201108348 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種對準基板的方法，且更明確地 說，本發明涉及以下一種對準基板的方法，即，其甚至在 未識別出對準標記中的一些的情況下仍能夠使用對準標記 來對準基板。 【先前技術】 通常’使用一種用於對準基板的設備來將基板定位在 基板安放單元（substrate seating unit)(例如，基座 (susceptor)或表面板（surface plate))上或使兩個基板彼 此精確地對準。 。現今，正在使用更多的平板顯示器，例如，液晶顯示 器（liquid crystal display，LCD)裝置、等離子顯示面板 (plasma display pand，PDP )和有機發光裝置（〇rganic 叫以 emitting device，0LED)。這些平板顯示器是通過附接上 面形成有精細圖案（fine patterns)的一對平板基板（flat panel substrates )而製造出來的。 對準並附接兩個基板為極其重要的過程，這是因為基 板的附接通常是在面板處理的最終階段期間執行的。二果 基板在最終階段顧未鮮，那麼只好丢棄整塊面板。此 外，形成在基板上的精細圖案也應在對準過程 且因此需要極其精確地對準基板。 記 4 201108348 使基板的對準標記彼此對準來對準具有精細圖案的兩個基 板。 在根據相關技術的用於對準基板的設備中，在所有對 準標記對料作出對準完成的決策，且接·著執行下一個操 作（例如，基板的附接）。㈣，在精細圖案處理期間， 對準標記中的-些在被薄膜無意遮住時或歸因於用於對準 基板的設備的視覺系統出麟障而可能無法識別出。、在對 準標記中的-些由於任何原因而未被識別出時，不可完成 對準過程。將此狀態視為出錯，且因此，下— 對準過程無法繼續下去。 # 此外，根據相關技術’在對準標記的識別不成功時， 應人工找出所述料標記贿對準過m因此，總操 增加，且生產力降低。此外，如果人工仍未識別出 對準標記，那麼將丟棄基板。 【發明内容】 本發明提供一種基板對準方法，所述方法基於識別出 的對準標記驗置來確定未識別出的對準標記的位置且基 於經確定的位置來對準基板，且因此能夠減少對準出錯 (aUgnmer^er^oO、縮短基板對準時間並改進生產力。 根據示範性實施例—_於對準基板的方法包含： 置在Ϊ板對準設備上;確定是否識別出所述基板 的對料記，在識別出所有對準標記的位置的條件下，基 f識別出的對準來對準基板，在未識別出-半以上的對準 標此的位置的條件下，產生對準出錯信號，或在識別出至 201108348 標記的位置的條件下，基於識別出的對準標 5己的位置料絲朗A的料治 =::r經確定的位置和識別出的對二 識別出的對準標記的位置 置之前存儲識別出的對準 所述方法可更包含：在基於 來確定未識別出的對準標記的位 標記的位置。 的她ίΓΖΓ μ板的四個區域處、對準標記 別出的對準標記的位置來確定未識別出的對準 :對角磕含繪製連接識別出的對準標記中的彼此 === 者的對角線;使所述對角線繞著所述 出的對準標記中的—者均著所述未識別出的對 位麵轉多達45度轉製-條參照線;使所述對 者所述兩個朗出的對準標記中的另—者且朝著所 j識別出的對準標記的位置旋轉多達45度以繪製另一 2照線；以及將兩條所述參照_相交點設為所述未識 別出的對準標記的位置。 在多㈣準標記佈置在基__區域處、對準標記 佈置具有矩形形狀’且對準標記中的—者未識別出 押.’ 土於制出的對準標記的位置來確定未識別出的對準 :己的位置可包含.分職所述識別出的對準標記中的兩 開始缘製兩條參照線，兩個所述識別出的料標記是彼 此在對角線上相向的，其巾所述參縣巾的—者經繪製成 6 201108348 與基板的-側平打’所述側鄰近於所述未識別出 記和所述兩個識別出的對準標記中的一者，且所述來昭^ 中的另-者經繪製成與基板的另—側平行，所述另;鄰 近於所述未識別出的對準標記和所述兩個識別出的對準標 記中的另一者；以及將所述兩條參照線的相交點設為所^ 未識別出的對準標記的位置。 & 在基板具有矩形形狀、多個對準標記佈置在基板的四 對準標記中的兩者未識別出時，所述基於識 對準“的位置來較未識別出的對準標記的位 U含：_連接兩個識別出的對準標記的第—參照線； 一參照線繞著所述兩個識別出的對準標記中的-者且 =所=未識別出的對準標記的位置旋轉多達45度以繪 ^第參照線；使第—參照線繞著所述兩個識別出的對準 者且财所述未朗a㈣轉記的位置旋 ▲以纟t製帛二參照線;從所述識別丨的對準 二=繪製第四參照線，其中所述第四參照線二 準伊=3，平行’所述侧鄰近於所述未識別出的對 你^+._、—者和所述兩個識射的對準標記中的-者； 線，;:標記中的另一者開始繪製第五參照 所、十、£ 4第參照線經㈣成與基板的另—側平行， ^ -側鄰近於所述未識別出的對準標記中的另— 參照:=的對準標記中的另一者;以及將所述第二 準標記的位^。五參照線的相交點設為所述未識別出的對 201108348 在夕個對準標記佈置在基板的四個區域處 的總體佈置具有轉職，且對準標記中的—者未識^出 時』，基於識別丨的對準標記的位絲確定未酬出的對準 L己的位置可包含：存儲所述識別出㈣準標記的位置； 使基板旋轉至少―:欠，每次㈣％度；識別錢轉的基板 的對準標記的位置；存職轉後所述識別出的對準標纪的 ㈣；調旋轉的基板的至少兩個區域處的對準標記的 位置，使得其無轉前紐岐少_祕 以及將經旋轉的基板的識別出的對上 °戠別出的對準標記的區處的位置存儲為所述未 為別出的對準標記的位置。 在夕個對準標記佈置在基板的四個區域處、 ^總^置具有矩形形狀’謂準標記中的兩者未識別出 二 別出的對準標記的位置來確定未識別出的對準 ^ 可包含.在基板上設定參照點；存儲所述識別 -次對ΐί記相對於所述參照點的位置；使基板旋轉至少 的灵;人旋轉9G度使經旋轉的基板的中心點與旋轉前 的基板的贿巾讀鮮；以及驗旋轉的 位於所述初始未姻㈣鮮標記的區處的 存儲為所述未識別出的對準標記的位置。 易懂為明之上述和其他目的、特徵和優點能更明顯 明如下特舉較佳實施例，並配合所關式，作詳細說 【實施方式】 8 201108348 可由結合附圖所進行的以下描述來更詳細地理解示範 性實施例。 下文中，將參看附圖來詳細地描述具體實施例。然而， 本發明可以不同形式來體現，且不應解釋為限於本文中所 闡述的實施例。而是，提供這些實齡m使得本發明將為 詳盡且完整的，且將本發明的範圍充分傳達給所屬領域的 技術人員。在圖式中，相同元件符號始終指代相同元件。 圖1是根據示範性實施例的基板對準設備的示意圖。 參看圖1，所述基板對準設備包含：台（stage)2〇〇, 其適合於將基板100安放在其上；校準單元3〇〇，其適合 於在Χ、γ、ζ和Θ方向上校準基板刚；視覺系統（visi〇n system) 400，其適合於檢測基板1〇〇的經對準的位置；.以 及對準控鮮το ’其適合練據視覺彡統铜來控制 該校準單元3〇〇的操作。 在示範性實施例中，彳有效地將透光基板（例如，破 ^基板或塑料基板）用於基板則。而且，可使用柔性基 ^ °用於基板100對準的對準標記形成在基板1〇〇的一侧 =舉例來說，如果基板1〇〇為矩形的，那麼對準標記可 四個角區域中的每—者處。然而’並不限於此，對 中不5己可安置在四個側中的每—者的中間區域中。在圖式 將料Ϊ準標記安置在四個角區域處。根據示範性實施例， 、=標記提供在至少兩個區域ψ以實現有效對準。 (例:2〇0固疋基板1〇0以防止基板100在基板處理過程 ’ ’液晶滴落、密咖塗覆和基板附接）躺移動且因 201108348 而出現缺陷。雖然未圖示，但可將液晶滴落設備、密封劑 塗覆設備或基板附接設備提供在台200上。 這意味著基板對準設備可屬於液晶滴落設備、密封劑 塗覆設備和基板附接設備的組成部分。也可將基板對準設 備提供在上述這些設備外部。此處，基板附接設備的基板 對準設備可在χ、γ、ζ和Θ方向上移動上基板和下基板中 的任一者。 台200具有與基板100形狀相同的板形式。台2〇〇包 含台對準標記，即，用以對準基板1〇〇的參照對準標記。 台對準標記使得基板100能夠安置在台2〇〇的上部部分上 的正確位置處《台對準標記經安置成對應於基板1〇〇的對 準標記。 在不範性實施例中，通過使基板對準標記與台對準標 。己對準而對準基板1〇〇。在將上基板與下基板彼此附接 時，使上基板的對準標記與下基板的對準標記對準。 ，準單7L 300通過對基板100進行精細校準來將基板 1〇〇安置在台200上的既定位置中。更具體來說，校準單 元300通過在X、丫、2和㊀方向上移動基板⑽來校準基 板100的位置。 視覺系統400使用照相機41〇來拍攝基板丨〇〇和台2〇〇 的對準標記且向視覺控制器（visiQn e。咖此）供應拍 攝結果。視覺线400存儲各對準標記的坐標結果。 對準控制單元500使用視覺系統4〇〇所拍得的 圖像或 圖像數據來㈣鮮單元_ _作。因此，執行基板1〇〇 201108348 的精細校準。 對準控制單元500包含對準標記補償模塊。在基板1〇〇 、一些對準標記雜置未朗it況下，料標記補償 模塊確細述未識別出的對準標記驗置，且使用經確定 的位置來執行對準。因此，即使對準標記巾的—些未能讀 出（識別出），仍可防止出錯。 圖2疋說明根據示範性實施例的用於對準基板的方法 的流程圖。 首先，如圖2中所示，將基板1〇〇安置在裝置上以對 準基板100 (S100)。即，在示範性實施例中，如圖1中 所示’將基板⑽安置在適合於對準基板刚的台2〇〇上。 接下來，確疋疋否識別出基板的對準標記 (S11〇)。如圖1中所示，視覺系統_識別基板100的 對準標記。之所喊行這個過程是因為如前面在【背景技 術】中所述，基板100的對準標記在精細圖案處理期間可 能已被去除。 在减定識別出所有對準標記時，使台對準標記（即， 上述參照對準標記）與基板100的對準標記對準（si2〇)。 在確定-半]^上㈣準標記未識別出時，將此情況確認為 對準出錯，且產生出錯信號⑽〇)。在產生出錯信號時， 丟棄基板0 在有-個對準標記到一半的對準標記未識別出時，基 於識別出的對準標記來確定未識別出的對準標記的位置 (S140)。接下來’通過使識別出的對準標記和未識別出 201108348 的對準標記的經確定的位置與台200的對準標記（即，上 述參照對準標記）對準來對準基板100 (S150)。 下文中’將更具體地解釋對是否識別出基板1〇〇的對 準標記的確定。參看圖1，視覺系統400的四個照相機* 經安置成對應於基板100的角區域，對準標記安置在所述 角區域處。照相機410 (其聚焦透鏡）拍攝對準標記所^ 於的區域的圖像。分析所拍得的圖像以確定是否識別出對 準標記。在基板100為透明的情況下，將不透明材料用於 對準標記。因此，確定不透明區域的形狀是否類似（在預 定容許範圍内大體上相同）於所輸入的對準標記。 然而，並不限於上述情況，而是可以各種其它方式來 執行對是否識別出對準標記的確定。舉例來說，可通過單 個照相機或肉眼來識別各解標記。料，_本示範性 實施例，可在確定是否識別出對準標記期間確定並存儲 別出的對準標記的坐標值。 由於如上文所述，在示範性實施例中在執行對準之 識別出對準標記，因此可縣找出包括錢別出的對準標 記的任何基板。另外’還確^哪些基板可用於進行進一: 處理。通過此過程，可縮短總的處理時間，且可易於確$ 是否前進到下-個步驟。舉例來說，财均 別出的基板⑽可直接經受基板對準過程。另一方Π 去棄未識別出-半以上的料標記的基板⑽ —步使用。 下文中’參看圖式來描述—種基於朗出的對準標記 12 201108348, 以確定未識別出的對準標記的位置的方法。 圖3是說明根據示範性實施例的用於確定未識別出的 對準標記的位置的方法的視圖。 在以下描述中’將多個對準標記佈置在基板的四個區 域處。對準標記的總體佈置可具有矩形形狀。具體來說， 四個對準標記佈置在矩形基板上。在圖3的實例中，未識 別出所述四個對準標記中的一者。基板的形狀不限於矩形 形狀，而是其可具有圓形形狀或任何其它形狀。 如上文所描述，視覺系統確定是否在基板上的四個位 置處識別出對準標記的位置。此處，如圖3中所示，識別 出三個對準標記的位置，而一個對準標記未識別出。 存儲所述三個識別出的對準標記（即，第一到第三對 準標s己Ml、M2和M3 )的位置。以如下方式來確定第一 到第三對準標記Μ卜M2和M3的位置。基板對準設備計 算基板的X軸長度和Υ軸長度。基於所計算出的χ轴長 度和Υ軸長度來確定所述三個識別出的對準標記Μ2 和M3的位置。此處，基板的中心可變成坐標中心。然而， 基板的任一個角區域可為坐標中心。將第—到第三對準標 記m、M2和M3的位置存儲在上述對準控 視覺系統400中。 接下來，使用所存儲的第-到第三對準標記m 和M3的位置來確定未識別出的對準標記（即，第四對準 Γϊ。根據本示範性實施例，使連接彼此在 對角線上相向的第一對準標記M!與第三對準標記Μ 3的 13 201108348 =著第—對準標記M1和第三對準標記M3且朝 =標記(即，第四對準標記M4)的位置 方疋轉。适疋因為第四對準標記 夏 侧匯合的角區域處。 4所處㈣域疋女置在兩 此處，對角線！^可逆時針方向（即，繞著第一對準 未識別出的對準標記的位置）旋轉45度， 照線…另外，對角㈣可順時針方向 立晉對準標錢3且朝縣識別出的對準標記的 位置）旋轉45度，借此繪製第二參照線u。接下來 算第-參照線L2與第二參照線L3的相交點。將所述相^ 點設為未識別出的第四對準標記M4的位置。旋轉角度不 限於45度’且可根據所述多個對準標記的總體佈置的ς 而變化。 j而並不限於上述方法，而是可從第一對準標記 Ml P歼1始繪製第一參照線L2’且可從第二對準標記M2、開 始繪製第mlu。第—參照線u經繪製成與基板的 一側平行，所述側鄰近於未識別出的對準標記M4和第一 對準標記Ml。第二參照線u鱗製成與基板的另一側平 行，所述另一側鄰近於未識別出的對準標記％4和第三對 準標記M3。將第一參照、線L2與第二參照線u的相^點 設為第四對準標記M4的位置。 在如上所述而確定未識別出的對準標記的位置後，使 用未識別出的對準標記的經確定的位置和識別出的對準標 記的位置來對準基板。 不 201108348 此處，未識別出的對準標記的經確定的位置鱼a 上的識別出的對準標記的中心點對準。更具體來 : 別出的對準標記的經確定的位置對應於一個坐標位署未識 得其在技術上^具有面積（area)，而識別出的對= 則為具有預定面積的真實標記。在所述坐標位 = 視覺系統識別的台對準標記（即，上述參照對準標^ 中心點時，確定基板已對準。 的 根據上述方法，在未識別出對準標記中的— 時，可實現基板的對準。雖然已相對於基板 =進行上文的描述，但上述方法可應用於基板二= ^ ΐ且’甚至在未識別出安置在矩形基板上的四個對準 時’仍可執行基板對準。現在將參看圖= 圖4是說明根據示範性實施例的第一經修改實 於確定未_㈣料標記驗置的方法的湖。用 ^繪示僅識別出兩個對準標記的位置的情況。即， =出第-對準標記M1和第二對準標記Μ2的位置 ‘別出第二對準標記Μ3和第四對準標記Μ4的位置。 j，繪製連接第-對準標記奶與第二對準標記吣 對進柄'照線UG。接下來，使第—參照線L1G繞著第— 2^記M1且朝著未識別出的對準標記M3和M4逆時 一=向旋轉45度，以便繪製第二參照線L2〇。此外， 一，照線uo繞著第二對準標記M2且朝著未識別出 15 201108348 45度，以便繪製第三灸 準標記M3和M4順時針方向旋轉 照線L30。 而且i從第-對準標記奶開始的第四參 繪製以與基板.的-側平行，所述側鄰近於第201108348 VI. Description of the Invention: [Technical Field] The present invention relates to a method of aligning a substrate, and more particularly, to a method of aligning a substrate, that is, even if it is not recognized Alignment marks can still be used to align the substrate with some of the alignment marks. [Prior Art] Generally, a device for aligning a substrate is used to position a substrate on a substrate seating unit (for example, a susceptor or a surface plate) or two substrates. Align precisely with each other. . Today, more flat panel displays are being used, such as liquid crystal display (LCD) devices, plasma display pands (PDPs), and organic light-emitting devices (〇rganic called emitter devices, 0 LEDs). These flat panel displays are manufactured by attaching a pair of flat panel substrates on which fine patterns are formed. Aligning and attaching two substrates is an extremely important process because the attachment of the substrate is typically performed during the final stages of panel processing. The second substrate is not fresh at the final stage, so the entire panel has to be discarded. In addition, the fine patterns formed on the substrate should also be in the alignment process and thus require extremely precise alignment of the substrate. Note 4 201108348 Align the alignment marks of the substrates with each other to align the two substrates with the fine pattern. In the apparatus for aligning a substrate according to the related art, the alignment completion decision is made at all of the alignment mark materials, and the next operation (e.g., attachment of the substrate) is performed. (d) During the fine pattern processing, some of the alignment marks may not be recognized when the film is unintentionally hidden by the film or due to the visual system of the device for aligning the substrate. The alignment process may not be completed when the alignment marks are not recognized for any reason. This state is considered an error, and therefore, the bottom-alignment process cannot continue. # Further, according to the related art, when the identification of the alignment mark is unsuccessful, it should be manually found that the material mark is aligned with m, so that the total operation is increased and the productivity is lowered. In addition, if the alignment mark is still not recognized by the hand, the substrate will be discarded. SUMMARY OF THE INVENTION The present invention provides a substrate alignment method that determines a position of an unrecognized alignment mark based on the identified alignment mark inspection and aligns the substrate based on the determined position, and thus is capable of Reducing alignment errors (aUgnmer^, reducing substrate alignment time and improving productivity. According to an exemplary embodiment - a method of aligning a substrate includes: placing on a seesaw alignment device; determining whether the The alignment of the substrate, under the condition that the position of all the alignment marks is recognized, the alignment recognized by the base f is aligned with the substrate, and the position is generated without identifying the position of the alignment target of more than half. Aligning the error signal, or under the condition that the position marked to 201108348 is recognized, based on the identified alignment mark 5, the position of the material yam A ==:r determined position and the identified pair The method of identifying the aligned alignment marks prior to storing the identified alignment may further include: determining the position of the bit marker based on the unidentified alignment mark based on the four regions of the panel ,Correct Marking the position of the aligned alignment mark to determine the unidentified alignment: the diagonal 磕 contains the diagonal of each other in the alignment mark identified by the connection; the diagonal is wrapped around One of the out-of-alignment marks is rotated by the unidentified alignment face by up to 45 degrees to the reference line; the pair of the two aligned alignment marks are And further rotating the position of the alignment mark recognized by j by up to 45 degrees to draw another 2 line; and setting the two reference_intersection points to the unidentified alignment mark The position of the multi-(four) quasi-marker is arranged at the base__region, the alignment mark arrangement has a rectangular shape 'and the alignment mark is not recognized. The position of the alignment mark is determined. Unrecognized alignment: the position of the position may include two reference lines in the two identified alignment marks, and the two identified material marks are diagonally opposite each other. The towel of the Shenxian towel is drawn as 6 201108348 with the side of the substrate - the side is adjacent to the Identifying one of the two identified alignment marks, and the other one of the two is drawn parallel to the other side of the substrate, the other; adjacent to the And identifying the other of the identified alignment marks and the two identified alignment marks; and setting the intersection of the two reference lines to the position of the unidentified alignment mark. When the substrate has a rectangular shape and a plurality of alignment marks are disposed in the four alignment marks of the substrate, the position based on the "alignment" is less than the position U of the unidentified alignment mark. :_ connecting the first reference line of the two identified alignment marks; a reference line is rotated around the two of the two identified alignment marks and = the position of the unidentified alignment mark Up to 45 degrees to draw the reference line; the first reference line is rotated around the two identified aligners and the position of the unremarkable a (four) turn is 纟t to make the second reference line; Aligning from the identified 二 == drawing a fourth reference line, wherein the fourth reference line is two quasi-i = 3, parallel 'the side neighbor In the unidentified one of the alignment marks of your ^+._, - and the two illuminating marks; the line, the other of the marks starts to draw the fifth reference point, ten , the fourth reference line is (4) parallel to the other side of the substrate, the ^-side is adjacent to the other of the unidentified alignment marks, the other of the alignment marks of the reference: = The bit of the second quasi-marker. The intersection of the five reference lines is set to the unidentified pair 201108348. The overall arrangement of the alignment marks disposed at the four regions of the substrate has a transfer, and the alignment marks are not recognized. Determining the position of the unrecognized alignment L based on the position of the alignment mark identifying the 丨 may include: storing the position identifying the (four) quasi mark; rotating the substrate at least ―: owed, each time (four)% Identifying the position of the alignment mark of the substrate on which the money is transferred; (4) identifying the alignment mark after the job rotation; adjusting the position of the alignment mark at at least two areas of the rotated substrate so that it does not rotate The front button is less secret and the position of the identified alignment mark of the rotated substrate is stored as the position of the unaligned alignment mark. The unaligned alignment is determined by arranging the alignment marks at four regions of the substrate at the four regions of the substrate, and the two of them have a rectangular shape, and the two of the alignment marks do not recognize the position of the two alignment marks. ^ may include: setting a reference point on the substrate; storing the position of the identification-secondary 相对 相对 相对 relative to the reference point; rotating the substrate at least; the person rotating 9G degrees to rotate the center point and rotation of the substrate The brittle towel of the front substrate is read; and the position of the rotation at the initial unmarked area is stored as the position of the unrecognized alignment mark. The above and other objects, features and advantages of the present invention will become more apparent from the description of the preferred embodiments illustrated in the accompanying claims. The exemplary embodiments are understood in detail. Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these inventions are provided so that this invention will be thorough and complete, and the scope of the invention will be fully conveyed by those skilled in the art. In the drawings, the same component symbols are used to refer to the same components. FIG. 1 is a schematic diagram of a substrate alignment apparatus, according to an exemplary embodiment. Referring to Fig. 1, the substrate alignment apparatus comprises: a stage 2 〇〇 which is adapted to mount the substrate 100 thereon; a calibration unit 3 〇〇 which is adapted to be in the Χ, γ, ζ and Θ directions Calibrating the substrate; a vision system 400, which is adapted to detect the aligned position of the substrate 1; and an alignment control το' which is suitable for controlling the calibration unit according to the visual copper 3 〇〇 operation. In an exemplary embodiment, the crucible is effective for using a light transmissive substrate (e.g., a substrate or a plastic substrate) for the substrate. Moreover, an alignment mark for alignment of the substrate 100 may be formed on one side of the substrate 1〇〇 using a flexible substrate. For example, if the substrate 1 is rectangular, the alignment mark may have four corner regions. Everywhere in the middle. However, it is not limited thereto, and the center can be placed in the middle portion of each of the four sides. In the figure, the standard mark is placed at the four corner areas. According to an exemplary embodiment, the = mark is provided in at least two regions to achieve effective alignment. (Example: 2〇0 solid-state substrate 1〇0 to prevent the substrate 100 from being slid during the substrate processing process 'liquid crystal dripping, close-coating, and substrate attachment') and defective due to 201108348. Although not shown, a liquid crystal dropping device, a sealant coating device, or a substrate attachment device may be provided on the stage 200. This means that the substrate alignment device can be part of a liquid crystal dropping device, a sealant coating device, and a substrate attachment device. Substrate alignment devices can also be provided external to these devices. Here, the substrate alignment apparatus of the substrate attachment apparatus can move any of the upper substrate and the lower substrate in the χ, γ, ζ, and Θ directions. The stage 200 has the same plate form as the substrate 100. The table 2 includes a table alignment mark, i.e., a reference alignment mark for aligning the substrate 1〇〇. The stage alignment marks enable the substrate 100 to be placed at the correct position on the upper portion of the stage 2's "the stage alignment marks are disposed to correspond to the alignment marks of the substrate 1". In an exemplary embodiment, the substrate alignment marks are aligned with the stage. The substrate 1 is aligned with the alignment. When the upper substrate and the lower substrate are attached to each other, the alignment marks of the upper substrate are aligned with the alignment marks of the lower substrate. The order sheet 7L 300 is placed in a predetermined position on the stage 200 by finely aligning the substrate 100. More specifically, the calibration unit 300 calibrates the position of the substrate 100 by moving the substrate (10) in X, 丫, 2, and one side. The vision system 400 uses the camera 41 to capture the alignment marks of the substrate and the table 2 and supply the shooting result to the visual controller (visiQn e). The visual line 400 stores the coordinate results of the respective alignment marks. The alignment control unit 500 uses the image or image data captured by the vision system 4 to make a fresh cell __. Therefore, the fine calibration of the substrate 1〇〇201108348 is performed. The alignment control unit 500 includes an alignment mark compensation module. In the case where the substrate 1 、 and some of the alignment marks are mismatched, the material mark compensation module details the unidentified alignment mark inspection and performs alignment using the determined position. Therefore, even if the alignment marks are not read (recognized), errors can be prevented. 2A is a flow chart illustrating a method for aligning a substrate, according to an exemplary embodiment. First, as shown in Fig. 2, a substrate 1 is placed on the apparatus to align the substrate 100 (S100). That is, in the exemplary embodiment, the substrate (10) is placed on the stage 2 that is suitable for aligning the substrate just as shown in FIG. Next, it is confirmed whether or not the alignment mark of the substrate is recognized (S11〇). As shown in Figure 1, the vision system_ identifies the alignment marks of the substrate 100. This process is called because the alignment marks of the substrate 100 may have been removed during the fine pattern processing as previously described in [Background Art]. When all of the alignment marks are identified, the stage alignment marks (i.e., the above-mentioned reference alignment marks) are aligned with the alignment marks of the substrate 100 (si2〇). When it is determined that the semi-mark is not recognized, the situation is confirmed as an alignment error and an error signal (10) is generated. When the error signal is generated, the substrate 0 is discarded. When the alignment mark having half of the alignment marks is not recognized, the position of the unrecognized alignment mark is determined based on the recognized alignment mark (S140). Next, the substrate 100 is aligned by aligning the identified alignment mark with the determined position of the alignment mark of 201108348 with the alignment mark of the stage 200 (ie, the above-mentioned reference alignment mark) (S150) ). The determination of whether or not the alignment mark of the substrate 1 is recognized will be explained more specifically hereinafter. Referring to Fig. 1, four cameras* of the vision system 400 are disposed to correspond to corner regions of the substrate 100 at which alignment marks are disposed. The camera 410 (its focus lens) captures an image of the area where the alignment mark is located. The captured image is analyzed to determine if the alignment mark is recognized. In the case where the substrate 100 is transparent, an opaque material is used for the alignment mark. Therefore, it is determined whether the shapes of the opaque regions are similar (substantially the same within a predetermined allowable range) to the input alignment marks. However, it is not limited to the above case, but the determination as to whether or not the alignment mark is recognized may be performed in various other manners. For example, each de-marking can be identified by a single camera or by the naked eye. In the present exemplary embodiment, the coordinate values of the other alignment marks may be determined and stored during the determination of whether or not the alignment mark is recognized. Since the alignment marks are recognized in performing the alignment in the exemplary embodiment as described above, it is possible to find any substrate including the alignment marks of the money. In addition, it is also true which substrates can be used for further processing. Through this process, the total processing time can be shortened, and it is easy to determine whether $ advances to the next step. For example, a substrate (10) that is uniform can be directly subjected to a substrate alignment process. The other party Π discards the substrate (10) that does not recognize more than half of the material mark. Hereinafter, a method of determining the position of an unrecognized alignment mark based on the aligning mark 12 201108348 will be described with reference to the drawings. FIG. 3 is a view illustrating a method for determining a position of an unidentified alignment mark, according to an exemplary embodiment. In the following description, a plurality of alignment marks are disposed at four regions of the substrate. The overall arrangement of the alignment marks can have a rectangular shape. Specifically, four alignment marks are arranged on a rectangular substrate. In the example of Figure 3, one of the four alignment marks is not recognized. The shape of the substrate is not limited to a rectangular shape, but it may have a circular shape or any other shape. As described above, the vision system determines whether the position of the alignment mark is identified at four locations on the substrate. Here, as shown in Fig. 3, the positions of the three alignment marks are recognized, and one alignment mark is not recognized. The positions of the three identified alignment marks (i.e., the first to third alignment marks s M1, M2, and M3) are stored. The positions of the first to third alignment marks M M2 and M3 are determined in the following manner. The substrate alignment device calculates the X-axis length and the x-axis length of the substrate. The positions of the three identified alignment marks Μ2 and M3 are determined based on the calculated χ-axis length and the Υ-axis length. Here, the center of the substrate can become a coordinate center. However, any corner area of the substrate may be the coordinate center. The positions of the first to third alignment marks m, M2, and M3 are stored in the above-described alignment control vision system 400. Next, the positions of the stored first to third alignment marks m and M3 are used to determine the unidentified alignment marks (ie, the fourth alignment marks. According to the present exemplary embodiment, the connections are made to each other The first alignment mark M! and the third alignment mark Μ 3 on the corner line 13 201108348 = the first alignment mark M1 and the third alignment mark M3 and toward the = mark (ie, the fourth alignment mark M4) The position of the position is 疋 。 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四 第四A position of the unidentified alignment mark is rotated by 45 degrees, and the line is illuminated. In addition, the diagonal (four) can be aligned clockwise to the position of the mark 3 and the position of the alignment mark recognized by the county is rotated 45. Degree, thereby drawing a second reference line u. Next, the intersection of the first reference line L2 and the second reference line L3 is counted. The phase is set to the position of the unidentified fourth alignment mark M4. The angle of rotation is not limited to 45 degrees' and may vary depending on the 布置 of the overall arrangement of the plurality of alignment marks. j is not limited to the above method, but the first reference line L2' may be drawn from the first alignment mark M1 P歼1 and the mlu may be drawn from the second alignment mark M2. The first - reference line u is drawn parallel to one side of the substrate, the side being adjacent to the unidentified alignment mark M4 and the first alignment mark M1. The second reference line u scale is made parallel to the other side of the substrate, the other side being adjacent to the unidentified alignment mark %4 and the third alignment mark M3. The phase of the first reference line L2 and the second reference line u is set to the position of the fourth alignment mark M4. After determining the position of the unrecognized alignment mark as described above, the determined position of the unrecognized alignment mark and the position of the identified alignment mark are used to align the substrate. No 201108348 Here, the identified position of the unidentified alignment mark is aligned with the center point of the identified alignment mark on the fish a. More specifically: the determined position of the alignment mark corresponding to a coordinate position does not recognize that it has a technical area, and the identified pair = is a true mark having a predetermined area. When the coordinate position=the table alignment mark recognized by the vision system (ie, the reference alignment mark center point, the substrate is aligned), according to the above method, when the alignment mark is not recognized, Alignment of the substrate can be achieved. Although the above description has been made with respect to the substrate =, the above method can be applied to the substrate 2 = ^ ΐ and 'even when four alignments disposed on the rectangular substrate are not recognized' Performing Substrate Alignment. Reference will now be made to Figure 4, which is a lake illustrating a first modified method of determining a non-(four) material mark inspection according to an exemplary embodiment. Only two alignments are identified by The position of the mark. That is, the position of the first alignment mark M1 and the second alignment mark Μ2 is 'the position of the second alignment mark Μ3 and the fourth alignment mark Μ4. j, draw the connection - Aligning the marker milk with the second alignment mark 吣 the handle ray UG. Next, the first reference line L1G is made around the first record M1 and toward the unrecognized alignment marks M3 and M4. When a = direction is rotated 45 degrees, in order to draw the second reference line L2 〇. In addition, one, according to the line uo Around the second alignment mark M2 and toward the unrecognized 15 201108348 45 degrees, in order to draw the third moxibustion marks M3 and M4 to rotate the illumination line L30 clockwise. And i is the fourth from the first alignment mark milk The reference is drawn in parallel with the - side of the substrate, the side being adjacent to the
Mi和未識別出的對準標記M4。即，基板的所述侧:匕己 在第-對準標d Ml與未朗$的第四對準標記糾 的側。另外，從第二對準標記M2開始的第五參 = 經繪製以與基板的另-侧平行，所述另—娜近於第 準標s己M2和未識別出的對準標記皿3。即，基板的所另 一側為安置在第二對準標記M2與未識別出的對準 M3之間的側。 π 5己 將第二參照線到第五參照線的相交點設為未識別出的 對準標記的位置。具體來說，將第三參照線L3〇與第四泉 照線L40的相交點設為第四對準標記M4的位置。將第二 參照線L20與第五參照線L50的相交點設為第三對準標記 M3的位置。 ^ 接下來，使用第三對準標記M3和第四對準標記M4 的經確定的位置來對準基板。雖然針對矩形基板來解釋示 範性實施例，但基板可具有矩形形狀、正方形形狀或任何 其它多邊形形狀。雖然已針對45度的旋轉角度來解釋示範 性實施例，但旋轉角度可根據對準標記的總體佈置的形狀 而變化。 或者，可通過使基板旋轉來確定未識別出的對準標記 的位置。 16 201108348 圖5是說明根據示範性實施例的第二經修改實例的用 於確定未識別出的對準標記的位置的方法的視圖。將多個 對準標記佈置在基板上的四個區域處。對準標記的總體佈 ，置可具有矩形形狀。在以下描述中，四個對準標記佈置在 矩形基板上。然而，基板的形狀不限於矩形形狀。基板可 具有矩形形狀、圓形形狀或任何其它形狀。 將關於與圖3相同的情況來解釋圖5，在所述情況中 未識別出第四對準標記M4。 ‘ 如圖5A中所示，識別出基板的對準標記的位置。此 處，識別出第一到第三對準標記M1、M2和M3的位置， 而未識別出第四對準標記M4的位置。 存儲第一到第三對準標記Ml、M2和M3的位置。 接下來，如圖5B中所示使基板旋轉。在經修改的本 實例中，因為基板具有矩形形狀，所以使基板旋轉180度。 如果基板具有正方形形狀，那麼基板可旋轉9〇度、18〇度 或270度。 在基板旋轉180度時，第一對準標記mi與第三對準 標記M3的位置交換，且第二對準標記M2安置在 出的第四對準標記M4的區域中。 接下來，用最初存儲的第一對準標記M1和第三對準 標記M3的位置（即，旋轉前的位置）來調整經旋轉的基 板的第一對準標記Ml和第三對準標記m3的位置（即， 旋轉後的位置），以使得其彼此對準。此處，將旋轉後的 第二對準標記M2的位置設為未識別出的第四對準標記 17 201108348 M4的位置。 第-：樂第一對準標記M1的位置與經旋轉的 第二對準己M3的位置對準。而且，第 吣 =始位置與經旋轉的第—鱗標記mi _對準 應地，第二對準標記M2的初始 四對準標記Μ4的位置處。 罝在未刻出的弟 在不旋轉基板以進行對準處理。然而，可 在不旋轉基板的情況下執行對準。 圖6是說明根據示範性實施 於確定未識別出的對準標記的位置的方法的; 見圖 圖6繪不未識別出吨對準標記 如圖6Α中所示，a萁^ 出第一對準標記M1和第^ = 3標記中’僅^ 矛一對準標記M2的位置，而未識 別出第三對準標記M3和第四對準標記_的位置置而未 的第!:t識5板的對準標記的位置後’存儲經識別 =置 的位置。此處，基板的中心可為參 如圖6B中所示，使基板旋轉⑽度。如果基板具有 S3:二麼，可旋轉9〇度、180度或270度。經 疋、土 ·〜點是與基板的初始中心點對準。識別出 基板的對準標記的位置。旋轉後的識別出 ，準W Ml的位置確定第三對準標記M3的位置。旋轉 後的識別出的第二對準標記奶的位置確定第 M4的位置。在基板旋轉回到擁位置後，執行基板^己 201108348 過程。 雖然已關於旋轉基板的情況來解釋圖5和圖6，但也 可使存儲在對準控制單元50〇中的位置或坐標旋轉。一 一如上文所述，根據示範性實施例，可迅速地確定是否 識別出對準標記。 另外，根據示範性實施例，可基於識別出的對準桿呓 的位置來確定未識別出的對準標記的位置，且使驗^定 的位置來對準紐，使得可減少*良的解和對準出錯， 可縮短用於基板對準的處理時間，借此可改進生產力。曰 雖然已參考具體實施例來描述基板對準方法，但其不 限於此。®此，所屬領域的技術人員將易於理解，在^脫 離由所附權利要求書界定的本發明的精神和範圍的情況 下，可對本發明進行各種修改和改變。 〜雖然本發明已以較佳實施例揭露如上，然其並非用以 本發明’任何熟習此技藝者’在不脫離本發明之精神 内’當可作些許之更動與潤飾，因此本發明之保護 範圍§視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1=根據不範性實施例的基板對準設備的示意圖。 圖2是說明根據示範性實施例的用於對準基板的方法 的流程圖。 圖3是說明根據示範性實施例的用於確定未識別 對準標記的位置的方法的視圖。 圖4是說明根據示範性實施例的第-經修改實例的用 201108348 於確定未識別出的對準標記的位置的方法的視圖。 圖5是說明根據示範性實施例的第二經修改實例的用 於確定未識別出的對準標記的位置的方法的視圖。 圖6是說明根據示範性實施例的第三經修改實例的用 於確定未識別出的對準標記的位置的方法的視圖。 【主要元件符號說明】 100 :基板 200 :台 300 :校準單元 400 :視覺系統 410 :照相機 420 :視覺控制器 500 :對準控制單元 M1，M2，M3，M4 :對準標記 20Mi and unidentified alignment mark M4. That is, the side of the substrate: 匕 has been corrected on the side of the first alignment mark d M1 and the fourth alignment mark of the unclear $. In addition, the fifth parameter = from the second alignment mark M2 is drawn to be parallel to the other side of the substrate, which is closer to the first standard M2 and the unidentified alignment mark 3. That is, the other side of the substrate is disposed on the side between the second alignment mark M2 and the unidentified alignment M3. π 5 has set the intersection of the second reference line to the fifth reference line as the position of the unidentified alignment mark. Specifically, the intersection of the third reference line L3 〇 and the fourth illuminating line L40 is set to the position of the fourth alignment mark M4. The intersection of the second reference line L20 and the fifth reference line L50 is set to the position of the third alignment mark M3. ^ Next, the determined position of the third alignment mark M3 and the fourth alignment mark M4 is used to align the substrate. Although the exemplary embodiment is explained for a rectangular substrate, the substrate may have a rectangular shape, a square shape, or any other polygonal shape. While the exemplary embodiment has been explained with respect to a 45 degree rotation angle, the angle of rotation may vary depending on the shape of the overall arrangement of the alignment marks. Alternatively, the position of the unrecognized alignment mark can be determined by rotating the substrate. 16 201108348 FIG. 5 is a view illustrating a method for determining a position of an unrecognized alignment mark according to a second modified example of the exemplary embodiment. A plurality of alignment marks are arranged at four areas on the substrate. The overall layout of the alignment marks can have a rectangular shape. In the following description, four alignment marks are arranged on a rectangular substrate. However, the shape of the substrate is not limited to a rectangular shape. The substrate may have a rectangular shape, a circular shape, or any other shape. Fig. 5 will be explained with respect to the same case as Fig. 3, in which the fourth alignment mark M4 is not recognized. ' As shown in FIG. 5A, the position of the alignment mark of the substrate is identified. Here, the positions of the first to third alignment marks M1, M2, and M3 are recognized, and the position of the fourth alignment mark M4 is not recognized. The positions of the first to third alignment marks M1, M2, and M3 are stored. Next, the substrate is rotated as shown in FIG. 5B. In the modified example, since the substrate has a rectangular shape, the substrate is rotated by 180 degrees. If the substrate has a square shape, the substrate can be rotated by 9 degrees, 18 degrees, or 270 degrees. When the substrate is rotated by 180 degrees, the position of the first alignment mark mi and the third alignment mark M3 is exchanged, and the second alignment mark M2 is placed in the area of the fourth alignment mark M4. Next, the first alignment mark M1 and the third alignment mark m3 of the rotated substrate are adjusted with the positions of the first alignment mark M1 and the third alignment mark M3 which are originally stored, that is, the position before the rotation. The positions (ie, the rotated positions) are such that they are aligned with each other. Here, the position of the rotated second alignment mark M2 is set to the position of the unidentified fourth alignment mark 17 201108348 M4. The position of the -first first alignment mark M1 is aligned with the position of the rotated second alignment M3. Moreover, the first 吣 = start position is aligned with the rotated first scale mark mi _ , and the initial alignment mark M2 of the second alignment mark M2 is at the position of the mark Μ 4 . The younger brother who is not engraved does not rotate the substrate for alignment processing. However, the alignment can be performed without rotating the substrate. 6 is a diagram illustrating a method of determining the position of an unidentified alignment mark in accordance with an exemplary implementation; see FIG. 6 not showing the tonne alignment mark as shown in FIG. In the quasi-marker M1 and the ^=3 mark, the position of the mark M2 is only aligned, and the position of the third alignment mark M3 and the fourth alignment mark_ is not recognized. After 5 positions of the alignment mark of the board, 'storage is identified=set position. Here, the center of the substrate can be rotated (10) degrees as shown in Figure 6B. If the substrate has S3: two, it can be rotated by 9 degrees, 180 degrees or 270 degrees. The 经, ··~ points are aligned with the initial center point of the substrate. The position of the alignment mark of the substrate is identified. After the rotation is recognized, the position of the quasi-W Ml determines the position of the third alignment mark M3. The position of the identified second alignment mark milk after the rotation determines the position of the M4th. After the substrate is rotated back to the holding position, the substrate is executed. Although Figs. 5 and 6 have been explained with respect to the case of rotating the substrate, the position or coordinates stored in the alignment control unit 50A can also be rotated. As described above, according to an exemplary embodiment, it is possible to quickly determine whether or not an alignment mark is recognized. In addition, according to an exemplary embodiment, the position of the unrecognized alignment mark may be determined based on the position of the identified alignment bar, and the position of the verification is aligned, so that the solution can be reduced And alignment errors can shorten the processing time for substrate alignment, thereby improving productivity. Although the substrate alignment method has been described with reference to the specific embodiments, it is not limited thereto. It will be apparent to those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. The present invention has been disclosed in the above preferred embodiments, but it is not intended to be used in the spirit of the invention, and the invention may be modified and modified in a manner that does not depart from the spirit of the invention. Scope is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a substrate alignment apparatus according to an exemplary embodiment. 2 is a flow chart illustrating a method for aligning a substrate, in accordance with an exemplary embodiment. FIG. 3 is a view illustrating a method for determining a position at which an alignment mark is not recognized, according to an exemplary embodiment. 4 is a view illustrating a method of determining a position of an unidentified alignment mark with 201108348 according to a first modified example of the exemplary embodiment. FIG. 5 is a view illustrating a method for determining a position of an unidentified alignment mark of a second modified example, according to an exemplary embodiment. FIG. 6 is a view illustrating a method for determining a position of an unidentified alignment mark of a third modified example, according to an exemplary embodiment. [Main component symbol description] 100: Substrate 200: Station 300: Calibration unit 400: Vision system 410: Camera 420: Vision controller 500: Alignment control unit M1, M2, M3, M4: Alignment mark 20