JP2018056218A - Mounting device for electronic component having bumps, and mounting method for electronic component having bumps - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting method for an electronic component having bumps and a mounting method for an electronic component having bumps, which are capable of efficiently performing setting processing of inspection parameters used in inspection of a transferred state of transfer material, while eliminating variance due to individual differences.SOLUTION: A mounting method of an electronic component having bumps includes: capturing and acquiring an inspection image while illuminating with light a component having bumps to which flux is transferred; inspecting a flux transferred state after detecting flux from the inspection image using a threshold; and mounting the component having bumps on a substrate. In the method, prior to the mounting of the component having bumps, an image before transfer for the component having bumps before transferring flux on the bumps and an image after transfer therefor after transferring flux on the bumps are captured for plural times while changing conditions of light illuminated on the component having bumps. Then, by comparing brightness of the bumps in the images before transfer with brightness of the bumps in the images after transfer, illumination condition used in the inspection in the transferred state is set.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a bumped electronic component mounting apparatus and a bumped electronic component mounting method for mounting a bumped electronic component on a substrate.

  As electronic component mounting forms, there are known electronic components with bumps, such as BGA (Ball Grid Array) and CSP (Chip Size Package), in which bumps that are metal electrodes are formed on a bonding surface with a substrate. In an electronic component mounting apparatus with bumps used in the mounting process of these electronic components with bumps, a transfer material such as a flux or a solder material is transferred to the bumps in order to improve the bondability between the bumps and the electrodes of the substrate. The transfer material is transferred by lowering an electronic component with bumps onto a coating film such as a flux supplied in a film formation state to the transfer material supply device and bringing the bumps into contact with the coating film. Then, after the transfer, it is inspected by image recognition whether or not a predetermined amount of the transfer material has been normally transferred to a predetermined range of the bump (see, for example, Patent Documents 1, 2, and 3).

  In the prior art disclosed in Patent Document 1, the diameter d of the flux 20b is obtained by recognizing the result of imaging the component 20 illuminated by the illumination light 21 after the flux 20b is transferred to the bump portion 20a of the component 20. The flux transfer amount is inspected, and the component center is calculated from the diameter D of the bump portion. Further, in the prior art disclosed in Patent Document 2, the brightness of the solder ball electrode is detected by detecting the brightness of the solder ball electrode by imaging the image of the solder ball electrode surface of the electronic component onto which the flux has been transferred, with the illumination unit 103 illuminated. The quality of the transferred flux is determined by comparing the luminance with a predetermined threshold value. Furthermore, in the prior art disclosed in Patent Document 3, reflected light obtained by irradiating illumination light to a bump 16A of the flip chip component 10 by a coaxial illumination device capable of irradiating parallel light 60 from the vertical direction is used as an imaging mechanism such as a CCD camera. The example which detects the transcription | transfer state of a flux using the imaging information caught by (1) is described.

JP 2003-60398 A JP 2007-281024 A JP 2008-41758 A

  In any of the above-described prior arts, the transfer state is inspected by recognizing an image acquired in a state where the inspection object is illuminated under a preset illumination condition. This transfer state inspection is performed by performing binarization processing on the acquired image to detect the transferred region by identifying the transferred region from the other region and transferring the transferred material. It is determined whether or not the range satisfies a predetermined determination condition, that is, an allowable condition such as a transfer area or a transfer position deviation.

  In order to obtain an accurate inspection result in the determination of such a transfer state, in order to obtain a good recognition image suitable for the inspection purpose by performing imaging under appropriate illumination conditions and appropriately perform binarization processing It is required to correctly set the threshold value. For this reason, conventionally, parameter setting processing for setting appropriate illumination conditions and threshold values as inspection parameters has been performed as an essential operation. This parameter setting processing work has been conventionally performed by a manual operation by an operator. In other words, the electronic components with bumps to be subjected to the determination process are imaged under a plurality of different illumination conditions for each of the pre-transfer state and the post-transfer state, and the pre-transfer state and the post-transfer state obtained from the image obtained by the imaging Based on the luminance information, an illumination condition suitable for identifying the region where the transfer material exists from other regions by binarization processing is selected, and a threshold value applied to the binarization processing is set.

  However, such a parameter setting process by manual operation requires a complicated work operation of recording and processing data obtained by performing a plurality of times of imaging before and after transfer of the transfer material. Therefore, there is a problem that it takes a lot of labor and time to set the inspection parameters such as illumination conditions and thresholds. Furthermore, since these work operations are usually performed by one worker, setting results are likely to vary depending on the worker, and it is difficult to stably set appropriate inspection parameters. As described above, in the bumped electronic component mounting apparatus and the bumped electronic component mounting method according to the related art, the setting process of the inspection parameter used for the inspection of the transfer state of the transfer material is efficiently performed without variation due to individual differences. There was a problem that it was difficult to do.

  Accordingly, the present invention provides a bumped electronic component mounting apparatus and a bumped electronic component mounting method capable of efficiently performing inspection parameter setting processing used for inspection of a transfer state of a transfer material while eliminating variations due to individual differences. The purpose is to provide.

  The bumped electronic component mounting apparatus according to the present invention is a bumped electronic component mounting apparatus that transfers a transfer material onto a plurality of bumps of a bumped electronic component and mounts the bumped electronic component on the substrate. A component supply unit, a mounting head for taking out the electronic component with bump supplied from the electronic component supplying unit with bump and mounting it on the substrate, and a plurality of bumps of the electronic component with bump held by the mounting head are transferred to Image for inspection by imaging a transfer material supply device that supplies a transfer material in the form of a film and an electronic component with bumps in which the transfer material is transferred to a plurality of bumps while irradiating light under illumination conditions included in the inspection parameters An inspection device that detects a transfer material from the image for inspection using a threshold value included in an inspection parameter and inspects a transfer state of the transfer material, and the inspection device includes: A sample image acquisition unit that executes the acquisition of the pre-transfer image of the electronic component with bump before the transfer material is transferred to the bump and the post-transfer image after the transfer material is transferred a plurality of times while changing illumination conditions And an inspection parameter setting unit for setting illumination conditions used in the inspection of the transfer state by comparing the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image.

  According to the bumped electronic component mounting method of the present invention, the bumped electronic component held by the mounting head is brought into contact with the deposited transfer material to transfer the transfer material to a plurality of bumps. The image is acquired while irradiating the part with light, an inspection image is obtained, the transfer material is detected from the inspection image using a threshold value, and the transfer state of the transfer material is inspected. An electronic component mounting method with bumps for mounting an electronic component with a bump on a substrate, prior to the mounting of the electronic component with bumps, the pre-transfer image of the electronic component with bumps and the transfer material transferred before the transfer material is transferred to the bumps After the transfer, the post-transfer image is acquired a plurality of times while changing the illumination condition of the light applied to the electronic component with bump, and the brightness of the bump in the pre-transfer image is compared with the brightness of the bump in the post-transfer image. Set the illumination conditions used in the inspection of the transfer state by the time of mounting the electronic component with bumps acquires the test image using the lighting conditions set.

  According to the present invention, it is possible to efficiently perform inspection parameter setting processing used for inspection of a transfer state of a transfer material while eliminating variations due to individual differences.

The top view of the electronic component mounting apparatus with bump of one embodiment of this invention The perspective view of the flux supply unit in the electronic component mounting apparatus with bump of one embodiment of this invention Functional explanatory drawing of the flux supply unit in the electronic component mounting apparatus with bump of one embodiment of the present invention Structure explanatory drawing of the recognition unit in the electronic component mounting apparatus with bump of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus with bump of one embodiment of this invention The flowchart which shows the electronic component mounting method with a bump by the electronic component mounting apparatus with a bump of one embodiment of this invention Flow chart of inspection parameter automatic setting processing in bumped electronic component mounting method of one embodiment of the present invention The image figure which shows the sample image (the image before transcription | transfer and the image after transcription | transfer) for the inspection parameter setting in the electronic component mounting method with bumps of one embodiment of this invention Explanatory drawing of the illumination condition data used for acquisition of the sample image for the inspection parameter setting in the electronic component mounting method with bumps of one embodiment of the present invention Explanatory drawing of the brightness measurement result data of the sample image for an inspection parameter setting in the electronic component mounting method with bumps of one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, a bumped electronic component mounting apparatus according to the present embodiment will be described with reference to FIG. The bumped electronic component mounting apparatus 1 is a bumped electronic component P having a plurality of bumps such as a BGA (Ball Grid Array) (see FIGS. 2 and 3..., Simply abbreviated as “bumped component P” hereinafter). It has a function to be mounted on the substrate 2. A substrate transport mechanism 3 is disposed in the X direction (substrate transport direction) on the base 1 a of the bumped electronic component mounting apparatus 1. The substrate transport mechanism 3 transports the substrate 2 to be mounted in the X direction and positions it at a predetermined mounting work position.

  Component supply units 4A and 4B are disposed on both sides of the substrate transport mechanism 3. A tray feeder 5 and a flux supply unit 6 for supplying the bumped component P stored in the tray 5a are mounted in parallel in the X direction on the one-side component supply unit 4A. Therefore, the component supply unit 4A is a bumped electronic component supply unit that supplies bumped electronic components. A plurality of tape feeders 7 for supplying small components such as chip components held on a carrier tape are set in the other component supply section 4B.

  In FIG. 2, the flux supply unit 6 supplies, in the state of a coating film, flux 8 that is a transfer material transferred to a plurality of bumps Pa (see FIG. 3) of a bumped component P held by a mounting head 11A described later. It has a function. The flux 8 is a viscous fluid having an action of removing an oxide film adhering to the surface of the bump Pa (FIG. 3A) and the surface of the electrode of the substrate 2 connected to the bump Pa when mounting the component.

  In FIG. 1, a Y-axis moving mechanism 9 having a linear drive mechanism is disposed at one end of the base 1a in the X direction in the Y direction perpendicular to the X direction in the horizontal plane. Similarly, two X-axis moving mechanisms 10A and 10B each having a linear drive mechanism are coupled to the Y-axis moving mechanism 9 so as to be movable in the Y direction. Mounted heads 11A and 11B are mounted on the X-axis moving mechanisms 10A and 10B so as to be movable in the X direction. By driving the Y-axis moving mechanism 9 and the X-axis moving mechanism 10A, the mounting head 11A moves horizontally in the XY directions. Similarly, by driving the Y-axis moving mechanism 9 and the X-axis moving mechanism 10B, the mounting head 11B moves horizontally in the XY direction.

  1 and 2, the mounting heads 11A and 11B are provided with a plurality of component holding heads 11a. The component holding head 11a includes a suction nozzle 12 capable of sucking the bumped component P at the lower end, and the suction nozzle 12 can be individually moved in the vertical direction (Z direction) by a nozzle lifting mechanism (not shown). Yes. The mounting head 11A picks up the bumped component P supplied from the tray feeder 5 of the component supply unit 4A, which is a bumped electronic component supply unit, by the suction nozzle 12 and mounts it on the substrate 2 positioned at the mounting work position. Has the function of The mounting head 11B has a function of sucking the component supplied from the tape feeder 7 by the suction nozzle 12 and mounting the component on the substrate 2 positioned at the mounting work position. In the above configuration, the Y-axis moving mechanism 9, the X-axis moving mechanisms 10A and 10B, and the mounting heads 11A and 11B take the component P with bumps and the chip component from the component supply units 4A and 4B and transfer and mount them on the substrate 2. Configure the mechanism.

  In FIG. 1, a board recognition camera 14 is disposed on the mounting heads 11A and 11B with the imaging direction facing downward. The substrate recognition camera 14 moves integrally with the mounting heads 11A and 11B, and images the substrate 2 from above. Further, a recognition unit 15 is disposed between the component supply units 4A and 4B and the board transport mechanism 3 in the base 1a. The recognition unit 15 picks up images of components such as a bumped component P and a chip component held by the mounting heads 11A and 11B moving above from below.

  Next, the structure and function of the flux supply unit 6 will be described with reference to FIGS. The flux supply unit 6 is a transfer material supply device that supplies a flux 8 as a transfer material to be transferred to a plurality of bumps Pa of the bumped component P held by the mounting head 11A in a film shape. The base part 20 is provided with each part described below. In addition to the flux 8, a flux containing metal particles or an adhesive may be used as the transfer material.

  The base unit 20 is detachably mounted on a feeder base (not shown) provided in the component supply unit 4A from the opposite side of the access direction of the mounting head 11A indicated by an arrow a with the longitudinal direction aligned with the Y direction. In this specification, the side on which the mounting head 11A accesses the flux supply unit 6 is defined as the front side, and the opposite direction is defined as the rear side. The flux supply unit 6 is provided with an engaging portion 20a that engages with the feeder base and fixes the base portion 20, and a handle 21 protrudes rearward from the engaging portion 20a. When the flux supply unit 6 is mounted on the feeder base, the lower surface side of the base portion 20 is aligned with the upper surface of the feeder base, and the handle 21 is gripped and pushed forward. Thereby, the engaging part 20a engages with the rear end part of the feeder base, and the base part 20 is mounted at a predetermined position.

  A stage 24 whose longitudinal reciprocation is guided by a guide rail 22 is disposed on the upper surface of the base portion 20. The stage 24 includes a stage drive mechanism including a motor 25, a feed screw 26, and a nut member (not shown) coupled to the lower surface of the stage 24 and screwed into the feed screw 26, and drives the motor 25 forward and backward. As a result, the stage 24 reciprocates in the longitudinal direction (Y direction). The stage 24 has a structure in which a concave portion having a smooth bottom surface is formed on the upper surface side of a rectangular member, and the bottom surface of the concave portion is a coating film forming surface 24a for forming a coating film of the flux 8 (FIG. 3). reference).

  A gate-shaped bracket 27 is disposed on the upper surface of the base portion 20 so as to straddle the stage 24, and a squeegee unit 28 is held on the bracket 27. As shown in FIG. 3, the squeegee unit 28 includes a squeegee 28a that extends downward and has a lower end portion disposed with a coating film forming gap g between the coating film forming surface 24a. With the flux 8 being supplied to the coating film forming surface 24a, the stage 24 is moved in the film forming operation direction (arrow b) as shown in FIG. A coating film of flux 8 having a coating film thickness corresponding to the film forming gap g is formed. The height position of the squeegee unit 28 with respect to the stage 24 is variable, and the coating thickness of the formed flux 8 can be adjusted to a desired thickness.

  A scraping portion 29 is disposed behind the squeegee unit 28, and the scraping portion 29 includes a scraper 29a extending downward and having a lower end portion in contact with the coating film forming surface 24a. The scraper 29a is urged by the coating film forming surface 24a and is always in contact with the coating film forming surface 24a. By moving the stage 24 in a state where the scraper 29a is in contact with the stage 24, the flux 8 on the coating film forming surface 24a is scraped to one side by the scraper 29a. A supply needle 30a for guiding the flux 8 supplied from the syringe 30 to the coating film forming surface 24a is inserted and disposed between the squeegee unit 28 and the scraping portion 29.

  The mounting head 11A moves to the flux supply unit 6 while the mounting head 11A, which has taken out the bumped component P from the tray 5a of the tray feeder 5 of the component supply unit 4A, moves above the recognition unit 15. As shown in FIG. 3A, the bumped component P held by the suction nozzle 12 of the component holding head 11a is lowered with respect to the stage 24 on which the flux 8 is formed (arrow c). Next, when the component holding head 11a is lifted after the bump Pa of the bumped component P is brought into contact with the flux 8 (arrow d), the flux Pa is applied to the bump Pa of the bumped component P as shown in FIG. Is transferred.

  The component holding head 11 a that holds the bumped component P after the flux 8 has been transferred to the bump Pa in this way moves above the recognition unit 15. Here, the bumped component P is imaged by the recognition unit 15, and the image acquired by the imaging is recognized by the recognition unit 40 (see FIG. 5), thereby checking the transfer state of the flux 8 in the bumped component P. Done. In this transfer state inspection, a predetermined criterion (for example, whether the transfer area of the flux 8 transferred to the bumped component P is equal to or larger than the reference value, and whether the bias of the transfer position is within an allowable range, etc.) ) Is determined based on the above.

  FIG. 4 shows the configuration of the recognition unit 15 used for the inspection of the transfer state. The imaging unit 15a of the recognition unit 15 includes an illumination unit 31, a half mirror 32, and a camera 33. With this configuration, the bump Pa of the bumped component P held by the suction nozzle 12 of the component holding head 11a positioned above. Image. The camera 33 receives imaging light incident from above, and acquires an optical image formed by the lens 33a as digital image data by the imaging element 33b. The acquired image is a target of recognition processing by the recognition processing unit 44 of the recognition unit 40.

  The illumination unit 31 irradiates the bumped component P to be imaged with illumination light. Here, the illumination unit 31 includes a backlight illumination 31a, a side illumination 31b, and a coaxial illumination 31c that emit light from different directions. The backlight illumination 31a irradiates light to the background surface 12b provided on the lower surface of the flange 12a of the suction nozzle 12, and the reflected light is transmitted downward from the back surface of the bumped component P to be imaged. Light is received by the camera 33 as imaging light. The side illumination 31b emits light obliquely from below to the lower surface of the bumped component P that is an imaging target, and the camera 33 receives the reflected light as imaging light.

  Further, the coaxial illumination 31 c irradiates illumination light from the lateral direction to the half mirror 32 disposed in an oblique posture above the camera 33. This illumination light is reflected upward by the half mirror 32 and is incident on the lower surface of the bumped component P from the direction coaxial with the optical axis of the camera 33. Then, the reflected light from which the illumination light is reflected downward is transmitted through the half mirror 32 and received by the camera 33 as imaging light. In the imaging for inspection of the transfer state shown in the present embodiment, an example is shown in which an inspection image is acquired using only the side illumination 31b and the coaxial illumination 31c.

  Next, the configuration of the control system of the bumped electronic component mounting apparatus 1 will be described with reference to FIG. Here, among the components of the bumped electronic component mounting apparatus 1, the bumped component P held by the mounting head 11A and the chip component held by the mounting head 11B are recognized, and the flux in the bump Pa of the bumped component P is shown. Only the elements related to the inspection of the transcription status of 8 are described.

  In FIG. 5, the recognition unit 40 is connected with a camera 33, a backlight illumination 31a, a side illumination 31b, and a coaxial illumination 31c constituting the illumination unit 31. The recognition unit 40 includes an image storage unit 41, an illumination control unit 42, a camera control unit 43, a recognition processing unit 44, an inspection parameter setting unit 45, and a parameter storage unit 46. The recognition unit 40 is connected to a mounting machine control unit 47, and the mounting machine control unit 47 is further connected to a display unit 48 and an operation / input unit 49.

  The image storage unit 41 stores an image acquired by capturing with the camera 33. The illumination control unit 42 controls ON / OFF of the backlight illumination 31a, the side illumination 31b, and the coaxial illumination 31c of the illumination unit 31 and the brightness of the illumination light during imaging by the recognition unit 15. At this time, during the normal operation in which the bumped component P is taken out from the mounting head 11A and mounted on the substrate 2, the illumination unit 31 is controlled based on the illumination conditions included in the normal operation inspection parameters stored in the parameter storage unit 46. To do. In the teaching operation for acquiring the inspection parameters used for the inspection of the transfer state, the illumination unit 31 is based on the illumination conditions for teaching operation stored in the inspection parameter setting unit 45 (see the illumination condition data 50 shown in FIG. 9). To control.

  The camera control unit 43 aims at imaging processing by the camera 33, that is, component recognition during normal operation, imaging for inspection of the transfer state of the flux, and acquisition of a sample image during teaching operation performed for setting inspection parameters. Control imaging. The imaging result is stored as image data in the image storage unit 41. The recognition processing unit 44 recognizes the position and state of the electrode of the chip component and the bump Pa of the bumped component P by performing a recognition process on the image data stored in the image storage unit 41. It also has a function of inspecting the quality of these recognized parts and inspecting the transfer state of the flux 8 transferred to the bumps Pa. These recognition results and inspection results are transferred to the mounting machine control unit 47 and displayed on the display unit 48 as necessary.

  The mounting machine control unit 47 performs control for executing a component mounting operation on the substrate 2 by the bumped electronic component mounting apparatus 1, that is, the substrate transport mechanism 3 and the component supply units 4A and 4B, the above-described component mounting mechanism, and flux supply. Control for each unit such as unit 6 is performed. In this control, the recognition result of the component transferred from the recognition processing unit 44 and the inspection result of the transfer state of the flux 8 are reflected. That is, the result of component recognition is reflected in the position correction at the time of component mounting by the component mounting mechanism, and the bumped component P that is determined to be defective in the transfer state by the inspection of the transfer state is excluded from the mounting target on the substrate 2, and the defective component It is excluded and collected as.

  The display unit 48 is a display device such as a liquid crystal panel, and performs the above-described component recognition results, transfer state inspection results, and various operation instructions and data input operations when operating the bumped electronic component mounting device 1. To display the operation screen. The operation / input unit 49 is an input device such as a touch panel or a pointing device incorporated in the display unit 48, and performs the above-described operation instruction and data input operation.

  The inspection parameter setting unit 45 has a function of executing processing for setting inspection parameters applied to the inspection of the transfer state of the flux 8. The inspection parameters include an illumination condition in imaging by the camera 33 for acquiring an inspection image, and a threshold value used for detecting the flux 8 by the recognition processing mechanism of the recognition processing unit 44 from the acquired inspection image. It is. This inspection parameter setting mode is either manual operation in which an operator manually sets an inspection parameter or automatic setting in which an inspection parameter is automatically set by a parameter setting processing function provided in the inspection parameter setting unit 45. You can choose.

  When manual operation is performed, an operation screen for setting inspection parameters is displayed on the display unit 48, and the operator manually inputs a parameter value on the displayed operation screen. When automatic setting is selected, a sample image that is an inspection parameter setting image described below is acquired, and illumination conditions and threshold values that are inspection parameters are automatically set based on the acquired sample image. The inspection parameter automatic setting process to be performed is executed. The inspection parameters set in this way are transferred to and stored in the parameter storage unit 46. In the inspection of the transfer state of the flux 8 by the inspection device described below, the inspection parameters stored in the parameter storage unit 46 are referred to. Is done.

  In the configuration shown in the present embodiment, the recognition unit 15 and the recognition unit 40 shown in FIG. 5 are configured so that the bumped part P in which the flux 8 as the transfer material is transferred to the plurality of bumps Pa includes the illumination condition included in the inspection parameter. The inspection apparatus is configured to acquire an inspection image by irradiating with light, detect a flux 8 from the inspection image using a threshold value included in the inspection parameter, and inspect the transfer state of the flux 8.

  This inspection apparatus uses a sample image used for automatic setting of inspection parameters, that is, an image before transfer of the bumped part P before the flux 8 is transferred to the bump Pa and a transfer after the flux 8 is transferred to the bump Pa. It is configured to include a sample image acquisition unit that executes the acquisition of the subsequent image a plurality of times while changing the illumination condition. In the configuration shown in FIG. 5, the camera 33, the illumination unit 31, the illumination control unit 42, and the camera control unit 43 are sample image acquisition units. The inspection parameter setting unit 45 has a function of setting the illumination condition used in the inspection of the transfer state by comparing the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image.

  Next, details of the inspection parameter automatic setting process executed by the inspection parameter setting unit 45 will be described with reference to FIGS. 8, 9, and 10. FIG. In the inspection parameter automatic setting process, sample images shown in FIG. 8 are first acquired. That is, the pre-transfer image 34a of the bumped component P before the flux 8 is transferred to the bump Pa shown in FIG. 8A and the post-transfer after the flux 8 is transferred to the bump Pa shown in FIG. 8B. The acquisition of the image 34b is executed a plurality of times while changing the illumination conditions.

  FIG. 9 shows illumination condition data 50 that defines details of a plurality of (in this case, 100) illumination conditions used in acquiring the sample image. The illumination condition data 50 corresponds to an “illumination condition” 51 that individually specifies a plurality of illumination conditions by an illumination condition number (1, 2,... 100) and a “lamp value” 52 applied in the illumination condition. It has a data structure. Here, the lamp value is numerical data defining the brightness of the illumination light when the lighting device is turned on.

  The “lamp value” 52 is “backlight illumination” 52a for each individual illumination (backlight illumination 31a, side illumination 31b, coaxial illumination 31c shown in FIG. 4) that is turned on when the illumination light is emitted during imaging. “Side illumination” 52b and “Coaxial illumination” 52c are individually defined. That is, the illumination condition data 50 applied in the present embodiment includes a combination of illumination conditions for each individual illumination when irradiating illumination light using a plurality of individual illuminations as an illumination condition for acquiring a sample image. The data structure includes a lighting pattern. When acquiring the sample image, the illumination condition for turning on the illumination unit 31 shown in FIG. 4 is sequentially switched according to the illumination condition indicated by the “illumination condition” identification number 51, and the above-mentioned pre-transfer image 34a and post-transfer image 34b. Are sampled a plurality of times, and the acquired sample images are stored in the image storage unit 41.

  Next, determination of illumination conditions as inspection parameters, that is, illumination conditions applied for inspection of the transfer state of the flux 8 will be described. As described above, the illumination condition is determined by measuring the brightness of the bumps in each of the pre-transfer image 34a shown in FIG. 8A and the post-transfer image 34b shown in FIG. This is done by comparing the brightness of the bumps. The measurement of the brightness in the bump and the comparison of the brightness are as follows: “illumination condition” 51 defined in the illumination condition data 50 of FIG. .. performed for each individual lighting condition specified by The brightness of the bump in the pre-transfer image 34a is measured at a bright portion in the area where the bump exists in the pre-transfer image 34a. Although it depends on the state of illumination light, in the case of a spherical bump, the central portion of the bump is often bright, so the brightness of the central portion of the bump is taken as the brightness of the bump.

  The pre-transfer image 34a shown in FIG. 8A includes an image of the bumped component P in a state where the flux 8 is not transferred to the bump Pa. By recognizing the pre-transfer image 34 a by the recognition processing unit 44, all of the plurality of bumps Pa (i) (subscript i indicates the i-th bump Pa among the total number of bumps). The brightness A1 (i) of the bump is detected. The brightness A1 (i) of the bump is the brightness of a bright portion in the area where the bump exists in the pre-transfer image 34a. Although it depends on the state of illumination light, in the case of a spherical bump, the central portion of the bump is often bright, so the brightness of the central portion of the bump is defined as the brightness A1 (i) of the bump. Then, based on the detected plurality of A1 (i), the brightness A1 representing the pre-transfer image 34a is obtained.

  Several variations are possible as a method for obtaining the brightness A1, and these are selected by appropriately selecting from these variations. First, in the first method, among the plurality of brightnesses A1 (i) detected for all the bumps Pa (i), the brightest brightness A1 is set as the brightness A1 representing the pre-transfer image 34a. In the second method, an average value of a plurality of brightnesses A1 (i) detected for all the bumps Pa (i) is obtained, and this average value is set as a brightness A1 representing the pre-transfer image 34a. Furthermore, in the third method, in the method of obtaining an average value of a plurality of brightnesses A1 (i) and representing it as a representative brightness A1, the range of the bump Pa (i) to be subjected to the average value calculation is set in advance. The range is limited. For example, the bump Pa that is the target of the average value calculation is limited to a bump Pa that exists within a predetermined range at the center of the bumped component P.

  The pre-transfer image shown in FIG. 8B includes an image of the bumped component P in a state where the flux 8 is transferred to the bump Pa. By performing recognition processing on the post-transfer image 34b by the recognition processing unit 44, the brightness A2 (i) of the bumps for all of the plurality of bumps Pa (i) (subscript i is the same as that of the pre-transfer image 34a). To detect. The brightness A2 (i) of the bump is the brightness of the portion where the flux is attached in the area where the bump exists in the post-transfer image 34b. Depending on the state of the illumination light, in the case of a spherical bump, flux often adheres to the center of the bump, so the brightness at the center of the bump is defined as the brightness A2 (i) of the bump. Then, based on the detected plurality of A2 (i), the brightness A2 representing the post-transfer image 34b is obtained.

  As a method of obtaining the brightness A2, several variations are possible as in the case of the above-mentioned pre-transfer image 34a, and the brightness A2 is appropriately selected and determined from these variations. First, in the first method, among the plurality of brightnesses A2 (i) detected for all the bumps Pa (i), the brightest A1 is set as the brightness A2 representing the pre-transfer image 34a. In the second method, an average value of a plurality of brightnesses A2 (i) detected for all the bumps Pa (i) is obtained, and this average value is set as a brightness A2 representing the pre-transfer image 34a. Further, in the third method, the average value of the plurality of brightnesses A2 (i) is obtained, and in the method of obtaining the representative brightness A2, the range of the bump Pa (i) that is the target of the average value calculation is set as described above. As in the case of the pre-transfer image 34a, the range is limited to a preset range.

  FIG. 10 shows measurement result data 60 in which the measurement results of brightness for the sample images (the pre-transfer image 34a and the post-transfer image 34b) are tabulated as described above. “Illumination condition” 61 corresponds to “illumination condition” 51 in the illumination condition data 50 shown in FIG. 9, and a plurality of illumination conditions are individually specified by illumination condition numbers (1, 2,... 100). ing.

  The measurement result of the brightness measured by the above-described method from the sample image acquired using these illumination conditions is made to correspond to each illumination condition specified by the “illumination condition” 61. “Measurement result” 62 is data indicating the measurement result of brightness. “Before flux transfer (A1)” 62a indicating brightness A1 obtained from the pre-transfer image 34a shown in FIG. 8A, FIG. “After flux transfer (A2)” 62b indicating the brightness A2 obtained from the post-transfer image 34b shown in b) is shown. The “difference (A1−A2)” 63 shows the difference (A1−A2) between the brightness A1 in the pre-transfer image 34a and the brightness A2 in the post-transfer image 34b.

  Next, a method for setting inspection parameters based on the measurement result data 60 will be described. First, in the “difference (A1-A2)” 63 of the measurement result data 60, an “illumination condition” 61 that maximizes the difference (A1-A2) is obtained. This “illumination condition” 61 is set to the illumination condition used in the inspection of the transfer state. That is, the inspection parameter setting unit 45 sets the illumination condition in which the difference between the brightness A1 of the bump in the pre-transfer image 34a and the brightness A2 of the bump in the post-transfer image 34b is the largest as the inspection parameter used in the inspection of the transfer state. Set to included lighting conditions.

  Next, similarly, setting of a threshold value included in the inspection parameter will be described. That is, brightness data (“before flux transfer (A1)” 62a, “after flux transfer (A2)” 62b) obtained under the illumination conditions set by the above-described method is obtained. Next, an intermediate value between the brightness A1 in the pre-transfer image 34a and the brightness A2 in the post-transfer image 34b thus determined is set as a threshold value for identifying whether the flux 8 is transferred and not transferred.

  That is, the inspection parameter setting unit 45 has an illumination condition in which the difference between the brightness A1 of the bump in the pre-transfer image 34a and the brightness A2 of the bump in the post-transfer image 34b is the largest, and the pre-transfer image 34a acquired under the illumination condition. The threshold value determined based on the brightness A1 of the bumps and the brightness A2 of the bumps in the post-transfer image 34b is set to the illumination condition and the threshold used in the inspection of the transfer state.

  In the above-described example, an example in which the illumination condition in which the difference between the brightness A1 of the bump in the pre-transfer image 34a and the brightness A2 of the bump in the post-transfer image 34b is the largest is set as the inspection parameter is shown. This setting example is a recommended example, and from a practical point of view, the illumination condition that maximizes the difference in the brightness of the bumps in the pre-transfer image 34a and the post-transfer image 34b needs to be set as the inspection parameter to be actually used. There is no. That is, in the inspection of the transfer state, it is sufficient for the purpose to be able to reliably identify the state in which the flux 8 is transferred and the state in which the flux 8 is not transferred on the inspection image, and the difference in brightness is not necessarily maximized. And not.

  Therefore, if the illumination difference satisfies the predetermined standard and the illumination condition can reliably identify the state where the flux 8 is transferred and the state where the flux 8 is not transferred on the inspection image, this illumination condition is set. It can be set as an inspection parameter. For example, a lower limit value of the brightness difference (A1-A2) that can reliably identify the state in which the flux 8 is transferred and the state in which the flux 8 is not transferred is set appropriately, and the pre-transfer image 34a, If the illumination condition is such that the difference in brightness of the bump (A1-A2) in the post-transfer image 34b is greater than or equal to this lower limit value, this illumination condition can be set as the inspection parameter.

  That is, in this case, the inspection parameter setting unit 45 illuminates such that the difference (A1−A2) between the bump brightness A1 in the pre-transfer image 34a and the bump brightness A2 in the post-transfer image 34b is equal to or greater than the above-described lower limit value. The conditions are set to the illumination conditions used for the transfer state inspection. By adopting such an illumination condition setting method, when the inspection parameters are set, the preset illumination conditions are included in the illumination conditions in which the difference (A1-A2) is equal to or greater than the above lower limit value. Has an advantage that the preset illumination conditions can be used as they are without changing the settings.

  The threshold value included in the inspection parameter is also set in the same manner as in the above example. That is, “before flux transfer (A1)” 62a and “after flux transfer (A2)” 62b obtained under the illumination conditions set by the above-described method are obtained. Next, an intermediate value between the brightness A1 in the pre-transfer image 34a and the brightness A2 in the post-transfer image 34b thus obtained is set as a threshold value for identifying whether the flux 8 is transferred or not transferred in the inspection image. .

  That is, the inspection parameter setting unit 45 includes the illumination condition in which the difference (A1-A2) between the brightness A1 of the bump in the pre-transfer image 34a and the brightness A2 of the bump in the post-transfer image 34b is equal to or greater than the above-described lower limit value. The threshold value determined based on the brightness A1 of the bump in the pre-transfer image 34a acquired under the illumination condition and the brightness A2 of the bump in the image 34b after the transfer is set to the illumination condition and threshold value used in the inspection of the transfer state. It has become.

  Next, with reference to FIG. 6, a bumped component mounting flow executed in the bumped component mounting method by the bumped electronic component mounting apparatus 1 will be described. First, a component with bumps is taken out (ST1). That is, the bumped component P is held and taken out from the tray feeder 5 of the component supply unit 4A by the mounting head 11A. Next, the mounting head 11A holding the bumped component P is moved to the flux supply unit 6 to perform flux transfer (ST2). That is, the bump-equipped component P held by the mounting head 11A is brought into contact with the flux 8 which is a transfer material formed on the stage 24 of the flux supply unit 6, and the flux 8 is transferred to a plurality of bumps Pa (see FIG. 3). ).

  The mounting head 11A holding the bumped component P after the transfer of the flux 8 moves above the recognition unit 15, and the bumped component P is imaged here (ST3). That is, the position of the bumped component P is recognized or the flux 8 transferred to the bump Pa by irradiating light onto the bumped component P to which the flux 8 has been transferred based on the illumination conditions included in the inspection parameters. An inspection image for inspecting the transfer state is obtained. In this imaging, the illumination conditions included in the inspection parameters, which are bump recognition component parameters stored in the parameter storage unit 46, are referred to.

  Next, a bumped component recognition process is performed on the acquired inspection image (ST4), that is, a process of recognizing the position of the bumped component P and the position of the bump Pa by the processing function of the recognition processing unit 44; Inspection of the transfer state of the flux 8 transferred to the bump Pa is executed. In this inspection, the flux 8 is detected from the inspection image using the threshold value included in the inspection parameter stored in the parameter storage unit 46, and the transfer state of the flux 8 is inspected. Here, whether or not the transfer state is good by referring to the judgment criteria for quality judgment stored in the recognition processing unit 44? Is determined (ST5).

  If it is determined in this determination that the transfer state is defective, after parts collection (ST6), the process returns to (ST1) and the same work process cycle is repeatedly executed. The parts are collected by discarding the bumped parts P held by the mounting head 11A in a collection box (not shown). If the transfer state is good in (ST5), the bumped component P is mounted on the substrate 2 (ST7), and one cycle of mounting the bumped component is completed.

  That is, in the above-described component mounting flow with bumps, the component P with bumps held by the mounting head 11A is brought into contact with the flux 8 that is a film-formed transfer material, and the flux 8 is transferred to a plurality of bumps Pa. The transferred bumped component P is imaged while irradiating light to obtain an inspection image, the flux 8 is detected from the inspection image using a threshold value, the transfer state of the flux 8 is inspected, and the transfer state is good If so, the bumped component P is mounted on the substrate 2.

  In the bumped electronic component mounting method shown in the present embodiment, the following inspection parameter setting processing is executed prior to mounting the bumped component P on the substrate 2. First, the pre-transfer image 34a of the bumped component P before the flux 8 is transferred to the bump Pa and the post-transfer image 34b after the flux 8 is transferred are obtained under the illumination conditions of the light that irradiates the bumped component P. It is executed multiple times while changing, and the illumination condition, which is an inspection parameter used in the inspection of the transfer state, is set by comparing the brightness A1 of the bump in the image 34a before transfer and the brightness A2 of the bump in the image 34b after transfer. When mounting the bumped component P, an inspection image is acquired using the set illumination condition.

  The flux inspection parameter setting process in the above-described bumped electronic component mounting method will be described below with reference to the flowchart of FIG. The following processing is executed by the processing function of the recognition unit 40 shown in FIG. First, a component with bumps is taken out (ST11). That is, the bumped component P is taken out from the tray feeder 5 of the component supply unit 4A by the mounting head 11A and held.

  Next, the mounting head 11A holding the bumped component P is moved above the recognition unit 15, and the bumped component continuous copying before flux transfer is performed (ST12). Here, imaging is executed a plurality of times while changing the illumination conditions of the light applied to the bumped component P. That is, a plurality of “illumination conditions” 51 defined in the illumination condition data 50 shown in FIG. 9 are sequentially applied to obtain a plurality of images with different illumination conditions. As a result, as shown in FIG. 8A, a pre-transfer image 34a in a state before transferring the flux 8 to the bump Pa is acquired for each of a plurality of illumination conditions.

  Next, the mounting head 11A holding the bumped component P is moved to the flux supply unit 6 to perform flux transfer (ST13). That is, the bumped component P held by the mounting head 11 </ b> A is brought into contact with the flux 8, which is a transfer material formed on the stage 24 of the flux supply unit 6, and the flux 8 is transferred to the plurality of bumps Pa.

  Next, the mounting head 11A holding the bumped component P after the transfer of the flux 8 is moved above the recognition unit 15, and the bumped component continuous copying after the flux transfer is performed (ST14). That is, similarly to (ST12), a plurality of “illumination conditions” 51 defined in the illumination condition data 50 shown in FIG. 9 are sequentially applied to obtain a plurality of images with different illumination conditions. Thereby, as shown in FIG. 8B, a post-transfer image 34b after the flux 8 is transferred to the bump Pa is acquired for each of a plurality of illumination conditions.

  As described above, by executing (ST12) and (ST14), a pair of sample images obtained by imaging the bumped parts P before and after the transfer of the flux 8 under the same illumination conditions are obtained under a plurality of illumination conditions. Obtained for each. In other words, here, imaging is executed a plurality of times while changing the illumination condition of the light applied to the bumped component P.

  Thereafter, the illumination condition for component recognition with bumps is determined (ST15). That is, by comparing the brightness A1 of the bump in the pre-transfer image 34a with the brightness A2 of the bump in the post-transfer image 34b, the illumination condition used in the inspection of the transfer state is set. In the example shown here, the illumination condition in which the difference (A1-A2) between the brightness A1 of the bump in the pre-transfer image 34a and the brightness A2 of the bump in the post-transfer image 34b (A1-A2) is the largest is used in the inspection of the transfer state. The condition is set.

  If the illumination conditions are determined, a flux inspection threshold value is determined (ST16). That is, the intermediate value between the brightness A1 in the pre-transfer image 34a and the brightness A2 in the post-transfer image 34b acquired under the illumination condition determined in (ST15) is the transfer / transfer of the flux 8 in the inspection image. It is set as a threshold for identifying none. The inspection parameter setting result including the illumination condition and the threshold value determined in this manner is displayed on the display unit 48 (ST17). Then, in the component mounting operation for mounting the bumped component P on the substrate 2, an inspection image for inspection of the transfer state is acquired using the set illumination condition, and the flux is extracted from the inspection image using the set threshold value. 8 is detected and the transfer state of the flux 8 is inspected.

  In the above-described method for mounting electronic components with bumps, an example has been shown in which the illumination condition in which the difference between the brightness of the bump in the pre-transfer image 34a and the brightness of the bump in the post-transfer image 34b is the largest is set as the inspection parameter. This setting example is a recommended example, and from a practical point of view, the illumination condition that maximizes the difference in the brightness of the bumps in the pre-transfer image 34a and the post-transfer image 34b needs to be set as the inspection parameter to be actually used. There is no. That is, in the inspection of the transfer state, it is sufficient for the purpose if the state in which the flux 8 is transferred and the state in which the flux 8 is not transferred can be reliably identified on the inspection image, and the difference in brightness is not necessarily maximized. And not.

  Therefore, if the difference in brightness satisfies a predetermined criterion and the illumination condition can reliably identify the state where the flux 8 is transferred and the state where it is not transferred on the inspection image, the illumination condition is inspected. It can be set as a parameter. For example, a lower limit value of the brightness difference (A1-A2) that can reliably identify the state in which the flux 8 is transferred and the state in which the flux 8 is not transferred is set appropriately, and the pre-transfer image 34a, If the illumination condition is such that the difference in brightness of the bump (A1-A2) in the post-transfer image 34b is greater than or equal to this lower limit value, this illumination condition can be set as the inspection parameter.

  That is, in this case, an illumination condition in which the difference (A1−A2) between the brightness A1 of the bump in the pre-transfer image 34a and the brightness A2 of the bump in the post-transfer image 34b is equal to or more than the above-described lower limit value is checked. Set to the lighting conditions used in. The setting of the threshold value included in the inspection parameter is performed in the same manner as in the above example. That is, brightness data (“before flux transfer (A1)” 62a, “after flux transfer (A2)” 62b) (FIG. 10) obtained under the illumination conditions set by the above-described method is obtained. Next, an intermediate value between the brightness A1 in the pre-transfer image 34a and the brightness A2 in the post-transfer image 34b thus obtained is set as a threshold value for identifying whether the flux 8 is transferred or not transferred in the inspection image. .

  That is, the illumination condition in which the difference (A1−A2) between the brightness A1 of the bump in the pre-transfer image 34a and the brightness A2 of the bump in the post-transfer image 34b is equal to or greater than the above lower limit, and the pre-transfer acquired under the illumination condition. The threshold value determined based on the brightness A1 of the bump in the image 34a and the brightness A2 of the bump in the image 34b after transfer is set to the illumination condition and the threshold value used in the inspection of the transfer state.

  As described above, in the bumped electronic component mounting apparatus and the bumped electronic component mounting method shown in the present embodiment, the bumped component P held by the mounting head 11A is brought into contact with the deposited flux 8. Flux 8 is transferred to a plurality of bumps Pa, and an image for inspection is obtained by irradiating light onto bumped component P to which flux 8 has been transferred, and flux 8 is detected from the image for inspection using a threshold value. When the transfer state of the flux 8 is inspected and the transfer state is good, the bumped component P is mounted on the substrate 2. When the bumped electronic component is mounted, the flux 8 is transferred to the bump Pa before mounting the bumped component P. The pre-transfer image 34a of the bumped component P and the post-transfer image 34b after the transfer of the flux 8 are acquired, and the illumination condition of the light for irradiating the bumped component P is changed. The illumination condition used in the inspection of the transfer state is set by comparing the brightness A1 of the bump in the pre-transfer image 34a and the brightness A2 of the bump in the post-transfer image 34b. When the is mounted, an inspection image in a transfer state is acquired using the set illumination condition.

  As a result, the inspection parameter setting operation that has been conventionally performed manually by the operator, that is, the measurement results obtained by performing the imaging a plurality of times before and after the transfer of the transfer material are recorded and processed. It is possible to automate complicated operations, and the inspection parameter setting process used for the inspection of the transfer state of the transfer material can be efficiently performed without variations due to individual differences.

  INDUSTRIAL APPLICABILITY The bumped electronic component mounting apparatus and bumped electronic component mounting method can efficiently perform the inspection parameter setting process used for the inspection of the transfer state of the transfer material, eliminating variations due to individual differences. This is effective in the field of electronic component mounting where a bumped electronic component is mounted on a substrate.

DESCRIPTION OF SYMBOLS 1 Bumped electronic component mounting apparatus 2 Board | substrate 4A Component supply part 6 Flux supply unit 8 Flux 15 Recognition unit 11A Mounting head 31 Illumination part 33 Camera 34a Image before transfer 34b Image after transfer P Bumped component Pa Bump

Claims (10)

A bumped electronic component mounting device that transfers a transfer material to a plurality of bumps of a bumped electronic component and mounts it on a substrate,
An electronic component supply unit with bumps for supplying electronic components with bumps;
A mounting head for taking out the bumped electronic component supplied from the bumped electronic component supply unit and mounting it on the substrate;
A transfer material supply device that supplies a transfer material transferred to a plurality of bumps of the bumped electronic component held by the mounting head in a film-formed state;
A bumped electronic component having a transfer material transferred to a plurality of bumps is imaged while irradiating light under illumination conditions included in the inspection parameter to obtain an inspection image, and the inspection is performed using a threshold value included in the inspection parameter. An inspection device that detects the transfer material from the image and inspects the transfer state of the transfer material,
The inspection apparatus executes the acquisition of the pre-transfer image of the electronic component with bump before the transfer material is transferred to the bump and the post-transfer image after the transfer material is transferred, a plurality of times while changing the illumination condition. A sample image acquisition unit to
Bumped electronic component mounting apparatus comprising: an inspection parameter setting unit that sets an illumination condition used in the inspection of the transfer state by comparing the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image .   The inspection parameter setting unit sets an illumination condition that maximizes the difference between the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image as an illumination condition used in the inspection of the transfer state. Item 1. A bumped electronic component mounting apparatus according to Item 1.   The inspection parameter setting unit includes an illumination condition in which a difference between the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image is the largest, and the brightness of the bump in the pre-transfer image acquired under the illumination condition. The bumped electronic component mounting apparatus according to claim 1, wherein a threshold value determined based on a brightness of the bump in the post-transfer image is set as an illumination condition and a threshold value used in the inspection of the transfer state.   The inspection parameter setting unit sets an illumination condition in which a difference between the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image is a lower limit value or more as an illumination condition used in the inspection of the transfer state. The electronic component mounting apparatus with a bump according to claim 1.   The inspection parameter setting unit includes an illumination condition in which a difference between the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image is a lower limit value or more, and the bump condition in the pre-transfer image acquired under the illumination condition. The bumped electronic component mounting apparatus according to claim 1, wherein brightness and a threshold value determined based on the brightness of the bump in the post-transfer image are set as an illumination condition and a threshold value used in the inspection of the transfer state. The bumped electronic component held by the mounting head is brought into contact with the film-formed transfer material, the transfer material is transferred to multiple bumps, and the bumped electronic component to which the transfer material has been transferred is imaged and inspected while irradiating light. A bumped electronic device that acquires an image for inspection, detects a transfer material from the inspection image using a threshold value, inspects the transfer state of the transfer material, and if the transfer state is good, mounts the bumped electronic component on the substrate A component mounting method,
Prior to mounting bumped electronic components,
Obtaining the pre-transfer image of the electronic component with bump before the transfer material is transferred to the bump and the post-transfer image after transferring the transfer material multiple times while changing the illumination conditions of the light that irradiates the electronic component with bump Run,
By setting the illumination condition used in the inspection of the transfer state by comparing the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image,
A bumped electronic component mounting method for acquiring the inspection image using the set illumination condition when mounting the bumped electronic component.   The bumped electron according to claim 6, wherein an illumination condition in which a difference between the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image is the largest is set as an illumination condition used in the inspection of the transfer state. Component mounting method.   The illumination condition in which the difference between the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image is the largest, the brightness of the bump in the pre-transfer image acquired under the illumination condition, and the bump in the post-transfer image The bumped electronic component mounting method according to claim 6, wherein a threshold value determined based on brightness is set to an illumination condition and a threshold value used in the inspection of the transfer state.   The bump according to claim 6, wherein an illumination condition in which a difference between a brightness of the bump in the pre-transfer image and a brightness of the bump in the post-transfer image is a lower limit value or more is set as an illumination condition used in the inspection of the transfer state. Electronic component mounting method.   The illumination condition in which the difference between the brightness of the bump in the pre-transfer image and the brightness of the bump in the post-transfer image is equal to or greater than a lower limit, the brightness of the bump in the pre-transfer image acquired under the illumination condition, and the post-transfer image The bumped electronic component mounting method according to claim 6, wherein the threshold value determined based on the brightness of the bump is set as an illumination condition and a threshold value used in the inspection of the transfer state.

Images