JP2019197313A - Electronic component mounting board, band, and card - Google Patents

Abstract

To provide an electronic component mounting board, a band and a card capable of protecting an electronic component from force of bending the board.SOLUTION: An electronic component mounting board 10 includes: a flexible wiring board 11; an IC chip 13 mounted on the wiring board 11; a frame-like reinforcement part 14 formed in the shape of a frame by a material having rigidity higher than the wiring board 11 and arranged on the wiring board 11, surrounding the IC chip 13; and a linear reinforcement part 15 formed by a material having rigidity higher than the wiring board 11 linearly arranged on the wiring board 11 outside the frame-like reinforcement part 14.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component mounting substrate, a band, and a card.

In recent years, many types of devices having various electronic components including IC chips, such as wristband type wearable devices, have been developed.
Many of the wristband type wearable devices are mainly those that do not bend, such as a substrate portion on which a component such as an IC chip is mounted in a hard casing. However, in such a form, when there are many functions etc. and an IC chip mounting substrate is large, a housing | casing etc. will also become large and the design property may be inferior.
In addition, some flexible members, such as wristbands, include an IC chip mounting substrate in which the IC chip portion is resin-sealed. If a bending load is applied to the IC chip substrate portion, the IC chip portion There is a possibility that a problem such as stress is applied to the end of the IC chip and the IC chip part is detached from the substrate.
Furthermore, in recent years, there is a type in which the entire IC chip mounting substrate portion is covered with a flexible resin or the like. However, the resin having flexibility has a poor reinforcing effect, and if excessive bending is performed, problems such as the IC chip portion being detached from the substrate are likely to occur.

  A technique for protecting an IC chip is disclosed in Patent Document 1. However, the technique disclosed in Patent Document 1 is a configuration for reducing the impact applied to the IC chip portion, and the IC chip portion may be detached from the substrate with respect to the force of bending the substrate. The sufficient effect for making it difficult to remove the IC chip portion could not be obtained.

JP 2014-10473 A

  An object of the present invention is to provide an electronic component mounting substrate, a band, and a card that can protect the electronic component against the force of bending the substrate.

  The present invention solves the above problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to embodiment of this invention is attached | subjected and demonstrated, it is not limited to this.

  According to a first aspect of the present invention, a flexible wiring board (11), an electronic component (13) mounted on the wiring board (11), and a material having rigidity higher than that of the wiring board (11) are used. A frame-shaped reinforcing portion (14) disposed on the wiring board (11) so as to surround the electronic component (13) and a material having higher rigidity than the wiring board (11), It is an electronic component mounting board (10) provided with the linear reinforcement part (15) arrange | positioned at least in one place on the said wiring board (11) of the outer side of the said frame-shaped reinforcement part (14).

  According to a second aspect of the present invention, in the electronic component mounting substrate (10) according to the first aspect, the length of the linear reinforcing portion (15) in the extending direction is the frame-shaped reinforcing portion in the extending direction ( The electronic component mounting board (10) is characterized in that it is formed equal to or longer than the length of 14).

  The third invention is formed of a flexible wiring board (11), an electronic component (13) mounted on the wiring board (11), and a material having higher rigidity than the wiring board (11). The covering reinforcing portion (16) disposed on the wiring board (11) so as to cover the entire electronic component (13), and a material having higher rigidity than the wiring board (11), It is an electronic component mounting board (10) provided with the linear reinforcement part (15) arrange | positioned at least at one place on the said wiring board (11) of the outer side of a covering reinforcement part (16).

  According to a fourth invention, in the electronic component mounting substrate (10) according to the third invention, the length of the linear reinforcing portion (15) in the extending direction is the covering reinforcing portion ( The electronic component mounting board (10) is characterized in that it is equal to or longer than the length of 16).

  According to a fifth invention, in the electronic component mounting board (10) according to any one of the first to fourth inventions, the linear reinforcing portion (15) is a longitudinal direction of the wiring board (11). The electronic component mounting board (10) is characterized by extending in a direction orthogonal to the electronic component mounting board (10).

  According to a sixth invention, in the electronic component mounting board (10) according to any one of the first to fifth inventions, a plurality of the linear reinforcing portions (15) are arranged. The electronic component mounting substrate (10).

  According to a seventh aspect of the present invention, in the electronic component mounting substrate (10) according to the sixth aspect, the linear reinforcing portion (15) is disposed closer to the electronic component (13). The electronic component mounting board (10) is characterized in that it is formed to be longer than the one disposed far from the electronic component (13).

  The eighth invention is formed of a flexible wiring board (11), an electronic component (13) mounted on the wiring board (11), and a material having higher rigidity than the wiring board (11). The cover-shaped reinforcing portion (16) disposed on the wiring board (11) so as to cover the entire electronic component (13) and a material having a rigidity higher than that of the wiring board (11) are formed in a frame shape. An electronic component mounting substrate (10) comprising: a frame-shaped reinforcing portion (14) disposed on the wiring substrate (11) surrounding the electronic component (13) and the covering reinforcing portion (16). is there.

  According to a ninth aspect of the invention, a flexible wiring board (11), an electronic component (13) mounted on the wiring board (11), and a material having rigidity higher than that of the wiring board (11) are used. A frame-shaped reinforcing portion (14) formed on the wiring board (11) so as to surround the electronic component (13), and having the same shape and area as the frame-shaped reinforcing portion (14). An electronic component mounting board comprising: an additional reinforcing portion (17) that reinforces the region, wherein the additional reinforcing portion (17) and the frame-shaped reinforcing portion (14) are arranged side by side with a space therebetween (10).

  According to a tenth aspect of the invention, in the electronic component mounting board (10) according to the ninth aspect of the invention, the additional reinforcing portion (17) is disposed with the frame-shaped reinforcing portion (14) interposed therebetween. The electronic component mounting substrate (10).

  The eleventh aspect of the present invention is a frame made of a flexible wiring board (11), an electronic component (13) mounted on the wiring board (11), and a material having rigidity higher than that of the wiring board (11). An electronic component mounting board comprising: a linear reinforcing portion group (15B) formed in a shape and facing at least one set linearly on the wiring board (11) across the electronic component (13) (10).

  According to a twelfth aspect of the present invention, in the electronic component mounting substrate (10) according to the eleventh aspect of the present invention, additional reinforcement for reinforcing a region having the same shape and area as the region sandwiched between the linear reinforcing portion groups (15B). An electronic component mounting board (10) comprising a portion (17), wherein the additional reinforcing portion (17) and the linear reinforcing portion group (15B) are arranged side by side with a space therebetween. .

  According to a thirteenth aspect, in the electronic component mounting substrate (10) according to the twelfth aspect, the additional reinforcing portion (17) is disposed with the linear reinforcing portion group (15B) interposed therebetween. The electronic component mounting board (10) is characterized.

  According to a fourteenth aspect of the present invention, in the electronic component mounting substrate (10) according to any one of the first to thirteenth aspects, the electronic component (13) is flip-chip with respect to the wiring substrate (11). The electronic component mounting board (10) is characterized by being mounted.

  According to a fifteenth aspect, in the electronic component mounting board (10) according to any one of the first to fourteenth aspects, the material having higher rigidity than the wiring board (11) is a thermosetting material. An electronic component mounting board (10) characterized by being a cured material.

  According to a sixteenth aspect of the present invention, in the electronic component mounting board (10) according to any one of the first to fourteenth aspects, the material having rigidity higher than that of the wiring board (11) is non-ionizing radiation curable. An electronic component mounting board (10) characterized in that the material is a cured material.

  According to a seventeenth aspect of the present invention, in the electronic component mounting substrate (10) according to any one of the first to sixteenth aspects, the electronic component (13) further includes an antenna (12). 12) An electronic component mounting board (10) characterized by having a function of performing non-contact communication via 12).

  According to an eighteenth aspect, in the electronic component mounting board (10) according to any one of the first to seventeenth aspects, at least the electronic component (13) of the wiring board (11) is mounted. An electronic component mounting board (10) comprising a protective layer (21, 22) disposed on a side surface.

  According to a nineteenth aspect of the invention, in the electronic component mounting substrate (10) according to the eighteenth aspect of the invention, the protective layers (21, 22) are a surface layer (21), the surface layer (21), and the wiring substrate (11). An electronic component mounting substrate (10) comprising: an adhesive layer or an adhesive layer that joins the two.

  According to a twentieth aspect of the invention, in the electronic component mounting board (10) according to the eighteenth aspect of the invention, the protective layer (21, 22) is a thermoplastic resin. It is.

  According to a twenty-first aspect, in the electronic component mounting board (10) according to any one of the eighteenth aspect to the twentieth aspect, the material having rigidity higher than that of the wiring board (11) is the protective layer (21 , 22) is an electronic component mounting board (10) characterized in that the bonding to the wiring board (11) is stronger.

  A twenty-second invention is a band (1) comprising the electronic component mounting substrate (10) according to any one of the first to twenty-first inventions and a flexible main body (2). is there.

  A twenty-third invention is a card comprising the electronic component mounting substrate (10) according to any one of the first to twenty-first inventions, and a flexible main body.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component mounting board | substrate, a band, and card | curd which can protect an electronic component with respect to the force which bends a board | substrate can be provided.

It is a figure which shows the wristband containing the electronic component mounting board | substrate 10 by this invention. It is the figure which looked at the electronic component mounting board | substrate 10 from the upper surface. FIG. 2 is an enlarged view of the vicinity of an IC chip 13 of an electronic component mounting substrate 10. 2 is a cross-sectional view of the electronic component mounting substrate 10 in the vicinity of an IC chip 13 cut. It is sectional drawing which abbreviate | omitted and showed the surface protective layer 21 and the back surface protective layer 22. FIG. It is a figure explaining the effect | action of the frame-shaped reinforcement part 14 and the linear reinforcement part 15 when the electronic component mounting board | substrate 10 is bent. It is a figure which shows the 1st modification of 1st Embodiment. It is a figure which shows the 2nd modification of 1st Embodiment. It is a figure which shows the 3rd modification of 1st Embodiment. It is the figure which expanded IC chip 13 vicinity of the electronic component mounting board | substrate 10 of 2nd Embodiment. It is sectional drawing which cut | disconnected the IC chip 13 vicinity of the electronic component mounting board | substrate 10 of 2nd Embodiment. It is a figure which shows the modification of 2nd Embodiment. It is the figure which expanded IC chip 13 vicinity of the electronic component mounting board | substrate 10 of 3rd Embodiment. It is sectional drawing which cut | disconnected the IC chip 13 vicinity of the electronic component mounting board | substrate 10 of 3rd Embodiment. It is a figure explaining the effect | action of the frame-shaped reinforcement part 14 and the covering reinforcement part 16 when the electronic component mounting board 10 of 3rd Embodiment is bent. It is a figure which shows the 1st modification of 3rd Embodiment. It is a figure which shows the 1st example of the 2nd modification of 3rd Embodiment. It is a figure which shows the 2nd example of the 2nd modification of 3rd Embodiment. It is the figure which expanded IC chip 13 vicinity of the electronic component mounting board | substrate 10 of 4th Embodiment. It is a figure which shows the modification of 4th Embodiment. It is the figure which expanded IC chip 13 vicinity of the electronic component mounting board | substrate 10 of 5th Embodiment. It is a figure explaining the effect | action of the frame-shaped reinforcement part 14 and the additional reinforcement part 17 when the electronic component mounting board | substrate 10 of 5th Embodiment is bent. It is a figure which shows the 1st example of the 1st modification of 5th Embodiment. It is a figure which shows the 2nd example of the 1st modification of 5th Embodiment. It is a figure which shows the 2nd modification of 5th Embodiment. It is a figure which shows the 3rd modification of 5th Embodiment. It is a figure explaining an example of the manufacturing method of electronic component mounting board. It is a figure explaining the other example of the manufacturing method of the electronic component mounting board | substrate 10. FIG. It is the figure which put together the result of the evaluation test.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a view showing a wristband including an electronic component mounting board 10 according to the present invention.
In addition, each figure shown below including FIG. 1 is the figure shown typically, and the magnitude | size and shape of each part are exaggerated suitably for easy understanding.
In the following description, specific numerical values, shapes, materials, and the like are shown and described, but these can be changed as appropriate.

The wristband 1 is a band that is used by being wound around a user's wrist, and includes a main body 2 and an electronic component mounting board 10.
The main body 2 is made of a material having flexibility and magnetic permeability, such as silicon rubber. Although not shown, a fastener or the like for attaching to the wrist may be provided as appropriate. The main body 2 is provided with a slit 3 opened in a side surface thereof, and an electronic component mounting board 10 is inserted into the slit 3. The main body 2 has a flat plate shape in a free state where no force is applied, and is used by being bent and deformed into an annular shape as shown in FIG. 1 when being mounted on the wrist of the user. In addition, the main-body part 2 may be formed in the annular | circular shape or C shape (substantially annular shape which one part opened) in the free state.

  The electronic component mounting board 10 is configured to be detachable from the slit 3 into the main body 2. In the present embodiment, the configuration in which the electronic component mounting board 10 can be inserted into and removed from the main body 2 is illustrated, but the electronic component mounting board 10 may be configured not to be removable from the main body 2.

FIG. 2 is a view of the electronic component mounting board 10 as viewed from above.
FIG. 3 is an enlarged view of the vicinity of the IC chip 13 of the electronic component mounting substrate 10.
In addition, in each figure mentioned later including FIG.2 and FIG.3, the surface protection layer 21 has shown the IC chip 13 etc. in the state abbreviate | omitted suitably.
FIG. 4 is a cross-sectional view of the electronic component mounting substrate 10 in the vicinity of the IC chip 13 cut. 4 corresponds to a diagram in which the electronic component mounting substrate 10 is cut at the position indicated by the arrow AA in FIG. 3. Similarly, in the other cross-sectional views shown below, the vicinity of the IC chip 13 is also long. A cross-sectional view at a position cut along the direction is shown.
FIG. 5 is a cross-sectional view in which the front surface protective layer 21 and the back surface protective layer 22 are omitted.
Note that the antenna 12 is not shown in FIG. 3 and subsequent drawings and other embodiments described later. In addition, in FIG. 5 and subsequent drawings and other embodiments described later, the surface protective layer 21 and the back surface protective layer 22 are also appropriately omitted.
The electronic component mounting substrate 10 includes a wiring substrate 11, an antenna 12, an IC chip 13, a frame-shaped reinforcing portion 14, a linear reinforcing portion 15, a surface protective layer 21, and a back surface protective layer 22. . The electronic component mounting substrate 10 is disposed in the main body 2 such that the longitudinal direction thereof (that is, the longitudinal direction of the wiring substrate 11) is along the longitudinal direction of the wristband 1, and in the use state of the wristband, It is bent in this longitudinal direction.

  The wiring board 11 is a flexible printed board having flexibility. The wiring board 11 has a conductor layer made of copper or the like formed on an insulating film made of polyimide, polyester, or the like.

  The antenna 12 is an antenna for the IC chip 13 to communicate with an external reader / writer. The antenna 12 of the present embodiment is formed by an etching process when the conductor layer of the wiring board 11 is formed. The antenna 12 of the present embodiment is a loop antenna connected with a single stroke. In addition, you may comprise the antenna 12 by making a covered conducting wire go around. An IC chip 13 is connected to the antenna 12. Further, a capacitor, a resistance element, or the like may be connected to the antenna 12 as necessary.

  The IC chip 13 is a semiconductor integrated circuit element (electronic component), and identification information and the like corresponding to the purpose of use of the wristband 1 are recorded. The IC chip 13 is flip-chip mounted on one surface of the wiring board 11. The IC chip 13 is electrically connected to the antenna 12, and necessary power is supplied from the antenna 12. The IC chip 13 includes a transmission / reception circuit and a memory that perform non-contact communication with an external reader / writer (not shown) via the antenna 12, and performs authentication and rewriting of identification information. The IC chip 13 of this embodiment is assumed to have a non-contact communication function conforming to the ISO / IEC 14443 Type A system.

The frame-shaped reinforcing portion 14 is formed in a frame shape with a material having higher rigidity than the wiring substrate 11, and is disposed on the wiring substrate 11 so as to surround the IC chip 13. In addition, in the following cross-sectional views including FIG. 5, the frame-shaped reinforcing portion 14 is not only a cross-sectional view but is visible in the rear in order to clarify the difference from the linear reinforcing portion 15. The frame-shaped reinforcing portion 14 is also illustrated. Here, the material having higher rigidity than the wiring substrate 11 may be configured by curing a resin material, or may be configured by processing a metal or a resin material.
When the resin material is cured to form the frame-shaped reinforcing portion 14, for example, a thermosetting material such as an epoxy resin, an acrylic resin, or a polyester resin can be used. Further, when the frame-shaped reinforcing portion 14 is configured by curing the resin material, a UV curable resin such as an epoxy resin, an acrylic resin, or a polyester resin may be used. In the case of using a UV curable resin, there is an advantage that it can be used even on a substrate or a component having low heat resistance. In the case where the resin material is cured to form the frame-shaped reinforcing portion 14, the resin material is applied on the wiring substrate 11 or the surface protective layer 21 with a dispenser or the like in an uncured state, and then cured. . Further, the frame-shaped reinforcing portion 14 may be formed by silk screen printing instead of application by a dispenser or the like.
Further, when the frame-shaped reinforcing portion 14 is formed by processing a metal or a resin material, a part to be the frame-shaped reinforcing portion 14 is manufactured by a separate processing process, and then this is applied to the wiring board 11 or the surface protection. The layer 21 may be bonded and fixed.
For example, the width of the linear portion of the frame-shaped reinforcing portion 14 is desirably about 2.0 to 6.0 mm, and the thickness (height) is desirably about 0.1 to 2.0 mm. In addition, the distance between the frame-shaped reinforcing portion 14 and the IC chip 13 is preferably about 0.5 to 2.0 mm.
Note that the width of the linear portion of the frame-shaped reinforcing portion 14 may be set according to the following calculation.
Frame width (2-6 mm) = IC chip size (1-2 mm) + (interval between IC chip and reinforcing part 0.5-2 mm) × 2

The linear reinforcing portion 15 is formed of a material having rigidity higher than that of the wiring substrate 11 similar to the frame-shaped reinforcing portion 14, and is arranged at one line on the wiring substrate 11 outside the frame-shaped reinforcing portion 14. . In the present embodiment, the linear reinforcing portions 15 are arranged so as to extend in a direction orthogonal to the longitudinal direction of the wiring board 11. In addition, in FIG. 3, although the length of the linear reinforcement part 15 is shown as equivalent to the frame-shaped reinforcement part 14, this length can be changed suitably. The material constituting the linear reinforcing portion 15 and the forming method thereof are the same as those of the frame-shaped reinforcing portion 14 described above. The desirable range of the width and thickness of the linear reinforcing portion 15 is the same as that of the frame-shaped reinforcing portion 14. Furthermore, the distance between the linear reinforcing portion 15 and the frame-shaped reinforcing portion 14 is preferably about 1.0 to 10.0 mm.
Here, when comparing the length of the linear reinforcement part 15 with the length of the frame reinforcement part 14, about the length of the frame reinforcement part 14, it is the length of the direction along the extension direction of the linear reinforcement part 15. That is, the length of one side of the frame-shaped reinforcing portion 14 along which the linear reinforcing portion 15 is disposed is indicated.

The surface protective layer 21 is disposed on the surface side of the wiring board 11 and protects the surface of the IC chip 13 mounted on the wiring board 11. The surface protective layer 21 is formed of, for example, a PET film, paper, PVC film, or the like.
The surface protective layer 21 may be configured by adhering a film material to the wiring substrate 11 using an adhesive material or an adhesive material, or may be configured by thermocompression bonding the film material.
When the surface protective layer 21 is attached using an adhesive or an adhesive, the surface protective layer 21 is used as a surface layer, and the surface layer (surface protective layer 21) and the wiring substrate (11) are bonded to each other. Alternatively, an adhesive layer is formed, and the surface layer (surface protective layer 21) and the adhesive layer or the adhesive layer constitute a protective layer.
For example, the surface protective layer 21 may have a thickness of about 0.2 mm.

The back surface protection layer 22 is disposed on the back surface side of the wiring substrate 11 and protects the back surface of the wiring substrate 11. The back surface protective layer 22 can be configured in the same manner as the surface protective layer 21 using the same material as the surface protective layer 21.
The back surface protective layer 22 is preferably about 0.2 mm thick, for example.

FIG. 6 is a diagram for explaining the operation of the frame-shaped reinforcing portion 14 and the linear reinforcing portion 15 when the electronic component mounting board 10 is bent. FIG. 6A shows a conventional configuration not including the frame-shaped reinforcing portion 14 and the linear reinforcing portion 15, and FIG. 6B shows the electronic component mounting substrate 10 of the present embodiment.
When only the wiring substrate 11 is bent, the whole is bent substantially uniformly, but when a rigid body such as the IC chip 13 is mounted, bending stress increases near the end of the rigid body. In the conventional example of FIG. 6A that is not reinforced, the bending stress increases at two locations indicated by arrows P close to the IC chip 13, and the IC chip 13 is likely to peel off.
On the other hand, in the electronic component mounting substrate 10 of this embodiment shown in FIG. 6B, the position of the arrow P where the bending stress increases is separated from the IC chip 13 by providing the frame-shaped reinforcing portion 14. Thus, the IC chip 13 can be protected. Moreover, by providing the linear reinforcement part 15, the site | part which acts as a rigid body has increased, and the position of the arrow P where a bending stress becomes high has increased to four places. If the total bending amount is the same, the bending stress acting on each position decreases as the position of the arrow P where the bending stress increases, and the IC chip 13 can be protected. In addition, the specific effect that the electronic component mounting substrate 10 of the present embodiment protects the IC chip 13 will be described later by showing test results.

(First variation of the first embodiment)
FIG. 7 is a diagram showing a first modification of the first embodiment.
As shown in FIG. 7, the linear reinforcing portion 15 may be formed longer than the frame-shaped reinforcing portion 14. Thereby, when it is bent so as to be twisted, the stress applied to the vicinity of the IC chip 13 can be reduced, and the protective effect can be enhanced.

(Second modification of the first embodiment)
FIG. 8 is a diagram illustrating a second modification of the first embodiment.
As shown in FIG. 8, the number of the linear reinforcing portions 15 may be further increased. If the number of the linear reinforcing portions 15 arranged increases, the stress dispersion effect can be expected by that number, and the protective effect can be enhanced. 8 shows an example in which the length of the linear reinforcing portion 15 is made longer than that of the frame-shaped reinforcing portion 14, but this length is the length of the frame-shaped reinforcing portion 14 as shown in FIG. And may be the same or shorter.

(Third modification of the first embodiment)
FIG. 9 is a diagram illustrating a third modification of the first embodiment.
In the case where a large number of linear reinforcing portions 15 are arranged side by side, as shown in FIG. 9, the length is made closer to the position closer to the IC chip 13, and the length is gradually shortened as the distance from the IC chip 13 increases. be able to. By setting the length of the linear reinforcing portion 15 in this way, the position where the stress becomes high can be moved away from the IC chip 13, and the effect of protecting the IC chip 13 when bending stress or torsional stress is applied. It can be further increased.

(Second Embodiment)
FIG. 10 is an enlarged view of the vicinity of the IC chip 13 of the electronic component mounting board 10 of the second embodiment.
FIG. 11 is a cross-sectional view of the vicinity of the IC chip 13 of the electronic component mounting substrate 10 of the second embodiment.
In addition, in each embodiment shown below including 2nd Embodiment, the part which fulfill | performs the function similar to 1st Embodiment mentioned above is attached | subjected the same code | symbol, and the overlapping description is abbreviate | omitted suitably.
The second embodiment is different from the first embodiment in that a covering reinforcing portion 16 is provided instead of the frame-like reinforcing portion 14 of the first embodiment.
The covering reinforcing portion 16 is formed of a material having rigidity higher than that of the wiring substrate 11 and is disposed on the wiring substrate 11 so as to cover the entire IC chip 13. The specific material and manufacturing method for configuring the covering reinforcing portion 16 are the same as those for forming the frame-shaped reinforcing portion 14 by curing the resin material in the first embodiment.
The covering reinforcing portion 16 is desirably formed so as to overlap the surface of the IC chip 13 by a thickness of about 0.5 mm, and further, formed to be larger by about 2.0 mm on one side than the outer shape of the IC chip 13. desirable.

  The cover-like reinforcing portion 16 in the second embodiment can be expected to have the same effect as the frame-like reinforcing portion 14 in the first embodiment when the electronic component mounting substrate 10 is bent, and can protect the IC chip 13. it can.

(Modified form of the second embodiment)
FIG. 12 is a diagram showing a modification of the second embodiment.
As shown in FIG. 12, the shape of the covering reinforcing portion 16 may be a quadrangle or other shapes. In addition, since the covering reinforcing part 16 is produced so as to be raised on the IC chip 13 by application with a dispenser or the like, it is difficult to form an accurate shape as compared with other parts, and there is a possibility that some shape collapse occurs. However, as a function of protecting the IC chip 13, some irregularities in the shape are not affected.

(Third embodiment)
FIG. 13 is an enlarged view of the vicinity of the IC chip 13 of the electronic component mounting board 10 of the third embodiment.
FIG. 14 is a cross-sectional view of the vicinity of the IC chip 13 of the electronic component mounting substrate 10 of the third embodiment.
In the electronic component mounting substrate 10 of the third embodiment, the covering reinforcing portion 16 is provided, and the frame-like reinforcing portion 14 is further provided outside thereof.
FIG. 15 is a diagram illustrating the operation of the frame-shaped reinforcing portion 14 and the covering-shaped reinforcing portion 16 when the electronic component mounting substrate 10 of the third embodiment is bent.
Since the covering reinforcing portion 16 is surrounded by the frame reinforcing portion 14, basically, as shown in FIG. 15, no bending stress is applied to the covering reinforcing portion 16, and the frame reinforcing portion 14 is bent. The IC chip 13 is protected under stress. However, even if the frame-shaped reinforcing portion 14 is peeled off, the IC-shaped chip 13 can be protected by further receiving the bending stress on the covering-shaped reinforcing portion 16. Therefore, the IC chip 13 can be protected in double (two steps), and the reliability can be improved.

(First variation of the third embodiment)
FIG. 16 is a diagram illustrating a first modification of the third embodiment.
As shown in FIG. 16, the size of the frame-shaped reinforcing portion 14 can be arbitrarily set. Further, as shown in FIG. 16, the position of the IC chip 13 in the frame-shaped reinforcing portion 14 may be arranged at a position other than the center of the region in the frame-shaped reinforcing portion 14.

(Second modification of the third embodiment)
FIG. 17 is a diagram illustrating a first example of the second modification of the third embodiment.
FIG. 18 is a diagram illustrating a second example of the second modification of the third embodiment.
As shown in FIG.17 and FIG.18, the frame-shaped reinforcement part 14 may be divided and comprised in the some site | part.
In FIG. 17, the frame-like reinforcing portion 14 can be regarded as a combination of the linear reinforcing portions 15.

(Fourth embodiment)
FIG. 19 is an enlarged view of the vicinity of the IC chip 13 of the electronic component mounting board 10 of the fourth embodiment.
In the electronic component mounting substrate 10 according to the fourth embodiment, the covering reinforcing portion 16 is provided, and the linear reinforcing portion group 15B is disposed on both sides thereof.
The linear reinforcing portion group 15B is formed in a frame shape by a material having rigidity higher than that of the wiring substrate 11, and a set of linear reinforcing portions 15B is arranged on the wiring substrate 11 so as to face each other with the IC chip 13 and the covering reinforcing portion 16 interposed therebetween. Has been. The linear reinforcing portion group 15B has the same configuration as the linear reinforcing portion 15 except that the linear reinforcing portion group 15B is arranged in parallel.
Further, the extending direction of the linear reinforcing portion group 15 </ b> B is along the longitudinal direction of the wiring board 11. That is, the linear reinforcing portion group 15B extends along the direction in which the electronic component mounting substrate 10 is bent. Thereby, it is possible to prevent bending stress from being directly applied to the IC chip 13 and to protect the IC chip 13.

(Modification of the fourth embodiment)
FIG. 20 is a diagram showing a modification of the fourth embodiment.
As shown in FIG. 20, in the form provided with the linear reinforcement part group 15B, the covering reinforcement part 16 can also be abbreviate | omitted. If the covering reinforcing portion 16 is omitted, although the durability against bending stress is slightly reduced, it is possible to prevent the bending stress from being directly applied to the IC chip 13 due to the presence of the linear reinforcing portion group 15B, and the IC chip 13 can be protected.

(Fifth embodiment)
FIG. 21 is an enlarged view of the vicinity of the IC chip 13 of the electronic component mounting board 10 of the fifth embodiment.
Similar to the first embodiment, the electronic component mounting substrate 10 of the fifth embodiment has a frame-shaped reinforcing portion 14 that surrounds the IC chip 13. Further, the electronic component mounting substrate 10 of the fifth embodiment has additional reinforcing portions 17 on both sides of the frame-shaped reinforcing portion 14 surrounding the IC chip 13.
The additional reinforcing portion 17 is formed in a frame shape from a material having higher rigidity than the wiring board, and reinforces a region having the same shape and area as the frame-shaped reinforcing portion 14. Moreover, the additional reinforcement part 17 is arrange | positioned on both sides of the frame-shaped reinforcement part 14, and the additional reinforcement part 17 and the frame-shaped reinforcement part 14 are arranged side by side at intervals.
Here, the material and configuration of the additional reinforcing portion 17 are substantially the same as those of the frame-shaped reinforcing portion 14 except that the IC chip 13 is not surrounded. Therefore, it can be understood that a plurality of frame-shaped reinforcing portions 14 are arranged side by side.

FIG. 22 is a diagram illustrating the operation of the frame-shaped reinforcing portion 14 and the additional reinforcing portion 17 when the electronic component mounting board 10 of the fifth embodiment is bent.
The action when the frame-shaped reinforcing portion 14 and the additional reinforcing portion 17 protect the IC chip 13 is basically the frame-shaped reinforcing portion 14 and the linear reinforcing portion 15 in the first embodiment protect the IC chip 13. It is the same as the action of time. However, since the additional reinforcing portion 17 of the present embodiment reinforces a region having the same shape and area as the frame-shaped reinforcing portion 14, the position where the stress acts is distributed further away from the IC chip 13. Can be expected. Although not particularly shown in FIG. 21, another electronic component can be disposed inside the additional reinforcing portion 17 to protect it.

(First variation of the fifth embodiment)
FIG. 23 is a diagram illustrating a first example of a first modification of the fifth embodiment.
FIG. 24 is a diagram illustrating a second example of the first modification of the fifth embodiment.
As shown in FIGS. 23 and 24, the frame-shaped reinforcing portion 14 and the additional reinforcing portion 17 may be divided into a plurality of parts, similarly to the second modification of the third embodiment. Even with such a configuration, the IC chip 13 can be protected as in the fifth embodiment described above.

(Second modification of the fifth embodiment)
FIG. 25 is a diagram illustrating a second modification of the fifth embodiment.
In the electronic component mounting substrate 10 shown in FIG. 25, the IC chip 13 is protected by the covering reinforcing portion 16 as in the second embodiment, and the additional reinforcing portion 17 is configured in the same manner as the covering reinforcing portion 16. Even with such a configuration, the IC chip 13 can be protected as in the fifth embodiment described above.

(Third modification of the fifth embodiment)
FIG. 26 is a diagram illustrating a third modification of the fifth embodiment.
In the electronic component mounting substrate 10 shown in FIG. 26, the IC chip 13 is protected by the linear reinforcing portion group 15B as in the fourth embodiment, and the additional reinforcing portion 17 is configured in the same manner as the linear reinforcing portion group 15B. . Even with such a configuration, the IC chip 13 can be protected as in the fifth embodiment described above.

(Production method)
Here, a method for manufacturing the electronic component mounting board 10 will be described.
FIG. 27 is a diagram illustrating an example of a method for manufacturing the electronic component mounting board 10.
In the example shown in FIG. 27, the case where the electronic component mounting substrate 10 of the first embodiment is manufactured is illustrated, but the same applies to other embodiments.
As shown in FIG. 27, after reinforcing portions such as the frame-shaped reinforcing portion 14 and the linear reinforcing portion 15 are first provided on the wiring board 11, the front surface protective layer 21 and the rear surface protective layer 22 are joined to mount the electronic component. The substrate 10 can be manufactured.

FIG. 28 is a diagram for explaining another example of the method for manufacturing the electronic component mounting board 10.
Unlike the previous FIG. 27, as shown in FIG. 28, after the reinforcing portions such as the frame-shaped reinforcing portion 14 and the linear reinforcing portion 15 are first provided on the surface protective layer 21 side, the surface protective layer 21 and the back surface protection are provided. The electronic component mounting substrate 10 can be manufactured by bonding the layer 22. By using such a manufacturing method, it is not necessary to form the reinforcing portions such as the frame-shaped reinforcing portion 14 and the linear reinforcing portion 15 on the wiring substrate 11, and the wiring substrate 11 caused by the manufacturing failure of the reinforcing portion is eliminated. The occurrence of defects can be suppressed. The wiring board 11 is more expensive than the material constituting the surface protective layer 21, and it is a very great advantage that the occurrence of defects in the wiring board 11 can be suppressed. Moreover, it becomes possible to form reinforcement parts, such as the frame-shaped reinforcement part 14 and the linear reinforcement part 15, on the large size film used as the raw material of the surface protective layer 21, and it can improve production efficiency.
In the electronic component mounting board 10 manufactured by the method as shown in FIG. 28, the material having rigidity higher than that of the wiring board 11 constituting each reinforcing portion is bonded to the surface protective layer 21. It is stronger than bonding.

(Evaluation test)
A test for evaluating the effect of protecting the IC chip 13 in the electronic component mounting substrate 10 of the present invention described above was performed.
FIG. 29 is a table summarizing the results of the evaluation test.
In this evaluation test, copper wiring was formed by etching on a polyimide wiring board (substrate outer size: 25 mm × 17 mm) having a thickness of 0.2 mm. On the wiring board, an antenna (antenna size: 20 mm × 12 mm, number of turns of 5 turns) and connection wiring to each mounted component are formed.
An IC chip having a non-contact IC communication function based on ISO / IEC 14443 is flip-chip mounted on the wiring board using an anisotropic conductive film (ACF) or anisotropic conductive paste (ACP), and The capacitor is connected using solder.
A pattern of various reinforcing portions for reinforcing the IC chip was formed on or around the IC chip by application with a dispenser using an epoxy resin.
Six types of test samples shown in FIG. 29 were prepared. Note that Type 1 of the present invention corresponds to a modified form of the second embodiment (FIG. 12), Type 2 corresponds to a first example (FIG. 17) of the second modified form of the third embodiment, and Type 3 Corresponds to the first embodiment (FIG. 3).
A 0.1 mm-thick PET film was attached to the front and back of a substrate on which components such as IC chips were mounted with a 0.05 mm-thick adhesive sheet to produce six types of electronic component mounting substrates.

  As a test method, a winding test was performed. Specifically, for the six types of electronic component mounting substrate test samples shown in FIG. 29, a plurality of metal cylinders (R = 10 mm) having different diameters so that the long side or the short side is curved. , 20 mm, 30 mm, 40 mm). For winding, the load of 300 times was applied by alternately turning the front and back directions of the electronic component mounting substrate. IC chip operation | movement was confirmed after this winding test implementation.

As a result of the above test, in the conventional reinforcement technique, the bending load was high and the operation was NG with repeated bending with a high radius of curvature (R = 10). Operation OK part).
In consideration of winding around the wrist, the wrist has a portion having a locally large radius of curvature (approximately R = 10 mm), and if it is a product of the present invention, an IC module can be incorporated in such a place. become able to. Further, in the case of the Type 2 structure of the product of the present invention, it was confirmed that the effect of protecting the IC chip was high even when bent in either the long side direction or the short side direction.

  As described above, in the electronic component mounting substrate of each of the embodiments described above, a reinforcing portion selected from a frame-shaped reinforcing portion, a linear reinforcing portion, a covering reinforcing portion, a linear reinforcing portion group, and an additional reinforcing portion is appropriately used. By using it, the electronic component can be effectively protected when the electronic component mounting substrate is bent. In addition, selection and combination of the above-mentioned reinforcing portions (frame-shaped reinforcing portion, linear reinforcing portion, covering reinforcing portion, linear reinforcing portion group, and additional reinforcing portion) are appropriately selected and used according to the actual board design. Good. This is because, in an actual substrate, there are various size restrictions and arrangements of components to be mounted, and which reinforcing portion of each reinforcing portion is optimal differs individually and specifically.

(Deformation)
The present invention is not limited to the embodiment described above, and various modifications and changes are possible, and these are also within the scope of the present invention.

(1) In each embodiment, the example which protects the IC chip 13 as an electronic component was given and demonstrated. However, the electronic component to be protected may be any component such as a resistor, a capacitor, a light emitting element, and various sensors.

(2) In each embodiment, the case where the IC chip 13 is flip-chip mounted has been described as an example. For example, the present invention may be applied to protection of electronic parts mounted by wire bonding.

(3) In each embodiment, the electronic component mounting board incorporated in the wristband has been described as an example. For example, a band attached to a part other than the wrist or a band including other functions such as a band part of a wristwatch or an activity meter may be used. Moreover, not only a band but the electronic component mounting board incorporated in various cards may be sufficient. Furthermore, it may be an electronic component mounting board incorporated in other articles such as a flexible toy, a figure, a key chain, and the like.

(4) In each embodiment, each reinforcing part (frame-like reinforcing part, linear reinforcing part, covering reinforcing part, linear reinforcing part group, additional reinforcing part) is the same material on the same wiring board. An example of the configuration is described. Not only this but a raw material may be changed with a reinforcement part, and a preparation method may also be changed.

(5) In each embodiment, each reinforcing part (frame-shaped reinforcing part, linear reinforcing part, covering reinforcing part, linear reinforcing part group, additional reinforcing part) is mounted with an electronic component to be protected of the wiring board. An example in which the surface is disposed on the same side as the surface being described has been described. However, the present invention is not limited to this, and some or all of the reinforcing portions may be arranged on the surface of the wiring board opposite to the surface on which the electronic component to be protected is mounted.

(6) In each embodiment, the frame-shaped reinforcing portion has been described with an example in which the frame-shaped reinforcing portion is configured in a rectangular shape in plan view. For example, the frame-shaped reinforcing portion may be configured in other shapes such as a triangular shape, a circular shape, and an elliptical shape in plan view.

  Each embodiment and modification may be used in appropriate combination, but detailed description is omitted. Further, the present invention is not limited by the embodiments described above.

DESCRIPTION OF SYMBOLS 1 Wristband 2 Body part 3 Slit 10 Electronic component mounting board 11 Wiring board 12 Antenna 13 IC chip 14 Frame-like reinforcement part 15 Linear reinforcement part 15B Linear reinforcement part group 16 Cover-like reinforcement part 17 Additional reinforcement part 21 Surface protective layer 22 Back side protective layer

Claims (23)

A flexible wiring board;
Electronic components mounted on the wiring board;
A frame-shaped reinforcing portion that is formed in a frame shape by a material having higher rigidity than the wiring board, and is disposed on the wiring board so as to surround the electronic component;
A linear reinforcing portion that is formed of a material having a higher rigidity than the wiring substrate, and is arranged in a line on the wiring substrate outside the frame-shaped reinforcing portion; and
An electronic component mounting board comprising: The electronic component mounting board according to claim 1,
The length in the extending direction of the linear reinforcing portion is equal to or longer than the length of the frame-shaped reinforcing portion in the extending direction,
Electronic component mounting board characterized by. A flexible wiring board;
Electronic components mounted on the wiring board;
Formed of a material having higher rigidity than the wiring board, covering the whole of the electronic component, and a covering reinforcing portion disposed on the wiring board;
A linear reinforcing portion that is formed of a material having a higher rigidity than the wiring substrate and is disposed in a line on the wiring substrate outside the covering reinforcing portion;
An electronic component mounting board comprising: In the electronic component mounting board according to claim 3,
The length in the extending direction of the linear reinforcing portion is equal to the length of the covering reinforcing portion in the extending direction, or the length is formed long,
Electronic component mounting board characterized by. In the electronic component mounting substrate according to any one of claims 1 to 4,
The linear reinforcing portion extends in a direction perpendicular to the longitudinal direction of the wiring board;
Electronic component mounting board characterized by. In the electronic component mounting substrate according to any one of claims 1 to 5,
A plurality of the linear reinforcing portions are disposed;
Electronic component mounting board characterized by. The electronic component mounting board according to claim 6,
The linear reinforcing portion is formed so that the length of the linear reinforcing portion is longer than the length of the linear reinforcing portion, compared to the length of the linear reinforcing portion.
Electronic component mounting board characterized by. A flexible wiring board;
Electronic components mounted on the wiring board;
Formed of a material having higher rigidity than the wiring board, covering the whole of the electronic component, and a covering reinforcing portion disposed on the wiring board;
A frame-shaped reinforcing portion that is formed in a frame shape by a material having higher rigidity than the wiring substrate, and is disposed on the wiring substrate so as to surround the electronic component and the covering-shaped reinforcing portion;
An electronic component mounting board comprising: A flexible wiring board;
Electronic components mounted on the wiring board;
A frame-shaped reinforcing portion that is formed in a frame shape by a material having higher rigidity than the wiring board, and is disposed on the wiring board so as to surround the electronic component;
An additional reinforcing portion that reinforces a region having the same shape and area as the frame-shaped reinforcing portion;
The additional reinforcing portion and the frame-shaped reinforcing portion are arranged side by side with a space therebetween,
Electronic component mounting board characterized by. In the electronic component mounting board according to claim 9,
The additional reinforcing portion is disposed across the frame-shaped reinforcing portion;
Electronic component mounting board characterized by. A flexible wiring board;
Electronic components mounted on the wiring board;
A linear reinforcing portion group formed in a frame shape by a material having higher rigidity than the wiring board, and arranged at least one line on the wiring board so as to face each other across the electronic component;
An electronic component mounting board comprising: The electronic component mounting board according to claim 11, further comprising an additional reinforcing portion that reinforces a region having the same shape and area as a region sandwiched between the linear reinforcing portion groups,
The additional reinforcing portion and the linear reinforcing portion group are arranged side by side with an interval between them,
Electronic component mounting board characterized by The electronic component mounting board according to claim 12,
The additional reinforcing portion is disposed across the linear reinforcing portion group;
Electronic component mounting board characterized by. In the electronic component mounting substrate according to any one of claims 1 to 13,
The electronic component is flip-chip mounted on the wiring board;
Electronic component mounting board characterized by. In the electronic component mounting substrate according to any one of claims 1 to 14,
The material having higher rigidity than the wiring board is a material obtained by curing a thermosetting material,
Electronic component mounting board characterized by. In the electronic component mounting substrate according to any one of claims 1 to 14,
The material having higher rigidity than the wiring board is a material obtained by curing a non-ionizing radiation curable material,
Electronic component mounting board characterized by. In the electronic component mounting substrate according to any one of claims 1 to 16,
An antenna,
The electronic component has a function of performing non-contact communication via the antenna;
Electronic component mounting board characterized by. In the electronic component mounting substrate according to any one of claims 1 to 17,
Including a protective layer disposed on at least a surface of the wiring board on which the electronic component is mounted;
Electronic component mounting board characterized by. The electronic component mounting board according to claim 18,
The protective layer is
Surface layer,
An adhesive layer or an adhesive layer joining the surface layer and the wiring board;
Providing
Electronic component mounting board characterized by. The electronic component mounting board according to claim 18,
The protective layer is a thermoplastic resin;
Electronic component mounting board characterized by. In the electronic component mounting board according to any one of claims 18 to 20,
The material having rigidity higher than that of the wiring board is such that the bonding with the protective layer is stronger than the bonding with the wiring board,
Electronic component mounting board characterized by. An electronic component mounting board according to any one of claims 1 to 21,
A flexible main body,
A band with An electronic component mounting board according to any one of claims 1 to 21,
A flexible main body,
Card with.

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