JP2016070725A - Inspection system and method for circuit board, etc., and program - Google Patents

Abstract

PURPOSE: To enable the inspection of a plurality of items to be performed efficiently.CONSTITUTION: A wiring inspection machine 11, a GP inspection machine 12, and a reverse side inspection machine 13 for performing different inspections, and further a review machine 18 are provided. In the inspection machines 11, 12, 13, inspection is performed automatically while successively conveying an object 40 to be inspected. The results of these inspections are given to the review machine 18. In the review machine 18, an operator checks a microscopic image and visually inspects its appearance with regard to the defect candidate portions detected by each inspection machine. If one piece 43 contains even a single defect that is determined to be bad, the piece 43 is regarded as wrong, without reviewing the other defect candidates of the piece.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an inspection system and method for a substrate and the like, and a computer program for controlling a computer of a review apparatus included in the inspection system. The substrate refers to a substrate provided with wiring, electrodes, solder, etc., such as a flexure substrate (product), an electric or electronic circuit substrate, and the substrate itself may be not only an insulator but also a semiconductor or a conductor. Substrates and the like include processed products that require multi-face appearance inspection other than the above-described substrates.

  There is a system disclosed in Patent Document 1 as an appearance inspection system for this type of processed product. This inspection system captures an image of a processed product at a first location, extracts a defect candidate location, and transfers image data of the defect candidate location to one or more work locations away from the first location. Based on the transferred defect candidate location image data, the operator determines whether the location is a defect location, returns the determination result to the first location again, and performs the final sorting process at the first location. That's it.

JP 2004-198265 A

  This appearance inspection system is characterized in that image data of a defect candidate location acquired at a first location is transferred to a location away from the location, and an operator makes a determination based on the transferred image data. . Therefore, the operator's determination is based only on the transferred image data. Judgment work can be performed at one or more locations away from the first location, so it is efficient, but it is not based on actual inspection objects, so it is not always sufficient when there are many inspection items. Can not.

  As for the substrate to be inspected, there are many inspection items such as a wiring portion, an electrode portion, a solder portion, a back surface, and it is difficult to efficiently automate.

  An object of the present invention is to automate the inspection of a plurality of items.

  Another object of the present invention is to enable efficient inspection of a plurality of items.

  A further object of the present invention is to make a pass / fail judgment based on an actual inspection object.

  The inspection system according to the present invention includes a plurality of inspection apparatuses that perform different inspections on one inspection object, and at least one review apparatus.

  The review device includes: input means for inputting inspection result data from the plurality of inspection devices; review means for recording a review result of defect candidates indicated by inspection result data for each inspection object; and the review means. Control means is provided for controlling to skip the review of other defect candidates indicated by the inspection result data for the inspection target when recording the review result indicating that the inspection target is not possible for one inspection target.

  Each inspection is performed by a plurality of inspection devices that inspect different items, and each inspection device is a device dedicated to each item inspection, so efficient inspection is possible. Preferably, each inspection device is preferably an automated device.

  Since the final pass / fail judgment is performed by the review device, each inspection device is sufficient if it has the ability to find defect candidates, and a relatively simple inspection device is sufficient, and each inspection can be performed at high speed.

  Since the review device only needs to review only the locations determined by the inspection devices as defect candidates, this is also efficient. Preferably, since the worker (operator) visually inspects the appearance, the accuracy is high and an accurate inspection can be expected. Then, when there are a plurality of defect candidates pointed out for one inspection object, when it is determined that the one defect candidate is defective, the other defect candidates are not requested to be determined, and the inspection object at that time is determined. Since it is determined to be defective, it is possible to perform an efficient review without performing a useless review.

  Here, one inspection object is a unit in which it is allowed to determine that the whole is defective, and is not necessarily the entire object carried into the inspection apparatus. There may be a case where a large number of inspection objects as a unit are collected to constitute one inspection object (see an example described later).

  In one embodiment, the review device further includes an integration unit that collects the inspection result data of the plurality of inspection devices input by the input unit for each inspection target.

  In a preferred embodiment, when the review of the defect candidate is skipped, the review means records all the review results of the defect candidate indicated by the inspection result data to be inspected as being impossible.

  In another embodiment, the review means has operation means for inputting a review result.

  In still another embodiment, each inspection apparatus includes an output unit that outputs inspection result data.

  In one embodiment, the inspection result data output from the plurality of inspection devices includes data for specifying an inspection object, and data indicating the position of the location when the inspection result indicates a defect candidate; including.

  In a preferred embodiment, the reviewing means has grouping means for grouping the inspection candidates in which the position of the defect candidate indicated by the inspection result data falls within the review visual field. This enables efficient review of grouped items.

  In one embodiment, the input means is a communication means.

  In a preferred embodiment, the review unit includes an imaging unit that captures an enlarged image of a defect candidate to be inspected, a display unit that displays an image captured by the imaging unit, and an operation unit that inputs a review result. .

  The operator can make a determination with high accuracy, for example, by visually observing the displayed magnified image with a microscope.

  In the inspection method for a substrate or the like according to the present invention, inspection result data output from a plurality of inspection apparatuses that perform different inspections for one inspection object is input to the review apparatus, and the inspection apparatus uses the inspection result data for each inspection object. The review result of the indicated defect candidate is recorded. At this time, when the review result indicating that the inspection target is not possible is recorded, the review of other defect candidates indicated by the inspection result data for the inspection target is skipped. To do.

  The program for controlling the computer of the review apparatus according to the present invention inputs inspection result data output from a plurality of inspection apparatuses that perform different inspections for one inspection object, and the defect indicated by the inspection result data for each inspection object. Record the review results of the candidates, and in this case, when recording the review results to the effect that one inspection object is not possible, skip the review of other defect candidates indicated in the inspection result data for that inspection object. The computer of the review device is controlled.

  The present invention also provides a computer-readable recording medium storing the above program.

The overall configuration of the inspection system is shown. An outline of the configuration of each inspection machine is shown. The electrical configuration of the inspection system is shown. A sheet of a flexure substrate is shown as an example of an inspection object. The frame of a flexure substrate is shown. It is an enlarged view of the part shown by A of FIG. It is an expanded sectional view which follows the VII-VII line of FIG. It is an enlarged view of the part shown by B of FIG. It is a flowchart which shows operation | movement (process) of a review machine. An example of wiring inspection result data is shown. An example of GP inspection result data is shown. An example of the data of a back surface inspection result is shown. The data which integrated various test results is shown. An example of a review result is shown. An example of a review result is shown. An example of a review result is shown.

  FIG. 1 shows the configuration of the entire inspection system.

  There are several inspection items for inspection of inspection objects (substrates, etc.), and for each inspection item, a separate inspection device dedicated to the inspection of that item is prepared. In this embodiment, they are an automatic inspection device for the wiring part (hereinafter referred to as a wiring inspection machine 11), an automatic inspection device for the front surface other than wiring such as an electrode (GP) part, a solder part (hereinafter referred to as a GP inspection machine 12) This is an inspection device (hereinafter referred to as back surface inspection machine 13). Specific contents of each inspection will be described later.

  The inspection object 40 is stored in the pre-inspection work box 14 (inspection object mounting place). An automatic transfer machine (automatic transfer device) 16 is arranged, and the inspection object 40 in the pre-inspection work box 14 is first transferred to the wiring inspection machine 11 and placed on the stage. When the inspection in the wiring inspection machine 11 is completed, the automatic transfer machine 16 carries the inspection object 40 in the wiring inspection machine 11 to the GP inspection machine 12 and places it on the stage. During this time, the next inspection object is taken out from the pre-inspection work box 14 and transported to the wiring inspection machine 11, where the next inspection object is inspected by the wiring inspection machine 11. When the inspection by the GP inspection machine 12 is completed, the inspection object 40 is transferred from the GP inspection machine 12 to the back surface inspection machine 13 by the automatic transfer machine 16 and placed on the stage. It goes without saying that the next inspection object 40 that has been inspected by the wiring inspection machine 11 is sent to the GP inspection machine 12. The inspection object 40 that has been inspected by the back surface inspection machine 13 is transferred to the post-inspection work box 15 (inspection object placement place) by the automatic transfer machine 16 and stored.

  In this way, the inspection object 40 is sequentially transported from the pre-inspection work box 14 to the wiring inspection machine 11, the GP inspection machine 12, and the back surface inspection machine 13, where each inspection machine 11, 12, 13 is inspected. , And finally, it is stored in the work box 15 after the inspection. The automatic transport machine 16 has an arm having a plurality of vacuum cups, for example, and sucks and transports the inspection object 40. Such individual inspection machines 11 to 13 may be provided one by one or a plurality of individual inspection machines. Further, it is not always necessary to arrange them in a line as shown.

  The inspection system also includes one or more review devices (review machine 18). Each of the inspection machines 11 to 13 basically performs the respective inspections automatically and finds a defect candidate location. The review machine 18 is basically an operator (operator) inspecting the defect candidate locations found by each of the inspection machines 11 to 13, for example, visual inspection using a microscope, or as an inspection object. By touching directly, the quality is finally judged. Of course, the review machine 18 may automate all or part of the inspection. The inspection object 40 determined to have a defect candidate portion by at least one of the inspection machines 11 to 13 is transported from the post-inspection work box 40 to the review machine 18 and finally inspected one by one. The post-inspection work box is preferably stored separately for those that require review by the review machine 18 and those that do not.

  The review machine 18 is preferably arranged near the inspection machines 11 to 13, but may be located far away in some cases. In any case, after the individual inspection by the inspection machines 11 to 13, the inspection by the review machine 18 can be performed at any time regardless of the operation of the inspection machines 11 to 13 (asynchronously). If the review by the review machine 18 can be performed with images taken by the inspection machines 11 to 13, the inspection object need not be conveyed to the review machine 18.

  The inspection items corresponding to the plurality of dedicated inspection machines 11 to 13 are individually and automatically inspected, so that the inspection speed can be increased. About what the inspection machines 11-13 determined as a defect candidate, since it inspects precisely by the 1 or several review machine 18, a highly accurate inspection result can be obtained.

  FIG. 2 shows a configuration example of each of the inspection machines 11-13.

  Each inspection machine 11 to 13 includes an XY stage 38. The XY stage 38 has a horizontal mounting surface, is held so as to be movable in the XY direction within a horizontal plane, and is positioned at an arbitrary position in the XY direction by a drive control device (not shown). The XY stage 38 may be movable in the Z direction (vertical direction).

  An imaging device 30 is disposed above the XY stage 38. The imaging device 30 includes an optical system 32 and an electronic camera 31. The optical system 32 is provided with a zoom mechanism as necessary. The camera 31 is a line sensor in this embodiment. Of course, a two-dimensional image sensor may be used. The imaging device 30 can be moved in the XYZ three-dimensional directions by a robot (not shown).

  The illumination device 33 is provided below the imaging device 30 and above the stage 38, is fixed integrally with the imaging device 30, and moves three-dimensionally together with the imaging device 30 by the robot. As the illumination device 33, a coaxial epi-illumination device, a ring illumination device 34, a bar illumination device, or the like, which is optimal for the inspection object, inspection method, etc., is used.

  When the inspection object 40 is placed on the stage 38, the imaging device 30 and the illumination device 33 are positioned by robot operation (height, horizontal position), and then the XY stage 38 is moved to detect the inspection object from the camera 31. A line scan image signal of the object 40 is output and provided to the inspection processing device 35. The inspection processing device 35 is configured by, for example, a computer (PC), and inspects whether there is a portion that is supposed to be a defect in the inspection object by analyzing the image captured by the imaging device 31. For example, a standard image of the standard appearance shape of the inspection object part of the inspection object is prepared. By comparing the image obtained by photographing with the standard image, a defect candidate (which should be inspected precisely by the review machine 18). Find part).

  The review machine 18 is basically the same as the configuration shown in FIG. 2, but preferably includes a microscope as the optical system 32. Further, the inspection processing device 35 of the review machine 18 is provided with a display device and an operation device. An enlarged image (microscope image) of a defect candidate portion of an inspection object determined to have a defect candidate by any of the inspection machines 11 to 13 is captured by the camera 31, and the image is displayed on the display device. The operator looks at this display image, makes a final pass / fail judgment on the defect candidate, and inputs the judgment result from the operating device. The movement of the stage 38 is also controlled by the inspection processing device 35.

  FIG. 3 shows the electrical connection relationship between the inspection machines 11 to 13 and the review machine 18 described above.

  Each inspection machine 11, 12, 13 is connected to a data server 21 for wiring inspection machine, a data server 22 for GP inspection machine, and a data server 23 for back side inspection machine, and each inspection machine 11, 12, 13 carried out Data indicating the inspection result of each inspection is sent to the corresponding data servers 21, 22, and 23 and stored there. The review machine 18 is connected to each inspection machine server 21, 22, 23 through a network including a hub 25. When each review machine 18 performs a review, each review machine 18 reads inspection result data from each server 21, 22, 23.

  FIG. 4 shows a flexure product as an example of an inspection object.

  The whole flexure product 40 shown in FIG. 4 is a sheet. The sheet is given an identification number (such as sheet No. 1). In this embodiment, the seat 40 is composed of nine frames 41. The frame 41 is connected by a frame body. The vertical arrangement of the frames 41 is called a line, and is in the order of line 1, line 2, line 3 from the right side of FIG. Each frame 41 is also numbered, and in line 1, frame 1, frame 2, frame 3, line 2 from below, frame 4, frame 5, frame 6, frame 6, line 3 from bottom, frame 7, frame 8, Frame 9. The lower left corner of the sheet 40 is the origin of the XY coordinates. The position of the defective portion determined by each of the inspection machines 11 to 13 is represented by the XY coordinates.

  FIG. 5 shows an enlarged view of one frame 41, and a large number of flexure substrates (pieces) 43 are connected by a frame body 44. Each piece 43 is also given an identification number.

  6 is an enlarged view of a range indicated by a chain line A in FIG. 5, and FIG. 7 is a cross-sectional view taken along the line VII-VII in FIG. The substrate 50 of the flexure substrate piece 43 is a metal, for example, stainless steel. An insulating film (layer), for example, a synthetic resin layer 51 such as polyimide is formed on the substrate 50, and metal (for example, copper) wirings 52, 53, and 54 are formed thereon. A protective film made of synthetic resin is formed on the wirings 52, 53, and 54 as necessary. A part (GP: Ground Pad) 55 is electrically connected to the substrate 50 in a part of the wiring 54. That is, a part of the wiring 54 is formed in a circular shape, a hole reaching the substrate 50 through the insulating layer 51 is opened in the center, and a pad 55 is formed by embedding a metal such as nickel in the hole. Has been. Another wiring 52 has a portion where GP is to be formed, but a pad is not formed here (not plated). This is a defect called GP-less, and is indicated by the symbol G20 in FIGS.

  FIG. 8 is an enlarged view of a range indicated by a chain line B in FIG. 5, and a wiring 61 is formed on a flexure substrate (piece) 43 in the same manner as described above, and an electrode 62 is provided at the end thereof. A wire is connected and fixed to the electrode 62 by solder (both not shown).

  The above-described wiring inspection machine 11 inspects the wirings 52, 53, 54, 61, etc. on the flexure substrate piece 43, detects short-circuiting of the wiring, disconnection, lack of wiring, and the like as defect candidates. And The flexure substrate piece 43 is an inspection target.

  The GP inspection machine 12 inspects the presence / absence of the GP, chipping of the GP, defective solder (short, chipping, height of solder) and the like, and if there is an abnormality, it is determined as a defect candidate.

  The back surface inspection machine 13 inspects the surface (back surface) of the flexure substrate (piece) 43 where the wiring pattern (wirings 52, 53, 54, 61, etc.) of the substrate 50 is not formed. Edge defects, dirt (attachment of dust, etc.), scratches, and the like are detected as defect candidates.

  FIG. 9 is a flowchart showing the operation controlled by the inspection processing device 35 of the review machine 18. Prior to the description of the operation of the review machine 18, the data indicating the inspection result obtained from each of the inspection machines 11, 12, 13 is shown. explain.

  FIG. 10 shows an example of wiring inspection result data for the inspection object of sheet NO. 1 output from the wiring inspection machine 11. This inspection result data is about the detected defect candidate. The defect ID (W153) identifies a defect candidate. The defect group is determined by the review machine 18, and a default value is still entered here. The object specifies a piece 43 of an inspection object having a defect candidate indicated by a defect ID, and a line number, a frame number, and a piece number are described. The determination is also determined (input) by the review machine 18, and a default value is entered here. The type of defect simply indicates what kind of defect the defect candidate is. The position indicates the position where the defect candidate exists in the above-described X and Y coordinates, and the unit is μm (micron). The defect image number is a file name of an image taken by the camera 31 of the inspection machine 11 for the defect candidate.

  FIG. 11 shows an example of GP inspection result data obtained from the GP inspection machine 12 in the same manner. Each item is the same as that shown in FIG. The defect ID is G20 (see FIGS. 6 and 7), and the defect type is GP-free.

  FIG. 12 shows an example of back surface inspection result data output from the back surface inspection machine 13. Each item is the same as that shown in FIG. The defect ID is S-121 and the defect type is missing.

  In FIG. 9, the review machine 18 obtains the inspection result data created by each of the inspection machines 11, 12, and 13 as shown in FIGS. 10 to 12 from their servers 21, 22, and 23, and stores them in the storage device. In FIG. 13, the inspection result data of each inspection machine is integrated as shown in FIG. 13 (S11). That is, data of the same line, the same frame, and the same piece are arranged. You may arrange in the order of the position of a defect candidate (The order of X coordinate, the order of Y coordinate, the order of the thing with the short distance between positions, etc.). As described above, the review machine 18 includes a microscope. If multiple defect candidates fall within the field of view of the microscope, the operator can observe the multiple defect candidates at once through the microscope. Grouping is a grouping of defect candidates that fall within one field of view of the microscope. The grouping is represented by the same defect group number. In FIG. 13, the defect group numbers of the three defect candidates shown in FIG. 13 are different in 1, 2, and 3, so they belong to different groups (in this example, there are no grouped defect candidates).

  When such data integration is completed, a microscopic image of defect candidates from the first one is displayed on the display screen of the display device of the review machine 18 (S12). That is, the inspection object of sheet No. 1 is placed on the stage 38 of the review machine 18 by an operator or a transfer machine, and the stage 38 moves based on the position data in the integrated data, and the first defect The candidate is positioned within the field of view of the microscope. The operator (operator) visually checks the displayed defect candidate image, makes a final determination of good (OK) or defective (NG), and the result is an operation device (touch box, keyboard, mouse on the display screen). Etc.) (S13). When OK is input, as shown in FIG. 14 (review result), in the integrated data (FIG. 12) described above, the OK determination result is recorded for the corresponding defect candidate, and the defect candidate to be reviewed. (S15), the next defect candidate is positioned in the field of view of the microscope by moving the stage 38, the microscope image is displayed on the display device (S12), and the review continues.

  When the determination result (input result) by the worker is NG, NG is recorded in the determination of the corresponding defect candidate as shown in FIG. 15 (S13). If one piece (flexure substrate) 43 is determined to be defective, the piece is regarded as NG (defective) as a whole, and other defect candidates in the piece are considered. Without waiting for the judgment input by the worker (without moving the stage, that is, without moving the stage 38 so that the next defect candidate location is within the field of view of the microscope), as shown in FIG. All NG judgment results are automatically written. That is, processing such as stage movement, microscope image acquisition, display, and determination input related to defect candidates in the same piece is skipped (S14), and the process proceeds to defect candidate processing of the next piece. The stage 38 is moved, positioned, imaged, and displayed so that the defect candidate falls within the field of view of the microscope (S15). In this way, work time in the review machine can be saved and efficiency can be increased.

  FIG. 15 and FIG. 16 are shown separately in order to make it easy to understand the processing skip (S14) as a change in the data, but the processing will be in the state shown in FIG. 16 without going through the state of FIG. .

  When the review of all defect candidates for one inspection object (sheet) is completed, a review result file is completed (S16), and the process in the review machine is completed. Of course, review results during the process may be stored in a buffer, and a review result file may be created last.

  In the above-described embodiment, the operator (operator) performs all the determinations in the review machine and inputs the determination results. However, there may be an automatic determination in the review machine.

11 Wiring inspection machine (inspection equipment)
12 GP inspection machine (inspection equipment)
13 Back side inspection machine (inspection equipment)
18 Review machine (review equipment)
30 Imaging device
35 Inspection processing equipment
38 stages
40 Inspection object
41 frames
43 Flexure substrate (piece) (subject to inspection)
50 substrates
52, 53, 54, 61 Wiring
55 pads
62 electrodes

Claims (13)

It has multiple inspection devices that perform different inspections on one inspection object, and at least one review device.
The review device
Input means for inputting inspection result data from the plurality of inspection devices;
Review means for recording the review results of defect candidates indicated by the inspection result data for each inspection object, and inspection result data for the inspection object when the review means records a review result indicating that one inspection object is not possible Control means for controlling to skip the review of other defect candidates indicated by
An inspection system for substrates, etc.   The inspection system for a substrate or the like according to claim 1, wherein the review device further includes an integration unit that collects inspection result data from a plurality of inspection devices input by the input unit for each inspection target.   3. The inspection system for a substrate or the like according to claim 1, wherein when the review of the defect candidate is skipped, the review means records all the defect candidate review results indicated by the inspection result data to be inspected as being impossible. .   The inspection system for a substrate or the like according to any one of claims 1 to 3, wherein the review unit includes an operation unit for inputting a review result.   Each said inspection apparatus is provided with the output means which outputs inspection result data, The inspection system of the board | substrate etc. as described in any one of Claim 1 to 4.   The inspection result data output from the plurality of inspection apparatuses includes data for specifying an inspection target and data indicating the position of the location when the inspection result indicates that the inspection candidate is a defect candidate. An inspection system for a substrate or the like according to any one of 1 to 5.   7. The review unit according to claim 1, further comprising a grouping unit that groups, with respect to one inspection object, a defect candidate indicated by the inspection result data within a review field of view. Inspection system for printed circuit boards.   2. The substrate inspection system according to claim 1, wherein the input unit is a communication unit.   6. The substrate inspection system according to claim 5, wherein the output means is a communication means. The review means
An imaging means for capturing an enlarged image of a defect candidate to be inspected;
Display means for displaying an image picked up by the image pickup means;
An operation means for inputting the review result,
An inspection system for a substrate or the like according to claim 1. The inspection result data output from multiple inspection devices that perform different inspections on one inspection object is input to the review device,
In the review device, the review result of the defect candidate indicated by the inspection result data is recorded for each inspection object, and at this time, when the review result indicating that the inspection object is not possible is recorded, the inspection result data for the inspection object Skip review of other defect candidates indicated in
Inspection method for substrates. Input inspection result data output from multiple inspection devices that perform different inspections for one inspection object,
For each inspection object, the review result of the defect candidate indicated by the inspection result data is recorded. At this time, when the review result indicating that one inspection object is not possible is recorded, the inspection result data for the inspection object is indicated. A program that controls the computer of the review device so that the review of other defect candidates is skipped.   13. A computer-readable recording medium storing the program according to claim 12.

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