CN210955087U

CN210955087U - Debugging board and product board interconnection debugging device

Info

Publication number: CN210955087U
Application number: CN201922136208.7U
Authority: CN
Inventors: 张慕生
Original assignee: Wuxi Taiji Brain Intelligent Technology Co ltd
Current assignee: Wuxi Taiji Brain Intelligent Technology Co ltd
Priority date: 2019-12-03
Filing date: 2019-12-03
Publication date: 2020-07-07
Anticipated expiration: 2029-12-03

Abstract

The utility model provides a debugging board and product board interconnection debugging device, which comprises a debugging board and a product board; the debugging board is provided with an interface required by the debugging of the finished board; an opening is arranged in the middle of the debugging plate, and the shape of the opening corresponds to that of the finished product plate; the size of the opening is larger than that of the finished plate; pasting openings on a debugging board, and arranging first bonding pads corresponding to the interfaces; each interface on the debugging board is electrically connected with the corresponding first bonding pad through a wiring on the debugging board; and second bonding pads corresponding to the first bonding pads are arranged at the side edges of the finished board, and the second bonding pads are correspondingly connected with the chips to be debugged on the finished board through wiring on the finished board. The length and the width of the opening in the middle of the debugging plate are respectively 0.6-2 mm larger than those of the finished product plate. Furthermore, the second bonding pads on the finished board and the first bonding pads on the debugging board are welded in a one-to-one correspondence mode. The utility model discloses can reduce development cost, and shorten development consuming time.

Description

Debugging board and product board interconnection debugging device

Technical Field

The utility model belongs to the technical field of the design technique of PCB board and specifically relates to a debugging board and product board interconnection debugging device.

Background

With the development of technology, the integration level of the processor is higher and higher, the number of functional modules is higher and higher, and the peripheral hardware circuits of the system are more and more complex. In order to ensure that the whole hardware circuit is fully verified, more and more external debugging interfaces are reserved on the PCB, and the area of the PCB is larger and larger.

As shown in fig. 1, it is common practice in the industry to design a debug board 1, where various interfaces 101, including JTAG, serial port, SPI, I2C, HDMI, etc., are led out from the debug board 1, and the debug board 1 is convenient to debug, but the interface itself has a large volume, which results in a large area of the debug board 1 and cannot be assembled into a housing of a product;

therefore, when the functions of the board 1 to be debugged are all debugged and the mass production is achieved, a product board 2 is independently designed based on the product shell, codes are solidified into a memory on the product board 2, and an interface is removed to optimize the product board 2 with a smaller area; the development time is prolonged;

however, since an additional debug board 1 is required, all chips on the product board 2 need to be mounted on the debug board 1, which results in an increase in development cost.

Disclosure of Invention

To exist not enough among the prior art, the utility model provides a debugging board and product board interconnection debugging device can reduce development cost, and shortens development consuming time. The utility model adopts the technical proposal that:

a debugging board and product board interconnection debugging device comprises a debugging board and a product board;

the debugging board is provided with an interface required by the debugging of the finished board; an opening is arranged in the middle of the debugging plate, and the shape of the opening corresponds to that of the finished product plate; the size of the opening is larger than that of the finished plate;

pasting openings on a debugging board, and arranging first bonding pads corresponding to the interfaces; each interface on the debugging board is electrically connected with the corresponding first bonding pad through a wiring on the debugging board;

and second bonding pads corresponding to the first bonding pads are arranged at the side edges of the finished board, and the second bonding pads are correspondingly connected with the chips to be debugged on the finished board through wiring on the finished board.

Further, the length and the width of the opening in the middle of the debugging plate are respectively 0.6-2 mm larger than those of the finished product plate.

Furthermore, the second bonding pads on the finished board and the first bonding pads on the debugging board are welded in a one-to-one correspondence mode.

Further, the interface is arranged at a position close to the side edge of the debugging plate.

The utility model has the advantages that:

1) the circuit board to be mounted to the product shell does not need to be designed twice through a debugging plate and a product plate; the finished board can be designed to be suitable for being installed in the shell at one time, and development time is reduced.

2) The debugging board has simple circuit, and a chip of a product board does not need to be installed on the debugging board, so that the cost of the debugging board is reduced.

3) The debugging plate can be used repeatedly, and the development cost is reduced.

Drawings

Fig. 1 is a schematic diagram of a debugging board and a product board in the prior art.

Fig. 2 is a schematic diagram of the debugging board and the product board of the present invention.

Detailed Description

The invention is further described with reference to the following specific drawings and examples.

As shown in fig. 2, an interconnection debugging device for debugging boards and product boards provided by the embodiment of the present invention includes a debugging board 1 and a product board 2;

the debugging plate 1 is provided with an interface 101 required by debugging of the finished board 2; these interfaces 101 may be JTAG, serial, SPI, I2C, HDMI, etc.; the interface 101 is preferably arranged at a position close to the side edge of the debugging plate 1; for example, the various interfaces 101 may be provided at approximately four side positions of the rectangular debugging plate 1;

an opening 102 is arranged in the middle of the debugging plate 1, and the shape of the opening 102 corresponds to that of the finished plate 2; the size of the opening 102 is larger than the size of the finished panel 2;

preferably, the length and the width of the opening 102 in the middle of the debugging plate 1 are respectively 0.6-2 mm larger than those of the finished plate 2;

attaching openings 102 on the debugging board 1, and arranging first bonding pads 103 corresponding to the interfaces 101; each interface 101 on the debug board 1 is electrically connected with the corresponding first pad 103 through a wire on the debug board; more preferably, the first pads 103 are distributed around the opening 102;

the finished board 2 is designed according to functional requirements, and is usually provided with a chip 201; second bonding pads 202 corresponding to the first bonding pads 103 are arranged at the side attaching positions of the finished board 2; each second bonding pad 202 is correspondingly connected with a chip to be debugged on the finished board 2 through a routing on the finished board;

when debugging is carried out, the finished board 2 is placed in the opening 102 in the middle of the debugging board 1, and a gap which is not more than 1mm is kept between each side edge of the finished board 2 and each side edge of the opening 102; the second bonding pads 202 on the finished board 2 and the first bonding pads 103 on the debugging board 1 are correspondingly welded by soldering tin; the finished board 2 and the debugging board 1 are connected together, and each interface 101 is electrically connected with the finished board 2;

the debugging plate 1 is not required to be provided with a functional chip on the finished product plate 2, so that the cost is low and the debugging plate can be used repeatedly. The design of the finished board 2 is performed once. After debugging is finished, the soldering tin between the finished board 2 and the debugging board 1 is removed, and the finished board 2 can be installed and used without waste.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.

Claims

1. A debugging board and product board interconnection debugging device is characterized by comprising a debugging board (1) and a finished product board (2);

an interface (101) required by the debugging of the finished board (2) is arranged on the debugging board (1); an opening (102) is formed in the middle of the debugging plate (1), and the shape of the opening (102) corresponds to that of the finished plate (2); the size of the opening (102) is larger than that of the finished plate (2);

first bonding pads (103) corresponding to the interfaces (101) are arranged on the debugging board (1) by pasting openings (102); each interface (101) on the debugging board (1) is electrically connected with the corresponding first bonding pad (103) through a wiring on the debugging board;

second bonding pads (202) corresponding to the first bonding pads (103) are arranged at the side pasting positions of the finished product board (2), and the second bonding pads (202) are correspondingly connected with chips needing debugging on the finished product board (2) through wiring on the finished product board.

2. The debug board and product board interconnection debug apparatus of claim 1,

the length and the width of the opening (102) in the middle of the debugging plate (1) are respectively 0.6-2 mm larger than those of the finished plate (2).

3. The debug board and product board interconnection debug apparatus of claim 1,

and the second bonding pads (202) on the finished board (2) are welded with the first bonding pads (103) on the debugging board (1) in a one-to-one correspondence manner.

4. The debug board and product board interconnection debug apparatus of claim 1,

the interface (101) is arranged at the position of the near side of the debugging plate (1).