CN103517575A - Method for transplant grafting of printed circuit board - Google Patents
Method for transplant grafting of printed circuit board Download PDFInfo
- Publication number
- CN103517575A CN103517575A CN201310312582.2A CN201310312582A CN103517575A CN 103517575 A CN103517575 A CN 103517575A CN 201310312582 A CN201310312582 A CN 201310312582A CN 103517575 A CN103517575 A CN 103517575A
- Authority
- CN
- China
- Prior art keywords
- daughter board
- milling
- board
- printed substrate
- transplantation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a method for transplant grafting of a printed circuit board. The method for transplant grafting of the printed circuit board comprises the following steps of (1) selecting an optical point or a welding spot on a poor daughter board as a reference point of a tool of a milling machine, milling the poor daughter board off from a mother board through the milling machine, and forming a mortice in the mother board; (2) selecting an optical point or a welding spot, with the same position as the optical point or the welding spot on the poor daughter board, on a good daughter board to be transplanted as a reference point of the tool of the milling machine, milling the outer edge of the good daughter board to be transplanted to form a tenon matched with the mother board in shape through the milling machine, and using a locating machine to carry out board splicing locating on the mother board and the good daughter board to be transplanted. According to the method for transplant grafting of the printed circuit board, due to the facts that the deviation of the printed circuit board after transplant grafting can be effectively controlled, and the deviation precision of the printed circuit board can be controlled to be +/-1mil or so, quality of transplant grafting of the printed circuit board can be effectively improved, the production requirements of clients can be met, production efficiency can be effectively improved, and production cost can be reduced.
Description
Technical field
The present invention relates to printed substrate field, particularly relate to a kind of for the transplantation and graft method of formula printed substrate in flakes.
Background technology
Electronic circuit surface installation technique (SMT) is a kind ofly will without pin or short leg surface-assembled components and parts, (be called for short SMC/SMD, Chinese title sheet components and parts) be arranged on printed circuit board (Printed Circuit Board, PCB) on surface or the surface of other substrate, by the methods such as reflow welding or the immersed solder circuit load technology of welding assembly in addition.SMT technology is highly suitable for automated production, can effectively enhance productivity, and reduce production costs, so SMT technology has obtained application very widely.
In order to adapt to the automation processing of wiring board, wiring board for SMT technology adopts formula printed substrate mechanism in flakes more, on a motherboard, be furnished with a plurality of daughter boards that are arranged in parallel, automation equipment just can be carried out surface mount welding to each daughter board one by one along moving direction like this.In the prior art, if a daughter board in this printed substrate of formula is in flakes defective, often monoblock motherboard all will be scrapped, and will cause so the great cost of wasting ，Shi enterprise to improve.In order to improve printed wiring board, scrap the utilance of plate, reduce the production cost of wiring board enterprise, improve shipment rate, conventional method is to adopt transplantation and graft technique to repair to scrap plate at present.The action principle of transplantation and graft technique is: the bad daughter board of certain position on many formula printed wiring board motherboards is in flakes cut down, combination is carried out in the position that identical qualified daughter board is put into the bad daughter board of taking off again, make its in flakes any one daughter board on formula printed wiring board motherboard be all qualified product.The difficult point of this technique is mainly that outward appearance, alignment precision and the property of fine qualities after transplanting is consistent with other non-defective unit, and whether client can relievedly use.The common engineering deviation standard of wiring board is ± 4mil that, for meeting the paster precision of the downstream BGA of SMT producer or FQ FP, some clients have the requirement of higher ± 2mil.Current wiring board is transplanted technique and mainly by forming machine, is directly located jigsaw, adopts that to transplant in this way the equipment cost that wiring board needs higher, and production efficiency is lower, and processing quality is uncontrollable.
Summary of the invention
The shortcoming of prior art, the object of the present invention is to provide a kind of method that method is simple, be convenient to realize and can effectively improve printed substrate transplantation and graft quality in view of the above.
For achieving the above object and other relevant objects, the invention provides a kind of printed substrate transplantation and graft method, it comprises the steps:
1) position deviation of bad daughter board is detected, determine whether bad daughter board has the size of position deviation and position deviation;
2) choose a certain optical point on bad daughter board or solder joint as the datum mark of cutter for milling machines, with milling machine, this bad daughter board milling from motherboard is got off, and form tongue-and-groove on motherboard;
3) choose on the non-defective unit daughter board that will transplant and step 2) in reference point location is identical on bad daughter board optical point or solder joint as the datum mark of cutter for milling machines, with milling machine milling the outward flange of this non-defective unit daughter board that will transplant form with described motherboard on shape adapt tenon, as there is deviation bad daughter board position,, when the non-defective unit daughter board to transplanting carries out milling, reply differential location is proofreaied and correct;
4) use localization machine that motherboard and the non-defective unit daughter board that will transplant are carried out to jigsaw location, use glue-injection machine at the stitching portion of daughter board and motherboard injecting glue, after glue curing, this printed substrate can complete by transplantation and graft.
Preferably, in step 1), select CCD measuring system to detect the position deviation of bad daughter board, when detecting, first CCD measuring system reads in the Gerber document information of this printed substrate, then by ccd image sensor, bad daughter board is detected, finally by detecting data and Gerber document information, contrast to determine whether the position of this bad daughter board has deviation.
Preferably, in step 2), 3) in, described milling machine is provided with CCD measuring system, when carrying out milling operation, first milling machine reads in the Gerber document information of this printed substrate, then by corresponding optical point or solder joint on CCD measuring system selection wiring board, as datum mark, carries out milling operation.
Preferably, described tongue-and-groove is rectangle, T-shaped or dove-tail form.
Preferably, the glue using in step 4) is epoxy resin glue.
Preferably, in step 4), glue adopts baking box or UV equipment to be cured.
As mentioned above, printed substrate transplantation and graft method of the present invention, there is following beneficial effect: this printed substrate transplantation and graft method carries out milling using identical optical point or the solder joint in position on bad daughter board and the non-defective unit daughter board that will transplant as datum mark when transplantation and graft, and after milling, motherboard is corresponding with the shape of the non-defective unit daughter board junction that will transplant, so just can effectively control the deviation size after printed substrate transplantation and graft, can be controlled in ± 1mil of its deviation precision left and right, so just can effectively improve printed substrate transplantation and graft quality, meet client's production requirement, can effectively enhance productivity simultaneously, reduce production costs.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the embodiment of the present invention.
Fig. 2 is for adopting the printed substrate of formula in flakes of embodiment of the present invention transplantation and graft.
Element numbers explanation
1 motherboard
2 daughter boards
3 joinery and its constructions
embodiment
By particular specific embodiment explanation embodiments of the present invention, person skilled in the art scholar can understand other advantages of the present invention and effect easily by the disclosed content of this specification below.
Refer to Fig. 1,2.Notice, appended graphic the illustrated structure of this specification, ratio, size etc., equal contents in order to coordinate specification to disclose only, for person skilled in the art scholar, understand and read, not in order to limit the enforceable qualifications of the present invention, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, not affecting under the effect that the present invention can produce and the object that can reach, all should still drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under without essence change technology contents, when being also considered as the enforceable category of the present invention.
As shown in Figure 1, the invention provides a kind of printed substrate transplantation and graft method, adopt the method first to need there being the wiring board of bad daughter board to check classification, survey sample by a certain percentage outward appearance, according to production cycle, version, version order, the position classification of aberration, X-OUT block.The product of identical item number is put together, then confirming version, version order, cycle., check quantity and calculate motherboard and daughter board, plug respectively the designation card of motherboard and daughter board, indicate state, quantity.Check that complete product is entering on discharging visual inspection record by model, district to be cut is recorded respectively and moved on to the production cycle.
Before bad daughter board is cut, first the position deviation of bad daughter board is detected, determine whether bad daughter board has the size of position deviation and position deviation.Detection selects CCD measuring system to carry out, when detecting, first CCD measuring system reads in the Gerber document information of this printed substrate, and Gerber document information is normally used professional electric design automation (EDA) or CAD software to produce by wiring board designer.Gerber document is sent to PCB factory, imports CAM software, thereby provides data for every one PCB technological process.Gerber document information also can be used for providing image document for particular device.The Gerber document information that first CCD measuring system reads in this printed substrate just can be determined the position of each solder joint of printed substrate, optical point, by ccd image sensor, bad daughter board is detected the physical location that can determine each solder joint, optical point on bad daughter board, by contrast, just can determine whether the position of this bad daughter board has deviation and inclined to one side extent like this.
When bad daughter board being carried out to milling cutting, motherboard is fixed on the Cutting platform of milling cutter, and the datum mark of definite milling cutter tool, for within the daughter board after making to transplant and motherboard deviation remain on the deviation range of regulation, can choose a certain optical point on bad daughter board or solder joint as the datum mark of cutter for milling machines, with milling machine, this bad daughter board milling from motherboard is got off, and form tongue-and-groove on motherboard.Then the non-defective unit daughter board that will transplant is carried out to Milling Process, the datum mark that adds milling cutter in man-hour selects the optical point identical with reference point location on bad daughter board or solder joint as the datum mark of cutter for milling machines, with milling machine milling the outward flange of this non-defective unit daughter board that will transplant form with described motherboard on shape adapt tenon.As there is deviation bad daughter board position,, when the non-defective unit daughter board to transplanting carries out milling, reply differential location is proofreaied and correct, and guarantees that daughter board can be by Deviation Control within claimed range after transplanting.
As a kind of optimal way, CCD measuring system can be set on milling machine, when carrying out milling operation, first milling machine should read in the Gerber document information of this printed substrate, and then as datum mark, carries out milling operation by corresponding optical point or solder joint on CCD measuring system selection wiring board.Because the Gerber document information of printed substrate is identical, therefore, as long as the datum mark of selecting is identical, just can guarantee that bad daughter board is identical with the non-defective unit daughter board milling position that will transplant, so just can effectively reduce the deviate after jigsaw.
Then use localization machine that motherboard and the non-defective unit daughter board that will transplant are carried out to jigsaw location, between tenon and tongue-and-groove, gap hour is seamless transplanting, now only the tenon of daughter board need be matched one by one with tongue-and-groove relative on motherboard, with plastic cement hammer, knocked in gently interface, make it in conjunction with the smooth strike-through that then carries out.During strike-through, arbitrary face of its cutting interface is carried out to rubberizing, another side, according to the shape of seam, carries out in order successively a Jiao，Jiang Qi gap and covers, and allows it infilter gap, and unnecessary glue, dispels totally with non-dust cloth.
When gap is larger between tenon and tongue-and-groove, be seamed transplanting, now need first to confirm whether daughter board has prying; Have plate prying to be placed in marble countertop leveling, the evenness diagonal of plate prying is equal to or less than 0.05%, then daughter board and motherboard is fixed in localization machine, can choose a certain cursor point as positioning datum in the time of fixedly.Then use injecting glue in the gap of point gum machine between tongue-and-groove and tenon, after injecting glue completes, check whether glue quantity and glue put in place; After checking out, move on removable baking box or UV equipment and make glue curing, finally product is sent in drying machine again and be dried, after being dried, product is moved on cooling frame, use fan cooled, whole like this wiring board transplantation and graft technique can complete.Glue is selected epoxy resin glue,
As shown in Figure 2, be to adopt the wiring board of process transplanting of the present invention, in figure, on motherboard 1, have two daughter boards 2 for the daughter board after transplanting, between motherboard 1 and daughter board 2, adopt joinery and its construction to be connected.The tongue-and-groove of joinery and its construction can be selected as rectangle, T-shaped or dove-tail form, and the shape of tenon and the shape of tongue-and-groove adapt.
After completing, wiring board transplantation and graft generally also needs the wiring board after transplanting to carry out Quality Detection: the difficult point of transplantation and graft technology is exactly the property of fine qualities how guaranteeing after transplanting.It generally comprises following trace routine:
Reliability detects
(1) transplant precision measure, adopt two-dimentional micrometer machine to carry out engineering survey to implants.Method of measurement: measure the Fiducial Mark (optical point) of implant units with respect to x axle, the Y-axis absolute value of the Fiducial Mark (optical point) of adjacent cells.Require figure and the standard Gerber value deviation of implant units to be less than 2mil.
(2) adhesion test, adopts digital pressure gauge to measure.Method of measurement: implant units both sides are propped with the object of highly about 5mm, with the center of defeating unit, made implant units separated from motherboard with digital pressure gauge.Require thickness of slab O.4mm below, adhesion is not less than 1.5kgf/cm2 thickness of slab 0.4ram ,-, 0.8mm, adhesion be not less than 3kgf/cmh thickness of slab O.8mm～1.6mm, more than adhesion is not less than 5kgf/cmh thickness of slab 1.6mm, adhesion be not less than 8kgf/cm～.
(3) thermal shock test
After the thermal shock of tin stove, size measuring is pressed IPC.TM.650 method of testing, with 288 " (2 cross after the thermal shocks of tin stove 10s tin stove adhesion test three times, measure respectively its point-to-point size and test adhesion≤± 3 mil (0.076mm).
Solderability test.
Method of testing: press the method for testing of IPC-STD mono-003A, the plate after transplanting coated to 3～5s in the tin stove that is dipped in 245 ℃ after scaling powder, visual inspection on it tin situation whether good, implant units particularly.
(5) drop test.
Method of testing, the plate of getting after transplanting is positioned over overhead 1.2m Gao position.And be parallel to ground, allow it freely fall, check that the glue groove of implant site has flawless.
(6) test that fractures.
Method of testing: clamp 1/2nd left and right (do not clamp and transplant groove) of edges of boards with flap tool, edges of boards then fracture.Require V-CUT noresidue of rupturing.
(7) the bent test of plate bent plate.
Method of testing: press the method for testing of IPC-TM 1, after requiring to transplant, whole production board bent plate song meets customer requirement or IPC-A
This wiring board transplantation and graft technique not only can be applied to repair the V groove plate that fractures, the stamp hole connection bit plate that breaks, can also be applied to transplant some particular component in pcb board, some lamination pcb boards for example, can adopt the method for transplanting to be mounted in motherboard by Jiang Mairongmai resistance part part, the pit processing technology of special counterbore form that also can alternate route plate hight difficulty, first directly that the milling of pit position is empty, the thin slice transplanting that again a thickness is met to residual thick requirement is adhered to groove position, adopt this kind of transplanting mode) pit of the special counterbore form of JnT, cost of manufacture is lower, pit is smooth, depth tolerances can be controlled easily, the simple and direct effective manufacture method of can yet be regarded as.
This printed substrate transplantation and graft method carries out milling using identical optical point or the solder joint in position on bad daughter board and the non-defective unit daughter board that will transplant as datum mark when transplantation and graft, and after milling, motherboard is corresponding with the shape of the non-defective unit daughter board junction that will transplant, so just can effectively control the deviation size after printed substrate transplantation and graft, can be controlled in ± 1mil of its deviation precision left and right, so just can effectively improve printed substrate transplantation and graft quality, meet client's production requirement, can effectively enhance productivity, reduce production costs simultaneously.So the present invention has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all can, under spirit of the present invention and category, modify or change above-described embodiment.Therefore, such as in affiliated technical field, have and conventionally know that the knowledgeable, not departing from all equivalence modifications that complete under disclosed spirit and technological thought or changing, must be contained by claim of the present invention.
Claims (6)
1. a printed substrate transplantation and graft method, is characterized in that, it comprises the steps:
1) position deviation of bad daughter board is detected, determine whether bad daughter board has the size of position deviation and position deviation;
2) choose a certain optical point on bad daughter board or solder joint as the datum mark of cutter for milling machines, with milling machine, this bad daughter board milling from motherboard is got off, and form tongue-and-groove on motherboard;
3) choose on the non-defective unit daughter board that will transplant and step 2) in reference point location is identical on bad daughter board optical point or solder joint as the datum mark of cutter for milling machines, with milling machine milling the outward flange of this non-defective unit daughter board that will transplant form with described motherboard on shape adapt tenon, as there is deviation bad daughter board position,, when the non-defective unit daughter board to transplanting carries out milling, reply differential location is proofreaied and correct;
4) use localization machine that motherboard and the non-defective unit daughter board that will transplant are carried out to jigsaw location, use glue-injection machine at the stitching portion of daughter board and motherboard injecting glue, after glue curing, this printed substrate can complete by transplantation and graft.
2. printed substrate transplantation and graft method according to claim 1, it is characterized in that: in step 1), select CCD measuring system to detect the position deviation of bad daughter board, when detecting, first CCD measuring system reads in the Gerber document information of this printed substrate, then by ccd image sensor, bad daughter board is detected, finally by detecting data and Gerber document information, contrast to determine whether the position of this bad daughter board has deviation.
3. printed substrate transplantation and graft method according to claim 1, it is characterized in that: in step 2), 3) in, described milling machine is provided with CCD measuring system, when carrying out milling operation, first milling machine reads in the Gerber document information of this printed substrate, then by corresponding optical point or solder joint on CCD measuring system selection wiring board, as datum mark, carries out milling operation.
4. printed substrate transplantation and graft method according to claim 1, is characterized in that: described tongue-and-groove is rectangle, T-shaped or dove-tail form.
5. printed substrate transplantation and graft method according to claim 1, is characterized in that: the glue using in step 4) is epoxy resin glue.
6. printed substrate transplantation and graft method according to claim 1, is characterized in that: in step 4), glue adopts baking box or UV equipment to be cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310312582.2A CN103517575A (en) | 2013-07-24 | 2013-07-24 | Method for transplant grafting of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310312582.2A CN103517575A (en) | 2013-07-24 | 2013-07-24 | Method for transplant grafting of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103517575A true CN103517575A (en) | 2014-01-15 |
Family
ID=49899330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310312582.2A Pending CN103517575A (en) | 2013-07-24 | 2013-07-24 | Method for transplant grafting of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103517575A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106102347A (en) * | 2016-09-18 | 2016-11-09 | 惠州市金百泽电路科技有限公司 | A kind of V CUT connects printed wiring board implantation method |
| CN106507610A (en) * | 2016-10-12 | 2017-03-15 | 郑州云海信息技术有限公司 | A kind of preparation method of printed circuit board (PCB) and printed circuit board (PCB) |
| CN106793493A (en) * | 2017-01-10 | 2017-05-31 | 上海展华电子有限公司 | The splicing construction and joining method of a kind of printed substrate |
| CN107825444A (en) * | 2016-09-16 | 2018-03-23 | 天津思博科科技发展有限公司 | Surface note machine hand based on machine vision technique |
| CN108174530A (en) * | 2017-12-22 | 2018-06-15 | 昆山四合电子有限公司 | A kind of wiring board comparison method |
| CN109992798A (en) * | 2017-12-29 | 2019-07-09 | 深圳市兴森快捷电路科技股份有限公司 | It is a kind of that resistance design method is buried based on Altium Designer software |
| CN112367768A (en) * | 2020-11-30 | 2021-02-12 | 江门荣信电路板有限公司 | Processing method of embedded unit circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232089A (en) * | 2001-01-30 | 2002-08-16 | Ibiden Denshi Kogyo Kk | Multi-piece substrate and manufacturing method thereof |
| CN2563644Y (en) * | 2002-08-14 | 2003-07-30 | 和椿科技股份有限公司 | Image supplement and correct system of autoamtic laser bar code imprinter |
| TW200520641A (en) * | 2003-12-02 | 2005-06-16 | jin-quan Lai | Method for replacing inter-connected defective printed circuit boards |
-
2013
- 2013-07-24 CN CN201310312582.2A patent/CN103517575A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232089A (en) * | 2001-01-30 | 2002-08-16 | Ibiden Denshi Kogyo Kk | Multi-piece substrate and manufacturing method thereof |
| CN2563644Y (en) * | 2002-08-14 | 2003-07-30 | 和椿科技股份有限公司 | Image supplement and correct system of autoamtic laser bar code imprinter |
| TW200520641A (en) * | 2003-12-02 | 2005-06-16 | jin-quan Lai | Method for replacing inter-connected defective printed circuit boards |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107825444A (en) * | 2016-09-16 | 2018-03-23 | 天津思博科科技发展有限公司 | Surface note machine hand based on machine vision technique |
| CN106102347A (en) * | 2016-09-18 | 2016-11-09 | 惠州市金百泽电路科技有限公司 | A kind of V CUT connects printed wiring board implantation method |
| CN106507610A (en) * | 2016-10-12 | 2017-03-15 | 郑州云海信息技术有限公司 | A kind of preparation method of printed circuit board (PCB) and printed circuit board (PCB) |
| CN106793493A (en) * | 2017-01-10 | 2017-05-31 | 上海展华电子有限公司 | The splicing construction and joining method of a kind of printed substrate |
| CN108174530A (en) * | 2017-12-22 | 2018-06-15 | 昆山四合电子有限公司 | A kind of wiring board comparison method |
| CN108174530B (en) * | 2017-12-22 | 2020-12-18 | 昆山四合电子有限公司 | Circuit board comparison method |
| CN109992798A (en) * | 2017-12-29 | 2019-07-09 | 深圳市兴森快捷电路科技股份有限公司 | It is a kind of that resistance design method is buried based on Altium Designer software |
| CN109992798B (en) * | 2017-12-29 | 2023-10-24 | 深圳市兴森快捷电路科技股份有限公司 | Buried resistor design method based on Aldium Designer software |
| CN112367768A (en) * | 2020-11-30 | 2021-02-12 | 江门荣信电路板有限公司 | Processing method of embedded unit circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103517575A (en) | Method for transplant grafting of printed circuit board | |
| CN107944517B (en) | Product whole-process quality tracing method | |
| CN101426344B (en) | Reflux temperature curve setting method and apparatus thereof | |
| CN102291949A (en) | Manufacturing method of multi-layer circuit board | |
| Huang et al. | The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction | |
| CN102990178A (en) | Method for improving programming speed and precision of soldering robot by using Gerber file | |
| CN102248288A (en) | Method for identifying and positioning flexible printed circuit (FPC) board plug | |
| CN106714465A (en) | Visual inspection-based PCB board automatic splicing method | |
| CN109583526A (en) | Two dimensional code application method, device and the storage medium of pcb board | |
| CN107133725A (en) | A kind of automated production management system of circuit board | |
| CN206470220U (en) | Circuit board detecting system | |
| CN103118482B (en) | There is circuit board and the discrimination method thereof of quality identification mark | |
| CN101684999B (en) | Conversion method of data format | |
| CN104519674A (en) | Partial mixed lamination board dislocation prevention method | |
| CN201332544Y (en) | Automatic alignment system for circuit board implantation | |
| CN203446106U (en) | Piece connecting-type printed circuit board structure convenient to be transplanted | |
| CN104765931B (en) | a kind of PCB design method and system | |
| CN105759196A (en) | Automatic positioning initial workpiece circuit board detection system with compensation calibration function | |
| CN204545651U (en) | A kind of wiring board welding localization tool | |
| CN101425099B (en) | Method and system for detecting element layout | |
| CN104111047A (en) | Calibration assisting device, correction method, inspection method and verification method | |
| CN204119669U (en) | A kind of multi-functional location attachment pallet | |
| KR101408848B1 (en) | Information tracing method of pcb test processing with multi-step mapping | |
| CN1677404A (en) | Paster-programming control method suitable for Nippon JUKI and siemens AG paster machine | |
| CN103327743A (en) | Para-position production method with accuracy within 2Mil for circuit board resistance welding windowing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20170412 |
|
| AD01 | Patent right deemed abandoned |