JP7120545B2 - Film forming apparatus, film forming method, and method for manufacturing organic EL display device using the same - Google Patents

Description

The present invention relates to a film forming apparatus, and more particularly to a substrate support for flatly attaching a substrate to an electrostatic chuck without damage.

Recently, an organic EL display device has been spotlighted as a flat panel display device. Organic EL display devices are self-luminous displays, and are superior to liquid crystal panel displays in characteristics such as response speed, viewing angle, and thinness. is accelerating. In addition, the field of application is expanding to automobile displays and the like.

An element of an organic EL display device has a basic structure in which an organic material layer that emits light is formed between two electrodes (a cathode electrode and an anode electrode) facing each other. The organic layer and the electrode layer of the organic EL display device are formed by heating the vapor deposition source provided in the lower part of the vacuum chamber of the film forming apparatus to evaporate the vapor deposition material through a mask having a pixel pattern formed in the vacuum chamber. It is formed by vapor deposition on (the lower surface of) a substrate placed on top.

In the vacuum chamber of such an upward vapor deposition type film forming apparatus, the substrate is held by a substrate holder. The peripheral edge of the lower surface is supported by the supporting portion of the substrate holder. In this case, as the size of the substrate increases, the central portion of the substrate that is not supported by the supporting portion of the substrate holder bends due to the weight of the substrate itself, which is a factor in lowering deposition accuracy.

A technique using an electrostatic chuck is being studied as a method for reducing the deflection of the substrate due to its own weight. That is, an electrostatic chuck is provided above the substrate, and the upper surface of the substrate supported by the supporting portion of the substrate holder is attracted by the electrostatic chuck, so that the central portion of the substrate is pulled by the electrostatic attraction force of the electrostatic chuck. and the bending of the substrate can be reduced.

However, if the support member constituting the support portion of the substrate holder has a high rigidity, the substrate is attracted to the electrostatic chuck. The substrate can be damaged by the applied pressure.

Also, when a plurality of supporting members are installed, the height of each supporting member may not be constant due to manufacturing errors. In this case, the substrate may not be stably supported by the supporting members. There is a risk that the substrate will not be evenly sucked.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a film forming apparatus, a film forming method, and a method of manufacturing an electronic device using such a film forming method, which can hold a substrate in a flat shape by an electrostatic chuck without damaging the substrate. do.

A film forming apparatus according to a first aspect of the present invention includes a substrate holding unit including a support for supporting a peripheral edge of a substrate, and an electrostatic chuck provided above the support for attracting the substrate. wherein the support includes a first support member installed in a first direction and a second support member installed in the first direction to face the first support member; and the second support member can be displaced in a direction in which the substrate support surface thereof supports the substrate.

A film forming method according to a second aspect of the present invention comprises the steps of loading a substrate into the film forming apparatus according to the first aspect of the present invention and placing the substrate on a supporting portion of a substrate holding unit; The method includes a step of sucking the upper surface of the substrate placed on the support portion of the holding unit, and a film forming step of depositing a vapor deposition material on the substrate through a mask.

A method for manufacturing an organic EL display device according to the third aspect of the present invention manufactures an organic EL display device using the film forming method according to the second aspect of the present invention.

According to the present invention, the support member of the substrate holding unit for supporting the peripheral portion of the lower surface of the substrate is configured to include the elastic body portion. When the substrate supported by the supporting member is brought into contact with the electrostatic chuck, even if the substrate receives pressure from the electrostatic chuck, the elastic body portion of the supporting member is elastically deformed to absorb the pressure. become. This can prevent the substrate from being damaged by the pressure from the electrostatic chuck. In addition, even if the substrate supporting surfaces of the plurality of supporting members are not at a constant height, the elastic portion of the supporting member can absorb variations in the height of the substrate supporting surfaces, thereby stably and flatly supporting the substrate. be able to.

FIG. 1 is a schematic diagram of part of a manufacturing line for an organic EL display device. FIG. 2 is a schematic diagram of the film forming apparatus of the present invention. FIG. 3 is a schematic diagram showing the supporting portion of the substrate holding unit used in the film forming apparatus according to one embodiment of the present invention. FIG. 4 is a schematic diagram showing a supporting portion of a substrate holding unit used in a film forming apparatus according to another embodiment of the invention. FIG. 5 is a schematic diagram showing the structure of the supporting portion of the substrate holding unit according to another embodiment of the present invention. FIG. 6 is a schematic diagram showing the structure of an organic EL display device.

Preferred embodiments and examples of the present invention will be described below with reference to the drawings. However, the following embodiments and examples merely exemplify preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. In addition, unless otherwise specified, the scope of the present invention is limited only to the hardware configuration and software configuration of the apparatus, process flow, manufacturing conditions, dimensions, materials, shapes, etc., in the following description. It's not intended.

INDUSTRIAL APPLICABILITY The present invention can be suitably applied to an apparatus for forming a patterned thin film (material layer) on the surface of a substrate by vacuum deposition. Any material such as glass, polymeric film, or metal can be selected as the material for the substrate, and organic materials, metallic materials (metals, metal oxides, etc.), etc. can be used as vapor deposition materials. Any material can be selected. The technology of the present invention is specifically applicable to manufacturing apparatuses for organic electronic devices (eg, organic EL display devices, thin-film solar cells), optical members, and the like. Among them, an apparatus for manufacturing an organic EL display device forms an organic EL display element by evaporating a deposition material, and is one of the preferred application examples of the present invention.

<Electronic device production line>

FIG. 1 is a top view schematically showing part of the configuration of a manufacturing line for electronic devices. The production line of FIG. 1 is used, for example, to produce display panels for organic EL display devices for smartphones. In the case of a display panel for smartphones, for example, after forming an organic EL film on a substrate having a size of about 1800 mm×about 1500 mm, the substrate is diced to produce a plurality of small-sized panels.

A manufacturing line for electronic devices generally has a plurality of film forming chambers 11 and 12 and a transfer chamber 13, as shown in FIG. A transfer robot 14 for holding and transferring the substrate 10 is provided in the transfer chamber 13 . The transport robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate is attached to an articulated arm, and carries the substrate 10 into/out of each film forming chamber.

Each of the film forming chambers 11 and 12 is provided with a film forming device (also referred to as a vapor deposition device). A series of film formation processes, such as transfer of the substrate 10 to and from the transport robot 14, adjustment of the relative positions of the substrate 10 and the mask (alignment), fixing of the substrate 10 onto the mask, and film formation (evaporation), are performed by the film formation apparatus. done automatically.

The configuration of the film forming apparatus in the film forming chamber will be described below.

<Deposition equipment>

FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus 2. As shown in FIG. In the following description, an XYZ orthogonal coordinate system with the vertical direction as the Z direction is used. Assuming that the substrate 10 is fixed parallel to the horizontal plane (XY plane) during film formation, the direction parallel to the short sides of the substrate 10 is the X direction, and the direction parallel to the long sides is the Y direction. Also, the angle of rotation about the Z-axis is indicated by θ.

The film-forming apparatus 2 comprises a vacuum chamber 20 defining a space in which the film-forming process takes place. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

A substrate holding unit 21 that holds and transports a substrate, a mask table 22 on which a mask is placed, an electrostatic chuck 23 that attracts the substrate by electrostatic attraction, a metallic A magnet 24 and the like for applying a magnetic force to the mask are provided, and a vapor deposition source 25 and the like containing vapor deposition material are provided in the lower part of the vacuum chamber 20 of the film forming apparatus.

The substrate holding unit 21 receives the substrate 10 from the transfer robot 14 in the transfer chamber 13 and holds and transfers it. The substrate holding unit 21 is also called a substrate holder. The substrate holding unit 21 includes support portions 211 and 212 that support the periphery of the bottom surface of the substrate. A fluorine-coated pad (not shown) is provided on the support to prevent damage to the substrate. The support part of the present invention includes a support member having an elastic part so that the substrate can be flatly attracted to the electrostatic chuck without being damaged, as will be described later.

A frame-shaped mask table 22 is installed under the substrate holding unit 21 , and a mask 221 having an opening pattern corresponding to the thin film pattern formed on the substrate 10 is placed on the mask table 22 . In particular, a mask used to manufacture organic EL elements for smartphones is a metal mask having a fine opening pattern, and is also called FMM (Fine Metal Mask).

An electrostatic chuck 23 is provided above the support portions 211 and 212 of the substrate holding unit 21 to attract and fix the substrate by electrostatic attraction. An electrostatic chuck has a structure in which an electric circuit such as a metal electrode is embedded in a ceramic matrix. When a positive (+) and negative (-) voltage is applied to the metal electrode, the substrate is polarized through the ceramic matrix. Charges are induced, and the substrate is attracted and fixed to the electrostatic chuck 23 by electrostatic attraction therebetween. The electrostatic chuck can be partitioned into multiple modules by the structure of the embedded electrical circuits.

A magnet 24 is provided above the electrostatic chuck 23 to apply a magnetic force to the metal mask 221 to prevent the mask from bending and bring the mask 221 and the substrate 10 into close contact with each other. The magnet 24 can be a permanent magnet or an electromagnet and can be partitioned into multiple modules.

Although not shown in FIG. 2, a cooling plate is provided between the electrostatic chuck 23 and the magnet 24 for cooling the substrate. The cooling plate may be formed integrally with the magnet 24 .

The vapor deposition source 25 includes a crucible (not shown) in which the vapor deposition material to be deposited on the substrate is stored, a heater (not shown) for heating the crucible, and the vapor deposition material until the evaporation rate from the vapor deposition source becomes constant. It includes a shutter (not shown) and the like that prevent scattering. The deposition source 25 may have various configurations according to its use, such as a point deposition source, a linear deposition source, a revolver deposition source, and the like.

Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate.

A drive mechanism for moving a substrate holding unit 21, an electrostatic chuck 23, a magnet 24, etc. in the vertical direction (Z direction), and for alignment of the substrate and the mask are provided on the outer upper surface of the vacuum chamber 20 of the film forming apparatus 2. A drive mechanism and the like are provided for moving the electrostatic chuck 23, the substrate holding unit 21, and the like parallel to the horizontal plane (in the X direction, Y direction, and θ direction). Also, an alignment camera (not shown) is provided for photographing alignment marks formed on the substrate and the mask through a window provided in the ceiling of the vacuum chamber 20 for aligning the mask and the substrate.

A film forming process by the film forming apparatus of the present invention will be described. A substrate is carried into the vacuum chamber 20 by the transfer robot 14 in the transfer chamber 13 and placed on the substrate holding unit 21 . Subsequently, an alignment process is performed to measure and adjust the relative positions of the substrate 10 placed on the substrate holding unit 21 and the mask 221 placed on the mask table 22 . When the alignment process is completed, the substrate holding unit 21 is lowered by the drive mechanism to place the substrate 10 on the mask 221, and then the magnet 24 is lowered to bring the substrate 10 and the mask 221 into close contact. The substrate is fixed by the support portions 211 and 212 of the substrate holding unit 21 and the electrostatic chuck 23 in such an alignment process, a lowering process for placing the substrate on the mask, and a process of bringing the substrate and the mask into close contact with each other using a magnet.

In this state, the shutter of the deposition source 25 is opened, and the deposition material evaporated from the crucible of the deposition source 25 is deposited on the substrate through the fine pattern openings of the mask.

When the film thickness of the deposition material deposited on the substrate reaches a predetermined thickness, the shutter of the deposition source 25 is closed, and then the transfer robot 14 transfers the substrate from the vacuum chamber 20 to the transfer chamber 13 .

<Support portion of substrate holding unit>

Hereinafter, the configuration of the substrate holding unit 21, in particular, the configuration of the supports 211 and 212 that hold the substrate together with the electrostatic chuck will be described with reference to FIG.

The substrate holding unit 21 holds the peripheral portion of the substrate 10 by the supporting portions 211 and 212 and conveys the substrate 10 . In the embodiment of the present invention illustrated in FIG. 3, the supports 211 and 212 are provided to support the peripheral edges of two opposite sides (eg, two long sides) of the substrate.

That is, the support portions 211 and 212 of the substrate holding unit 21 are composed of a plurality of first support members 211 provided along one side (first side) of the two opposing sides of the substrate and the other side. It includes a plurality of second support members 212 provided along the (second side). For example, the plurality of first support members 211 are provided along the long side direction (Y direction, first direction) of the substrate, and the plurality of second support members 212 face the plurality of first support members 211 . is installed in the long side direction (Y direction, first direction) of the . Although FIG. 3 illustrates that the first support member 211 and the second support member 212 each include a plurality of support members, the present invention is not limited to this, and the first support member 211 and/or the second support member 212 may each comprise one support member elongated in the first direction. In addition, although FIG. 3 shows that the first support member 211 and the second support member 212 are provided along the long side of the substrate, the present invention is not limited thereto, and the first support member 211 and the second support member 212 are arranged along the long side of the substrate. Second support members 212 may be provided along opposite short sides of the substrate.

The support portions 211 and 212 that support the peripheral portion of the lower surface of the substrate are installed so that the substrate support surface can move in the vertical direction (Z direction) with respect to the substrate holding unit 21 (that is, in the direction in which the substrate is supported). be. That is, the supports 211 and 212 can vary in height.

For this reason, the supporting portion of the substrate holding unit 21 of the present invention is configured including an elastic body. For example, as shown in FIG. 3( a ), each of the plurality of support members 211 and 212 of the support includes a substrate support surface portion 30 and an elastic body portion 31 . The substrate supporting surface portion 30 supports the peripheral portion of the lower surface of the substrate, and the elastic body portion 31 supports the substrate supporting surface portion 30 so as to be elastically displaceable.

As the elastic body used for the elastic body part 31, a coil spring, a plate spring, silicone rubber, or the like can be used, but the present invention is not limited to this, and the substrate support surface part of the support member is elastically displaceable. Other configurations can be included as long as they are possible.

In this embodiment, the support member is configured to include the elastic body portion 31 , so that when the substrate supported by the substrate support surface portion 30 receives pressure from the electrostatic chuck 23 , the elastic body portion 31 is elastically displaced. (eg, compressive displacement or tensile displacement), it is possible to prevent the substrate from being damaged by absorbing the pressure from the electrostatic chuck 23 . In addition, even if the height of the substrate support surface portion 30 is not constant due to manufacturing errors in each support member, the effect on the overall function of the support portion can be reduced by the elastic displacement of the elastic body portion 31 .

In the present invention, among the plurality of supporting members 211 and 212, the first supporting member 211, which is installed at a position corresponding to the peripheral edge along one side (first side) of the substrate, is more likely to support the substrate than the other supporting members. The height of the support surface portion 30 is high. For example, as shown in FIG. 4A, the length of the elastic portion 31 of the first support member 211 is longer than the length of the elastic portion 31 of the second support member 212 .

With such a configuration, when the substrate is placed on the supporting portion of the substrate holding unit 21 and the substrate 10 comes into contact with the electrostatic chuck 23 by raising the substrate holding unit 21 or lowering the electrostatic chuck 23, the substrate is not supported. The peripheral edge portion of the first side of the substrate supported by the first support member 211 having the high surface portion 30 comes into contact with the lower surface of the electrostatic chuck 23 first and is attracted.

Then, when the distance between the electrostatic chuck 23 and the substrate 10 is further reduced, for example, the elastic body portion 31 of the first support member 211 is elastically compressed by the pressure from the electrostatic chuck 23, thereby The substrate support surface portion 30 of the 1 support member 211 is displaced, that is, lowered downward. As the elastic body portion 31 of the first support member 211 is elastically compressed, the height difference between the substrate support surface portion 30 of the first support member 211 and the substrate support surface portion 30 of the second support member 212 becomes smaller. Meanwhile, the adsorption of the substrate to the electrostatic chuck 23 progresses from the peripheral portion on the first side of the substrate toward the central portion of the substrate. When the distance between the electrostatic chuck 23 and the substrate 10 is further reduced, the adsorption of the substrate progresses from the central portion of the substrate toward the peripheral portion on the second side of the substrate.

When the electrostatic chuck 23 approaches the substrate support surface portion 30 of the second support member 212, the peripheral portion of the second side of the substrate supported by the second support member 212 is attracted to the electrostatic chuck 23, and this At this time, the height of the substrate supporting surface portion 30 of the first supporting member 211 is the same as the height of the substrate supporting surface portion 30 of the second supporting member 212 so that the substrate is attracted to the electrostatic chuck 23 in a flat state as a whole. become.

Although FIG. 4A shows that the displacement axis of the substrate support surface portion 30 of the support member and the displacement axis of the elastic body portion 31 are aligned, the present invention is not limited to this, and the displacement axis of the substrate support surface portion 30 is illustrated. and the displacement axis of the elastic body part 31 may be formed to be different from each other. That is, as shown in FIG. 4D, the displacement axis of the substrate supporting surface portion 30 and the displacement axis of the elastic body portion 31 are separated from each other in the direction parallel to the substrate surface (that is, shifted). can also be configured (ie both displacement axes can be formed parallel to each other). In such a configuration, the support member of the substrate holding unit 21 may further include a guide portion 32 that guides displacement of the substrate support surface portion 30 . As shown in FIG. 4(d), the elastic member 31 can be configured not only to be compressed and displaced when the substrate comes into contact with the electrostatic chuck 23, but also to be made to undergo tensile displacement.

The support portion of the substrate holding unit 21 of the present invention may be set such that the support force with which the plurality of support members 211 and 212 support the substrate varies depending on the support members. That is, the supporting portion of the substrate holding unit 21 has a supporting force with which the substrate is supported by the first supporting member 211 which supports the first side, which is one of the two opposing sides of the substrate, and the other one. The second support members 212 that support the second side, which is one side, are installed so that the support force for supporting the substrate is different from each other. For example, the supporting force with which the first supporting member 211 supports the substrate is set to be greater than the supporting force with which the second supporting member 212 supports the substrate.

For this reason, as shown in FIG. 4, the elastic modulus of the elastic portion 31 of the first support member 211 is made larger than that of the elastic portion 31 of the second support member 212, or the elasticity of the first support member 211 is increased. The length of the body portion 31 is made longer than the length of the elastic body portion 31 of the second support member 212 . As the length of the elastic body portion 31 of the first support member 211 increases, the distance over which the elastic body portion 31 of the first support member 211 is elastically displaced (tensile displacement or compression displacement) by the pressure from the electrostatic chuck 23 is the first. Since the elastic body portion 31 of the second support member 212 is longer than the elastically displaced distance, as a result, the support force of the first support member 211 to support the substrate becomes larger than the support force of the second support member 212 to support the substrate. can do.

By making the supporting force of the first supporting member 211 larger than the supporting force of the second supporting member 212 in this manner, the bending of the central portion of the substrate can be extended toward the second supporting member 212 having a smaller supporting force. , the substrate can be flatly attracted to the electrostatic chuck 23 as a whole.

In the present invention, as long as the supporting force of the first supporting member 211 is greater than the supporting force of the second supporting member 212, the elastic modulus and length of the elastic body can be variously combined.

For example, as shown in FIG. 4A, the elastic modulus and length of the elastic portion 31 of the first support member 211 may be greater than the elastic modulus and length of the elastic portion 31 of the second support member 212. 4(b), the elastic modulus of the elastic portion 31 of the first support member 211 and the elastic portion 31 of the second support member 212 are the same, The length of the elastic portion 31 of the first support member 211 may be longer than the length of the elastic portion 31 of the second support member 212 . Further, as shown in FIG. 4C, even if the lengths of the elastic portions of the first support member 211 and the second support member 212 are the same, the difference in the supporting force can be reduced by making the elastic coefficients different from each other. can also be granted.

As shown in FIG. 5, the supporting portion of the substrate holding unit 21 of the present invention includes a plurality of first supporting members 211 arranged to support the peripheral edge portion of the substrate on the first side side, facing the first side. In addition to the plurality of second supporting members 212 arranged to support the substrate peripheral edge portion on the second side side where the first side and the second side are connected, the substrate peripheral edge portions on the third side and the fourth side connecting the first side and the second side. can include a plurality of third support members 213 and a plurality of fourth support members 214 arranged to support the . The third support member 213 and the fourth support member 214 also include a substrate support surface portion 30 and an elastic body portion 31 . At this time, the elastic modulus and the length of the elastic body portion 31 of the third support member 213 and the fourth support member 214 are determined such that the third support member 213 and the fourth support member 214 are located at the peripheral edge portion on the third side of the substrate and at the third edge portion of the substrate. It is desirable to set the support force for supporting the peripheral edge portions on the four sides to be smaller than the support force of the first support member 211 . More preferably, the elastic modulus and/or length are set such that the supporting force of the third supporting member 213 and the fourth supporting member 214 is greater than the supporting force of the second supporting member 212 . By adjusting the supporting force of the supporting member in this way, when the substrate 10 is attracted to the electrostatic chuck 23, the first side (for example, one of the two opposing long sides) side From the peripheral edge of the substrate to the central portion of the substrate toward the second side (for example, the other one of the two long sides facing each other), the substrate is flattened. It becomes possible to be attracted to the electrostatic chuck.

<Method for manufacturing electronic device>

Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described. The configuration and manufacturing method of an organic EL display device will be exemplified below as an example of an electronic device.

First, the organic EL display device to be manufactured will be described. FIG. 6(a) is an overall view of an organic EL display device 60, and FIG. 6(b) shows a cross-sectional structure of one pixel.

As shown in FIG. 6A, in a display area 61 of an organic EL display device 60, a plurality of pixels 62 each having a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to a minimum unit that enables display of a desired color in the display area 61 . In the case of the organic EL display device according to this embodiment, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element and a white light emitting element. It is not limited.

FIG. 6(b) is a schematic partial cross-sectional view taken along line AB in FIG. 6(a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, any one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. and an organic EL element. Among these layers, the hole transport layer 65, the light emitting layers 66R, 66G and 66B, and the electron transport layer 67 correspond to organic layers. In this embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light-emitting layers 66R, 66G, and 66B are light-emitting elements (
It is formed in a pattern corresponding to an organic EL element). Also, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 to prevent short-circuiting between the first electrodes 64 and the second electrodes 68 due to foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

In FIG. 6B, the hole transport layer 65 and the electron transport layer 67 are shown as one layer, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. may be In addition, a positive electrode having an energy band structure capable of smoothly injecting holes from the first electrode 64 to the hole transport layer 65 is provided between the first electrode 64 and the hole transport layer 65 . A hole injection layer can also be formed. Similarly, an electron injection layer may be formed between the second electrode 68 and the electron transport layer 67 as well.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a substrate 63 on which a circuit (not shown) for driving the organic EL display device and a first electrode 64 are formed is prepared.

An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the first electrode 64 is formed, thereby forming an insulating layer. form 69. This opening corresponds to a light emitting region where the light emitting element actually emits light.

A substrate 63 having an insulating layer 69 patterned thereon is carried into a first organic material deposition apparatus, and the substrate is held by a substrate holding unit and an electrostatic chuck. is deposited as a common layer on the The hole transport layer 65 is deposited by vacuum deposition. Since the hole transport layer 65 is actually formed to have a size larger than that of the display area 61, a high-definition mask is not required.

Next, the substrate 63 on which the hole transport layer 65 is formed is carried into the second organic material deposition apparatus and held by the substrate holding unit and the electrostatic chuck. The substrate and the mask are aligned, the substrate is placed on the mask, and a light-emitting layer 66R emitting red is formed on a portion of the substrate 63 where the element emitting red is to be arranged.

Similarly to the deposition of the light-emitting layer 66R, the third organic material deposition apparatus is used to deposit a green-emitting light-emitting layer 66G, and the fourth organic material deposition apparatus is used to deposit a blue-emitting light-emitting layer 66B. . After the formation of the light-emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light-emitting layers 66R, 66G, and 66B.

The substrate on which the electron transport layer 67 has been formed is moved by a metallic evaporation material film-forming apparatus to form the second electrode 68 as a film.

According to the present invention, support portions 211, 212, 213, and 214 of a substrate holding unit for supporting a substrate when various organic materials and metallic materials are deposited on the substrate for manufacturing an organic EL display device. Since the support member of has the elastic body part 31, when the substrate supported by the support part of the substrate holding unit is attracted to the electrostatic chuck, the substrate is flatly attracted without being damaged. Accuracy can be improved.

After that, the substrate is moved to a plasma CVD apparatus to form a protective layer 70, and the organic EL display device 60 is completed.

If the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus and is exposed to an atmosphere containing moisture and oxygen until the film formation of the protective layer 70 is completed, the light emitting layer made of the organic EL material will be damaged. It may deteriorate due to moisture and oxygen. Therefore, in this example, substrates are carried in and out between film forming apparatuses under a vacuum atmosphere or an inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of its technical concept.

21: Substrate holding unit 22: Mask stand 23: Electrostatic chuck 24: Magnet 30: Substrate support surface portion 31: Elastic body portion 32: Guide portion 211: First support member 212: Second support member 213: Third support member 214 : Fourth support member

Claims (13)

A film forming apparatus for forming a film on a substrate through a mask,
a substrate holding unit including a first supporting member that supports a peripheral portion of a first side of the substrate; and a second supporting member that supports a peripheral portion of a second side of the substrate that faces the first side;
an electrostatic chuck provided above the substrate for attracting the substrate;
a drive unit for driving the substrate holding unit and the electrostatic chuck ,
each of the first supporting member and the second supporting member has a substrate supporting surface portion and a shaft portion connected to the substrate supporting surface portion via an elastic body portion and driven by the driving portion;
The substrate supporting surface portion of each of the first supporting member and the second supporting member intersects the attraction surface of the electrostatic chuck with respect to the shaft portion due to elastic deformation of a plate spring that constitutes the elastic body portion. A film forming device that is elastically displaced in the direction of movement. 2. The film forming apparatus according to claim 1, wherein heights of said substrate supporting surface portions of said first supporting member and said second supporting member are varied. 3. The film forming apparatus according to claim 1, wherein said elastic body part is elastically displaced in said direction by a pressure applied from said electrostatic chuck. 4. The film forming apparatus according to claim 1 , wherein the length of the elastic portion of the first support member is longer than the length of the elastic portion of the second support member. 5. The film forming apparatus according to claim 1 , wherein the elastic modulus of the elastic portion of the first support member is greater than the elastic modulus of the elastic portion of the second support member. 6. The first support member includes a plurality of support members arranged along the first side, and the second support member includes a plurality of support members arranged along the second side. The film forming apparatus according to the item. The substrate holding unit includes a third supporting member that supports a peripheral edge portion of a third side that intersects with the first side and the second side of the substrate, and a fourth side that faces the third side of the substrate. and a fourth support member that supports the peripheral edge,
The film forming apparatus according to any one of claims 1 to 6 , wherein the substrate supporting surfaces of the third supporting member and the fourth supporting member are displaceable in the direction. 8. The film forming apparatus according to claim 7 , wherein said third support member includes a plurality of support members arranged along said third side, and said fourth support member includes a plurality of support members arranged along said fourth side. . The elastic modulus of the elastic portions of the third support member and the fourth support member is larger than that of the elastic portion of the second support member, and is higher than that of the elastic portion of the first support member. The film forming apparatus according to claim 8 , which is small. The lengths of the elastic portions of the third support member and the fourth support member are longer than the length of the elastic portion of the second support member and shorter than the length of the elastic portion of the first support member. Item 9. The film forming apparatus according to item 8 or 9 . The mask is made of metal,
a mask table installed below the substrate holding unit to hold the mask;
11. The film forming apparatus according to any one of claims 1 to 10 , further comprising a magnet installed above the electrostatic chuck and applying a magnetic force to the mask to bring the substrate and the mask into close contact with each other. A film formation method for forming a film on a substrate through a mask, comprising:
A step of loading a substrate into the film forming apparatus according to any one of claims 1 to 11 and placing the substrate on a supporting portion of a substrate holding unit;
a step of attracting the upper surface of the substrate placed on the support portion of the substrate holding unit with an electrostatic chuck;
and a film forming step of depositing a vapor deposition material on the substrate through a mask. A method for manufacturing an organic EL display device using the film forming method according to claim 12 .

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