JP2004148436A - Electronic component carrier head and electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To connect and mount even a film electronic component having the vicinity of an electrode part deformed by warping, etc. to/on a substrate, while properly performing the aligning. <P>SOLUTION: One end part side of the electronic component 1 having the electrode part 11a sucked and held by a projecting part (pressing part) 811 is sucked by a suction pad 82b connected to a cylinder 82a and a height position of the suction can be adjusted. Since the projecting part 811 sucks and holds the electrode part 11a so that the surface of the electrode part 11a may be parallel to the surface of the glass substrate 4 by the height position adjustment of the suction pad 82b, the positioning with the substrate 4 is accurately performed, and the connection mounting via a connecting member is performed. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component transport head suitable for manufacturing a flat panel display such as a plasma display or a liquid crystal display panel, and an improvement of an electronic component mounting apparatus using the electronic component transport head.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as an electronic component mounting apparatus for manufacturing a flat panel display such as a plasma display, a so-called film electronic component (hereinafter simply referred to as an electronic component) formed in an elongated film is connected and mounted on a substrate such as a glass substrate. 2. Description of the Related Art An electronic component mounting apparatus is known (for example, see Patent Document 1).
[0003]
As shown in FIG. 8, such an electronic component mounting apparatus includes a tray 2 on which electronic components 1 are supplied and mounted, a transport head 3 that suctions and holds the electronic components 1 mounted on the tray 2, A transport mechanism 5 transports the transport head 3 in the direction indicated by the arrow X (X direction) to transport the sucked electronic component 1 onto the glass substrate 4 to be mounted.
[0004]
The transfer mechanism 5 includes a guide rail 51, a transfer robot 52 guided by the guide rail 51 and reciprocating between the tray 2 and the glass substrate 4, and a cylinder 53 attached to the transfer robot 52. The transport head 3 is attached to the lower end of an operating rod 53a that moves up and down in the direction indicated by the arrow Z (Z direction) of the cylinder 53.
[0005]
As shown in an enlarged manner in FIG. 9, the transport head 3 for sucking and holding the electronic component 1 includes a head body 31 and two suction pads 32, 32. The head body 31 has a built-in heater 31a. The protruding portion 311 includes a protruding portion 311 that protrudes downward and forms a pressing portion, and an extending portion 312 that extends laterally at an upper end of the protruding portion 311.
[0006]
A suction portion 311b in which a plurality of suction holes are arranged in an oval-shaped concave portion is formed on a bottom surface of the lower portion of the protruding portion 311, that is, on the contact surface 311a.
[0007]
The electronic component 1 is formed of a laminate in which a thin FPC (Flexible Printed Circuit) 11 in the form of a film is connected between an IC chip 12 and a heat sink 13 made of aluminum on both sides, and one end of the flexible FPC 11 has An electrode portion 11a connected to the glass substrate 4 is provided. The lead wires formed on the electrode portion 11a are connected to respective electrodes of the IC chip 12, although not shown.
[0008]
The electrode portion 11a of the electronic component 1 is detachably sucked and held by the suction portion 311b of the transport head, and the other end of the FPC 11 on which the IC chip 12 and the heat radiating plate 13 are disposed is also extended. Similarly, two suction pads 32, 32 provided at an interval along the longitudinal direction of 312 are detachably suction-held.
[0009]
In FIG. 9, reference numeral 31b and reference numerals 32a, 32a indicate suction pipes connecting the suction portions 311b and the suction pads 32, 32 to corresponding vacuum pumps (not shown). Reference numeral 6 denotes an imaging camera for photographing a positioning mark provided on the electronic component 1 and the glass substrate 4, and the electronic component 1 transported to the glass substrate 4 position is controlled by the imaging camera 6. After being photographed and subjected to a positioning operation based on the photographed image, the electrode portion 11a of the electronic component 1 is mounted on the glass substrate 4 by pressing and heating. When pressing the electronic component 1, the lower surface of the glass substrate 4 is supported by the backup 7.
[0010]
[Patent Document 1]
JP-A-2000-77898 (pages 3-4, FIGS. 1 and 5)
[0011]
[Problems to be solved by the invention]
As described above, the electronic component transport head employed in the conventional electronic component mounting apparatus sucks the electrode portion 11a at one end on the contact surface 311a and also has a plurality of suction pads 32, 32 provided in the longitudinal direction. Thus, the heat dissipating plate 13 and the like on the other end side are attracted to transport the long electronic component 1 in a film shape.
[0012]
However, in order for the electronic component 1 to be properly connected and mounted on the edge of the glass substrate 4, high-precision alignment based on the imaging screen of the positioning mark formed near the outside of the electrode portion 11a is required. Therefore, it is necessary to avoid deformation at least in the film-shaped electrode portion 11a and to ensure flatness. In the electrode portion 11a, in order to correct a deformation such as warpage or sagging and secure a flat surface, a strong suction force is required for the contact surface 311a.
[0013]
Further, in order for the protruding portion 311 to press the electrode portion 11a and securely connect and mount the electrode portion 11a on the surface of the glass substrate 4 via a connecting member such as an anisotropic conductive film, the region where the electrode portion 11a is formed is covered. It is necessary that a flat pressing surface having a width is formed on the contact surface 311a.
[0014]
However, forming the suction portion 311b having a strong suction force on the contact surface 311a to correct the deformation of the electrode portion 11a and securing a wide flat portion to obtain a necessary pressing area are as follows. , Structurally contradictory. Therefore, in the conventional electronic component transport head, if the electrode portion 11a has a deformation such as drooping, as shown in FIG. 10, there is a risk that the deformation cannot be completely corrected and the electrode portion 11a hangs down. In such a case, the positioning accuracy based on the photographing of the positioning mark and the accuracy of the connection mounting operation by pressing are reduced. Such a decrease in accuracy is considered to be a problem that cannot be neglected while the electrode pitch tends to be further narrowed due to miniaturization, and improvement has been desired.
[0015]
Therefore, the present invention holds the electronic component parallel to the pressing portion without reducing the pressing area in the pressing portion of the transport head, performs proper alignment with the substrate, and reliably secures the electronic component. It is an object of the present invention to provide an electronic component transport head which can be connected and mounted on a substrate, and an electronic component mounting apparatus using the electronic component transport head.
[0016]
[Means for Solving the Problems]
The electronic component transport head according to the present invention has a pressing portion that sucks and holds one end of an electronic component, and the other end side of the electronic component that is sucked and held by the pressing portion. And a suction holding portion configured to be capable of holding by suction.
[0017]
Further, an electronic component mounting apparatus according to the present invention includes a stage on which a substrate is mounted, the electronic component transport head according to the present invention for sucking and holding an electronic component mounted on the substrate, and an electronic component transfer head sucking and holding the electronic component. And a transport mechanism for transporting an electronic component transport head to mount the electronic component on the substrate.
[0018]
As described above, according to the electronic component transport head and the electronic component mounting apparatus of the present invention, the suction holding unit is configured to be capable of holding the other end of the electronic component by suction at a different height from the pressing unit. Therefore, by changing the height position of the suction holding portion, it is possible to perform suction holding such that one end of the deformed electronic component is parallel to the surface of the pressing portion, or to perform suction holding by correcting the electronic component. The electronic component can be connected and mounted on the substrate with high precision under a large pressing area.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of an electronic component transport head according to the present invention and an electronic component mounting apparatus using the electronic component transport head will be described in detail with reference to FIGS. Note that the same components as those of the conventional configuration shown in FIGS. 8 to 10 are denoted by the same reference numerals, and detailed description is omitted.
[0020]
FIG. 1 is a front view showing a first embodiment of an electronic component mounting apparatus to which an electronic component transport head according to the present invention is applied, and FIG. 2 is a plan view of the apparatus shown in FIG.
[0021]
That is, as shown in FIGS. 1 and 2, the electronic component mounting apparatus includes a transport head 8 that suctions and holds the long electronic component 1 and presses the electronic component 1 on a predetermined edge of a substrate, for example, a glass substrate 4. A transport mechanism 5 for moving the transport head 8 from the supply destination of the electronic component 1 to the position of the glass substrate 4.
[0022]
As shown in FIG. 1 or FIG. 2, the transport mechanism 5 is provided between the electronic component 1 and the glass substrate 4 between the cylinder 53 on which the transport head 8 is vertically movably mounted in a direction indicated by an arrow Z (Z direction). A θ-direction rotating portion 54 capable of rotating a cylinder 53 in a turning (θ) direction for alignment, and a guide rail 51 capable of moving the θ-direction rotating portion 54 in a direction indicated by Y in the drawing (Y direction). It is composed of
[0023]
In this embodiment, before the transport mechanism 5 transports the transport head 8 holding the electronic component 1 by suction to the position of the glass substrate 4, the electronic component 1 is removed from the tray 2 by the removal mechanism 9. Then, it is conveyed and moved in the Y direction and is placed on an intermediate stage (stage) 10 as a supply destination.
[0024]
As shown in FIG. 1, the take-out mechanism 9 includes a Z-direction moving mechanism 92 that moves the suction nozzle 91 with the suction nozzle 91 that sucks the electronic component 1 in an arrow Z (up and down) direction, and the Z-direction moving mechanism 92. The Y-direction moving mechanism 93 is capable of moving the suction nozzle 91 in the Y-direction.
[0025]
Further, the intermediate stage 10 includes a mounting table 101 on which the electronic component 1 is mounted, and an X-direction moving mechanism 102 capable of moving the mounting table 101 in an X direction orthogonal to the Y direction in a horizontal plane.
[0026]
On the other hand, the glass substrate 4 on which the electronic component 1 is connected and mounted via a connection member such as an anisotropic conductive film is placed on a substrate table 41 movable in the XY-θ direction, and Positioning between the electronic component 1 (electrode portion 11a) and the glass substrate 4 is performed based on the captured image of the positioning mark. In the positioning, when the imaging camera 6 photographs the positioning marks formed on the electronic component 1 and the glass substrate 4, the backup tool 7 movable in the Z direction is moved from the position shown in FIG. And is retracted from the field of view of the imaging camera 6.
[0027]
As shown in the enlarged perspective view of FIG. 3, the transport head 8 has a head body 81 including a protruding portion 811 and an extending portion 812, and a head body 81 attached at an interval along the longitudinal direction of the extending portion 812. It is composed of two suction holding sections including one suction holding section 821 and a second suction holding section 822.
[0028]
The protruding portion 811 of the head main body 81 has a built-in heater 81a to form a pressing portion, and also shows a front view of FIG. 4A and a cross-sectional view taken along the line AA of FIG. 4A. As shown in b), a suction portion 811b is formed on the contact surface 811a at the tip, and the suction portion 811b has a plurality of suction holes arranged in an oval concave portion to suck the electrode portion 11a. Then, the long electronic component 1 is held together with the first and second suction holding portions 821 and 822.
[0029]
Note that the transport head 8 moves the edge of the protruding portion 811 in front of the electrode portion 11a of the electronic component 1 with respect to the electronic component 1 mounted on the intermediate stage 10, as shown in FIGS. It is desirable to hold by suction so that the edges are aligned.
[0030]
Next, the mounting structure of the first and second suction holding portions 821 and 822 in the extending portion 812 will be described.
[0031]
That is, as shown in FIGS. 3, 4A, and 4B, the first and second through holes 812a, 812a provided at intervals in the longitudinal direction of the extending portion 812 are provided. The first and second suction holding portions 821 and 822 are respectively inserted into the through holes 812 a and 812 a having a large diameter in the longitudinal direction of the extending portion 812. In addition, while being supported by a support shaft 812b projecting perpendicularly to the longitudinal direction in a horizontal plane, it is mounted to be rotatable around a shaft (support shaft 812b).
[0032]
The first and second suction holding portions 821 and 822 both having a common configuration include a cylinder 82a rotatably supported by the support shaft 812b, and the lower end of the operating rod 82aa is formed in a bellows shape. The formed suction pad 82b is attached with its suction surface facing downward.
[0033]
Therefore, the height position of the suction pad 82b sucking the electronic component 1 is adjusted by the operation of the cylinder 82a.
[0034]
In FIG. 3 and the like, reference numerals 81c and 82c denote suction pipes that connect the suction unit 811b and each suction pad 82b to each vacuum pump (not shown).
[0035]
Further, as shown in FIGS. 4A and 4B, the cylinder 82a is rotatably supported by the support shaft 812b in the through hole 812a of the extending portion 812. A pair of electromagnets 83, 83 which are respectively opposed to each other and which can be attracted, are fixedly mounted on the inner wall surface in the longitudinal direction of each through hole 812a facing the outer surface of the cylinder 82a.
[0036]
When the pair of opposing electromagnets 83 and 83 are in the ON state, they attract each other, and the rotation of each cylinder 82a around the support shaft 812b is suppressed, and the cylinders 82a are stabilized in the vertical direction (Z direction).
[0037]
That is, by the ON / OFF switching operation of a switch (not shown) in each pair of electromagnets 83 (four in total), the cylinders 82a, 82a are stably fixed in the vertical (Z) direction and rotate around the support shaft 812b. Is switched to a rotatable operation.
[0038]
Therefore, as shown in FIG. 3, for example, when the electronic component 1 in a state where the electrode portion 11a is warped downward is supplied and mounted on the intermediate stage 10, the ON / OFF operation of the electromagnet 83 causes the posture of the electronic component 1 to be fixed. The cylinders 82a, 82a are lowered together with the head main body 81 by operating the cylinder 53, and hold the electronic component 1 by suction.
[0039]
When the suction pads 82b, 82b holding the electronic component 1 and the head main body 81 lift the electronic component 1 upward, the electromagnet 83 is turned off so as to be rotatable, and as shown in FIG. The height positions of the suction pads 82b, 82b are adjusted and controlled by the cylinders 82a, 82a so that the surface of the deformed electrode portion 11a is parallel to the direction of the contact surface 811a of the protruding portion 811.
[0040]
Thus, regardless of deformation such as warpage in the electrode portion 11a, the deformed surface of the electrode portion 11a is conveyed onto the glass substrate 4 in a state in which the surface of the deformed electrode portion 11a coincides with the surface of the contact surface 811a. The positioning mark is appropriately photographed by the imaging camera 6 together with the positioning mark formed on the glass substrate 4, and an accurate positioning operation is performed.
[0041]
As described above, according to the electronic component transport head of the first embodiment, the electronic component 1 having the electrode portion 11a sucked and held by the protruding portion 811 serving as the pressing portion is held in the sucking and holding portions 821 and 822. By adjusting the height position of the suction pads 82a, 82a, the electrode portion 11a is suction-held so that the surface thereof is parallel to the substrate surface. Therefore, a necessary pressing area on the contact surface 811a is secured and the anisotropic conductive film is secured. Thus, reliable connection mounting via connection members such as is possible.
[0042]
Although the first and second two suction holding portions 821 and 822 are provided in the first embodiment, the number may be one or three or more.
[0043]
Also, the electromagnet 83 is used for the lock and unlock mechanism of the pivoting operation of the suction holding portions 821 and 822 about the support shaft 812b. For example, the extension portion 812 can freely project into the through hole 812a. A simple rod-shaped stopper may be incorporated, and the rotation of the suction holding portions 821 and 822 may be prevented by the stopper as necessary.
[0044]
In the first embodiment, the case where the tip of the electronic component 1 is warped downward in the longitudinal direction in the electrode portion 11a has been described as an example. However, depending on the electronic component 1, it is shown in FIG. As described above, in the electrode portion 11a, both sides in the width direction may be curved downward.
[0045]
As shown in FIG. 6, the electrode portion at one end portion is lifted upward while the middle portion in the longitudinal direction is pressed against the deformation in the width direction of the electrode portion 11 a, as shown in FIG. 6. Curve deformation in the width direction at 11a can be corrected.
[0046]
Therefore, FIG. 7 shows that the operation principle of the deformation correction shown in FIG. 6 is applied to the deformation in the width direction of the electrode portion 11a shown in FIG. 5, and the electrode portion 11a is properly attracted to the contact surface 811a. FIG. 10 shows a main part of an electronic component mounting apparatus according to a second embodiment of the present invention configured to be in a state, that is, an electronic component transport head.
[0047]
That is, unlike the first embodiment, the electronic component transport head used in the electronic component mounting apparatus according to the second embodiment of the present invention is different from the first embodiment in that the suction pad 82b of the first suction holding portion 821 is used. The cylinders 82a and 82a are adjusted and controlled such that the suction height position of the electronic component 1 by the above is higher than the suction height position of the contact surface 811a and the intermediate position of the second suction holding portion 822. .
[0048]
Therefore, according to the configuration shown in FIG. 7, the transport head 8 is configured such that the curvature in the width direction of the electrode portion 11a as shown in FIG. 5 is corrected, and the electrode portion 11a comes into surface contact with the contact surface 811a. Since the electronic component 1 is sucked and held, the position of the electronic component 1 and the glass substrate 4 can be properly and smoothly adjusted by the imaging camera 6 according to the second embodiment, and the electronic component 1 can be securely connected. Implementation is possible.
[0049]
In the second embodiment, a flat portion is formed in the projecting portion 811 of the transport head 8 so as to obtain a sufficient and sufficient pressing area for connection and mounting of the electrode portion 11a. If the electrode portion 11a does not fall off the contact surface 811a regardless of the height position of the suction pad 82b, the second suction holding portion 822 can be omitted.
[0050]
In any case, according to the electronic component transport head and the electronic component mounting apparatus using the electronic component transport head according to the present invention, the other end of the electronic component held by the pressing unit is held by the suction holding unit as the pressing unit. Is configured to be able to be suction-held at different height positions, so that even if the electrode portion of the electronic component sucked and held by the pressing portion is deformed due to warpage or the like, a connection member such as an anisotropic conductive film is formed. The connection and mounting of the electronic component to the substrate via the substrate can be performed appropriately and with high precision.
[0051]
【The invention's effect】
The electronic component transport head and the electronic component mounting apparatus of the present invention can hold the film electronic component by suction so as to be parallel to the substrate surface to be mounted, even if the film electronic component has a shape deformation such as warpage. This enables high-precision connection mounting without reducing the area, and is a large effect obtained in practical use.
[Brief description of the drawings]
FIG. 1 is a front view showing a first embodiment of an electronic component mounting apparatus to which an electronic component transport head according to the present invention is applied.
FIG. 2 is a plan view of the device shown in FIG.
FIG. 3 is an enlarged perspective view of a main part of the transport head shown in FIG.
4 (a) is a front view of the transport head shown in FIG. 3, and FIG. 4 (b) is a cross-sectional view taken along the line AA of FIG. 4 (a).
5 is a perspective view of an electronic component sucked by an electronic component transport head of the apparatus shown in FIG.
FIG. 6 is an explanatory view illustrating a principle of correcting the warpage of the electronic component shown in FIG. 5;
FIG. 7 is a front view of an essential part showing an electronic component transport head according to a second embodiment of the electronic component mounting apparatus of the present invention.
FIG. 8 is a configuration diagram showing a conventional electronic component mounting apparatus.
FIG. 9 is an enlarged perspective view showing a transport head of the apparatus shown in FIG.
FIG. 10 is a front view showing a state in which the transport head shown in FIG. 9 sucks an electronic component.
[Explanation of symbols]
1 Film-shaped electronic components (electronic components)
11 FPC
11a Electrode part 12 IC chip 13 Heat sink 2 Tray (stage)
3 Transfer head 4 Glass substrate (substrate)
Reference Signs List 5 transport mechanism 53 cylinder 6 imaging camera 7 backup tool 8 transport head 81 head body 811 projecting part (pressing part)
811a Contact surface 811b Suction unit 812 Extension unit 812a Through hole 812b Support shaft 81a Heater 821 First suction holding unit (suction holding unit)
822 Second suction holding unit (suction holding unit)
82a cylinder 82b suction pad 82c suction pipe 83 electromagnet 9 takeout mechanism 10 intermediate stage (stage)

Claims (4)

A pressing portion that sucks and holds one end of the electronic component;
An electronic component comprising: a suction holding portion configured to be capable of holding the other end of the electronic component sucked and held by the pressing portion at a different height from the pressing portion. Transfer head. 2. The electronic component transport head according to claim 1, wherein a plurality of the suction holding units are provided along a longitudinal direction of the electronic component to be sucked. 3. The electronic component transport head according to claim 1, wherein the suction holding unit is configured to be able to change a height position. A stage on which the substrate is mounted,
The electronic component transport head according to claim 1, wherein the electronic component transport head holds the electronic component mounted on the substrate by suction.
An electronic component mounting apparatus, comprising: a transport mechanism that transports the electronic component transport head to mount the electronic component sucked and held by the electronic component transport head on the substrate.

Images