JP2005101211A - Component recognition apparatus and surface-mounting machine mounted therewith, and component testing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component recognition apparatus which can correctly detect a sucked state and the posture of an electronic component with respect to a holding means. <P>SOLUTION: The component recognition apparatus comprises a movable head unit 6 which includes a nozzle 16a for holding the electronic component and a camera 18, and a half mirror 25 which is fixed below a movement range of the head unit 6. When the head unit 6 passes above the half mirror 25, the image of the bottom face of the electronic component C which is reflected by the half mirror 25 is fetched and imaged by means of the camera 18. The component recognition apparatus is also equipped with a first and a second auxiliary mirrors 22 and 26 which reflect the image of the side face of the electronic component C toward the camera 18. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component recognition apparatus that images an electronic component held by a head unit.

  Generally, a holding unit that holds an electronic component and an imaging unit, a movable head unit, and a mirror that reflects an image of the electronic component that is relatively displaced by the movement of the head unit to the imaging unit side. In addition, there is known a component recognition apparatus configured to capture an image of an electronic component projected by the mirror using the imaging unit. This type of component recognition apparatus is mounted on an electronic component mounting apparatus as disclosed in Patent Document 1, for example.

The electronic component mounting apparatus includes a suction nozzle and a CCD camera for sucking an electronic component, and includes a movable suction head and a mirror for reflecting the lower surface of the sucked electronic component toward the CCD camera. When the head unit passes above, the lower surface of the electronic component is imaged by the CCD camera, and based on this image, the posture of the electronic component relative to the suction nozzle, the shape of the electronic component, and the like are detected.
JP-A-6-216568

  However, since the component recognition device mounted on the electronic component mounting device of Patent Document 1 is configured to image only the lower surface of the electronic component, the posture of the electronic component with respect to the suction nozzle is determined based on the captured image. In some cases, it could not be detected accurately. Specifically, for example, when the electronic component is sucked and sucked in the vertical direction with respect to the suction nozzle, the image of the lower surface of the picked-up electronic component is almost different from the image of the normally sucked electronic component. Since it does not occur, it is difficult to accurately detect the difference between these postures.

  In particular, since electronic components have become finer with the recent downsizing of electronic products, if the size of the electronic component and the suction nozzle is the same when viewed from below, the suction nozzle is taken when the electronic component is imaged from below. In some cases, it is difficult to determine whether or not an electronic component has been attracted.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a component recognition apparatus that can accurately detect the suction state and posture of an electronic component with respect to a holding unit.

In order to solve the above-described problems, the present invention includes a holding unit that holds an electronic component, an imaging unit, a movable head unit, and a reflecting unit that is fixedly installed below the moving range of the head unit. And a component recognition device that captures an image of the lower surface of the electronic component reflected by the reflection unit when the head unit passes above the reflection unit and captures the image.
Auxiliary reflection means for reflecting the image of the side surface of the electronic component toward the imaging means,
The auxiliary reflecting means and the image of the side surface and the lower surface of the specific electronic component reflected by the reflecting means are configured to be taken into the same imaging means (claim 1).

  In this component recognition apparatus, it is preferable that the image of the lower surface and the side surface of the electronic component reflected by the reflection unit and the auxiliary reflection unit is simultaneously captured within the imaging range of the imaging unit (Claim 2).

  An image of the lower surface of the electronic component reflected by the reflecting means and an image of the side surface of the electronic component reflected by the auxiliary reflecting means are configured to be taken into the imaging means at different times (claim 3). preferable.

  The holding means is configured to pick up and hold a part from a predetermined supply unit, and the auxiliary reflecting means is configured to reflect an image of a side surface of the electronic component in the picking process toward the imaging means. (Claim 4) is preferable.

  The head unit preferably further includes illumination means for irradiating the electronic component with illumination light (Claim 5).

  It is preferable that the illumination means for irradiating the electronic component with illumination light is fixedly installed in the vicinity of the reflection means (Claim 6).

  In the head unit, it is preferable that a reference mark capable of detecting a specific position of the head unit is formed at a position where the image pickup unit can pick up the image together with the image of the lower surface of the electronic component.

  Another aspect of the present invention is a surface mounter on which the component recognition apparatus is mounted, and a component as a supply unit capable of supplying an electronic component to the head unit and a base that supports the reflecting means. A supply unit; a nozzle as a holding unit capable of receiving an electronic component from the component supply unit and mounting the electronic component on a printed circuit board positioned on the base; and the head unit with respect to the base The image pickup means is configured to take an image of a lower surface and a side surface of the electronic component in a process in which the head unit conveys the electronic component from the component supply unit to the printed circuit board. (Claim 8).

  Still another aspect of the present invention is a component testing apparatus on which the component recognition device is mounted, and a base that supports the reflecting means, and an inspection socket that is provided on the base and inspects an electronic component. A drive mechanism that moves the head unit relative to the base; and a tray that serves as a supply unit that accommodates electronic components so as to be supplied to the head unit. In the process of transporting the electronic component from the tray to the inspection socket, the lower surface and the side surface of the electronic component are imaged (claim 9).

  According to the component recognition apparatus of the present invention, the image of the lower surface of the electronic component reflected by the reflecting means and the image of the side surface of the electronic component reflected by the auxiliary reflecting means can be imaged by the same imaging means. The suction state and posture of the electronic component with respect to the holding unit can be accurately detected based on images viewed from the two directions of the lower side and the side. Further, in the present invention, since the lower surface and the side surface of the electronic component can be imaged by the same imaging unit by adding the auxiliary reflecting unit, a configuration in which an additional imaging unit is added to image the side surface of the electronic component. Compared with, the cost of the component recognition apparatus can be reduced.

  According to the component recognition apparatus of the second aspect, since the image in which the lower surface and the side surface of the electronic component are projected can be obtained by one imaging, the lower surface and the side surface of the electronic component are individually imaged. Compared with the case where the posture of the electronic component is detected based on the image, it is possible to reduce the time required to detect the suction state and posture of the electronic component.

  According to the component recognition apparatus of the third aspect, since the image of the lower surface and the image of the side surface of the electronic component can be individually captured, it is compared with a case where these images are divided into a single image and formed. As a result, each image can be obtained as a large image. As a result, the suction state and posture of the electronic component can be detected more accurately based on these images.

  According to the component recognition apparatus of the fourth aspect, the side surface of the electronic component picked up from the supply unit can be immediately imaged. Therefore, when the electronic component is clearly displaced with respect to the holding means at the time of picking up, When the parts are not picked up, it is possible to quickly take measures such as picking up again.

  According to the component recognition apparatus of the fifth aspect, the lower surface and the side surface of the electronic component can be imaged under the illumination condition by the illumination means.

  According to the component recognition apparatus of the sixth aspect, it is possible to take an image of the electronic component that has been brightened by the illumination unit from the reflection unit side.

  According to the component recognition apparatus of the seventh aspect, it is possible to detect the positional deviation of the electronic component with respect to the holding unit of the head unit based on the captured image obtained by imaging both the reference mark and the electronic component. Further, according to this configuration, the position of the reference mark is checked in advance, and the distortion and the inclination of the reflecting means or the shift of the imaging timing can be detected by comparing the position with the mark position based on the captured image. It becomes possible.

  In addition, according to the surface mounter of the present invention, the posture of the electronic component relative to the holding means can be accurately detected in the process of mounting the electronic component on the printed board.

  Furthermore, according to the component testing apparatus of the present invention, the posture of the electronic component relative to the holding means can be detected in the process of conveying the electronic component from the tray to the inspection socket.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a surface mounter (a surface mounter according to the present invention) on which a component recognition apparatus according to the present invention is mounted. As shown in the drawing, a printed circuit board conveying conveyor 2 is arranged on a base 1 of the mounting machine, and the printed circuit board 3 is conveyed on the conveyor 2 and stopped at a predetermined mounting work position. It has become. A fiducial mark F for specifying the position of the printed circuit board 3 with respect to the base 1 is formed on the printed circuit board 3.

  On both sides of the conveyor 2, component supply units 4 and 4 are arranged. These component supply units 4 and 4 are provided with a plurality of rows of tape feeders 4a. Each tape feeder 4a is configured such that small pieces of chip parts such as ICs, transistors, capacitors, etc. are stored at predetermined intervals, and the held tape is led out from the reel. Electronic parts are taken out intermittently.

  Above the base 1, a head unit 6 for component mounting is provided. The head unit 6 is movable across the component supply units 4 and 4 and the component mounting unit on which the printed circuit board 3 is located. (In the direction to be).

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The head unit 6 is provided with a plurality of nozzle units 16 each having a component suction nozzle 16a as a holding means for holding electronic components. This nozzle unit 16 can be moved up and down (moved in the Z-axis direction) and rotated around the nozzle central axis (R-axis) with respect to the frame of the head unit 6, and is driven up and down such as a Z-axis servo motor (not shown). And it is actuated by a rotational drive means such as an R-axis servo motor. In the present embodiment, a configuration in which six nozzle units 16 are arranged is shown.

  Further, as shown in FIG. 3, a component recognition device 20 is mounted on the mounting machine. The component recognizing device 20 includes a reflection unit 17 that extends in the X-axis direction on the base 1 inside each of the component supply units 4 and 4 and a head unit that is aligned in the X-axis direction corresponding to each nozzle 16a. 6, an upper illuminating unit 19 and a side illuminating unit 21 fixed to the head unit 6 corresponding to each nozzle 16 a (each constituting an illuminating means), and adsorbing to each nozzle 16 a A first auxiliary mirror (auxiliary reflecting means) 22 for reflecting the side surface of the component thus formed toward the reflecting portion 17 side, and a reference mark 31 disposed on the head unit 6 for each nozzle 16a are provided.

  As shown in FIG. 3, the reflection unit 17 includes a box-shaped frame 23 that opens upward, a lower illumination unit (illumination unit) 24 that emits light upward in the frame 23, an X axis, A half mirror (reflecting means) 25 arranged parallel to the Y-axis motion plane and closing the opening of the frame 23, and a second auxiliary mirror (auxiliary reflecting means) arranged above the half mirror 25 26.

  The frame 23 is fixed on the base 1 and includes a mounting plate 23a on which the lower illumination unit 24 is mounted. The lower illumination unit 24 illuminates the suction component C along a first illumination means 24a that illuminates the electronic component C attracted by the nozzle 16a from directly below, and an optical axis K1 that is inclined in the Y-axis direction from the vertical direction. 2 illumination means 24b. These illumination means 24a and 24b are provided with LEDs 27 and 28, respectively, and the LEDs 27 and 28 illuminate the electronic component C through the half mirror 25. The half mirror 25 is fixed to the frame 23 in a state parallel to the XY plane. The second auxiliary mirror 26 is a strip-shaped mirror disposed along the long side portion of the half mirror 25 on the component supply unit 4 side, and is fixed to the frame 23 in a state parallel to the XY plane. The second auxiliary mirror 26 reflects the image of the side surface of the electronic component C reflected by the first auxiliary mirror 22 toward the camera 18 as will be described in detail later.

  The camera 18 is an imaging means including an area sensor, and images the side surface of the suction component C and the component lower surface C1 reflected by the half mirror 25 when the head unit 6 passes over the reflecting portion 17. ing. Specifically, the camera 18 images the lower surface of the electronic component C along the optical axis K2 inclined in the Y-axis direction from the vertical direction, and the optical axis K2 is applied to the suction component C before the regular reflection by the half mirror 25. It is set so that the lower surface of is located. Further, the camera 18 images the side surface of the electronic component C along the optical axis K3 toward the second auxiliary mirror 26, and the optical axis K3 is regularly reflected by the second auxiliary mirror 26, and further described in a first described later. It is set so that the side surface of the suction component C is positioned ahead of the regular reflection by the auxiliary mirror 22. As shown in FIG. 4, the focal point is focused on an imaging object separated by a distance (d1 + d2) obtained by adding the optical path length d1 from the camera 18 to the half mirror 25 and the optical path length d2 from the half mirror 25 to the component lower surface C1. So that the focal length of the camera 18 and the arrangement of the camera 18, the lower surface C1 of the component, and the half mirror 25 are set. Further, the optical path length da from the camera 18 to the second auxiliary mirror 26, the optical path length db from the second auxiliary mirror 26 to the first auxiliary mirror 22, and the axis line (electronic component C) of the nozzle unit 16 from the first auxiliary mirror 22. The arrangement of the camera 18, the second auxiliary mirror 26, the first auxiliary mirror 22, and the electronic component C is set so that the distance (da + db + dc) obtained by adding the optical path length dc is equal to the distance (d1 + d2). Furthermore, in the surface mounter of this embodiment, when the head unit 6 moves onto the component supply unit 4, the upper surface of the supply component C on the tape feeder 4a is located at a position away from the camera 18 by a distance (d1 + d2). Further, when the head unit 6 moves onto the printed circuit board 3, the upper surface of the printed circuit board 3 is set at a position away from the camera 18 by a distance (d1 + d2). That is, the surface mounter of the present embodiment is configured so that the camera 18 can image the supply component C on the tape feeder 4a, the printed circuit board 3 on the base 1, the component lower surface C1, and the side surfaces of the suction component C. A mirror 25 is disposed so as to protrude from the tape feeder 4a and the base 1, and a second auxiliary mirror 26 is disposed so as to protrude from the half mirror 25, and the upper surface of the electronic component C on the tape feeder 4a and the base 1 are disposed. The upper surface of the upper printed circuit board 3 is configured to be at the same height position.

Since the optical axis K2 of the camera 18 that images the component lower surface C1 is inclined with respect to the component lower surface C1, for example, an electronic component C having a rectangular component lower surface C1 as shown in FIG. In the case of imaging, as shown in FIG. 5B, the image captured by the camera 18 is projected in a trapezoidal shape in which the side away from the camera 18 on the component lower surface C1 is tapered, that is, the camera 18. Image with different perspectives depending on the distance from the camera. Therefore, it is also possible to obtain a regular image of the lower surface C1 of the component by performing image processing using the following formula (1) in order to correct the difference in imaging magnification. That is, when the captured image has Ylen pixels from the leftmost pixel address 0 to the rightmost pixel (Ylen-1) address in the Y direction, the imaging magnification at pixel 0 is set to 1, and the pixel (Ylen− 1) Assuming that the imaging magnification at the address is S, the magnification Sy at an arbitrary Y address can be obtained from the equation (1). Using this Sy, the image at the Y address is converted into a center line Ty parallel to the Y axis. An image as shown in FIG. 4A can be obtained by enlarging the image at the center and executing this process from the address 1 to the address (Ylen-1). However, since the processing takes time, the camera 18 according to the present embodiment employs a camera having an optical system as shown in FIG. That is, the camera 18 includes a lens array 28, and the lens array 28 has a conjugate relationship between the imaging plane M that is not perpendicular to the optical axis K 2 of the camera 18 and the component lower surface C 1 of the electronic component C. It is designed to transmit light.
Sy = 1- (1-S) * Y / (Ylen-1) (1)

  The upper illumination unit 19 is disposed at a position symmetrical to the camera 18 with respect to the nozzle 16a (a position symmetrical to the camera 18 in FIG. 3). The upper illumination unit 19 includes an LED 29 that illuminates the electronic component C along an optical axis K4 inclined in the Y-axis direction from the vertical direction. The optical axis K4 is a suction component that is specularly reflected by the half mirror 25. The camera 18 is set so that C is positioned and the camera 18 is positioned at the tip of the regular reflection by the suction component C and the half mirror 25. That is, the optical axis K4 reflected by the half mirror 25 and the optical axis K1 of the second illumination means 24b are parallel to each other.

  The said side illumination part 21 is equipped with LED30 which has an optical axis along the Y-axis direction, and this LED30 illuminates the adsorption | suction component C from the opposite side of the side surface used as an imaging target.

  The first auxiliary mirror 22 is attached to the head unit 6 in a state of facing the side illumination unit 21 through the nozzles 16a. Further, the first auxiliary mirror 22 reflects the image of the side surface of the suction component C toward the camera 18 in cooperation with the second auxiliary mirror 26. Specifically, the first auxiliary mirror 22 is disposed with its reflection surface inclined downward, and the image of the side surface of the suction component C under the illumination condition by the side illumination unit 21 is displayed as the second auxiliary mirror 26. The second auxiliary mirror 26 reflects the image toward the camera 18.

  The reference mark 31 is a substantially cylindrical rod-like member, and is erected on the lower surface of the head unit 6 that is within the imaging range of the camera 18. Therefore, as shown in FIG. 7, the image captured by the component recognition device 20 includes a component lower surface C1 and a lower surface of the reference mark 31 that are brightened by the upper illumination unit 19 or the lower illumination unit 24, and side illumination. The side surface of the electronic component C whose contour is raised by the portion 21 is projected.

  By the way, although not shown in the drawings, the mounting machine described above includes a well-known CPU that executes logical operations, a ROM that stores a control program by the CPU in advance, a RAM that temporarily stores various data, and the like. The servo motors 9 and 15 and the component recognition device 20 are all electrically connected to the control means. This control means has a function of identifying the position and contour of the object to be picked up based on the image picked up by the camera 18, and a function of controlling the driving of the servo motors 9, 15 and the like in accordance with these identification results. Yes. In the mounting operation, the servo motor 9 and the like are comprehensively controlled by this control means, so that a series of component mounting operations are executed according to a program stored in advance.

  Hereinafter, according to the flowchart of FIG. 8, an example of the mounting operation of the mounting machine based on the control of the control means will be described.

  First, a suction process for sucking the electronic component C is performed by each nozzle 16a (step S1). As the suction processing S1, first, the head unit 6 is moved to a position above the tape feeder 4a, and the electronic component C on the tape feeder 4a is imaged prior to the suction of the electronic component C. Based on this captured image, the displacement of the electronic component C with respect to the tape feeder 4a is detected, and the amount of movement of the head unit 6 is corrected according to the detection result. Next, after the electronic component C on the tape feeder 4a is sucked by the nozzle 16a of the nozzle unit 16 and the suction operation is executed for each nozzle unit 16, the head unit 6 is moved from the tape feeder 4a to the printed board 3 side. .

  In the moving process of the head unit 6 after the suction process S1, the electronic component C passes over the half mirror 25. At this time, the half mirror 25 and the first and second auxiliary mirrors 22 and 26 are moved by the cameras 18. The lower surface and the side surface of the electronic component C projected on are imaged (step S2). When each of the electronic components C attracted to each nozzle 16 is imaged by each camera 18, the electronic component C is attracted to the nozzle unit 16 based on the image on which the side surface of the electronic component C is projected (the electronic component C of the electronic component C). It is determined whether or not (including presence / absence) is normal (step S3). Here, it is determined that it is abnormal (for example, the electronic component C is not sucked or the electronic component C is tilted and sucked). If so (NO in step S3), error processing (step S4) is executed. As this error processing, when the electronic component C is sucked and sucked with respect to the nozzle 16a, the electronic component C is transported to a temporary storage unit (not shown), and then the suction processing S1 is executed again. If the electronic component C is not picked up, the suction processing S1 is executed as it is. On the other hand, if it is determined that the suction state of the electronic component C is normal (YES in step S2), it is determined whether there is a defect such as the shape of the electronic component C based on the image of the lower surface of the electronic component C. If it is determined (step S5), and it is determined that it is defective (NO in step S5), the electronic component C is transported to a defective product storage unit (not shown) (step S6), and the suction process S1 is performed again. Execute. On the other hand, if it is determined that the electronic component C is a non-defective product (YES in step S5), a correction value for the mounting position is calculated based on the image of the lower surface of the electronic component C (step S7). More specifically, the electronic component C and the reference mark 31 are shown in the image captured by the camera 18, and the displacement of the suction position of the electronic component C (nozzle unit) is examined by examining the relative positions of these components. 16), and the correction value of the mounting position is calculated based on this. When the correction value of the mounting position is calculated, all the electronic components C attracted to each nozzle unit 16 are printed on the printed circuit board while adjusting the movement amount of the head unit 6 for each electronic component C according to the correction value. 3 (step S8). Next, it is determined whether or not all the electronic components C are mounted on the printed circuit board 3 (step S9). If it is determined that there is an unmounted electronic component C (NO in step S9), the suction is repeated. On the other hand, if it is determined that the mounting of all the electronic components C has been completed (YES in step S9), the mounting operation is ended.

  In the mounting operation, when the head unit 6 moves onto the printed circuit board 3, the fiducial mark F (see FIG. 1) on the printed circuit board 3 is imaged by the camera 18 prior to mounting the suction component C. Further, it is possible to add a process of detecting the positional deviation of the printed circuit board 3 with respect to the base 1 based on the captured image and correcting the mounting position of the electronic component C according to the detection result at the time of mounting. This process does not need to be performed every time the electronic component C is mounted. For example, the process may be performed when the printed circuit board 3 is transported to the base 1 and the electronic component C is mounted on the printed circuit board 3 for the first time. . Further, when imaging the printed circuit board 3, in addition to the detection of the positional deviation, the surface state on the printed circuit board 3 (for example, confirmation of the adhesion of foreign matter or the state of solder paste applied to the surface of the substrate 3) may be performed. Is possible. Furthermore, it is possible to check whether or not a component is mounted at a predetermined mounting position by imaging the printed circuit board 3 after mounting the component.

  Prior to the mounting operation, the reference mark 31 of the head unit 6 is imaged, the position of the reference mark 31 in this image is stored in the control means, and the position of the reference mark 31 and the actual bottom surface of the electronic component C are actually stored. If the position of the reference mark 31 projected in the image captured is compared, the distortion or inclination of the half mirror 25 or the shift of the imaging timing can be detected.

  In the component recognition device 20 of the above-described embodiment, the lower illumination means 24 is provided in the frame 23 of the reflection unit 17. However, the present invention is not limited to this. For example, as shown in FIG. You may make it attach the 2 illumination means 24b on the base 1 in the vicinity position of the half mirror 25. FIG. In this embodiment, since the 1st illumination means 24a is not installed in the flame | frame 23, it can also be set as the structure which replaced the half mirror 25 with the normal mirror. Further, the second illumination unit 24b may be omitted and only the upper illumination unit 19 may be provided.

  In the component recognition device 20 of the above embodiment, the distance between the camera 18 and the tape feeder 4a and the printed board 3 is set to the focal length of the camera 18, so that the electronic component C and the printed board 3 on the tape feeder 4a are moved to the camera. However, the present invention is not limited to this configuration, and as shown in FIG. 9, a lens 32 that adjusts the focal length of the camera 18 is attached to the head unit 6 so as to be capable of relative displacement. It can also be. In this embodiment, the lens 32 is arranged on the optical axis K2 when imaging the supply component C and the printed board 3 on the tape feeder 4a, while the lens 30 is separated from the optical axis K2 when imaging the suction component C. It becomes possible to image each object to be imaged with the focal length of the camera 18 matched.

  Further, in the component recognition device 20 of each of the above embodiments, one camera 18 is disposed corresponding to one nozzle unit 16, but the present invention is not limited to this. For example, FIG. As shown in the figure, a single camera 18 may be provided corresponding to the two nozzle units 16. In this embodiment, the imaging range of the camera 18 is set so that the electronic components C attracted to the two nozzle units 16 can be simultaneously imaged.

  Moreover, although the part recognition apparatus 20 in the above embodiment employs an area sensor, the invention is not limited to this. For example, a camera including a line sensor is relatively displaced with respect to the head unit 6 by an LM guide or the like. It is also possible to mount such that the camera is moved with respect to the head unit 6 at the time of imaging, and the image of the electronic component C projected on the half mirror 22 by the camera is scanned.

  Furthermore, in the component recognition apparatus 20 of the above embodiment, the lower surface and the side surface of the electronic component C are simultaneously imaged. However, the present invention is not limited to this. For example, as illustrated in FIG. 4 is configured such that the side surface of the electronic component C sucked (taken up) from 4 is imaged, and the lower surface of the electronic component C can be imaged when the head unit 6 passes over the half mirror 25. It is also possible. Hereinafter, the difference between the component recognition device 120 and the component recognition device 20 of FIG. 3 will be described.

  The component recognizing device 120 includes a pair of stays 140 (one shown in the figure) standing upright on the component supply unit 4 in the X-axis direction, and a first bridge erected vertically between these stays 140. An auxiliary mirror 122 and a second auxiliary mirror 126, and a side illumination unit 121 attached to the outer surface of the frame 23 so as to face the second auxiliary mirror 126 in the Y-axis direction are provided. Between the second auxiliary mirror 126 and the side illumination unit 121, an outlet T of the electronic component C supplied by the tape feeder 4a is opened upward. The head unit 6 moved onto the component supply unit 4 picks up the electronic component C from the outlet T by the nozzle 16a extended downward, and the optical axis K5 of the camera 18 at the time of picking up is The side surface of the electronic component C being reflected by the first auxiliary mirror 122 and the second auxiliary mirror 126 and picked up by the nozzle 16a is set so as to be capable of imaging. The optical path length dd from the camera 18 to the first auxiliary mirror 122, the optical path length de from the first auxiliary mirror to the second auxiliary mirror 126, and the axis line (electronic component C) of the nozzle unit 16 from the second auxiliary mirror 126. The distance (dd + de + df) obtained by adding the optical path length df is set equal to the above (d1 + d2).

  Moreover, although the said embodiment demonstrated the structure which mounted the component recognition apparatuses 20 and 120 in the mounting machine, it is not limited to a mounting machine, For example, the component test apparatus which test | inspects electronic components C, such as an IC chip 40 can also be mounted.

  FIG. 12 is a plan view showing a component testing apparatus 40 on which the component recognition apparatus according to the present invention is mounted. In the figure, the X axis and the Y axis are shown in order to clarify the directionality.

  As shown in FIG. 12, on the base 41 of the component testing apparatus 40, a tray accommodating portion 42a for placing four trays for accommodating the electronic components C and the right side of the tray accommodating portion 42a are arranged. A tray accommodating portion 42b for placing the temporary storage tray and an inspection socket 43 for inspecting the electronic component C on the tray placed on each tray accommodating portion 42a are provided. A head 44 that can suck the electronic component C on the tray and can be displaced in the XY direction is provided above the position where the tray accommodating portions 42a and 42b are disposed. The electronic component sucked by the head 44 is provided. C is conveyed onto a pair of left and right movable tables 45. These movable tables 45 are moved to the receiving position P1 (shown by a solid line in the drawing) that can receive components from the head 44, and are moved in the Y direction to deliver the electronic components C to the transport head units 46A and 46B described later. It is mounted on the base 41 so as to be freely displaceable between possible delivery positions P2 (indicated by broken lines in the figure). At the upper position of each movable table 45, transport head units 46A and 46B are provided so that the electronic component C on the movable table 45 displaced to the delivery position P2 can be sucked. These transport head units 46A and 46B are supported by the base 41 so as to be freely displaceable in the X direction, and transport the electronic component C on each movable table 45 to the inspection socket 43. ing.

  In such a component testing apparatus 40, a pair of reflecting portions 17 are provided on the base 41 between each movable table 45 and the inspection socket 43 located at the delivery position P <b> 2. The head units 46 </ b> A and 46 </ b> B are provided with a camera 18 and a first auxiliary mirror (not shown), and the reflection unit 17, the camera 18, and the first auxiliary mirror constitute a component recognition device 220.

  When the transport head units 46A and 46B pass over the reflecting portion 17, that is, in the process of transporting the electronic component C on the movable table 45 at the delivery position P2 to the inspection socket 43, the component recognition device 220 performs electronic processing. The lower surface and the side surface of the component C are imaged to detect the suction state and surface state of the electronic component C. Here, the electronic component C detected as not being normally sucked is the transport head units 46A and 46B. Then, the sheet is conveyed again to the movable table 45 and then conveyed onto the tray placed on the temporary storage tray accommodating portion 42b.

  As described above, according to the component recognition device 20 (component recognition device 120, 220), the image of the lower surface of the electronic component C reflected by the half mirror 25 and the first and second auxiliary mirrors 22, 26 (first , The image of the side surface of the electronic component C reflected by the second auxiliary mirrors 122 and 126) can be captured by the same camera 18, so that the suction state and posture of the electronic component C with respect to the nozzle 16a are changed downward and sideward. It is possible to detect accurately based on images viewed from the two directions.

  According to the configuration in which the lower surface and the side surface of the electronic component C are simultaneously imaged, the time required to detect the suction state and posture of the electronic component C can be reduced.

  According to the configuration in which the image on the lower surface and the image on the side surface of the electronic component C are captured at different times, each image is a large image as compared with the case where these images are divided into a single image. As a result, it is possible to detect the suction state and posture of the electronic component C more accurately based on these images.

  According to the configuration in which the side surface of the electronic component C is imaged in the process of being picked up from the component supply unit 4, the side surface of the electronic component C picked up from the component supply unit 4 can be immediately imaged. When the component C is clearly displaced with respect to the nozzle 16a or when the electronic component C is not picked up, it is possible to quickly take measures such as picking up again.

It is a top view which shows roughly the surface mounter by which the component recognition apparatus which concerns on embodiment of this invention was mounted. It is a front view which abbreviate | omits and shows a part of surface mounting machine of FIG. FIG. 2 is a partial side sectional view mainly showing a component recognition apparatus in the surface mounter of FIG. 1. FIG. 4 is a partial side sectional view mainly showing an optical path length of a camera in the component recognition apparatus of FIG. 3. It is a top view which shows the component lower surface of an electronic component, (a) is an image in which the component lower surface imaged with appropriate imaging magnification is displayed, (b) is imaged between the near side and back side of a camera It is an image in which the lower surface of the component is displayed when a difference in magnification occurs. FIG. 4 is a partial side sectional view schematically showing the structure of a camera in the component recognition apparatus of FIG. 3. It is a figure which shows roughly the image imaged by the components recognition apparatus of FIG. It is a flowchart which shows mounting operation | movement of the surface mounting machine of FIG. It is side surface partial sectional drawing which abbreviate | omits and shows a part of mounting machine with which the component recognition apparatus of another embodiment was mounted. It is a top view which shows roughly the arrangement | positioning of the camera of the components recognition apparatus with respect to a mounting machine. It is side surface partial sectional drawing which abbreviate | omits and shows a part of mounting machine with which the component recognition apparatus of another embodiment was mounted. It is a top view which shows roughly the components test apparatus by which the components recognition apparatus which concerns on embodiment of this invention is mounted.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 4 Parts supply part 6 Head unit 9 Y-axis servo motor 15 X-axis servo motor 16a Nozzle 18 Camera 19 Upper illumination part 20, 120, 220 Component recognition apparatus 21 Side illumination part 22, 122 First auxiliary mirror 24 Below Illumination unit 25 Half mirror 26, 126 Second auxiliary mirror

Claims (9)

A holding unit that holds an electronic component; an imaging unit; a movable head unit; and a reflecting unit that is fixedly installed below a moving range of the head unit. The head unit is located above the reflecting unit. A component recognition device that captures an image of the lower surface of the electronic component reflected by the reflecting means when passing through the imaging means,
Auxiliary reflection means for reflecting the image of the side surface of the electronic component toward the imaging means,
A component recognizing apparatus configured to capture images of side surfaces and a lower surface of a specific electronic component reflected by the auxiliary reflecting unit and the reflecting unit into the same imaging unit.   2. The component recognition apparatus according to claim 1, wherein images of the lower surface and the side surface of the electronic component reflected by the reflection unit and the auxiliary reflection unit are simultaneously captured within an imaging range of the imaging unit.   2. The apparatus according to claim 1, wherein an image of the lower surface of the electronic component reflected by the reflecting means and an image of the side surface of the electronic component reflected by the auxiliary reflecting means are taken into the imaging means at different times. The component recognition apparatus according to 1.   The holding means is configured to pick up and hold a part from a predetermined supply unit, and the auxiliary reflecting means is configured to reflect an image of a side surface of the electronic component in the picking process toward the imaging means. The component recognition device according to claim 3, wherein the component recognition device is a component recognition device.   The component recognition apparatus according to claim 1, wherein the head unit further includes an illumination unit that irradiates an electronic component with illumination light.   6. The component recognition apparatus according to claim 1, wherein illumination means for irradiating the electronic component with illumination light is fixedly installed in the vicinity of the reflection means.   2. A reference mark capable of detecting a specific position of the head unit is formed in the head unit at a position where the image pickup unit can pick up an image together with an image of the lower surface of the electronic component. The component recognition apparatus according to any one of 6. A surface mounter on which the component recognition device according to any one of claims 1 to 7 is mounted,
A base supporting the reflecting means;
A component supply unit as a supply unit capable of supplying electronic components to the head unit;
A nozzle as a holding means capable of receiving the electronic component from the component supply unit and mounting the electronic component on the printed circuit board positioned on the base;
A drive mechanism for moving the head unit relative to the base,
The surface mounting machine, wherein the imaging unit is configured to image a lower surface and a side surface of the electronic component in a process in which the head unit conveys the electronic component from the component supply unit to the printed board. A component testing apparatus on which the component recognition device according to any one of claims 1 to 7 is mounted,
A base supporting the reflecting means;
An inspection socket provided on the base for inspecting electronic components;
A drive mechanism for moving the head unit relative to the base;
A tray serving as a supply unit that accommodates electronic components so as to be supplied to the head unit;
The component testing apparatus, wherein the imaging unit is configured to image a lower surface and a side surface of the electronic component in a process in which the head unit conveys the electronic component from the tray to the inspection socket.

Images