CN108174530B - Circuit board comparison method - Google Patents
Circuit board comparison method Download PDFInfo
- Publication number
- CN108174530B CN108174530B CN201711408162.9A CN201711408162A CN108174530B CN 108174530 B CN108174530 B CN 108174530B CN 201711408162 A CN201711408162 A CN 201711408162A CN 108174530 B CN108174530 B CN 108174530B
- Authority
- CN
- China
- Prior art keywords
- circuit boards
- ccd
- circuit board
- board
- lenses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000003825 pressing Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000007689 inspection Methods 0.000 abstract description 8
- 238000011161 development Methods 0.000 abstract description 3
- 238000012797 qualification Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Abstract
The invention discloses a circuit board comparison method, which comprises the steps of circuit board fixing, lens focusing positioning, image comparison and classification and sorting, wherein the transplanted circuit board is classified and sorted through multi-lens multi-directional comparison and inspection, qualified circuit boards are classified into one class and packed and warehoused, unqualified circuit boards are classified into one class and reworked, and doubtful circuit boards are classified into one class and retested, so that the comparison and inspection accuracy is greatly improved, the qualification rate of finished products is improved, the utilization rate of the circuit boards is improved, the cost of the circuit boards is reduced, and the circuit board comparison method is in line with enterprise development.
Description
Technical Field
The invention relates to a circuit board comparison method, and belongs to the technical field of circuit board manufacturing.
Background
Along with the competition in market, more and more electronic factory requires production even circuit board, with the hope of improving production efficiency, reduction in production cost, even the single one of circuit board is scrapped and has become the difficult problem of circuit board factory gradually, a daughter board in even piece formula printed wiring board is unqualified, often can make the monoblock mother board all scrap, will cause very big waste like this, in transplanting the grafting process, it is essential a step to the circuit board after transplanting the inspection to compare, be used for examining whether the circuit board after transplanting accords with the requirement, whether satisfy the quality requirement of circuit board, but compare the mode diverse of inspection, the enterprise needs a circuit board comparison method that can satisfy the requirement.
Disclosure of Invention
In view of the above technical problems, the present invention aims to: the circuit board comparison method capable of accurately checking whether the circuit board meets the requirements is provided.
The technical solution of the invention is realized as follows: a circuit board comparison method comprises the following processing steps that firstly, a circuit board is fixed, the circuit board is placed on a table board of a comparison device and is fixed through a pressing block; secondly, focusing and positioning the lenses, adjusting a plurality of CCD lenses on the comparison device, adjusting one CCD lens to align to a positioning point on an original intact daughter board on the circuit board, and then adjusting other CCD lenses according to the position of the first CCD lens, wherein each CCD lens is sequentially aligned to the positioning point of the daughter board on the circuit board; thirdly, comparing images, connecting the CCD lens with a computer, reflecting the images on a display, observing the position of a positioning point below the CCD lens on the display, checking whether the transplanted daughter board and the original intact daughter board are horizontally and vertically aligned, and determining the position and the precision of the transplanted daughter board; fourthly, classifying and arranging, namely classifying and arranging the circuit boards which meet the precision and position requirements after comparison; classifying and reworking the circuit boards which do not meet the requirements of precision and position; and classifying the suspected circuit boards and then retesting the circuit boards.
Preferably, in the second step, four CCD lenses are provided and are arranged at the upper end of the table top.
Preferably, in the second step, six CCD lenses are arranged at the upper end of the table board.
Preferably, the number of the CCD lenses is eight, four are arranged at the upper end of the table board, and four are arranged at the lower end of the table board.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
the circuit board comparison method comprises four steps of circuit board fixing, lens focusing positioning, image comparison and classification and sorting, classified sorting of transplanted circuit boards is performed through multi-lens multi-directional comparison inspection, qualified circuit boards are classified into one class and packed for storage, unqualified circuit boards are classified into one class and reworked, suspected circuit boards are classified into one class and retested, accuracy of comparison inspection is greatly improved, qualification rate of finished products is improved, utilization rate of the circuit boards is improved, cost of the circuit boards is reduced, and enterprise development is met.
Drawings
The technical scheme of the invention is further explained by combining the accompanying drawings as follows:
fig. 1 is a flow chart of a circuit board comparison method according to the present invention.
Detailed Description
The invention is described below with reference to the accompanying drawings.
Embodiment 1, the comparison method of a circuit board according to the present invention includes the following processing steps, first, the circuit board is fixed, the circuit board is placed on the table top of the comparison device and is fixed by a pressing block; secondly, focusing and positioning the lenses, adjusting four CCD lenses on the comparison device, adjusting one CCD lens to align to a positioning point on an original intact daughter board on the circuit board, and adjusting other three CCD lenses according to the position of the first CCD lens, wherein each CCD lens is sequentially aligned to the positioning point of the daughter board on the circuit board; thirdly, comparing images, connecting the CCD lens with a computer, reflecting the images on a display, observing the position of a positioning point below the CCD lens on the display, checking whether the transplanted daughter board and the original intact daughter board are horizontally and vertically aligned, and determining the position and the precision of the transplanted daughter board; fourthly, classifying and arranging, namely classifying and arranging the circuit boards which meet the precision and position requirements after comparison; classifying and reworking the circuit boards which do not meet the requirements of precision and position; and classifying the suspected circuit boards and then retesting the circuit boards.
Embodiment 2, a circuit board comparison method according to the present invention includes a first step of fixing a circuit board by placing the circuit board on a table top of a comparison device and fixing the circuit board with a press block; secondly, focusing and positioning the lenses, adjusting six CCD lenses on the comparison device, adjusting one CCD lens to align to a positioning point on an original intact daughter board on the circuit board, and adjusting the other five CCD lenses according to the position of the first CCD lens, wherein each CCD lens is sequentially aligned to the positioning point of the daughter board on the circuit board; thirdly, comparing images, connecting the CCD lens with a computer, reflecting the images on a display, observing the position of a positioning point below the CCD lens on the display, checking whether the transplanted daughter board and the original intact daughter board are horizontally and vertically aligned, and determining the position and the precision of the transplanted daughter board; fourthly, classifying and arranging, namely classifying and arranging the circuit boards which meet the precision and position requirements after comparison; classifying and reworking the circuit boards which do not meet the requirements of precision and position; and classifying the suspected circuit boards and then retesting the circuit boards.
Embodiment 3, the comparison method of a circuit board according to the present invention includes the following processing steps, first, the circuit board is fixed, the circuit board is placed on the table top of the comparison device and is fixed by a pressing block; secondly, focusing and positioning the lenses, adjusting eight CCD lenses on the comparison device, wherein the number of the CCD lenses is eight, four CCD lenses are arranged at the upper end of the table board, four CCD lenses are arranged at the lower end of the table board, one CCD lens at the upper end is adjusted to be aligned with a positioning point on an original complete daughter board on the circuit board, one CCD lens at the lower end is adjusted to be aligned with a positioning point on the original complete daughter board below the circuit board, the other six CCD lenses at the upper end and the lower end are adjusted according to the position of the first CCD lens at the upper end and the lower end, and each CCD lens is sequentially aligned with positioning; thirdly, comparing images, connecting the CCD lens with a computer, reflecting the images on a display, observing the position of a positioning point below the CCD lens on the display, checking whether the transplanted daughter board and the original intact daughter board are horizontally and vertically aligned, and determining the position and the precision of the transplanted daughter board; fourthly, classifying and arranging, namely classifying and arranging the circuit boards which meet the precision and position requirements after comparison; classifying and reworking the circuit boards which do not meet the requirements of precision and position; and classifying the suspected circuit boards and then retesting the circuit boards.
The circuit board comparison method comprises four steps of circuit board fixing, lens focusing positioning, image comparison and classification and sorting, classified sorting of transplanted circuit boards is performed through multi-lens multi-directional comparison inspection, qualified circuit boards are classified into one class and packed for storage, unqualified circuit boards are classified into one class and reworked, suspected circuit boards are classified into one class and retested, accuracy of comparison inspection is greatly improved, qualification rate of finished products is improved, utilization rate of the circuit boards is improved, cost of the circuit boards is reduced, and enterprise development is met.
The above-mentioned embodiments are merely illustrative of the technical idea and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the scope of the present invention.
Claims (4)
1. A circuit board comparison method is characterized in that: the method comprises the following processing steps that firstly, a circuit board is fixed, and the circuit board is placed on a table top of a comparison device and fixed by a pressing block; secondly, focusing and positioning the lenses, adjusting a plurality of CCD lenses on the comparison device, adjusting one CCD lens to align to a positioning point on an original intact daughter board on the circuit board, and then adjusting other CCD lenses according to the position of the first CCD lens, wherein each CCD lens is sequentially aligned to the positioning point of the daughter board on the circuit board; thirdly, comparing images, connecting the CCD lens with a computer, reflecting the images on a display, observing the position of a positioning point below the CCD lens on the display, checking whether the transplanted daughter board and the original intact daughter board are horizontally and vertically aligned, and determining the position and the precision of the transplanted daughter board; fourthly, classifying and arranging, namely classifying and arranging the circuit boards which meet the precision and position requirements after comparison; classifying and reworking the circuit boards which do not meet the requirements of precision and position; and classifying the suspected circuit boards and then retesting the circuit boards.
2. A method for comparing circuit boards according to claim 1, wherein: in the second step, the number of the CCD lenses is four, and the CCD lenses are arranged at the upper end of the table board.
3. A method for comparing circuit boards according to claim 1, wherein: in the second step, the number of the CCD lenses is six, and the CCD lenses are arranged at the upper end of the table board.
4. A method for comparing circuit boards according to claim 1, wherein: in the second step, the number of the CCD lenses is eight, four are arranged at the upper end of the table board, and four are arranged at the lower end of the table board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711408162.9A CN108174530B (en) | 2017-12-22 | 2017-12-22 | Circuit board comparison method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711408162.9A CN108174530B (en) | 2017-12-22 | 2017-12-22 | Circuit board comparison method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108174530A CN108174530A (en) | 2018-06-15 |
| CN108174530B true CN108174530B (en) | 2020-12-18 |
Family
ID=62523716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711408162.9A Expired - Fee Related CN108174530B (en) | 2017-12-22 | 2017-12-22 | Circuit board comparison method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108174530B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201039596Y (en) * | 2007-04-20 | 2008-03-19 | 源台精密科技股份有限公司 | Migration location device for printed circuit board |
| TW200841782A (en) * | 2007-04-04 | 2008-10-16 | Unimicron Technology Corp | Apparatus for transplanting multi-circuit boards |
| CN201332544Y (en) * | 2008-12-30 | 2009-10-21 | 廖宗毅 | Automatic alignment system for circuit board implantation |
| CN101662928A (en) * | 2009-09-14 | 2010-03-03 | 邓智军 | Circuit board framing device and drilling and milling device with image framing |
| CN103517575A (en) * | 2013-07-24 | 2014-01-15 | 昆山荣迈电子有限公司 | Method for transplant grafting of printed circuit board |
| CN105704944A (en) * | 2015-12-01 | 2016-06-22 | 淮安自然兴电子有限公司 | Circuit board transplantation double-sided automatic alignment device |
| CN106714465A (en) * | 2017-01-10 | 2017-05-24 | 昆山铭驰自动化科技有限公司 | Visual inspection-based PCB board automatic splicing method |
-
2017
- 2017-12-22 CN CN201711408162.9A patent/CN108174530B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200841782A (en) * | 2007-04-04 | 2008-10-16 | Unimicron Technology Corp | Apparatus for transplanting multi-circuit boards |
| CN201039596Y (en) * | 2007-04-20 | 2008-03-19 | 源台精密科技股份有限公司 | Migration location device for printed circuit board |
| CN201332544Y (en) * | 2008-12-30 | 2009-10-21 | 廖宗毅 | Automatic alignment system for circuit board implantation |
| CN101662928A (en) * | 2009-09-14 | 2010-03-03 | 邓智军 | Circuit board framing device and drilling and milling device with image framing |
| CN103517575A (en) * | 2013-07-24 | 2014-01-15 | 昆山荣迈电子有限公司 | Method for transplant grafting of printed circuit board |
| CN105704944A (en) * | 2015-12-01 | 2016-06-22 | 淮安自然兴电子有限公司 | Circuit board transplantation double-sided automatic alignment device |
| CN106714465A (en) * | 2017-01-10 | 2017-05-24 | 昆山铭驰自动化科技有限公司 | Visual inspection-based PCB board automatic splicing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108174530A (en) | 2018-06-15 |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201218 |