6A CN108510041A (en) | 2018-04-28 | 2018-04-28 | A kind of high temperature resistant pressure resistance electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810399530.6A CN108510041A (en) | 2018-04-28 | 2018-04-28 | A kind of high temperature resistant pressure resistance electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108510041A true CN108510041A (en) | 2018-09-07 |
Family
ID=63399319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810399530.6A Pending CN108510041A (en) | 2018-04-28 | 2018-04-28 | A kind of high temperature resistant pressure resistance electronic tag |
Country Status (1)
| Country | Link |
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| CN (1) | CN108510041A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109508777A (en) * | 2018-12-31 | 2019-03-22 | 上海仪电特镭宝信息科技有限公司 | A kind of tire sticking type RFID electronic label and implementation method |
| CN110880030A (en) * | 2019-11-21 | 2020-03-13 | 盐城工业职业技术学院 | Impact-resistant electronic tag |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010176454A (en) * | 2009-01-30 | 2010-08-12 | Japan Crown Cork Co Ltd | Rfid tag made of rubber and method for manufacturing the same |
| CN102054194A (en) * | 2009-11-09 | 2011-05-11 | 软控股份有限公司 | RFID (Radio Frequency Identification Device) tire electronic tag and manufacturing method thereof |
| CN103886357A (en) * | 2012-12-20 | 2014-06-25 | 软控股份有限公司 | RFID electronic tag and processing method thereof |
| CN204650569U (en) * | 2014-04-22 | 2015-09-16 | 株式会社村田制作所 | Wireless communication tag |
| CN105787550A (en) * | 2016-02-18 | 2016-07-20 | 上海坤锐电子科技有限公司 | Anti-removal vehicular electronic label |
| CN106447014A (en) * | 2016-10-19 | 2017-02-22 | 厦门英诺尔电子科技股份有限公司 | High-temperature-resistant tag and application thereof |
| CN207148889U (en) * | 2017-08-18 | 2018-03-27 | 深圳市文鼎创数据科技有限公司 | smart card |
| CN208314837U (en) * | 2018-04-28 | 2019-01-01 | 厦门英诺尔电子科技股份有限公司 | A kind of high temperature resistant pressure resistance electronic tag |
-
2018
- 2018-04-28 CN CN201810399530.6A patent/CN108510041A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010176454A (en) * | 2009-01-30 | 2010-08-12 | Japan Crown Cork Co Ltd | Rfid tag made of rubber and method for manufacturing the same |
| CN102054194A (en) * | 2009-11-09 | 2011-05-11 | 软控股份有限公司 | RFID (Radio Frequency Identification Device) tire electronic tag and manufacturing method thereof |
| CN103886357A (en) * | 2012-12-20 | 2014-06-25 | 软控股份有限公司 | RFID electronic tag and processing method thereof |
| CN204650569U (en) * | 2014-04-22 | 2015-09-16 | 株式会社村田制作所 | Wireless communication tag |
| CN105787550A (en) * | 2016-02-18 | 2016-07-20 | 上海坤锐电子科技有限公司 | Anti-removal vehicular electronic label |
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| CN207148889U (en) * | 2017-08-18 | 2018-03-27 | 深圳市文鼎创数据科技有限公司 | smart card |
| CN208314837U (en) * | 2018-04-28 | 2019-01-01 | 厦门英诺尔电子科技股份有限公司 | A kind of high temperature resistant pressure resistance electronic tag |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109508777A (en) * | 2018-12-31 | 2019-03-22 | 上海仪电特镭宝信息科技有限公司 | A kind of tire sticking type RFID electronic label and implementation method |
| CN110880030A (en) * | 2019-11-21 | 2020-03-13 | 盐城工业职业技术学院 | Impact-resistant electronic tag |
| CN110880030B (en) * | 2019-11-21 | 2023-03-07 | 盐城工业职业技术学院 | Impact-resistant electronic tag |
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