WO2012117509A1

WO2012117509A1 - Thin plate-shaped workpiece adhesion and retention method, thin plate-shaped workpiece adhesion and retention device, and manufacturing system

Info

Publication number: WO2012117509A1
Application number: PCT/JP2011/054552
Authority: WO
Inventors: 道也横田
Original assignee: 信越エンジニアリング株式会社
Priority date: 2011-02-28
Filing date: 2011-02-28
Publication date: 2012-09-07
Also published as: JP4857407B1; CN103201201B; CN103201201A; KR101791280B1; KR20130138652A; TWI466811B; JPWO2012117509A1; TW201302585A

Abstract

The present invention adheres and retains a thin plate-shaped workpiece and corrects any bending under the weight of the workpiece itself, without damaging the workpiece. In a thin plate-shaped workpiece (W) of which part is supported by a lattice-shaped support member (1), an adhesion means (2) is moved so as to approach, in a direction which intersects with the thin plate-shaped workpiece (W), a non-supported portion (W1) which has bent and deformed downward due to the weight of the workpiece itself, and part of an adhesion surface (2a) of the adhesion means (2) is brought into contact with the non-supported portion (W1). Then, the adhesion surface (2a) is moved so as to gradually increase the contact area between the adhesion surface (2a) and the non-supported portion (W1). Thus, the adhesion surface (2a) is gradually brought into contact, over a staggered time period and in a partial manner in keeping with the bending of the non-supported portion (W1) under the weight of the workpiece itself, and as this happens the external load on the thin plate-shaped workpiece is suppressed to an extremely low level, and approximately the entirety of the adhesion surface (2a) is brought into contact with, adhered to and retained against the non-supported portion (W1). Then, the adhesion means (2) is moved in the opposite direction to the abovementioned approaching direction, up until a position in which the adhesion surface (2a) is in the same plane as a supported portion (W2) in the thin plate-shaped workpiece, which is supported by a support member (1). Thus, bending, under the weight of the workpiece itself, in the non-supported portion (W1) is reduced, and the entire thin plate-shaped workpiece is adhered and retained in a planar shape.

Description

Adhesion holding method of thin plate-like work, adhesion holding apparatus of thin plate-like work and manufacturing system

The present invention relates to a thin plate used for detachably holding a thin plate-like work such as a glass substrate in the process of manufacturing a flat panel display (FPD) such as an organic EL display (OLED) or a liquid crystal display (LCD). In order to manufacture, for example, an organic EL display (OLED) or the like provided with a method for adhesively holding a workpiece, an adhesive holder for a thin plate work used to carry out the method, and an adhesive holder for the thin plate Manufacturing system used in

Conventionally, an organic film for forming an organic EL element is formed on the film formation region of the film formation substrate by superposing the film formation mask having an opening corresponding to the film formation region and the film formation substrate. As a manufacturing apparatus of an EL device, a chamber, a deposition source provided at a bottom of the chamber to evaporate a film forming material, and a substrate holding unit which holds the film formation substrate in a substantially horizontal state so as to face the deposition source. And the substrate holding unit includes a support having a holding unit in a clamp shape on the outer edge side, and the magnets, the film-forming substrate, and the magnetic flux of the magnet sequentially stacked by the holding unit. By holding the peripheral portion of the laminated body including the film forming mask having a coercive force reaching saturation magnetization with respect to density, the film formation substrate is magnetically interposed between the magnet and the film forming mask. Hold by suction force Some (for example, see Patent Document 1).
In addition, as another method and apparatus for manufacturing an organic EL device, a magnet unit provided with a substrate supporting surface and a magnet on which a surface on the opposite side to a film forming surface of a substrate to be processed is overlapped; And a deposition mask made of a magnetic material adsorbed by the magnet unit so as to sandwich the substrate to be processed between the substrate supporting surface and the substrate by the magnetic attraction force of the magnet. And the magnetic attraction force of the magnet provided to the magnet unit by overlapping the substrate to be processed and the vapor deposition mask with respect to the substrate support surface in a state where the magnet unit is turned upside down The substrate to be treated is held between the substrate and the deposition mask, and then the whole is turned upside down, and the deposition mask is set on the rotating mechanism of the mask deposition apparatus so that the deposition mask faces downward, There is Nau (e.g., see Patent Document 2).
Furthermore, in forming an element substrate of the organic EL device in Patent Document 2, each layer is formed on a large substrate (substrate to be processed) where a large number of element substrates can be taken (substrate to be processed) using a semiconductor process such as mask evaporation. It is cut into element substrates of the size.

Unexamined-Japanese-Patent No. 2010-209441 JP, 2010-185107, A

By the way, in recent years, there is a tendency that the size of a substrate used for an organic EL display or the like becomes larger, and one having a side exceeding 2000 mm has begun to be manufactured. Such a large substrate is formed into a thin plate from a fragile material such as glass, and when supported using a grid-like support member, the central portion (non-supporting portion) of the large substrate surrounded by the support member is The substrate may be further deformed and broken if it is bent due to its own weight and sags, and if an external load is applied to the deformed unsupported portion.
That is, it has been difficult to hold the large substrate flat without entirely supporting the large substrate from the lower side.
Therefore, as described in Patent Document 1 and Patent Document 2 described above, it is conceivable to horizontally hold the large substrate without bending it partially.
However, as in the case of Patent Document 1 mentioned above, in the apparatus in which the substrate is held between the magnet and the film formation mask by the magnetic attraction force of the magnet, the film formation mask is also increased with the increase in substrate size. Since one side is increased to 2000 mm or more, even if the magnet, the large substrate, and the peripheral portion of the film formation mask are held by the holding portion of the clamp form, the central portion (unsupported portion) of these laminates is bent by its own weight, Once hanging down to a position lower than the magnetic attraction area of the magnet, the unsupported portion can not be magnetically attracted by the magnet and returned to a planar shape.
As a result, deformation or distortion occurs in the mask pattern in the mask for film formation, so that accurate pattern formation can not be performed, and there is a problem that the yield is lowered.
Further, as in Patent Document 2 described above, in the method and apparatus in which the whole is vertically reversed after the substrate is held between the substrate support surface of the magnet unit and the deposition mask by the magnetic attraction force of the magnet, As the evaporation mask and the magnet unit become too large to be 2000 mm or more and become heavy with the increase in size, it is difficult to easily turn upside down even using a transport mechanism such as a robot, and there is a problem of poor feasibility. The

The present invention has an object to address such a problem, and is an adhesive of a thin plate-like work which can be adhesively held without damaging the thin plate-like work to correct the self-weight deflection of the thin plate-like work. To provide a holding method, to provide an adhesive holding device for a thin plate-like work capable of holding the thin plate-like work in an adhesive manner without damaging the thin-plate-like work and correcting the self weight deflection of the thin plate-like work It is an object of the present invention to provide a manufacturing system which can be held in a flat state between a magnet surface and a processing mask by holding the adhesive without adhesion.

In order to achieve such an object, the adhesive holding method for a thin plate-like work according to the present invention comprises adhesion means for a non-supporting portion not supported by the support member in the thin plate-like work partially supported by the support member. The adhesive surface is moved close to a direction crossing the thin plate-like work until a part of the adhesive surface contacts, and the contact area between the adhesive surface and the non-supporting area gradually increases with respect to the non-supporting area. Move the adhesive means in the direction opposite to the approaching movement to a position where the adhesive surface is flush with the support portion supported by the support member in the thin plate-like work It is characterized by

Furthermore, the adhesive holding device for a thin plate-like work according to the present invention is provided so as to abut on a part of the thin plate-like work to support the thin plate-like work, and the support member does not abut on the thin plate-like work An adhesive means having an adhesive surface opposed to the non-supporting part, which is provided reciprocably in the direction intersecting the thin plate-like work, and a reciprocation control means for controlling operation of the reciprocation of the adhesive surface with respect to the non-supporting part. And adhesion area increasing means for controlling operation of the adhesion means so that the adhesive face moves relative to the non-supporting part, and the reciprocation control means approaches the adhesive face toward the non-supporting part It is moved, and when a part of the adhesive surface comes in contact with the non-supporting part, the approaching movement of the adhesive surface is stopped, and the adhesive area increasing means stops the non-supporting part after stopping the approaching movement of the adhesive part. The adhesive surface is moved so that the contact area between the adhesive surface and the non-supporting part gradually increases and the entire surface comes into contact, and the reciprocation control means comprises the entire adhesive surface and the non-supporting area. After the contact, the adhesive surface is moved in the direction opposite to the approaching movement to a position flush with the supporting portion supported by the supporting member in the thin plate-like work.

In the manufacturing system according to the present invention, the adhesive holding device for the thin plate-like work, a smooth magnetic surface provided facing the non-machined surface of the thin plate-like work, and the machined surface of the thin plate-like work It has a processing mask made of a magnetic material provided so as to be capable of reciprocating in the direction intersecting the thin plate-like work, and a mask movement control means for controlling operation of the reciprocating movement of the processing mask relative to the working surface of the thin plate-like work. The mask movement control means moves the processing mask to a magnetic attraction force area of the magnet surface after the contact between the substantially entire adhesive surface and the unsupported portion in conjunction with the reciprocation control means. It is characterized by

The adhesive holding method of a thin plate-like work according to the present invention having the above-mentioned features is an adhesive means for a thin plate-like work partially supported by a grid-like support member against an unsupported portion which is deformed downward by its own weight. Is moved in the direction intersecting the thin plate-like work to bring the non-supporting part into contact with a part of the adhesive surface of the adhesive means, and then the adhesive surface is made to the non-supporting area As the contact area gradually increases and moves so as to contact almost the entire surface, the adhesive surface gradually contacts with time lag according to the self weight deflection of the non-supporting part, and accordingly the external to the thin plate-like work Almost the entire adhesive surface is in contact with the unsupported area and held adhesively while holding the load very small, and then the adhesive means is coplanar with the support area supported by the support member in the thin plate work By moving the adhesive means in the direction opposite to the approach movement, the self-weight deflection of the non-supporting part is reduced, and the entire thin plate-like work is adhesively held flat, so the thin plate-like work is broken It is possible to correct the self-weight deflection of the thin plate-like work by holding the adhesive without adhesion.
As a result, even if the substrate size of the thin plate-like work is enlarged to 2000 mm or more on a side, the large-sized substrate is partially supported by the grid-like support member from the lower side, and the self-weight deflection of the unsupported portion is within a certain range. It can be suppressed internally and can be held flat.

Further, the adhesive holding device for a thin plate-like work according to the present invention having the characteristics described above reciprocates, with a thin plate-like work partially supported by a grid-like support member, against a non-supporting portion deformed downward by its own weight. The movement control means moves the adhesion means in the direction intersecting with the thin plate-like work to bring the non-supporting part into contact with a part of the adhesive surface of the adhesion means. By moving the adhesive surface so that the contact area between the adhesive surface and the non-supporting part gradually increases and the entire surface comes into contact with each other, the adhesive surface is partially delayed while following the self-weight deflection of the non-supporting part. Gradually contact, and while keeping the external load on the thin-plate-like work very small accordingly, almost the entire adhesive surface comes into contact with the unsupported area to be adhesively held, and then the adhesive means is adhered by the reciprocation control means surface By moving the adhesive means in the direction opposite to the approaching movement to a position flush with the supporting portion supported by the supporting member in the thin plate-like work, the self-weight deflection of the non-supporting portion is reduced, Since the whole is adhesively held in a flat shape, adhesive holding can be performed without damaging the thin plate-like work, and the self-weight deflection of the thin plate-like work can be corrected.
As a result, even if the substrate size of the thin plate-like work is enlarged to 2000 mm or more on a side, the large-sized substrate is partially supported by the grid-like support member from the lower side, and the self-weight deflection of the unsupported portion is within a certain range. It can be suppressed internally and can be held flat.

In the manufacturing system according to the present invention having the above-mentioned characteristics, the magnet for moving the processing mask to the magnetic attraction force area of the magnet surface is moved by the mask movement control means after approximately the entire adhesive surface contacts the unsupported portion. The thin plate workpiece is drawn to the magnet surface together with the processing mask by the magnetic attraction force of the surface, and the entire thin plate workpiece is held between the magnetic surface and the processing mask, so the thin plate workpiece is not damaged. It can be adhesively held and sandwiched between the magnet surface and the processing mask in a planar manner.
As a result, even if the substrate size of the thin plate-like work is enlarged to 2000 mm or more on a side, the large-sized substrate is partially supported by the grid-like support member from the lower side, and the self-weight deflection of the unsupported portion is within a certain range. It can be suppressed internally and can be held flat.
As a result, deformation or distortion does not occur in the mask pattern in the processing mask, so that accurate pattern formation can be performed by vapor deposition or the like, precision can be improved, and yield can be improved.
Furthermore, even if the substrate size is increased to 2000 mm or more compared to the conventional apparatus in which the substrate is sandwiched between the substrate support surface of the magnet unit and the vapor deposition mask by the magnetic attraction force of the magnet and then the whole is turned upside down. Since the entire large substrate can be held flat without being turned upside down, it is excellent in the feasibility.

BRIEF DESCRIPTION OF THE DRAWINGS It is a longitudinal cross-sectional front view which shows the outline of the adhesion holding apparatus of the thin-plate shaped workpiece which concerns on embodiment of this invention, (a) shows before adhesion, (b) shows the time of contact of an adhesion surface, (c) is adhesion It shows the holding time. BRIEF DESCRIPTION OF THE DRAWINGS It is a longitudinal front view which shows the outline of the manufacturing system which concerns on embodiment of this invention, (a) shows before adhesion, (b) shows the time of contact of an adhesive surface, (c) shows the time of adhesion holding, (D) shows the approach movement of the processing mask, and (e) shows the magnetic attraction of the processing mask. It is a flowchart which shows the adhesion holding method of the thin-plate shaped workpiece | work which concerns on embodiment of this invention. It is a longitudinal cross-sectional front view which shows the Example of the adhesion means, (a) shows before adhesion, (b) shows the approach time of the adhesion surface, (c) shows the time of contact of the adhesion surface, (d) Shows the peeling time of the adhesive surface.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
An adhesive holding apparatus A of a thin plate-like work used to carry out an adhesive holding method of a thin plate-like work according to an embodiment of the present invention is a part and part of a thin plate-like work W, as shown in FIGS. A thin plate-like work provided with a support member 1 provided so as to abut on and supporting the thin plate-like work W, and an adhesive surface 2a facing the non-supporting portion W1 on the thin plate-like work W not contacting the support member 1; An adhesive means 2 provided for reciprocating movement in a direction intersecting W, a reciprocation control means 3 for operationally controlling reciprocation of the adhesive surface 2a with respect to the surface of the unsupported portion W1, and a surface of the unsupported portion W1. An adhesive area increasing means 4 for controlling the operation of the adhesive means 2 so as to move the adhesive surface 2a is provided as a main component.
Furthermore, although not shown in the drawings, it is preferable to include a peeling means described later for peeling the adhesive surface 2a adhered to the unsupported portion W1 of the thin plate-like work W from the surface of the unsupported portion W1.

The thin plate-like work W is, for example, a glass substrate used for an organic EL display, a liquid crystal display, etc., and has a drawback that it is easily broken by deformation since its thickness is relatively thin with respect to its surface area ing.
Further, in the thin plate-like work W, for example, a film surface having a functional part (not shown) such as an organic EL element is formed on one surface to be bonded to each other in the manufacturing process of the organic EL display or liquid crystal display. .

The supporting member 1 is formed, for example, in a lattice shape or other similar shape so as to support only a part of the film surface (bonding surface) of the thin plate-like work W.
As shown in FIGS. 1 and 2 as a specific example, when the support member 1 is formed in a lattice, two or more vertical frames 1a extending in the Y direction and two or more horizontal lines extending in the X direction The frame 1 b is configured by framing in the same plane, and is disposed substantially horizontally. By placing the thin plate-like work W on the upper surface of the support member 1 so as not to contact the area requiring the post-processing (post-processing) such as the functional part on the film surface, only the area where the post-processing is unnecessary Partially abuts on the upper surface of the support member 1 and the entire thin plate-like work W is held.

That is, in the thin plate-like work W, an area where post-processing is unnecessary after removing the functional part and the like is the support portion W2 supported by the support member 1, and an area where post-processing such as the functional part is necessary The non-supporting portion W1 which is not supported by the support member 1 without being abutted, is bent downward by its own weight, and the central portion of the non-supporting portion W1 hangs down most.
The substrate is further deformed when an external load is applied to the unsupported portion W1 at a stretch, for example, by bringing the adhesive surface 2a of the adhesive means 2 into surface contact with the unsupported portion W1 bent and deformed by its own weight. May be damaged.

That is, when the pressure-sensitive adhesive material to be the pressure-sensitive adhesive surface 2a of the pressure-sensitive adhesive unit 2 described later contacts the surface of the thin plate-like work W, the pressure-sensitive adhesive material is deformed first, and the pressure is applied to the elastic material. And some adhesion develops. When the pressure-sensitive adhesive material is further pressed, the thin plate-like work W is deformed, and the repulsive force increases the adhesion. However, if this deformation exceeds a certain limit, the tension on the surface of the thin plate-like work W does not endure it and is broken.
Therefore, if the pressure by the adhesive is stopped within this limit, the thin plate-like work W can be adhered without being broken. In order to stop the pressure by the adhesive material within the limit, it is important to reduce the contact area to a very local one and to limit the pressing force to the extent that the thin plate work W is not displaced more than necessary. It is.
Once the adhesive surface 2a is locally adhered to the surface of the thin plate-like work W, the same thing can be realized by applying the same degree of pressure to the next local part. In this case, assuming that the adjacent local portion is already adhered, the surface tension of the thin plate-like work W in the vicinity becomes looser than before and it is in a hard-to-break state, and the sagging by the own weight of the thin plate-like work W Since the descent is also relaxed, adhesion becomes easy.
By spreading the local adhesion of the adhesive surface 2a to the surface of the thin plate-like work W to the adjacent local areas one after another, the entire adhesive surface 2a which is not so large can be adhered.
If the thin plate-like work W and the adhesive surface 2a are completely parallel and they can be in contact while keeping them completely parallel, it will not be necessary to stack the local contacts described above. That is, it should be possible to obtain the cohesion at once. However, in fact, since the surface of the thin plate-like work W is bent upward by its own weight in a concave shape, if it is too close to try to express the adhesive strength all at once in the whole of the flat adhesive surface 2a, In particular, a state close to one-side contact occurs at the end of the adhesive surface 2a, and the part is broken.
Therefore, as an actual device, the adhesion surface 2a is brought into contact with the surface of the thin plate-like work W only at a local portion, and adhesion is first realized at the local contact portion, and this adhesion portion is used as a basis. Therefore, it is necessary to devise a method of gradually increasing the adhesive area of the adhesive surface 2a to the surface of the thin plate-like work W.

Further, it is preferable that the lattice pitch of the support member 1 be configured to be adjustable to correspond to the size of the thin plate-like work W, and to adjust the distance between the vertical frames 1a and the distance between the horizontal frames 1b.
Furthermore, as an example of the thin plate-like work W, when taking a large number of single-sized substrates (not shown) from one large substrate (not shown), three or more vertical frames 1a and three or more horizontal frames By placing the substrate 1b in a grid shape on the support member 1 so as to be in partial contact with only the border portions of the respective substrates, the border portions of the respective substrates become support portions W2 supported by the support member 1, The film surface of each substrate is not in contact with the support member 1 and becomes an unsupported portion W 1 which is not supported by the support member 1.

In the example shown in FIGS. 1 (a) to 1 (c), the case where a large number of single-sized substrates are taken from a single large-sized substrate as the thin plate-like work W is shown partially enlarged. The adhesive means 2 described later is disposed one by one so as to face the central portion of the unsupported portion W1. That is, the adhesive means 2 described later is disposed one by one so as to face the central portion of each unsupported portion W1 even for substrates of other single-piece sizes which are not shown.
In addition, although not illustrated as another example, a plurality of adhesive means 2 described later are disposed so as to face the unsupported portion W1 in one single-piece sized substrate, or a single single-piece sized substrate as a thin plate work W The adhesive means described later is supported by the support member 1 in which the two vertical frames 1a and the two horizontal frames 1b are framed in a grid shape and the outer peripheral edge of the substrate is opposed to the nonsupporting portion W1 of the substrate. It is also possible to arrange two or more of two.

Furthermore, according to need, the supporting member 1 has a vertical frame 1a and a horizontal frame 1b, and a pressing vertical frame 1c and a horizontal frame 1d disposed so as to sandwich the thin plate-like work W. It is preferable to provide 1c and the horizontal frame 1d so as to be movable up and down with respect to the supporting vertical frame 1a and the horizontal frame 1b.
Either the supporting vertical frame 1a and the horizontal frame 1b or the holding vertical frame 1c and the horizontal frame 1d, or both the supporting vertical frame 1a and the horizontal frame 1b and the holding vertical frame 1c and the horizontal frame 1d Preferably, a magnetic attraction means (not shown) such as a magnet or a magnetic body is provided, and the thin plate-like work W is vertically held by the magnetic attraction means and held immovably.

The adhesive means 2 comprises an adhesive chuck or the like provided with an adhesive surface 2a which is detachably attached to the unsupported portion W1 of the thin plate-like work W, the adhesive surface 2a is movably attached to the main body 2b, and the main body 2b is The adhesive surface 2 a is provided so as to reciprocate in the Z direction intersecting (orthogonal) with the supporting direction of the thin plate-like work W by the support member 1 so that the adhesive surface 2 a faces the non-supporting portion W 1 of the thin plate-like work W.
The attachment structure of the adhesive surface 2a to the main body 2b is supported such that the adhesive surface 2a can perform a predetermined mechanical movement such as tiltable, swingable or vibrationable along the surface of the thin plate-like work W . More specifically, it is preferable that the adhesive surface 2a be supported so as to orbit or turn while being pressed against the surface of the thin plate-like work W.
The pressure-sensitive adhesive surface 2a is a pressure-sensitive adhesive sheet made of, for example, a pressure-sensitive adhesive material such as fluororubber, elastomer, butyl rubber, photosensitive resin, acrylic resin or silicone, and the surface is formed in an elastic surface. Furthermore, the surface of the adhesive surface 2a may be configured to easily stick to the surface of the unsupported portion W1 by, for example, forming emboss processing, concave grooves or the like to facilitate elastic deformation as a whole. preferable.
The reciprocation of the adhesive surface 2a with respect to the surface of the unsupported portion W1 of the thin plate-like work W is operationally controlled by the reciprocation control means 3 to be described later.
Furthermore, with respect to the main body 2b of the adhesive means 2, the adhesive surface 2a is applied to the surface of the non-supporting portion W1 of the thin plate-like work W by the adhesive area increasing means 4 described later. It is controlled so as to move, such as turning (turning) while hitting with a whistle.

The reciprocation control means 3 and the adhesion area increasing means 4 are, for example, means for operation control to change the grid pitch of the support member 1 and means for controlling the vertical movement of the pressing vertical frame 1c and horizontal frame 1d. And other operation control means are provided in a controller (not shown) described later.
The controller is electrically connected to a drive source (not shown) for reciprocating the main body 2b of the adhesive means 2, a drive source (not shown) for moving the adhesive surface 2a to the main body 2b of the adhesive means 2, etc. The reciprocation control means 3 controls operation of the reciprocation drive source according to a program input and set in advance, and the adhesion area increasing means 4 controls operation of the adhesion drive unit.

An example of the operation control of the reciprocation drive source by the reciprocation control means 3 includes, in its initial state, the support portion of the thin plate-like work W whose adhesive surface 2a is supported by the support member 1 It is waiting to be separated from or flush with the surface of W2. Thereafter, when the operation start signal is input by the operator's operation or the like, the thin plate work W is moved closer to the unsupported portion W1, and when a part of the adhesive surface 2a contacts the unsupported portion W1, the main body 2b Stop the approaching movement of Thereafter, based on the movement completion signal output from the adhesion area increasing means 4, the main body 2b is moved to the position where the adhesion surface 2a is flush with the surface of the support portion W2 of the thin plate-like work W It is set to move in the reverse direction.

The reciprocating movement distance of the main body 2b by the driving source for reciprocating movement places the target thin plate-like work W on the supporting member 1 in advance, and the actual weight deflection amount of the non-supporting part W1 is actual side. The approach movement distance of the main body 2b from the standby position of the adhesive surface 2a to the partial contact with the unsupported portion W1, and the adhesive surface 2a from the stop movement stop position of the adhesive surface 2a The reverse movement distance of the main body 2b to a position on the same plane as the surface is calculated, and these calculated values are set and input to the controller.

As an example of the operation control of the adhesion drive unit by the adhesion area increasing means 4, in the initial state, the adhesion surface 2a of the adhesion means 2 is opposed to the unsupported portion W1 of the thin plate-like work W at a predetermined angle. Let me wait. After that, when a part of the adhesive surface 2a comes into contact with the unsupported portion W1 by the approach movement of the main body 2b, the contact area with the surface of the unsupported portion W1 gradually increases with respect to the main body 2b. The movement of the adhesive surface 2a relative to the main body 2b is stopped when substantially the entire adhesive surface 2a comes in contact with the surface of the unsupported portion W1 while moving (turning) while being hit against the surface of the thin plate-like work W. , And is set to output an operation completion signal to the reciprocating motion control means 3.
The movement of the adhesive surface 2a with respect to the surface of the non-supporting part W1 causes the adhesive surface 2a to make "rotational movement" only once or a plurality of times, or "rocks" several times depending on the operation content. It is possible to repeat “oscillation” continuously for a predetermined time.

The adhesion holding method of the thin plate-like work W according to the embodiment of the present invention is, as in the flow chart shown in FIG. 3, an approaching movement process of the adhesion means 2, an adhesion process of the adhesion surface 2 a and a reverse of the adhesion means 2. It includes a moving step and a peeling step of the adhesive surface 2a.
As shown in FIG. 1 (a), the approaching and moving process of the adhesive unit 2 is performed by the reciprocating control unit 3 from the standby position of the adhesive unit 2 separated from the thin plate-like work W supported by the support member 1. The main body 2b of 2 is moved toward the non-supporting part W1 of the thin plate-like work W. Subsequently, when a part of the adhesive surface 2a of the adhesive means 2 contacts the surface of the unsupported portion W1, the approaching movement of the adhesive means 2 is stopped.
In the adhesive process of the adhesive surface 2a, as shown in FIG. 1 (b), the adhesive surface 2a partially in contact with the surface of the unsupported portion W1 is made with the surface of the unsupported portion W1 by the adhesive area increasing means 4. Move the contact area to increase gradually. Subsequently, the movement of the adhesive surface 2a is stopped after substantially the entire adhesive surface 2a comes in contact with the surface of the unsupported portion W1 by the movement of the adhesive surface 2a.
In the reverse movement step of the adhesion means 2, as shown in FIG. 1 (c), the adhesion surface 2a adhered to the surface of the unsupported portion W1 in contact with the surface is moved by the reciprocation control means 3 in the opposite direction to the approaching movement. The reverse movement of the adhesive means 2 is stopped at a position where the adhesive surface 2a is on the same plane as the surface of the support portion W2 supported by the support member 1 in the thin plate-like work W.

Furthermore, the peeling process of the adhesive surface 2a forcibly pushes or peels off the adhesive surface 2a from the surface of the unsupported portion W1. Thereafter, the adhesive means 2 is returned to the standby position, and thereafter, it is programmed to repeat the above-described steps.

According to the adhesion holding method of the thin plate-like work W and the adhesion holding apparatus A of the thin plate-like work W according to the embodiment of the present invention, first, in the approaching and moving step of the adhesion means 2 The main body 2b of the adhesive unit 2 approaches and moves from the standby position toward the non-supporting portion W1 which is bent and deformed downward by its own weight in the work W. Subsequently, when a part of the adhesive surface 2a of the adhesive means 2 contacts the surface of the unsupported portion W1, the approaching movement of the adhesive means 2 is stopped. (See Fig. 1 (a))
As a result, a part of the adhesive surface 2a is brought into contact with the surface of the nonsupporting portion W1 with a hammer to make local adhesion.
Thereafter, the adhesive surface increasing means 4 moves the adhesive surface 2a around the surface of the thin plate-like work W by means of a tacking process, etc. The contact area with will gradually expand. (See Figure 1 (b))
As a result, the adhesive surface 2a contacts gradually with a partial time delay following the self-weight deflection of the non-supporting part W1, and accordingly the external load on the thin plate-like work W is kept very small while the adhesive surface 2a is Almost the whole is in contact with the surface of the unsupported portion W1 and held adhesively.
Thereafter, in the reverse movement step of the adhesion means 2, the position where the adhesion surface 2 a of the adhesion means 2 becomes flush with the surface of the support portion W 2 supported by the support member 1 in the thin plate work W It is moved backwards. (See Figure 1 (c))
As a result, the self-weight deflection of the unsupported portion W1 is reduced, and the entire thin plate-like work W is adhesively held in a planar manner.
Therefore, the self-weight deflection of the thin plate-like work W can be corrected by adhesively holding the non-supporting portion W1 substantially flush with the support portion W2 without damaging the thin plate-like work W.

Furthermore, as shown in FIGS. 2 (a) to 2 (e), the manufacturing system according to the embodiment of the present invention becomes the surface along the thin plate-like work adhesive holding device A and the thin plate-like work W described above. A magnetic surface 5 provided to face the non-processed surface W3, a processing mask 6 made of a magnetic material provided to face the processed surface W4 to be the film surface along the thin plate-like work W, and a thin plate A mask movement control means 7 is provided which controls the reciprocating movement of the processing mask 6 with respect to the processing surface (film surface) W4 of the workpiece W.

The magnet surface 5 is formed by embedding a permanent magnet or the like in a plate material having substantially the same size as the thin plate-like work W, or forming the whole plate material with a permanent magnet or the like, and the smooth magnetic surface portion 5a is a support member The thin plate-like work W supported by 1 is arranged on the same plane as the non-processed surface W3 of the support portion W2.
That is, the magnetic surface portion 5a of the magnet surface 5 is disposed on the same plane as the lower surfaces of the pressing vertical frame 1c and the horizontal frame 1d.

The processing mask 6 is, for example, a vapor deposition mask in which one or more openings (not shown) corresponding to vapor deposition patterns are formed on the film surface of the thin plate-like work W, and reciprocates in the Z direction It is freely provided, and the reciprocation of the thin plate-like work W with respect to the processing surface W4 is operated and controlled by the mask movement control means 7.
The mask movement control means 7 is provided in the controller together with the reciprocation control means 3 etc. and is also electrically connected to a drive source (not shown) for making the processing mask 6 reciprocate. According to the above, the operation control of the mask reciprocating drive source is performed.

As an example of operation control of the processing mask 6 by the mask movement control means 7, in its initial state, as shown in FIG. 2A, the non-supporting portion W1 of the thin plate-like work W not supported by the support member 1 It is preferable to make the processing mask 6 stand by so as to be separated from the processing surface W4. As shown in FIGS. 2 (a) to 2 (c), the processed surface W4 of the unsupported portion W1 also in the approaching and moving process of the adhesive means 2 and the adhesive process of the adhesive surface 2a and the reverse moving process of the adhesive means 2 described above. It is preferable to make the processing mask 6 stand by so as to be separated from the As shown in FIG. 2D, the processing mask 6 is moved in conjunction with the reciprocation control means 3 at the same time as the reverse movement process of the adhesion means 2 or after the reverse movement process of the adhesion means 2 is completed. The processing mask 6 is set to move toward the processing surface W 4 of the thin plate-like work W so that the processing mask 6 enters the magnetic attraction force area of the magnet surface 5.
In the example shown in FIGS. 2C and 2D, the adhesive surface 2a is moved back to a position on the thin plate-like work W on the same plane as the surface of the support portion W2 in the reverse movement step of the adhesive means 2. Although not shown as another example, it is also possible to reversely move the adhesive surface 2a until it enters the magnetic attraction region of the magnet surface 5.

According to the manufacturing system according to the embodiment of the present invention, the mask movement control means 7 makes the processing mask 6 a magnet surface after the contact of substantially the entire adhesion surface 2a of the adhesion means 2 with the surface of the unsupported portion W1. In order to move to the magnetic attraction region of 5, the thin plate-like work W is attracted to the magnetic surface 5 together with the processing mask 6 by the magnetic attraction force of the magnetic surface 5, and the support site W2 on the smooth magnetic surface portion 5a of the magnetic surface 5 While the non-machined surface W3 is in pressure contact, the surface of the processing mask 6 is in pressure contact with the processing surface W4 of the thin plate-like work W, and the entire thin plate-like work W is held between the magnet surface 5 and the processing mask 6 Ru. (See Figure 2 (e))
Therefore, the thin plate work W is held adhesively so that the non-supporting portion W1 is substantially flush with the supporting portion W2 without breakage, and is held in a planar shape between the magnetic surface portion 5a of the magnet surface 5 and the processing mask 6 can do.
As a result, deformation or distortion does not occur in the mask pattern in the processing mask 6, so that accurate pattern formation can be performed by vapor deposition or the like, precision can be improved, and yield can be improved.
Next, an embodiment of the present invention will be described based on the drawings.

In this embodiment, as shown in FIGS. 4A to 4D, the adhesive surface 2a is tiltably supported with respect to the main body 2b of the adhesive unit 2 as a specific example of the adhesive unit 2, and the adhesive area increasing unit 4 The adhesive surface 2a is moved while being pressed against the non-supporting portion W1 of the thin plate-like work W, and the adhesive surface 2a is peeled off from the non-supporting portion W1 of the thin plate-like work W in the main body 2b of the adhesive means 2 The peeling means 8 is integrally incorporated.

The main body 2b of the adhesion means 2 is formed in a disk shape or a rectangular plate shape, and the cylindrical body 2c is reciprocably inserted in the Z direction through a through hole opened at the center thereof. By providing a biasing member 2d such as a coil spring over the cylindrical body 2c, for example, the thin plate-like work W placed on the grid-like support member 1 is always biased in a direction to separate the cylindrical body 2c. There is.
An idler 2e is provided loosely at one end of the cylindrical body 2c, and an adhesive sheet to be the adhesive surface 2a is fixed to the tip of the idler 2e. For example, rubber may be inserted between the cylindrical body 2c and the idler 2e. By interposing an elastically deformable elastic member 2f such as a sheet, the floating body 2e and the adhesive surface 2a are supported so as to be tiltable with respect to the cylindrical body 2c.

The supporting direction of the floating body 2e and the adhesive surface 2a with respect to the cylindrical body 2c is controlled by the adhesive area increasing means 4, and one of the adhesive surface 2a is inclined at a predetermined angle with respect to the non-supporting portion W1 of the thin plate work W After contacting the portion with the surface of the unsupported portion W1, the adhesive material to be the adhesive surface 2a and the elastically deformable portion of the unsupported portion W1 are reciprocated while being pressed against the unsupported portion W1 with the adhesive surface 2a. By moving, the contact area with the surface of the unsupported portion W1 is gradually increased.

In the example shown in FIG. 4 (c), a rod 4a is rotatably inserted as an adhesion driving portion into the inner peripheral hole of the cylindrical body 2c, and the inclined surface 4b formed at the tip of the rod 4a is an idler 2e. The adhesive surface 2a is inclined at a predetermined angle θ by contacting the base end of the rod with a predetermined pressure, and the adhesive surface 2a is rotated at a predetermined angle by rotating the inclined surface 4b of the rod 4a while maintaining the contact state. It is configured to rotate and move while being inclined at θ.
Furthermore, in the example shown in FIGS. 4B and 4C, the reciprocating motion control means 3 contacts the surface of the unsupported portion W1 of the thin plate-like work W without tilting the adhesive surface 2a of the adhesive means 2 The inclined surface 4b of the rod 4a is brought into contact with the proximal end of the floating body 2e by the adhesive area increasing means 4 so that a part of the adhesive surface 2a contacts the surface of the unsupported portion W1. Then, by rotating the inclined surface 4b of the rod 4a, the pressure-sensitive adhesive surface 2a is wrinkled at the non-supporting region W1 within the range in which the pressure-sensitive adhesive material serving as the adhesive surface 2a and the non-supporting region W1 are elastically deformable. Operation control is performed to turn (turn) while inclining to hit.
Further, although not shown as another example, the adhesive surface 2a is made to stand by in a state in which the adhesive surface 2a is inclined in advance, or the adhesive surface 2a is inclined during approaching movement, and a part of the adhesive surface 2a is on the surface of the unsupported portion W1. It is also possible to stop the approaching movement at the time of contact.

Further, the peeling means 8 separates the adhesive surface 2a adhered to each other and the surface of the non-supporting portion W1 in the Z direction with a larger force than the adhesive force of the adhesive surface 2a.
As a specific example of the peeling means 5, a pusher 8a is provided so as to be movable toward the surface of the unsupported portion W1 or in the plane of the adhesive surface 2a or around the adhesive surface 2a, and is not supported by the protruding movement of the pusher 8a. It is preferable to forcibly push off the adhesive surface 2a from the surface of the part W1.
In the example shown in FIG. 4D, the pusher 8a is inserted into the through hole 2g opened at the center of the floating body 2e, and the operation is controlled so that the tip 8b protrudes from the adhesive surface 2a. There is.
Moreover, although not illustrated as another example, it is also possible to forcibly peel off the adhesive surface 2a from the surface of the unsupported portion W1 by reverse movement of the adhesive means 2.

According to the adhesive holding method of the thin plate-like work W and the adhesive holding apparatus A of the thin plate-like work W and the manufacturing system according to the embodiment of the present invention, a part of the adhesive surface 2a is pressed against the surface of the unsupported portion W1. After contact is made and local adhesion is performed, the adhesive surface increasing means 4 sets the adhesive surface 2a to the non-supporting region W1 within the elastically deformable range of the adhesive material to be the adhesive surface 2a and the non-supporting region W1. Since the cushioning action by the elastic member 2f causes the adhesive surface 2a to copy according to the reaction force of the posture of the unsupported portion W1 and the like, the adhesive surface 2a is partially not circumferentially moved in order to move around while turning with a brow. The contact area between the adhesive surface 2a and the surface of the non-supporting portion W1 is gradually expanded as the surface of the support portion W1 approaches sequentially.
As a result, the adhesive surface 2a of the adhesive means 2 can be softly partially contacted with the elastically deformed unsupported portion W1 of the thin plate-like work W, and the entire adhesive surface 2a can be reliably in surface contact.
As a result, there is an advantage that adhesion can be held flatly while preventing the thin plate-like work W from being completely cracked, and the operability is excellent.

In the above-described embodiment, the adhesive surface 2a is tiltably supported with respect to the main body 2b of the adhesive unit 2, and the adhesive surface increasing unit 4 applies the adhesive surface 2a to the unsupported portion W1 of the thin plate-like work W It is not limited to this, so that the inclination angle to the unsupported portion W1 gradually decreases from one end of the adhesive surface 2a to the other end instead of the rotational (rotation) movement of the adhesive surface 2a. Operation control may be performed to overturn.
Furthermore, the peeling means 8 for peeling off the adhesive surface 2a from the unsupported portion W1 of the thin plate-like work W is integrally incorporated into the main body 2b of the adhesive means 2, but the invention is not limited thereto. You may provide eight.

A Adhesive holding apparatus for thin plate-like workpiece 1 Support member 2 Adhesive means 2a Adhesive surface 2b Main body 3 Reciprocation control means 4 Adhesive area increasing means 5 Magnet surface 6 Processing mask 7 Mask movement control means W Thin plate W1 Unsupported part W2 Support area W3 Non-machined surface W4 Machined surface

Claims

With respect to a non-supporting portion of the thin plate-like work which is partially supported by the supporting member and not supported by the supporting member, the adhesion means is approached in a direction intersecting with the thin plate-like work until a part of the adhesive surface contacts. Let go
Moving the adhesive surface relative to the non-supporting part such that the contact area between the adhesive surface and the non-supporting part is gradually increased and substantially the entire surface comes into contact;
The adhesion of a thin plate-like work characterized in that the adhesion means is moved in a direction opposite to the approaching movement to a position where the adhesive face is flush with the support portion supported by the support member in the thin plate-like work How to hold.
A support member provided to abut a portion of the thin plate-like work to support the thin plate-like work;
An adhesive means having an adhesive surface facing the non-supporting portion where the support member does not abut on the thin plate-like work, and provided reciprocally in a direction crossing the thin plate-like work;
A reciprocation control means operable to control reciprocation of the adhesive surface with respect to the non-supporting portion;
Adhesive area increasing means for controlling the operation of the adhesive means so that the adhesive surface moves relative to the unsupported portion;
The reciprocation control means moves the adhesive surface closer to the non-supporting part, and stops a parting movement of the adhesive surface when a part of the adhesive surface contacts the non-supporting part,
The adhesion area increasing means is configured such that the contact area between the adhesive surface and the non-supporting part gradually increases to substantially contact the non-supporting part with respect to the non-supporting part after stopping the approach movement of the adhesive means. Move to
The reciprocation movement of the adhesive surface to a position where the reciprocation control means is in the same plane as the support region supported by the support member in the thin plate-like work after contact between the substantially entire adhesive surface and the unsupported region An adhesive holding device for a thin plate-like work, characterized in that it is moved in the opposite direction.
3. The pressure-sensitive adhesive surface is supported so as to be freely tiltable with respect to the main body of the pressure-sensitive adhesive means, and the pressure-sensitive adhesive area increasing means causes the pressure-sensitive adhesive surface to move circumferentially while touching the thin plate-like work. Adhesive holding device for thin plate-like work.
A manufacturing system comprising the adhesive holding device for a thin plate-like work according to claim 2 or 3,
It is composed of a smooth magnetic surface provided facing the non-machined surface of the thin plate-like work, and a magnetic material provided reciprocally in the direction intersecting the thin plate-like work opposite the processed surface of the thin plate-like work Processing mask,
Mask movement control means for controlling the reciprocating movement of the processing mask relative to the processing surface of the thin plate-like workpiece;
The mask movement control means moves the processing mask to the magnetic attraction force area of the magnet surface after the contact between the substantially entire adhesive surface and the unsupported portion in conjunction with the reciprocation control means. Characteristic manufacturing system.