CN103308522A

CN103308522A - Automatic camera chip module wire bonding quality tester

Info

Publication number: CN103308522A
Application number: CN201210348861XA
Authority: CN
Inventors: 赵盾
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-03-16
Filing date: 2012-09-19
Publication date: 2013-09-18
Also published as: CN103324380A

Abstract

Signal connection between a camera chip and a substrate generally depends on a fine metal bonding wire, namely wire bonding. The wire bonding quality detection depends on manual observation, the efficiency is low, and the accuracy is low at present. The chip module wire bonding photos are obtained by employing a camera microscope and are analyzed through a computer, the wire bonding number, position and other information are extracted, and when the information is compared with a wire bonding standard configuration file, the wire bonding quality problems such as wrong wire bonding, leaked wire bonding and wire collision, quality defects on the chip surface, such as corner collapse, dust and the like, and quality problems of possible attached capacitors and other auxiliary chips are discovered.

Description

A kind of camera chip module group routing quality automatic test machine

Technical field

The present invention relates to the automatic test of the routing quality of the chip (IC) of camera module (camera module) and the metal wire that substrate (substrate) electrical interconnection is used.

Background technology

Preparation during semiconductor devices the basic fundamental that integrated circuit (IC) chip and substrate is interconnected be what is called " nation is fixed " (wire bonding), use exactly thin end points melting wiry, be soldered to and be fixed on the aluminium pad on the chip surface on the substrate, again this tinsel other end is welded on the gold plated copper sheets electrode on the substrate plate.In this " routing " process, often want at least " nation is fixed " tens this lines on each chip module, and have thousands of this modules or assembly to produce on the streamline.The camera chip surface is with sensor, and it is high more than common IC nation provisioning request to the fixed quality requirements of nation.The camera chip module is behind routing procedure at present, generally all be to check the routing quality by operator with the instrument microscopic visual measurement, because the asthenopic restriction of people, usually can only check out obvious defective products, but be difficult to check out and answer the bad quality problems such as no marking line that cause of technique.The routing yield of industry is 93%～98% at present.

Summary of the invention

For the quality checking of " nation is fixed " routing rely at present be human eye at the observation and inspection of microscopically, become the bottleneck that improves yield rate and quality.For this technical matters, the present invention has adopted robotization quality tester as described below to the quality of the routing of a large amount of camera chip modules that adopt in mobile phone and the digital camera, owing to having realized robotization, obviously improve for detection efficiency and the accuracy of " nation is fixed " quality.

The present invention is a kind of automatic test machine of the routing quality for the camera chip module, comprise (1) control box (2) test board, (2) computing machine of connection control box, (3) keyboard of input service instruction, (4) photographic microscope of picked-up chip module routing image, the display of (5) Display control computer analysis result.Computer test stand, the photographic microscope on the mobile console obtains target image by photographic microscope, and the Computer Analysis image shows the analysis result of target at display.

Economic results in society for this invention: as long as the operator picks and places material and logging test results, reduced manpower requirement, reduced the pollution source of dust free room, thereby realized high quality and low cost production.

The detection of the routing of the present invention in using the camera chip module, also can use in the detection of integrated circuit package " nation is fixed " (wire bonding) quality of other similar kinds.

Description of drawings

Accompanying drawing is a kind of camera chip module group routing quality automatic test machine overall block-diagram

Embodiment

The assembling of equipment:

Computing machine connects upper keyboard, display, photographic microscope, control box.X-axis and the y-axis motor of control box connecting test platform.

The debugging of equipment:

Photographic microscope is fixed on the load bearing arm of X-axis;

Operation computer testing software;

According to what obtain on computers, from the photo of photographic microscope, regulate microscopical height, focal length is until obtain clearly metal wire picture.

The details of all parts:

Test board:

Comprise (1) base, the y-axis motor that (2) are mounted thereon, the X-axis motor (5) on X-axis beam (4) the X-axis beam that (3) y-axis motor drives is by the photographic microscope along the directions X translation of X-axis driven by motor.

The method of the photographic microscope on the mobile test bench:

Send X-axis and y-axis motor movement instruction by computing machine through control box, finally drive photographic microscope and move to assigned address.

Computer program obtains the method for the photo of module to photographic microscope:

Computer constantly reads in the image from photographic microscope output, and after confirming that motor action is complete, the next picture constantly of intercepting is kept in the computing machine with the bmp form.

Routing standard configuration file content:

Arranging of module plate (carrying a carrier of a plurality of camera chip modules) upper mould piece: laterally, vertically what are individual respectively, and mutual spacing how much, and how many wires each module has, the mutual alignment relation data between metal wire.This content can be that manual input obtains according to target camera chip module CAD drawing.

Computer program is analyzed photo, extracts module metal wire radical in the target photo, and the method for the position relationship that metal wire is mutual is as follows:

(1) according to the color of each pixel in the target module photo, extracts the pixel of all metallochromes (gold thread is golden, and aluminum steel is silver color);

(2) classify used criteria for classification according to the coordinate of metallochrome pixel: whether adjacent between pixel;

(3) after the classification, obtain the number of neighbor set---the radical of metal wire on the target;

(4) according to the coordinate relation of pixel in each neighbor set, obtain the length of metal wire, the information such as shape;

(5) according to neighbor be integrated on the target photo about, left and right sides position relationship ordering;

(6) coordinate distance between the set of calculating " vicinity " neighbor;

(7) with the coordinate distance between the set of " vicinity " neighbor in the target photo, and the coordinate distance between the set of " vicinity " neighbor in the configuration file, carry out difference and calculate, obtain the metal wire location similarity;

(8) basis and result after standard is compared, filter because the metallochrome coordinate of the vacation that various random causes are introduced and the metallochrome coordinate of inferring some omission (such as broad-spectrum " corrosion " in processing with image, " expansion " operation just can well be removed near the metallochrome pixel burr the metal wire and recover originally to be faint in color on the metal wire, is not the pixel of metallochrome)

(9) repeating step (1) ~ (8) are until result's enough similar (consistent such as radical, shape no longer changes, and position relationship no longer changes) of twice before and after in (8) step;

(10) compare (whether equate such as the metal wire radical, whether the welding position is offset metal wire) according to final metallochrome pixel set feature and the characteristic parameter in the configuration file, output test result.

The method of the defective of camera chip of finding own is:

Collapse angle or surperficial scratch such as fruit chip, the relevant position can detect the extra set of pixels that is higher than adjacent domain brightness or is lower than adjacent domain brightness so.

Find the electric capacity that the chip module surface may attach simultaneously, the method for some quality problems of other subsidiary function chip:

According to standard configuration file and current photo, calculate relevant position pixel color difference in distribution;

If record is inconsistent in this band of position pixel intensity histogram and the normative document, then certainly exist: target does not exist, perhaps sticking position skew.

Production line uses the process of this test machine:

(1), opens program;

(2), waited for 6 seconds, the system hardware initialization is complete;

(3), put test product well;

(4), operation keyboard is key up and down, and then drives the test board motor and move, and makes the photosensitive area center of test product chip surface at the center of preview region;

(5), turn on the power supply of the attached LED lamp ring of photographic microscope;

(6), regulate LED brightness, make the product brightness of image even, gold goal is clear, and is full, but the discord golden finger joins together

(7), editor and preservation configuration file;

(8), begin test by space bar, test machine is automatically controlled test board and is moved according to configuration file, takes the test product photo, analyzes photo, outputs test result;

(9), withdraw from " Esc " key in the keypad upper left corner such as need.

Automatic base process of test:

The module plate that (1) will be loaded with tested camera chip module is placed on the objective table;

(2) computer program is changed the positional value of the relative module plate of photographic microscope in real time according to each module coordinate in the configuration file;

(3) computer program sends move to control box according to positional value;

(4) control box control test board motor, the photographic microscope on the mobile test bench;

(5) computer program obtains the photo of module to photographic microscope;

(6) computer program is analyzed photo, extracts module metal wire radical in the target photo, the position relationship that metal wire is mutual;

(7) computer program comparison configuration file judges whether the metal wire radical of target is consistent with configuration file;

(8) computer program comparison configuration file judges whether the mutual position relationship of the metal wire of target is similar with configuration file;

(9) if target is consistent with metal wire radical in the configuration file, the mutual position relationship of metal wire is similar, output " by " to display;

(10) if the metal wire radical is inconsistent in target and the configuration file, or the mutual position relationship dissmilarity of metal wire, output " is not passed through " to display;

(11) repeat the operation of above-mentioned (1) ~ (10), realize the robotization of routing quality testing, at last with the photo deposit of all targets, for subsequent analysis and quality tracing.

Claims

1. camera chip module group routing quality automatic test machine, it is characterized in that: comprise (1) objective table (2), the computing machine of control box (2) the control control box of control objective table, (3) keyboard of input service instruction, (4) be connected to the photographic microscope of computing machine, the display of (5) Display control computer analysis result; The computer control objective table changes photographic microscope and objective table relative position, obtains target image by photographic microscope, and the Computer Analysis image shows the analysis result of target at display.

2. according to a kind of camera chip module group routing quality automatic test machine claimed in claim 1, it is characterized in that: (1) stores the routing standard configuration file of tested module in computing machine, this document content comprises: the module plate (carries a carrier of a plurality of camera chip modules, be fixed on the objective table) the arranging of upper mould piece: laterally, vertical respectively what camera modules, mutual spacing how much, how many wires each module has, the shape of metal wire and position, the mutual alignment relation data between metal wire; (2) Computer Processing is from the target module photo of photographic microscope, the shape of module metal wire radical, metal wire and position, the mutual position relationship data of metal wire in the extraction photo, compare with the data of routing standard configuration file, differentiate the quality of chip module routing, unusual such as the metal wire bank, the no marking line, metal wire hangs together mutually.

3. according to a kind of camera chip module group routing quality automatic test machine claimed in claim 1, it is characterized in that: by the target module photo of photographic microscope acquisition, can be by Computer Analysis, directly find some quality problems on chip module surface, for example chip collapses angle, chip surface scratch.

4. according to a kind of camera chip module group routing quality automatic test machine claimed in claim 1, it is characterized in that: by the target module photo of photographic microscope acquisition, can be by Computer Analysis, directly find the electric capacity that the chip module surface may attach simultaneously, some quality problems of other subsidiary function chip, such as the no existence of target, whether sticking position is offset.