JP6456726B2 - Inspection device, inspection method, and inspection program - Google Patents

Description

  The present invention relates to an inspection apparatus, an inspection method, and an inspection program.

  2. Description of the Related Art Conventionally, an inspection apparatus that images a board and inspects a mounted component on the board is known. For example, Patent Document 1 discloses an inspection apparatus that scans a single wide substrate by combining two line sensors having overlapping fields of view and two telecentric lenses.

Japanese Patent No. 4166585

The conventional inspection apparatus described above cannot efficiently inspect various substrates. That is, in the conventional inspection apparatus described above, one type of substrate can be inspected by one apparatus, but a configuration for inspecting a type of substrate different from the substrate is not disclosed. Moreover, the structure which test | inspects several board | substrate simultaneously with one apparatus is not disclosed.
The present invention has been made in view of the above problems, and an object thereof is to provide a technique capable of efficiently inspecting various substrates.

  In order to achieve the above object, an inspection apparatus includes a plurality of board transfer means capable of transferring different types of boards to an imaging region and a plurality of imaging means for imaging the board, wherein the inspection apparatus is parallel to a component mounting surface of the board. A plurality of photographing means arranged at different positions along the first direction, a movement control means for moving at least one of the substrate and the photographing means in a second direction perpendicular to the first direction, the substrate and the photographing means. A photographing control unit that causes the photographing unit to perform photographing at a plurality of photographing positions that are different in relative positional relationship, a coupling control unit that moves and combines the photographing unit in the first direction, and an image photographed by the photographing unit. Inspection object image acquisition means for acquiring an image to be inspected based on the inspection object image.

  In other words, the substrate transport means can transport different types of substrates to the imaging region. Therefore, the inspection apparatus can inspect various substrates. Further, in the inspection apparatus, the substrate can be transported to the imaging region by a plurality of substrate transporting means, and the substrate can be imaged by the plurality of capturing means. Accordingly, a plurality of substrates can be inspected simultaneously. For this reason, the inspection apparatus can inspect various substrates efficiently. Further, in a state where the photographing unit is moved and coupled in the first direction by the coupling control unit, the size of the photographing unit is substantially extended in the first direction. Therefore, it is possible to capture a wider imaging area than when performing imaging with individual imaging means. For this reason, it is possible to inspect a wider substrate as compared with the inspection by individual photographing means, and it is possible to inspect a wider variety of substrates.

  Here, the board transfer means can transfer different types of boards to the imaging area, and a plurality of boards arranged at different positions along a first direction parallel to the component mounting surface of the board transferred to the imaging area. Any means can be used. That is, different types of substrates can be transferred to the imaging region by one substrate transfer means, and the inspection apparatus includes a plurality of the substrate transfer means so that the inspection apparatus can simultaneously apply a plurality of different types of substrates to the imaging region. It only needs to be transportable. Of course, the same type of substrates may be simultaneously photographed by different substrate transport means transporting the same type of substrates to the imaging region.

  The imaging area may be an area where the substrate is arranged when an image of the substrate is taken, and imaging is performed in a state where at least a part of the substrate is arranged in the imaging area. Various methods can be adopted as the method of transporting the substrate to the imaging region by the substrate transport means. For example, a transport device that transports the substrate to the imaging region, and a fixing unit that fixes the substrate so as not to move in the imaging region. It is possible to adopt a configuration including

  The plurality of board conveying means may be arranged at different positions along the first direction parallel to the component mounting surface of the board. As a result, the plurality of inspection lines are arranged along the first direction. It only has to be done. That is, it is only necessary that the plurality of inspection lines are arranged along the first direction and the substrate transporting units are arranged at different positions so that the substrate can be inspected independently in each line. The first direction may be a direction parallel to the component mounting surface of the board and perpendicular to the second direction. In the orthogonal three-dimensional coordinate system defined for the inspection apparatus, the first direction is one coordinate axis. It is sufficient that the second direction is parallel to the other coordinate axes, and the surface formed by both coordinate axes is parallel to the component mounting surface. If the component mounting surface of the board is not strictly a plane due to the warp of the board or the like, the board may be regarded as a plane and the first direction may be defined in a direction parallel to the plane.

  Furthermore, it is only necessary that each substrate transport means can transport different types of substrates to the imaging region. Various configurations can be adopted as the configuration for this purpose, and examples include a configuration capable of transporting substrates having different widths and lengths to a specific imaging region. In order to transport substrates having different widths and lengths to the imaging region, the substrate transport device transports the substrate using a member that can be deformed or moved according to the shape of the substrate, or transports the substrate to the imaging region. What is necessary is just to be comprised. For example, when the edge part of the width direction of a board | substrate is pinched | interposed, the structure etc. which the member which pinches | interposes an edge part can move to the width direction are mentioned.

  The photographing means may be a plurality of means for photographing the substrate transported to the photographing region in the plurality of substrate transporting means and may be a plurality of means arranged at different positions along the first direction. In other words, the photographing unit can photograph the substrate transported to the photographing region. Since the photographed image includes a component mounted on the substrate and an image of solder or the like connecting the component, inspection can be performed based on the image.

  The sensor for performing imaging can be configured by, for example, a two-dimensional image sensor including a plurality of pixels arranged two-dimensionally, and a plurality of cameras including the two-dimensional image sensor are included in one imaging unit. Individual may be installed. The optical system for photographing the substrate is not limited to a telecentric lens, and a non-telecentric lens can be used. However, it is desirable to employ a telecentric lens in that an image viewed from a substantially constant direction can be obtained over the entire field of view. In addition, the imaging unit may be provided with a part for guiding reflected light from the substrate to the sensor, a light source for illuminating the substrate, and the like. Note that the light source that illuminates the component mounting surface from directly above the substrate is desirably arranged so as to surround the lens at substantially the same height as the lens in order to perform illumination that does not cause an image shadow by the component.

  The plurality of imaging units are arranged at different positions along a first direction perpendicular to a second direction (scanning direction) that is a direction in which at least one of the substrate and the imaging unit moves. The imaging means may be arranged without interfering and may be configured so that imaging can be performed independently of each other for each substrate transport means at different positions along the first direction.

  The movement control unit only needs to move at least one of the substrate and the imaging unit in the second direction. In other words, it is only necessary that the relative positional relationship between the substrate and the photographing means is changed in the second direction so that different positions on the substrate can be photographed. For this purpose, the part to be moved may be a substrate, an imaging means, or both. In order to move the substrate, it is sufficient that the substrate transport unit is configured to change the position of the substrate in the second direction. For example, the substrate transport unit can transport the substrate in the second direction. A configuration in which the substrate is fixed by a clamp or the like in the imaging region can be employed.

  In order to move the photographing unit, a configuration including a mechanism for enabling the photographing unit to change the position of the photographing unit may be employed. The mechanism can be configured by, for example, a ball screw that can move the photographing unit along an axis extending in the second direction. In any case, in the above configuration, it is only necessary that the movement control unit can move at least one of the substrate and the photographing unit in the second direction by controlling at least one of the substrate carrying unit and the photographing unit. .

  The imaging control unit only needs to allow the imaging unit to perform imaging at a plurality of imaging positions in which the relative positional relationship between the substrate and the imaging unit is different. That is, since at least one of the substrate and the photographing unit can move in the second direction, if photographing is performed while changing the relative positional relationship between the substrate and the photographing unit by the movement in the second direction, Can be photographed at different positions (a plurality of different photographing positions). As a result, the imaging control unit can scan the substrate and image a desired position on the substrate.

  The plurality of shooting positions may be positions where the relative positional relationship between the board and the shooting means is different, and various definitions are possible, but the board can be filled with images shot at each shooting position. If comprised in this way, all the positions on a board | substrate along a 2nd direction can be made into imaging | photography object.

  The coupling control unit only needs to be able to couple the imaging unit by moving it in the first direction. In other words, the coupling control unit couples a plurality of imaging units along the first direction, thereby substantially extending the length of the imaging unit in the first direction, and from the range that can be captured by a single imaging unit. What is necessary is just to be comprised so that imaging | photography can be carried out over a wide range in the 1st direction. The combination may be performed so that the plurality of photographing units are substantially integrated and it is considered that the photographing is performed by the substantially integral photographing unit. Accordingly, it is sufficient that at least a part of the photographing unit is configured to move in the first direction. For example, when the photographing unit includes a sensor, at least the position of the sensor is configured to move in the first direction. It may be.

  The inspection target image acquisition unit only needs to be able to acquire the inspection target image based on the image captured by the imaging unit. That is, the inspection target image acquisition unit only needs to be able to acquire an image to be inspected based on an image obtained by photographing the substrate so that the inspection target such as a component or solder related to the component is included. Of course, the images to be inspected may be combined and acquired. For example, the inspection target image acquisition means combines images obtained by photographing each part of the substrate at a plurality of photographing positions with different photographing means, thereby inspecting an image of a board in a wider range than the range photographed by one photographing. It may be acquired as a target.

  The inspection may be performed automatically or artificially. In the former case, for example, a configuration in which the image analysis unit extracts a part characterizing the quality of the inspection target from the image and analyzes the image of the part to determine the quality of the inspection target can be adopted. In the latter case, for example, it is possible to adopt a configuration in which a user who visually recognizes an image to be inspected visually determines the quality of the object to be inspected by displaying the image to be inspected on the display unit.

  Further, in the plurality of substrate transfer means, some of the substrate transfer means can be retracted from the imaging area, and other imaging areas including the area after the partial substrate transfer means have been retracted The substrate transfer means may be configured to transfer the substrate. According to this configuration, it is possible to transport a substrate having a larger width to the imaging region as compared with the case where a plurality of substrate transporting units are used simultaneously.

  Furthermore, the board | substrate conveyance means may be equipped with the two fixing | fixed part which fixes each of the opposite side of a board | substrate, and the structure where the distance of the 1st direction of a fixing | fixed part is variable may be employ | adopted. That is, one substrate transport means includes two fixing portions, and is configured so that different types of substrates (substrates having different widths) can be transported to the imaging region by changing the distance between the fixing portions. Also good. The fixing unit only needs to fix each of the two opposing sides of the substrate when the substrate is transported to the imaging region, and various means can be used for fixing. For example, the fixing portion can be configured by means for sandwiching the substrate in the thickness direction.

  Further, the photographing unit may be configured to include a plurality of cameras. That is, when a plurality of cameras are used, it is possible to shoot the wide shooting range by performing shooting so that the wide shooting range is covered by the plurality of cameras. Therefore, a wide imaging range can be covered with a camera smaller than the range (a small sensor that captures a range narrower than the range), and the cost can be reduced compared to a configuration including a small number of large cameras.

  Further, in this configuration, the camera may be installed in the photographing unit so that analysis ranges narrower than the maximum field of view of the camera are arranged in the first direction without a gap. According to this configuration, an image without a gap can be taken along the first direction. Note that the state where the analysis ranges are arranged without gaps can be realized by a state where the boundaries of the analysis ranges are in contact with each other or a state where portions having a predetermined width including the boundaries overlap.

  In the photographing means, the camera is installed in the photographing means so that the analysis range narrower than the maximum field of view of the camera is arranged in the first direction without any gap, thereby absorbing the deviation from the ideal position of the camera in the photographing means. can do. That is, when a plurality of cameras are installed on the photographing means, the camera installation position may deviate from the ideal position. However, even if such a shift (including rotation from the ideal angle) occurs, if the analysis range is narrower than the maximum field of view, the difference between the maximum field of view and the analysis range is used as a margin and the margin is used. Thus, the analysis range can be defined in a state where the deviation of the camera installation position from the ideal position is canceled.

  In order to install the camera on the photographing unit so that the analysis range is arranged in the first direction without a gap, the camera itself may not be arranged in the first direction without a gap. For example, the camera adjacent to the first direction in the photographing unit may be installed at different positions along the second direction. That is, a camera that is adjacent to a certain camera may be installed at a position that is different in the second direction as well as in the first direction with respect to the installation position of the certain camera.

  For example, when a coordinate system with the second direction as the x-axis and the first direction as the y-axis is defined on a plane included in the photographing unit, and a certain camera is arranged at the coordinates (X, Y), A configuration in which the coordinates of the cameras adjacent in the y-axis direction are not (X, Y + Ly) but (X + Lx, Y + Ly) may be adopted (where Lx is the camera pitch in the x-axis direction, Ly is camera pitch in the y-axis direction). In such a case, adjacent cameras are displaced from each other in the second direction. However, when attention is paid only to the first direction, the analysis ranges are arranged without gaps in the first direction.

  According to this configuration, since these cameras can be installed in a state where adjacent cameras do not interfere with each other, it is easy to arrange the analysis ranges of the respective cameras in the first direction. Even when three or more cameras are installed in the photographing means, a plurality of cameras are installed in the photographing means without causing the adjacent cameras to interfere with each other as long as the relationship between the adjacent cameras is maintained. It is possible.

  The case where the present invention is realized as an apparatus has been described above, but the present invention can also be applied to a method and a program for realizing such an apparatus. The inspection apparatus as described above may be realized alone, applied to a certain method, or used in a state where the method is incorporated in another device. The present invention is not limited to this and includes various aspects. Of course, the embodiment of the invention can be changed as appropriate, such as software or hardware. The software recording medium may be a magnetic recording medium, a magneto-optical recording medium, or any recording medium that will be developed in the future. The same is true for the replication stage of primary replicas and secondary replicas. In addition, even when the communication apparatus is used as the supply device, the present invention is not used. Further, even when a part is software and a part is realized by hardware, the idea of the invention is not completely different, and a part is stored on a recording medium and is appropriately changed as necessary. It may be in a form that is read.

It is a schematic block diagram of an inspection apparatus. (2A) is a perspective view schematically showing a main part of the inspection apparatus, and (2B) is a perspective view schematically showing an imaging part. (3A) is a diagram schematically illustrating the positional relationship between the camera, the analysis range, and the illumination, (3B) is a side view illustrating the relationship between the main body and the illumination, and (3C) is a schematic diagram illustrating a state in which the main body is coupled. FIG. (4A) is a diagram showing the relationship between the maximum field of view and the analysis range, (4B) is a diagram showing the state of scanning, and (4C) is a diagram for explaining the elimination of the camera assembly error. (5A) is a flowchart of the inspection process, and (5B) and (5C) are explanatory diagrams of the reference sheet. It is a flowchart of a width adjustment process. (7A) and (7B) are diagrams showing a scan example of the substrate. (8A) and (8B) are diagrams showing examples of scanning of the substrate. (9A) and (9B) are diagrams showing the transfer device.

Here, embodiments of the present invention will be described in the following order.
(1) Configuration of the inspection device:
(1-1) Configuration of substrate transfer unit:
(1-2) Configuration of photographing unit:
(1-2-1) Relationship between maximum field of view of camera and analysis range:
(1-2-2) Coupling of the imaging unit:
(1-2-3) Generation of correction data:
(1-3) Configuration of control unit:
(2) Inspection process:
(2-1) Width adjustment processing:

(1) Configuration of the inspection device:
FIG. 1 is a schematic block diagram of an inspection apparatus according to an embodiment of the present invention. The inspection apparatus includes an imaging mechanism unit 100 and a control unit 200. In the imaging mechanism unit 100, the substrate is transported by a transport device (not shown), and each part of the imaging mechanism unit 100 is controlled by the control unit 200, whereby an image of the substrate is captured. That is, the control unit 200 outputs a control signal to the imaging mechanism unit 100 via a controller (not shown), transports the substrate to a predetermined imaging region, and images the substrate. When an image is taken, information indicating the image is sent to the control unit 200 via a controller (not shown). The control unit 200 executes processing for determining the quality of components, solder, and the like mounted on the substrate based on the image, and processing for inspecting the presence or absence of foreign matter on the substrate.

(1-1) Configuration of substrate transfer unit:
The imaging mechanism unit 100 includes a substrate transport unit 110 and an imaging unit 120. FIG. 2A is a perspective view illustrating components of the substrate transport unit 110 and the imaging unit 120. The substrate transport unit 110 is a plurality of means that can transport different types of substrates to the imaging region. In the present embodiment, two substrate transfer units 110a and 110b are provided as the substrate transfer unit 110, and different types of substrates can be transferred to the imaging region in each of the substrate transfer units 110a and 110b. Specifically, the substrate transport unit 110a includes rails R1 and R2, a motor M4, a ball screw B4, a transport device (not shown), and a fixing unit. The substrate transfer unit 110b includes rails R3 and R4, motors M5 and M6, ball screws B5 and B6, a transfer device (not shown), and a fixing unit (not shown).

  In this embodiment, the rails R1 to R4 are plate-shaped rectangular parallelepipeds. In FIG. 2A, the vertical direction is the z-axis direction, and the direction in which the rails R1 to R4 extend is the x-axis direction, the z-axis direction, and the direction perpendicular to the x-axis direction. Is defined as a y-axis direction to define a three-dimensional orthogonal coordinate system (the same applies hereinafter). The transfer device of the substrate transfer unit 110a can transfer the substrate in the x-axis direction between the rails R1 and R2, and can move the substrate in the z-axis direction. The transport apparatus can be configured by, for example, a transport belt that transports a substrate placed thereon and a lifting mechanism that moves the substrate up and down. FIG. 9A and FIG. 9B are explanatory diagrams of the transport device, and show a state where the rail R1 is viewed from the x-axis direction. In FIG. 9A and FIG. 9B, the conveyance apparatus omitted in FIG. 2A and the like is shown. The transport device can transport the substrate W placed on the belt B in the x-axis direction by moving the belt B along the x-axis direction. The elevating mechanism H can move up and down along the z-axis direction, and can move the substrate W transported to the imaging region upward along the z-axis direction.

  The fixing portion is a plate-like member protruding from the rails R1 and R2, and the fixing portion F1 provided on the rail R1 protrudes from the rail R1 toward the rail R2 by a minute distance and the plate-like surface is xy. Parallel to the plane. The fixing portion F2 provided in the rail R2 protrudes from the rail R2 toward the rail R1 by a minute distance, and the plate-like surface is parallel to the xy plane. Accordingly, after the substrate is transported to the imaging region (region Rs indicated by the broken line in the example shown in FIG. 2A) by the transport device, when the substrate is moved upward in the z-axis direction by the lifting mechanism, the fixing portions F1, F2 and A substrate is sandwiched between the lifting mechanism. As a result, the opposite side of the substrate is fixed by the fixing portions F1 and F2, and is fixed to the imaging region while being sandwiched between the rails R1 and R2. The rail R1 of the substrate transport unit 110a is fixed to the inspection device (not movable). On the other hand, a nut (not shown) of a ball screw B4 is joined to the rail R2, and the axis is parallel to the y-axis direction. Therefore, when the shaft of the ball screw B4 rotates due to the rotation of the motor M4, the rail R2 moves in the y-axis direction. The configuration of the fixing portion is not limited to a configuration in which a plate-like member protrudes from the rail, and the rail includes a groove and a belt is disposed in the groove, and the substrate moved upward by the lifting mechanism is a groove. The structure etc. which are fixed between the inner wall and the raising / lowering mechanism may be sufficient.

  The substrate transport unit 110b is disposed at a position different from the substrate transport unit 110a along the y-axis direction. The transport device and the fixing unit of the substrate transport unit 110b are the same as the configuration of the substrate transport unit 110a (however, the fixing unit is not shown in FIG. 2A). Accordingly, after the substrate is transported to the imaging region Rs by the transport device, when the substrate is moved upward in the z-axis direction by the transport device, the substrate is sandwiched between the fixed portion and the transport device. As a result, the opposite side of the substrate is fixed by the fixing portion, and is fixed to the imaging region with being sandwiched between the rails R3 and R4. A nut (not shown) of a ball screw B5 is joined to the rail R3 of the substrate transport unit 110b, and the axis is parallel to the y-axis direction. Therefore, when the shaft of the ball screw B5 rotates due to the rotation of the motor M5, the rail R3 moves in the y-axis direction. A nut (not shown) of a ball screw B6 is joined to the rail R4 of the substrate transport unit 110b, and the axis is parallel to the y-axis direction. Therefore, when the shaft of the ball screw B6 rotates due to the rotation of the motor M6, the rail R4 moves in the y-axis direction.

  As described above, in the present embodiment, the rail R2 of the substrate transport unit 110a and the rails R3 and R4 of the substrate transport unit 110b are movable in the y-axis direction. Therefore, the board | substrate conveyance part 110 can adjust the distance between rail R1, R2 and the distance between rail R3, R4 by moving each rail R2, R3, R4. For this reason, in each of the substrate transport units 110a and 110b, substrates having different widths (substrates having different lengths in the y-axis direction) can be fixed to the imaging region.

(1-2) Configuration of photographing unit:
Furthermore, in the present embodiment, two photographing units 120a and 120b are provided as the photographing unit 120, and each of the photographing units 120a and 120b can photograph the substrate transported to the photographing region. Specifically, the photographing unit 120a includes a main body H1, a plurality of lights L1, a plurality of cameras C1, a motor M1, and a ball screw B1. The ball screw B1 includes an axis extending in the x-axis direction and a nut N1 attached to the upper portion of the main body H1 (on the opposite side to the substrate transport unit 110a along the z-axis direction). Accordingly, when the shaft of the ball screw B1 rotates due to the rotation of the motor M1, the main body H1 moves in the x-axis direction together with the nut N1. In the present embodiment, since the board is a plate-like member whose opposite sides are fixed by a fixing portion (F1, F2, etc. shown in FIG. 2A), the component mounting surface of the board is parallel to the xy plane. Therefore, in this embodiment, the x-axis direction (second direction) in which the main body H1 moves is parallel to the component mounting surface of the board.

  The camera C1 is a camera provided with a telecentric lens and a two-dimensional image sensor. In the present embodiment, ten cameras C1 are installed on the main body H1. Each camera C1 images light from the field of view through a telecentric lens on a two-dimensional image sensor, and generates image information indicating the intensity of light in each pixel included in the two-dimensional image sensor. Therefore, when the board | substrate conveyed to the imaging | photography area | region by each camera C1 is image | photographed, the image information which shows the image of a board | substrate is output from each camera C1.

  FIG. 3A is a diagram showing the installation position of the camera C1 in a state where the main body H1 is viewed along the z-axis direction. In FIG. 3A, the positions of the camera C1 installed in the main body H1 and a part of the illumination L1 are shown as x. It is shown as a state projected onto the -y plane. In FIG. 3A, the main body H1, the illumination L1, and the image analysis range Ia (details will be described later) are indicated by a solid line, and the maximum aperture portion T1 of the telecentric lens is indicated by a one-dot chain line. 3A shows the positions of the maximum aperture portion T1 and the analysis range Ia on the assumption that the camera C1 is installed at an ideal position (design position) in the main body H1.

  As shown in FIG. 3A, in this embodiment, ten cameras C1 are arranged in the y-axis direction, and the cameras C1 adjacent in the y-axis direction are installed at different positions by a distance 4Lx along the x-axis direction. Yes. The pitch of the camera C1 in the y-axis direction is Ly. Here, Lx is the length of the side of the analysis range Ia in the x-axis direction, and Ly is the length of the side of the analysis range Ia in the y-axis direction. Therefore, in the present embodiment, the cameras C1 are arranged with the length Ly as a pitch along the y-axis direction, and the adjacent cameras C1 are separated from each other by 4Lx along the x-axis direction. That is, the camera C1 is installed on the main body H1 in a staggered arrangement (zigzag arrangement). In the present embodiment, the pitch of the camera C1 in the x-axis direction is 4Lx, which is an integral multiple of the length of the side in the x-axis direction of the analysis range Ia, but may be a non-integer multiple.

  The illumination L1 has a shape that is long in the y-axis direction, and is installed on the main body H1 so that light is emitted mainly vertically downward (in FIG. 2A and FIG. 3A, a plurality of illuminations L1). Only a part of is shown). FIG. 3B is a side view showing a state in which the main body H1, the camera C1, and the illumination L1 are extracted and viewed along the y-axis direction (members that connect the illumination L1 and the main body H1 are omitted). The illumination L1 in the present embodiment is configured by five illuminations L11 to L15 shown in FIG. 3B. When each of the illuminations L11 to L15 emits light, a substrate that can exist vertically below along the z-axis direction is illuminated. The brightness is suitable for shooting.

  The illuminations L11 and L15 can irradiate light obliquely with respect to the component mounting surface of the substrate arranged in parallel to the xy plane. Therefore, even if parts with a lot of specular reflection components (for example, parts or characters on the board) are included on the board, shooting is performed so that images of these parts can be identified by illumination from various directions. It becomes possible. Further, three illuminations L12, L13, and L14 are arranged along the x-axis direction, and the camera C1 is disposed between two adjacent illuminations. When these illuminations L12, L13, and L14 illuminate the negative direction of the z-axis, the component mounting surface of the board can be illuminated in a state close to epi-illumination.

  With the above configuration, in the photographing unit 120a, the substrate can be photographed by some or all of the ten cameras C1 while the substrate is illuminated by some or all of the five lights L11 to L15. As described above, since the main body H1 is movable along the x-axis direction, the camera C1 performs shooting with the substrate fixed to the shooting region Rs shown in FIG. 2A. By moving to a position and shooting with the camera C1, it is possible to take images of the substrate at different shooting positions. Since the photographed image includes a component mounted on the substrate and an image of solder or the like connecting the component, inspection can be performed based on the image.

(1-2-1) Relationship between maximum field of view of camera and analysis range:
In the present embodiment, the analysis is performed so that the analysis range of each camera C1 fills the predetermined range in the xy plane without any gap by moving the main body H1 in a certain direction (x-axis direction, second direction). The size of the range and the position of the camera C1 are determined. Specifically, the maximum field of view of the camera C1 is larger than the analysis range Ia, and the camera C1 is installed in the main body H1 so that the analysis range Ia is arranged in the y-axis direction (first direction) without a gap.

  FIG. 4A is a diagram showing the position of the camera C1 by the maximum aperture portion T1, and also showing the maximum field of view Im and the analysis range Ia of each camera C1, and shows a state where each is projected onto the xy plane. In FIG. 4A, the maximum aperture portion T1 is indicated by a one-dot chain line, the maximum visual field Im is indicated by a two-dot chain line, and the analysis range Ia is indicated by a solid line.

  FIG. 4A is an example when the position of the camera C1 is an ideal position in design. In the present embodiment, the two-dimensional image sensor provided in the camera C1 is rectangular. Accordingly, among the light reflected from the object existing inside the maximum aperture portion T1 of the camera C1, the camera C1 can convert only the substrate existing in the maximum visual field Im inside the maximum aperture portion T1.

  Furthermore, in the present embodiment, the analysis range Ia is smaller than the maximum visual field Im, and the analysis range Ia is large so that the range is narrowed by dx at each end in the x-axis direction and dy at each end in the y-axis direction. (Lx and Ly) are defined. That is, the length of the maximum visual field Im in the x-axis direction is (Lx + 2dx), and the length of the analysis range Ia in the y-axis direction is (Ly + 2dy).

  Furthermore, in the present embodiment, as described above, the analysis range Ia of the camera C1 is installed in the main body H1 with the pitch Ly in the y-axis direction. Therefore, focusing on only one dimension in the y-axis direction, the analysis range Ia whose length in the y-axis direction is Ly is arranged without gaps in the y-axis direction. On the other hand, when viewed in one dimension in the y-axis direction, adjacent cameras C1 are separated by 4Lx along the x-axis direction. Accordingly, when the photographing unit 120a is moved along the x axis, a continuous range in the real space can be photographed by the adjacent camera C1. For example, when the image is taken with the camera C11 shown in FIG. 4A, the main body H1 is moved by 4Lx in the negative x-axis direction, and the image is taken with the camera C12, the continuous parts in the real space are taken with the cameras C11 and C12. become.

  In the present embodiment, the substrate in the imaging region can be imaged without a gap by moving (scanning) the main body H1 in the negative direction of the x-axis as described above. FIG. 4B is a diagram schematically illustrating how a substrate existing in the imaging region is scanned. A broken line W indicates a state in which the position of the substrate in the imaging region is projected onto the xy plane. Since the width in the y-axis direction of the substrate W shown in FIG. 4B is smaller than 10 Ly, the width in the y-axis direction of the substrate W is included in the length 10Ly of the analysis range Ia of ten cameras C1 arranged in the y-axis direction. . Further, the length of the substrate W in the x-axis direction is smaller than 9Lx.

  Therefore, when the photographing with the camera C1 and the movement of the pitch Lx in the negative x-axis direction of the main body H1 are repeated nine times (that is, photographing is performed at each of different photographing positions), the photographing is performed over the entire length in the x-axis direction. It can be carried out. Since the adjacent cameras C1 are separated from each other by 4Lx in the x-axis direction, when shooting of the end of the substrate W is started on one of the two adjacent cameras, The end of the substrate W is included in the field of view of the camera. Accordingly, by repeating the shooting from the fourth shooting to the ninth shooting, the other camera can also perform shooting over the entire length in the x-axis direction. In FIG. 4B, the analysis range Ia that changes in the process of scanning by the camera is indicated by a solid rectangle, and the number of times of imaging is indicated in each rectangle. As described above, the substrate W shown in FIG. 4B is photographed over the entire length in the x-axis direction in the first to ninth photographing and over the entire length in the x-axis direction in the fourth to twelfth photographing. There is a part. And the whole range of the board | substrate W is image | photographed by 1st-12th imaging | photography.

  Furthermore, in the present embodiment, as described above, the maximum field of view Im of the camera C1 is larger than the analysis range Ia, and the camera C1 is installed in the main body H1 with the pitch Ly in the y-axis direction. Even if an assembling error (deviation from the ideal position of the camera (including a deviation in orientation)) occurs during installation, the margin dx and dy can be used to eliminate the error. FIG. 4C shows an example in which some cameras C1 (cameras C13 and C14) are installed at positions deviated from the ideal positions when the ideal positions of the cameras C1 are the same as those in FIG. 4A. ing. In FIG. 4C, as in FIG. 4A, the position of the camera C1 is indicated by the maximum aperture portion T1, and the maximum visual field Im and the analysis range Ia of each camera C1 are indicated.

  The camera C13 shown in FIG. 4C is attached at a position rotated with respect to an ideal position. That is, the side of the analysis range Ia13 is parallel to the x-axis direction and the y-axis direction on the xy plane, but the maximum field of view of the camera C13 when the camera C13 is mounted at a position rotated from an ideal position (mounting direction). Im13 rotates. As a result, the side of the maximum field of view Im13 of the camera C13 is not parallel to the x-axis direction and the y-axis direction. Even if the camera C13 deviates from the ideal position in this way, the analysis range Ia13 of the camera C13 exists in the maximum visual field Im13 in FIG. 4C. Therefore, the two-dimensional image sensor included in the camera C13 can capture an image of the analysis range Ia13 at an appropriate position shown in FIG. 4C. For this reason, it is possible to absorb the deviation (rotation error) from the ideal position by extracting the image of the analysis range Ia13 at the appropriate position from the image captured by the camera C13.

  The camera C14 shown in FIG. 4C is attached at a position translated from the ideal position in the x-axis direction and the y-axis direction. As a result, the position of the maximum field of view Im14 of the camera C14 is deviated from the ideal position, but in FIG. 4C, the analysis range Ia14 of the camera C14 exists inside the maximum field of view Im14. Therefore, the two-dimensional image sensor provided in the camera C14 can capture an image of the analysis range Ia14 at an appropriate position shown in FIG. 4C. For this reason, it is possible to absorb the deviation (position error) from the ideal position by extracting the image of the analysis range Ia14 at an appropriate position from the image captured by the camera C14.

(1-2-2) Coupling of the imaging unit:
As described above, the imaging unit 120a can perform imaging with a plurality of cameras C1 while scanning the substrate in the x-axis direction. With this configuration, the substrate can be imaged without a gap. is there. On the other hand, the imaging unit 120b is arranged at a position different from the imaging unit 120a along the y-axis direction. The imaging unit 120b has the same configuration as that of the imaging unit 120a. However, the imaging unit 120b has not only the x-axis direction (second direction) but also a part of the imaging unit 120b in the y-axis direction (first direction). However, it is different from the photographing unit 120a in that it can be moved. That is, as illustrated in FIG. 2A, the photographing unit 120b also includes a main body H2, a plurality (five pieces) of illumination L2, a plurality (ten pieces) of cameras C2, a motor M2, and a ball screw B2. These components are substantially the same as the components of the photographing unit 120a, and the installation positions (pitch) of the camera C2 and the illumination L2 with respect to the main body H2 are the same as those of the photographing unit 120a. The imaging unit 120b can move the main body 2 in the x-axis direction by rotating the axis of the ball screw B2. Therefore, the substrate can be scanned in the x-axis direction by moving the main body H2 of the imaging unit 120b while the substrate is sandwiched between the rails R3 and R4 and conveyed to the imaging region.

  In the present embodiment, the main body H1 of the photographing unit 120a and the main body H2 of the photographing unit 120b are configured to be movable in the x-axis direction independently of each other. That is, a small gap (in the y-axis direction) between the main body H1 and the main body H2 when viewed in one dimension in the y-axis direction so that the main body H1 and the main body H2 do not interfere with each other when moving in the x-axis direction. Ball screws B1 and B2 are installed in the inspection apparatus so that a gap along the line is generated. Therefore, the imaging units 120a and 120b are arranged at different positions along the y-axis direction (first direction) and are configured not to interfere with each other in movement in the x-axis direction (second direction).

  However, in this embodiment, the imaging unit 120b can move a part of the imaging unit 120b in the y-axis direction. That is, a rack and pinion mechanism and a motor M3 (not shown) are provided inside the main body H2 of the photographing unit 120b. The object to be moved by the rack and pinion mechanism is a camera installation unit in which the camera C2 is installed. FIG. 2B is a perspective view showing the main bodies H1 and H2. As shown in FIG. 2B, in the main body H2, a camera C2 is installed in a rectangular parallelepiped portion below the main body H2, and the rectangular parallelepiped portion where the camera C2 is installed. Is the camera installation unit H22 to be moved by the rack and pinion mechanism.

  And the imaging | photography part 120b can move the camera installation part H22 to the y-axis direction via a rack and pinion mechanism by driving the motor M3 provided in the inside of the main body H2. In FIG. 2B, the camera installation unit H22 is shown at the upper side in a state where the camera installation unit H22 is arranged at a specified position (position when photographing independently by the imaging unit 120b: directly below the main body H2). A state where the shaft is moved in the negative direction is shown on the lower side.

  As described above, when the camera installation unit H22 is moved in the negative direction of the y-axis with the positions of the main bodies H1 and H2 being the same position, the main body H1 and the main body H2 move the camera installation unit H22. Are connected to each other. FIG. 3C shows the camera C1, C2, illuminations L1, L2, and analysis ranges Ia1, Ia2 in a state in which the main body H1 and the camera installation unit H22 in a coupled state are viewed from the same direction as in FIG. 3A and projected onto the xy plane. FIG.

  As shown in FIG. 3C, the installation positions of the cameras C1 and C2 are the same in both the main bodies H1 and H2 (the pitches 4Lx and Ly are the same, and the positions of the cameras viewed from the main body boundary are also common). Further, the arrangement of the illuminations L1 and L2 is also common, and the three illuminations arranged in the x-axis direction are shifted by the same distance along the y-axis direction. Therefore, the main body H1 and the camera installation portion H22 can be coupled without causing the cameras C1, C2 and the lights L1, L2 to interfere with each other. In a state where the main body H1 and the camera installation portion H22 are coupled, the cameras C1 and C2 are arranged at a pitch 4Lx in the x-axis direction and a pitch Ly in the y-axis direction over all the cameras C1 and C2. become.

  Therefore, in a state where the main body H1 and the camera installation unit H22 are coupled, it can be considered that the main body H1 of the photographing unit 120a is a camera array substantially extended in the y-axis direction. Further, in a state where the main body H1 and the camera installation portion H22 are coupled, when the main bodies H1 and H2 are moved by the same distance in the same direction by the ball screws B1 and B2, the main body H1 and the camera installation portion H22 are coupled. The camera array moves in the x-axis direction. Therefore, it is possible to image the substrate with a wide (double) range as the imaging region compared to before the coupling is performed. In addition, the coupling | bonding of a main body is realizable even if main bodies are not integrated by a fastening means etc. FIG. That is, the main bodies are moved so as to approach each other by a mechanism with high positional accuracy such as a rack and pinion mechanism, and the main body is moved in the x-axis direction by a mechanism with high positional accuracy such as a ball screw while the main bodies are in contact with each other. The joined body can be moved accurately.

(1-2-3) Generation of correction data:
As described above, in this embodiment, since the analysis range is a narrower range than the maximum field of view of the cameras C1 and C2, the influence of the assembly error on the main bodies H1 and H2 of the cameras C1 and C2 is eliminated. Is possible. In order to eliminate the error, in the present embodiment, before the inspection is performed, correction data for performing imaging that eliminates the influence of the error is generated. In the present embodiment, as described above, the photographing units 120a and 120b can perform photographing independently, and the main body H1 of the photographing unit 120a and the camera installation unit H22 of the photographing unit 120b are combined. It is possible to shoot with.

  Therefore, in the present embodiment, correction data when the shooting units 120a and 120b perform shooting alone and correction data when shooting in a combined state are generated in advance. 5B and 5C are diagrams schematically illustrating a reference sheet for generating correction data. The reference sheet is a sheet indicating the analysis range of the cameras C1 and C2 included in the photographing units 120a and 120b. The portion corresponding to the analysis range is colored, and the shape and positional relationship of each portion are accurately adjusted in advance. ing.

  The reference sheet illustrated in FIG. 5B is a sheet for generating correction data when the photographing units 120a and 120b perform photographing independently. Therefore, in the colored portion in the reference sheet shown in FIG. 5B, there are two columns that are separated by five in the y-axis direction, and a total of ten analysis ranges Ia are reproduced. When the correction data for the image capturing unit 120a is generated, the image is captured by the camera C1 of the image capturing unit 120a with the reference sheet shown in FIG. 5B sandwiched between the rails R1 and R2. At this time, photographing is performed so that all the colored portions are included in the maximum field of view of all the cameras C1. And the colored part is detected in the image of each camera C1, and the coordinates of the analysis range within the maximum visual field are specified by detecting the pixel at the corner. Then, data indicating the coordinates is generated and recorded in the memory 240 as correction data 240c for the photographing unit 120a.

  When the correction data for the image capturing unit 120b is generated, the image is captured by the camera C2 of the image capturing unit 120b in a state where the reference sheet shown in FIG. 5B is sandwiched and fixed between the rails R3 and R4. At this time, shooting is performed so that all the colored portions are included in the maximum field of view of all the cameras C2. And the colored part is detected in the image of each camera C2, and the coordinates of the analysis range within the maximum visual field are specified by detecting the pixel at the corner. Then, data indicating the coordinates is generated and recorded in the memory 240 as correction data 240c for the photographing unit 120b.

  When correction data is generated for a state in which the main body H1 of the photographing unit 120a and the camera installation unit H22 of the photographing unit 120b are combined, the reference sheet shown in FIG. 5C is sandwiched and fixed between the rails R1 and R2. In this state (the rails R3 and R4 are retracted; details will be described later), the images are taken by the cameras C1 and C2 in the combined state. At this time, photographing is performed so that all the colored portions are included in the maximum field of view of all the cameras C1 and C2. And the colored part is detected in the image of each camera C1, C2, and the coordinates of the analysis range within the maximum visual field are specified by detecting the pixel at the corner position. Data indicating the coordinates is then generated and recorded in the memory 240 as correction data 240c for the combined state.

(1-3) Configuration of control unit:
As shown in FIG. 1, the control unit 200 includes a CPU 210, an input unit 220, an output unit 230, and a memory 240. The input unit 220 is an input device such as a mouse or a keyboard that accepts a user's operation input, and the user can input a desired operation instruction via the input unit 220. CPU 210 receives the contents of the operation instruction. The output unit 230 is a display that outputs an arbitrary image to the user, and can display an arbitrary image instructed by the CPU 210 in accordance with a control signal output by the CPU 210.

  The memory 240 is a recording medium capable of recording arbitrary information, and a program for controlling the inspection apparatus is recorded in advance as program data 240a. The CPU 210 can execute an inspection process based on the program data 240 a recorded in the memory 240. In the present embodiment, the CPU 210 executes the inspection process based on the program data 240a, so that the CPU 210 serves as the movement control unit 210a, the imaging control unit 210b, the combination control unit 210c, the inspection target image acquisition unit 210d, and the inspection unit 210e. Function.

  The movement control unit 210a causes the CPU 210 to perform a function of moving the main bodies H1 and H2 of the photographing units 120a and 120b in the x-axis direction. That is, the CPU 210 specifies the driving amounts of the motors M1 and M2 necessary for moving the main bodies H1 and H2 to a predetermined designated position by the processing of the movement control unit 210a. Then, the CPU 210 outputs a control signal for driving the motors M1 and M2 with the driving amount to the photographing units 120a and 120b via a controller (not shown). As a result, the main bodies H1 and H2 are moved to the designated positions designated by the CPU 210.

  The photographing control unit 210b causes the CPU 210 to perform a function of causing the cameras C1 and C2 included in the photographing units 120a and 120b to perform photographing at a plurality of photographing positions having different relative positional relationships. That is, the CPU 210 moves the main bodies H1 and H2 of the photographing units 120a and 120b to the photographing position by the process of the movement control unit 210a, and then the cameras C1 and C2 through the controller (not shown) by the processing of the photographing control unit 210b. Output a control signal. As a result, since image data is output from the cameras C1 and C2, the CPU 210 acquires the image data via a controller (not shown) and records it in the memory 240 (image data 240b). Since the photographing can be executed in a state where the main bodies H1 and H2 of the photographing units 120a and 120b exist at arbitrary positions, the CPU 210 performs relative processing between the substrate and the main bodies H1 and H2 by the processing of the photographing control unit 210b. It is possible to cause the cameras C1 and C2 to perform shooting at a plurality of shooting positions with different positional relationships.

  The coupling control unit 210c causes the CPU 210 to perform a function of moving the photographing unit 120 in the y-axis direction and coupling. That is, when shooting should be performed in a state where the main body H1 of the shooting unit 120a and the camera installation unit H22 of the shooting unit 120b are coupled (when a wide substrate is inspected), the CPU 210 performs shooting via a controller (not shown). A control signal is output to the units 120a and 120b. The control signal is a signal for coupling the main body H1 of the photographing unit 120a and the camera installation unit H22 of the photographing unit 120b, and may include signals for driving the motors M1, M2, and M3.

  That is, the motors M1 and M2 are driven by the signal, and the main bodies H1 and H2 are moved to the same position in the x-axis direction. Furthermore, the motor M3 is driven by the signal, and the camera installation unit H22 is moved in the negative direction of the y-axis via the rack and pinion mechanism (see FIG. 2B). As a result, the main body H1 of the photographing unit 120a and the camera installation unit H22 of the photographing unit 120b are combined.

  The inspection target image acquisition unit 210d causes the CPU 210 to execute a function of acquiring an inspection target image based on the images captured by the imaging units 120a and 120b. In other words, the CPU 210 performs processing by the inspection target image acquisition unit 210d to determine the conveyance mode (one line inspection using the photographing unit 120a alone, two line inspection using the photographing units 120a and 120b, and one in which the photographing units 120a and 120b are combined). With reference to the correction data 240c corresponding to the line inspection), an image in the analysis range is acquired from the captured images (images for the maximum visual field) of the cameras C1 and C2 indicated by the image data 240b.

  The inspection unit 210e causes the CPU 210 to execute a function of inspecting the substrate based on the inspection target image (processing for determining the quality of components mounted on the substrate, solder, and the like, and processing for inspecting the presence or absence of foreign matter on the substrate). . In other words, the CPU 210 acquires an image of a component to be inspected and solder based on the characteristic amount of the component to be inspected and solder from the image to be inspected acquired by the processing of the inspection target image acquisition unit 210d. Then, the CPU 210 acquires a feature amount that characterizes pass / fail based on the acquired image, and determines pass / fail based on a predetermined determination criterion (such as a threshold).

  According to the present embodiment as described above, a plurality of types of substrates can be transferred to the imaging region by the plurality of substrate transfer units 110a and 110b, and the substrates are imaged by the plurality of imaging units 120a and 120b. Is possible. Accordingly, a plurality of types of substrates can be inspected simultaneously. For this reason, the inspection apparatus can inspect various substrates efficiently. Further, in a state where the main body H1 of the photographing unit 120a and the camera installation unit H22 of the photographing unit 120b are coupled, the photographing range is substantially extended in the y-axis direction. Therefore, it is possible to capture a wider imaging area than when the individual imaging units 120a and 120b perform imaging. Therefore, in the inspection apparatus, it is possible to inspect a wider substrate as compared with the inspection by the individual photographing units 120a and 120b, and it is possible to inspect a wider variety of substrates.

(2) Inspection process:
FIG. 5A is a flowchart showing the inspection process. The inspection process is executed by the CPU 210 functioning as the movement control unit 210a, the imaging control unit 210b, the combination control unit 210c, the inspection target image acquisition unit 210d, and the inspection unit 210e. In the inspection process, the CPU 210 acquires substrate information through the process of the movement control unit 210a (step S100). In the present embodiment, the substrate information is information indicating the substrate to be inspected, information indicating the shape of the substrate to be inspected (the length in the x-axis direction and the width in the y-axis direction), and the transport mode of the substrate to be inspected This is information indicating (one line inspection by the photographing unit 120a alone, two line inspection by using the photographing units 120a and 120b, and one line inspection in a state where the photographing units 120a and 120b are combined). The board information may be acquired by various methods, for example, may be recorded in the memory 240 in advance, may be input by the user via the input unit 220, or may be an external recording medium (for example, The board information recorded in the portable memory may be transferred to the memory 240 via an interface (not shown).

(2-1) Width adjustment processing:
When the board information is acquired, the CPU 210 performs a width adjustment process by the process of the movement control unit 210a (step S105). FIG. 6 is a diagram showing the width adjustment process in step S105. In the width adjustment process, the CPU 210 determines the width of the substrate and the conveyance form (step S200). That is, the CPU 210 specifies the width of the substrate to be inspected (the length in the y-axis direction) and the substrate transport form based on the substrate information acquired in step S100.

  If it is determined in step S200 that the substrate transport mode is one line non-bonding (one line inspection by the photographing unit 120a alone), the CPU 210 acquires correction data for the photographing unit 120a (step S210). That is, the CPU 210 obtains correction data when the photographing unit 120a performs photographing independently from the correction data 240c.

  Next, the CPU 210 moves the main body H1 of the photographing unit 120a to the reading positions of the marks Mk1 and Mk2 shown in FIG. 7A (step S215). In the present embodiment, marks Mk1 to Mk4 for determining the positions of the rails R2 to R4 are attached in advance to the upper surfaces of the rails R1 to R4 (on the imaging unit 120a side in the z-axis direction). 7A, FIG. 7B, FIG. 8A, and FIG. 8B schematically show the rails R1 to R4, the main bodies H1 and H2 of the photographing units 120a and 120b, and the motors M4 to M6 as viewed vertically below along the z-axis direction. FIG. In step S215, the CPU 210 controls the motor M1 to move the main body H1 from above the marks Mk1 and Mk2 to a position where the marks Mk1 and Mk2 can be photographed.

  Next, the CPU 210 moves the rail R2 so that the width of the rails R1 and R2 (the rail interval in the y-axis direction) is a width that can fix the board (step S220). That is, in the present embodiment, the widths of the rails R1 and R2 for fixing a board having an arbitrary width are determined in advance. Therefore, the CPU 210 specifies the widths of the rails R1 and R2 necessary for fixing the board specified in step S200. Further, the CPU 210 controls the photographing unit 120a to photograph the marks Mk1 and Mk2, and specifies the positions of the marks Mk1 and Mk2 based on the analysis range image indicated by the correction data acquired in step S210.

  Then, the CPU 210 specifies the current widths of the rails R1 and R2 based on the widths of the marks Mk1 and Mk2, and determines whether or not the current width is a width for fixing the board specified in step S200. judge. When it is not determined that the width of the rails R1 and R2 is the width for fixing the board specified in step S200, the CPU 210 specifies the movement amount of the rail R2 based on the widths of the marks Mk1 and Mk2, and the motor M4. Is controlled to move the rail R2. The photographing and the determination of the widths of the rails R1 and R2 are repeated until it is determined that the current width of the rails R1 and R2 is a width for fixing the board specified in step S200. The method for adjusting the width of the rail is not limited to a method using reading of the mark position, and various methods can be adopted. For example, the width may be adjusted based on the count of the number of steps in the stepping motor.

  When the rail R2 moves to an appropriate position, the CPU 210 conveys the board to the imaging area (step S222). That is, the CPU 210 outputs a control signal to the transport device, and transports the substrate to the imaging areas of the rails R1 and R2 by the belt of the transport device. Next, the CPU 210 fixes the substrate (step S225). That is, the CPU 210 outputs a control signal to the transfer device, moves the substrate upward by the lifting mechanism of the transfer device, and fixes the substrate between the rails R1 and R2. FIG. 7A shows an example of adjusting the width of the rails R1 and R2 when the width of the substrate W is the width W1, and FIG. 7B shows the width of the rails R1 and R2 when the width of the substrate W is the width W2. An adjustment example is shown. As described above, in the present embodiment, by changing the position of the rail R2, the substrates W having different widths can be transported and fixed to the imaging region of the main body H1 of the imaging unit 120a.

  In step S200, when it is determined that the substrate transport mode is two lines (two-line inspection using the photographing units 120a and 120b), the CPU 210 acquires the photographing unit 120a correction data and the photographing unit 120b correction data. (Step S235). That is, the CPU 210 acquires correction data when the photographing unit 120a performs photographing alone and correction data when the photographing unit 120b performs photographing independently from the correction data 240c. When the transport mode is two lines, two types of substrates are inspected at the same time. Here, the substrate fixed to the rails R1 and R2 is the first substrate, and the substrate fixed to the rails R3 and R4 is the second substrate. Call it.

  Next, the CPU 210 moves the main body H1 of the photographing unit 120a to the reading positions of the marks Mk1 and Mk2, and the main body H2 of the photographing unit 120b to the reading positions of the marks Mk3 and Mk4 (step S240). That is, the CPU 210 controls the motor M1 to move the main body H1 from above the marks Mk1 and Mk2 to a position where the marks Mk1 and Mk2 can be photographed. Further, the CPU 210 controls the motor M2 to move the main body H2 from above the marks Mk3 and Mk4 to a position where the marks Mk3 and Mk4 can be photographed.

  Next, the CPU 210 moves the rail R4 to a specified position (step S245). That is, the position of the rail R4 when the transport mode is two lines is determined in advance, and in this embodiment, the position farthest from the rail R1 is the specified position of the rail R4. Therefore, the CPU 210 performs control to move the position of the rail R4 by the motor M6, and moves the rail R4 to the specified position.

  Next, the CPU 210 moves the rail R3 so that the widths of the rails R3 and R4 can be fixed to the board (step S250). That is, the CPU 210 controls the photographing unit 120b to photograph the marks Mk3 and Mk4, and specifies the positions of the marks Mk3 and Mk4 based on the correction data for the photographing unit 120b acquired in step S235. The CPU 210 performs control to move the position of the rail R3 by the motor M5 until the current width of the rails R3 and R4 is determined to be a width for fixing the second board specified in step S200. The photographing and the determination of the width of the rails R3 and R4 are repeated.

  When the rail R3 moves to an appropriate position, the CPU 210 moves the rail R2 so that the widths of the rails R1 and R2 can be fixed to the board (step S255). That is, the CPU 210 controls the photographing unit 120a to photograph the marks Mk1 and Mk2, and specifies the positions of the marks Mk1 and Mk2 based on the correction data for the photographing unit 120a acquired in step S235. The CPU 210 performs control to move the position of the rail R2 by the motor M4 until the current width of the rails R1 and R2 is determined to be the width for fixing the first board specified in step S200. The photographing and the determination of the width of the rails R1 and R2 are repeated.

  When the rail R2 moves to an appropriate position, the CPU 210 conveys the board to the imaging area (step S257). That is, the CPU 210 outputs a control signal to the transport device, and transports the substrate to the imaging regions of the rails R1 and R2 and the imaging regions of the rails R3 and R4 by the belt of the transport device. Next, the CPU 210 fixes the substrate (step S260). That is, the CPU 210 outputs a control signal to the transfer device, moves the substrate upward by the lifting mechanism of the transfer device, and fixes the first substrate between the rails R1 and R2 and the second substrate between the rails R3 and R4. To do. FIG. 8A shows an example of adjusting the width of the rails R1 to R4 when the width of the first substrate W11 is the width W1 and the width of the second substrate W12 is the width W2. As described above, in the present embodiment, by changing the positions of the rails R2 to R4, the boards W having two different types of widths can be simultaneously photographed by the photographing units 120a and 120b.

  If it is determined in step S200 that the substrate transport mode is one-line combination (one-line inspection with the imaging units 120a and 120b combined), the CPU 210 corrects the combined state correction data for the imaging units 120a and 120b. Is acquired (step S270). That is, the CPU 210 acquires correction data regarding the state in which the main body H1 of the photographing unit 120a and the camera installation unit H22 of the photographing unit 120b are coupled from the correction data 240c.

  Next, the CPU 210 combines the photographing units 120a and 120b and moves the combined main bodies H1 and H2 to the reading positions of the marks Mk1 and Mk2 (step S275). That is, the CPU 210 controls the motors M1 and M2 to move the main bodies H1 and H2 to the same position in the x-axis direction. Further, the CPU 210 controls the motor M3 to move the camera installation unit H22 in the negative direction of the y axis via the rack and pinion mechanism. As a result, the main body H1 of the photographing unit 120a and the camera installation unit H22 of the photographing unit 120b are combined. Further, the CPU 210 controls the motors M1 and M2 to move the main bodies H1 and H2 from above the marks Mk1 and Mk2 to positions where the marks Mk1 and Mk2 can be photographed.

  Next, the CPU 210 retracts the rails R3 and R4 (step S280). That is, the CPU 210 performs control to move the position of the rail R4 by the motor M6, and moves the rail R4 to a specified position (position farthest from the rail R1). Further, the CPU 210 performs control to move the position of the rail R3 by the motor M5, and moves it to a position adjacent to the rail R4. The positions of the rails R3 and R4 shown in FIG. 8B are the positions after the movement in step S280.

  Next, the CPU 210 moves the rail R2 so that the widths of the rails R1 and R2 can be fixed to the board (step S285). That is, the CPU 210 controls the photographing units 120a and 120b to photograph the marks Mk1 and Mk2, and specifies the positions of the marks Mk1 and Mk2 based on the combined state correction data of the photographing units 120a and 120b acquired in step S270. To do. Then, the CPU 210 performs control to move the position of the rail R2 by the motor M4, and shoots until it is determined that the current width of the rails R1 and R2 is the width for fixing the board specified in step S200. And the determination of the width of the rails R1 and R2 is repeated.

  When the rail R2 moves to an appropriate position, the CPU 210 conveys the board to the imaging area (step S287). That is, the CPU 210 outputs a control signal to the transport device, and transports the substrate to the imaging areas of the rails R1 and R2 by the belt of the transport device. Next, the CPU 210 fixes the substrate (step S290). That is, the CPU 210 outputs a control signal to the transfer device, moves the substrate upward by the lifting mechanism of the transfer device, and fixes the substrate between the rails R1 and R2. FIG. 8B shows an example of adjusting the width of the rails R1 and R2 when the width of the substrate W is the width W3. As described above, in the present embodiment, by combining the main bodies H1 and H2 to change the position of the rail R2, the main bodies H1 and H2 have a width W larger than the width of the board that can be photographed by the main body H1 alone. It can be conveyed and fixed to the imaging area.

When the width adjustment process ends, the CPU 210 returns to the flowchart shown in FIG. 5A and continues the process from step S110. That is, the CPU 210 moves the photographing unit to the photographing position by the process of the movement control unit 210a (step S110). In the present embodiment, when an arbitrary board is fixed to the rails R1 to R4, the position where the end of the board in the positive direction of the x axis is arranged is determined in advance (for example, in the example shown in FIG. 4B). Position (x ₀ )). Therefore, when step S110 is executed for the first time in the process of loop processing (steps S110 to S130), the CPU 210 controls the imaging unit 120 so that the end of the board is included in the analysis range. Move the main body.

  For example, when the conveyance form is one line non-coupled, the CPU 210 controls the motor M1, and the end of the substrate is in the analysis range Ia of the camera C1 on the negative direction side of the x axis (for example, C11 instead of C12 in FIG. 4A). The main body H1 is moved so that the part is included. When the transport mode is two lines, the CPU 210 controls the motors M1 and M2 to move each of the main bodies H1 and H2 so that the end portion of the substrate is included in the analysis range Ia of the cameras C1 and C2. When the transport mode is one-line coupling, the CPU 210 controls the motors M1 and M2, and moves the main bodies H1 and H2 in the coupled state so that the end of the substrate is included in the analysis range Ia of the cameras C1 and C2.

  On the other hand, when step S110 is executed after the second time in the course of the loop processing, the CPU 210 controls the photographing unit 120, and the main body of the photographing unit 120 in the negative direction of the x axis by the pitch Lx in the x axis direction of the analysis range. Move. When the transport mode is 1 line non-joining, the moving object is the main body H1, when the transporting form is 2 lines, the moving object is the individual main bodies H1 and H2, and when the transporting form is 1 line joining, the moving object is The combined bodies H1 and H2.

  Next, the CPU 210 performs shooting by processing of the shooting control unit 210b (step S115). That is, the CPU 210 controls the photographing unit 120 via a controller (not shown) and causes the camera to perform photographing. In addition, the CPU 210 acquires the captured image as image data 240 b and records it in the memory 240. Note that, when the conveyance form is one line non-coupled, the CPU 210 acquires an image output from the camera C1 installed in the main body H1 as the image data 240b. When the conveyance form is a combination of two lines and one line, the CPU 210 acquires an image output from the cameras C1 and C2 installed in the main bodies H1 and H2 as image data 240b.

  Next, the CPU 210 performs pass / fail determination by the processing of the inspection target image acquisition unit 210d and the inspection unit 210e (step S120). That is, the CPU 210 specifies the analysis range of each camera by referring to the correction data 240c by the processing of the inspection target image acquisition unit 210d. And the image of the analysis range of each camera is acquired from the image data 240b. Further, the CPU 210 acquires a feature quantity characterizing pass / fail from an image in the analysis range acquired from each camera by the processing of the inspection unit 210e, and determines pass / fail based on a predetermined determination criterion (such as a threshold).

  In the present embodiment, since the analysis ranges are arranged without gaps, the inspection target (solder, parts, etc.) is present at the boundary portion between adjacent analysis ranges (for example, a portion inside a predetermined pixel from the side). It may be in a disconnected state. Therefore, for the boundary portion, the determination is suspended until an image in the adjacent analysis range is acquired (the image is stored in the memory 240). Make a decision. For example, in the example shown in FIG. 4B, the inspection for the boundary Ba of the first analysis range is suspended, and the pass / fail determination is made after the second analysis range is acquired and a continuous image of the boundary Ba portion is acquired. Done. The inspection for the boundary Bb of the first analysis range is suspended, and the pass / fail determination is performed after the fourth analysis range is acquired and a continuous image of the boundary Ba portion is acquired.

  Next, the CPU 210 determines whether or not the pass / fail judgment result is a pass / fail judgment by the processing of the inspection unit 210e (step S125). In step S125, when it is not determined that the pass / fail determination result is a pass / fail determination (when there is at least one failure determination), the CPU 210 performs a failure determination process by the process of the inspection unit 210e (step S135). That is, the CPU 210 outputs a control signal to the output unit 230 to display information indicating that the substrate is defective on the display. Of course, in this case, a display indicating a defective portion may be performed.

  On the other hand, when it is determined in step S125 that the pass / fail determination result is a pass / fail determination, the CPU 210 determines whether or not the scan is completed by the process of the movement control unit 210a (step S130). That is, the CPU 210 determines whether or not shooting by the camera has been completed over the entire length of the substrate in the x-axis direction based on the board information acquired in step S100, and if it is determined that shooting has ended. It is determined that the scan has been completed.

  If it is not determined in step S130 that the scan has been completed, the CPU 210 repeats the processes in and after step S110. On the other hand, when it is determined in step S130 that the scan is completed, the CPU 210 performs a good determination process by the process of the inspection unit 210e (step S140). That is, the CPU 210 outputs a control signal to the output unit 230 to display information indicating that the substrate is not defective on the display. Note that FIG. 5A shows an inspection process for one substrate. If a plurality of substrates are inspected, the substrate is unloaded from the inspection apparatus after the completion of one inspection process. After that, the cycle in which the uninspected substrate is carried into the inspection apparatus and the inspection process is executed again is repeated.

  DESCRIPTION OF SYMBOLS 100 ... Shooting mechanism part, 110, 110a, 110b ... Board | substrate conveyance part, 120, 120a, 120b ... Shooting part, 200 ... Control part, 210 ... CPU, 210a ... Movement control part, 210b ... Shooting control part, 210c ... Coupling control , 210d ... inspection target image acquisition unit, 210e ... inspection unit, 220 ... input unit, 230 ... output unit, 240 ... memory, 240a ... program data, 240b ... image data, 240c ... correction data

Claims (7)

A plurality of board transporting means capable of transporting different types of boards to the imaging area, and a plurality of boards arranged at different positions along a first direction parallel to the component mounting surface of the board transported to the imaging area A substrate transport means;
A plurality of photographing means for photographing the substrate transported to the photographing region in the plurality of substrate transporting means, and a plurality of photographing means arranged at different positions along the first direction;
Movement control means for moving at least one of the substrate and the photographing means in a second direction perpendicular to the first direction;
Photographing control means for causing the photographing means to perform photographing at a plurality of photographing positions in which the relative positional relationship between the substrate and the photographing means is different;
A coupling control unit that moves and couples the imaging unit in the first direction;
Inspection object image acquisition means for acquiring an image to be inspected based on an image captured by the imaging means;
An inspection apparatus comprising: A plurality of the substrate transfer means,
A part of the substrate transport means is retracted from the imaging region, and the substrate can be transported by the other substrate transport means with respect to the imaging region including the area after being retracted.
The inspection apparatus according to claim 1. The substrate transport means includes
Two fixing portions for fixing each of the opposite sides of the substrate are provided, and the distance in the first direction of the fixing portion is variable.
The inspection apparatus according to claim 1 or 2. The photographing means includes
The camera is provided with a plurality of cameras, and the camera is installed in the photographing unit such that an analysis range narrower than the maximum field of view of the camera is arranged without gaps in the first direction.
The inspection apparatus according to any one of claims 1 to 3. The camera adjacent to the first direction in the photographing means is installed at a different position along the second direction.
The inspection apparatus according to claim 4. A plurality of board transporting means capable of transporting different types of boards to the imaging area, and a plurality of boards arranged at different positions along a first direction parallel to the component mounting surface of the board transported to the imaging area A substrate transport means;
A plurality of photographing means for photographing the substrate transported to the photographing region in the plurality of substrate transporting means, and a plurality of photographing means arranged at different positions along the first direction; An inspection method in an inspection apparatus comprising:
A movement control step of moving at least one of the substrate and the photographing means in a second direction perpendicular to the first direction;
A photographing control step for causing the photographing means to perform photographing at a plurality of photographing positions in which the relative positional relationship between the substrate and the photographing means is different;
A coupling control step of moving and coupling the imaging means in the first direction;
An inspection object image obtaining step for obtaining an image to be inspected based on an image photographed by the photographing means;
Including inspection methods. A plurality of board transporting means capable of transporting different types of boards to the imaging area, and a plurality of boards arranged at different positions along a first direction parallel to the component mounting surface of the board transported to the imaging area A substrate transport means;
A plurality of photographing means for photographing the substrate transported to the photographing region in the plurality of substrate transporting means, and a plurality of photographing means arranged at different positions along the first direction; An inspection program that realizes an inspection function in a computer that controls an inspection device provided,
A movement control function for moving at least one of the substrate and the photographing means in a second direction perpendicular to the first direction;
A photographing control function for causing the photographing means to perform photographing at a plurality of photographing positions in which the relative positional relationship between the substrate and the photographing means is different;
A coupling control function for coupling the imaging means by moving in the first direction;
An inspection object image acquisition function for acquiring an image to be inspected based on an image photographed by the photographing means;
Inspection program that makes a computer realize.

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