JP7057334B2 - Manufacturing method of board holding unit, board holding member, board holding device, board processing device and electronic device - Google Patents

Description

The present invention relates to a substrate holding unit, a substrate holding member, a substrate holding device, a substrate processing apparatus, a substrate processing method, and a method for manufacturing an electronic device.

Display devices that display images on display panels are widely used in various fields such as industrial and consumer applications. Examples of the display device include an organic EL device provided with an organic EL element using electroluminescence of an organic material, a liquid crystal display device, and the like. At the time of manufacturing such a display device, the film forming material (metal electrode material, organic material, etc.) is adhered to the substrate in the film forming apparatus to form a film. The substrate held by the holding mechanism may be moved or inverted by the transport mechanism when the substrate is carried in and out of the film forming chamber or during the film forming process. Therefore, it is necessary to stably hold the substrate so that misalignment or the like does not occur.

As a mechanism for holding the substrate during transportation or film formation, there are methods such as sandwiching with a clamp, mounting on a receiving claw, and adsorption with an electrostatic chuck, as well as a method of adhesively holding the substrate using an adhesive material. Physical adhesion using an adhesive material is also called PSC (Physical Sticky Chuck), and can be preferably used for a large glass substrate or the like.

In Patent Document 1, a glass substrate is held by an adhesive member (sticky pad) provided on a holding plate, and the adhesively held glass substrate is conveyed and inverted together with the holding plate, and is held by the holding plate in an adhesive state. A configuration for processing a glass substrate is described.

Japanese Unexamined Patent Publication No. 2013-55093

However, when the substrate is held by using the adhesive member, there is a demand for a method for holding the substrate better.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique for better holding a substrate by using an adhesive member.

The present invention adopts the following configuration. That is,
A board holding unit for holding a board on a holding surface.
An adhesive member having an adhesive surface provided with an adhesive material that adheres to the substrate, and an adhesive member.
A coil spring connected to the adhesive member and
It has a shaft portion that is inserted into the inner peripheral side of the coil spring and is connected to the adhesive member.
The adhesive member is attached to the substrate via the coil spring so that the adhesive surface of the adhesive member can tilt and move forward and backward with respect to the holding surface.
The adhesive member is composed of a bottom portion having an opening larger than the diameter of the shaft portion and a cylindrical wall portion having the adhesive surface at the upper portion.
A bolt larger than the diameter of the opening is attached to one end of the shaft portion.
The shaft portion is connected to the adhesive member by inserting the opening.
It is a substrate holding unit characterized by this.
The present invention also employs the following configuration. That is,
A board holding device that holds a board against a board holding member.
The substrate holding member is
It has a substrate having a holding surface for holding the substrate and a plurality of substrate holding units.
Each of the plurality of substrate holding units of the substrate holding member
Shaft and
An adhesive member having an adhesive surface connected to the first end of the shaft portion and provided with an adhesive material that adheres to the substrate.
A stopper portion connected to a second end opposite to the first end of the shaft portion, and a stopper portion.
It has an elastic member connected to the adhesive member, and has.
The substrate of the substrate holding member has a holding portion provided with an opening.
In the substrate holding member, the shaft portion is inserted into the opening of the holding portion so that the adhesive member and the stopper portion are arranged at positions sandwiching the holding portion.
In the substrate holding member, each of the plurality of substrate holding units is attached to the substrate so that the adhesive surface of the adhesive member can tilt and move forward and backward with respect to the holding surface.
The board holding device is
A substrate moving means for moving the substrate between a first position where the substrate does not abut on the holding surface and a second position where the substrate abuts on the holding surface.
When the substrate is in the first position, the adhesive surface is moved to a position away from the substrate from the holding surface, and the substrate moving means moves the substrate to the second position and then the adhesive surface. It has an adhesive member moving means for bringing a surface into contact with the substrate, and has.
The adhesive member moving means of the substrate holding device has an electromagnetic coil for moving the adhesive surface by electromagnetic force.
It is a substrate holding member characterized by the above.

According to the present invention, it is possible to provide a technique for better holding a substrate by using an adhesive member.

The figure which shows the schematic structure of the substrate holding apparatus of Embodiment 1. Sectional drawing which shows the forward movement and the backward operation of the substrate holding unit of Embodiment 1. Sectional drawing which shows the tilting operation of the substrate holding unit of Embodiment 1. Sectional drawing which shows the tilting operation of the substrate holding unit of Embodiment 1. The figure explaining the operation flow of the substrate holding unit of Embodiment 1. Another figure illustrating the flow of operation of the substrate holding unit of the first embodiment. Another figure illustrating the flow of operation of the substrate holding unit of the first embodiment. An operation explanatory view of the reversing device of the first embodiment An operation explanatory view of the film forming apparatus of the first embodiment Schematic diagram of operation of the substrate peeling device of the first embodiment Sectional drawing which shows the forward movement and the backward operation of the substrate holding unit of Embodiment 2. Sectional drawing which shows the tilting operation of the substrate holding unit of Embodiment 2. Top view showing the manufacturing apparatus of the electronic device of Embodiment 3. The figure explaining the electronic device of Embodiment 4.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples merely illustrate preferred configurations of the present invention, and do not limit the scope of the present invention to those configurations. Further, in the following description, the hardware configuration and software configuration of the apparatus, processing flow, manufacturing conditions, dimensions, materials, shapes, the number of each member, the arrangement location, and the like are described in the present invention unless otherwise specified. It is not intended to limit the scope of.

The present invention relates to a substrate holding device and a substrate holding method for holding a substrate, a film forming apparatus and a film forming method using the same, a substrate processing device and a substrate processing method, and manufacturing of an electronic device using the formed substrate. It can be preferably applied to a method for manufacturing an apparatus and an electronic device. The film forming method is not limited to a method such as vapor deposition or sputtering, and the film forming material or the type of vapor deposition material is not limited. The present invention can also be regarded as a program for causing a computer to execute a substrate holding method and a film forming method, and a storage medium for storing the program. The storage medium may be a non-temporary storage medium that can be read by a computer.

INDUSTRIAL APPLICABILITY The present invention can be preferably applied to an apparatus for cleaning a substrate or forming a thin film (material layer) having a desired pattern on the surface of the substrate or a film of another material formed on the surface of the substrate. As the material of the substrate, any material such as glass, resin, metal, and silicon can be selected. As the film forming material, any material such as an organic material and an inorganic material (metal, metal oxide, etc.) can be selected. The technique of the present invention can be applied to, for example, an apparatus for manufacturing an electronic device or an optical member, and in particular, an organic electronic device (for example, an organic EL apparatus using an organic EL element, a thin film solar cell, an organic CMOS image sensor) and the like. It is applicable to the manufacturing equipment of.

The present invention can be applied not only to film formation applications but also to devices having a process of holding a substrate by an adhesive member, for example, a display manufacturing device and a processing device, and particularly a device for processing a large substrate or an inverted substrate. It can be preferably applied to an apparatus having a step of performing.

<Examination>
According to the study by the inventors of the present application, in order to stably hold the substrate by using the adhesive member provided in a plane by the substrate holding device, the substrate and the adhesive surface provided with the adhesive member are parallel to each other. It turned out that it is important to hold the adhesive in the state. For example, when an adhesive pad provided with an adhesive material on a flat surface is used, the larger the contact area between the adhesive material and the substrate, the greater the adhesive force. On the other hand, if the parallelism between the adhesive surface and the substrate is lowered, the contact area may be reduced and the holding force may be lowered.

Further, especially in a large substrate, the substrate tends to be in a wavy or bent state, and if a plurality of sticky pads are uniformly brought into contact with the substrate in such a state, the holding force differs depending on the part of the substrate. It may end up. That is, even if one sticky pad can be brought into contact with the substrate in parallel, the other sticky pads may be tilted and come into contact with the substrate due to the influence of bending or swelling of the substrate. If the adhesive pad and the substrate are tilted rather than parallel, the sufficient holding force cannot be exhibited as described above, which may hinder stable substrate holding.

Therefore, as a result of diligent studies by the inventor of the present application, when the substrate is held by a substrate holding device having an adhesive surface such as an adhesive pad, the adhesive pad is tilted so that the adhesive pad can be moved back and forth and tilted with respect to the substrate. It was found that the parallelism between the adhesive surface of the adhesive pad and the substrate can be improved by following the procedure, which led to the creation of the present invention. Hereinafter, examples of the present invention will be described.

[Embodiment 1]
The configuration of the substrate holding device of this embodiment will be described with reference to the drawings. 1A and 1B are views for explaining an internal configuration of a substrate holding device, FIG. 1A is a plan view of a substrate holding member, and FIG. 1B is a side sectional view of the substrate holding device.

<Board holding member>
The substrate holding member 100 includes a substrate having a surface for holding the substrate 10 (hereinafter, referred to as a holding surface 110X). In this embodiment, the substrate includes a flat plate-shaped member 110 whose holding surface 110X is formed of a flat surface, and a frame body 115 that supports the flat plate-shaped member 110. The flat plate-shaped member 110 is provided with a plurality of through holes 111 for allowing the pins 240 for moving the substrate 10 up and down from the holding surface 110X of the flat plate-shaped member 110. Further, the substrate holding member 100 includes a plurality of substrate holding units (adhesive units) 120 for holding the substrate 10 by utilizing the adhesive force. The configuration and function of the board holding unit 120 will be described later. Further, the flat plate-shaped member 110 is also provided with a plurality of through holes 112 for movably constituting the constituent members (adhesive pads 123 and the like) of the substrate holding unit 120. As will be described later, by driving the adhesive pad 123 by the adhesive member driving mechanism, the adhesive pad 123 can be projected or embedded from the holding surface 110X through the through hole 112, or the adhesive surface of the adhesive pad 123 can be brought into contact with the holding surface 110X. It can be made into one (same surface) state.

Further, the substrate holding member 100 includes a plurality of fixing tools 130 for fixing the periphery of the substrate 10 to the flat plate-shaped member 110. In this embodiment, the case of a clamp is shown as an example of the fixture 130, but the fixture is not limited to the clamp, and various known techniques can be adopted. Further, the shape and dimensions of the flat plate-shaped member 110 are appropriately set according to the size of the substrate 10 and the film formation region on the substrate 10. The number and arrangement of the through holes 111, the substrate holding unit 120, and the fixture 130 are also appropriately set according to the size of the substrate 10 and the film formation region on the substrate 10. In this embodiment, the substrate is a flat plate member 1.
An example composed of 10 and the frame 115 will be described, but the present invention is not limited thereto. That is, the substrate may include at least one of the flat plate-shaped member 110 and the frame 115. Alternatively, the substrate may be made of any other member as long as it has a holding surface 110X on a plane.

<Board holding device>
As shown in FIG. 1 (b), the substrate holding member 100 has a substrate holding chamber R1 (first chamber). The inside of the substrate holding chamber R1 is typically maintained in a vacuum atmosphere, and is provided with an opening for carrying in and out the substrate 10 and the mask. The vacuum in the present specification means a state of a space filled with a gas having a pressure lower than the normal atmospheric pressure (1013 hPa). The board holding device supports (fixes) a pin unit 200 (board moving mechanism) for moving the board 10 up and down, an electromagnetic coil unit 300 (adhesive member driving mechanism) having an electromagnetic coil 360, and a board holding member 100. ) Is provided with a support base 400. When the substrate holding member 100 is supported by the support base 400, the holding surface 110X of the substrate holding member 100 (flat plate-shaped member 110) is configured to be parallel to the horizontal plane.

The substrate holding chamber R1 is divided into a substrate processing area A1 and a drive source arrangement area A2. A substrate holding member 100 or the like is arranged in the substrate processing region A1. In the drive source arrangement area A2, the motor 210 in the pin unit 200, the motor 310 in the electromagnetic coil unit 300, and the like are arranged. With such a configuration, it is possible to prevent foreign matter generated by the rotation of the motors 210 and 310 and foreign matter generated in the sliding portion of the ball screw mechanism portion from entering the substrate processing region A1. The pin 240 may include the pin unit 200 as a substrate moving mechanism.

In the present embodiment, the configuration in which all the above two regions (A1 and A2) are arranged in the vacuum atmosphere of the substrate holding chamber R1 has been described, but the present invention is not limited to this. For example, only the substrate processing region A1 may be arranged in the vacuum atmosphere of the substrate holding chamber R1, and the drive source arrangement region A2 may be arranged in the atmosphere atmosphere. By doing so, the above-mentioned effect of suppressing the invasion of foreign matter into the substrate processing region A1 can be further enhanced.

Each unit included in the board holding member 100 is supplied with electric power from the power supply 710 and is controlled and operated by receiving a control signal from the control unit 720. Any known power supply can be used as the power supply 710. As the control unit 720, for example, an information processing device such as a PC or a workstation that has computational resources such as a processor and a memory and operates according to a program can be used.

The board holding member 100 supports (fixes) the pin unit 200 for moving the board 10 up and down by the pin 240 described above, the electromagnetic coil unit 300 for moving the electromagnetic coil 360 up and down, and the board holding member 100. It is equipped with a stand 400. The support base 400 can support the substrate holding member 100 so that the holding surface 110X formed by the flat plate-shaped member 110 is substantially horizontal.

The pin unit 200 is fixed to a motor 210, a screw shaft 220 rotated by the motor 210, a nut portion 230 that moves up and down along the screw shaft 220 as the screw shaft 220 rotates, and a nut portion 230. It is provided with a pin 240 that moves up and down together with the nut portion 230. It should be noted that a plurality of balls are configured to infinitely circulate between the inner peripheral surface of the nut portion 230 and the outer peripheral surface of the screw shaft 220. The configuration for moving the pin 240 up and down is not limited to the ball screw mechanism, and other known techniques such as a rack and pinion method can be adopted.

Further, in the illustrated example, a drive mechanism such as a motor 210 is provided for each pin 240. With this configuration, the top and bottom of the pin can be adjusted individually. However, it is possible to drive a plurality of pins 240 at the same time by one drive mechanism. For example, when the above ball screw mechanism is adopted, a plurality of pins 240 may be provided on one nut portion 230.

The electromagnetic coil unit 300 is fixed to a motor 310, a screw shaft 320 rotated by the motor 310, a nut portion 330 that moves up and down along the screw shaft 320 as the screw shaft 320 rotates, and a nut portion 330. A shaft portion 340 that moves up and down together with the nut portion 330, a support portion 350 provided at the tip of the shaft portion 340, and an electromagnetic coil 360 supported by the support portion 350 are provided. It should be noted that a plurality of balls are configured to infinitely circulate between the inner peripheral surface of the nut portion 330 and the outer peripheral surface of the screw shaft 320. The configuration for moving the electromagnetic coil 360 up and down is not limited to the ball screw mechanism, and other known techniques such as a rack and pinion method can be adopted.

Further, in the illustrated example, a drive mechanism such as a motor 310 is provided for each of the electromagnetic coils 360. With this configuration, the vertical movement of the electromagnetic coil can be adjusted individually. However, it is also possible to adopt a configuration in which a plurality of electromagnetic coils 360 are simultaneously driven by one drive mechanism. For example, when the above-mentioned ball screw mechanism is adopted, a plurality of shaft portions 340, support portions 350, and electromagnetic coils 360 may be provided for one nut portion 330.

Further, the electromagnetic coil 360 is configured such that a current flows by the power supply 710 under the control of the control unit 720. The operation of the electromagnetic coil 360 can be controlled by changing the direction of the current flowing through the electromagnetic coil 360 and the magnitude of the current by the control unit 720.

Here, a plurality of electromagnetic coils 360 are provided so as to correspond to each of the plurality of substrate holding units 120. As a result, the electromagnetic coil unit 300 functions as an adhesive member driving mechanism for driving the adhesive pads 123 in each substrate holding unit 120. That is, the electromagnetic coil unit 300 can advance and retreat the adhesive surface of the adhesive pad 123 with respect to the holding surface by acting on the advancing / retreating mechanism of each of the substrate holding units 120 in a non-contact manner. As a result, even if the distance between the holding surface and the substrate 10 varies from place to place due to waviness of the substrate 10, the adhesive pad 123 can move to a position where it can come into contact with the substrate 10. Further, since the adhesive surface of the adhesive pad 123 is moved back and forth by acting non-contactly with the advancing / retreating mechanism of each of the substrate holding units 120, the adhesive surface of the adhesive pad 123 is moved back and forth by sliding or the like when it comes into contact with the adhesive pad 123. It is possible to advance and retreat the adhesive surface of the adhesive pad 123 while suppressing the generation of foreign matter (wear powder and the like) that is generated.

<Structure of board holding unit>
2 and 3 are schematic cross-sectional views of the substrate holding unit 120, showing a cross section of the AA line portion of FIG. The individual substrate holding units 120 are held by the substrate holding unit holding portion 150 having an L-shaped cross section. The substrate holding unit holding portion 150 includes a fixed portion 151 fixed to the flat plate-shaped member 110 and a holding portion 152 for holding the substrate holding unit 120. The holding portion 152 is provided with a through hole 153. In this embodiment, an example in which the substrate holding unit holding portion 150 is fixed to the frame body 115 will be described, but the present invention is not limited to this, and the substrate holding unit holding portion 150 may be fixed to the substrate.

The substrate holding unit 120 includes a shaft portion 121, a support flange portion 122 fixed to one end of the shaft portion 121, and a sticky pad 123 fixed to the support flange portion 122. The adhesive pad 123 is a sheet-like member having an adhesive surface formed by molding an adhesive material made of a silicon-based resin, a fluororesin, a diene-based resin, or the like. The adhesive pad 123 may be considered as the adhesive member of the present invention, or the support flange portion 122 and the adhesive pad 123 may be considered together as an adhesive member. The adhesive pad 123 may have a structure in which an adhesive layer having adhesiveness and having a gripping surface (or adhesive surface) and an adhesive layer for adhering the adhesive layer to the support flange portion 122 are laminated. ..

The support flange portion 122 is fixed to one end side of the shaft portion 121 as a rotation shaft so as to be tiltable. For example, by providing the support flange portion 122 with a receiving portion for receiving the shaft end portion, the support flange portion 122 can be pivotally supported with respect to the axis in the extending direction of the shaft portion 121. As such a tilting mechanism including the shaft end portion and the bearing portion 122a, a known configuration such as a ball joint structure can be adopted. For example, in FIG. 3A, the adhesive surface of the adhesive pad 123 is substantially horizontal along the substrate 10, whereas in FIG. 3B where the substrate 10 is wavy, the adhesive pad 123 The adhesive surface is tilted with respect to the horizontal plane so as to be along the substrate 10.

In the present embodiment, the support flange portion 122 is fixed to one end side of the shaft portion 121 so as to be tiltable, but the present invention is not limited to this, and the support flange portion 122 is rigidly fixed to the shaft portion 121 by welding fixing or the like. It may be fixed to. Even in this case, since the integrally fixed support flange portion 122 and the shaft portion 121 are supported by the elastic body 128 described later, the support flange portion 122 can be tilted with respect to the holding surface. That is, when the support flange portion 122 is tilted, the elastic body 128 is bent and the shaft portion 121 is tilted. As a result, as shown in FIG. 4, it is possible to swing within the play range of the through hole 153 provided in the holding portion 152. As a result, the adhesive surface of the adhesive pad 123 can be made to follow the inclination of the substrate 10. That is, the elastic body 128 also functions as a tilting mechanism.

Further, the substrate holding unit 120 includes a stopper portion 124 fixed to the shaft portion 121 and a cylindrical permanent magnet 125 fixed to the shaft portion 121 with the shaft portion 121 inserted and adjacent to the stopper portion 124. , A washer 126 and a nut 127 for fixing the permanent magnet 125 to the shaft portion 121. A female screw is formed on the other end side of the shaft portion 121, and the permanent magnet 125 can be fixed to the shaft portion 121 by screwing the nut 127 into the female screw. The stopper portion 124 is fixed to both ends of the shaft portion 121 on the other end side opposite to the one end side on which the adhesive pad is arranged by screw fastening, welding, or the like.

When the nut 127 is screwed in, the shaft portion 121, the support flange portion 122, the adhesive pad 123, the stopper portion 124, the permanent magnet 125, the washer 126, and the nut 127 are integrated and integrated. It constitutes a modified shaft portion 121 and the like. Further, the cylindrical permanent magnet 125 is configured so that the magnetic poles are different on one end side and the other end side in the axial direction. In the illustrated example, the side where the adhesive pad 123 is provided is the N pole, and the opposite side is the S pole, but they may be arranged in the opposite direction.

The substrate holding unit 120 is elastic for supporting the integrated shaft portion 121 and the like in a state where the shaft portion 121 can be reciprocated (vertically moved) and the shaft portion 121 can be swung. It has a body 128. In the illustrated example, a metal spring (coil spring) is used as the elastic body 128. However, as the elastic body, an appropriate configuration such as a metal leaf spring or a cylindrical member made of an elastomer material can be adopted. However, when the substrate holding member 100 is used in a vacuum, it is preferable to use a metal elastic member as the elastic body 128 from the viewpoint of reducing degassing from the constituent materials.

The substrate is held with the shaft portion 121 inserted through the through hole 153 so that the adhesive pad 123 and the like are arranged on the holding surface 110X side with the holding portion 152 sandwiched between them and the stopper portion 124 and the like are arranged on the opposite side thereof. The unit 120 is held by the substrate holding unit holding unit 150. At this time, one end of the elastic body 128 is fixed to the support flange portion 122, and the other end is provided in a state of being fixed to the holding portion 152. A gap is provided between the inner peripheral surface of the elastic body 128 and the outer peripheral surface of the shaft portion 121 so that the elastic body 128 and the shaft portion 121 do not come into contact with each other. Further, the stopper portion 124 is set to have a diameter larger than that of the through hole 153 to prevent the integrated shaft portion 121 and the like from falling out of the through hole 153. As described above, in the substrate holding unit 120, only the other end of the elastic body 128 is fixed to the holding portion 152, and the other members constituting the substrate holding unit 120 are the constituent members other than the substrate holding unit 120. It is configured not to touch. With such a configuration, it is possible to suppress the generation of foreign matter (particles) due to contact wear. In this embodiment, the stopper portion 124 is arranged adjacent to the permanent magnet 125, and is integrated with the positioning and fixing function of the shaft portion 121 of the permanent magnet 125 in the axial direction by abutting against the holding portion 152. It has both a function of preventing the 121 and the like from falling out of the through hole 153 (mechanical stopper function), but the configuration is not limited to this. That is, a member having a positioning and fixing function of the permanent magnet 125 may be provided separately from the stopper portion 124 having the mechanical stopper function.

The sticky pad 123 can change its position between the forward state shown in FIG. 2 (a) and the retracted state shown in FIG. 2 (b). That is, when the holding surface 110X is parallel to the horizontal plane and faces upward in the vertical direction, and only the weight of the substrate holding unit 120 acts on the substrate holding unit 120, the adhesive pad 123 is more than the holding surface 110X. Also slightly protrudes upward in the vertical direction. In this forward state, the integrated shaft portion 121 and the like are supported only by the elastic body 128. As a result, the integrated shaft portion 121 and the like are allowed to reciprocate (up and down) so that the adhesive surface of the adhesive pad 123 can move forward and backward with respect to the holding surface 110X. Therefore, the adhesive pad 123 can move forward and backward from the holding surface 110X. Further, when the adhesive surface of the adhesive pad 123 is tilted, pressure can be absorbed by deforming the spring constituting the elastic body 128 as shown in FIG. 3 (b). In this embodiment, an example in which the adhesive pad 123 is slightly protruded from the holding surface 110X in the above-mentioned state will be described, but the present invention is not limited to this, and the adhesive surface of the adhesive pad 123 is in the above-mentioned state. It may be located on the same plane as the holding surface 110X.

Here, the power supply 710 passes a current through the electromagnetic coil 360 under the control of the control unit 720 to generate an electromagnetic force that draws the permanent magnet 125 into the electromagnetic coil 360. As a result, the integrated shaft portion 121 and the like move downward in the vertical direction against the elastic repulsive force (spring force of the spring) of the elastic body 128 in the substrate holding unit 120. As a result, as shown in FIG. 2B, the adhesive pad 123 moves vertically downward with respect to the holding surface 110X. Although the substrate holding unit 120 has a permanent magnet 125 here, the present invention is not limited to this, and a magnetic member made of a magnetic material may be used instead of the permanent magnet. As the magnetic material, it is preferable to use a ferromagnetic material or a diamagnetic material. As a result, the integrated shaft portion 121 or the like can be moved downward or upward in the vertical direction by an external magnetic force such as an electromagnetic force generated by the electromagnetic coil 360.

<Substrate holding process>
With reference to FIGS. 5A to 5C, a mode in which the substrate holding unit 120 as illustrated in FIG. 4 of the present embodiment adheres to the substrate 10 will be described.
FIG. 5A shows how the pin 240 holds the substrate 10 above the holding surface 110X. That is, before the substrate 10 is carried into the substrate holding chamber R1, the pin unit 200 controls so that the surface formed by one end of each of the plurality of pins 240 is above the holding surface 110X in the Z direction. Further, the control unit 720 controls the energization of the electromagnetic coil 360 by the power supply 710 to keep the adhesive pad 123 of the substrate holding unit 120 in the retracted state. Then, by carrying the substrate 10 into the substrate holding chamber R1 in this state, the state shown in the figure is obtained. In the illustrated state, the height of the substrate 10 is above the holding surface 110X, and the two do not come into contact with each other. The height of the substrate at this time is defined as the first height.

In FIG. 5B, the pin unit 200 moves the plurality of pins 240 downward. As a result, the substrate 10 comes into contact with the holding surface 110X. The height of the substrate at this time is defined as the second height. However, in the illustrated example, since the substrate 10 is wavy, a part of the substrate 10 does not abut on the holding surface 110X, and the angle of the substrate 10 is also partially tilted with respect to the horizontal plane. It is in a non-parallel state.

When, for example, the side depot method is used instead of the depot-up method, the substrate 10 moves laterally instead of raising and lowering. In that case, the substrate 10 is moved by the substrate moving mechanism between the first position where it does not abut on the holding surface and the second position where it abuts on the holding surface. At this time, when the substrate is in the first position, the substrate holding unit retracts the adhesive surface to a position farther from the substrate than the holding surface. Then, after the substrate moving mechanism moves the substrate to the first position where it does not abut on the holding surface, the adhesive surface is advanced to the holding surface to bring the substrate into contact with the adhesive surface.

In FIG. 5C, the control unit 720 controls the energization of the electromagnetic coil 360 by the power supply 710 to advance the adhesive pad 123 of the substrate holding unit 120 so that it slightly protrudes from the holding surface 110X. Since the adhesive pad 123 is urged toward the substrate side with respect to the holding surface by the elastic body 128, the adhesive pad 123 comes into contact with the substrate 10. At this time, the tilting mechanism allows the adhesive pad 123 to tilt, and the substrate 10 and the adhesive surface of the adhesive pad 123 come into contact with each other in a substantially parallel state. That is, the elastic body 128 also has a function as an urging means for urging the adhesive surface of the adhesive pad 123 toward the substrate 10. The elastic body 128 as the urging means urges the adhesive pad 123 toward the substrate in a swingable state, so that the contact state between the adhesive surface and the substrate is improved.

As shown in FIGS. 2 to 5C, in this embodiment, the adhesive pad 123 can move forward and backward with respect to the holding surface and can be tilted. That is, the adhesive pad 123 can be moved forward and backward with respect to the holding surface 110X by the integrated shaft portion 121 or the like, and the adhesive pad 123 is urged against the substrate by the elastic body 128, so that the substrate can be moved back and forth. Even when the distance from the holding surface 110X differs depending on the position of the substrate 10 due to the undulation of the substrate 10, the adhesive pad 123 can reach the height of the substrate 10 and adhere to the substrate. The shaft portion 121 and the like, the electromagnetic coil unit 300, and the electromagnetic coil 360 can be considered as an advancing / retreating mechanism that allows the adhesive pad 123 to advance / retreat with respect to the holding surface.

Further, the tilting mechanism allows the sticky pad 123 to change its inclination with respect to the holding surface 110X (when the surface parallel to the holding surface is an XY plane, the inclination with respect to an arbitrary XY direction). Since the substrate holding unit 120 allows the adhesive pad 123 to tilt (swing operation) in this way, the adhesive pad 123 even when the angle of the substrate 10 is tilted with respect to the horizontal plane due to the waviness of the substrate 10 or the like. Since the parallelism when the adhesive surface of the substrate 10 comes into contact with the substrate 10 is improved, a decrease in the adhesive force is suppressed.

After the state shown in FIG. 5B, the pin 240 is further moved downward, the substrate 10 is placed on the substrate, and then the substrate 10 is pressed from above using a pressing portion (not shown) to press the substrate 10. A further pressing step for flattening may be provided. By sandwiching the substrate 10 between the pressing portion (not shown) and the holding surface 110X of the substrate, the substrate 10 can be straightened so as to be in a flatter state. Then, by advancing the adhesive pad 123 as shown in FIG. 5C, the substrate 10 can be held better. Even when the substrate 10 is corrected in this way and then held by the adhesive pad 123, as time passes, the internal stress of the substrate 10 itself and various films formed on the substrate 10 may increase. As a result, the substrate 10 may bend or undulate. Even in such a case, according to the present embodiment, the adhesive pad 230 is configured to be tiltable while being urged by the elastic body 128 in the direction of approaching (or being pressed against) the substrate 10. Therefore, the adhesive pad 230 moves following the tilting and floating of the substrate 10. Therefore, according to the present embodiment, the substrate 10 can be stably held for a long time.

In this embodiment, the substrate holding member 100 holds the substrate 10 in a state where the holding surface 110X of the substrate holding member 100 is arranged so as to be parallel to the horizontal plane and face upward in the vertical direction. Not limited to. For example, the substrate holding member 100 holds the substrate 10 in a state where the holding surface 110X of the substrate holding member 100 is arranged so as to be perpendicular to the horizontal plane, that is, in a state where the holding surface 110X is arranged so as to face the horizontal direction. You may do so. In this case, as a substrate moving mechanism, the substrate 10 is supported in a state where the main surface (deposition surface) of the substrate 10 faces in the horizontal direction, and the substrate 10 is brought closer to the holding surface 110X of the substrate holding member 100 in that state. A mechanism that can be separated from each other may be used. As such a substrate moving mechanism, a conventionally known mechanism can be adopted. For example, a clamp portion that clamps the upper and lower sides of the substrate 10 with the main surface facing horizontally and a clamp portion that clamps the clamp portion in the horizontal direction. And an actuator to move to can be used. Alternatively, an electrostatic chuck that electrostatically attracts the surface of the substrate 10 opposite to the film-forming surface of the substrate 10 with the main surface facing horizontally and an actuator that moves the electrostatic chuck in the horizontal direction may be used. can.

Further, in the present embodiment, the pin 240 and the pin unit 200 provided with the actuator are used as the substrate moving mechanism, but the present invention is not limited thereto as described above. As the substrate moving mechanism, in addition to the above-mentioned example, one or a plurality of supporting portions (claw) supporting the peripheral portion of the substrate 10 arranged in a state where the main surface (deposition surface) is parallel to the horizontal plane, and An actuator for moving the support portion can also be used. In this case, the substrate of the substrate holding member 100 is provided with a notch or the like at a position corresponding to each of the one or a plurality of support portions, and the support surface by the support portion and the holding surface 110X of the substrate holding member 100 are provided. It is preferable to be able to position and in the same plane.

As a result, the substrate holding step is completed, and the substrate holding member 100 holding the substrate 10 is carried out from the substrate holding chamber R1.

<Other processes>
<< Inversion process >>
FIGS. 6A and 6B show a schematic configuration of the entire reversing device in cross section. The reversing device includes a reversing chamber R2. The inside of the reversing chamber R2 is configured to have a vacuum atmosphere. The reversing device includes a holding member 610 that holds the substrate holding member 100, a rotary shaft 620 fixed to the holding member 610, a motor 630 that rotates the rotary shaft 620, and a support member 640 that pivotally supports the rotary shaft 620. I have.

The substrate holding member 100 holding the substrate 10 is carried out from the substrate holding chamber R1 and then sent to the reversing device (reversing chamber R2). Then, the substrate holding member 100 carried into the reversing chamber R2 is held by the holding member 610 (see FIG. 6A). After that, the substrate holding member 100 is inverted (rotated by 180 °) by the motor 630. As a result, the substrate 10 is in a state of facing downward in the vertical direction with respect to the substrate holding member 100. FIG. 6B shows the state after inversion. According to the present embodiment, since the adhesive surface of the adhesive pad 123 and the substrate 10 are in contact with each other substantially in parallel, the substrate 10 can be held without reducing the adhesive force. It is also preferable to fix the substrate to the substrate holding member 100 by a clamping operation using the fixing tool 130 before the reversing operation. In the state where the board holding member 100 is inverted, the stopper portion 124 is in a state of abutting against the holding portion 152 of the board holding unit holding member 150. As a result, the substrate 10 is held by the plurality of substrate holding units 120 while maintaining the parallel state.

As a result, the inversion step is completed, and the substrate holding member 100 holding the substrate 10 is the inversion chamber R2.
It is carried out from.

<< Mask holding process >>
The substrate holding member 100 holding the substrate 10 is carried out from the reversing chamber R2 and then sent to an alignment device (alignment chamber). In the alignment chamber, the mask 20 is held on the substrate 10 in a state of being aligned with the substrate 10. As a method for holding the mask 20, a magnetic force generated by a permanent magnet, an electromagnet, a permanent magnet, or the like can be used, or a mechanical holding means such as a clamp can be adopted. Of course, these can be used together. As for the device for holding the mask 20 in the state of being aligned with the substrate 10, various known techniques may be applied, and thus the description thereof will be omitted.

As described above, the mask holding step is completed, and the substrate holding member 100 holding the substrate 10 and the mask 20 is carried out from the alignment chamber.

<< Film formation process >>
FIG. 7 shows a schematic configuration of the entire film forming apparatus (vapor deposition apparatus in this embodiment) in cross section. The film forming apparatus includes a film forming chamber (second chamber) R3. The inside of the film forming chamber R3 is configured to have a vacuum atmosphere. Further, the film forming apparatus includes an evaporation source 30 as a film forming source.

The substrate holding member 100 holding the substrate 10 and the mask 20 is carried out from the alignment chamber and then sent to the film forming apparatus (deposition chamber R3). A film forming source for forming a film is arranged in the film forming chamber R3, and the film is formed on the substrate 10 held by the substrate holding member 100 via the mask 20. In this embodiment, film formation (deposited film) by vacuum vapor deposition is performed. Specifically, the film-forming material evaporates or sublimates from the evaporation source 30 as the film-forming source, and the film-forming material is vapor-deposited on the substrate 10 to form a thin film on the substrate 10. Since the evaporation source 30 is a known technique, detailed description thereof will be omitted. For example, the evaporation source 30 can be composed of a container for accommodating a film forming material such as a crucible, a heating device for heating the container, and the like. The film forming chamber R3 may be composed of a plurality of chambers, and a film forming source for forming a different film forming material may be arranged in each chamber. Then, the substrate holding member 100 holding the substrate 10 is sequentially conveyed in each chamber, so that film formation with each film forming material may be sequentially performed. Further, the film forming source is not limited to the evaporation source 30, and the film forming source may be a sputtering cathode for forming a film by sputtering.

With the above, the film forming process is completed. After that, the mask 20 is removed from the substrate 10. Since the device for removing the mask 20 from the substrate 10 is a known technique, the description thereof will be omitted. Further, after the mask 20 is removed, the step of forming a film with another film forming material using another mask may be repeated. Then, after all the film forming steps are completed and the mask is removed, the substrate 10 is peeled off from the substrate holding member 100.

<< Substrate peeling process >>
FIGS. 8A and 8B show a schematic configuration of the entire substrate peeling device in cross section. The substrate peeling device includes a substrate peeling chamber R4. The inside of the substrate peeling chamber R4 is configured to have a vacuum atmosphere. Similar to the board holding device, the board peeling device includes a pin unit 200 (board moving mechanism) for moving the board 10 up and down, an electromagnetic coil unit 300 (first adhesive member driving mechanism), and a board holding member 100. It is equipped with a support base 500 to support. Since these configurations themselves are as described above, the description thereof will be omitted.

Then, the substrate peeling device makes it possible to move the electromagnetic coil unit 300 in parallel with the holding surface 110X by moving the support base 370 supporting the electromagnetic coil unit 300 and the support base 370 in parallel with the holding surface 110X. It is equipped with a driving device 380 (second adhesive member driving mechanism). Various known techniques such as a ball screw mechanism and a rack and pinion actuator can be applied to the drive device 380. In the illustrated example, a plurality of electromagnetic coil units 300 are provided, and the support base 370 is configured to support all the electromagnetic coil units 300.

After the mask is removed, the substrate holding member 100 holding the substrate 10 is carried into the substrate peeling chamber R4. Then, the substrate holding member 100 is supported (fixed) by the support base 500. FIG. 8A shows a state in which the substrate holding member 100 is supported by the support base 500. After that, by passing an electric current through the electromagnetic coil 360, an electromagnetic force that draws the permanent magnet 125 into the electromagnetic coil 360 is generated. In this embodiment, since the adhesive force of the adhesive pad 123 is high, the adhesive pad 123 does not peel off from the substrate 10 only by this electromagnetic force.

Then, in the state where the above-mentioned electromagnetic force is generated, the support base 370 is moved by the drive device 380, so that all the electromagnetic coils 360 are simultaneously moved in parallel with the holding surface 110X. As a result, the permanent magnet 125 in the substrate holding unit 120 is pulled in the direction parallel to the holding surface 110X, and the shaft portion 121 is slightly tilted, so that the adhesive pad 123 is also tilted and is in a state of being peeled off from the substrate 10. After that, the integrated shaft portion 121 and the like move downward in the vertical direction by the electromagnetic force against the elastic repulsive force of the elastic body 128, so that the adhesive pad 123 is separated from the substrate 10. In this embodiment, a case where all the electromagnetic coils 360 are moved at the same time by one support base 370 and one drive device 380 is shown. However, the present invention is not limited to such a configuration. For example, the plurality of electromagnetic coils 360 may be divided into a plurality of sets, and a support base 370 and a drive device 380 may be provided for each set. In this case, the electromagnetic coil 360 may be moved at the same time for all the sets, or the electromagnetic coil 360 may be moved at different times for each set. It is sufficient that one or more electromagnetic coils 360 are present in each set. When a plurality of electromagnetic coils 360 are present in each set, it is possible to adopt a configuration in which a drive mechanism such as a motor 310 is individually provided for one electromagnetic coil 360, as described above. It is also possible to adopt a configuration in which a plurality of electromagnetic coils 360 are simultaneously driven by one drive mechanism. Therefore, for each set, it is possible to adopt a configuration in which only one electromagnetic coil unit 300 (however, a plurality of electromagnetic coils 360 are provided) is provided. Further, the substrate peeling device may be provided with only one electromagnetic coil unit 300 (however, a plurality of electromagnetic coils 360 are provided).

After the sticky pad 123 is separated from the substrate 10, the fixing of the substrate 10 by the fixture 130 is released. FIG. 8B shows a state in which the support base 370 has moved and the substrate 10 has been released from being fixed by the fixture 130. The operation of releasing the fixing of the substrate 10 by the fixing tool 130 may be controlled so as to be performed before the support base 370 is moved. After that, the pin 240 is moved upward in the vertical direction by the motor 210, and the substrate 10 is lifted by the plurality of pins 240 and separated from the substrate holding member 100. After that, the substrate 10 is carried out from the substrate peeling chamber R4.

In this embodiment, the substrate 10 is peeled off from the substrate holding member 100 in a state where the holding surface 110X of the substrate holding member 100 is arranged so as to be parallel to the horizontal plane and face upward in the vertical direction. Not limited to. For example, the substrate 10 is peeled off from the substrate holding member 100 in a state where the holding surface 110X of the substrate holding member 100 is arranged so as to be perpendicular to the horizontal plane, that is, in a state where the holding surface 110X is arranged so as to face the horizontal direction. You may do so. Needless to say, as the substrate moving mechanism, other conventionally known mechanisms can be used as described in the description of the substrate holding process.

[Embodiment 2]
Another configuration of the substrate holding member 100 will be described with reference to FIGS. 9 to 10. The same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 9A shows an advancing state in which the adhesive surface of the adhesive pad 123 of the substrate holding member 100 of the present embodiment projects upward from the holding surface 110X, and FIG. 9B shows the adhesive surface holding the adhesive surface. It is a retracted state in which the surface 110X is retracted downward. Differences from the adhesive pad 123 of the first embodiment will be described. FIG. 9C is a plan view of the adhesive pad 123 viewed from above in the Z direction.
As shown in FIGS. 9A to 9C, the support flange portion 122 of the present embodiment is configured in the shape of a bottomed cylindrical container having a hole through which the shaft portion 121 is inserted in the central portion. The adhesive material of the adhesive pad 123 is arranged on the upper part of the wall of the cylindrical container to form an adhesive surface. By fixing the shaft portion 121 to the shaft portion 121 through the insertion hole, the adhesive pad 123 does not fall off even when the substrate holding member 100 is turned upside down.

Also in this embodiment, the substrate 10 is carried in with the adhesive pad 123 retracted downward from the holding surface 110X, and is supported above the holding surface 110X by the pin 240. Then, the pin 240 is lowered and the substrate 10 is placed on the holding surface 110X. After that, the electromagnetic coil 360 operates under the control of the control unit 720 to move the substrate holding unit 120 upward, so that the adhesive pad 123 comes into contact with the substrate 10.
FIG. 10A shows a contact state when the substrate 10 is placed substantially horizontally on the holding surface 110X. On the other hand, FIG. 10B shows a state in which the substrate 10 is placed at a certain angle with respect to the holding surface 110X due to the waviness of the substrate 10. As shown in the figure, since the support flange portion 122 urged by the elastic body 128 is configured to be tiltable according to the inclination of the substrate 10, the adhesive surface of the adhesive pad 123 and the substrate 10 are substantially parallel to each other. I can touch you.

Also in the second embodiment, since the adhesive surface of the adhesive pad 123 can move forward and backward and tilt with respect to the holding surface, the contact area between the substrate 10 and the adhesive pad 123 increases, and the decrease in adhesive force can be suppressed.

[Embodiment 3]
In this embodiment, a method of applying the film forming apparatus of each of the above embodiments to the electronic device manufacturing apparatus for manufacturing an organic EL display or the like will be described. FIG. 11 is a plan view schematically showing a part of the electronic device manufacturing apparatus 500. The electronic device manufacturing apparatus 500 automatically performs steps from substrate pretreatment to film formation / encapsulation in electronic device manufacturing.
In addition, instead of the cluster type configuration in which a plurality of processing chambers are arranged around the transport chamber as shown in the figure, an in-line type configuration in which a plurality of processing chambers are arranged in the order of processes may be adopted. When the in-line type configuration is adopted, a substrate holding device for holding the substrate may be provided in the transport carrier and moved between the processing chambers. In that case, the substrate carried into the electronic device manufacturing apparatus is held by the transport carrier with the film-formed surface facing upward, and then the mask is placed on the substrate while aligning the mask, and then the transport carrier is mounted. It may be turned upside down. As a result, the substrate with the film-formed surface facing downward is carried into the film-forming chamber together with the transport carrier, and film-forming using the film-forming material is performed.

A pretreatment chamber 511, an organic treatment chamber 512, a metal treatment chamber 513, and a measurement chamber 514 are radially arranged around the transfer chamber 510. Note that FIG. 11 is a simplified diagram, and the type and number of processing chambers are not limited to this. For example, a processing chamber such as a hole injection layer, a hole transport layer, an electron transport layer, or an electron injection layer may be provided, or a light emitting layer for each color such as R (red), G (green), and B (blue). Processing room may be provided. The transfer chamber 510 is provided with a transfer robot 519 that holds and conveys the substrate 10. The transfer robot 519 is, for example, a robot having a structure in which a robot hand for holding a substrate is attached to an articulated arm, and carries in and out the substrate into and out of each processing room and measurement room.

The manufacturing process of electronic devices is roughly as follows. First, the substrate 10 is carried into the pretreatment chamber 511, and pretreatment such as cleaning is performed. After that, the substrate is transferred to the organic processing chamber 512 or the metal processing chamber 513 by the transfer robot 519 according to the type of the film forming material. In each processing chamber, the vapor deposition material adheres to the substrate and a film is formed by vapor deposition or sputtering from the evaporation source. Next, the substrate 10 is carried into the measuring chamber 514. In the measurement room, the film thickness and the uniformity of film formation are measured.

Each processing chamber for forming a film is provided with a film forming apparatus. A series of processes such as transfer of the substrate to and from the transfer robot, adjustment of the relative position between the substrate and the mask (alignment), fixing of the substrate on the mask, and film formation (deposited film) are automatically performed by the film forming apparatus. In addition, the measurement process in the measurement room can also be automated. Further, as a treatment after the measurement, a sealing treatment with a sealing glass coated with a desiccant or an adhesive may be performed. The completed panel is automatically removed from the manufacturing apparatus and supplied to the next process (for example, the assembly process of the display panel). However, the above configuration is an example, and does not limit the configuration of the film forming apparatus of the present invention and the electronic device manufacturing apparatus including the film forming apparatus.

According to the above-mentioned electronic device manufacturing apparatus and the electronic device manufacturing method using the same, the temperature of the substrate is well controlled in the film forming apparatus, so that the film formation is performed well. As a result, it becomes possible to manufacture high quality electronic devices.

[Embodiment 4]
<Manufacturing method of organic electronic devices>
In this embodiment, an example of a method for manufacturing an organic electronic device using a film forming apparatus including an evaporation source apparatus will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be illustrated as an example of the organic electronic device. First, the organic EL display device to be manufactured will be described. FIG. 12A shows an overall view of the organic EL display device 60, and FIG. 12B shows a cross-sectional structure of one pixel.

As shown in FIG. 12A, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix in the display area 61 of the organic EL display device 60. Each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The pixel referred to here refers to the smallest unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device of the present figure, the pixel 62 is composed of a combination of a first light emitting element 62R, a second light emitting element 62G, and a third light emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and is particularly limited to at least one color. It is not limited. Further, each light emitting element may be configured by laminating a plurality of light emitting layers.

Further, the pixel 62 is composed of a plurality of light emitting elements exhibiting the same light emission, and one pixel is displayed by using a color filter in which a plurality of different color conversion elements are arranged in a pattern so as to correspond to each light emitting element. It may be possible to display a desired color in the region 61. For example, a color filter may be used in which the pixel 62 is composed of at least three white light emitting elements and red, green, and blue color conversion elements are arranged so as to correspond to the respective white light emitting elements. Alternatively, a color filter may be used in which the pixel 62 is composed of at least three blue light emitting elements and each of the red, green, and colorless color conversion elements is arranged so as to correspond to each light emitting element. In the latter case, quantum dots (Quantum Dot) are used as the material that constitutes the color filter.
: QD) By using a quantum dot color filter (QD-CF) using a material, the display color gamut can be made wider than that of a normal organic EL display device that does not use a quantum dot color filter.

12 (b) is a schematic partial cross-sectional view taken along the line AB of FIG. 12 (a). The pixel 62 has a first electrode (anode) 64, a hole transport layer 65, one of the light emitting layers 66R, 66G, 66B, an electron transport layer 67, and a second electrode (cathode) 68 on the substrate 10. It has an organic EL element comprising. Of these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. Further, in the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. When a color filter or a quantum dot color filter is used as described above, the color filter or the quantum dot color filter is arranged on the light emitting side of each light emitting layer, that is, on the upper or lower part of FIG. 12B. However, the illustration is omitted.

The light emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to a light emitting element (sometimes referred to as an organic EL element) that emits red, green, and blue, respectively. Further, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer P for protecting the organic EL element from moisture and oxygen is provided.

Next, an example of a method for manufacturing an organic EL display device as an electronic device will be specifically described. First, a substrate 10 on which a circuit (not shown) for driving an organic EL display device and a first electrode 64 are formed is prepared.

Next, an acrylic resin is formed by spin coating on the substrate 10 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in the portion where the first electrode 64 is formed. The insulating layer 69 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

Next, the substrate 10 in which the insulating layer 69 is patterned is carried into the first film forming apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is placed on the first electrode 64 in the display region. A film is formed as a common layer. The hole transport layer 65 is formed by vacuum deposition. In reality, the hole transport layer 65 is formed in a size larger than that of the display region 61, so that a high-definition mask is unnecessary. Here, the film forming apparatus used for the film forming in this step and the film forming of each of the following layers is the film forming apparatus described in any of the above embodiments.

Next, the substrate 10 on which the hole transport layer 65 is formed is carried into the second film forming apparatus and held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 66R that emits red is formed on the portion of the substrate 10 where the element that emits red is arranged. According to this example, the mask and the substrate can be satisfactorily overlapped with each other, and high-precision film formation can be performed.

Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G that emits green is formed by the third film forming apparatus, and the light emitting layer 66B that emits blue is further formed by the fourth film forming apparatus. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the light emitting layers 66R, 66G, and 66B of three colors. In this embodiment, the electron transport layer 67, the light emitting layer 66R, 66G, 66B
Is formed by vacuum deposition.

The substrate on which the electron transport layer 67 is formed is moved to a sputtering device to form a second electrode 68, and then moved to a plasma CVD device to form a protective layer P to complete the organic EL display device 60. do. Although the second electrode 68 is formed by sputtering here, the present invention is not limited to this, and the second electrode 68 may also be formed by vacuum deposition in the same manner as up to the electron transport layer 67.

From the time when the substrate 10 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer P is completed, when the substrate 10 is exposed to an atmosphere containing moisture and oxygen, a light emitting layer made of an organic EL material is formed. It may be deteriorated by moisture and oxygen. Therefore, in this example, the loading and unloading of the substrate between the film forming apparatus is performed in a vacuum atmosphere or an inert gas atmosphere.

According to the substrate holding unit, the substrate holding member, the substrate holding device, the substrate processing device, the substrate processing method, and the manufacturing method of the electronic device according to the present embodiment, the contact between the substrate and the adhesive member when holding the substrate Since the area is improved and the adhesive performance of the adhesive member can be exhibited, the stability is improved and the substrate can be held well.

100: Board holding device, 120: Board holding unit, 122: Support flange part, 122a: Tilt mechanism, 123: Sticky pad, 300: Electromagnetic coil unit, 360: Electromagnetic coil, 720: Control unit

Claims (14)

A board holding unit for holding a board on a holding surface.
An adhesive member having an adhesive surface provided with an adhesive material that adheres to the substrate, and an adhesive member.
A coil spring connected to the adhesive member and
It has a shaft portion that is inserted into the inner peripheral side of the coil spring and is connected to the adhesive member.
The adhesive member is attached to the substrate via the coil spring so that the adhesive surface of the adhesive member can tilt and move forward and backward with respect to the holding surface.
The adhesive member is composed of a bottom portion having an opening larger than the diameter of the shaft portion and a cylindrical wall portion having the adhesive surface at the upper portion.
A bolt larger than the diameter of the opening is attached to one end of the shaft portion.
The shaft portion is connected to the adhesive member by inserting the opening.
A board holding unit characterized by that. The substrate holding unit according to claim 1, wherein the adhesive member is fixed to the shaft portion. The substrate holding unit according to claim 1, wherein the adhesive member is tiltably connected to the shaft portion. The invention according to any one of claims 1 to 3 , wherein the coil spring projects the adhesive surface from the holding surface by urging the adhesive surface of the adhesive member toward the substrate side. Board holding unit. The substrate holding unit according to any one of claims 1 to 4 , wherein the shaft portion has a magnet attached to one end opposite to the adhesive member. A substrate holding member having the substrate having the holding surface and a plurality of substrate holding units.
Each of the plurality of substrate holding units is the substrate holding unit according to any one of claims 1 to 5 .
A substrate holding member, characterized in that the adhesive surface of each of the plurality of substrate holding units adheres to the substrate to hold the substrate. A board holding device that holds a board against a board holding member.
The substrate holding member is
It has a substrate having a holding surface for holding the substrate and a plurality of substrate holding units.
Each of the plurality of substrate holding units of the substrate holding member
Shaft and
An adhesive member having an adhesive surface connected to the first end of the shaft portion and provided with an adhesive material that adheres to the substrate.
A stopper portion connected to a second end opposite to the first end of the shaft portion, and a stopper portion.
It has an elastic member connected to the adhesive member, and has.
The substrate of the substrate holding member has a holding portion provided with an opening.
In the substrate holding member, the shaft portion is inserted into the opening of the holding portion so that the adhesive member and the stopper portion are arranged at positions sandwiching the holding portion.
In the substrate holding member, each of the plurality of substrate holding units is attached to the substrate so that the adhesive surface of the adhesive member can tilt and move forward and backward with respect to the holding surface.
The board holding device is
A substrate moving means for moving the substrate between a first position where the substrate does not abut on the holding surface and a second position where the substrate abuts on the holding surface.
When the substrate is in the first position, the adhesive surface is moved to a position away from the substrate from the holding surface, and the substrate moving means moves the substrate to the second position and then the adhesive surface. It has an adhesive member moving means for bringing a surface into contact with the substrate, and has.
The adhesive member moving means of the substrate holding device has an electromagnetic coil for moving the adhesive surface by electromagnetic force.
A board holding device characterized by that. The substrate holding device according to claim 7 , wherein each of the plurality of substrate holding units is attached to the holding portion via an elastic member connected to the adhesive member. The substrate holding device according to claim 8 , wherein the elastic member urges the adhesive member toward the substrate so that the adhesive surface of the adhesive member projects from the holding surface. The substrate holding device according to any one of claims 7 to 9 , wherein the diameter of the stopper portion is larger than the diameter of the opening. The substrate holding device according to any one of claims 7 to 10, wherein the adhesive member moving means moves the adhesive surface without contacting the substrate holding unit. The substrate holding apparatus according to any one of claims 7 to 11 , further comprising a reversing means for reversing the substrate holding member holding the substrate. The substrate holding device according to any one of claims 7 to 12 , and the substrate holding device.
A substrate processing apparatus comprising: a film forming apparatus for forming a film on a substrate held by the substrate holding member by the substrate holding apparatus. A method for manufacturing an electronic device, wherein the electronic device is manufactured by processing the substrate by the substrate processing apparatus according to claim 13 .

Images