JP2011021999A - Substrate inspecting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus capable of rapidly and accurately determining the quality of the mounting state of the electronic parts mounted on the peripheral edge part of a panel substrate and capable of easily corresponding, even in scaling-up of a panel. <P>SOLUTION: The substrate inspection apparatus is equipped with a moving stage 1 for moving the transparent panel substrate 10 (work W), which has the electronic parts mounted thereon via an anisotropic conductive film, to a predetermined inspection position to position the same, an imaging means 2 for imaging an inspection target region through the substrate 10, from the rear side of the surface having the electronic parts mounted thereon; a linear drive means 3 for sliding the imaging means 2 along the inspection target region; and an information processing means for determining the quality of the mounting state of the imaged inspection target region and places the substrate 10 on the upper surface 1a of the moving stage 1, in a state where at least one of the end parts of the substrate protrudes laterally. In this substrate inspection apparatus, a fixing stage 4 for supporting the end part of the substrate 10 protruding from the moving stage 1 from below is arranged in the vicinity of the imaging means 2. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a circuit board inspection apparatus in which electronic components, modules, and the like are mounted on a peripheral portion of a flat and transparent panel substrate such as a liquid crystal display panel via an anisotropic conductive film.

  In recent years, in the manufacture of flat display panels (FDP) such as liquid crystal display (LCD) panels, plasma display panels (PDP) and organic EL displays, driving ICs and the like are mounted on electrodes formed on the peripheral edge of the panel substrate. When mounting chip-like electronic components (IC, LSI, etc.) or modules on electrode pads on transparent (glass) substrates, the electronic components are attached via an anisotropic conductive film (ACF). In addition, a method of electrically connecting them is used.

  In the TAB method and COG method, the chip mounting process using the ACF is usually performed in the order of attaching an ACF to a panel (cell) substrate-IC chip mounting-crimping-crimping state. Line) also includes a substrate loader, a substrate cleaning device, an ACF sticking device, a chip mounting and crimping device, and a substrate inspection device arranged in a line.

  In addition, when such a chip mounting method is used, a method using differential interference observation is known as a method for determining the quality of the mounting state of the driving IC or the like. Specifically, the electrode part of the transparent panel substrate on which the IC chip or the like is mounted is observed with a differential interference microscope or the like from the back side (translucent side) in the mounting direction of the IC chip or the like. The number of “indentations” formed on the electrodes by being pressed by the conductive particles is counted, and if the number of indentations is large, it is determined that the mounting state is good.

  Then, as a method for automatically determining the quality of the mounting state of the IC chip or the like, the shape and number of the conductive particles are raised by observing the crimped portion (contrast) using an imaging means such as a CCD camera. Method of determining (Patent Document 1), and method of determining strength, number, position deviation, foreign matter contamination, etc. of indentations by comparison with standard image data of pre-measured / stored crimping points (Pattern Matching) (Patent Document) 2) etc. have been proposed.

  In addition, in the Japanese Patent Application No. 2008-53642, the applicant stores the optimum focal length at the time of inspection, and uses the stored optimum focal length data to determine the optimum focal length at the next and subsequent inspections. An electronic component inspection method and an apparatus used therefor have been proposed that can reduce the time required for focusing of the image pickup means by prediction.

  All of these devices (substrate inspection devices) for automatically determining the mounting state of the IC chip or the like are incorporated in the final process part of the chip mounting process as described above, and a transfer arm or the like from the upstream side of the process. And a stage (moving stage) on which the chip-mounted panel substrate transferred (supplied) is placed, and an imaging means with a differential interference microscope function for photographing the chip-mounted portion from the back side of the panel substrate. Further, the moving stage can be controlled independently of the three axes X, Y, and Z, and is configured to be rotatable around the θ axis along the Z axis. The panel substrate can be quickly moved to a position where the position can be accurately photographed.

  Here, the moving stage is formed in a circular shape or a rectangular shape having a flat upper surface, and a suction means for fixing the placed panel substrate is provided on the surface thereof. The imaging means with a differential interference microscope function observes the electrode part of the transparent panel substrate on which the chip is mounted from the back side (translucent side) of the chip mounting surface. When placed on the moving stage upward, the imaging means is arranged below the moving stage. Conversely, when the panel substrate is placed on the moving stage with its mounting surface facing down, the imaging means is disposed above the moving stage.

  In addition, in order to quickly image (inspect) a plurality of locations, many inspection apparatuses are provided with a plurality of sets of imaging means with a differential interference microscope function, and these imaging means slide on a guide rail provided in the X direction or the Y direction. It is configured to be movable.

  By the way, among the substrate inspection apparatuses that automatically determine the mounting state of the IC chip or the like as described above, the mounting surface of the panel substrate is placed on the moving stage with the mounting surface facing upward from the lower side of the apparatus (usually, The type that images the peripheral portion of the display panel and the inspection target portion in this application) includes an inspection target on the moving stage so that the moving stage on which the panel substrate is placed does not hide the inspection target portion. Those with a smaller area than the substrate are used.

  In addition, when the moving stage is a square or the like and is relatively large, the moving stage is prevented from coming into contact with the imaging means, and the inspection target substrate is arranged to make it easier to perform the imaging operation from the lower side of the device of the chip mounting site. When placing on the moving stage, the inspection target substrate is placed offset from the center of the upper surface of the moving stage toward the imaging means, and the end of the inspection target including the inspection target part is separated from the edge of the moving stage. There is a case where a method of arranging so as to protrude is used.

JP 2003-269934 A JP 2005-227217 A

  However, as described above, in the substrate inspection apparatus in which the panel substrate is placed in a state in which the inspection target portion (end) protrudes laterally (extends laterally) from the moving stage, the imaging means at the time of inspection The following problems occur during focusing.

1) Problem that warpage or distortion occurs in panel substrate In other words, the depth of field (depth of field) of the imaging means (CCD camera, differential interference microscope, etc.) used to acquire the differential interference image of the inspection target region is The flat display panel such as a liquid crystal display (LCD) panel, plasma display panel (PDP), and organic EL display to be inspected is usually formed using a large glass substrate, while the thickness is about several tens of μm. Therefore, a relatively large warp or distortion (several hundred μm or more) occurs in the width (longitudinal) direction of the panel due to heating, compression, or tension during manufacturing. The central portion of the panel substrate is sucked and fixed to the upper surface of the flat moving stage by the suction means described above, but the end (edge) that is the inspection target portion is separated from the moving stage. Since it protrudes like a flange in the air (side), warpage and distortion that differ from panel to panel are not corrected, and this causes the focusing operation of the imaging means to be delayed.

2) The problem that it takes time to converge the vibration of the panel substrate In other words, in recent years, in particular, due to the demand for rapid substrate inspection, the moving stage on which the panel substrate is mounted is often driven at a relatively high speed. Even after the positioning is completed and the moving stage is stopped, there is a phenomenon that the minute vibration of the panel is not easily settled. In particular, in the panel substrate in which only the central portion is fixed to the moving stage, it takes time to converge the vibration of the end portion (edge portion) that is the inspection target portion. Similar to the warp and distortion, the fine vibration not only delays the focusing operation of the imaging unit, but also decreases the accuracy of the quality determination of the mounting state of the inspection target part.

  These problems tend to become more prominent as the size of the panel substrate increases, and may become even more serious as future flat display panels become increasingly larger. In addition, in order to increase the size of the panel substrate, it is necessary to replace the moving stage on the mounting side with a larger one. If the moving stage with a small area is used as it is, this large panel substrate will be used. Cannot be supported in a well-balanced manner, increasing the warpage and distortion of the edge.

  The present invention has been made in view of such circumstances, and it is possible to quickly and accurately determine whether the electronic component mounted on the peripheral portion of the panel substrate is good, and it is easy to increase the size of the panel. It is an object of the present invention to provide a substrate inspection apparatus that can be adapted to the above.

  In order to achieve the above object, the present invention provides a predetermined inspection position by placing a transparent panel substrate on which electronic components are mounted via an anisotropic conductive film at a plurality of positions in the vicinity of the end portion on the upper surface thereof. The part to be inspected on which the electronic component is mounted is imaged through the substrate from the back side of the surface on which the electronic component is mounted, and the differential interference of the part is moved. Based on the image pickup means for acquiring an image, the linear drive means for sliding the image pickup means along each inspection target portion of the substrate positioned at the inspection position, and the image data obtained from the image pickup means, Information processing means for determining the quality of the mounting state of the imaged inspection object part, and at least one substrate end including the inspection object part is on the side of the movement stage on the upper surface of the movement stage. A substrate inspection apparatus in which the substrate is placed in the extended state, and a fixed stage for supporting an end portion of the substrate protruding from the moving stage from below is disposed in the vicinity of the imaging means. The board inspection apparatus is a first gist.

  The second gist of the present invention is a substrate inspection apparatus in which the fixed stage is formed in a bar shape extending along the sliding direction of the imaging means.

  Furthermore, among the above, the third aspect of the present invention is a substrate inspection apparatus in which the fixing stage includes a suction unit that sucks and fixes the panel substrate.

  The present invention relates to a substrate inspection apparatus that handles a panel substrate on which electronic components or the like are mounted on the peripheral edge of the substrate in a state in which the mounting portion protrudes laterally from the moving stage. By providing a fixed stage that contacts and supports the protruding portion of the panel substrate from the lower surface side at a nearby position, the position of the end including the inspection target portion of the panel substrate is stabilized, and the substrate inspection is performed. It is intended to improve the reproducibility and accuracy.

  That is, the substrate inspection apparatus of the present invention does not leave the end portion (inspection target portion) of the panel substrate disposed so as to protrude sideways from the moving stage as a stable base. Since the stationary stage is supported from the lower side, even if the movable stage moves and the substrates are replaced, the inspection target portions of these panel substrates can be set at the same position (height) every time.

  In addition, since the end portion of the panel substrate is supported so as to be lifted from the lower side at a position close to the edge portion, the warp and distortion of the different end portions (variation) for each panel are corrected, and the moving stage The vibration generated by the movement of is absorbed and can be quickly converged. Therefore, the board inspection apparatus of the present invention can minimize the adverse effects of warpage, vibration, etc. on the inspection, and improve the reproducibility and accuracy of the inspection of the mounting state.

  Since the inspection target part of the panel substrate is set at the same position every time, and the vibration due to the movement of the moving stage is quickly converged, this substrate inspection apparatus is in a waiting time from when the panel is set to when the imaging operation starts. And the time required for focusing during imaging is also short. Therefore, the substrate inspection apparatus of the present invention can speed up a series of these inspection operations (processes) as compared with the prior art.

  Furthermore, since the panel substrate is supported at the two points of the moving stage and the fixed stage, the substrate inspection apparatus can stably support even a large (large area) substrate. Therefore, the board inspection apparatus of the present invention can be easily adapted to an increase in the size of the panel.

  In the substrate inspection apparatus of the present invention, the fixed stage is formed in a bar shape extending along the sliding direction of the imaging means, and the inspection target end portion of the panel substrate extends over the entire width. It can be supported in a lump and is suitable. Furthermore, by making the length of the bar-shaped fixed stage larger than the length of the maximum size panel substrate assumed as an inspection target, without changing the moving stage, etc., to various size panel substrates, It becomes possible to respond easily.

  In the substrate inspection apparatus of the present invention, in particular, when the fixing stage includes an adsorption means for adsorbing and fixing the panel substrate, the inspection target end portion of the panel substrate is firmly fixed. And can be securely fixed. In addition, since the inspection target end of the panel substrate is adsorbed and fixed, it is possible to correct to some extent warpage and distortion that differ from panel to panel, and to quickly converge the vibration of the panel after the moving stage stops. Has the advantage of being able to.

It is a perspective view which shows the principal part structure of the board | substrate inspection apparatus in 1st Embodiment of this invention. It is a side view which shows the state by which the panel board | substrate which is a test object was set to the board | substrate inspection apparatus of 1st Embodiment. It is the figure which represented typically the structure and operation | movement of the board | substrate inspection apparatus in 2nd Embodiment of this invention.

  Next, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment.

  FIG. 1 is a configuration diagram of a main part of a substrate inspection apparatus according to a first embodiment of the present invention, and FIG. 2 is a diagram illustrating a state in which a panel substrate to be inspected is set in the substrate inspection apparatus. In the following description, the flow direction of the substrate in the sticking apparatus (and in the process) is the X direction, the depth direction in the apparatus orthogonal to the X direction is the Y direction, and the vertical (top / bottom) direction of the apparatus is the Z direction. In addition, the suction means (panel fixing means) disposed on the upper surfaces of the moving stage 1 and the fixed stage 4 are not shown in the drawing such as a suction pump and a pipe serving as an air flow path.

  The substrate inspection apparatus according to the present embodiment is incorporated into a part of a process (line) for mounting a chip-like electronic component or module on a work W (liquid crystal display panel, electronic circuit board, etc.) with an anisotropic conductive film interposed therebetween. The entire process is as follows: loader → substrate cleaning device → anisotropic conductive film pasting device (ACF transfer) → chip crimping device (COG or FPC temporary crimping, final crimping) → substrate inspection device (AOI) → unloader.

  The substrate inspection apparatus according to the first embodiment is arranged in the vicinity of one end of the panel substrate 10 by an anisotropic conductive film pasting device and a chip crimping device (not shown) located on the upstream side (left side in FIG. 1) of the process. An LCD panel (work W) on which a plurality of IC chips (driver ICs) 11 are mounted at a predetermined position is taken into the apparatus main body using a transfer arm or the like to be described later, and transferred to the moving stage 1 with a suction pad. After sucking and fixing, the moving stage 1 is moved to a predetermined inspection position, and the chip mounting site on the panel substrate 10 placed on the upper surface 1a is imaged by the imaging means 2 with a differential interference microscope function. In addition, the substrate inspection apparatus is provided with a fixed stage 4 that is located below the panel substrate 10 and supports the inspection target portion of the substrate 10.

  The moving stage 1 can be controlled independently of the three axes of X, Y, and Z, and is configured to be rotatable about the θ axis along the Z axis. Guide rails for guiding the base on which the moving stage 1 is placed are provided in two directions XY, and a servo motor (not shown) is used for driving the guide rails. The moving stage 1 also includes a servo motor that enables height adjustment in the Z-axis direction, and a servo motor that controls rotation about the θ axis along the Z-axis.

  In addition, the panel mounting surface (upper surface 1a) of the moving stage 1 is formed in an area smaller than the panel substrate 10 to be inspected, in order to facilitate the imaging work from the back side of the chip mounting portion described later. The inspection target portion (end portion 10a) of the panel substrate 10 can be placed in a state of protruding sideways (extending laterally) from the moving stage 1. The upper surface 1a is formed to be substantially flat, and a suction pad having a slit, an intake hole, and the like communicating with the suction means is disposed on the upper surface 1a.

  As shown in FIG. 2, the imaging unit 2 is a combination of a differential interference microscope unit 2b having an objective lens unit 2a, a differential interference prism and a mirror with coaxial incident illumination, and a CCD camera unit 2c having an image data output function. Therefore, an enlarged image can be taken for each predetermined point from the rear surface side of the surface on which the IC chip 11 is mounted on the panel substrate 10. The differential interference microscope unit 2b is characterized by being able to observe changes in the refractive index and thickness of the subject by converting them into changes in interference color and contrast between light and dark with the differential interference prism. And the blue light emitting diode with little heat radiation is used suitably for the light source of the said illumination.

  The imaging means 2 is disposed on the linear drive means 3 that can slide in the X direction on the guide rail along each inspection target portion of the substrate positioned at the inspection position. By repeating the above, the terminal (electrode) portion of the IC chip 11 mounted at a predetermined position in the vicinity of the one end portion 10a of the panel substrate 10 is sequentially inspected from the back surface side.

  The linear drive means 3 is a linear servo actuator (not shown) that can move at high speed. Further, the linear drive unit 3 includes a Z-direction adjusting unit 3a for adjusting the height of the imaging unit 2 in the Z direction (vertical direction) and performing focusing. A linear stepping actuator capable of adjusting the height of the imaging unit 2 in units of micrometers (μm) is used for the Z direction adjusting unit 3a.

  As described above, the substrate inspection apparatus according to the present embodiment is characterized in that the inspection target portion (end portion 10a) of the panel substrate 10 is supported at a position below the panel substrate 10 and in the vicinity of the imaging means 2. The fixed stage 4 is provided. The fixed stage 4 is disposed between the moving stage 1 and the imaging unit 2 and is a part protruding laterally from the moving stage 1 in the panel substrate 10 and at a position other than the inspection target part. It abuts from the lower surface side and supports it. Note that, similarly to the moving stage 1, a suction pad having a slit, an intake hole, and the like communicating with the suction means described above is also arranged on the upper surface 4 a of the fixed stage 4.

  Next, a procedure for inspecting a panel substrate 10 (work W) such as an LCD panel using the substrate inspection apparatus having the above configuration will be described.

  In the substrate inspection apparatus having the above-described configuration, first, the chip-mounted panel substrate 10 to be inspected is taken into the apparatus from the upstream side of the process by a transfer arm or the like, and its upper surface 1a is at the substantially central portion of the panel substrate 10. It is placed on the moving stage 1 so as to be positioned. The center portion of the panel is sucked and fixed by the suction pad on the upper surface 1a of the moving stage, and the end portion 10a, which is the inspection target portion, protrudes laterally (Y direction) from the moving stage 1.

  Thereafter, the panel substrate 10 is slightly lifted in the Z direction while the central portion of the panel is supported by the moving stage 1, and the XY movement of the moving stage 1 causes the panel substrate 10 as shown by a two-dot chain line in FIG. The IC chip 11 mounting portion of the imaging device 2 moves to the inspection position where it faces above the objective lens portion 2a of the imaging means 2. Then, after an alignment mark or the like on the panel substrate 10 is recognized by a panel position confirmation unit such as a CCD camera provided separately, and the XY direction position of the moving stage 1 and the rotation angle of the θ axis are finely adjusted to the correct position. Then, the moving stage 1 is lowered, and the panel substrate 10 is positioned at an accurate inspection position (solid line state in FIG. 2).

  At this time, the end portion 10a (chip mounting portion) which is the inspection target portion of the panel substrate 10 is supported from the lower side of the panel by the fixed stage 4 at a position close to the imaging means 2 and provided on the upper surface 4a thereof. Further, the panel substrate 10 is reliably positioned by being suctioned and fixed by the suction pad.

  Next, the image pickup means 2 slides in the X direction on the linear drive means 3 together with the base, performs focusing at every predetermined point, and an enlarged image is picked up. Also, the imaged image data (differential interference image) is sent to an information processing means (not shown), and the quality of the mounted state of the imaged inspection object part is determined.

  In the information processing means, the image data input from the imaging means 2 is converted by a predetermined calculation program corresponding to the inspection item (for example, into luminance distribution data based on a 256 gradation luminance scale). And is compared with the reference data set for each inspection item, and those that deviate from the reference are detected as defective.

  The information processing means is provided with an optimum focal length calculation unit and an optimum focal length storage unit as part of a calibration system for focusing described below. That is, according to this system, when sequentially inspecting the panel substrate 10 such as the LCD panel, the first panel substrate 10 is subjected to imaging for focusing before the inspection at the same inspection point. Repeated multiple times, calculates the optimum focal length based on the obtained image data, adjusts the imaging means 2 (the objective lens 2a thereof) in the Z direction according to the value, and performs focusing in that state. In addition, the information processing means stores the optimum focal length calculated at the time of focusing.

  Then, in the next and subsequent inspections, the focal length is not narrowed down from a separately set reference value or a random value, but the predicted optimum focal length is determined from the stored optimum focal length according to a predetermined algorithm. And a system for determining the initial position of the image pickup means 2 in the Z direction according to the distance and automatically focusing from that position.

  In addition, in the process of repeating the inspection one after another, the optimum focal length at the time of focusing is stored, and the variation tendency of the shape of the panel substrate 10 to be inspected can be grasped from the stored optimum focal length. Therefore, if a certain tendency is extracted from the variation in the optimum focal length stored before the previous time, and the prediction optimum focal length is derived by adding a correction corresponding to the variation, the target is subject to repeated inspections. Thus, it is possible to perform focusing more quickly according to the variation tendency of the chip mounting portion.

  With the configuration described above, the substrate inspection apparatus according to the present embodiment is supported so that the end portion 10a of the panel substrate 10 is lifted from the lower side at a position close to the edge portion. The warpage and distortion of 10a can be suppressed, and the end portion 10a of the panel substrate 10 that is the inspection target portion can be reliably set at the same position (height) every time.

  In addition, since the vibration generated by the movement of the moving stage 1 is quickly absorbed by the fixed stage 4 and there is little vibration transmitted to the panel substrate end 10a, the substrate inspection apparatus according to the present embodiment inspects these warpages and vibrations. It is possible to improve the reproducibility and accuracy of the inspection of the mounting state while minimizing the adverse effect on the device.

  Then, the inspection target part of the panel substrate 10 is set at the same position every time, and the vibration due to the movement of the moving stage 1 is quickly converged. The standby time is short, and further, the time required for focusing at the time of imaging is short due to the calibration system for focusing. Therefore, the substrate inspection apparatus in the present embodiment can speed up a series of these inspection operations (processes) compared to the conventional art.

  Note that this substrate inspection apparatus has an advantage that the warp and distortion that differ from panel to panel can be corrected to some extent because the fixing stage 4 sucks and fixes the end 10a of the panel substrate 10.

  Further, since the fixed stage 4 is formed in a bar shape extending along the sliding direction of the image pickup means 2, the inspection target end portion of the panel substrate 10 can be supported collectively over the entire width, which is preferable. It is. Further, by making the length of the bar-shaped fixed stage 4 larger than the length of the panel substrate 10 of the maximum size assumed as an inspection target, various sizes of panels can be obtained without replacing the moving stage 1. The substrate 10 can be easily handled.

  Next, as a second embodiment, an example in which the substrate inspection apparatus of the present invention is incorporated as part of an actual chip mounting process (line) will be described.

  FIG. 3 is a diagram schematically showing the configuration and operation of the substrate inspection apparatus according to the second embodiment of the present invention.

  The substrate inspection apparatus according to the present embodiment is also arranged and incorporated in a part of a process (line) for mounting a chip-shaped electronic component or module with an anisotropic conductive film interposed in the workpiece W. The substrate inspection apparatus (AOI) transports a flat display panel (FDP) on which a plurality of chip-shaped electronic components and modules are mounted at a predetermined position of the workpiece W on the upstream side of the process (left side in FIG. 3). The arm 12 is used to be taken into the apparatus main body, transferred to the moving stage 1, 1 'with the suction pad, and sucked and fixed. Then, the moving stage 1, 1' is moved to a predetermined inspection position, The above-described chip mounting portion on the mounted FDP is imaged by the imaging means 2 and 2 ′ with a differential interference microscope function.

  The substrate inspection apparatus is provided with two inspection lines in parallel so that two workpieces W can be inspected simultaneously in parallel. Therefore, the moving stage (1, 1 ') and the imaging means (2, 2') are equipped with two sets (two sets). Moreover, although the fixed stage (4) which supports the test | inspection end part of the workpiece | work W from the lower side is also provided like 1st Embodiment, it is not separate for each of these inspection lines, and is common to two inspection lines. It is formed as a bar-shaped fixed stage 5.

Next, the operation (workflow) of the substrate inspection apparatus (AOI) will be described.
The substrate inspection apparatus has a plurality of chips at predetermined positions on a flat display panel (FDP) by means of an anisotropic conductive film pasting apparatus and a chip crimping apparatus (not shown) located upstream of the process (left side in FIG. 3). A workpiece W on which a shaped electronic component, module, or the like is mounted is taken into the main body of the apparatus using the transfer arm 12 (A → B position or A → B ′ position), and can be moved in two directions XY and in the Z direction. After the height adjustment and transfer to the movable stage with suction pad 1 and 1 'rotatable around the θ axis, the center of each panel is sucked and fixed by the suction pad on the upper surface of the moving stage 1 (B, B' position).

  Then, with the panels supported at the center, the panels are slightly lifted in the Z direction, and the moving stages 1, 1 ′ are slid in the XY directions, so that the chip mounting portion of the work W is moved to the imaging means 2, 2 ′. To a position facing above the slide position. An alignment mark or the like on the workpiece W is recognized by a panel position confirmation unit such as a CCD camera (not shown), and the XY direction position and the rotation angle of the θ axis of each moving stage 1, 1 ′ are finely adjusted to the correct position. The moving stages 1 and 1 ′ are lowered, and each workpiece W is positioned at an accurate inspection position (C and C ′ positions in FIG. 3).

  At this time, as in the first embodiment, the end portion (chip mounting portion) that is the inspection target portion of the workpiece W is located near the imaging means 2 and 2 ′ at the lower side of the panel by the bar-shaped fixing stage 5. In addition, the workpiece W is attracted and fixed by a suction pad provided on the upper surface thereof, so that the positioning of each workpiece W is ensured.

  Next, each imaging means 2, 2 'slides in the X direction on a linear drive means (not shown) together with its base, and each imaging means 2, 2' independently focuses at a predetermined point (focus). Alignment is performed, and an enlarged image of each examination target part is taken. Further, the imaged image data (differential interference image) is sent to an information processing unit (not shown), and the quality of the chip mounting state of the imaged inspection target part is determined.

  Note that the inspection target region is not limited to one side of the workpiece W. When inspecting the mounting part formed on the other side of the workpiece W, the suction by the bar-shaped fixed stage 5 is released, the panel is lifted slightly in the Z direction, and then the movement of the moving stage 1 and the θ-axis rotation are performed. Thus, a new end portion to be inspected is set. Further, after the alignment mark on the workpiece W is recognized by the panel position confirmation means, and the XY direction position and θ angle of each moving stage 1, 1 ′ are finely adjusted to the correct position, the moving stage 1, 1 ′. Is lowered again, and each workpiece W is positioned at a new inspection position. This operation is repeated until each side to be inspected is completed.

  When the determination of all the inspection target parts of the workpiece W is completed, the comprehensive determination of the chip mounting state regarding the workpiece W is determined and stored in the information processing means. Then, each workpiece is released from the suction by the bar-shaped fixed stage 5, returned to the B and B ′ positions, which are the initial standby positions of the moving stages 1 and 1 ′, transferred again to the transfer arm 12, and It is transferred to the determination standby position (D position) on the downstream side (right side in FIG. 3).

  Thereafter, the workpiece W determined to be “Good” by the information processing means is transferred to the unloader on the downstream side of the process as it is, and further processing such as post-processing is further performed. Further, the work W determined to be “defective product (NG)” by the information processing means is stored in a multistage defective product shelf (NG rack) 13 provided on the downstream side of the substrate inspection apparatus. Collected and discarded or reused (F position in FIG. 3).

  Also with the above configuration, the substrate inspection apparatus of the present embodiment can suppress warpage and distortion that differ for each workpiece W, and reliably set the inspection target end of the workpiece at the same position (height) each time. be able to. Further, the vibration of each of the moving stages 1 and 1 ′ is prevented from being transmitted to the workpiece W, and the reproducibility and accuracy of the mounting state inspection can be improved.

  In the substrate inspection apparatus according to the present embodiment, the vibration due to the movement of the moving stages 1 and 1 ′ is quickly converged, the waiting time from when the workpiece W is set to when the imaging operation is started is short, and the inspection line is duplicated. Thus, the substrate can be inspected more efficiently.

  Further, in the substrate inspection apparatus of the present embodiment, since the fixed stage 5 is formed in a bar shape extending along the sliding direction of the imaging means 2 and 2 ′, the inspection target end portion of the workpiece W is set to the full width. Can be supported at once. Further, the bar-shaped fixed stage 5 can easily correspond to panels of various sizes without exchanging the moving stages 1 and 1 '.

  In addition, according to the board | substrate inspection apparatus of the said 2nd Embodiment, the curvature of the edge part of the LCD module conventionally seen about 200-400 micrometers by crimping | bonding of an IC chip is reduced to 100 micrometers or less by adsorption | suction of the bar-shaped fixed stage 5. I was able to.

  In the above-described two embodiments, an example in which one imaging unit 2 (2 ′) is provided for each inspection line is shown. However, a plurality of imaging units 2 may be provided for each inspection line. good. In the case where a plurality of inspection lines are provided for each inspection line (X direction), it is preferable to adjust the arrangement interval to the mounting interval of the workpiece W or the chip mounted on the panel substrate 10. When the intervals are synchronized, it is possible to simultaneously run these imaging means and to image a plurality of locations simultaneously, so that the inspection can be completed in a shorter time.

  Further, the image pickup means 2 may be provided not only in the X direction but also in the Y direction alone or in a plurality of Y directions. With this configuration, the inspection can be completed in a very short time as a whole. Needless to say, a fixed stage is also provided in the vicinity of the imaging means 2 provided in the Y direction to support the workpiece W or the end of the panel substrate 10 to be inspected (Y direction).

  The substrate inspection apparatus of the present invention is a chip-like electronic component (such as a liquid crystal display (LCD) panel, a plasma display panel (PDP), an organic EL display) on a large transparent glass substrate via an anisotropic conductive film (ACF). It is suitable for inspecting a panel to which an IC, an LSI, etc.), a module, etc. are bonded.

DESCRIPTION OF SYMBOLS 1 Moving stage 1a Upper surface 2 Imaging means 3 Linear drive means 4 Fixed stage 10 Panel substrate

Claims (3)

  A transparent stage substrate on which electronic components are mounted via anisotropic conductive films at a plurality of positions in the vicinity of the end portion is placed on the upper surface, moved to a predetermined inspection position, and a moving stage for positioning the substrate An imaging unit for imaging an inspection target site on which the electronic component is mounted, through the substrate from the back side of the surface on which the electronic component is mounted, and obtaining a differential interference image of the site; and Based on the linear drive means that slides along each inspection target part of the substrate positioned at the inspection position and the image data obtained from the imaging means, whether the mounting state of the imaged inspection target part is good or bad Information processing means for determining, and placing the substrate on the upper surface of the moving stage in a state where at least one substrate end including the inspection target portion protrudes to the side of the moving stage. A substrate inspection device, in the vicinity of the imaging means, a substrate inspection apparatus characterized by fixed stage for supporting the edge of the substrate projecting from the movable stage from the lower side is disposed.   The substrate inspection apparatus according to claim 1, wherein the fixed stage is formed in a bar shape extending along a sliding direction of the imaging unit.   The substrate inspection apparatus according to claim 1, wherein the fixing stage includes suction means for sucking and fixing the panel substrate.

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