CN208460706U - Printed steel mesh - Google Patents
Printed steel mesh Download PDFInfo
- Publication number
- CN208460706U CN208460706U CN201721614675.0U CN201721614675U CN208460706U CN 208460706 U CN208460706 U CN 208460706U CN 201721614675 U CN201721614675 U CN 201721614675U CN 208460706 U CN208460706 U CN 208460706U
- Authority
- CN
- China
- Prior art keywords
- steel mesh
- printed steel
- printing
- liner
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 45
- 239000010959 steel Substances 0.000 title claims abstract description 45
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000006071 cream Substances 0.000 claims abstract description 28
- 238000005516 engineering process Methods 0.000 claims abstract description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 25
- 229910000679 solder Inorganic materials 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 12
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model is about printed steel mesh.Print solder paste in surface mounting technology is configured for use according to the printed steel mesh of an embodiment.The printed steel mesh includes: plate, with opposite upper surface and lower surface；And the multiple printing mouths being arranged in array, multiple printing mouths run through the upper surface and lower surface of plate.The area that the printed steel mesh of the utility model can meet the liner of tin cream covering semiconductor core on piece after print solder paste is greater than or equal to 70% requirement, and there is bigger spacing between adjacent tin cream, thus the problem of being effectively improved the bridge joint of tin cream caused by reflow soldering process while guaranteeing that printing needs.
Description
Technical field
The utility model relates to technical field of semiconductors, more particularly to printing steel used in technical field of semiconductors
Net.
Background technique
In traditional flip chip surface attachment (SMT, Surface Mount Technology) processing procedure, need using
Printed steel mesh is by paste solder printing on the liner (or convex block, similarly hereinafter) of semiconductor chip.However, for having smaller liner spacing
Semiconductor chip, the printed steel mesh that the prior art generallys use be have with the size of the liner on chip to be printed it is complete
Identical printing mouth.But since the spacing between the liner of semiconductor chip is smaller, in subsequent reflow Welding, liner
On tin cream be easy to generate bridge joint, in turn result in semiconductor chip yields attenuating, greatly affected production efficiency.
Therefore, the print solder paste processing procedure of semiconductor chip small-pitch for liner, there are still considerable skills in the industry
Art problem urgent need to resolve.
Utility model content
One of the purpose of this utility model is to provide a kind of printed steel mesh, after can guaranteeing printing after print solder paste
Tin cream on liner has biggish spacing and lesser area, thus be effectively improved the tin cream bridge joint of reflow soldering process generation
Problem.
One embodiment of the utility model provides a printed steel mesh, which is configured for use in surface mount skill
Print solder paste in art.The printed steel mesh includes: plate, with opposite upper surface and lower surface；And be arranged in array
Multiple printing mouths, multiple printing mouth run through the upper surface and lower surface of plate.
In another embodiment of the utility model, multiple printing mouth is rectangle print of the long side on the column direction of array
Brush mouth.In the another embodiment of the utility model, the width of multiple rectangle printing mouth is greater than or equal to liner to be printed
The 75% of diameter.In another embodiment of the utility model, the length of multiple rectangle printing mouth is greater than or equal to multiple linings
The 100% of the diameter of pad.In the another embodiment of the utility model, multiple printing mouth is configured to print solder paste in lining
After pad, tin cream covering liner is greater than or equal to the area of liner 70%.It is multiple in another embodiment of the utility model
The central point of printing mouth is overlapped with the central point of liner to be printed.In the another embodiment of the utility model, the printing steel
Net is metal material.In another embodiment of the utility model, every a line is adjacent in multiple printing mouths for being arranged in array
The minimum spacing printed between mouth is greater than or equal to 105 microns.
The printed steel mesh that the embodiments of the present invention provide can meet tin cream covering semiconductor chip after print solder paste
On liner area be greater than or equal to liner 70% requirement, and print after liner on adjacent tin cream between minimum between
Away from more than or equal to 105 microns.Compared to traditional print solder paste processing procedure, the printing provided by the embodiments of the present invention
There is bigger spacing, but the tin cream on each liner has enough between the adjacent tin cream of semiconductor core on piece made of steel mesh
Area, thus be effectively improved while guaranteeing printing demand tin cream caused by reflow soldering process bridge joint the problem of.Thus,
There is many advantages, such as improving production efficiency and product yield.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram according to the printed steel mesh of an embodiment of the present invention
Fig. 2 is longitudinal direction when preparing print solder paste according to the printed steel mesh and semiconductor chip of an embodiment of the present invention
Diagrammatic cross-section
Fig. 3 is the operation according to an embodiment of the present invention using printed steel mesh print solder paste on a semiconductor die
The flow chart of method
Fig. 4 A and Fig. 4 B are to use the method for Fig. 3 by the flow diagram of paste solder printing to semiconductor chip
Fig. 5 is the schematic diagram that integrated circuit component is mounted on to semiconductor chip according to an embodiment of the present invention
Specific embodiment
For the spirit for better understanding the utility model, it is made below in conjunction with the part preferred embodiment of the utility model
It further illustrates.
Specifically, Fig. 1 is the overlooking structure diagram according to the printed steel mesh 100 of an embodiment of the present invention.Fig. 2 is
According to the printed steel mesh 100 of an embodiment of the present invention and semiconductor chip 200 prepare print solder paste 308 (referring to fig. 4 A,
Longitudinal profile schematic diagram when 4B).It note that printed steel mesh 100 shown in FIG. 1 includes 10 printing mouths 107, herein only conduct
Example.As those skilled in the art usually know, on printed steel mesh 100 printing mouth 107 particular number can according to
Liner 202 on the semiconductor chip 200 of printing and be accordingly arranged.In other embodiments, liner 202 may also set up in lead
On frame.
As illustrated in fig. 1 and 2, which includes plate 101, and plate 101 has opposite upper surface 103 under
Surface 105.The printed steel mesh 100 further includes the multiple printing mouths 107 being arranged in array, and multiple printing mouths 107 run through plate 101
Upper surface 103 and lower surface 105.Multiple printing mouths 107 are that rectangle of the long side on the column direction of array prints mouth.It uses
When, the central point of multiple printing mouths 107 is overlapped with the central point of liner 202 to be printed.The width of multiple rectangle printing mouths 107
The 75% of the X diameter d (as shown in Figure 2) (as shown in Figure 1) more than or equal to liner 202 to be printed.Multiple rectangles print mouth
The 100% of the 107 length Y diameter d (as shown in Figure 1) more than or equal to multiple liners 202.Multiple printing mouths 107 are configured
With in print solder paste 308, after liner 202, the covering of tin cream 308 liner 202 is greater than or equal to the area of liner 70%.Also, it is more
Minimum spacing D in a printing mouth between the adjacent printing mouth 107 of every a line is (as shown in fig. 1) more than or equal to 105 microns.
Printed steel mesh material commonly used in the art can be used in the material of printed steel mesh, it is preferable that stainless steel material, metal material can be used
Matter does not repeat herein.
Printed steel mesh 100 shown in FIG. 1, which has, makes simple, low manufacture cost, and manufactured size advantage with high accuracy.It adopts
With the printed steel mesh 100 of an embodiment of the present invention, print solder paste 308 may insure tin cream 308 on semiconductor chip 200
Covering liner 202 is greater than or equal to the area of liner 70%, and guarantees the minimum spacing between the adjacent tin cream 308 in every a line
More than or equal to 105 microns, while meeting industry and needing, a possibility that tin cream 308 bridges is reduced, while having saved tin cream
308 dosages, and improve production yield.
Fig. 3 is to use the print solder paste on semiconductor chip 200 of printed steel mesh 100 according to an embodiment of the present invention
The flow diagram of 308 operational method, which provided according to an embodiment of the present invention.Fig. 4 A and
It is stereoscopic schematic diagram of the printed steel mesh 100 of an embodiment according to the present utility model in print solder paste 308 shown in 4B.
Embodiment according to Fig.3, provides semiconductor chip 200 in step 301, the semiconductor chip 200 it is upper
Surface 201 is provided with multiple liners 202.
In step 302, as shown in Figure 4 A, semiconductor chip 200 is transmitted to printed steel mesh using printing machine platform 300
100 lower surface 105.And lifting printing machine platform 300 to the lower surface of semiconductor chip 200 203 and make semiconductor chip 200 with
The lower surface 105 of printed steel mesh 100 is bonded, so that the central point of multiple printing mouths 107 of printed steel mesh 100 and to be printed
The central point of liner 202 is overlapped.
In step 303, as shown in Figure 4 B, tin cream 308 is pushed in the upper table of printed steel mesh 100 using printing equipment 306
It is moved on face 103 to squeeze tin cream 308 to multiple and pad on each of 202.The printing equipment 306 can be this field
Common scraper.
In step 304, printing machine platform 300 moves down, so that semiconductor chip 200 is detached from printed steel mesh 100, completes
The printing of tin cream 308.
Then, as shown in figure 5, by the tin cream of the attachment of integrated circuit component 400 to the upper surface of semiconductor chip 200 201
On 308 corresponding position.Then, carry out reflow soldering process so that the conductive bump 401 of integrated circuit component 400 with partly lead
Each of multiple liners 202 of upper surface 201 of body chip 200 form layer gold altogether.Finally, the cleaning of tin cream 308 is carried out,
Complete entire flip-chip attachment processing procedure.
The printed steel mesh 100 that the embodiments of the present invention use can substantially ensure tin cream after print solder paste 308
308 covering liners 202 are greater than or equal to the area of liner 70%, and guarantee between the adjacent printing mouth 107 in every a line most
Small spacing is greater than or equal to 105 microns, reduces a possibility that tin cream 308 bridges, while having saved the dosage of tin cream 308.
The technology contents and technical characterstic of the utility model have revealed that as above, however those skilled in the art still may be used
Can teaching based on the utility model and announcement and make various replacements and modification without departing substantially from the spirit of the present invention.Therefore, originally
The protection scope of utility model should be not limited to the revealed content of embodiment, and should include various replacing without departing substantially from the utility model
It changes and modifies, and covered by present patent application claims.
Claims (7)
1. a kind of printed steel mesh, it is characterised in that the printed steel mesh, which is configured for use in surface mounting technology, prints tin
Cream, the printed steel mesh include:
Plate, with opposite upper surface and lower surface；And
The multiple printing mouths being arranged in array, the multiple printing mouth runs through the upper surface and lower surface of the plate, described more
A printing mouth is that rectangle of the long side on the column direction of the array prints mouth.
2. printed steel mesh according to claim 1, which is characterized in that the width of the multiple rectangle printing mouth is greater than or waits
In the 75% of the diameter of liner to be printed.
3. printed steel mesh according to claim 1, which is characterized in that the length of the multiple rectangle printing mouth is greater than or waits
In the 100% of the diameter of multiple liners.
4. printed steel mesh according to claim 1, which is characterized in that the multiple printing mouth is configured to described in printing
For tin cream after liner, the tin cream covers the area that the liner is greater than or equal to the liner 70%.
5. printed steel mesh according to claim 1, which is characterized in that the multiple printing central point of mouth and to be printed
The central point of liner is overlapped.
6. printed steel mesh according to claim 1, which is characterized in that the printed steel mesh is metal material.
7. printed steel mesh according to claim 1, which is characterized in that each in the multiple printing mouths being arranged in array
Minimum spacing between capable adjacent printing mouth is greater than or equal to 105 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721614675.0U CN208460706U (en) | 2017-11-28 | 2017-11-28 | Printed steel mesh |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721614675.0U CN208460706U (en) | 2017-11-28 | 2017-11-28 | Printed steel mesh |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208460706U true CN208460706U (en) | 2019-02-01 |
Family
ID=65139654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721614675.0U Active CN208460706U (en) | 2017-11-28 | 2017-11-28 | Printed steel mesh |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208460706U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111993768A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
-
2017
- 2017-11-28 CN CN201721614675.0U patent/CN208460706U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111993768A (en) * | 2020-08-10 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
| CN111993768B (en) * | 2020-08-10 | 2021-09-24 | 深圳市华星光电半导体显示技术有限公司 | Steel mesh for printing solder paste, display panel and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee after: Riyuexin semiconductor (Suzhou) Co.,Ltd. Address before: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee before: SUZHOU ASEN SEMICONDUCTORS Co.,Ltd. |