201102637 /、、發明說明： 【發明所屬之技術領域】 本發明係關於在液晶顯示面板等係平板且透明之面板基板周 緣部隔著異方導電膜安裝有電子零件或模組等的電路基板檢驗裝 【先前技術】 近年來’製造液晶顯示（LCD)面板、電漿顯示面板（PDP) 機EL顯示器等平面顯示器面板（FDp)時，於該面板基板周 :邛形成之電極搭載驅動用Ic等之情形下等，在透明（玻璃）基 J上，電極接塾安裝晶片狀電子零件（IC或LSI等）或模組等之 ^，係使用隔著異方導電膜（ACF) _此電子零件等，使此 者之間電性連接之方法。 、產吏用ACF之晶片安裝工序係採TAB方式、C0G方式，且 二::板4單ί,)基板進行ACF貼附-IC晶片安裝-壓接-板'ϋ工序（線）尚由配置成—列的基板裝載機、基 構Γ。、 附裝置、晶片安裝壓接裝置、基板檢驗裝置 狀能晶片安裝方法時，作為狀上述驅動用1C等安裝 狀恶良否之方法，已知使用微分干 ^ 此1C晶片等安裝方向之背面側（ ^ ' /、體而5，自 •察安財1C“等之透明面2严涉顯微鏡等觀 膜中之導電性粒子_而形成二電^之。「‘計=由異方導1 多時，判定安裝狀態良好。 土痕」數i，壓痕數量 又，作為自動判定上述汇晶片等 提議藉由使用CCD相機等攝影機顯良否之方法，有人 性粒子_狀_狀或她(對比），以導電 1)，或藉由與預先測定、記憶之壓接進方法（專利文獻 案匹配），判定壓痕強弱、數量、位衫像貧料進哲比—轉（圖 夏偏離或異物混入等方法（專 201102637 利文獻2)等。 方法寺願巧姻2中提議一種電子零件檢驗 此記·_焦點距離之資佳利用 距離，可縮短攝影機構對焦所需之時間。 最佳焦點 任mi等IC晶片等安裝m置（基板檢驗裝置）中 組裝於如上述“安裝卫序之最終過程部分，包含 平σ (移動平台），將自工序上游侧輸送f帛 而來之晶片安裝完畢的面板基板加以載置；γ料私（供給） 攝輸彻觸，自崎_面側拍 軸繞軸’且可沿著此ζ 可正確拍㈣繼速黯增影機構 心上用=:上4:成之=構_= 於上述面板基板其安裳面朝上 構配置於較此移動平台更下侧。相反地，上 置^，上職影機構配 檢驗）複數處’檢驗裝置亦多具有複數組上 或Υ方構驾攝影機構可細方向 面板述自動判定1C晶片等安裝狀態之基板檢驗裝置中， 位面朝上載置於移動平台上，自裝置下側拍攝安裂部 類t tf不面板周緣部’於本中請案中係檢驗對象部位）之 面板基㈣====於該移動平台’俾載置 201102637 影機料減較鱗，為防切雜平台接觸摄 行，？時ί會下 時進行配置，俾自移動平台上表面移動平台上 =ίΓ包含上述檢驗對象部位之檢 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2003-269934號公報 [專利文獻2]日本特開2005—227217號公報 【發明内容】 (發明所欲解決之課題) 而上述，在面板基板其檢，驗對象雜（端部）自[Technical Field] The present invention relates to a circuit board inspection in which an electronic component, a module, or the like is mounted on a peripheral portion of a transparent flat panel substrate such as a liquid crystal display panel and a transparent conductive film. [Previous Technology] In recent years, when manufacturing a flat panel display panel (FDp) such as a liquid crystal display (LCD) panel or a plasma display panel (PDP) EL display, the electrode substrate is mounted on the periphery of the panel substrate. In the case of the transparent (glass) base J, the electrode is mounted with a chip-shaped electronic component (IC, LSI, etc.) or a module, etc., and the use of an alternating conductive film (ACF) is used. Etc., a method of making electrical connections between the parties. The ACF wafer mounting process is based on the TAB method and the C0G method, and the second:: board 4 single, and the substrate is subjected to ACF attachment - IC wafer mounting - crimping - board 'ϋ process (line) is still configured The substrate loader and the base structure of the array. In the case of the mounting device, the wafer mounting pressure-bonding device, and the substrate-inspecting device-like wafer mounting method, it is known to use a differential dry method such as a 1C wafer or the like on the back side of the mounting direction. ^ ' /, body and 5, from the transparent surface of the 1C", etc. 2, the conductive particles in the film are strictly observed in the microscope, and the second electrode is formed. It is judged that the installation state is good. The number of soil marks i, the number of indentations, as a method of automatically determining whether the above-mentioned wafer or the like is proposed to be good by using a camera such as a CCD camera, human particles _ shape or her (contrast), Conducting 1), or by using the pre-measurement and memory crimping method (patent literature case matching), to determine the strength of the indentation, the number, the bit shirt like the poor material into the Zhebi-turn (the summer deviation or the foreign matter mixed in, etc.) Method (specialized in 201102637 and diligent literature 2), etc. Method Temple is willing to propose an electronic part to verify this record. _Focus distance is better than the distance, which can shorten the time required for the focusing of the camera. IC chip, etc. The substrate inspection device is assembled in a final process part of the installation process, and includes a flat σ (mobile platform), and the panel substrate on which the wafer has been transferred from the upstream side of the process is mounted; (Supply) Take the touch and touch, from the _ _ side of the side of the axis around the axis 'and can be along this ζ can be correctly shot (four) speed 黯 黯 黯 = = = = 上 上 上 上 = = = The panel substrate is disposed on the lower side of the mobile platform with the upper side facing up. Conversely, the upper part is mounted on the upper part, and the upper part is inspected. The plurality of inspection devices also have a complex array or a side view. The mechanism can automatically determine the mounting state of the 1C wafer and the like in the substrate inspection device, and the positioning surface is placed on the moving platform, and the bottom side of the device is photographed in the lower side of the device. t tf is not in the peripheral portion of the panel. The panel base of the inspection object part (4) ==== On the mobile platform '俾 201 102 201102637 影 料 减 减 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The surface of the platform is moved on the platform = Γ Γ contains the above test [Problems to be solved by the invention] [Problems to be solved] [Problems to be solved] [Patent Document 1] [Patent Document 1] JP-A-2005-269217 (Patent Document 2) And the above, in the panel substrate, the inspection object, the object (end) from
向延伸）之狀態下載置該面板基板之基板檢 檢驗時攝影機構對焦（細s)之際，會產生如A 1) 於面板基板產生魅曲或應變之間題 即1為取得檢驗縣部位微分干涉影像使狀攝影機構 (CCD相機或微分干涉顯微鏡等）焦點深度（景深）大致為土數十 Mm，相對於此’係檢驗對象之液晶顯示（LCD)面板、電漿顯示 面板（PDP)或有機EL顯示料平祕示II面板通常係使用大格 式玻璃基材形成，故會因製造時加熱、壓迫或拉伸而分別沿面板 寬度（長邊）方向產生相對較大的（數5μιη以上）翹曲或應變。 上述面板基板中央部雖係藉由先前所述之吸附機構等吸附、固定 於平面之上述移動平台上表面，但係檢驗對象部位之端部（緣部） 係自此移動平台朝空中（侧方）如凸緣般延伸，故無法矯正於每 一面板不同之翹曲或應變，會成為延緩上述攝影機構對焦作業之 原因。 —- -----------— -— 2) 面板基板振動之收斂需花費時間之間題 201102637 _板基’上述載置面 上述移動平a佟,门疋阿迷埏動，會發生定位結束， 特別是在僅t㈣較於移斜 獅減弱之現象。 之端部（緣部）的振動收斂相^費:基檢驗對象部位 因，亦會成為降低該檢驗子i 對焦作業之原 顯示器面板會逐漸大科，古大傾向於顯者，因今後平面 面板基板大型化會使載置側題之虞4配合此， >然持續使用小面積移動平台，會者’若仍 面板基板，導致該緣部__變4杆抓之方式支持此大型 否，亦可輕易適應面板大型化。 ^玉子令件女裝狀態良 (解決課題之手段；） 為達成上述目的，本發明之楚1 © t 含： 要曰係一種基板檢驗裝置，包 移動平台’將於端部附近之複 位電==板基板載置於其上二 拍攝 影像； 私MjI取付该部位之微分干涉 線性驅動機構，沿定位於該檢驗位 使該攝影機構滑動移動；及 置之基板各榀驗對象部位 資訊處理機構’根據自該攝 拍攝之檢驗對象部位安裝狀態良否传之衫像育料，判定所 -且在包含該檢驗對象部位至少農 平台側方突出之狀態下，載置該基板於該I之^^=綱錄 7 201102637 該基板檢驗裝置之特徵在於： 於s亥攝影機構附近配置有固定平台，以自下侧支樓自該移動 平台突出之基板端部。 ° 且本發明之基板檢驗裝置第2要旨係其中特別是該固定平台 形成為沿該攝影機構滑動方向延伸之棒狀。 a a且本發明之基板檢驗裝置第3要旨係其中尤其是該固定平台 匕έ吸附並固定該面板基板之吸附機構。 (發明之效果） 本發明之基板檢驗裝置在於基板周緣部安裝有電子震件等之 其安裝部位自移動平台朝側方突出之狀態下處i該於基 =、、彖将裝有電子零將之面板基板，其巾於面板基板下側且 固定平台’以自下表面側抵接上述面 ίΐίϊΐ 4雜並支狀’11此欲實現包含上述面板基板檢驗 緣^位之端部位置穩定化，以提升基板檢驗之再現性與精度。 f情之基板檢驗裝置不僅配置面板基板端部（i驗 ，#)，俾自移動平台朝側方突出，尚以固定平 ΙίΓ自I側支樓之，故即使移動平台移動以交換基板，ϋ面 板基板之檢驗縣雜每次亦可冑奴於侧位置（高产）。 ，支持上述面板基板端部，俾於接近其 置^側 ί二可墙正於每一面板不同(具有差異)之端部 交吸㈣上輕鮮台義而赴之振動，可财 ，此’本發明之基板檢驗裝置可 動 ί造成的不良影響至最小限度，提升安裝狀 ^，面板基板之檢驗對象部位每次皆設定於相同位 面板之振動亦會迅速收敛，故此基板檢驗裝置中，Γ 起至進人攝影㈣止之待命時間短，且 -心檢馳 且此基板檢驗裝置中，面板基板係由上述移動平台與固定平 201102637 台 =2巧持，故即使係大型（大面積)之基板亦可穩定受到支 因此，本务明之基板檢驗裝置亦可輕易適應面板大型化。、 且本發明之基板檢驗裝置内，其中特 影機動方向延伸之棒狀，係因其可橫 =於作為檢驗對象假定之最大尺寸面板基板之長度，藉^在^ 父、平台等情形下，可輕易對應各種尺寸之面板基板。 驗裝置内，其中尤其是上述固定平台包 定卜ϋ ^ 靖_，_討牢_實地固 基板之檢驗對象端部。且因吸附並固定面板基板之檢 右卜、fS、:可？程度矯正於每一面板不同之翹曲或應變，且具 有述私動平台停止後面板之振動亦可迅速收敛之優點。'、 【實施方式】 施形式詳細_本發明實施形態。惟本發明不由該實 FI 明第1實施形態中基板檢驗裝置重要部位之構成 ΐ狀=f示於該基板檢‘錄置設敍係檢驗對象之面板4 ίί:二’說明_裝置内（及工序内）基板之移動方向為 下（垂直）裝置内之進深方向為Υ方向，裝置之上 方向為方向。且移動平台1及固定平台4上表面所 或模於使晶片狀電子零件 電子雷政ί 方^電膜而a於卫作件W (液晶顯示面板、 一基板清’&為f體依裝载機 萝ΐ^ΓηΝ β〜 ¥膜貼附装置（ACF轉印）—晶片壓接 ，載機^構成之暫犧姻壓接)—基碰驗裝置(八01) 於第1貫施形態中基板檢驗裝置内，使用後述之輸送臂等將藉 201102637 ίίϊ,ΐ上游侧（圖1中左方）之異方導電膜貼附農置及晶片墨 接，置（省略圖不），於面板基板10一方端部附近既定位置 有複數1C晶片.（驅動HIC)丨丨之㈣面板作件w)導 ^ 本體内’移載並吸附、固定於附吸附接塾之移動平台增，移^ 驗f置，⑽微分干麵纖舰之攝影機構 攝載置於，、上表面la之面板基板1〇上的上述晶片安裝部位。 有位於面咖。下侧’支持此基板10檢驗 立移動平台1可獨立控制X、Y、G軸，且可沿此2轴繞 旋轉。沿灯二方向分別設有用以引導搭載有上述移動平△ ^之導軌’使賴服馬達u、略圖示）於此驅動。且移動^台丄 εί-* 3 · 伺服馬達，可調節ζ軸方向高度；及 伺服馬達，控制沿此ζ軸繞著θ軸之旋轉。 對象平台1面板置面（上表面la)面積小於係檢驗 =之面板基板1G ’為輕易自後述晶片安襄部位背面側進行攝影 業，可在面板基板1〇之檢驗對象部位（端部1〇a)自移 ( 突出（橫向延伸）之狀態下進行載置。且形成此上表面°la =平坦，於其表面配置有具有連通上述吸_構 孔寻之吸附接墊。 思4及軋 攝影機構2如圖2，由下列各部分組合而成： 物鏡部2a ; 之^分Γ步顯微鏡部2b ’包含微分干涉棱鏡及附同軸頂置照明 CCD相機部2c，具有影像資料輸出功能； 於=、，微分干涉顯微鏡部2b其特徵在於可藉由上述微分干紗 將被攝體之折射率或厚度變化轉換為干涉 匕 對比而加以觀察。又，宜使用熱放射少的藍色發光 10 201102637 照明之光源。 對象2影?置ΐ可沿定位於上述檢驗位置之基板各檢驗 ίtr二f 向滑動移動之線性驅動機構3上，藉由 所^之ics 卜 面板基板1G—方端部丨_近既定位置 電極）部其背面侧依序檢驗於上述面板 J板10-私糾崎近既定位置所安裝之IC“ u端子（電極） 哭述ff驅ϊ機構3中使用有可高速移動之線性舰致動 二…圖不）。且線性驅動機構3具有用以沿Z方向（上下方向） 構2高度並對焦之z方向調签機構如。此冗方向調整機構 動2使财可以微米（陴）單位調整攝影機構2高度之線性步進致 柘中基板檢驗裝置之特徵在於如前所述，於面板基 ，勒Λ”）固疋平台4。此固定平台4配置於上述 3機構2之間，於上述面板細G中自移動平台1朝 接ί係檢驗對象部位以外之位置，自下表面側抵 同’於此固定平台4上表面4a亦與上述移動平台1相 ^墊有先續述具有連通觸機構讀m纽等之吸附 %關於仙上麟獻基板檢驗裝置檢紙⑶面板等 面板基板10 (工作件w)之程序。 低寺 Ρ#ίΐϊϊΐ之基板檢驗裝置$ ’首先自轉上游侧，藉由輪 =^將純驗對象之晶片安裝完畢的面板基板1G導人裝置内， 又，動平台1上’俾其上表面1&位於面板基板10大致中央部。 # 動平台上表面la之吸附接塾吸附、固定面板中央部’ 出ίίΪ驗對象部位之端部施自移動平台1朝側方（γ方向）突 此而ϋ以移動平台1支持面板中央部，直接沿ζ方向稱微抬起 面板基板10，藉由上述移動平台iiXY移動，如以圖2之雙點劃 201102637 線所不’移動至面板基板10IC晶片u安裝部面對攝影機構2物鏡部 2吐方之檢驗位置。又，藉由另外設置之CCD相機等面板位置綠 認機構認知到面板基板1()上的對準記號等，微調_動平台】χγ 方=位置及θ|峨·正確之㈣後，移動平#1下降，面板基板 10疋位於正碟之檢驗位置（圖2之實線狀態）。 此時，面板基板10係檢驗對象部位之端部1〇a(晶片安裝部位） 於，近上述攝影機構2之位置由固定平台4自面板下側支持，且藉 由設於其上表面4a之上述吸附接墊吸附、固定，使面板基 之 定位確實。 其·人’攝影機構2與其基台一齊在線性驅動機構3上沿X方向滑 動移動，於，—既定點對焦加⑷，拍攝其放大影像。且將經 ，攝之影像資料（微分干涉像）送往未圖示之資訊處理機構，判 定經拍攝之檢驗對象部位安裝狀態良否。 又，於上述資讯處理機構中，藉由預先所設定，對應檢驗項 目之既定運算程式，轉換由攝影機構2輸入之影像資料（例如轉換 為根據25時級之職尺度之輝度分布賴將此與於每一檢驗 項目所設定之基準資料相比較，偵測不合該基準者為不良。 上且亡述資訊處理機構中，作為以下所述，用以對焦（f〇cus) 之，準系統之一環，設有最佳焦點距離計算部與其最佳焦點距離 §己$部。亦即’依此系統’於依序檢驗上述LCD面板等面板基板 =時f檢驗之前，先於相同之檢驗點對該最初之面板基板1〇重 複進7複數次用以對焦之攝影，根據所得之影像資料計算最佳焦 點距離，依此數值沿Z方向調節攝影機構2 (之物鏡2a)以進行對 焦，在此狀態下進行用以檢驗之攝影，並於上述資訊處理機構記 憶該對焦時所計算之最佳焦點距離。 又’搭載有一系統’於下次以後的檢驗中，不自另外設定之 基準值，或隨機數值鎖定焦點距離，而係依既定之運算法則自該 所記憶之最佳焦點距離導出預測最佳焦點距離，按照該距離決定 -攝影機構2Z方向之初期位置，自此位置喜動對焦^……一 且於逐一重複檢驗之過程中，可每次皆記憶對焦時之最佳焦 12 201102637 點距離，自额記憶之最健、舰_祕檢驗對象之面板基板 ίο形狀之差異傾向，故若自前次以前所記憶之最佳焦點距離之差 異中抽出-定的傾向，施加對應該差異之修正而導出删最佳隹 點距離，即可更迅速地依重複檢驗，對應係 & 之差異傾向進行對焦。 乃文衣丨诅 依上述構成，於本實施賴中基板檢驗裝 1〇端部術，俾於接近該緣部之位置自下側抬起，故可抑制 面板不同（具有差異）的端部10a之麵曲或應變，並可 檢驗對象部位之面板基板10端部10a於每次相同之位置（高度）’。、 動迅速吸收因上述移動平台1移動而產^之振 之振動亦少，故本實施形態中之基板檢 驗衣置可抑制此雜錢振動㈣檢驗所 限度，提升安餘態、檢驗之魏性無度。岐不^ a至最低 移動二驗對象部位每^設定於相同位置，因 面板設°定“人攝故此基板檢驗裝置自 μ進m待命時間短’且因上述用以對焦 於習知者本^施形能中之之時間亦短。因此，相較 (工序）高ί化 檢齡置可使此等—連串檢驗作業 之端ί 巾上翻定平纟4會吸關定面板基板10 故有可續正某程度於每一面板不同之趣曲或應變之優 故可影機構2滑動方向延伸之棒狀， 且藉由使此象端部，相當理想。 尺寸面板基板10之長檢驗縣缺之最大 輕易對應各種尺寸之面板換上述移動平台1等之情況下， 繼作為實際 圖3係不意顯示本發明第2實施形態中基板檢驗裝置構成與動 13 201102637 作圖。 本實施形態中之基板檢驗楚置亦組裝並配置於炎隔著異 電膜安裝“狀電子零件或模崎社作件默工序（ =分内’此基板檢驗裝置（A0I)使用輸送臂12將於工序上游側（圖 =之平面顯示器面板（FDP)導入裝置本體内，移載並吸附、固定 附接墊之移動平台卜丨，後，移動此移動平台丨、丨，至既定檢 =置，以附微分干涉顯微鏡功能之攝影機構2、2,拍攝載置於豆 上表面FDP上的上述晶片安裝部位。 、八 此w土’此基板檢驗裝置中’檢驗線並列設有2線，可使2個工作 二備^^檢、驗。因此’其移動平台(1、丨，）與攝影機構(2、2，） i ί()。且雖與第1實施形態相同，亦設有自下側支掠工 产^檢驗對象端部之固定平纟⑷，但非分別形成於每一此等 ^驗^而係作為共通之棒_定平台5戦於2個檢驗線。、 說關於此基板檢驗裝置（腦）之動作（工作件流程）。 方）iitii置使用輸送臂12將藉由位於工序上游側（圖3中左 等的工作财魏“狀電子零件或模組 移載至可?雜置或是A—B，位置）， 附吸附接墊之二juir動且可调節z方向高度並繞著_旋轉之 持各面板，直接沿2方向稍微抬起此等面板， 構辦工作件準記H微調至ΐ η，下降，定位久工 走轉角正確之位置後，移動平台 .心士 位各f作件％於正確檢驗位置(圖3C、C,位置}。 之位晉丁茲1、上述第1實施形態相同’.於接近上述攝影機構2、2， 之位置’細咖梢5自面細支持係工 14 201102637 象部位之其端部(晶片安裝部位），並 塾吸附、固定之，使各工作件w之定位確;，、上表面之吸附接 攝影機構2、2，與其基台—齊在線性驅動 7Γ) /σΧ方向滑動移動，各攝影機構2、2,獨自於既定點斟Γ —(focus)，_各檢驗對象雜之放 _ ^對焦 貧料(微分干涉像)送往未圖示之資J處:將3攝之，錄 檢驗對象部位晶片安裝狀態良否。 、冓判疋經拍攝之 心二檢驗形成於工 件w上的對準記號等，微調至各移動忍知工作 ’ &_上_訊處理機構 =移載，移_工序·(断右方)之_=: 其後，將藉由上述資訊處理機構判定#「 且肘猎由上述貝汛處理機構判定係「 繼爛：丨』 拋棄或再利用之（圖3F位置）。 作件a ^施形紅基板檢驗裝置亦可抑制於每一工 每次相同^位。’亚可確實設定工作件檢驗對象端部於 傳至工作件w，提^^ 上述各轉平纟卜〗，之振動 —提升女農狀恶檢驗之再現性與精度。 本只細形恶中之基板檢驗裝置内，因移動平台卜1，移動 15 201102637 之振動可迅速收斂，工作卿自設定至進 命日㈣豆，且因上述檢驗線雙重化，可以更高聶f H之待 旦;機基板f縣置中，上述固定平台5‘為沿攝 Η 4之纽下，輕骑應各種尺寸之面板。 侧十口 又’依上述第2實郷態之基紐驗裝置 it可i觸LCD模組端部之_藉由=固定平 1 之吸附降低至ΙΟΟμιη以下。 午狀口疋十σ5 舰述f赌郷‘態中，巧揭示於每-各檢驗線逐—設置攝影 於备一但亦可於每一各檢驗線配置複數此攝影機構2。 ί日士鬥ρΓί此等攝影機構同時併行，同時_複數處，故可在更 短㈠·間内使檢驗結束。 H f上述攝影機構2不僅可沿X方向設置，亦可沿Y方向單獨設 有複數個。依此構成，料—整體可在非常短 。又，於上述沿Υ方向設置之攝影機構2附近， « …5又置支樓此卫作件w或是面板基板1G檢驗對象（γ方向） 端邵之固定平台。 【產業上利用性】 本發明之基板檢驗裝置對檢驗在液晶顯示（lcd)面板、電 板/PDP)或有機EL顯示器等大型透明玻璃基板上隔著 ”導電膜（ACF)壓接有晶片狀電子零件(IC或LSI等）或模組等 之面板而言相當理想。 【圖式簡單說明】 圖1係顯不本發明第1實施形態中基板檢驗裝置重要部位構 成之立體圖。 一......... · ......... 圖2係顯不於第1實施形態之基板檢驗裝置設定有係檢驗對 16 201102637 象之面板基板之狀態之侧視圖。 圖3係示意顯示本發明第2實施形態中基板檢驗裝置構成與 動作圖。 【主要元件符號說明】 W〜工作件 1、 1’〜移動平台 la〜上表面 2、 2’〜攝影機構 2a〜物鏡部 2b〜微分干涉顯微鏡部 2c〜CCD相機部 3〜線性驅動機構 3a〜Z方向調整機構 4、5〜固定平台 4a〜上表面 10〜面板基板 10 a〜端部 11〜1C晶片 12〜輸送臂 13〜不良品架 17When the substrate is inspected for the substrate inspection and inspection (the thin s) when the substrate is inspected, the result is as follows: A 1) The fascination or strain between the panel substrate is generated. The depth of focus (depth of field) of the interference imaging imaging mechanism (CCD camera or differential interference microscope, etc.) is approximately tens of meters of soil, compared to the liquid crystal display (LCD) panel, plasma display panel (PDP) or The organic EL display material flat panel II is usually formed by using a large-format glass substrate, so that it is relatively large in the direction of the panel width (long side) due to heating, pressing or stretching at the time of manufacture (number 5 μm or more). Warp or strain. The center portion of the panel substrate is adsorbed and fixed to the upper surface of the moving platform by a suction mechanism or the like as described above, but the end portion (edge portion) of the inspection target portion is directed from the moving platform toward the air (side) ) If it extends like a flange, it cannot be corrected for different warpage or strain of each panel, which may be the reason for delaying the focusing operation of the above-mentioned photographing mechanism. ——— -----------———— 2) The convergence of the vibration of the panel substrate takes time between the questions 201102637 _ plate base 'the above-mentioned mounting surface is the same as the above movement, the threshold is awkward The positioning will end, especially in the case that only t (four) is weaker than the moving lion. The vibration of the end portion (edge portion) converges: the base inspection object is also reduced, and the original display panel that reduces the focus of the inspection i will gradually become a large subject. If the size of the substrate is large, the 侧4 of the mounting side will be matched with this. > However, the small-area mobile platform will continue to be used. If the panel substrate is still in use, the edge will be supported by the edge __ 4 poles. It can also be easily adapted to the large size of the panel. ^玉子令件女装良良 (means to solve the problem;) In order to achieve the above objectives, the present invention 1 1 t contains: To be a substrate inspection device, the package mobile platform 'will be reset near the end == The board substrate is placed on the top two to capture the image; the private MjI takes the differential interference linear drive mechanism of the part, and the photographing mechanism is slid and moved along the check position; and the information processing mechanism of each object of the substrate is set 'Based on the image of the inspection image of the test object to be photographed from the shot, the judgment is made - and the substrate is placed on the I in the state where the inspection target portion protrudes at least on the side of the agricultural platform. =章册7 201102637 The substrate inspection device is characterized in that: a fixed platform is arranged in the vicinity of the shai photography mechanism, and the end portion of the substrate protruded from the mobile platform from the lower branch. Further, the second object of the substrate inspection apparatus of the present invention is that the fixed platform is formed in a rod shape extending in the sliding direction of the photographing mechanism. A a and the third aspect of the substrate inspection apparatus of the present invention is an adsorption mechanism in which the fixed platform 匕έ adsorbs and fixes the panel substrate. (Effect of the Invention) The substrate inspection apparatus of the present invention is characterized in that the mounting portion of the electronic vibration member or the like is attached to the periphery of the substrate from the moving platform to the side, and the base is replaced by the electronic zero. The panel substrate has a towel on the lower side of the panel substrate and the fixed platform 'abuts against the surface from the lower surface side, and the end portion of the panel substrate is stabilized. To improve the reproducibility and accuracy of substrate inspection. The substrate inspection device of f is not only configured with the end of the panel substrate (i test, #), but also protrudes from the mobile platform to the side, and is still fixed from the I side branch, so even if the mobile platform moves to exchange the substrate, The inspection of the panel substrate can also be carried out at the side position (high yield). Supporting the end of the above-mentioned panel substrate, so that the wall is close to the side of the panel, and the wall is in the opposite end of each panel (different), and the vibration is good. The substrate inspection device of the present invention can minimize the adverse effects caused by the movement, and improve the mounting state. The vibration of the panel of the panel substrate is set to be the same at each time, and the vibration of the panel is quickly converged, so that the substrate inspection device is lifted. In the case of the camera (4), the standby time is short, and the heart-testing and the substrate inspection device are the substrate of the above-mentioned mobile platform and the fixed flat 201102637, so even a large (large-area) substrate is used. It can also be stably supported. Therefore, the substrate inspection device of the present invention can be easily adapted to the enlargement of the panel. Further, in the substrate inspection apparatus of the present invention, the rod shape in which the direction of the shadow is extended is because the length of the panel substrate which is assumed to be the largest size assumed by the inspection object, by the parent, the platform, etc. It can easily correspond to panel substrates of various sizes. In the inspection device, in particular, the above-mentioned fixed platform package includes the end of the inspection object of the solid-solid substrate. And because of the adsorption and fixing of the panel substrate, the right, fS,: can? The degree is corrected to the different warpage or strain of each panel, and the vibration of the panel after the stop of the private platform can also quickly converge. 'Embodiment> The embodiment is detailed in the embodiment of the present invention. However, the present invention is not limited to the configuration of the important portion of the substrate inspection device in the first embodiment of the present invention, and is shown in the panel 4 of the substrate inspection device. In the process, the moving direction of the substrate is that the depth direction in the lower (vertical) device is the Υ direction, and the direction above the device is the direction. And the upper surface of the mobile platform 1 and the fixed platform 4 or the mold is used to make the electronic components of the wafer-shaped electronic components, and the protective film W (liquid crystal display panel, a substrate clearing & Carrier ΐ ΐ Γ Ν Ν 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 In the substrate inspection apparatus, the transfer conductive arm or the like described later is attached to the upstream side (the left side in FIG. 1) of the opposite-side conductive film, and the ink is attached to the wafer and the wafer is placed (not shown) on the panel substrate. There is a plurality of 1C wafers at the predetermined position near the end of 10. (Drive HIC) 丨丨 (4) Panel work w) Guide ^ The body 'transfers and adsorbs and fixes the mobile platform with the adsorption joints, and moves the test The photographic mechanism of the (10) differential dry-faced fiber carrier mounts the above-mentioned wafer mounting portion on the panel substrate 1 of the upper surface la. There is a coffee shop. The lower side supports the substrate 10 inspection. The vertical moving platform 1 can independently control the X, Y, and G axes, and can rotate around the 2 axes. In the two directions of the lamp, there are respectively provided guide rails for carrying the above-mentioned moving flat Δ^, and the driving motor u, which is slightly illustrated, is driven. And move ^台丄 εί-* 3 · Servo motor, which can adjust the height of the 方向 axis; and servo motor to control the rotation around the θ axis along this 。 axis. The panel substrate 1G of the target platform 1 (the upper surface la) is smaller than the panel substrate 1G of the inspection = the photographic work is easily performed from the back side of the wafer mounting portion described later, and the inspection target portion (end portion 1) of the panel substrate 1 can be used. a) Self-moving (protrusion (lateral extension) state is carried out. And the upper surface is formed to be flat_la = flat, and an adsorption pad having the above-mentioned suction-construction hole is disposed on the surface thereof. The mechanism 2 is composed of the following parts as shown in Fig. 2: the objective lens portion 2a; the branching microscope unit 2b' includes a differential interference prism and a coaxial overhead illumination CCD camera unit 2c, and has an image data output function; The differential interference microscope unit 2b is characterized in that the refractive index or thickness variation of the subject can be converted into interference 匕 contrast by the differential dry yarn. Further, it is preferable to use blue light emission with less heat radiation 10 201102637 illumination The light source of the object 2 can be placed along the linear drive mechanism 3 of the substrate that is positioned at the above-mentioned inspection position, and is slidably moved by the RGB panel. The back surface side of the fixed position electrode portion is sequentially inspected on the panel J plate 10 - the IC mounted on the position of the private correction island near the predetermined position "u terminal (electrode) crying ff drive mechanism 3 uses a linear ship capable of high speed movement Actuating the second (not shown), and the linear drive mechanism 3 has a z-direction adjustment mechanism for aligning the height in the Z direction (up and down direction) and focusing. For example, the redundant direction adjustment mechanism moves 2 to make the micron (陴) The unit-adjusting photographic mechanism 2 height linear step-inducing medium-substrate inspection device is characterized in that, as described above, the panel base is reinforced and the platform 4 is fixed. The fixed platform 4 is disposed between the three mechanisms 2, and is located at a position other than the portion to be inspected from the moving platform 1 in the panel thin G, and is abutted from the lower surface side, and the upper surface 4a of the fixed platform 4 is also In addition to the above-described mobile platform 1, the procedure of the panel substrate 10 (worker w) such as the panel for detecting the paper (3) of the board of the board of the Supreme Linyi substrate inspection device is described. The low-level substrate inspection device $' first rotates the upstream side, and the panel substrate 1G on which the wafer of the pure object is mounted is guided into the device by the wheel=^, and the upper platform 1& Located at a substantially central portion of the panel substrate 10. # sorption of the upper surface of the platform, adsorption, and the central part of the fixed panel. The end of the inspection object is applied from the mobile platform 1 to the side (γ direction), and the mobile platform 1 supports the central portion of the panel. The panel substrate 10 is slightly lifted in the ζ direction, and moved by the moving platform iiXY, as shown by the double dot 201102637 line of FIG. 2, not moved to the panel substrate 10IC wafer u mounting portion facing the objective lens portion 2 of the photographic mechanism 2 The inspection position of the spit. Further, by the panel position green recognition mechanism such as a separately provided CCD camera, the alignment mark on the panel substrate 1() is recognized, and the fine adjustment_moving platform] χγ side=position and θ|峨·correct (4) are moved. #1降, the panel substrate 10疋 is located at the inspection position of the positive disc (the solid line state of Fig. 2). At this time, the panel substrate 10 is an end portion 1a (a wafer mounting portion) of the inspection target portion, and the position of the photographing mechanism 2 is supported by the fixed platform 4 from the lower side of the panel, and is provided on the upper surface 4a thereof. The adsorption pad is adsorbed and fixed to ensure the positioning of the panel base. The human-photographing mechanism 2 slides along the X direction on the linear drive mechanism 3 together with the base, and the fixed-point focus is added (4) to capture the enlarged image. The image data (differential interference image) that has been photographed is sent to an information processing unit (not shown) to determine whether the image of the inspection target portion is in good condition. Further, in the information processing unit, the image data input by the photographing unit 2 is converted by a predetermined calculation program corresponding to the test item (for example, converted into a luminance distribution according to the 25th-level job scale). Compared with the benchmark data set in each inspection item, it is not good to detect the non-conformity. In the information processing organization, as described below, for focusing (f〇cus), the quasi-system One ring, with the best focus distance calculation unit and its best focus distance § has been. That is, 'in accordance with this system' in order to verify the panel substrate such as the LCD panel = before the f test, before the same checkpoint pair The first panel substrate 1 〇 repeats 7 times for focusing photography, calculates the optimal focus distance based on the obtained image data, and adjusts the photographing mechanism 2 (the objective lens 2a) in the Z direction according to the value to perform focusing. In the state, the image is used for inspection, and the best focus distance calculated by the information processing mechanism is used to memorize the focus. The 'equipped with a system' is used in the next test, The preset reference value or the random value locks the focus distance, and the predicted optimal focus distance is derived from the best focus distance memorized according to the predetermined algorithm, and the initial position of the 2Z direction of the photographing mechanism is determined according to the distance. From this position, the focus is on the focus ^... and in the process of repeating the test one by one, the best focus 12 201102637 point distance can be memorized every time, the panel of the most reliable, ship-station inspection object ίοThe difference in shape, so if you extract the tendency from the difference in the best focus distance you remembered before, and apply the correction corresponding to the difference to derive the best defect distance, you can repeat the test more quickly. The difference between the corresponding system & the tendency is to focus. According to the above configuration, in the implementation of the substrate inspection device, the end of the substrate inspection device is lifted from the lower side at a position close to the edge portion. Suppressing the curvature or strain of the end portion 10a of the panel (having a difference), and checking the end portion 10a of the panel substrate 10 at the same position (height) at each time. Since the vibration of the vibration generated by the movement of the moving platform 1 is small, the substrate inspection clothing in the present embodiment can suppress the limit of the vibration (4) inspection, and improve the safety state of the security state and the inspection.岐不^ a to the lowest movement of the second inspection object is set to the same position each time, because the panel is set to "the person is photographed, the substrate inspection device is short from standby time" and is used to focus on the learner. The time in the shape energy is also short. Therefore, compared with the (process) high-level inspection, the end of the series of inspection operations can be lifted and the flat panel 4 will suck the panel substrate 10. It can be renewed to a certain extent in the different pieces of music or strain of each panel, and the rod-like shape of the shadow-receiving mechanism 2 is extended in the sliding direction, and the end portion of the image-like substrate is quite ideal. In the case where the panel of the various sizes is easily replaced with the above-described mobile platform 1 or the like, the structure of the substrate inspection apparatus and the motion 13 201102637 in the second embodiment of the present invention are not shown in the actual drawing. In the present embodiment, the substrate inspection is also assembled and placed in the vicinity of the smear-proof electronic component or the mold-like electronic component (in the sub-input), the substrate inspection device (A0I) uses the transfer arm 12 On the upstream side of the process (Fig. = the flat display panel (FDP) is introduced into the body of the device, the mobile platform of the attached pad is transferred and adsorbed and fixed, and then the mobile platform is moved, 丨, 丨, to the predetermined check = set, The above-mentioned wafer mounting portion placed on the FDP of the upper surface of the bean is photographed by the photographing mechanisms 2 and 2 with the differential interference microscope function. The two inspection lines of the 'in this substrate inspection device' are provided with two lines in parallel. 2 jobs are provided for inspection and verification. Therefore, 'the mobile platform (1, 丨,) and the photographic mechanism (2, 2,) i ί(). And as in the first embodiment, there are also The side branch plucks the product to check the fixed flat 纟 (4) at the end of the object, but it is not formed separately for each of the above-mentioned tests, but is used as a common bar _ fixed platform 5 戦 on two inspection lines. Inspection device (brain) action (workpiece flow).) iitii set using transport arm 12 will be attached to the upstream side of the process (the left side of the work in Figure 3, "the electronic components or modules are transferred to the miscellaneous or A-B, position", with the adsorption pad The height of the z-direction can be adjusted and the panels can be rotated around the _ to directly lift the panels in the direction of the 2, and the work piece is accurately fine-tuned to ΐη, and the position of the long-distance walking angle is correctly positioned. , mobile platform. Each position of the heart position is in the correct inspection position (Fig. 3C, C, position}. The position of the Jindingz 1, the first embodiment is the same '. close to the above-mentioned photography institutions 2, 2, Position 'fine coffee tip 5 self-face fine support system 14 201102637 The end of the image part (wafer mounting part), and 塾 adsorption, fixed, so that the positioning of each work piece w;,, the upper surface of the adsorption joint photography Mechanisms 2, 2, and their abutments are aligned in a linear drive 7Γ) /σΧ direction, each camera mechanism 2, 2, alone in the established point 斟Γ — (focus), _ each test object miscellaneous _ ^ focus poor Material (differential interference image) is sent to the unmarked capital J: 3 shots, the test object is mounted on the wafer. No. 冓 疋 疋 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心_=: After that, it will be judged by the above-mentioned information processing mechanism #" and the elbow hunting is determined by the above-mentioned Bellow processing mechanism to be discarded or reused (Fig. 3F position). ^The red-shaped substrate inspection device can also be suppressed to the same position every time. 'Aco can set the end of the workpiece inspection object to the work piece w, and raise the above-mentioned various flats. Vibration—Improve the reproducibility and accuracy of the female farmer's evil test. In this thin-form substrate test device, the vibration of the mobile platform can be quickly converged due to the movement of the platform, and the work is self-set to the date of birth (four) beans. And because the above test line is doubled, it can be higher; the machine board f county is centered, the above fixed platform 5' is under the button 4, and the light ride should be a panel of various sizes. The side ten port and the device according to the second actual state of the above-mentioned device can be touched by the end of the LCD module by the = fixed flat 1 adsorption is reduced to below ιμιη. Noon 疋 σ σ 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 舰 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧 巧ί日士斗ρΓί These cameras are in parallel at the same time, and at the same time _ plural, so the inspection can be completed in a shorter (one). H f The above-described photographing mechanism 2 can be provided not only in the X direction but also in the Y direction. According to this composition, the material - the whole can be very short. Further, in the vicinity of the photographing mechanism 2 disposed along the above-mentioned Υ direction, «...5 is also a fixed platform for the support member w or the panel substrate 1G inspection object (γ direction) end. [Industrial Applicability] The substrate inspection apparatus of the present invention is inspected on a large transparent glass substrate such as a liquid crystal display (LCD panel), an electric panel (PDP) or an organic EL display, and is bonded to the wafer by a "conductive film (ACF). It is preferable to use a panel such as an electronic component (IC, LSI, etc.) or a module. [Brief Description] Fig. 1 is a perspective view showing an essential part of a substrate inspection device according to a first embodiment of the present invention. Fig. 2 is a side view showing a state in which the substrate inspection device of the first embodiment is provided with a panel substrate of the test pattern 16 201102637. The structure and operation diagram of the substrate inspection apparatus according to the second embodiment of the present invention are schematically shown. [Description of main component symbols] W to the workpiece 1, 1' to the moving platform 1a to the upper surface 2, 2' to the imaging mechanism 2a to the objective lens 2b ～Differential interference microscope unit 2c to CCD camera unit 3 to linear drive mechanism 3a to Z direction adjustment mechanism 4, 5 to fixed stage 4a to upper surface 10 to panel substrate 10a to end 11 to 1C wafer 12 to transport arm 13~ Bad goods rack 17