CN201332544Y - Automatic alignment system for circuit board implantation - Google Patents
Automatic alignment system for circuit board implantation Download PDFInfo
- Publication number
- CN201332544Y CN201332544Y CNU2008202358779U CN200820235877U CN201332544Y CN 201332544 Y CN201332544 Y CN 201332544Y CN U2008202358779 U CNU2008202358779 U CN U2008202358779U CN 200820235877 U CN200820235877 U CN 200820235877U CN 201332544 Y CN201332544 Y CN 201332544Y
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- Prior art keywords
- alignment system
- automatic alignment
- automatic
- plate
- circuit board
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Abstract
The utility model relates to an automatic alignment system for circuit board implantation. The automatic alignment system is electrically connected with a host computer, and comprises an automatic platform, a CCD camera and a micro-adjusting machine, wherein the automatic platform is used to place the fixing point of a printed circuit board; the CCD camera is arranged above the automatic platform and used to detect the printed circuit board; and the micro-adjusting machine is arranged below the automatic platform and controlled by the host computer. The CCD camera and the micro-adjusting machine are electrically connected with the host computer. In the prior art, more or less deviation is caused when the cathode plate forming a skip area is manually aligned with a single-chip anode plate taken down from other circuit boards. The utility model has the advantages that the poor loop module is taken out from the single-chip cathode plate after cutting, the single-chip cathode plate is fixed together with the good loop module single chips through the precise automatic alignment system, the good loop module single chips in the connected chips are jointed through refractory tapes and adhesives, and the operation, the replacement and the combination of the chip connection plates of the printed circuit board are further improved.
Description
Technical field
The utility model relates to printed substrate, more particularly, relates to a kind of automatic alignment system that circuit board is transplanted that is used for.
Background technology
Fig. 1 shows a kind of multiple-plate printed substrate structure.In Fig. 1, A1 represents the fixing point (optics point) of cloudy plate lower-left end, A2 represents the fixing point (optics point) of cloudy plate left upper end, B1 represents the fixing point of positive plate left upper end, B2 represents the fixing point of positive plate bottom righthand side, A3 represents cloudy plate upper right corner fixing point (optics point), and A4 represents cloudy plate lower right corner fixing point (optics point).
In the connection sheet, 4 arrangements (small pieces composing) are arranged, 4 return circuit modules are numbered 01,02,03,04 and arrange (abbreviating connection sheet plate as) continuously, 4 the return circuit module monolithics 01,02,03,04 of connection in the sheet at the machine sheet metal forming after whether test machine detects be qualified product, if not unusual, then this connection sheet module monolithic 01,02,03,04 is qualified product; If arrange in the return circuit module monolithic and have when wherein any one monolithic (as numbering 2) is bad for 4 in the connection sheet, then these 4 platelet return circuit module monolithic 01-04 will scrap all.Because of the client does not allow to join the monolithic defective products is not arranged in the sheet, scrap and to scrap together by its other non-defective unit that joins in sheet of the company of dragging if any a slice.
During if any any small pieces defective products return circuit module monolithic, the return circuit module monolithic of this non-defective unit multi-disc will be scrapped together simultaneously in the above connection sheet, and the loss that brings is serious, and delivery quantity regular meeting deficiency, and there isn't enough time in feed supplement again, causes prestige impaired.Therefore, the non-non-defective unit platelet in the bar printing wiring board is taken out, on the bad printed substrate of another piece, mill out and the positive plate of the non-defective unit of last printed substrate coupling, the non-defective unit platelet that mills out is mended on big plate by adhesive or alternate manner.Yet, use in this case and manually carry out contraposition, all certain deviation can appear more or less.
The utility model content
The technical problems to be solved in the utility model is, manually make cloudy plate that forms the dead zone and the monolithic sun plate that takes off from other wiring board carry out contraposition at the above-mentioned usefulness of prior art and produce the defective of deviation, a kind of automatic alignment system that circuit board is transplanted that is used for is provided.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of automatic alignment system that circuit board is transplanted that is used for, described automatic alignment system is electrically connected with host computer, comprise the automatic platform that is provided with the fixing point of placing printed substrate, be arranged on the CCD camera that printed substrate detected described automatic platform top, be arranged on the freqency fine adjustment machine of described automatic platform below by described host computer control, described CCD camera all is electrically connected with described host computer with freqency fine adjustment machine.
In automatic alignment system described in the utility model, described automatic alignment system also comprises the lift that is arranged on described automatic platform below control component height.
In automatic alignment system described in the utility model, described automatic alignment system also comprises and is connected the manipulator that is used to pick and place printed substrate with host computer.
In automatic alignment system described in the utility model, the described printed substrate that is placed on the automatic platform comprises the cloudy plate that forms the dead zone and is placed on the monolithic sun plate that takes off from another non-defective unit printed substrate in the dead zone.
In automatic alignment system described in the utility model, described cloudy plate and the monolithic sun zone of closing of hardening is a waveform.
In automatic alignment system described in the utility model, described monolithic sun plate is fixed on the described cloudy plate by high temperature resistant adhesive tape and adhesive.
Implement the automatic alignment system that the utility model is transplanted in circuit board, has following beneficial effect: the former cloudy plate of the monolithic that takes out bad return circuit module in the back that cut, be fixed together through automatic alignment system of precision and good return circuit module monolithic, by pasting high temperature resistant adhesive tape and adhesive, good return circuit module monolithic in the connection sheet is engaged, further improved the operation of printed substrate connection sheet plate and replaced combination.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is a kind of schematic diagram of multiple-plate printed substrate structure;
Fig. 2 is the structural representation of automatic alignment system of the present utility model;
Fig. 3 is the measurement plane figure of automatic alignment system of the present utility model;
Fig. 4 is the schematic diagram of cloudy plate and the positive piece contraposition of monolithic in the printed circuit board (PCB) connection sheet;
Fig. 5 has formed the cloudy plate of dead zone and the profile that non-defective unit monolithic sun hardens and closes;
Fig. 6 has formed the cloudy plate of dead zone and the enlarged diagram that non-defective unit monolithic sun hardens and closes.
Embodiment
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be understood that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
As shown in Figure 2, there is shown the utility model and be used for the automatic alignment system that circuit board is transplanted.Shown automatic alignment system is electrically connected with host computer 1, comprise the automatic platform 4 that is provided with the fixing point of placing printed substrate 5, be arranged on the CCD camera 2 that printed substrate 5 detected automatic platform 4 tops, be arranged on the freqency fine adjustment machine 3 of automatic platform 4 belows by host computer 1 control, CCD camera 2 all is electrically connected with host computer 1 with freqency fine adjustment machine 3.In addition, automatic alignment system of the present utility model also comprises the lift (not shown) that is arranged on automatic platform 4 belows control printed substrate 5 height.The same with similar PCB manufacturing equipment, automatic alignment system of the present utility model also comprises and is connected the manipulator (not shown) that is used to pick and place printed substrate 5 with host computer 1.
The above-mentioned printed substrate 5 that is placed on the automatic platform 4 comprises the cloudy plate that forms the dead zone and is placed on the monolithic sun plate that takes off from another non-defective unit printed substrate in the dead zone, wherein cloudy plate and the monolithic sun zone of closing of hardening is a waveform, and monolithic sun plate is fixed on the cloudy plate by high temperature resistant adhesive tape and adhesive.Adhesive is preferably the epoxy resin of heat-resisting quantity, can add curing agent in the adhesive, and adding proportion percentage is host 80%, hard agent 20%.Further, the bad return circuit module monolithic that more than takes out forms the cloudy plate of dead zone, and the spacing of having taken out between the return circuit module monolithic combination of positive plate of non-defective unit is set at 0.15-0.6mm.
According to the utility model, what the bad replacement in the circuit board connection sheet was adopted is that automatic alignment system is replaced combined method and cutting.Automatic alignment system of the present utility model is a kind of accurate high replacement bonding apparatus of locating, after relating generally to the line loop module board cutting of the arrangement in the circuit board connection sheet, the return circuit module monolithic that takes out bad return circuit module monolithic non-defective unit is placed on location on the connection sheet that forms the dead zone and strong bonded.Connection taken out in the sheet cloudy plate behind the return circuit module monolithic of non-defective unit and monolithic sun harden close between aligning accuracy, after a glue is fixing deviant be ± the 0.015mm scope in.
Coupling system is replaced in automatic location of the present utility model, it mainly is the bad return circuit module monolithic of the line loop module board of cutting back taking-up, through this automatic alignment system the good return circuit module monolithic of non-defective unit is fixed, pasting the heatproof adhesive tape fixes with the some adhesive, do heat then and be baked to curing (hot baking temperature is set at 60-150 degree centigrade), can be converted to the non-defective unit plate to defective products, can reach the standard of client's quality inspection, and improve circuit board factory and produce yield.
As shown in Figure 3, there is shown the measurement plane figure of automatic alignment system of the present utility model.What CCD camera 2 adopted is the method for established standards dimensional measurement.Fixing point (label the is A1) system of being of cloudy plate plays the zero point of moving axes, identical fixing point B1 belongs to the fixing point of positive plate the inside appointment, and alignment system can be along A1 to B1 automatically, while A2 to B2 (as shown in Figure 3), operate with X, Y-axis, precision can reach ± 0.015mm.
Automatic alignment system work flow of the present utility model is as follows: the cloudy plate of appointment and the standard size of positive plate are imported 1 li of host computer earlier, program start from CCD camera 2, first seeks former fixing point (coordinate code name at zero point is A1), automatically moving to B1 after the A1 contraposition measures, CCD camera 2 projected data are returned to host computer 1 simultaneously, host computer 1 can the cloudy plate of immediate response and the fixing point of positive plate apart from size, judge whether itself and former set standard size are being offset and are going beyond the scope.If any error, host computer 1 will be sent out signal automatically and give freqency fine adjustment machine 3, and freqency fine adjustment machine 3 will be adjusted automatically and be positioned in the critical field, then represents OK (size is in scope) if show green light on the automatic platform 4; If show red light, then represent NG (size goes beyond the scope).
Fig. 4 is the cloudy plate of the formation dead zone in the printed circuit board (PCB) connection sheet and the schematic diagram that carries out contraposition from the monolithic sun plate that another printed substrate takes out.Bad return circuit module monolithic in the printed circuit board (PCB) connection sheet plate cuts, mills out bad return circuit module monolithic and forms dead zone (being cloudy plate), select the non-defective unit return circuit module single piece plate (positive plate) in the identical sheet else, cloudy plate mills out bad return circuit module monolithic, after milling out, moulding forms lateral groove, the cutting of sun plate mills out and connects the shape that the opposite position section formation outside occurs, and it is waveform that both grooved overhang outward appearances are all looked class.It is good that font that cloudy plate and positive plate are designed and spacing effectively improve this stability of structure.After taking out this bad return circuit module monolithic in the former sheet plate of combination at that time, formed dead zone (cloudy plate) and selected the high temperature gummed tape removal of being pasted between the monolithic return circuit module (positive plate) of non-defective unit plate at last, the result is transformed into the non-defective unit plate, promoted the yields that circuit board is made like this, reduce scrappage, improved the industry competitiveness.
As shown in Figure 5 and Figure 6, formerly cut the regional undulate that the single piece plate of taking out bad return circuit module in the back combines with good return circuit module monolithic.Reference numeral among Fig. 5 and Fig. 6 is illustrated respectively in the point that adhesive is dripped in the waveform zone, by pasting high temperature resistant adhesive tape and adhesive, the good return circuit module monolithic in the connection sheet is engaged, and has further improved the operation of printed circuit board (PCB) connection sheet plate and has replaced combination.
The utility model purpose is that above-mentioned bad return circuit module single piece plate is taken out in the former back of having cut, fixing through the automatic alignment system of precision with good return circuit module monolithic, by pasting high temperature resistant adhesive tape and adhesive, good return circuit module monolithic in the connection sheet is engaged, further improved the operation of printed circuit board (PCB) connection sheet plate and replaced combination.Implement the utility model, can strengthen the stability that engages between the defective products and non-defective unit return circuit module monolithic in the printed circuit board (PCB) connection sheet, can effectively prevent the abnormal quality that the module monolithic in the circuit board connection sheet is replaced, as be out of shape, burst apart, come off, size displacement etc. unusually.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; any modification of being done within every spirit of the present utility model and the principle, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (6)
1, a kind of automatic alignment system that is used for the circuit board transplanting, it is characterized in that, described automatic alignment system is electrically connected with host computer, comprise the automatic platform that is provided with the fixing point of placing printed substrate, be arranged on the CCD camera that printed substrate detected described automatic platform top, be arranged on the freqency fine adjustment machine of described automatic platform below by described host computer control, described CCD camera all is electrically connected with described host computer with freqency fine adjustment machine.
2, automatic alignment system according to claim 1 is characterized in that, described automatic alignment system also comprises the lift that is arranged on described automatic platform below control component height.
3, automatic alignment system according to claim 1 is characterized in that, described automatic alignment system also comprises with described host computer and is connected the manipulator that is used to pick and place printed substrate.
4, automatic alignment system according to claim 1 is characterized in that, the described printed substrate that is placed on the automatic platform comprises the cloudy plate that forms the dead zone and is placed on the monolithic sun plate that takes off from another non-defective unit printed substrate in the dead zone.
5, automatic alignment system according to claim 4 is characterized in that, described cloudy plate and the monolithic sun zone of closing of hardening is a waveform.
6, automatic alignment system according to claim 5 is characterized in that, described monolithic sun plate is fixed on the described cloudy plate by high temperature resistant adhesive tape and adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202358779U CN201332544Y (en) | 2008-12-30 | 2008-12-30 | Automatic alignment system for circuit board implantation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202358779U CN201332544Y (en) | 2008-12-30 | 2008-12-30 | Automatic alignment system for circuit board implantation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201332544Y true CN201332544Y (en) | 2009-10-21 |
Family
ID=41225929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202358779U Expired - Fee Related CN201332544Y (en) | 2008-12-30 | 2008-12-30 | Automatic alignment system for circuit board implantation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201332544Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686033A (en) * | 2012-06-08 | 2012-09-19 | 镇江华印电路板有限公司 | Transplanting method for circuit board |
| CN106507610A (en) * | 2016-10-12 | 2017-03-15 | 郑州云海信息技术有限公司 | A kind of preparation method of printed circuit board (PCB) and printed circuit board (PCB) |
| CN108174530A (en) * | 2017-12-22 | 2018-06-15 | 昆山四合电子有限公司 | A kind of wiring board comparison method |
| CN110430694A (en) * | 2019-07-03 | 2019-11-08 | 温州源利智能科技有限公司 | A kind of automated calibration equipment before pcb board graft procedure |
| CN111511184A (en) * | 2020-05-07 | 2020-08-07 | 龙南县方成科技有限公司 | Full-automatic machine of following |
-
2008
- 2008-12-30 CN CNU2008202358779U patent/CN201332544Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686033A (en) * | 2012-06-08 | 2012-09-19 | 镇江华印电路板有限公司 | Transplanting method for circuit board |
| CN106507610A (en) * | 2016-10-12 | 2017-03-15 | 郑州云海信息技术有限公司 | A kind of preparation method of printed circuit board (PCB) and printed circuit board (PCB) |
| CN108174530A (en) * | 2017-12-22 | 2018-06-15 | 昆山四合电子有限公司 | A kind of wiring board comparison method |
| CN108174530B (en) * | 2017-12-22 | 2020-12-18 | 昆山四合电子有限公司 | Circuit board comparison method |
| CN110430694A (en) * | 2019-07-03 | 2019-11-08 | 温州源利智能科技有限公司 | A kind of automated calibration equipment before pcb board graft procedure |
| CN110430694B (en) * | 2019-07-03 | 2020-07-17 | 广东顺德星原电子实业有限公司 | Automatic calibration equipment before PCB transplanting operation |
| CN111511184A (en) * | 2020-05-07 | 2020-08-07 | 龙南县方成科技有限公司 | Full-automatic machine of following |
| CN111511184B (en) * | 2020-05-07 | 2021-05-04 | 龙南县方成科技有限公司 | Full-automatic machine of following |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091021 Termination date: 20111230 |