JP6836938B2 - Manufacturing method of die bonding equipment and semiconductor equipment - Google Patents

Description

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonding apparatus having a function of inspecting a relative position between a die and a substrate.

A part of the manufacturing process of a semiconductor device includes a process of mounting a semiconductor chip (hereinafter, simply referred to as a die) on a wiring board, a lead frame, etc. (hereinafter, simply referred to as a substrate) and assembling a package. Partly, there is a step of dividing (dying) a die from a semiconductor wafer (hereinafter, simply referred to as a wafer) and a bonding step of mounting the divided die on a substrate. The manufacturing apparatus used in the bonding process is a die bonding apparatus such as a die bonder.

A die bonder is a device that uses solder, gold plating, or resin as a bonding material to bond (mount and bond) a die onto a substrate or a die that has already been bonded. In a die bonder that bonds a die to the surface of a substrate, for example, the die is sucked from a wafer using a suction nozzle called a collet, picked up, transported onto the substrate, and a pressing force is applied and the bonding material is heated. By doing so, the operation (work) of performing bonding is repeated.

Japanese Unexamined Patent Publication No. 2015-195261

In the bonding process, it is necessary to bond to a predetermined bonding position on the substrate with high accuracy.
An object of the present disclosure is to provide a technique capable of improving the inspection accuracy of the inspection of the relative position between the die and the substrate.
Other challenges and novel features will become apparent from the description and accompanying drawings herein.

The following is a brief overview of the representative ones of the present disclosure.
That is, the die bonding apparatus includes a substrate to which the die is bonded, an imaging unit that images the die, and a control unit that controls the imaging unit. The control unit (a) takes an image in the same exposure of the imaging unit, with the region of the substrate outside the region of the die as the first imaging condition and the region of the die as the second imaging condition. b) The relative position between the die and the substrate is inspected based on the imaging result of the imaging unit.

According to the die bonding apparatus, the inspection accuracy in the bonding process can be improved.

Schematic top view showing the configuration of the die bonder according to the embodiment The figure explaining the schematic structure of the die bonder of FIG. 1 and its operation. External perspective view showing the configuration of the die supply unit of FIG. Schematic cross-sectional view showing the main part of the die supply part of FIG. A block diagram showing a schematic configuration of the control system of the die bonder of FIG. The figure for demonstrating the optical system of the wafer supply part of the die bonder of FIG. A flowchart illustrating a die bonding process in the die bonder of FIG. Flowchart for explaining copying operation Diagram showing an example of a unique part (selected area) of a die Flowchart for explaining continuous construction start operation Diagram showing examples of registered images and similar images The figure which shows the example which finds the center of a die from the positional relationship of a pattern Flowchart for explaining copying operation The figure which shows the example of the unique part (selection area) of a substrate The figure which shows the substrate which the die was bonded Flowchart for explaining continuous construction start operation The figure explaining the area which expanded the variation Image of the substrate to which the die is bonded A diagram illustrating a problem when the light reflectance of the die and the substrate are different. Flowchart of bonding accuracy inspection according to comparative example The figure explaining the problem of the bonding accuracy inspection which concerns on a comparative example

Hereinafter, Examples and Comparative Examples will be described with reference to the drawings. However, in the following description, the same components may be designated by the same reference numerals and repeated description may be omitted. In addition, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but this is just an example, and the interpretation of the present invention is used. It is not limited.

The inventor of the present application has studied a technique for inspecting the relative position between the die and the substrate while the die is bonded to the substrate. FIGS. 19 to 21 will be described with respect to the techniques (comparative examples) examined by the inventor. FIG. 19 is a diagram illustrating a problem when the light reflectances of the die and the substrate are different. FIG. 20 is a flowchart of a bonding accuracy inspection according to a comparative example. 21 is a diagram for explaining a problem of bonding accuracy inspection according to a comparative example, FIG. 21 (A) is an example of shaking an image, and FIG. 21 (B) is an image captured under appropriate conditions of a substrate. 21 (C) is an image taken under appropriate conditions of the die.

The die and the substrate may have different light reflectances. If you try to image the tabs of the die and the board at the same time in the inspection after bonding (in many cases), the reflectance will be different and it will not fit in the dynamic range of the camera. For example, as shown in FIG. 19A, the die becomes pure white under proper illumination of the substrate. Further, as shown in FIG. 19B, the leads of the substrate cannot be seen with proper illumination of the die.

Therefore, as shown in FIG. 19, when recognizing a die and when recognizing a tab, it is necessary to take two images by changing the illumination output, the shutter opening time (exposure time), or the gain of the camera.

As shown in FIG. 21 (A), when the vibration VIB fits in the device, the vibration VIB of the device is transmitted to the camera to shake the image, and when there is a heat haze HH or the like that synchronously affects the entire screen, the heat haze. HH shakes the image. As shown in FIG. 21 (B), the first imaging is performed under the suitability condition of the substrate, and as shown in FIG. 21 (C), the second imaging is performed under the suitability condition of the die. The image D2 of the die of the second imaging and the image TAB2 of the substrate deviate from the image D1 of the die of the first imaging and the image TAB1 of the substrate. As a result, by dividing the imaging (image capture) into two times, the calculation result of the relative position of the die and the tab includes the image movement offset caused by the difference in the imaging timing, and the accurate relative between the die and the substrate is included. The distance cannot be measured and the inspection accuracy deteriorates.

Therefore, in the die bonding apparatus according to the embodiment, the level of the input brightness signal (imaging condition) is switched for each imaging area within the same exposure timing to perform imaging. Examples of the imaging condition include the gain of the imaging device. Further, the shutter opening time (exposure time) may be changed for each imaging area. As a result, when measuring the mounting accuracy of a product (die, etc.) that is attached to a base (such as a substrate) that has significantly different reflectance, the imaging timing is the same, and this is caused by the difference in imaging timing (vibration, heat haze, etc.). The placement accuracy can be measured without being affected by the offset. Due to the difference in reflectance of the positioning target (pattern), it is possible to take the same image of a subject that could not be imaged in the same way, and it is not affected by the offset generated by the difference in timing. Can be improved. Further, the processing time can be improved by performing the image acquisition twice.

FIG. 1 is a top view showing an outline of a die bonder according to an embodiment. FIG. 2 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG.

The die bonder 10 is roughly divided into a die supply unit 1, a pickup unit 2, an intermediate stage unit 3, a bonding unit 4, a transport unit 5, a board supply unit 6, and a board carry-out unit 7, and monitors the operation of each unit. It has a control unit 8 for controlling. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply unit 1 is arranged on the front side of the die bonder 10, and the bonding unit 4 is arranged on the back side.

First, the die supply unit 1 supplies the die D to be mounted on the substrate P. The die supply unit 1 includes a wafer holding table 12 for holding the wafer 11, and a pushing unit 13 indicated by a dotted line for pushing the die D from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving means (not shown), and the die D to be picked up is moved to the position of the push-up unit 13.

The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y direction, and each drive unit (not shown) that moves the collet 22 up / down, rotates, and moves in the X direction. , Have. The pickup head 21 has a collet 22 (see also FIG. 2) that attracts and holds the pushed-up die D to the tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has drive units (not shown) that move the collet 22 up / down, rotate, and move in the X direction.

The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it on the conveyed substrate P, or bonds it in a form of being laminated on the die already bonded on the substrate P. The bonding unit 4 includes a bonding head 41 having a collet 42 (see also FIG. 2) that attracts and holds the die D to the tip like the pickup head 21, a Y drive unit 43 that moves the bonding head 41 in the Y direction, and a substrate. It has a substrate recognition camera 44 that captures a position recognition mark (not shown) of P and recognizes the bonding position.
With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the image data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and bases the board based on the image data of the board recognition camera 44. Bond the die D to P.

The transport unit 5 includes a board transport pallet 51 on which one or a plurality of boards P (4 boards in FIG. 1) are placed, and a pallet rail 52 on which the board transport pallet 51 moves, and is provided in parallel. It also has first and second transport units having the same structure. The substrate transfer pallet 51 moves by driving a nut (not shown) provided on the substrate transfer pallet 51 with a ball screw (not shown) provided along the pallet rail 52.
With such a configuration, the substrate transport pallet 51 mounts the substrate P on the substrate supply unit 6, moves to the bonding position along the pallet rail 52, and after bonding, moves to the substrate carry-out portion 7 to carry out the board. The substrate P is passed to the unit 7. The first and second transport units are driven independently of each other, and while the die D is bonded to the substrate P mounted on one substrate transport pallet 51, the other substrate transport pallet 51 carries out the substrate P. , Return to the board supply unit 6 and make preparations such as mounting a new board P.

Next, the configuration of the die supply unit 1 will be described with reference to FIGS. 3 and 4. FIG. 3 is a view showing an external perspective view of the die supply unit. FIG. 4 is a schematic cross-sectional view showing a main part of the die supply part.

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction) and a push-up unit 13 that moves in the vertical direction. The wafer holding table 12 has an expanding ring 15 for holding the wafer ring 14 and a support ring 17 for horizontally positioning the dicing tape 16 held on the wafer ring 14 and to which a plurality of dies D are adhered. The push-up unit 13 is arranged inside the support ring 17.

The die supply unit 1 lowers the expanding ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held by the wafer ring 14 is stretched to widen the interval between the dies D, and the push-up unit 13 pushes up the dicing D from below the die D to improve the pick-up property of the die D. The adhesive that adheres the die to the substrate as it becomes thinner changes from a liquid to a film, and a film-like adhesive material called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. There is. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

The die bonder 10 has a wafer recognition camera 24 that recognizes the posture of the die D on the wafer 11, a stage recognition camera 32 that recognizes the posture of the die D mounted on the intermediate stage 31, and a mounting position on the bonding stage BS. It has a substrate recognition camera 44 for recognizing. It is the stage recognition camera 32 involved in the pickup by the bonding head 41 and the substrate recognition camera 44 involved in bonding to the mounting position by the bonding head 41 that must correct the posture deviation between the recognition cameras. In this embodiment, the wafer recognition camera 24 is used to position the die D, and the substrate recognition camera 44 is used to position the substrate P and inspect the relative position of the die bonded to the substrate P and the substrate P.

The control system will be described with reference to FIG. FIG. 5 is a block diagram showing a schematic configuration of the control system of the die bonder of FIG. The control system 80 includes a control unit 8, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 8 is roughly divided into a control / arithmetic unit 81 mainly composed of a CPU (Central Processor Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The storage device 82 is an auxiliary storage device 82b composed of a main storage device 82a composed of a RAM for storing a processing program and the like, and an HDD for storing control data, image data, and the like necessary for control. And have. The input / output device 83 includes a monitor 83a for displaying the device status and information, a touch panel 83b for inputting an operator's instruction, a mouse 83c for operating the monitor, and an image capture device 83d for capturing image data from the optical system 88. And have. Further, the input / output device 83 includes a motor control device 83e that controls a drive unit 86 such as an XY table (not shown) of the die supply unit 1 and a ZZ drive shaft of a bonding head table, various sensor signals, lighting devices, and the like. It has an I / O signal control device 83f that captures or controls a signal from a signal unit 87 such as a switch of the above. The optical system 88 includes a wafer recognition camera 24, a stage recognition camera 32, and a substrate recognition camera 44. The control / arithmetic unit 81 takes in necessary data via the bus line 84, calculates the data, controls the pickup head 21 and the like, and sends the information to the monitor 83a and the like.

The control unit 8 stores the image data captured by the wafer recognition camera 24 and the substrate recognition camera 44 in the storage device 82 via the image acquisition device 83d. The die D and the substrate P are positioned by using the control / arithmetic unit 81 by the software programmed based on the stored image data. Based on the positions of the die D and the substrate P calculated by the control / arithmetic unit 81, the drive unit 86 is moved by software via the motor control device 83e. By this process, the die on the wafer is positioned and operated by the drive unit of the pickup unit 2 and the bonding unit 4 to bond the die D onto the substrate P. The wafer recognition camera 24 and the substrate recognition camera 44 to be used are grayscale, color, or the like, and the light intensity is quantified.

Next, the wafer recognition camera will be described with reference to FIG. FIG. 6 is a diagram for explaining the optical system of the wafer supply unit, and shows the arrangement of the wafer recognition camera and the illumination unit that irradiates the die to be picked up with light for image capture. The stage recognition camera 32 and the substrate recognition camera 44 are the same as the wafer recognition camera 24.
The imaging unit ID of the wafer recognition camera 24 is connected to one end of the lens barrel BT, an objective lens (not shown) is attached to the other end of the lens barrel BT, and an image of the main surface of the die D is taken through this objective lens. It is configured to do.
An illumination unit LD equipped with a surface emitting illumination (light source) SL and a half mirror (semi-transmissive mirror) HM is arranged between the lens barrel BT and the die D on the line connecting the imaging unit ID and the die D. ing. The irradiation light from the surface emission illumination SL is reflected by the half mirror HM on the same optical axis as the image pickup unit ID, and is applied to the die D. The scattered light emitted to the die D on the same optical axis as the image pickup unit ID is reflected by the die D, and the specularly reflected light of the scattered light passes through the half mirror HM and reaches the image pickup unit ID to form an image of the die D. To do. That is, the illumination unit LD has a function of coaxial epi-illumination (coaxial illumination).

The lighting system is not limited to coaxial lighting, and may be dome lighting, oblique ring illumination, oblique bar illumination, transmitted illumination, or the like. Depending on the subject, a system may be constructed by combining a plurality of these types of lighting. The light source color includes white and the like in addition to a single color. As the light source, one that can adjust the output linearly, for example, one that adjusts the amount of light by the pulse dimming duty of the LED is used.

FIG. 7 is a flowchart illustrating a die bonding process in the semiconductor manufacturing apparatus according to the embodiment.
In the die bonding step of the embodiment, first, the control unit 8 takes out the wafer ring 14 holding the wafer 11 from the wafer cassette and places it on the wafer holding table 12, and the wafer holding table 12 is picked up by the die D. It is conveyed to the reference position where it is performed (wafer loading (step P1)). Next, the control unit 8 makes fine adjustments so that the arrangement position of the wafer 11 exactly matches the reference position from the image acquired by the wafer recognition camera 24.

Next, the control unit 8 arranges the first die D to be picked up at the pickup position by moving the wafer holding table 12 on which the wafer 11 is placed at a predetermined pitch and holding it horizontally (die transfer). (Step P2)). The wafer 11 is inspected in advance for each die by an inspection device such as a prober, and map data indicating good or bad is generated for each die and stored in the storage device 82 of the control unit 8. Whether the die D to be picked up is a non-defective product or a defective product is determined by the map data. When the die D is a defective product, the control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed at a predetermined pitch, arranges the die D to be picked up next at the pickup position, and arranges the defective product. Die D is skipped.

The control unit 8 photographs the main surface (upper surface) of the die D to be picked up by the wafer recognition camera 24, and calculates the amount of displacement of the die D to be picked up from the pickup position from the acquired image. The control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed based on this amount of misalignment, and accurately arranges the die D to be picked up at the pickup position (die positioning (step P3)). Details of die positioning will be described later.

The control unit 8 places the substrate P on the substrate transfer pallet 51 by the substrate supply unit 6 (board loading (process P4)). The control unit 8 moves the substrate transfer pallet 51 on which the substrate P is placed to the bonding position (board transfer (process P5)).

The board is imaged by the board recognition camera 44 and positioned (board positioning (process P6)). The details of the positioning of the substrate will be described later.

After accurately arranging the die D to be picked up at the pickup position, the control unit 8 picks up the die D from the dicing tape 16 by the pickup head 21 including the collet 22 and places it on the intermediate stage 31 (die handling (process). P7)). The control unit 8 detects the posture deviation (rotational deviation) of the die placed on the intermediate stage 31 with the stage recognition camera 32. When there is a posture deviation, the control unit 8 rotates the intermediate stage 31 on a surface parallel to the mounting surface having the mounting position by a turning drive device (not shown) provided on the intermediate stage 31 to correct the posture deviation.

The control unit 8 picks up the die D from the intermediate stage 31 by the bonding head 41 including the collet 42, and performs die bonding to the substrate P or a die already bonded to the substrate P (diatouch (step P8)).

After bonding the die D, the control unit 8 inspects whether the bonding position is accurate (relative position inspection between the die and the substrate (step P9)). Details of the relative position inspection between the die and the substrate will be described later.

After that, the dies D are bonded to the substrate P one by one according to the same procedure. When the bonding of one substrate is completed, the substrate transport pallet 51 is moved to the substrate carry-out portion 7 (board transport (process PA)), and the substrate P is passed to the board carry-out portion 7 (board unloading (process PB)).

Further, the dies D are peeled off from the dicing tape 16 one by one according to the same procedure (step P7). When the pickup of all the dies D except the defective products is completed, the dicing tape 16 and the wafer ring 14 and the like holding the dies D in the outer shape of the wafer 11 are unloaded to the wafer cassette (process PC).

The method of positioning the die will be described with reference to FIGS. 8 to 12. FIG. 8 is a flowchart for explaining the copying operation. FIG. 9 is a diagram showing an example of a unique portion (selection area) of the die. FIG. 10 is a flowchart for explaining the continuous construction start operation. FIG. 11 is a diagram showing an example of a registered image and a similar image. FIG. 12 is a diagram showing an example of finding the center of the die from the positional relationship of the pattern, FIG. 12 (A) is a registered image, and FIG. 12 (B) is an image of the die for alignment.

The die positioning algorithm mainly uses template matching, and is an operation using a generally known normalized correlation equation. The result is used as the match rate. Template matching includes a copy operation of reference learning and an operation for continuous construction start.

First, the copying operation will be described. The control unit 8 conveys the reference sample to the pickup position (step S1). The control unit 8 acquires the image PCr of the reference sample with the wafer recognition camera 24 (step S2). The operator of the die bonder selects a unique partial UA as shown in FIG. 8 from the image by using the human interface (touch panel 83b or mouse 83c) (step S3). The control unit 8 stores the positional relationship (coordinates) between the selected unique portion (selected area) UA and the reference sample in the storage device 82 (step S4). The control unit 8 stores the image (template image) PT of the selected area in the storage device 82 (step S5). The reference work image (registered image) and its coordinates are stored in the storage device 82.

By preparing a plurality of registered images, as shown in FIG. 12, the center of the die is calculated from the relative relationship with each position matching the detected registered image and positioned.

Next, continuous operation will be described. The control unit 8 conveys the member (product wafer) to the pickup position for continuous construction (step S11). The control unit 8 acquires the image PCn of the product die with the wafer recognition camera 24 (step S2). As shown in FIG. 11, the control unit 8 compares the template image PT saved in the copying operation with the acquired image PCn of the product die, and calculates the coordinates of the image PTn of the most similar portion (step S13). .. The coordinates are compared with the coordinates measured by the reference sample, and the position of the product die (offset between the image PTn and the template image PT) is calculated (step S14).
The method of positioning the substrate and inspecting the relative position of the substrate to which the die is bonded and the die will be described with reference to FIGS. 13 to 17. FIG. 13 is a flowchart for explaining the copying operation. FIG. 14 is a diagram showing an example of a unique portion (selection area) of the substrate. FIG. 15 is a diagram showing a substrate to which a die is bonded. FIG. 16 is a flowchart for explaining the continuous construction start operation. FIG. 17 is a diagram for explaining a region in which the variation is expanded.

Similar to the above-mentioned die positioning algorithm, the substrate positioning and die-bonded substrate and die recognition algorithms mainly use template matching, and template matching includes a reference learning imitation operation and a continuous construction start operation.

First, the copying operation will be described. The copying operation is roughly divided into two types: substrate recognition copying (step S21) and die recognition copying (step S24).

The control unit 8 conveys the substrate for the reference sample to the bonding position (step S211). The control unit 8 adjusts the illumination value (L1), gain (G1), and exposure time (V1) of the substrate recognition camera 44 (step S212). The control unit 8 acquires an image of the substrate for the reference sample with the substrate recognition camera 44 (step S213). The operator of the die bonder selects a unique partial TUA as shown in FIG. 14 from the image by the human interface (touch panel 83b or mouse 83c) (step S214). A plurality of tabs (product areas) TABs are arranged in a grid pattern on the substrate P, and the tab TABs are a region DR to which the die D is bonded and a terminal TT electrically connected to the bonding pad of the die D by a bonding wire. And a unique part TUA of the substrate. The control unit 8 stores the positional relationship (coordinates) between the selected unique portion (selected area) TUA and the substrate for the reference sample in the storage device 82 (step S215). The control unit 8 saves the image (template image) of the selected area in the storage device 82 (step S216). The reference work image (registered image) and its coordinates are stored in the storage device 82. The above is the imitation of substrate recognition (step S21).

After copying the substrate recognition (step S21), the die bonding position on the substrate is determined, stored as coordinate data in the storage device 82 (step S22), and the die is bonded onto the substrate (step S23). After that, the die recognition imitation (step S24) described below is performed.

The control unit 8 determines the die range (die size) on the substrate (step S241). The control unit 8 adjusts the gain (G2) of only the die range in the illumination value (L1) and the exposure time (V1) of the substrate recognition camera 44 when the template image of the substrate for the reference sample is acquired (step S242). .. The control unit 8 acquires an image of the die for the reference sample with the substrate recognition camera 44 (step S243). The operator of the die bonder selects a unique partial UA as shown in FIG. 15 from the image by the human interface (touch panel 83b or mouse 83c) (step S244). The control unit 8 stores the positional relationship (coordinates) between the selected unique portion (selected area) UA and the die for the reference sample in the storage device 82 (step S245). The control unit 8 saves the image (template image) of the selected area in the storage device 82 (step S246). The reference work image (registered image) and its coordinates are stored in the storage device 82.

Next, the continuous construction start operation will be described. The control unit 8 conveys the member (product substrate) to the bonding position for continuous construction (step S31). The control unit 8 adjusts the imaging conditions of the substrate recognition camera 44. It is an adjustment value of step S212 of the copying operation, and the illumination value is L1, the gain is G1, and the exposure time is V1 (step S32). The control unit 8 acquires an image of the product board with the board recognition camera 44 (step S33). At this time, the gain in the screen may be the same in the area where the die is mounted and the area where the die is not mounted. As shown in FIG. 14, the substrate positioning is also performed by calculating the center position of the tab TAB on which the die is mounted by using the unique portion TUA of the substrate. The template image acquired by the copying operation is compared with the image acquired in step S33 to calculate the coordinates of the most similar part, and the coordinates are compared with the coordinates measured on the reference sample substrate to calculate the position of the product substrate. The substrate is positioned by template matching (step S34). Based on the positioning result of the substrate, the die is bonded according to the position of the substrate (step S35).

As shown in FIG. 17, the control unit 8 is a position where the die should be bonded, reflecting the result of board recognition in the bonding coordinate data saved in step S22 from the board position PD on the data and the actual board position PR. Is predicted and calculated (step S36). The control unit 8 predictively calculates the shape range DD of the die in which the die size determined in step S241 is reflected in the result of the prediction calculation (step S37). The control unit 8 calculates the extended region DA by adding the bonding variation that can normally occur to the expected calculation area (step S38).

The control unit 8 adjusts the gain of the region DA in step S242 of the copying operation in the illumination value (L1) and the exposure time (V1) of the board recognition camera 44 when the template image of the board is acquired by the copying operation, G2, and the like. The gain in this region is set to G1 adjusted in step S212, and a camera image is acquired by the substrate recognition camera 44 (step S39). The control unit 8 acquires an image of the product board on which the die is mounted by the board recognition camera 44 (step S3A). The control unit 8 calculates the center position of the substrate from the unique portion on the substrate in the image, calculates the center position of the die from the unique portion on the die, and inspects whether the relative position is correct (step S3B). .. The template image saved in step S246 is used when calculating the center position of the die from the unique portion on the die.

A specific example of steps S39 to 3B, for example, a case where the reflectance of the light of the substrate P is smaller than the reflectance of the light of the die D will be described with reference to FIG. FIG. 18 is an image of a substrate to which a die is bonded.

The tab TAB immediately after the die D is mounted on the substrate P is imaged by the substrate recognition camera 44. For the substrate recognition camera 44, a camera capable of switching the input brightness signal level for each imaging area within the same exposure timing (for example, Sony Corporation's machine vision camera (product name), XCL-SG510 (model)) is used. To do. The shutter opening timing at this time is the same as the exposure time length. The gain of the die D and the gain around the die D are made different, and the gain around the die D is increased so that the periphery of the die D can be imaged brightly without increasing the gain of the die D. As a result, the captured images of the die D and its surroundings can be accommodated within the dynamic range of the camera. As for the relative position inspection pattern, two unique partial UAs are registered with the tab TAB and two unique partial UAs are registered with the die D, and the positions of each other are measured.

The invention made by the present inventor has been specifically described above based on the embodiments and examples, but the present invention is not limited to the above embodiments and examples, and can be variously modified. Not to mention.

For example, in the embodiment, it has been described that the gain of the die D and the gain around the die D are different from each other for imaging. However, if the shutter opening time (exposure time) of the die D and the exposure time around the die D are different, The image may be taken separately, or the illumination output of the die D and the illumination output around the die D may be different from each other for imaging.
Further, in the embodiment, the type in which the coaxial illumination is arranged between the objective lens and the die has been described, but the coaxial illumination may be an in-lens insertion type.
Further, in the embodiment, the DAF is attached to the back surface of the wafer, but the DAF may not be present.
Further, in the embodiment, one pickup head and one bonding head are provided, but two or more of each may be provided. Further, although the intermediate stage is provided in the embodiment, the intermediate stage may not be provided. In this case, the pickup head and the bonding head may be used in combination.
Further, in the embodiment, the die is bonded with the front surface facing up, but after picking up the die, the front and back surfaces of the die may be inverted and the die may be bonded with the back surface facing up. In this case, the intermediate stage may not be provided. This device is called a flip chip bonder.

10 ・ ・ ・ Die bonder 1 ・ ・ ・ Wafer supply part D ・ ・ ・ Die ID ・ ・ ・ Imaging part LD ・ ・ ・ Lighting part 2 ・ ・ ・ Pickup part 24 ・ ・ ・ Wafer recognition camera 3 ・ ・ ・ Alignment part 31 ・・ ・ Intermediate stage 32 ・ ・ ・ Stage recognition camera 4 ・ ・ ・ Bonding part 41 ・ ・ ・ Bonding head 42 ・ ・ ・ Collet 44 ・ ・ ・ Board recognition camera 5 ・ ・ ・ Conveying part BS ・ ・ ・ Bonding stage P ・ ・・ Board 8 ・ ・ ・ Control unit

Claims (16)

An image pickup device that images the substrate to which the die is bonded and the bonded die, and
A control unit that controls the image pickup device and
With
The control unit
The substrate is imaged by the imaging device under the first imaging condition to recognize the substrate position, and the substrate position is recognized.
The position where the die should be bonded is predicted based on the predetermined die bonding coordinates and the recognized substrate position, and the die is bonded.
Predict the shape range of the die that reflects the die size at the predicted position to be bonded,
A region obtained by extending the bonding variation that can normally occur in the predicted die shape range was obtained.
In the same exposure of the image pickup apparatus, wherein the die is a region outside the region to the expansion of the substrate which is bonded to the first imaging condition, and the area was the expansion of the substrate in which the die is bonded second Take an image under the imaging conditions,
Die bonding apparatus configured to the imaging apparatus performs an inspection of the relative position of the substrate on which the die and the bonded die is bonded on the basis of the result of imaging by the first imaging condition and the second imaging condition. In claim 1,
The control unit is a die bonding device configured to bond a die to the substrate based on the recognized substrate position. In claim 2,
The control unit adjusts the illumination value, the exposure time, and the gain with respect to the reference substrate to set the first imaging condition.
The illumination value, exposure time, and gain were adjusted with respect to the reference die mounted on the reference substrate to obtain the second imaging condition.
A die bonding apparatus that adjusts the illumination value and exposure time of the second imaging condition to the illumination value and exposure time of the first imaging condition, respectively. In claim 3, further
A wafer supply unit that holds a wafer ring that holds the dicing tape to which the die is attached, and a wafer supply unit.
A wafer recognition camera that captures the die on the dicing tape and
A die bonding device equipped with. In claim 4, further
A die bonding apparatus including a bonding head for bonding the substrate or the die onto a die that has already been bonded. In claim 4, further
A pickup head that picks up the die and
The intermediate stage on which the picked-up die is placed and
A bonding head that bonds a die placed on the intermediate stage onto the substrate or a die that has already been bonded to the substrate.
A die bonding device equipped with. (A ) The process of preparing a wafer ring holder for holding the dicing tape to which the die is attached, and
(B) A step of positioning the die on the dicing tape using the first imaging device, and
(C) The process of preparing the substrate and
(D) A step of positioning the substrate using the second imaging device, and
(E) A step of bonding the die onto the substrate or a die that has already been bonded.
(F) A step of inspecting the relative position between the bonded die and the substrate using the second imaging device, and
With
In the step (d), the substrate is imaged by the second imaging apparatus under the first imaging condition to recognize the position of the substrate.
The step (f) is
(F1) A step of predicting a position to be bonded of a die based on a predetermined die bonding coordinate and the recognized substrate position.
(F2) A step of predicting the shape range of the die reflecting the die size at the predicted position to be bonded, and
(F3) A step of obtaining a region in which the bonding variation that can normally occur in the predicted die shape range is expanded, and a step of obtaining the region.
(F4) in the same exposure of the second imaging device, the outer region of the expanded regions in the substrate on which the die is bonded to the first imaging condition, and the expansion in the substrate on which the die is bonded The process of taking an image with the created area as the second imaging condition,
(F5) A step of inspecting the relative positions of the bonded die and the substrate to which the die is bonded based on the results of imaging under the first imaging condition and the second imaging condition by the second imaging device.
A method for manufacturing a semiconductor device . In the method for manufacturing a semiconductor device according to claim 7,
The step (e ) is a method for manufacturing a semiconductor device that bonds a die to the substrate based on the substrate position recognized in the step (d) . In the method for manufacturing a semiconductor device according to claim 8, further
(G) A step of adjusting the illumination value, the exposure time, and the gain with respect to the reference substrate to obtain the first imaging condition.
(H) A step of adjusting the illumination value, the exposure time, and the gain with respect to the reference die mounted on the reference substrate to obtain the second imaging condition.
With
The step (h) is a method for manufacturing a semiconductor device that adjusts the illumination value and the exposure time of the second imaging condition to the illumination value and the exposure time of the first imaging condition, respectively. In the method for manufacturing a semiconductor device according to claim 9, further
(I) The process of picking up the die and
(J) The step of placing the picked-up die on the intermediate stage and
A method for manufacturing a semiconductor device . A wafer supply unit that holds the dicing tape to which the die is attached, and
A wafer recognition camera that captures the die on the dicing tape and
A board recognition camera that captures the board and
A control unit that controls the wafer recognition camera and the substrate recognition camera,
A bonding head that bonds the die to the substrate,
With
The control unit
The die is imaged by the wafer recognition camera, the die is positioned, and the die is positioned.
The substrate is imaged by the substrate recognition camera, the substrate is positioned, and the substrate is positioned.
When the substrate recognition camera captures an image of the die bonded to the substrate and the substrate to inspect the positional relationship between the die and the substrate.
The board is imaged by the board recognition camera under the first imaging condition to recognize the position of the board.
The position where the die should be bonded is predicted based on the predetermined die bonding coordinates and the recognized substrate position, and the die is bonded.
Predict the shape range of the die that reflects the die size at the predicted position to be bonded,
A region obtained by extending the bonding variation that can normally occur in the predicted die shape range was obtained.
In the same exposure of the board recognition camera, the die is a region outside the region to the expansion of the substrate which is bonded to the first imaging condition, and the area was the expansion of the substrate in which the die is bonded a (2) Imaging under the imaging conditions,
Die bonding apparatus configured to inspect the relative position of the substrate on which the die and the bonded die is bonded on the basis of the result of imaging by the board recognition camera the first imaging condition and the second imaging condition .. 11.
The control unit
A die bonding apparatus configured to bond a die to the substrate based on the recognized substrate position. In claim 12,
The control unit adjusts the illumination value, the exposure time, and the gain with respect to the reference substrate to set the first imaging condition.
The illumination value, exposure time, and gain were adjusted with respect to the reference die mounted on the reference substrate to obtain the second imaging condition.
A die bonding apparatus that adjusts the illumination value and exposure time of the second imaging condition to the illumination value and exposure time of the first imaging condition, respectively. (A ) The process of preparing a wafer ring holder for holding the dicing tape to which the die is attached, and
(B) A step of positioning the die using a wafer recognition camera and
(C) The process of preparing the substrate and
(D) A step of positioning the board using a board recognition camera and
(E) The process of picking up the die and
(F) A step of bonding the picked-up die onto the substrate or a die that has already been bonded.
(G) A step of inspecting the relative position between the die and the substrate using the substrate recognition camera, and
With
In the step (f), the substrate is imaged by the substrate recognition camera under the first imaging condition to recognize the substrate position.
The step (g) is
(G1) A step of predicting a position to be bonded of a die based on a predetermined die bonding coordinate and the recognized substrate position.
(G2) The step of predicting the shape range of the die reflecting the die size at the predicted position to be bonded, and
(G3) A step of obtaining a region in which the bonding variation that can normally occur in the predicted die shape range is extended, and a step of obtaining the region.
(G4) in the same exposure of the board recognition camera, the outer region of the expanded regions in the substrate on which the die is bonded to the first imaging condition, and were the expansion of the substrate where the die is bonded The process of imaging with the region as the second imaging condition,
(G5) A step of inspecting the relative position of the bonded die and the substrate to which the die is bonded based on the results of imaging by the substrate recognition camera under the first imaging condition and the second imaging condition.
A method for manufacturing a semiconductor device . In the method for manufacturing a semiconductor device according to claim 14,
The step (f ) is a method for manufacturing a semiconductor device for bonding a die to the substrate based on the substrate position recognized in the step (d) . In the method for manufacturing a semiconductor device according to claim 15, further
(H) A step of adjusting the illumination value, the exposure time, and the gain with respect to the reference substrate to obtain the first imaging condition.
(I) A step of adjusting the illumination value, the exposure time, and the gain with respect to the reference die mounted on the reference substrate to obtain the second imaging condition.
With
The step (i) is a method for manufacturing a semiconductor device that adjusts the illumination value and the exposure time of the second imaging condition to the illumination value and the exposure time of the first imaging condition, respectively.

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