KR20210052257A - Substrate holding unit, substrate holding member, substrate holding apparatus, substrate processing apparatus, substrate processing method, and manufacturing method of electronic device - Google Patents

Abstract

The present invention is to provide a technique for better holding a substrate using an adhesive member. A substrate holding apparatus has a plurality of substrate holding units for holding a substrate on a holding surface. Each of the plurality of substrate holding units comprises: an adhesive member having an adhesive surface on which an adhesive material bonded to the substrate is formed; a tilting mechanism for tilting the adhesive surface of the adhesive member with respect to the holding surface; and an advancing/retracting mechanism that enables advancing and retreating of the adhesive surface of the adhesive member with respect to the holding surface.

Description

Substrate holding unit, substrate holding member, substrate holding device, substrate processing device, substrate processing method, and manufacturing method of electronic device {SUBSTRATE HOLDING UNIT, SUBSTRATE HOLDING MEMBER, SUBSTRATE HOLDING APPARATUS, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE}

The present invention relates to a substrate holding unit, a substrate holding member, a substrate holding apparatus, a substrate processing apparatus, a substrate processing method, and a manufacturing method of an electronic device.

In various fields such as industrial and consumer use, display devices that display images on a display panel are widely used. Examples of the display device include an organic EL device including an organic EL element using electroluminescence of an organic material, a liquid crystal display device, and the like. In manufacturing such a display device, in a film forming apparatus, a film forming material (metal electrode material, organic material, etc.) is adhered on a substrate to perform film formation. At the time of carrying in/out of the substrate into the film formation chamber or during the film formation process, the substrate held by the holding mechanism may be moved or reversed by the transfer mechanism. Therefore, it is necessary to stably hold the substrate so that position shift or the like does not occur.

As a mechanism for holding a substrate during transport or film formation, there are methods of holding a substrate using an adhesive material in addition to methods such as pinching by a clamp, placing on a receiving finger, and adsorption by an electrostatic chuck. Physical adhesion using an adhesive material is also called PSC (Physical Sticky Chuck), and can be preferably used for a large glass substrate or the like.

In Patent Document 1, a glass substrate is held by an adhesive member (adhesive pad) provided on a holding plate, and the glass substrate holding the adhesive is conveyed and inverted as the holding plate, and the glass is adhered and held on the holding plate. The configuration for processing the substrate is described.

Patent Document 1: Japanese Patent Laid-Open No. 2013-55093

However, in the case of holding a substrate using an adhesive member, there is a demand for a method of holding the substrate better.

The present invention has been made in view of such a problem, and an object thereof is to provide a technique for better holding a substrate by using an adhesive member.

The present invention adopts the following configuration. In other words,

A substrate holding device having a plurality of substrate holding units for holding a substrate on a holding surface, comprising:

Each of the plurality of substrate holding units includes an adhesive member having an adhesive surface on which an adhesive material adhering to the substrate is formed, and a tilt motion that enables the adhesive surface of the adhesive member to tilt with respect to the holding surface. A substrate holding device comprising: a mechanism; and an advancing and retreating mechanism for advancing and retreating the adhesive surface of the adhesive member with respect to the holding surface.

The present invention also adopts the following configuration. In other words,

As a substrate holding unit for holding a substrate on the holding surface,

An adhesive member having an adhesive surface on which an adhesive material adhered to the substrate is formed,

A substrate holding unit comprising a pressing means for pressing the adhesive member toward the substrate in a state in which the adhesive member is able to swing.

According to the present invention, it is possible to provide a technique for better holding a substrate by using an adhesive member.

1 is a diagram showing a schematic configuration of a substrate holding device according to a first embodiment.
2 is a cross-sectional view showing the advance and retreat operation of the substrate holding unit according to the first embodiment.
3 is a cross-sectional view showing a tilting operation of the substrate holding unit according to the first embodiment.
4 is a cross-sectional view showing a tilting operation of the substrate holding unit according to the first embodiment.
5A is a view for explaining an operation flow of the substrate holding unit according to the first embodiment.
5B is another diagram for explaining an operation flow of the substrate holding unit according to the first embodiment.
5C is another diagram explaining the operation flow of the substrate holding unit according to the first embodiment.
6 is a diagram illustrating the operation of the inversion device according to the first embodiment.
7 is an operation explanatory diagram of the film forming apparatus according to the first embodiment.
8 is an operation explanatory diagram of the substrate peeling apparatus according to the first embodiment.
9 is a cross-sectional view showing the advance and retreat operation of the substrate holding unit according to the second embodiment.
10 is a cross-sectional view showing a tilting operation of the substrate holding unit according to the second embodiment.
11 is a plan view showing an electronic device manufacturing apparatus according to the third embodiment.
12 is a diagram illustrating an electronic device according to the fourth embodiment.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention and are not intended to limit the scope of the present invention to these configurations. In the following description, the hardware configuration and software configuration of the device, the processing flow, manufacturing conditions, dimensions, materials, shapes, the number and placement positions of each member, etc., are the scope of the present invention unless otherwise specified. It is not intended to be limited to these only.

The present invention relates to a substrate holding apparatus and a substrate holding method for holding a substrate, a film forming apparatus and a film forming method using the same, or a substrate processing apparatus and a substrate processing method, an electronic device manufacturing apparatus and an electronic device using the deposited substrate. It can be preferably applied to a manufacturing method or the like. The film-forming method does not depend on a method such as vapor deposition or sputtering, and does not depend on the type of film-forming material or evaporation material. The present invention is also conceived as a program for causing a computer to execute a substrate holding method or a film forming method, or a storage medium storing the program. The storage medium may be a non-transitory storage medium readable by a computer.

The present invention can be preferably applied to an apparatus for cleaning a substrate or forming a thin film (material layer) of a desired pattern on the surface of the substrate or on a film of another material formed on the surface of the substrate. As the material of the substrate, any material such as glass, resin, metal, and silicon can be selected. As the film forming material, an arbitrary material such as an organic material and an inorganic material (metal, metal oxide, etc.) can be selected. The technology of the present invention can be applied to, for example, an apparatus for manufacturing an electronic device or an optical member, and in particular, an organic electronic device (e.g., an organic EL device using an organic EL element, a thin film solar cell, an organic CMOS image sensor) ), etc., can be applied to manufacturing equipment.

In addition to film forming applications, the present invention can also be applied to devices having a process of holding a substrate by an adhesive member, for example, a display manufacturing device or a processing device, and in particular, a device or a substrate in which a large substrate is a processing target. It can be suitably applied to an apparatus with a process of inverting.

<Review>

According to the review of the inventors of the present application, in order to stably hold a substrate using an adhesive member installed in a planar shape by a substrate holding device, the adhesive holding is performed while the substrate and the adhesive surface on which the adhesive member is installed are parallel. I knew it was important to do. For example, in the case of using an adhesive pad in which an adhesive material is formed in a planar shape, the larger the contact area between the adhesive material and the substrate, the greater the adhesive force. On the other hand, when the degree of parallelism between the adhesive surface and the substrate decreases, there is a concern that the contact area decreases and the holding power decreases.

In addition, especially for large-sized substrates, the substrate tends to become wavy or sag, and if a plurality of adhesive pads are brought into contact with the substrate collectively in such a state, the holding power may vary for each portion of the substrate. . That is, even if a certain adhesive pad can be brought into parallel contact with the substrate, due to the influence of sagging or undulations of the substrate, other adhesive pads may be inclined with respect to the substrate in some cases. If the pressure-sensitive adhesive pad and the substrate are not parallel and inclined, as described above, sufficient holding power cannot be exhibited, and there is a fear that it may interfere with stable holding of the substrate.

Accordingly, as a result of a thorough study by the inventors of the present application, when the substrate is held by a substrate holding device having an adhesive surface such as an adhesive pad, the adhesive pad can move forward and backward relative to the substrate, so that the adhesive pad can be applied to the substrate. It was found that the parallelism between the adhesive surface of the adhesive pad and the substrate was improved by making it conform to the inclination, leading to the creation of the present invention. Hereinafter, an embodiment of the present invention will be described.

[Embodiment 1]

With reference to the drawings, the configuration of the substrate holding device of the present embodiment will be described. 1 is a view for explaining an internal configuration of a substrate holding device, in which (a) of FIG. 1 is a plan view of a substrate holding member, and (b) of FIG. 1 is a side cross-sectional view of the substrate holding device.

<Substrate holding member>

The substrate holding member 100 is provided with a substrate having a surface (hereinafter referred to as holding surface 110X) that holds the substrate 10. In this embodiment, the base body includes a plate-shaped member 110 in which the holding surface 110X is formed in a plane, and a frame 115 supporting the plate-shaped member 110. The plate-shaped member 110 has a plurality of through holes 111 for protruding and protruding from the holding surface 110X of the plate-shaped member 110 with a pin 240 for moving the substrate 10 up and down. Installed. Further, the substrate holding member 100 includes a plurality of substrate holding units (adhesive units) 120 for holding the substrate 10 using adhesive force. The configuration and function of the substrate holding unit 120 will be described later. In addition, a plurality of through holes 112 are provided in the plate-shaped member 110 so as to be able to move the constituent members (adhesive pads 123 and the like) of the substrate holding unit 120. As described later, by driving the adhesive pad 123 by the adhesive member driving mechanism, the adhesive pad 123 is protruded or immersed from the holding surface 110X through the through hole 112, or the adhesive pad 123 It is possible to make the adhesive surface of the holding surface (110X) and the state of one surface (same surface).

Further, the substrate holding member 100 includes a plurality of fasteners 130 for fixing the periphery of the substrate 10 to the flat plate member 110. Further, in the present embodiment, the case of a clamp is shown as an example of the fixture 130, but the fixture is not limited to a clamp, and various known techniques can be employed. In addition, the shape and dimensions of the plate-like member 110 are appropriately set according to the size of the substrate 10 and the film-forming region on the substrate 10. The number and arrangement of the through holes 111, the substrate holding unit 120, and the fixture 130 are also appropriately set according to the size of the substrate 10 and the film-forming region on the substrate 10. In addition, in the present embodiment, an example in which the base body is composed of the flat member 110 and the frame 115 will be described, but the present invention is not limited thereto. That is, it is sufficient that the base body includes at least one of the flat member 110 and the frame 115. Alternatively, the base body may be formed of any other member as long as it has a planar holding surface 110X.

<Substrate holding device>

As shown in FIG. 1B, the substrate holding member 100 has a substrate holding chamber R1 (first chamber). The inside of the substrate holding chamber R1 is typically maintained in a vacuum atmosphere, and has an opening for carrying the substrate 10 or mask in and out. In addition, vacuum in this specification means the state of a space filled with gas of a pressure lower than normal atmospheric pressure (1013 hPa). In addition, the substrate holding device includes a pin unit 200 (substrate moving mechanism) for vertically moving the substrate 10, an electromagnetic coil unit 300 having an electromagnetic coil 360 (adhesive member driving mechanism), A support base 400 for supporting (fixing) the substrate holding member 100 is provided. In a state in which the substrate holding member 100 is supported on the support base 400, the holding surface 110X in the substrate holding member 100 (flat plate-shaped member 110) is configured to be parallel to the horizontal plane. have.

The substrate holding chamber R1 is divided into a substrate processing region A1 and a driving source arrangement region A2. A substrate holding member 100 or the like is disposed in the substrate processing region A1. The motor 210 in the pin unit 200, the motor 310 in the electromagnetic coil unit 300, and the like are arranged in the drive source arrangement region A2. With this configuration, foreign matter generated by the rotation of the motors 210 and 310 or foreign matter generated in the sliding portion of the ball screw mechanism part is suppressed from entering the substrate processing region A1. can do. The pin 240 and the pin unit 200 may be included as a substrate moving mechanism.

In addition, in the present embodiment, the configuration in which both of the two regions A1 and A2 are disposed in the vacuum atmosphere of the substrate holding chamber R1 has been described, but is not limited thereto. For example, only the substrate processing region A1 may be arranged in the vacuum atmosphere of the substrate holding chamber R1, and the driving source arrangement region A2 may be arranged in an atmospheric atmosphere. By doing in this way, the effect of suppressing the invasion of the above-described foreign material into the substrate processing region A1 can be further enhanced.

Each unit included in the substrate holding member 100 is controlled and operated by receiving a control signal from the controller 720 while being supplied with power from the power source 710. Any known power supply device can be used as the power supply 710. As the control unit 720, for example, an information processing device such as a PC or a workstation, which is provided with computational resources such as a processor or memory, and operates according to a program, can be used.

The substrate holding member 100 includes a pin unit 200 for vertically moving the substrate 10 by the pin 240 described above, an electronic coil unit 300 for vertically moving the electromagnetic coil 360, and , A support base 400 for supporting (fixing) the substrate holding member 100 is provided. The support base 400 is capable of supporting the substrate holding member 100 so that the holding surface 110X constituted by the flat member 110 is substantially horizontal.

The pin unit 200 includes a motor 210, a screw shaft 220 rotated by the motor 210, and a nut that moves up and down along the screw shaft 220 according to the rotational motion of the screw shaft 220 A portion 230 and a pin 240 that is fixed to the nut portion 230 and moves up and down together with the nut portion 230 are provided. Further, between the inner peripheral surface of the nut portion 230 and the outer peripheral surface of the screw shaft 220, a plurality of balls are configured to circulate indefinitely. In addition, the configuration in which the pin 240 is moved up and down is not limited to a ball screw mechanism, and other known techniques such as a rack and pinion method can be employed.

Further, in the illustrated example, a drive mechanism such as a motor 210 is provided for each pin 240. With this configuration, the pins can be individually adjusted up and down. However, it is possible to drive the plurality of pins 240 at the same time by one driving mechanism. For example, in the case of employing the ball screw mechanism, a plurality of pins 240 may be provided in one nut part 230.

The electromagnetic coil unit 300 is a motor 310, a screw shaft 320 that is rotated by the motor 310, and moves up and down along the screw shaft 320 according to the rotational motion of the screw shaft 320. A nut part 330, a shaft part 340 fixed to the nut part 330 and moving up and down together with the nut part 330, a support part 350 installed at the tip of the shaft part 340, and a support part 350 It is provided with an electromagnetic coil 360 supported by. Further, between the inner peripheral surface of the nut portion 330 and the outer peripheral surface of the screw shaft 320, a plurality of balls are configured to circulate indefinitely. In addition, the configuration in which the electromagnetic coil 360 is moved up and down is not limited to the ball screw mechanism, and other known techniques such as a rack and pinion method can be employed.

In addition, in the illustrated example, a drive mechanism such as a motor 310 is provided for each of the electromagnetic coils 360. With this configuration, it is possible to individually adjust the vertical movement of the electromagnetic coil. However, it is also possible to adopt a configuration in which a plurality of electromagnetic coils 360 are simultaneously driven by a single driving mechanism. For example, in the case of employing the ball screw mechanism, a plurality of shaft portions 340, support portions 350, and electromagnetic coils 360 may be provided for one nut portion 330.

In addition, the electromagnetic coil 360 is configured such that a current flows by the power source 710 under the control of the control unit 720. The control unit 720 may control the operation of the electronic coil 360 by changing the direction or magnitude of the current flowing through the electronic coil 360.

Here, a plurality of electromagnetic coils 360 are provided to correspond to each of the plurality of substrate holding units 120. Thereby, the electromagnetic coil unit 300 functions as an adhesive member driving mechanism for driving the adhesive pad 123 in each of the substrate holding units 120. That is, the electromagnetic coil unit 300 can advance and retreat the adhesive surface of the adhesive pad 123 with respect to the holding surface by acting in a non-contact manner with respect to the advance and retreat mechanisms each of the substrate holding units 120 have. As a result, even if the distance between the holding surface and the substrate 10 varies from place to place due to the wave shape of the substrate 10, the adhesive pad 123 is moved to a position where it can contact the substrate 10. You can move. In addition, since it acts in a non-contact manner with respect to the advancing and retreating mechanisms of each of the substrate holding units 120 to advance and retreat the adhesive surface of the adhesive pad 123, when contacting and advancing and retreating the adhesive surface of the adhesive pad 123, by sliding or the like. The advancing and retreating of the adhesive surface of the adhesive pad 123 can be realized while suppressing the generation of foreign matter (abrasion powder, etc.) generated.

<Configuration of substrate holding unit>

2 and 3 are schematic cross-sectional views of the substrate holding unit 120, and are cross-sectional views taken along line AA in FIG. 1. Each of the substrate holding units 120 is held by the substrate holding unit holding portion 150 having an L-shaped cross section. The substrate holding unit holding portion 150 includes a fixed portion 151 fixed to the flat member 110 and a holding portion 152 holding the substrate holding unit 120. The holding part 152 is provided with a through hole 153. Further, in this embodiment, an example in which the substrate holding unit holding portion 150 is fixed to the frame 115 is described, but the present invention is not limited thereto, and the substrate holding unit holding portion 150 may be fixed to the base body. .

The substrate holding unit 120 includes a shaft portion 121, a support flange portion 122 fixed to one end of the shaft portion 121, and an adhesive pad 123 fixed to the support flange portion 122. . The adhesive pad 123 is a sheet-like member having an adhesive surface formed of an adhesive material made of a silicone resin, a fluorine resin, a diene resin, or the like. The adhesive pad 123 may be considered an adhesive member of the present invention, or may be considered an adhesive member by combining the support flange portion 122 and the adhesive pad 123. The adhesive pad 123 may have a structure in which an adhesive layer having adhesiveness and a gripping surface (or an adhesive surface) and an adhesive layer for adhering the adhesive layer to the support flange portion 122 are stacked.

The support flange portion 122 is fixed so as to be tiltable to one end side of the shaft portion 121 serving as a rotation shaft. For example, by providing a receiving portion receiving the shaft end portion to the support flange portion 122, the support flange portion 122 can be axially supported so as to be tiltable with respect to the axis in the extending direction of the shaft portion 121. As such a tilt mechanism including the shaft end portion and the bearing portion 122a, a known configuration such as a ball joint structure can be adopted. For example, in FIG. 3 (a), the adhesive surface of the adhesive pad 123 is substantially horizontal along the substrate 10, whereas in FIG. 3 (b), the substrate 10 is in a wavy shape. ), the adhesive surface of the adhesive pad 123 is tilted with respect to the horizontal surface so as to follow the substrate 10.

Further, in the present embodiment, the support flange portion 122 is tiltably fixed to one end side of the shaft portion 121, but is not limited to this, and the support flange portion 122 is the shaft portion 121 by welding fixing or the like. It may be firmly fixed to the. Even in this case, since the support flange portion 122 and the shaft portion 121 that are integrally fixed are supported by an elastic body 128 to be described later, the support flange portion 122 can tilt with respect to the holding surface. That is, when the support flange portion 122 is tilted, the elastic body 128 is bent and the shaft portion 121 is inclined. As a result, as shown in FIG. 4, it can swing within the margin range of the through hole 153 provided in the holding|maintenance part 152. Thereby, the adhesive surface of the adhesive pad 123 can be made to follow the inclination of the substrate 10. That is, the elastic body 128 also functions as a tilt mechanism.

In addition, the substrate holding unit 120, a stopper portion 124 fixed to the shaft portion 121, and a cylinder fixed to the shaft portion 121 in a state in which the shaft portion 121 is inserted and adjacent to the stopper portion 124 A permanent magnet 125 of the shape and a washer 126 and a nut 127 for fixing the permanent magnet 125 to the shaft portion 121 are provided. In addition, a female screw is formed on the other end of the shaft portion 121, and the permanent magnet 125 can be fixed to the shaft portion 121 by fastening the nut 127 to the female screw. The stopper portion 124 is fixed to the other end side of the both ends of the shaft portion 121 opposite to the one end side on which the adhesive pad is disposed, by screwing or welding or the like.

In the state where the nut 127 is fastened, the shaft portion 121, the support flange portion 122, the adhesive pad 123, the stopper portion 124, the permanent magnet 125, the washer 126, and The nut 127 is in an integrated state, and constitutes an integrated shaft portion 121 and the like. In addition, the cylindrical permanent magnet 125 is configured such that magnetic poles are different at one end side and the other end side in the axial direction. In the illustrated example, the side on which the adhesive pad 123 is provided is the N-pole, and the opposite side is the S-pole, but may be arranged in the reverse direction.

In addition, the substrate holding unit 120 is capable of reciprocating (up-down movement) of the shaft portion 121 and supporting the integrated shaft portion 121 and the like in a state in which the shaft portion 121 is swingable. It is provided with an elastic body (128) for. In the illustrated example, a metal spring (coil spring) is used as the elastic body 128. However, for the elastic body, an appropriate configuration such as a metal leaf spring or a cylindrical member made of an elastomer material can be adopted. However, when the substrate holding member 100 is used in a vacuum, it is preferable to use a metallic elastic member as the elastic body 128 from the viewpoint of reducing degassing from the constituent material.

An adhesive pad 123 or the like is disposed on the side of the holding surface 110X with the holding portion 152 interposed therebetween, and the shaft portion 121 in the through hole 153 so that the stopper portion 124 or the like is disposed on the opposite side thereof. With the inserted state, the substrate holding unit 120 is held by the substrate holding unit holding portion 150. At this time, one end of the elastic body 128 is fixed to the support flange portion 122, and the other end is installed in a state fixed to the holding portion 152. Further, a gap is provided between the inner circumferential surface of the elastic body 128 and the outer circumferential surface of the shaft portion 121 so that the elastic body 128 and the shaft portion 121 do not come into contact with each other. In addition, the stopper portion 124 is set to have a larger diameter than the through hole 153 to prevent the integrated shaft portion 121 and the like from falling out of the through hole 153. As described above, in the substrate holding unit 120, only the other end of the elastic body 128 is fixed to the holding portion 152, and the other member constituting the substrate holding unit 120 is the substrate holding unit ( It is constructed so as not to contact constituent members other than 120). By constituting in this way, generation of foreign matter (particle) due to contact wear can be suppressed. In addition, in this embodiment, the stopper portion 124 is disposed adjacent to the permanent magnet 125, has a function of positioning and fixing in the axial direction of the shaft portion 121 of the permanent magnet 125, and the holding portion 152 ) Has both functions (mechanical stopper function) of preventing the integrated shaft portion 121 or the like from falling out of the through hole 153 by colliding with it, but is not limited to this configuration. That is, apart from the stopper portion 124 having a mechanical stopper function, a member having a positioning and fixing function of the permanent magnet 125 may be provided.

The adhesive pad 123 can change the position between the advanced state shown in FIG. 2(a) and the retracted state shown in FIG. 2(b). That is, when the holding surface 110X is parallel to the horizontal plane and facing upward in the vertical direction, and only its own weight is acting on the substrate holding unit 120, the adhesive pad 123 is held It protrudes slightly upwards in the vertical direction than the support surface 110X. In this advanced state, the integrated shaft portion 121 or the like is supported only by the elastic body 128. Thereby, the integrated shaft portion 121 and the like are allowed to reciprocate (up-down movement) so that the adhesive surface of the adhesive pad 123 can advance and retreat with respect to the holding surface 110X. Therefore, the adhesive pad 123 can advance and retreat from the holding surface 110X. In addition, when the adhesive surface of the adhesive pad 123 is tilted, the spring constituting the elastic body 128 is deformed as shown in Fig. 3B, so that the pressure can be absorbed. Further, in the present embodiment, an example in which the adhesive pad 123 protrudes slightly from the holding surface 110X in the above-described state is described, but the present invention is not limited thereto, and in the above-described state, the adhesive pad ( 123) may be located on the same plane as the holding surface 110X.

Here, under the control of the controller 720, the power source 710 passes current through the electromagnetic coil 360, thereby generating an electromagnetic force that attracts the permanent magnet 125 into the electromagnetic coil 360. Thereby, against the elastic repulsion force (spring force of the spring) of the elastic body 128 in the substrate holding unit 120, the integrated shaft portion 121 and the like move downward in the vertical direction. Thereby, as shown in FIG. 2(b), the adhesive pad 123 moves vertically downward from the holding surface 110X. On the other hand, although it is assumed here that the substrate holding unit 120 has the permanent magnet 125, the present invention is not limited to this, and a magnetic member made of a magnetic material may be used without being a permanent magnet. It is preferable to use a ferromagnetic material or a diamagnetic material as the magnetic material. Thereby, by external magnetic force such as an electromagnetic force generated by the electromagnetic coil 360, the integrated shaft portion 121 or the like can be moved downward or upward in the vertical direction.

<Substrate holding process>

Referring to FIGS. 5A to 5C, a state in which the substrate holding unit 120 as illustrated in FIG. 4 of the present embodiment adheres to the substrate 10 will be described.

5A shows a state in which the pin 240 holds the substrate 10 above the holding surface 110X. That is, before the substrate 10 is carried into the substrate holding chamber R1, the pin unit 200 has a surface formed at one end of each of the plurality of pins 240 above the holding surface 110X in the Z direction. Control to come to. Further, the control unit 720 controls energization of the electromagnetic coil 360 by the power source 710 to place the adhesive pad 123 of the substrate holding unit 120 in a retracted state. Then, by carrying the substrate 10 into the substrate holding chamber R1 in that state, it is brought into the illustrated state. In the illustrated state, the height of the substrate 10 is above the holding surface 110X, and both do not abut. The height of the substrate at this time is taken as the first height.

In FIG. 5B, the pin unit 200 moves the plurality of pins 240 downward. Thereby, the substrate 10 comes into contact with the holding surface 110X. The height of the substrate at this time is taken as the second height. However, in the illustrated example, since the substrate 10 has a wavy shape, a part of the substrate 10 does not contact the holding surface 110X, and the angle of the substrate 10 is also partially relative to the horizontal plane. It is in a state which is inclined and is not parallel to the holding surface 110X1.

In addition, when a side deposition method is used instead of a deposition up method, for example, the substrate 10 moves in a lateral direction rather than an elevating operation. In that case, the substrate 10 is moved between a first position not in contact with the holding surface and a second position in contact with the holding surface by the substrate moving mechanism. At this time, when the substrate is in the first position, the substrate holding unit retreats the adhesive surface to a position further from the substrate than the holding surface. Then, after the substrate moving mechanism moves the substrate to a first position not in contact with the holding surface, the adhesive surface is advanced to the holding surface, and the substrate and the adhesive surface are brought into contact with each other.

In FIG. 5C, the control unit 720 controls the energization of the electronic coil 360 by the power source 710, and advances the adhesive pad 123 of the substrate holding unit 120 to be slightly more than the holding surface 110X. Make it protruding. The adhesive pad 123 comes into contact with the substrate 10 because it is pressed against the holding surface by the elastic body 128 to the substrate side. At this time, the inclination of the adhesive pad 123 is allowed by the tilting mechanism, and the adhesive surface of the substrate 10 and the adhesive pad 123 abuts in a substantially parallel state. That is, the elastic body 128 also functions as a pressing means for pressing the adhesive surface of the adhesive pad 123 toward the substrate 10. When the elastic body 128 as such a pressing means presses the adhesive pad 123 toward the substrate side in a swingable state, the contact state between the adhesive surface and the substrate is improved.

As shown in Figs. 2 to 5C, in this embodiment, the adhesive pad 123 is capable of moving forward and backward with respect to the holding surface and tiltable. That is, the adhesive pad 123 can be moved forward and backward with respect to the holding surface 110X by the integrated shaft portion 121, and the adhesive pad 123 is pressed against the substrate by the elastic body 128. , Even if the distance from the holding surface 110X is different for each position of the substrate 10 due to the wave shape of the substrate 10, the adhesive pad 123 reaches the height of the substrate 10 Thus, it becomes possible to adhere to the substrate. The shaft portion 121 and the like, the electromagnetic coil unit 300, and the electromagnetic coil 360 can be considered as an advancing and retreating mechanism that enables the adhesive pad 123 to advance and retreat with respect to the holding surface.

Further, by the tilting mechanism, the inclination of the adhesive surface in the adhesive pad 123 with respect to the holding surface 110X (when the surface parallel to the holding surface is an XY plane, an inclination in an arbitrary XY direction) ) Is also permitted. In this way, since the substrate holding unit 120 allows the adhesive pad 123 to tilt (shaking the head), the angle of the substrate 10 is in a horizontal plane due to the substrate 10 becoming a wavy shape. Even when it is inclined to the opposite side, since the degree of parallelism between the adhesive surface of the adhesive pad 123 and the substrate 10 is improved, a decrease in adhesive force is suppressed.

In addition, after the state shown in FIG. 5B, after the pin 240 is further moved downward and the substrate 10 is placed on the substrate, the substrate 10 is pressed from the upper side using a pressing portion (not shown). (10) You may further provide a pressing step of flattening. The substrate 10 can be calibrated so that the substrate 10 is in a more flat state by sandwiching the substrate 10 between the pressing portion (not shown) and the holding surface 110X of the substrate. Then, by advancing the adhesive pad 123 as shown in FIG. 5C, the substrate 10 can be more favorably held. In addition, even if the substrate 10 is calibrated in this way and then held by the adhesive pad 123, as time elapses, the substrate 10 itself or the interior of various films formed on the substrate 10 The substrate 10 may sag or undulate due to stress or the like. Even in this case, according to the present embodiment, the adhesive pad 230 is configured to be tiltable while the adhesive pad 230 is pressed in a direction approaching (or pressed) to the substrate 10 by the elastic body 128 Therefore, the adhesive pad 230 moves in accordance with the tilt or lift of the substrate 10. Therefore, according to this embodiment, the substrate 10 can be stably held over a long period of time.

On the other hand, in this embodiment, the substrate 10 is held by the substrate holding member 100 in a state in which the holding surface 110X of the substrate holding member 100 is parallel to the horizontal plane and is arranged to face upward in the vertical direction. Although it was supposed to be made, the present invention is not limited to this. For example, in a state in which the holding surface 110X of the substrate holding member 100 is disposed so as to be orthogonal to the horizontal plane, that is, the state that the holding surface 110X is arranged facing the horizontal direction, the substrate holding member You may make it hold the board|substrate 10 by 100. In this case, as a substrate moving mechanism, the substrate 10 is supported with the main surface (film formation surface) of the substrate 10 facing the horizontal direction, and the substrate 10 is held in that state of the substrate holding member 100. A mechanism capable of approaching or moving away from the holding surface 110X may be used. As such a substrate moving mechanism, a conventionally known mechanism may be employed. For example, a clamp portion for clamping the upper and lower sides of the substrate 10 with the main surface facing the horizontal direction, and a clamp portion for moving the clamp portion in the horizontal direction. Actuators can be used. Alternatively, an electrostatic chuck that electrostatically adsorbs a surface on the opposite side of the film-forming surface of the substrate 10 with the main surface facing the horizontal direction, and an actuator that moves the electrostatic chuck in the horizontal direction may be used.

In addition, in the present embodiment, the pin 240 and the pin unit 200 including the actuator are used as the substrate moving mechanism, but it is as described above that the present invention is not limited thereto. As the substrate moving mechanism, in addition to the above-described examples, one or more support portions (receiving fingers) supporting the peripheral portion of the substrate 10 arranged in a state in which the main surface (film formation surface) is parallel to the horizontal surface, and the support portion moving You can also use an actuator. In this case, the substrate of the substrate holding member 100 is provided with a cutout portion or the like at a position corresponding to each of one or a plurality of support portions, and the support surface and the substrate holding member 100 are held by the support portion. It is desirable to be able to position the support surface 110X in the same plane shape.

As described above, the substrate holding process is ended, and the substrate holding member 100 holding the substrate 10 is carried out from the substrate holding chamber R1.

<Other processes>

<<reverse process>>

6A and 6B show cross-sections of the overall schematic configuration of the reversing device. The inversion device is provided with the inversion chamber R2. The inside of the inversion chamber R2 is configured to be in a vacuum atmosphere. The reversing device includes a holding member 610 that holds the substrate holding member 100, a rotation shaft 620 fixed to the holding member 610, a motor 630 that rotates the rotation shaft 620, and , It is provided with a support member 640 for supporting the axis of the rotation shaft 620.

After the substrate holding member 100 holding the substrate 10 is taken out from the substrate holding chamber R1, it is sent to a reversing device (reversing chamber R2). Then, the substrate holding member 100 carried into the inversion chamber R2 is held by the holding member 610 (see Fig. 6A). Then, by the motor 630, the substrate holding member 100 is inverted (rotated by 180°). Thereby, the substrate 10 is brought into a state facing downward in the vertical direction with respect to the substrate holding member 100. 6B shows the state after reversal. According to this embodiment, since the adhesive surface of the adhesive pad 123 and the substrate 10 are in substantially parallel contact, the substrate 10 can be held without lowering the adhesive force. It is also preferable to fix the substrate to the substrate holding member 100 by a clamping operation using the fixture 130 before the reversing operation. In a state in which the substrate holding member 100 is inverted, the stopper portion 124 is brought into a state in which the stopper portion 124 hits the holding portion 152 of the substrate holding unit holding member 150. Thereby, the substrate 10 is in a state held by the plurality of substrate holding units 120 while maintaining a parallel state.

As described above, the inversion process is ended, and the substrate holding member 100 holding the substrate 10 is carried out from the inversion chamber R2.

<<mask holding process>>

After the substrate holding member 100 holding the substrate 10 is taken out from the inversion chamber R2, it is sent to an alignment device (alignment chamber). In the alignment chamber, the mask 20 is held on the substrate 10 in a state in which the substrate 10 is aligned (aligned). Further, as a method of holding the mask 20, magnetic force by a permanent magnet, an electromagnet, or a zero electromagnet may be used, or a mechanical holding means such as a clamp may be employed. Of course, these can also be used together. As for the apparatus for holding the mask 20 in the state of being aligned with the substrate 10, since various known techniques may be applied, the description thereof will be omitted.

As described above, the mask holding process is finished, and the substrate holding member 100 holding the substrate 10 and the mask 20 is carried out from the alignment chamber.

<<film forming process>>

7 is a cross-sectional view of an overall schematic configuration of a film forming apparatus (a vapor deposition apparatus in this embodiment). The film forming apparatus is provided with a film forming chamber (second chamber) R3. The inside of this film formation chamber R3 is comprised so that it may become a vacuum atmosphere. Further, the film forming apparatus is provided with an evaporation source 30 as a film forming source.

The substrate holding member 100 holding the substrate 10 and the mask 20 is taken out from the alignment chamber and then sent to a film forming apparatus (film forming chamber R3). A film formation source for performing film formation is arranged in the film formation chamber R3, and film formation is performed on the substrate 10 held by the substrate holding member 100 through the mask 20. In this embodiment, film formation (deposition) by vacuum evaporation is performed. Specifically, a film-forming material is evaporated or sublimated from the evaporation source 30 as a film-forming source, and the film-forming material is deposited on the substrate 10 to form a thin film on the substrate 10. Since the evaporation source 30 is a known technique, a detailed description thereof will be omitted. For example, the evaporation source 30 can be constituted by a container for accommodating a film forming material such as a crucible, a heating device for heating the container, or the like. Further, the film formation chamber R3 is constituted by a plurality of chambers, and a film formation source for depositing a different film formation material may be disposed in each of the chambers. Then, the substrate holding member 100 holding the substrate 10 is sequentially conveyed in each chamber, so that the film formation using each film forming material may be sequentially performed. In addition, the film formation source is not limited to the evaporation source 30, and the film formation source may be a sputtering cathode for performing film formation by sputtering.

By the above, the film forming process is finished. After that, the mask 20 is removed from the substrate 10. A device or the like for removing the mask 20 from the substrate 10 is a known technique, and its description is omitted. Further, after the mask 20 is removed, the process of forming a film using another film forming material using another mask may be repeated. Then, after all the film formation processes are completed and the mask is removed, a process in which the substrate 10 is peeled from the substrate holding member 100 is performed.

<<substrate peeling process>>

8A and 8B show cross-sections of the overall schematic configuration of the substrate peeling apparatus. The substrate peeling apparatus is provided with the substrate peeling chamber R4. The inside of the substrate peeling chamber R4 is configured to be in a vacuum atmosphere. The substrate peeling device includes a pin unit 200 (substrate moving mechanism) for vertically moving the substrate 10, an electromagnetic coil unit 300 (first adhesive member driving mechanism), and a substrate, similar to the substrate holding device. It is provided with a support (500) for supporting the holding member (100). These configurations themselves are the same as those described above, and the description thereof will be omitted.

In addition, the substrate peeling apparatus moves the support 370 for supporting the electromagnetic coil unit 300 and the support 370 in parallel with the holding surface 110X to hold the electromagnetic coil unit 300 on the holding surface 110X. ) And a drive device 380 (a second adhesive member drive mechanism) capable of being moved in parallel. In addition, for the drive device 380, various known techniques such as a ball screw mechanism and an actuator using a rack-and-pinion method can be applied. Further, in the illustrated example, a plurality of electromagnetic coil units 300 are provided, and the support 370 is configured to support all of the electromagnetic coil units 300.

After the mask is removed, the substrate holding member 100 holding the substrate 10 is carried into the substrate peeling chamber R4. Then, this substrate holding member 100 is supported (fixed) by the support 500. FIG. 8A shows a state in which the substrate holding member 100 is supported by the support 500. Thereafter, by passing a current through the electromagnetic coil 360, an electromagnetic force that draws the permanent magnet 125 into the electromagnetic coil 360 is generated. In this embodiment, since the adhesive force of the adhesive pad 123 is high, the adhesive pad 123 is not peeled off from the substrate 10 only by this electromagnetic force.

In the state in which the electromagnetic force is generated, by moving the support base 370 by the driving device 380, all the electromagnetic coils 360 are simultaneously moved in parallel with the holding surface 110X. Thereby, the permanent magnet 125 in the substrate holding unit 120 is pulled in a direction parallel to the holding surface 110X, and the shaft portion 121 is slightly inclined, so that the adhesive pad 123 is also inclined. , It is in a state peeled off from the substrate 10. Thereafter, against the elastic repulsion force of the elastic body 128, the integrated shaft portion 121 or the like moves downward in the vertical direction by electromagnetic force, so that the adhesive pad 123 is moved away from the substrate 10. In addition, in the present embodiment, a case in which all the electromagnetic coils 360 are simultaneously moved by one support 370 and one driving device 380 is illustrated. However, the present invention is not limited to such a configuration. For example, a plurality of electromagnetic coils 360 may be divided into a plurality of sets, and a support 370 and a driving device 380 may be provided for each set. In this case, for all sets, the electromagnetic coil 360 may be moved at the same time, or the electromagnetic coil 360 may be moved by dividing the timing for each set. One or more electromagnetic coils 360 may be present in each set. In addition, in the case where a plurality of electromagnetic coils 360 exist in each set, a configuration in which a drive mechanism such as a motor 310 is individually provided for one electromagnetic coil 360 may be adopted, and the above As described above, a configuration in which a plurality of electromagnetic coils 360 are simultaneously driven by a single drive mechanism may be employed. Therefore, for each set, a configuration in which only one electromagnetic coil unit 300 (however, a plurality of electromagnetic coils 360 are provided) may be employed. In addition, a configuration in which only one electromagnetic coil unit 300 (however, a plurality of electromagnetic coils 360 are provided) may be adopted in the substrate peeling apparatus.

After the adhesive pad 123 is separated from the substrate 10, the fixing of the substrate 10 by the fixture 130 is released. FIG. 8B shows a state in which the support 370 is moved and the fixing of the substrate 10 by the fixture 130 is released. Moreover, you may control so that it may perform before moving the support base 370 about the release|release operation of the fixation of the board|substrate 10 by the fixture 130. After that, by the motor 210, the pin 240 moves upward in the vertical direction, and the substrate 10 is lifted up by the plurality of pins 240 and separated from the substrate holding member 100. After that, the substrate 10 is carried out from the substrate peeling chamber R4.

In addition, in this embodiment, the substrate 10 is peeled off from the substrate holding member 100 in a state in which the holding surface 110X of the substrate holding member 100 is parallel to the horizontal plane and is arranged to face upward in the vertical direction. Although it was supposed, the present invention is not limited to this. For example, in a state in which the holding surface 110X of the substrate holding member 100 is disposed so as to be orthogonal to the horizontal plane, that is, the state that the holding surface 110X is arranged facing the horizontal direction, the substrate holding member You may make the board|substrate 10 peel from 100. In addition, it goes without saying that as the substrate moving mechanism, as described in the description of the substrate holding step, other conventionally known mechanisms can be used.

[Embodiment 2]

9 and 10, another configuration of the substrate holding member 100 will be described. The same reference numerals are assigned to the same configurations as those of the first embodiment, and the description is omitted.

FIG. 9(a) is an advanced state in which the adhesive surface of the adhesive pad 123 of the substrate holding member 100 of the present embodiment protrudes upward from the holding surface 110X, and FIG. 9(b) Is a retreat state in which the corresponding adhesive surface is retreating downward from the holding surface 110X. The difference from the adhesive pad 123 of the first embodiment will be described. 9C is a plan view of the adhesive pad 123 viewed from the upper direction in the Z direction.

9(a) to 9(c), the support flange part 122 of the present embodiment is configured in a cylindrical container shape having a bottom portion in which a hole through which the shaft portion 121 is inserted is opened in the central portion. And the adhesive material of the adhesive pad 123 is disposed on the upper portion of the wall of the cylindrical container to constitute the adhesive surface. Since the bolt 129 fixes the shaft portion 121 through the insertion hole, the adhesive pad 123 does not come off even when the top and bottom of the substrate holding member 100 is reversed.

In this embodiment as well, the substrate 10 is carried in with the adhesive pad 123 retracted downward from the holding surface 110X, and is supported above the holding surface 110X by the pins 240. Then, the pin 240 is lowered, and the substrate 10 is placed on the holding surface 110X. Thereafter, the electronic coil 360 operates under the control of the controller 720 to move the substrate holding unit 120 upward, so that the adhesive pad 123 contacts the substrate 10.

Fig. 10(a) shows an abutting state when the substrate 10 is placed on the holding surface 110X substantially horizontally. On the other hand, Fig. 10B shows a state in which the substrate 10 is placed in a wave shape with respect to the holding surface 110X at a certain angle. As shown, since the support flange portion 122 pressed by the elastic body 128 is configured to tilt according to the inclination of the substrate 10, the adhesive surface of the adhesive pad 123 and the substrate 10 It can be touched roughly in parallel.

Also in the second embodiment, since the adhesive surface of the adhesive pad 123 can advance and retreat with respect to the holding surface and can be tilted, the contact area between the substrate 10 and the adhesive pad 123 increases, and a decrease in adhesive force can be suppressed. I can.

[Embodiment 3]

In this embodiment, a method of applying the film forming apparatus of each of the above embodiments to an electronic device manufacturing apparatus for manufacturing an organic EL display or the like will be described. 11 is a plan view schematically showing a part of an electronic device manufacturing apparatus 500. The electronic device manufacturing apparatus 500 automatically performs steps from pretreatment of a substrate to film formation and sealing in electronic device manufacturing.

On the other hand, instead of the cluster-type configuration in which a plurality of processing chambers are arranged around the conveyance chamber as shown in the figure, an in-line configuration in which a plurality of processing chambers are arranged in sequence of steps may be employed. In the case of adopting an in-line configuration, a substrate holding device for holding a substrate may be provided on the transfer carrier, and may be moved between the processing chambers. In that case, after holding the board|substrate carried in to the electronic device manufacturing apparatus by the conveyance carrier with the film-forming surface facing upward, after installing it while aligning a mask on the board|substrate, you may turn the conveyance carrier upside-down. Thereby, the substrate with the film-forming surface facing downward is carried into the film-forming chamber for each transport carrier, and film-forming using the film-forming material is performed.

Around the conveyance chamber 510, a pretreatment chamber 511, an organic processing chamber 512, a metal processing chamber 513, and a measurement chamber 514 are arranged radially. On the other hand, Fig. 11 is a simplified diagram, and the type and number of processing chambers are not limited thereto. For example, a processing chamber such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer may be provided, or a processing chamber of a light emitting layer for each color such as R (red), G (green), and B (blue) may be provided. . In the transfer chamber 510, a transfer robot 519 that holds and transfers the substrate 10 is provided. The transfer robot 519 is, for example, a robot having a structure in which a robot hand that holds a substrate is attached to an articulated arm, and carries the substrate into and out of each processing chamber and measurement chamber.

The manufacturing process of the electronic device is schematically as follows. First, the substrate 10 is carried into the pretreatment chamber 511, and pretreatment such as cleaning is performed. After that, the substrate is transported to the organic processing chamber 512 or the metal processing chamber 513 by the conveying robot 519 according to the type of the film forming material. In each processing chamber, a vapor deposition material is adhered to the substrate by vapor deposition or sputtering from an evaporation source to form a film. Subsequently, the substrate 10 is carried into the measurement chamber 514. In the measurement chamber, the film thickness, uniformity of film formation, and the like are measured.

A film forming apparatus is provided in each processing chamber in which a film is formed. A series of processes such as transfer of the substrate to and from the transfer robot, adjustment (alignment) of the relative position of the substrate and the mask, fixing of the substrate onto the mask, and film formation (deposition) are performed automatically by the film forming apparatus. In addition, it is possible to automate the measurement process in the measurement room. Further, as the treatment after the measurement, a sealing treatment with a sealing glass coated with a drying agent or an adhesive may be performed. The completed panel is automatically taken out of the manufacturing apparatus and supplied to the next process (for example, the assembly process of the display panel). However, the above configuration is only an example, and does not limit the configuration of the film forming apparatus of the present invention or the electronic device manufacturing apparatus including the same.

According to the electronic device manufacturing apparatus described above and the electronic device manufacturing method using the same, since the temperature control of the substrate is satisfactorily performed in the film forming apparatus, film formation is satisfactorily performed. As a result, it becomes possible to manufacture an electronic device of good quality.

[Embodiment 4]

<Method of manufacturing organic electronic device>

In this embodiment, an example of a method of manufacturing an organic electronic device using a film forming apparatus provided with an evaporation source device will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device will be exemplified as an example of an organic electronic device. First, an organic EL display device to be manufactured will be described. FIG. 12A is an overall view of the organic EL display device 60, and FIG. 12B shows a cross-sectional structure of one pixel.

As shown in Fig. 12A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix shape. Each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. On the other hand, the pixel referred to herein refers to a minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device of this figure, a pixel 62 is formed by a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B that exhibit different light emission. . The pixel 62 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited if it is at least one color. . Further, each light-emitting element may be configured by stacking a plurality of light-emitting layers.

In addition, the pixel 62 is composed of a plurality of light-emitting elements that exhibit the same light emission, and a color filter in which a plurality of different color conversion elements are arranged in a pattern shape to correspond to each light-emitting element is used, so that one pixel is a display area. In (61), a desired color may be displayed. For example, the pixel 62 may be constituted by at least three white light-emitting elements, and a color filter in which red, green, and blue color conversion elements are arranged to correspond to the respective light-emitting elements may be used. Alternatively, a color filter in which the pixel 62 is composed of at least three blue light-emitting elements and each of red, green, and colorless color conversion elements is arranged to correspond to each light-emitting element may be used. In the latter case, by using a quantum dot color filter (QD-CF) using a quantum dot (QD) material as a material constituting the color filter, the display color gamut is higher than that of a conventional organic EL display device that does not use a quantum dot color filter. Can be made wider.

Fig. 12(b) is a schematic partial cross-sectional view taken along line A-B in Fig. 12(a). On the substrate 10, the pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, a light emitting layer 66R, 66G, 66B, an electron transport layer 67, and , An organic EL element including a second electrode (cathode) 68. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In addition, in this embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. In addition, in the case of using a color filter or a quantum dot color filter as described above, a color filter or a quantum dot color filter is disposed on the light emitting side of each light emitting layer, that is, on the upper or lower portion of FIG. Omit it.

The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements emitting red, green, and blue colors (which may be described as organic EL elements), respectively. In addition, the first electrode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. In addition, in order to prevent the first electrode 64 and the second electrode 68 from being shorted by foreign substances, an insulating layer 69 is provided between the first electrode 64. Furthermore, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer P for protecting the organic EL element from moisture or oxygen is provided.

Next, an example of a method of manufacturing an organic EL display device as an electronic device will be described in detail. First, a substrate 10 on which a circuit (not shown) for driving an organic EL display device and a first electrode 64 are formed is prepared.

Next, on the substrate 10 on which the first electrode 64 is formed, an acrylic resin is formed by spin coating, and the acrylic resin is patterned to form an opening in the portion where the first electrode 64 is formed by a lithography method to insulate. A layer 69 is formed. This opening corresponds to a light-emitting region in which the light-emitting element actually emits light.

Next, the substrate 10 on which the insulating layer 69 is patterned is carried into the first film forming apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is provided with the first electrode 64 in the display area. ) On top of it as a common layer. The hole transport layer 65 is formed by vacuum evaporation. Actually, since the hole transport layer 65 is formed to have a size larger than that of the display area 61, a very fine (high precision) mask is not required. Here, the film formation apparatus used in film formation in this step and the film formation of each of the following layers is the film formation apparatus in any one of the above embodiments.

Next, the substrate 10 formed up to the hole transport layer 65 is carried into the second film forming apparatus, and held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a light emitting layer 66R emitting red is formed on a portion of the substrate 10 in which an element emitting red is disposed. According to this example, the mask and the substrate can be properly stacked, and high-definition film formation can be performed.

Similar to the film formation of the light-emitting layer 66R, the light-emitting layer 66G emitting green is formed by the third film forming device, and further, the light-emitting layer 66B emitting blue color is formed by the fourth film-forming device. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a common layer on the three color light emitting layers 66R, 66G, and 66B. In this embodiment, the electron transport layer 67 and the light emitting layers 66R, 66G, 66B are formed by vacuum evaporation.

The substrate formed up to the electron transport layer 67 is moved to a sputtering device, the second electrode 68 is formed, and then it is moved to a plasma CVD device to form a protective layer P, and the organic EL display device 60 is It is completed. On the other hand, although it is assumed here that the second electrode 68 is formed by sputtering, the present invention is not limited thereto, and the second electrode 68 may also be formed by vacuum evaporation in the same manner as the electron transport layer 67.

After carrying the substrate 10 patterned with the insulating layer 69 into the film forming apparatus until the protective layer P is formed, when exposed to an atmosphere containing moisture or oxygen, the light-emitting layer made of an organic EL material is There is a risk of deterioration due to moisture or oxygen. Therefore, in this example, carrying in/out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

According to the substrate holding unit, the substrate holding member, the substrate holding apparatus, the substrate processing apparatus, the substrate processing method, and the electronic device manufacturing method according to the present embodiment, between the substrate and the adhesive member when holding the substrate Since the contact area of is improved and the adhesive performance by the adhesive member can be exhibited, stability is improved, and it becomes possible to hold the substrate satisfactorily.

100: substrate holding device
120: substrate holding unit
122: support flange portion
122a: tilt mechanism
123: adhesive pad
300: electronic coil unit
360: electronic coil
720: control unit

Claims (21)

As a substrate holding unit for holding a substrate on the holding surface,
An adhesive member having an adhesive surface on which an adhesive material adhered to the substrate is formed,
A tilt mechanism for tilting the adhesive surface of the adhesive member with respect to the holding surface;
A substrate holding unit comprising an advancing and retreating mechanism that enables the adhering surface of the adhesive member to advance and retreat with respect to the holding surface. The method of claim 1,
The substrate holding unit, wherein the advancing and retreating mechanism includes an elastic body for pressing the adhesive surface of the adhesive member toward the substrate. The method according to claim 1 or 2,
The substrate holding unit, characterized in that the advancing and retreating mechanism includes a magnetic member that enables the adhesive surface of the adhesive member to advance and retreat with respect to the holding surface by receiving an external magnetic force. As a substrate holding member having a substrate having a holding surface and a plurality of substrate holding units,
Each of the plurality of substrate holding units is the substrate holding unit according to any one of claims 1 to 3,
A substrate holding member, characterized in that the adhesive surface of each of the plurality of substrate holding units adheres to the substrate to hold the substrate. A substrate holding device for holding a substrate with respect to the substrate holding member according to claim 4, comprising:
A substrate moving mechanism for moving the substrate between a first position not in contact with the holding surface and a second position in which the substrate and the holding surface abut,
The substrate holding unit retracts the adhesive surface to a position further from the substrate than the holding surface when the substrate is in the first position, and after the substrate moving mechanism moves the substrate to the first position A substrate holding device, characterized in that the adhesive surface is advanced to the holding surface, and the adhesive surface is brought into contact with the substrate. The method of claim 5,
An adhesive member driving mechanism for moving the adhesive surface of the adhesive member forward and backward with respect to the holding surface by acting in a non-contact manner with respect to the advancing and retreating mechanisms of each of the plurality of substrate holding units provided by the substrate holding member. A substrate holding device, characterized in that it has. A substrate holding device for holding a substrate with respect to the substrate holding member according to claim 4, comprising:
An adhesive member driving mechanism for moving the adhesive surface of the adhesive member forward and backward with respect to the holding surface by acting in a non-contact manner with respect to the advancing and retreating mechanisms of each of the plurality of substrate holding units provided by the substrate holding member. A substrate holding device, characterized in that it has. The method according to claim 6 or 7,
The advancing and retreating mechanism includes a magnetic member,
The adhesive member driving mechanism is provided with an electromagnetic coil, wherein the adhesive surface is moved forward and backward by applying an electromagnetic force to the magnetic member. The method of claim 8,
A substrate holding apparatus, characterized in that the magnetic member is a permanent magnet. The method according to claim 8 or 9,
The substrate holding device, wherein the advancing and retreating mechanism includes a shaft portion provided with the adhesive member at one end and the magnetic member at the other end. The method of claim 10,
The substrate holding device, wherein the tilt mechanism is formed between the adhesive member and the shaft portion. As a substrate holding unit for holding a substrate on the holding surface,
An adhesive member having an adhesive surface on which an adhesive material adhered to the substrate is formed,
A substrate holding unit comprising: a pressing means for pressing the adhesive member toward the substrate in a state in which the adhesive member is able to swing. The method of claim 12,
A substrate holding unit comprising: a shaft portion provided with the adhesive member at one end and a magnetic member at the other end. As a substrate holding member having a substrate having a holding surface and a plurality of substrate holding units,
Each of the plurality of substrate holding units is the substrate holding unit according to claim 12 or 13,
A substrate holding member, characterized in that the adhesive surface of each of the plurality of substrate holding units adheres to the substrate to hold the substrate. A substrate holding device for holding a substrate with respect to the substrate holding member according to claim 14, comprising:
A substrate moving mechanism for moving the substrate between a first position not in contact with the holding surface and a second position in which the substrate and the holding surface abut,
The substrate holding unit retracts the adhesive surface to a position further from the substrate than the holding surface when the substrate is in the first position, and after the substrate moving mechanism moves the substrate to the first position A substrate holding device, characterized in that the adhesive surface is advanced to the holding surface, and the adhesive surface is brought into contact with the substrate. The method of claim 15,
It has an adhesive member driving mechanism for moving the adhesive surface of the adhesive member forward and backward with respect to the holding surface by acting in a non-contact manner with respect to the advance/retreat mechanism of each of the plurality of substrate holding units provided by the substrate holding member. A substrate holding device, characterized in that. A substrate holding device for holding a substrate with respect to the substrate holding member according to claim 14, comprising:
It has an adhesive member driving mechanism for moving the adhesive surface of the adhesive member forward and backward with respect to the holding surface by acting in a non-contact manner with respect to the advance/retreat mechanism of each of the plurality of substrate holding units provided by the substrate holding member. A substrate holding device, characterized in that. The method of claim 16 or 17,
The advancing and retreating mechanism includes a magnetic member,
The adhesive member driving mechanism is provided with an electromagnetic coil, wherein the adhesive surface is moved forward and backward by applying an electromagnetic force to the magnetic member. The substrate holding device according to any one of claims 5 to 11 and 15 to 18, and
A substrate processing apparatus comprising: a film forming apparatus for forming a film on a substrate held by the substrate holding member by the substrate holding apparatus. A substrate processing method characterized in that the substrate is processed by the substrate processing apparatus according to claim 19. A method for manufacturing an electronic device, comprising the substrate processing apparatus according to claim 19, and manufacturing an electronic device by performing processing on the substrate by the substrate processing apparatus.

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