KR102358840B1 - Integrated inspection apparatus of board - Google Patents

Abstract

The present invention relates to an integrated board inspection apparatus for automatically performing double-sided inspection of a printed circuit board (PCB) and re-inspection of an area expected to be defective.
For this purpose, the integrated board inspection apparatus of the present invention is a board integrated inspection apparatus for inspecting both sides of a substrate by installing a plurality of inspection units on the upper part of the body, and is installed along the first axial direction and transports the substrate along the first axial direction. The first transfer unit, installed along a second axial direction orthogonal to the first axis, a first scan inspection unit for inspecting the upper surface of the substrate, is installed along a second axial direction parallel to the first scan inspection unit, and a first scan inspection unit Based on the inspection result of A second scan inspection unit installed along a second axis direction orthogonal to the axis and inspecting the lower surface of the substrate transferred from the reverse transfer unit, is installed along the second axis direction in parallel to the second scan inspection unit, the second scan inspection unit Based on the inspection result, a second region of interest inspection unit for inspecting an expected defective region on the lower surface of the substrate, and a second transfer unit installed along the first axial direction and transporting the substrate between the second scan inspection unit and the second region of interest inspection unit includes

Description

Board integrated inspection device {INTEGRATED INSPECTION APPARATUS OF BOARD}

The present invention relates to a printed circuit board inspection apparatus, and more particularly, to a board integrated inspection apparatus for automatically performing double-sided inspection of a printed circuit board (PCB) and re-inspection of an area expected to be defective. will be.

With the development of semiconductor technology, the width of semiconductor wiring has been reduced to a nano level, and the wiring width of a printed circuit board (PCB) on which a semiconductor is mounted is further reduced.

In addition, as the number of semiconductor pins increases due to the expansion of various functions in the semiconductor, it is very important to clearly inspect the normal/failure of the semiconductor PCB to improve the reliability of the entire system including the semiconductor.

In general, when PCB manufacturing is completed, the printed circuit pattern is inspected after undergoing a cleaning process using CO ₂ , etc., and the inspection-completed substrate is classified into good and defective products according to whether or not it is defective, and then laser marking on good products process will be performed.

This PCB inspection is done through vision inspection, and after inspecting the PCB with a line scan camera, the inspector visually re-inspects the PCB that is expected to be defective.

However, the visual inspection has disadvantages in that the inspection time is long and manpower is consumed because the inspector has to individually determine the location of the defect and the reason for the defect.

Accordingly, there is a case where equipment for re-inspecting the PCB, which is expected to be defective, is installed separately, but in this case, a lot of space is required for equipment installation, As the PCB transport distance increases, the PCB transport time takes longer, which increases the inspection time.

On the other hand, when circuit patterns, etc. are formed on both sides of the PCB, inspection must be performed on both sides.

However, the method of inspecting both sides of the PCB alternately has a disadvantage in that it takes a long time to transport and inspect the PCB.

Accordingly, there has been proposed a technology for simultaneously performing inspection by installing a camera for photographing the upper surface of the PCB and a camera for photographing the lower surface of the inspection equipment. There were downsides.

As another method, after inspecting the upper surface of the PCB on the same inspection line, a technique of inverting the PCB inspection surface to inspect the lower surface has been proposed.

However, in this case, for the inspection of the lower surface of the substrate on which the upper surface inspection has been completed, there is a method in which an inspector inverts the substrate by hand or inverts the substrate by using a reversing device, but the inversion device has a complicated disadvantage.

Korea Patent No. 1777547 "Semiconductor pcb inspection equipment and inspection method" Korean Patent No. 1796550 "Automatic inspection device for printed circuit boards" Korean Patent No. 1751394 "Printed Circuit Board Inspection Apparatus and Method"

It is an object of the present invention to solve the disadvantages of the background art by arranging a plurality of cameras for inspecting the upper and lower surfaces of the substrate, a camera for performing re-inspection of the expected defective area, and a substrate reversing means in parallel in a single equipment to arrange the upper surface of the substrate An object of the present invention is to provide an integrated board inspection apparatus capable of reducing board transfer time and reducing the space required for an inspection equipment installation line by continuously performing inspection on a single piece of equipment.

In addition, the present invention is to provide an integrated board inspection apparatus that can simplify the device configuration of the inverting means for the inspection of the lower surface of the substrate that has been inspected for the upper surface.

The integrated board inspection apparatus of the present invention for solving the problem is a board integrated inspection apparatus for inspecting both sides of a substrate by installing a plurality of inspection units on the upper part of the body, and is installed along the first axial direction, A first transfer unit for transporting along, installed along a second axial direction orthogonal to the first axis, a first scan inspection unit for inspecting the upper surface of the substrate, is installed along a second axial direction parallel to the first scan inspection unit, A first region of interest inspection unit that inspects an expected defective region among the upper surface of the substrate transferred from the first transfer unit based on the inspection result of the 1-scan inspection unit, a reverse transfer unit that inverts the substrate inspected by the first region of interest inspection unit and transfers it to the rear end , installed along a second axis direction orthogonal to the first axis, a second scan inspection unit for inspecting the lower surface of the substrate transferred from the reverse transfer unit, is installed along the second axis direction in parallel to the second scan inspection unit, the second Based on the inspection result of the scan inspection unit, the second region of interest inspection unit for inspecting the predicted defective region on the lower surface of the substrate and the second region of interest inspection unit installed along the first axial direction, and transferring the substrate between the second scan inspection unit and the second region of interest inspection unit and a second transfer unit.

In this case, the first and second scan inspection units include a plurality of line scan cameras, and each line scan camera may photograph the substrate at different positions so that a partial region of the captured image overlaps.

In addition, the first transfer unit may include a buffer stage for temporarily loading the substrate when the transfer speed of the substrate in the front end is faster than the inspection speed.

In addition, the reversing transfer unit vacuum-sucks the transfer substrate and moves vertically and horizontally in the first axial direction, and is installed at the rear end of the stage and vacuum-sucks the substrate transferred through the stage and inverts the inspection surface of the substrate through rotation. do flippers

In addition, the reversing transfer unit includes a lifting means for moving the stage up and down from the lower part of the stage, and a sliding rail that allows the bracket and the bracket coupled to the lower end of the lifting means to move horizontally in the first axial direction through sliding. have.

In addition, an air cleaning device may be installed at a front end of each of the first scan inspector and the second scan inspector.

According to the present invention, the inspection efficiency and production yield can be improved by implementing the upper and lower surface inspection of the substrate and the re-inspection of the defective area as a single equipment in which the inspection unit is integrated and installed in parallel.

1 is a block diagram of an integrated board inspection apparatus according to an embodiment of the present invention.
Figure 2 is a perspective view of the configuration of the reverse transfer unit according to an embodiment of the present invention.
3 to 8 are views for explaining the operation process of the reverse transfer unit of FIG.

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram of an integrated board inspection apparatus according to an embodiment of the present invention, and relates to an apparatus for classifying a substrate to be inspected into a good product and a defective product after inspecting a cleaned substrate by a plurality of inspection units installed on the upper part of the body.

Prior to the description, in the embodiment of the present invention, it is expressed that the plurality of inspection units inspect, but the inspection processing for whether the substrate is defective is actually performed in the image processing system.

That is, the image processing system calculates whether the substrate is defective and coordinate information of the defective area based on the image captured by each inspection unit, and the controller controls each camera device and transport means based on the processing result of the image processing system do.

Referring to FIG. 1 , the integrated board inspection apparatus of the present invention includes a main body 10 , a first transfer unit 100 , a first scan inspection unit 200 , a first region of interest inspection unit 300 , a reverse transfer unit 400 , and a second It includes a two-scan inspection unit 500 , a second region of interest inspection unit 600 , and a second transfer unit 700 .

The first transfer unit 100 includes a first transfer rail 101 installed along a first axial direction, and a first stage 102 coupled to the first transfer rail 101 and holding a substrate placed on the upper surface by vacuum suction. ) and a first picker (not shown) which is installed to be reciprocally movable along the first direction from the upper side of the first transfer rail 101 and picks up and transfers the substrate.

At this time, the buffer stage 103 is installed on the first transfer rail 102 so that when the speed at which the substrate is transferred from the cleaning unit is higher than the inspection speed, the temporarily loaded state of the substrate can be maintained.

The first scan inspection unit 200 is installed along a second axis direction orthogonal to the first axis and inspects the upper surface of the substrate, and the second transfer rail 201 , the second stage 202 , and the first line scan It includes a camera 203 .

The second transfer rail 201 is installed in a second axis direction orthogonal to the first transfer rail 101 .

The second stage 202 is installed to be movable in the second axial direction along the second transfer rail 201 , and vacuum-sucks and holds the transferred substrate.

The first line scan camera 203 is mounted on the second stage 202 to scan the upper surface of the transferred substrate, and is installed above the second transfer rail 201 .

In this case, the first line scan camera 203 may be installed to be movable in the X-Y-Z axis direction to adjust the photographing magnification.

That is, according to the present invention, substrates of various sizes can be inspected by adjusting the magnification by adjusting the height and horizontal position of the camera according to the size of the substrate.

In addition, the first line scan camera 203 may be composed of a plurality of line scan cameras that photograph the substrate at different positions, and the plurality of line scan cameras may be arranged so that arbitrary regions of the captured image overlap each other. .

The first region of interest inspector 300 is installed along the second axis direction parallel to the first scan inspector 200 , and is transmitted from the first transfer unit 100 based on the inspection result of the first scan inspector 200 . This is to inspect the defect-predicted area among the upper surface of the processed substrate, and includes a third transfer rail 301 , a third stage 302 , and a first area camera 303 .

The third transfer rail 301 is installed at the rear end of the first transfer rail 101 in parallel to the second transfer rail 201 in the second axis direction.

The third stage 302 is installed to be movable in the second axial direction along the third transfer rail 301 , and when the substrate is transferred, it is vacuum-adsorbed and held.

The first area camera 303 is for re-inspecting an area expected to be defective according to the photographing result of the first line scan camera 203 among the upper surface of the substrate, and is installed above the third transfer rail 301 .

In this case, a first alignment camera 304 for photographing a fiducial mark of the substrate may be further installed at the front end of the first area camera 303 so that the region of interest of the substrate to be inspected can be accurately photographed.

In this way, when the coordinate information expected to be defective is calculated based on the fiducial mark mark photographed by the first alignment camera 304, the first area camera 303 moves in the XYZ axis direction in order to photograph the defective area. Move.

The reversing transfer unit 400 is installed at the rear end of the third transfer rail 301 in the first axial direction to invert the inspection surface of the substrate.

2 is a perspective view of the reverse transfer unit configuration according to an embodiment of the present invention, the reverse transfer unit 400 is a fourth transfer rail 401 (see FIG. 1), a fourth stage 402, a lifting means 403, a bracket 404 ), a sliding rail 405 , a flipper 406 and a second picker (not shown).

The fourth transfer rail 401 is installed between the first region of interest inspection unit 300 and the second scan inspection unit 500 .

As the lifting means 403 for vertically moving the fourth stage 402, a cylinder rod may be used, and the sliding rail 405 is for horizontally moving the fourth stage 402 connected to the bracket 404. installed in the first axial direction.

The flipper 406 rotates the substrate P seated on the fourth stage 402 by vacuum adsorption.

The second picker (not shown) moves between the first region of interest inspection unit 300 , the inversion transfer unit 400 , and the inversion transfer unit 400 and the second scan inspection unit 500 along the fourth transfer rail 401 while moving The substrate P is picked up and transferred.

According to this configuration, as shown in FIG. 3 , when the substrate is seated on the fourth stage 402 , the lifting means 403 operates to lower the fourth stage 402 as shown in FIG. 4 .

Subsequently, the bracket 404 is horizontally moved in the first axial direction along the sliding rail 405 , whereby the fourth stage 402 is positioned below the flipper 406 as shown in FIG. 5 . .

Next, as shown in FIG. 6 , the lifting means 403 operates to vertically rise until the substrate P seated on the fourth stage 402 is positioned close to the lower surface of the flipper 406 .

When the fourth stage 402 moves vertically to a desired position, the vacuum suction force is removed, and the flipper 406 picks up the substrate P on the fourth stage 402 by vacuum suction.

Next, as shown in FIG. 7 , the lifting means 403 operates to vertically lower the fourth stage 402 , and the flipper 406 rotates the lower surface of the substrate P as shown in FIG. 8 . Let's look at this upwards.

On the other hand, the second scan inspection unit 500 is installed along the second axis direction orthogonal to the first axis, and inspects the lower surface of the substrate transferred from the reverse transfer unit 400, the fifth transfer rail 501 and the second 5 stage 502 and a second line scan camera 503 .

The second region of interest inspection unit 600 is installed along a second axis direction parallel to the second scan inspection unit, and based on the inspection result of the second scan inspection unit 500, it inspects a defective predicted region among the lower surface of the substrate. , a sixth transfer rail 601 , a sixth stage 602 , and a second area camera 603 .

In this case, a second alignment camera 604 for photographing a fiducial mark of the substrate may be further installed at the front end of the second area camera 603 so that the region of interest of the substrate to be inspected can be accurately photographed.

The second transfer unit 700 is installed along the first axial direction, and serves to transfer the substrate between the second scan inspection unit 500 and the second region of interest inspection unit 600 , and includes the seventh transfer rail 701 and the second transfer rail 701 . Includes 3 pickers (not shown).

The seventh transfer rail 701 extends in the first axial direction to be perpendicular to the fourth transfer rail 501 and the fifth transfer rail 602 , and a third picker (not shown) picks up the substrate and then moves the sixth The substrate is transferred while moving on the transfer rail 701 .

Meanwhile, the seventh transfer rail 701 may be provided with a seventh stage 800 on which a good substrate is loaded among the inspected substrates and an eighth stage 900 on which a substrate determined to be defective is loaded.

In addition, the present invention additionally provides a second transfer rail 201 and a fourth transfer rail ( Cleaning apparatuses 100 may be further installed in the 501 .

An inspection method using an integrated board inspection apparatus according to an embodiment of the present invention having such a configuration will be described with reference to FIGS. 1 to 9 .

In the embodiment of the present invention, it is expressed that the first and second scan inspectors and the first and second region of interest inspectors perform inspection, but actually, the inspection process for whether the substrate is defective is performed in the image processing system.

That is, the image processing system calculates whether the substrate is defective and coordinate information of the defective area based on the image captured by each inspection unit, and the controller controls each camera device and transport means based on the processing result of the image processing system do.

First, when a substrate is transferred to the first stage 102 after cleaning, a first picker (not shown) picks up the substrate from the first stage 102 and then transfers it to the second stage 202 .

Then, after the second stage 202 holds the substrate by vacuum suction, the first line scan camera 203 moves downward along the second transfer rail 201 .

The first line scan camera 203 takes a line scan image of the upper surface of the substrate located on the lower side, and, although not shown in the drawing, determines whether the upper surface of the substrate is defective through processing of the line scan image in the image processing system. do.

At this time, the first line scan camera 203 moves in the X-Y-Z axis direction under preset conditions according to the size of the substrate to adjust the magnification, and takes a line scan image of the substrate according to the adjusted magnification.

As described above, according to the present invention, substrates of various sizes can be inspected by adjusting the magnification by adjusting the height and horizontal position of the camera according to the size of the substrate.

In addition, according to an embodiment of the present invention, arbitrary regions of a captured image are captured using a plurality of first line scan cameras 203 to overlap each other, and the image processing system synthesizes the captured images to determine whether there is a defect.

When the substrate line scan using the first line scan camera 203 is completed, the second stage 202 moves along the second transfer rail 201 in the direction of the first transfer rail 101 , and the first picker (not (shown) picks up the substrate on the second stage 202 and then loads it on the third stage 302 after moving along the first transfer rail 101 .

In the third stage 302 , the alignment camera 304 moves downward along the third transfer rail 301 after holding the substrate by vacuum suction.

Then, the alignment camera 304 takes a picture of the upper surface of the substrate, finds a fiducial mark through analysis of the substrate image obtained by the alignment camera in the image processing system, and is defective based on the recognition mark information. Obtain coordinate information of the expected area.

Thereafter, when the third stage 302 moves to the lower side of the first area camera 303 , the first area camera 303 performs XYZ axis adjustment based on the coordinate information obtained through the first alignment camera 304 . After that, the defect-predicted area on the upper surface of the substrate is photographed.

The image processing system re-determines whether the defect predicted area of the upper surface of the substrate is defective based on the image captured by the first area camera 304 .

In this case, when it is determined that the upper surface inspection using the first line scan camera 203 is not defective, the inspection using the first area camera 303 may be omitted.

Next, the third stage 302 moves toward the reverse transfer unit 400 along the third transfer rail 301 , and the second picker (not shown) installed on the reverse transfer unit 400 is installed on the third stage 302 . As shown in FIG. 3 by picking up the loaded substrate, the substrate P is loaded on the fourth stage 402 .

Then, the fourth stage 402 holds the substrate P by vacuum suction, and as shown in FIG. 4 , the lifting means 403 operates to lower the fourth stage 402 .

When the fourth stage 402 descends to a desired position, the bracket 404 moves the sliding rail 405 until the fourth stage 402 is positioned below the flipper 406 as shown in FIG. 5 . It moves horizontally in the first axis direction.

Then, as shown in FIG. 6 , the lifting means 403 raises the fourth stage 402 until the substrate P on the upper surface of the fourth stage 402 becomes close to the lower surface of the flipper 406 . and the fourth stage 402 removes the substrate vacuum adsorption force.

At this time, the flipper 406 pips up the substrate P through vacuum suction, and the lifting means 403 operates to vertically lower the fourth stage 402 as shown in FIG. 7 .

Thereafter, as the bracket 404 moves along the sliding rail 405 , the fourth stage 402 returns to its original position.

And, as shown in FIG. 8 , the flipper 406 spots the substrate P through rotation so that the lower surface of the substrate P faces upward.

Then, a second picker (not shown) picks up the substrate P on the flipper 406 and loads it to the fifth stage 502 , and the fifth stage 502 is transferred to the fourth stage with the substrate raised on the upper surface. The second line scan camera 503 moves downward along the rail 501 .

The second line scan camera 503 photographs the lower surface of the transferred substrate, and the image processing system determines whether there is a defect based on the image captured by the second line scan camera 503 .

Next, when the inspection using the second line scan camera 503 is completed, the fifth stage 502 moves along the fifth transfer rail 501 in the direction of the seventh transfer rail 700 .

In addition, a third picker (not shown) picks up the substrate from the fifth stage 502 that has moved in the direction of the seventh transfer rail 700 , moves in the direction of the sixth transfer rail 601 , and then moves to the sixth stage 602 . ) is loaded into

Next, the second area camera 603 photographs an area expected to be defective among the lower surfaces of the substrate transferred to the sixth stage 602 , and the image processing system uses the image captured by the second area camera 603 based on the image. to re-inspect whether the region of interest is defective.

At this time, even when it is determined that the lower surface inspection using the second line scan camera 503 is not defective, the inspection using the second area camera 603 is omitted. It is transferred to the seventh stage 800 .

On the other hand, if it is determined that either the upper surface inspection or the lower surface inspection is defective, a rework process must be performed or discarded. In this case, the substrate is transferred to the eighth stage 900 .

As described above, the present invention provides a plurality of line scan cameras for inspecting the upper and lower surfaces of the substrate and an area camera for re-inspection of an area expected to be defective by arranging in parallel in a direction symmetrical to each other, thereby reducing the inspection space and reducing the substrate movement speed. In addition, the inspection speed can be improved by performing a re-inspection using a single device integrated into the main body without a visual inspection or additional inspection equipment for an area where defects are expected in the scanned image.

Although the present invention has been described with reference to the above-mentioned preferred embodiments, various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, it is intended that the appended claims cover such modifications and variations as fall within the scope of the present invention.

10: body
100: first transfer unit 102: first transfer rail
103: buffer stage 200: first scan inspection unit
201: second transfer rail 202: second stage
203: first line scan camera 300: first region of interest inspection unit
301: third transfer rail 302: third stage
303: first area camera 400: reverse transfer unit
401: fourth transfer rail 402: fourth stage
403: lifting means 404: bracket
405: sliding rail 406: flipper
500: second scan inspection unit 501: fifth transfer rail
502: fifth stage 503: second line scan camera
600: second region of interest inspection unit 601: sixth transport rail
602: sixth stage 603: second area camera
700: second transfer unit 701: seventh transfer rail
800: 7th stage 900: 8th stage

Claims (6)

A substrate integrated inspection apparatus in which transport and inspection are performed in a first axis and a second axis direction orthogonal to the first axis,
a first transfer unit installed along the first axial direction and configured to transfer a substrate along the first axial direction;
a first scan inspection unit installed along the second axis direction and configured to inspect an upper surface of the substrate transferred from one end of the first transfer unit;
a first region of interest inspection unit installed along the second axis direction and configured to inspect an expected defect region among the upper surface of the substrate transferred from the other end of the first transfer unit based on the inspection result of the first scan inspection unit;
a reversing transfer unit for inverting the substrate inspected by the first region of interest inspection unit and transferring it to the rear end;
a second scan inspection unit installed along the second axis direction and inspecting the lower surface of the substrate transferred from the reverse transfer unit;
a second region of interest inspection unit installed along the second axial direction and configured to inspect an expected defect region of the lower surface of the substrate based on the inspection result of the second scan inspection unit;
a second transfer unit installed along the first axial direction and transferring the substrate from one end to the second scan inspection unit and from the other end to the second region of interest inspection unit;
The reverse transfer unit
A stage that vacuum-sucks a transfer substrate and moves vertically and horizontally in the first axial direction, a lifting means for raising and lowering the stage from a lower portion of the stage, a bracket coupled to a lower end of the lifting means, and the bracket A sliding rail that allows horizontal movement in the first axis direction through this sliding, and a flipper installed at the rear end of the stage and vacuum-sucking the substrate transferred through the stage and then rotating to invert the inspection surface of the substrate Board integrated inspection device, characterized in that.
The method of claim 1,
The first and second scan inspection units include a plurality of line scan cameras, and each line scan camera captures the substrate at different positions so that a partial region of the captured image overlaps.
The method of claim 1,
and the first transfer unit includes a buffer stage for temporarily loading the substrate when the speed at which the substrate is transferred from the front end is faster than the inspection speed.
delete delete The method of claim 1,
An air cleaning device is installed at a front end of each of the first scan inspection unit and the second scan inspection unit.

Images