KR20190070896A - Mask attaching device, film-forming apparatus, film-forming method, and method for manufacturing electronic device - Google Patents

Abstract

According to the present invention, a mask attachment device comprises: an electrostatic chuck plate portion for holding a surface opposite to a film formation surface of a substrate; a load dispatching terminal portion for supplying electric power to the electrostatic chuck plate portion; and a magnetic force applying means having a magnetic force generating portion and applying magnetic force from the magnetic force generating portion to a mask with the substrate and the electrostatic chuck plate portion in between. A region in which the load dispatching terminal portion is projected on a plane including the film formation surface of the substrate does not overlap with a region in which the magnetic force generating portion is projected on a plane including the film formation surface of the substrate.

Description

TECHNICAL FIELD [0001] The present invention relates to a mask attaching apparatus, a film forming apparatus, a film forming method, and a manufacturing method of an electronic device. [0002] Mask attaching device,

More particularly, the present invention relates to a structure of a power supply terminal portion for supplying a voltage to an electrostatic chuck plate portion for holding a substrate by electrostatic attraction in a film forming apparatus.

Recently, an organic EL display device has been spotlighted as a flat panel display device. The organic EL display device is a self-luminous display, and its characteristics such as response speed, viewing angle, and thinness are superior to those of a liquid crystal panel display, and thus various types of portable terminals represented by monitors, televisions, and smart phones are rapidly replacing existing liquid crystal panel displays . In addition, automotive displays are expanding their applications.

The element of the organic EL display device has a basic structure in which an organic material layer causing light emission is formed between two opposing electrodes (cathode electrode, anode electrode). The organic layer and the electrode metal layer of the organic EL display device are manufactured by depositing a deposition material on a substrate through a mask in which a pixel pattern is formed in a vacuum chamber.

In order to transfer the pixel pattern on the mask onto the substrate with high accuracy in this film formation process, the relative position of the mask and the substrate must be adjusted with high precision before the deposition onto the substrate, and the mask must be brought into close contact with the film formation surface of the substrate .

A magnetic plate is used to apply a magnetic force from the top of the substrate to the metal mask at the bottom of the substrate in order to bring the mask into close contact with the film formation surface of the substrate. That is, in the prior art, by bringing the magnet plate into contact with the upper surface of the substrate in a state in which the substrate with the relative position adjusted (aligned) is placed on the upper surface of the mask, the magnetic force applied to the metal mask by the magnet of the magnet plate Close the mask.

Recently, a method of holding the upper surface of the substrate by the electrostatic attraction of the electrostatic chuck has been studied in order to prevent the substrate from sagging due to its own weight. The electrostatic chuck is installed just above the upper surface of the substrate, since the upper surface of the substrate is attracted by electrostatic attraction.

Therefore, in the film-forming apparatus of the structure in which the substrate is held by using the electrostatic chuck and the substrate and the mask are closely contacted by the magnet plate, the electrostatic chuck holds the substrate below the magnet plate. In order to supply power to the electrostatic chuck disposed under the magnet plate, a feed line from the outside of the film forming apparatus is provided so as to reach the electrostatic chuck through the magnet plate and disposed at the lower portion of the magnet plate.

7, a power supply terminal 731 for supplying power to the electrostatic chuck 723 in addition to the magnet 725 is installed in the region where the magnet 725 of the magnet plate 724 is disposed do. Thereby, the power supply terminal 731 is disposed together in the region where the magnet 725 of the magnet plate 724 is disposed, so that a local region in which the magnet 725 is not disposed exists.

As a result, the magnetic force is weakened around the local region where the magnet 725 is not disposed, and the magnetic force to the mask is uneven in the entire region where the magnet 725 of the magnet plate 724 is disposed, And the film forming precision is lowered.

A film forming apparatus having a structure in which a substrate is held by using an electrostatic chuck and a magnetic force application means is used to bring the substrate and the mask into close contact with each other, An apparatus for attaching a mask, a film forming apparatus including the apparatus, a film forming method using the apparatus, and a method of manufacturing an electronic device.

An apparatus for attaching a mask according to a first aspect of the present invention includes an electrostatic chuck plate portion for holding a surface opposite to a deposition surface of a substrate, a power supply terminal portion for supplying electric power to the electrostatic chuck plate portion, And a magnetic force applying means for applying a magnetic force from the magnetic force generating portion to the mask with the substrate and the electrostatic chuck plate portion therebetween, wherein the power supply terminal portion is provided on a plane including the film forming surface of the substrate The projected region does not overlap with the region where the magnetic force generating section is projected on a plane including the film forming surface of the substrate.

An apparatus for attaching a mask according to a second aspect of the present invention includes an electrostatic chuck plate portion for holding a surface opposite to a deposition surface of a substrate, a power supply terminal portion for supplying electric power to the electrostatic chuck plate portion, And a magnetic force applying means for applying a magnetic force from the magnetic force generating portion to the mask with the substrate and the electrostatic chuck plate portion therebetween, wherein the magnetic force from the magnetic force generating portion is applied to the substrate And is provided outside the region where the magnetic force generating portion of the magnetic force applying means is disposed in a state of being applied to the mask with the electrostatic chuck plate portion interposed therebetween.

A film forming apparatus according to a third aspect of the present invention is a film forming apparatus for forming an evaporation material on a substrate through a mask, including a mask attaching apparatus according to the first or second aspect.

A film forming method according to a fourth aspect of the present invention is a film forming method for forming an evaporation material on a substrate through a mask, characterized in that the mask is placed on the film formation side of the substrate by the mask attaching apparatus according to the first or second aspect And depositing an evaporated material evaporated from the evaporation source on the substrate through a mask.

The method for manufacturing an electronic device according to the fifth aspect of the present invention uses the film forming method according to the fourth aspect to manufacture an electronic device.

According to the present invention, by providing the power supply terminal portion of the electrostatic chuck device outside the region in which the magnetic force generating portion of the magnetic force applying means is disposed, the power supply line or the power supply terminal portion for supplying power to the electrostatic chuck plate portion is disposed It is possible to avoid the arrangement area of the magnetic force generating portion of the magnetic force applying means without passing through the region. Accordingly, the magnetic force generating portion is not locally disposed in the region where the magnetic force generating portion of the magnetic force applying means is disposed, due to the penetration of the power feed line or the power supply terminal portion. Therefore, the magnetic force of the magnetic force applying means can be prevented from becoming non- . As a result, the magnetic field pulling the mask by the magnetic force applying means becomes uniform, and the precision of close contact between the mask and the substrate is improved.

1 is a schematic view of a part of a manufacturing line of an organic EL display device.
2 is a schematic view of a film forming apparatus according to the present invention.
3 is a schematic diagram showing a mask attaching apparatus including an electrostatic chucking apparatus according to an embodiment of the present invention.
4 is a schematic view showing a mask attaching apparatus including an electrostatic chucking apparatus according to another embodiment of the present invention.
5 is a schematic diagram showing the planar structure of the electrostatic chuck apparatus of the present invention and the arrangement of the supporting portions of the substrate support.
6 is a schematic view showing an example of an electronic device manufactured using the film forming method according to the present invention.
7 is a schematic view showing a structure of a conventional electrostatic chuck and a magnet plate.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration, the software configuration, the process flow, the manufacturing conditions, the size, the material, the shape, and the like of the apparatus are intended to limit the scope of the present invention unless otherwise specified no.

The present invention can be suitably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation on the surface of a substrate. As the material of the substrate, any material such as glass, a film of a polymer material, or a metal can be selected, and as the evaporation material, an arbitrary material such as an organic material, a metallic material (metal, metal oxide, etc.) can be selected. Specifically, the technique of the present invention is applicable to an organic electronic device (for example, an organic EL display, a thin film solar cell), an optical member, and the like. In particular, the apparatus for manufacturing an organic EL display device is one of preferred applications of the present invention because it is required to further improve the alignment precision of the substrate and the mask and the close contact accuracy in accordance with the enlargement of the substrate or the high definition of the display panel.

<Electronic Device Manufacturing Line>

1 is a plan view schematically showing a part of the configuration of a manufacturing line of an electronic device. The manufacturing line of Fig. 1 is used, for example, in manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smart phone, after the organic EL is formed on a substrate having a size of, for example, about 1800 mm x about 1500 mm, the substrate is diced to produce a plurality of small-sized panels.

The manufacturing line of the electronic device generally includes a plurality of film forming chambers 11 and 12 and a transport chamber 13 as shown in Fig. In the transfer chamber 13, a transfer robot 14 for holding and transferring the substrate 10 is provided. The carrying robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate 10 is mounted on a multi-joint arm, and performs carrying in / out of the substrate 10 into each of the film forming chambers.

Each of the deposition chambers 11 and 12 is provided with a deposition apparatus (also referred to as a deposition apparatus). A series of film formation processes such as the transfer of the substrate 10 to the transfer robot 14, the alignment of the relative position of the substrate 10 and the mask, the fixing of the substrate 10 onto the mask, Is automatically performed by the film forming apparatus.

Hereinafter, the structure of the film forming apparatus of the film forming chamber will be described.

&Lt;

2 is a cross-sectional view schematically showing the structure of the film forming apparatus 2. As shown in Fig. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. Assuming that the substrate 10 is fixed parallel to the horizontal plane (XY plane) at the time of film formation, the direction parallel to the short side of the substrate 10 is defined as X direction, and the direction parallel to the long side is defined as Y direction. Also, the rotation angle around the Z axis is denoted by?.

The film forming apparatus 2 has a vacuum chamber 20 defining a space in which a film forming process is performed. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

An upper part of the film forming apparatus 2 in the vacuum chamber 20 is provided with a substrate supporting table 21 for supporting the substrate, a mask table 22 on which the mask is placed, an electrostatic chuck apparatus 23 for holding the substrate by electrostatic attraction, A magnetic force applying means 24 for applying a magnetic force to a metal mask, and the like. An evaporation source 25 and the like for accommodating the evaporation material are provided in a lower portion of the vacuum chamber 20 of the film forming apparatus.

The substrate 10 transported into the vacuum chamber 20 by the transport robot 14 of the transport chamber 13 is mounted on the substrate support 21. The substrate support 21 may be fixed to the vacuum chamber 20 or be vertically movable. The substrate support 21 includes supports 211, 212 that support the periphery of the lower surface of the substrate.

A frame-shaped mask table 22 is provided below the substrate support 21 and a mask 221 having an opening pattern corresponding to the thin film pattern to be formed on the substrate 10 is placed on the mask table 22 . Particularly, a mask used for manufacturing an organic EL device for a smart phone is also called a fine metal mask (FMM) as a metal mask having a fine opening pattern.

An electrostatic chucking device 23 for holding and fixing the substrate by electrostatic attraction is provided above the supporting portions 211 and 212 of the substrate supporting table 21. The electrostatic chucking device 23 has, for example, a structure in which an electric circuit such as a metal electrode is buried in a dielectric (e.g., a ceramic material) matrix. When positive (+) and negative (-) voltages are applied to the metal electrode, a polarized charge having a polarity opposite to that of the metal electrode is induced on the substrate through the dielectric matrix, As shown in Fig. The electrostatic chucking device 23 may be formed of a single plate or a plurality of sub-plates. Further, even in the case of a single plate, it is possible to include a plurality of electric circuits in the plate and to control the electrostatic attraction differently according to the position in one plate.

A magnetic force applying means 24 for applying a magnetic force to the metal mask 221 to prevent sagging of the mask and bringing the mask 221 into close contact with the substrate 10 is provided on the electrostatic chuck device 23. The magnetic force applying means 24 includes a plurality of magnetic force generating portions 241 such as permanent magnets or electromagnets.

3, the electrostatic chucking device 23 includes a power supply terminal portion 32 to which a power supply line for supplying power to the electrostatic chuck plate portion 31 is connected to a magnetic force applying means (not shown) 24) of the magnetic force generating portion (241). Thus, the feed line to the power supply terminal portion 32 of the electrostatic chucking device 23 does not pass through the arrangement region of the magnetic force generating portion 241 of the magnetic force applying means 24. [

Although not shown in FIG. 2, a cooling plate for cooling the substrate may be provided between the electrostatic chuck device 23 and the magnetic force applying means 24. The cooling plate may be integrally formed with the electrostatic chuck device 23 or the magnetic force applying means 24. [

The evaporation source 25 includes a crucible (not shown) in which an evaporation material to be formed on the substrate is housed, a heater (not shown) for heating the crucible, and evaporation materials scattered to the substrate until the evaporation rate from the evaporation source becomes constant. And a shutter (not shown) for blocking the shutter. The evaporation source 25 may have various configurations depending on the application such as a point evaporation source, a linear evaporation source, and a revolver evaporation source.

Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) and a film thickness calculating unit (not shown) for measuring the film thickness deposited on the substrate.

A driving mechanism for moving the substrate support 21, the electrostatic chucking device 23, the magnetic force applying means 24 and the like in the vertical direction (Z direction) is formed on the outer upper surface of the vacuum chamber 20 of the film forming apparatus 2, A drive mechanism for moving the electrostatic chuck device 23 and the like parallel to the horizontal plane (in the X direction, the Y direction, and the? Direction) is provided for aligning the substrate and the mask. An alignment camera (not shown) is also provided for taking an alignment mark formed on the substrate and the mask through a window provided on the ceiling of the vacuum chamber 20 for aligning the mask and the substrate.

The film forming apparatus is provided with a control section (26). The control unit 26 has functions such as conveyance and alignment of the substrate 10, control of an evaporation source, and control of film formation. The control unit 26 can be configured by a computer having a processor, memory, storage, I / O, and the like. In this case, the function of the control section 26 is realized by the processor executing the program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded type computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 26 may be configured by a circuit such as an ASIC or an FPGA. Further, the control unit 26 may be provided for each deposition apparatus, or one control unit 26 may control a plurality of deposition apparatuses.

 Hereinafter, a film forming process in the film forming apparatus of the present invention will be described.

First, a new mask is carried into the vacuum chamber 20 of the film forming apparatus and placed on the mask table 22.

The substrate is carried into the vacuum chamber 20 by the transfer robot 14 of the transfer chamber 13 and placed on the substrate support 21. [ Subsequently, the electrostatic chuck apparatus 23 is lowered to hold the substrate 10 by electrostatic attraction.

There is performed a substrate alignment process for measuring and adjusting the relative position in the horizontal (XY &amp;thetas;) direction of the substrate 10 held on the electrostatic chuck device 23 and the mask 221 placed on the mask table 22. [

When the substrate alignment process is completed, the electrostatic chucking device 23 and / or the substrate support 21 are lowered by the driving mechanism to place the substrate 10 on the mask 221, And is lowered by the driving mechanism to bring the substrate 10 and the mask 221 into close contact with each other.

In this state, the shutter of the evaporation source 25 is opened, and the evaporation material evaporated from the crucible of the evaporation source 25 is deposited on the substrate through the fine pattern opening of the mask.

The shutter of the evaporation source 25 is closed and then the transfer robot 14 transfers the substrate from the vacuum chamber 20 to the transfer chamber 13 Out. After a predetermined number of steps are carried out from the substrate carrying-in step to the substrate carrying-out step, a mask in which the evaporation material is deposited and can no longer be used is taken out of the film forming apparatus and a new mask is carried into the film forming apparatus.

&Lt; Mask attaching device &

Hereinafter, a mask attaching apparatus including the electrostatic chuck apparatus according to the present invention will be described with reference to FIGS. 3 and 4. FIG.

An apparatus for attaching a mask (30) of the present invention is an apparatus for attaching a mask on a film formation surface of a substrate, comprising an electrostatic chucking device (23) for holding a surface opposite to a film formation surface of the substrate, And a magnetic force applying means (24) for applying the magnetic force to the film formation surface of the substrate by a magnetic force.

The electrostatic chuck apparatus 23 of the present invention includes an electrostatic chuck plate portion 31 for holding a surface opposite to the film forming surface of the substrate by electrostatic attraction and a feed line for supplying electric power to the electrostatic chuck plate portion 31 And a power supply terminal portion 32 connected thereto.

The electrostatic chuck plate portion 31 includes a plurality of electrodes 311 to which positive and negative voltages are applied to generate an electrostatic attractive force.

The electrostatic chuck plate portion 31 is provided so that the upper surface thereof faces the magnetic force applying means 24 and the substrate 10 is held on the lower surface of the electrostatic chuck plate portion 31 do.

3, the power supply terminal portion 32 of the electrostatic chucking device 23 is located outside the region where the magnetic force generating portion 241 of the magnetic force applying means 24 is disposed, And is connected to the upper surface (first surface) (the first embodiment).

The power supply terminal portion 32 of the electrostatic chuck device 23 is provided outside the region where the magnetic force generating portion 241 of the magnetic force applying means 24 is disposed, Or the power supply line for supplying the power supply does not pass through the region where the magnetic force generating portion 241 is disposed. This allows the plurality of magnetic force generating portions 241 to be continuously disposed without the region where the magnetic force generating portion 241 is to be withdrawn from the magnetic force applying means 24 and the magnetic force generated by the magnetic force applying means 24 The magnetic field becomes uniform.

3, the power supply terminal portion 32 is provided on the upper surface (first surface) side of the electrostatic chuck plate portion 31. However, the present invention is not limited to this and may have a different arrangement structure.

For example, as shown in Fig. 4A, according to the second embodiment of the electrostatic chuck apparatus 23 of the present invention, the power supply terminal portion 32 is provided on the side surface of the electrostatic chuck plate portion 31 And a third surface that intersects the second surface). The electrostatic chuck plate portion 31 can be formed to be shorter in the X direction to the Y direction than in the first embodiment by disposing the power supply terminal portion 32 on the side surface of the electrostatic chuck plate portion 31. [

4 (b), according to the third embodiment of the electrostatic chuck apparatus 23 of the present invention, the power supply terminal portion 32 is provided on the lower surface (second surface) of the electrostatic chuck plate portion 31, As shown in FIG. When the power supply terminal portion 32 is provided on the lower surface of the electrostatic chuck plate portion 31, it is provided so as not to interfere with the substrate held on the lower surface of the electrostatic chuck plate portion 31 in the film forming process.

The power supply terminal portion 32 of the electrostatic chuck device 23 is disposed on the upper surface of the electrostatic chuck plate portion 31 outside the arrangement region of the magnetic force generating portion 241, In order to prevent the length of the electrostatic chucking plate portion 31 in the X direction or the Y direction from being lengthened, the shape of the power supply terminal portion 32 may be formed in a bent shape (Fourth embodiment). In this case, the power supply terminal portion 32 is disposed in the region covered by the magnetic force applying means 24 in the upper surface of the electrostatic chuck plate portion 31, so that the magnetic force applying means 24 is disposed on the electrostatic chuck plate portion 31 The thickness of the power supply terminal portion 32 may be adjusted so as to be sufficiently close to the thickness of the power supply terminal portion 32. In order to prevent the increase in resistance due to the thickness reduction of the power supply terminal portion 32, And the power supply terminal portion 32 may be provided thereon.

3 and 4, the present invention is not limited to this configuration, and the power supply terminal portion 32 may be connected to the magnetic force generating portion 241, that is, so as not to penetrate the arrangement region of the magnetic force generating section 241, as long as it can be provided. For example, depending on the installation position of the feeder line drawn from the outside of the vacuum chamber 20 of the film forming apparatus 2, the feeder terminal portion 32 can have various shapes so that connection with the feeder line can be made simpler. For example, the free end portion of the power supply terminal portion 32 shown in Fig. 4 (a) is bent in an upward direction to further simplify the connection with the feeder line drawn from the upper portion of the vacuum chamber 20 of the film forming apparatus 2 . &Lt; / RTI &gt;

4D, the power supply terminal portion 32 of the electrostatic chuck apparatus 23 does not pass the region where the magnetic force generating portion 241 of the magnetic force applying means 24 is disposed, May be provided to penetrate other portions of the means (24). In this case, since the power supply terminal portion 32 penetrates the magnetic force applying means 24 but passes through the region where the magnetic force generating portion 241 is disposed, it does not affect the arrangement of the magnetic force generating portion 241, The magnetic field can be maintained.

<Structure of Electrostatic Chuck Plate and Substrate Supporting Member>

Hereinafter, the structures of the electrostatic chuck plate portion 31 of the present invention and the supporting portions of the substrate support 21 will be described with reference to FIG.

The electrostatic chuck plate portion 31 of the present invention includes a plurality of substrate holding portions. For example, as shown in Fig. 5 (a), the electrostatic chuck plate portion 31 of the present invention has two substrate holding portions 312 and 313, 313, and 314, but it is not limited thereto and may have more substrate holding portions for controlling the holding accuracy of the substrate.

The plurality of substrate holding portions are elongated in the longitudinal direction (Y-axis direction) of the substrate and are separated in the short-side direction (X-axis direction) of the substrate, but are not limited thereto and may be separated in the longitudinal direction of the substrate. The plurality of substrate holding portions may be realized by separating a plurality of internal electric circuits of the plate, which is physically one, or may be implemented by a plurality of physically separated sub-plates. (As long as the holding of the substrate in each of the plurality of substrate holding portions can be independently controlled) so long as the voltage for holding the substrate can be independently controlled to be applied to each of the plurality of substrate holding portions, The structure and electrical circuit structure may be different.

A plurality of substrate holding portions 312, 313, and 314 of the electrostatic chuck plate portion 31 of the present invention are provided with a plurality of substrate holding portions, which are disposed on either side of a long side (first side) (Refer to the arrows in Fig. 5) is applied to the second substrate holding portion 313 disposed on the other long side (second side) side of the substrate from the second substrate holding portion 313. That is, as shown in Fig. 5 (a), a voltage is first applied to the first substrate holding portion 312, and then a voltage is applied to the second substrate holding portion 313. In the electrostatic chuck plate portion 31 shown in Fig. 5 (b), the voltage is first applied to the first substrate holding portion 312, and then the third substrate holding portion 314, (313). &Lt; / RTI &gt;

The substrate is first held by the first substrate holding portion 312 to the first side edge portion of the substrate in the electrostatic chuck plate portion 31 and then the center portion of the substrate is held by the third substrate holding portion 314 And the second side edge portion of the substrate is most recently absorbed by the second substrate holding portion 313. Thus, the deflection of the central portion of the substrate can be effectively extended toward the second side edge portion of the substrate. That is, since the substrate is attracted to the electrostatic chuck plate portion 31 in the order of the first side edge portion, the center portion, and the second side edge portion, the deflection of the central portion of the substrate can be spread toward the second side edge portion, I will not.

The support portion of the substrate support 21 of the film forming apparatus 2 of the present invention includes a plurality of support members 211 and 212 for supporting the substrate 10. [

For example, as shown in Fig. 5 (a), the supporting portion of the substrate support 21 is installed to support at least two opposite side edges of the substrate. That is, the support portion of the substrate support 21 includes at least a plurality of first support members 211 installed along one side (first side) of two opposing sides of the substrate, and a second side And a plurality of second support members 212 installed along the first direction.

The plurality of first support members 211 are provided along the long side direction (Y direction) of the substrate, and the plurality of second support members 212 are arranged in the long side direction of the substrate Y direction).

As shown in Fig. 5 (b), the support portion of the substrate support 21 of the present invention includes a plurality of first support members 211 arranged to support the first side edge portion of the substrate, In addition to a plurality of second support members 212 disposed so as to support the opposite side edge portions of the second side plates, the first and second support members 212, A plurality of third support members 213 and a plurality of fourth support members 214 arranged in two directions (short side direction, X direction).

5, the first support member 211 and the second support member 212 are each composed of a plurality of support members. However, the present invention is not limited thereto, and the first support member 211 and / 2 support members 212 may each be composed of a single support member extending in a first direction.

Each support member includes a substrate support surface portion 215 for supporting the periphery of the lower surface of the substrate and an elastic body portion 216 elastically supporting the substrate support surface portion. A fluorine-coated pad (not shown) is provided on the substrate supporting surface portion 215 to prevent damage to the substrate. The elastic body portion 216 of the support member includes an elastic body such as a coil spring, a leaf spring, or silicone rubber. When the substrate is attracted to the electrostatic chuck plate portion 31, The displacement prevents the substrate from being broken between the electrostatic chuck plate portion and the supporting member.

The substrate supporting surface portion 215 of the first supporting member 211 is formed so as to be higher than the substrate supporting surface portion 215 of the second supporting member 212 so as to entirely and flatly adhere the substrate to the electrostatic chuck plate portion 31 Can be installed. The elastic modulus of the elastic body 216 of the first supporting member 211 is set to be different from the elastic modulus of the elastic body 216 of the second supporting member 212 The supporting force for supporting the substrate by the first supporting member 211 may be different from the supporting force for supporting the substrate by the second supporting member 212 by different lengths (for example, longer).

&Lt; Method of manufacturing electronic device &

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be exemplified as an example of the electronic device.

First, an organic EL display device to be manufactured will be described. 6 (a) is an overall view of the organic EL display device 60, and Fig. 6 (b) shows a cross-sectional structure of one pixel.

6A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 each having a plurality of light emitting elements are arranged in a matrix form. Each of the light emitting devices has a structure including an organic layer sandwiched between a pair of electrodes. The term &quot; pixel &quot; as used herein refers to a minimum unit capable of displaying a desired color in the display region 61. [ In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B, . The pixel 62 is often formed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. no.

Fig. 6 (b) is a partial sectional schematic view taken along the line A-B in Fig. 6 (a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, light emitting layers 66R, 66G and 66B, an electron transport layer 67, a second electrode (cathode) 68 The organic EL device according to claim 1, Of these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to the light emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue, respectively. The first electrode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67 and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed separately for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

Although the hole transport layer 65 and the electron transport layer 67 are shown as one layer in FIG. 6 (b), depending on the structure of the organic EL display device, a plurality of layers including a hole blocking layer and an electron blocking layer It is possible. A hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 64 into the hole transport layer 65 is formed between the first electrode 64 and the hole transport layer 65 . Similarly, an electron injection layer may be formed between the second electrode 68 and the electron transport layer 67 as well.

Next, an example of a manufacturing method of the organic EL display device will be described in detail.

First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

An acrylic resin is formed on the substrate 63 on which the first electrode 64 is formed by spin coating and the acrylic resin is patterned by lithography so as to form an opening in a portion where the first electrode 64 is formed, . This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is brought into the first organic material film forming apparatus to hold the substrate with the substrate support and the hole transport layer 65 is formed as a common layer on the first electrode 64 in the display region To the tabernacle. The hole transport layer 65 is formed by vacuum evaporation. In practice, since the hole transport layer 65 is formed in a size larger than the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transporting layer 65 is carried into the second organic film forming apparatus, and held on the substrate supporting table 21. [ After the substrate on the substrate support table 21 is held by the electrostatic chucking device 23, the alignment of the substrate and the mask is performed. Subsequently, after the substrate is placed on the mask, the substrate and the mask are closely contacted by the magnetic force application means 24. [ In this state, a light emitting layer 66R that emits red light is formed on the portion where the red emitting element of the substrate 63 is arranged.

According to the present invention, the power supply terminal portion 32 of the electrostatic chuck device 23 is provided outside the arrangement region of the magnetic force generating portion 241 of the magnetic force applying means 24 so as to penetrate the arrangement region of the magnetic force generating portion 241 The magnetic force applied to the mask by the magnetic force applying means 24 can be uniformly maintained, and the degree of adhesion between the substrate and the mask can be improved.

The light emitting layer 66G that emits green light is formed by the third organic film forming apparatus similarly to the film formation of the light emitting layer 66R and further the light emitting layer 66B that emits blue light by the fourth organic film forming apparatus is formed. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth organic material film forming apparatus. The electron transporting layer 67 is formed as a common layer to the three color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transporting layer 67 is moved to the metallic deposition material film forming apparatus to form the second electrode 68. [

Thereafter, the protective layer 70 is formed by moving to a plasma CVD apparatus to complete the organic EL display device 60.

When the substrate 63 having the insulating layer 69 is exposed to an atmosphere containing moisture or oxygen from the time when the substrate 63 having been patterned is transferred to the film forming apparatus to the completion of film formation of the protective layer 70, There is a possibility of deterioration due to moisture or oxygen. Therefore, in this example, the carrying-in and carrying-out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, but may be appropriately modified within the scope of the technical idea.

10: substrate
21: Substrate support
22: Mask band
23: electrostatic chuck device
24: magnetic attraction means
30: mask attachment device
31: Electrostatic chuck plate portion
32: Feed terminal
241:

Claims (17)

As a mask attaching apparatus,
An electrostatic chuck plate portion for holding a surface opposite to the film formation surface of the substrate,
A power supply terminal portion for supplying power to the electrostatic chuck plate portion,
And a magnetic force applying unit for applying a magnetic force from the magnetic force generating unit to the mask with the substrate and the electrostatic chuck plate unit interposed therebetween,
/ RTI &gt;
The region where the power supply terminal portion is projected on the plane including the film formation surface of the substrate does not overlap with the region where the magnetic force generation portion is projected on the plane including the film formation surface of the substrate
Apparatus for attaching a mask. The method according to claim 1,
Wherein the electrostatic chuck plate portion includes a first surface facing the magnetic force applying means and a second surface opposing the first surface and holding a surface opposite to the film forming surface of the substrate,
Wherein the power supply terminal portion is provided on the first surface of the electrostatic chuck plate portion. The method according to claim 1,
Wherein the electrostatic chuck plate portion includes a first surface facing the magnetic force applying means and a second surface opposing the first surface and holding a surface opposite to the film forming surface of the substrate,
Wherein the power supply terminal portion is provided on the second surface of the electrostatic chuck plate portion. The method according to claim 1,
Wherein the electrostatic chuck plate portion includes a first surface facing the magnetic force applying means and a second surface opposing the first surface and holding a surface opposite to the film forming surface of the substrate,
Wherein the power supply terminal portion is provided on a third surface that intersects the first surface and the second surface of the electrostatic chuck plate portion. The method according to claim 1,
The power supply terminal portion is provided outside the region where the magnetic force generating portion of the magnetic force applying means is disposed in a state where a magnetic force from the magnetic force generating portion is applied to the mask with the substrate and the electrostatic chuck plate portion being interposed therebetween And the mask is attached to the mask. The method according to claim 1,
Wherein the power supply terminal portion is a portion in which the magnetic force from the magnetic force generating portion is applied to the mask with the substrate and the electrostatic chuck plate portion interposed therebetween and the magnetic force is generated by the magnetic force applying means Wherein the mask is provided outside the region where the mask is disposed. The method according to claim 1,
Wherein the electrostatic chuck plate portion includes a plurality of substrate holding portions, and the holding force of each of the plurality of substrate holding portions can be independently controlled. 8. The method of claim 7,
And the voltage applied to each of the plurality of substrate holding portions can be independently controlled. 8. The method of claim 7,
Further comprising a moving mechanism for relatively moving at least one of the magnetic force applying means and the electrostatic chuck plate portion relative to the other. As a mask attaching apparatus,
An electrostatic chuck plate portion for holding a surface opposite to the film formation surface of the substrate,
A power supply terminal portion for supplying power to the electrostatic chuck plate portion,
And a magnetic force applying means for applying a magnetic force from the magnetic force generating portion to the mask with the substrate and the electrostatic chuck plate portion sandwiched therebetween,
/ RTI &gt;
The power supply terminal portion is provided outside the region where the magnetic force generating portion of the magnetic force applying means is disposed in a state where a magnetic force from the magnetic force generating portion is applied to the mask with the substrate and the electrostatic chuck plate portion being interposed therebetween Characterized by
Apparatus for attaching a mask. 11. The method of claim 10,
Wherein the power supply terminal portion is a portion in which the magnetic force from the magnetic force generating portion is applied to the mask with the substrate and the electrostatic chuck plate portion interposed therebetween and the magnetic force is generated by the magnetic force applying means Wherein the mask is provided outside the region where the mask is disposed. 11. The method of claim 10,
Wherein the electrostatic chuck plate portion includes a plurality of substrate holding portions, and the holding force of each of the plurality of substrate holding portions can be independently controlled. 13. The method of claim 12,
And the voltage applied to each of the plurality of substrate holding portions can be independently controlled. 11. The method of claim 10,
Further comprising a moving mechanism for relatively moving at least one of the magnetic force applying means and the electrostatic chuck plate portion relative to the other. 1. A film forming apparatus for forming an evaporation material on a substrate through a mask,
A film forming apparatus comprising the mask adhering apparatus according to any one of claims 1 to 14. A film forming method for forming an evaporation material on a substrate through a mask,
A method for manufacturing a mask, comprising the steps of: attaching a mask to a film formation surface side of a substrate with the mask adhering apparatus according to any one of claims 1 to 14;
Depositing a deposition material evaporated from an evaporation source on a substrate through a mask
&Lt; / RTI &gt; A method of manufacturing an electronic device,
A method of manufacturing an electronic device using the deposition method according to claim 16.

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