CN102686033A - Transplanting method for circuit board - Google Patents
Transplanting method for circuit board Download PDFInfo
- Publication number
- CN102686033A CN102686033A CN2012101889748A CN201210188974A CN102686033A CN 102686033 A CN102686033 A CN 102686033A CN 2012101889748 A CN2012101889748 A CN 2012101889748A CN 201210188974 A CN201210188974 A CN 201210188974A CN 102686033 A CN102686033 A CN 102686033A
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- CN
- China
- Prior art keywords
- wiring board
- plate body
- bad
- circuit board
- milling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention discloses a transplanting method for a circuit board. According to the method, an undesirable board body of an undesirable circuit board is milled and is replaced with a qualified board body, so that after a replacing board body is transplanted onto the undesirable circuit board, the undesirable circuit board can be used normally, and the scrapped circuit board is effectively utilized.
Description
Technical field
The present invention relates to wiring board and make the field, the method that especially a kind of wiring board is transplanted.
Background technology
Along with the competition in market, increasing Electronics Factory requires to produce wiring board in flakes, in the hope of enhancing productivity, reduces production costs.The list of wiring board is only scrapped a difficult problem that becomes circuit board plant gradually in flakes, and particularly at present external client does not receive in flakes the list of plate fully and only scraps, and domestic also have Electronics Factory about 10% not receive in flakes the list of plate only to scrap.So the situation of scrapping of plate becomes a puzzlement greatly of vast circuit board plant in flakes.
Therefore, need a kind of new technical scheme to address the above problem.
Summary of the invention
To above-mentioned existing in prior technology problem and shortage, the purpose of this invention is to provide a kind of method that can utilize the wiring board transplanting of scrapping wiring board again.
For realizing above-mentioned purpose, the method that wiring board of the present invention is transplanted can adopt following technical scheme:
The method that a kind of wiring board is transplanted may further comprise the steps:
(1), wiring board is tested, find out the bad plate body in the bad wiring board;
(2), this bad plate body is got off through the Digit Control Machine Tool milling;
(3), will replace with the wiring board after plate body and the milling and dock, and will replace the position that is installed on original bad plate body with plate body;
(4), will replace with plate body and wiring board through the glue bonding.
The present invention is compared with prior art: be substituted into qualified plate body through after the bad plate body milling in the bad wiring board is got off, make bad wiring board transplant replacement again and can normally use with after the plate body, effectively utilized the wiring board of scrapping.
Embodiment
Below in conjunction with embodiment; Further illustrate the present invention; Should understand following embodiment only be used to the present invention is described and be not used in the restriction scope of the present invention; After having read the present invention, those skilled in the art all fall within the application's accompanying claims institute restricted portion to the modification of the various equivalent form of values of the present invention.
The present invention discloses the method that a kind of wiring board is transplanted, and said wiring board is formula wiring board in flakes, and this method may further comprise the steps:
(1), wiring board is tested, find out the bad plate body in the bad wiring board;
(2), this bad plate body is got off through the Digit Control Machine Tool milling;
(3), will replace with the wiring board after plate body and the milling and dock, and will replace the position that is installed on original bad plate body with plate body;
(4), will replace with plate body and wiring board through the glue bonding.
The qualified plate body that replacement in the said step (3) uses plate body to get off for milling in other bad wiring boards can make full use of all bad wiring boards to reconfigure like this, realizes maximum saving.
The present invention is through being substituted into qualified plate body after the bad plate body milling in the bad wiring board is got off; Making bad wiring board transplant replacement again can normally use with after the plate body; Effectively utilized the wiring board of scrapping; Through calculating, the method that adopts wiring board of the present invention to transplant can be practiced thrift the scrappage more than 50%.
Claims (3)
1. the wiring board method of transplanting is characterized in that: may further comprise the steps:
(1), wiring board is tested, find out the bad plate body in the bad wiring board;
(2), this bad plate body is got off through the Digit Control Machine Tool milling;
(3), will replace with the wiring board after plate body and the milling and dock, and will replace the position that is installed on original bad plate body with plate body;
(4), will replace with plate body and wiring board through the glue bonding.
2. one kind is used the method for wiring board transplanting according to claim 1, it is characterized in that: the qualified plate body that the replacement in the said step (3) uses plate body to get off for milling in other bad wiring boards.
3. method of using wiring board according to claim 1 to transplant is characterized in that: said wiring board is formula wiring board in flakes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101889748A CN102686033A (en) | 2012-06-08 | 2012-06-08 | Transplanting method for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101889748A CN102686033A (en) | 2012-06-08 | 2012-06-08 | Transplanting method for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102686033A true CN102686033A (en) | 2012-09-19 |
Family
ID=46817191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101889748A Pending CN102686033A (en) | 2012-06-08 | 2012-06-08 | Transplanting method for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102686033A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110430694A (en) * | 2019-07-03 | 2019-11-08 | 温州源利智能科技有限公司 | A kind of automated calibration equipment before pcb board graft procedure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005045072A (en) * | 2003-07-23 | 2005-02-17 | Toyota Motor Corp | Method for laying boards and multilayer board |
| CN101296579A (en) * | 2007-04-27 | 2008-10-29 | 欣兴电子股份有限公司 | Station transplantation device of multi-gang circuit board |
| CN201332544Y (en) * | 2008-12-30 | 2009-10-21 | 廖宗毅 | Automatic alignment system for circuit board implantation |
-
2012
- 2012-06-08 CN CN2012101889748A patent/CN102686033A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005045072A (en) * | 2003-07-23 | 2005-02-17 | Toyota Motor Corp | Method for laying boards and multilayer board |
| CN101296579A (en) * | 2007-04-27 | 2008-10-29 | 欣兴电子股份有限公司 | Station transplantation device of multi-gang circuit board |
| CN201332544Y (en) * | 2008-12-30 | 2009-10-21 | 廖宗毅 | Automatic alignment system for circuit board implantation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110430694A (en) * | 2019-07-03 | 2019-11-08 | 温州源利智能科技有限公司 | A kind of automated calibration equipment before pcb board graft procedure |
| CN110430694B (en) * | 2019-07-03 | 2020-07-17 | 广东顺德星原电子实业有限公司 | Automatic calibration equipment before PCB transplanting operation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120919 |