JP7199889B2 - Film forming apparatus, film forming method, and electronic device manufacturing method - Google Patents

Description

The present invention relates to a film forming apparatus and a film forming method, and more particularly to a film forming apparatus having a structure in which an elevating mechanism for a substrate attracting means and an elevating mechanism for a magnetic force applying means are mounted on an alignment stage, and a film forming method using the same. It is.

Recently, an organic EL display device has been spotlighted as a flat panel display device. Organic EL display devices are self-luminous displays, and are superior to liquid crystal panel displays in characteristics such as response speed, viewing angle, and thinness. are replaced at a high speed. In addition, the field of application is expanding to automobile displays and the like.

An element of an organic EL display device has a basic structure in which an organic material layer that emits light is formed between two electrodes (a cathode electrode and an anode electrode) facing each other. The organic layer and the electrode layer of the organic EL display device are formed by heating the vapor deposition source provided in the lower part of the vacuum chamber of the film forming apparatus to vaporize the vapor deposition material through the mask on which the pixel pattern is formed to the upper part of the vacuum chamber. It is formed by vapor deposition on (the lower surface of) a placed substrate.

The substrate is held by a substrate holder in the vacuum chamber of such an upward vapor deposition type film forming apparatus. The peripheral edge of the lower surface is held by the supports and clamps of the substrate holder. However, in this case, as the size of the substrate increases, the central portion of the substrate that is not supported by the supporting portion of the substrate holder and the clamp bends due to the substrate's own weight. This lowers the accuracy of alignment of the substrate with respect to the mask and the accuracy of close contact between the substrate and the mask, resulting in lowering the accuracy of vapor deposition on the substrate.

As a method for reducing the deflection of the substrate due to its own weight, a technique of holding the substrate using an electrostatic chuck is being studied. That is, an electrostatic chuck is provided above the substrate, and a voltage is applied to the electrostatic chuck to attract the upper surface of the substrate to the electrostatic chuck so that the central portion of the substrate is pulled by the electrostatic attraction force of the electrostatic chuck. and the deflection of the substrate is reduced.

In a conventional film forming apparatus using an electrostatic chuck, the substrate and the mask are moved relative to each other while being attracted to the electrostatic chuck in the horizontal direction (XYθ direction). An alignment process is performed to adjust the correct position.

With the substrate whose relative position is adjusted (aligned) in this way placed on the upper surface of the mask, the magnet plate is lowered from above the substrate to bring the magnet plate into contact with the upper surface of the substrate. The magnet plates sandwich the substrate and apply a magnetic force to the mask, thereby bringing the substrate and the mask into close contact with each other.

By the way, in a film deposition apparatus using an electrostatic chuck, position adjustment between the electrostatic chuck and the substrate and position adjustment between the magnet plate and the mask are more difficult than in a film deposition apparatus using a substrate clamp. accuracy has a great influence on film formation accuracy.

In other words, when the substrate is attracted to the electrostatic chuck while the relative position between the electrostatic chuck and the substrate is shifted in the horizontal direction (XYθ direction) due to a substrate transfer error caused by the substrate transfer robot, the substrate may move to the electrostatic chuck. It will not be properly adhered to. If the alignment process of the substrate with respect to the mask is performed in such a state, the accuracy of positional adjustment of the substrate with respect to the mask will be degraded.

Further, when the magnet plate applies a magnetic force to the mask in a state in which the relative position between the magnet plate and the mask which receives the magnetic force is shifted, the magnetic force is not sufficiently applied to the mask, and the substrate and the mask are separated from each other. There is a problem that the accuracy of close contact between the electrodes is lowered.

The present invention can adjust the position of the electrostatic chuck with respect to the substrate even when there is a relative positional deviation between the electrostatic chuck and the substrate and between the magnet plate and the mask. A main object of the present invention is to provide a film forming apparatus, a film forming method, and an electronic device manufacturing method that can adjust the position of a plate with respect to a mask.

A film forming apparatus according to a first aspect of the present invention is a film forming apparatus for forming a film of a vapor deposition material on a substrate through a mask, comprising: a vacuum chamber defining a space in which a vapor deposition process is performed; magnetic force application means for applying a magnetic force to the mask provided above the substrate adsorption means in the vacuum chamber; and under the substrate adsorption means A substrate holding means for holding a substrate , the rotation about a first direction, a second direction intersecting the first direction, and a third direction intersecting the first direction and the second direction. and a mask holding means installed under the substrate holding means for holding a mask , wherein the first direction, the second direction, and the a mask holding means mounted to be rotationally fixed ; and a substrate holding means mounted on a first exterior surface of the vacuum chamber for aligning the magnetic force applying means with respect to the mask. The substrate attracting means and the magnetic force applying means with which the held substrate is position-adjusted and attracted are moved in a first direction, a second direction intersecting with the first direction, and the first direction and the second direction. an alignment stage for commonly moving or rotating in at least one of the directions of rotation about the intersecting third direction.

A film forming method according to a second aspect of the present invention is a film forming method for vapor-depositing a vapor deposition material onto a substrate through a mask, the film forming method being carried into the vacuum chamber of the film forming apparatus according to the first aspect of the present invention. placing a mask on a mask holding means; carrying a substrate into the vacuum chamber of the film forming apparatus and placing it on the substrate holding means; a step of aligning the substrate chucking means for adjusting the position thereof; a step of chucking the substrate by the position-adjusted substrate chucking means; a step of aligning a substrate for position adjustment; a step of aligning a magnetic force applying means for positioning a magnetic force applying means with respect to said mask; a step of placing said position- adjusted substrate on said mask; A step of moving the substrate above the substrate to bring the substrate and the mask into close contact with each other, and a step of depositing a vapor deposition material on the substrate through the mask.

An electronic device manufacturing method according to the third aspect of the present invention manufactures an electronic device using the film forming method according to the second aspect of the present invention.

According to the present invention, by mounting the substrate chucking means elevating mechanism and the magnetic force applying means elevating mechanism on the alignment stage, a relative positional deviation occurs between the substrate chucking means and the substrate in the horizontal direction (XYθ direction). In this case, the alignment stage on which the substrate chucking means elevating mechanism is mounted is moved in the horizontal direction (XYθ direction) with respect to the substrate placed on the substrate holding table, so that the relative position between the substrate chucking means and the substrate is increased. position can be adjusted. Further, since the magnetic force applying means elevating mechanism is also mounted on the alignment stage, the magnetic force applying means can be lowered above the substrate and the mask even when there is a relative positional deviation between the magnetic force applying means and the mask. The relative position between the magnetic force applying means and the mask can be adjusted by moving the alignment stage on which the magnetic force applying means elevating mechanism is mounted in the horizontal direction (XYθ direction) with respect to the mask. .

As a result, the accuracy of the alignment process can be improved by improving the accuracy of attraction between the substrate attraction means and the substrate, and at the same time, the accuracy of close contact between the substrate and the mask by the magnetic force application means can be improved. . As a result, it becomes possible to improve film formation accuracy.

FIG. 1 is a schematic diagram of part of a manufacturing line for an organic EL display device. FIG. 2 is a schematic diagram of a film forming apparatus. FIG. 3 is a schematic diagram showing the configuration of the alignment stage of this embodiment. FIG. 4 is a schematic diagram for explaining the alignment process of this embodiment. FIG. 5 is an overall view of an organic EL display device and a cross-sectional view of elements of the organic EL display device.

Preferred embodiments and examples of the present invention will be described below with reference to the drawings. However, the following embodiments and examples merely exemplify preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. In addition, unless otherwise specified, the scope of the present invention is limited only to the hardware configuration and software configuration of the apparatus, process flow, manufacturing conditions, dimensions, materials, shapes, etc., in the following description. It's not intended.

The present invention can be preferably applied to an apparatus for forming a patterned thin film (material layer) on the surface of a substrate by vacuum deposition. As the material of the substrate, any material such as glass, polymer material film, and metal can be selected, and as the vapor deposition material, organic material, metallic material (metal, metal oxide, etc.), etc. can be selected. any material can be selected. The technology of the present invention is specifically applicable to manufacturing apparatuses for organic electronic devices (eg, organic EL display devices, thin-film solar cells), optical members, and the like. Among them, an organic EL display device is one of the preferred application examples of the present invention.

<Electronic device production line>
FIG. 1 is a top view schematically showing part of the configuration of a manufacturing line for electronic devices. The production line of FIG. 1 is used, for example, to produce display panels for organic EL display devices for smartphones. In the case of a display panel for smartphones, for example, after forming an organic EL film on a substrate having a size of about 1800 mm×about 1500 mm, the substrate is diced to produce a plurality of small-sized panels.

A manufacturing line for electronic devices generally has a plurality of film forming chambers 11 and 12 and a transfer chamber 13, as shown in FIG. A transfer robot 14 for holding and transferring the substrate 10 is provided in the transfer chamber 13 . The transport robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate is attached to an articulated arm, and carries the substrate 10 into and out of each film forming chamber.

Each of the film forming chambers 11 and 12 is provided with a film forming apparatus (also referred to as a vapor deposition apparatus). A series of film formation processes, such as transfer of the substrate 10 to and from the transport robot 14, adjustment of the relative positions of the substrate 10 and the mask (alignment), fixing of the substrate 10 onto the mask, and film formation (evaporation), are performed by the film formation apparatus. done automatically.

The configuration of the film forming apparatus in the film forming chamber will be described below.

<Deposition equipment>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus 2. As shown in FIG. In the following description, an XYZ orthogonal coordinate system with the vertical direction as the Z direction is used. Assuming that the substrate is fixed parallel to the horizontal plane (XY plane) during film formation, the direction parallel to the short side of the substrate is the X direction (first direction), and the direction parallel to the long side is the Y direction (first direction). two directions). Also, the rotation angle around the Z-axis is indicated by θ (rotation direction).

The film-forming apparatus 2 comprises a vacuum chamber 20 defining a space in which the film-forming process takes place. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

A substrate holder 21 for holding a substrate, a mask holder 22 for holding a mask, a substrate chucking means 23 for chucking the substrate, and a metal mask with magnetic force are provided in the upper part of the vacuum chamber 20 of the film forming apparatus 2 . A magnetic force applying means 24 for applying the magnetic force is provided, and a vapor deposition source 25 and the like for containing vapor deposition materials are provided in the lower part of the vacuum chamber 20 of the film forming apparatus.

The substrate holding table 21 is a frame-like means on which the substrate 10 received from the transfer robot 14 in the transfer chamber 13 is placed. The substrate holding table 21 is installed so as to be fixed to the vacuum chamber 20, but the present invention is not limited to this. For example, the substrate holding table 21 is fixed in the horizontal direction (XYθ direction), but may be installed so as to be movable up and down in the vertical direction (Z direction, third direction). The substrate holder 21 includes support portions 211 and 212 that support the periphery of the bottom surface of the substrate. A fluorine-coated pad (not shown) may be placed on the support to prevent damage to the substrate.

A frame-shaped mask holding table 22 fixed to the vacuum chamber 20 is installed under the substrate holding table 21 , and the mask holding table 22 has an opening pattern corresponding to the thin film pattern formed on the substrate 10 . A mask 221 is placed. A mask used to manufacture organic EL elements for smartphones is a metal mask having a fine opening pattern, and is also called an FMM (Fine Metal Mask). The mask holding table 22 may be installed so as to be fixed in the vacuum chamber 20 in the horizontal direction, and may be installed in the vertical direction so as to be movable up and down.

A substrate adsorption means 23 for adsorbing and fixing a substrate is provided above the supporting portion of the substrate holding table 21 . The substrate attracting means 23 may be, for example, an electrostatic chuck having a structure in which electric circuits such as metal electrodes are embedded in a matrix of ceramic material, but is not limited to this. When positive (+) and negative (-) voltages are applied to the metal electrodes in the electrostatic chuck type substrate chucking means 23, polarization charges are induced in the substrate through the ceramic matrix, and the substrate chucking means 23 and the substrate are induced. The substrate is attracted and fixed to the substrate attracting means 23 by electrostatic attraction between them. The substrate attracting means 23 can be divided into a plurality of modules according to the structure of the embedded electric circuit.

A magnetic force applying means 24 is provided on the substrate attracting means 23 to apply a magnetic force to the metal mask 221 to prevent the mask from bending and bring the mask 221 and the substrate 10 into close contact with each other. The magnetic force applying means 24 is composed of permanent magnets or electromagnets, and can be partitioned into a plurality of modules.

Although not shown in FIG. 2, a cooling plate (not shown) for cooling the substrate can be installed between the substrate attracting means 23 and the magnetic force applying means 24 . The cooling plate may be formed integrally with the substrate attracting means (23) or the magnetic force applying means (24).

The vapor deposition source 25 includes a crucible (not shown) in which the vapor deposition material to be deposited on the substrate is stored, a heater (not shown) for heating the crucible, and the vapor deposition material until the evaporation rate from the vapor deposition source becomes constant. It includes a shutter (not shown) and the like that prevent scattering. The vapor deposition source 25 is a point
) It may have various configurations according to its use, such as a deposition source, a linear deposition source, a revolver deposition source, and the like.

Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) for measuring the thickness of the film deposited on the substrate and a film thickness calculation unit (not shown).

On the outer upper surface of the vacuum chamber 20 of the film forming apparatus 2, an elevating mechanism for lifting and lowering the substrate attracting means 23 and the magnetic force applying means 24 in the vertical direction (third direction), the substrate attracting means 23 and the magnetic force applying means 24 are provided. An alignment stage or the like is installed for moving the laser in the horizontal direction (in the XYθ directions). In this embodiment, as will be described later with reference to FIG. 3, an elevating mechanism and magnetic force application means for the substrate attraction means 23 are provided for position adjustment of the substrate attraction means 23 with respect to the substrate 10 and position adjustment of the magnetic force application means 24 with respect to the mask. 24 lift mechanisms are mounted on the alignment stage.

Further, in the film forming apparatus 2 of the present embodiment, for the alignment process, the alignments formed on the substrate 10, the substrate attracting means 23, the mask 221 and the magnetic force applying means 24 through the window provided on the ceiling of the vacuum chamber 20 are provided. An alignment camera (not shown) is also provided for photographing the marks.

Each step of the film forming process performed by the film forming apparatus of this embodiment will be described below.

First, a new mask is carried into the vacuum chamber 20 of the film forming apparatus and placed on the mask holder 22 .

Next, when the substrate is carried into the vacuum chamber 20 by the transfer robot 14 of the transfer chamber 13 and placed on the substrate holding table 21, the substrate adsorption means 23 descends to adsorb and fix the substrate on the substrate holding table 21. do. In this embodiment, before the substrate is adsorbed by the substrate adsorption means 23, the substrate adsorption means alignment for adjusting the relative positions of the substrate adsorption means 23 and the substrate 10 is performed.

Subsequently, a substrate alignment step is performed for measuring and adjusting the relative position between the substrate 10 sucked by the substrate sucking means 23 and the mask 221 placed on the mask holding table 22 .

When the substrate alignment process is completed, the substrate attracting means 23 that attracts and fixes the substrate 10 is further lowered by the elevating mechanism to put the substrate 10 on the mask 221 . After that, the magnetic force applying means 24 is lowered by the elevating mechanism, thereby bringing the substrate 10 and the mask 221 into close contact with each other. In this embodiment, magnetic force applying means alignment for adjusting the relative position between the magnetic force applying means 24 and the mask 221 is performed before the substrate 10 and the mask 221 are brought into close contact with each other by the magnetic force applying means 24 .

In this state, the shutter of the deposition source 25 is opened, and the deposition material evaporated from the crucible of the deposition source 25 is deposited on the substrate through the fine pattern openings of the mask.

When the film thickness of the deposition material deposited on the substrate reaches a predetermined thickness, the shutter of the deposition source 25 is closed, and then the transfer robot 14 transfers the substrate from the vacuum chamber 20 to the transfer chamber 13 . After repeating the process from carrying in the substrates to carrying out the substrates for a predetermined number of substrates, the mask that can no longer be used due to the accumulation of vapor deposition material is carried out from the film forming apparatus and replaced with a new one. The mask is carried into the film forming apparatus.

<Alignment stage>
The configuration of the alignment stage 30 of this embodiment will be described below with reference to FIG.

On the outer upper surface (first outer surface) of the vacuum chamber 20, the substrate attracting means 23 and the magnetic force applying means 24 are horizontally arranged for adjusting the position of the substrate attracting means 23 with respect to the substrate 10 and adjusting the position of the magnetic force applying means 24 with respect to the mask. an alignment stage 30 for moving in directions (XYθ directions), a substrate adsorption means Z-axis elevating mechanism 31 for elevating the substrate adsorption means 23 in the Z-axis direction, and a mechanism for elevating the magnetic force application means 24 in the Z-axis direction. A magnetic force application means Z-axis elevating mechanism 32 and the like are installed.

The alignment stage 30 receives driving force in the horizontal direction (XYθ directions) through linear guides from an alignment stage driving motor 301 fixed to the upper surface of the outside of the vacuum chamber. That is, a guide rail (not shown) is fixedly installed on the outer upper surface of the vacuum chamber, and a linear block is movably installed on the guide rail. An alignment stage base plate 302 is mounted on the linear block. Movement of the alignment stage base plate 302 mounted on the linear block is achieved by moving the linear block in the horizontal direction (XYθ direction) with the driving force from the alignment stage driving motor 301 fixed on the outer upper surface of the vacuum chamber. Accordingly, the entire alignment stage 30 can be moved in the horizontal direction (XYθ directions).

The substrate adsorption means Z-axis elevating mechanism 31 and the magnetic force applying means Z-axis elevating mechanism 32 are mounted on the alignment stage 30 as will be described later. 23 and the magnetic force application means 24 follow the movement of the alignment stage 30 and move in the horizontal direction (XYθ direction).

The substrate adsorption means Z-axis elevating mechanism 31 is a mechanism for elevating the substrate adsorption means 23 in the Z-axis direction, and is mounted on the alignment stage base plate 302 . The substrate adsorption means 23 in the vacuum chamber 20 is connected to the substrate adsorption means Z-axis elevating mechanism 31 through the outer upper surface of the vacuum chamber 20 . The substrate adsorption means Z-axis elevation mechanism 31 includes a substrate adsorption means elevation drive motor (not shown) and a substrate elevation driving force transmission mechanism (not shown) for transmitting the driving force of the substrate adsorption means elevation drive motor to the substrate adsorption means 23 . shown). A linear guide, a ball screw, or the like can be used as the substrate lifting drive force transmission mechanism, but the present invention is not limited to this.

The magnetic force applying means Z-axis elevating mechanism 32 includes a magnetic force applying means elevation driving motor (not shown) that generates driving force for driving the magnetic force applying means 24 in the Z direction, and a magnetic force applying means elevation driving motor. It is mounted on the alignment stage base plate 302 and includes a magnetic force application means elevation driving force transmission mechanism (not shown) for transmitting force to the magnetic force application means 24 . A ball screw, a linear guide, or the like can be used as the magnetic force applying means elevation driving force transmission mechanism, but the present invention is not limited to this.

As described above, in this embodiment, the Z-axis elevating mechanism 31 of the substrate attracting means and the Z-axis elevating mechanism 32 of the magnetic force applying means are installed on the base plate 302 of the alignment stage 30, so that the alignment stage 30 can move in the horizontal direction (XYθ direction). ), the substrate adsorption means Z-axis elevation mechanism 31 and the magnetic force application means Z-axis elevation mechanism 32 (therefore, the substrate adsorption means 23 and the magnetic force application means 24) also move in the horizontal direction (XYθ direction). As a result, as will be described later, even if the substrate is displaced relative to the substrate attracting means 23, the relative position between them can be adjusted. Even if the position is shifted relative to the mask, the position relative to the mask can be adjusted by moving the magnetic force applying means 24 in the horizontal direction (XYθ direction).

On the other hand, the substrate holding table 21 and the mask holding table 22 are installed so as to be fixed in the horizontal direction, but can be installed so as to be able to move up and down in the vertical direction. In this case, an elevating mechanism for vertically elevating the substrate holding table 21 and the mask holding table 22 is provided on the upper surface of the outside of the vacuum chamber 20 so as to be separated and independent from the alignment stage.

That is, the Z-axis elevating mechanism (not shown) of the substrate holding table 21 and the mask holding table 22 is not installed on the alignment stage base plate 302 , but is separated and independent from the alignment stage 30 and installed in the vacuum chamber 20 . It is installed on a separate base plate (not shown) fixed to the outer top surface. Therefore, even if the alignment stage 30 moves in the horizontal (XY.theta.) direction, the substrate holding table 21 and the mask holding table 22 do not move in the horizontal (XY.theta.) direction and are fixed in the horizontal (XY.theta.) direction. In a broad sense, the fact that the Z-axis elevating mechanisms of the substrate holding table 21 and the mask holding table 22 are separated from the alignment stage 30 and installed independently means that the Z axis of the substrate holding table 21 and the mask holding table 22 is in a broad sense. It means that the axis lifting mechanism is not installed on the alignment stage 30 and does not receive the driving force for horizontal (XYθ) movement from the alignment stage 30. In a narrow sense, the substrate holding table 21 and the mask holding table The Z-axis elevating mechanism 22 is not installed on the alignment stage 30, but is installed so as to be fixed to the external upper surface of the vacuum chamber 20 in the horizontal direction (XYθ direction) (i.e., fixed without moving or rotating in the horizontal direction). It means that

<Alignment of Substrate Attracting Means with respect to Substrate and Alignment of Magnetic Force Applying Means with respect to Mask>
Alignment of the substrate attracting means 23 with respect to the substrate 10 and alignment of the magnetic force applying means 24 with respect to the mask will be described with reference to FIG.

When it is time to replace the mask, a new mask 221 is carried into the vacuum chamber 20 of the film forming apparatus 2 and placed on the mask holder 22, as shown in FIG. 4(a).

Subsequently, the substrate 10 on which the vapor deposition material is deposited using the mask is carried into the vacuum chamber 20 and placed on the substrate holder 21 .

In this state, the substrate adsorption means alignment mark formed on the substrate adsorption means 23 and the alignment mark formed on the substrate are photographed by a rough alignment camera (first alignment camera), and the substrate adsorption means 23 and the substrate are photographed. Measure the relative displacement amount of The substrate chucking means alignment mark may be formed on the substrate chucking means 23 itself, or may be formed on an alignment mark plate separate from the substrate chucking means 23 . When a separate alignment mark plate is used, the alignment mark plate is attached to the upper or lower surface of the substrate suction means. Further, an opening is formed in the substrate attracting means 23 so that the alignment mark of the substrate 10 placed under the substrate attracting means 23 can be seen from above.

When it is found that the relative positions of the substrate chucking means 23 and the substrate 10 are shifted, the alignment stage 30 is horizontally moved to adjust the relative positions of the substrate chucking means 23 and the substrate in the horizontal direction. . In this embodiment, as described with reference to FIG. 3, the substrate adsorption means Z-axis elevating mechanism 31 is mounted on the alignment stage 30, and the substrate holding table 21 or its elevating mechanism is separated and independent from the alignment stage 30. Therefore, by moving the alignment stage in the horizontal direction, the relative positional deviation between the substrate adsorption means 23 and the substrate 10 can be corrected. As described above, according to the present invention, even when the relative positions of the substrate chucking means 23 and the substrate 10 in the horizontal direction are deviated from each other due to the substrate transfer error of the transfer robot 14, the substrate chucking means 23 can be moved to the substrate 10. Since the position can be adjusted with respect to the substrate 10, the entire substrate 10 can be properly adsorbed by the substrate adsorption means 23.例文帳に追加

When the positional adjustment of the substrate adsorption means 23 with respect to the substrate 10 is completed, the substrate adsorption means 23 is lowered by the substrate adsorption means Z-axis elevating mechanism 31 to move the substrate 10 to the substrate adsorption means 23 as shown in FIG. 4(d). Absorb.

Subsequently, as shown in FIG. 4( e ), the substrate adsorption means Z-axis elevating mechanism 31 is driven to lower the substrate 10 adsorbed by the substrate adsorption means 23 onto the mask 221 . At this time, the substrate holding table 21 can also be lowered together with the lowering of the substrate adsorption means 23 by the elevating mechanism of the substrate holding table 21 .

When the substrate 10 sucked by the substrate sucking means 23 descends to the measurement position for the fine alignment process, the fine alignment camera (second alignment camera) is used to separate the substrate 10 and the mask as shown in FIG. 221 alignment marks are photographed to measure whether there is any relative deviation. When the relative displacement between the substrate 10 and the mask 221 exceeds the threshold value, the alignment stage 30 on which the Z-axis lifting mechanism 31 of the substrate attracting means is mounted is horizontally moved to adjust the relative positions of the substrate 10 and the mask 221 . adjust.

If the relative positional deviation between the substrate 10 and the mask 221 is within the threshold value, the magnetic force applying means alignment marks formed on the magnetic force applying means 24 and the alignment marks of the mask 221 are aligned before the magnetic force applying means 24 is lowered onto the substrate. is photographed by a camera for rough alignment, and the amount of relative positional deviation between the magnetic force applying means 24 and the mask 221 is measured. The magnetic force applying means alignment mark may be formed on the magnetic force applying means 24 itself, or may be formed on an alignment mark plate separate from the magnetic force applying means 24 . When a separate alignment mark plate is used, the alignment mark plate is attached to the upper or lower surface of the magnetic force applying means. Further, the magnetic force applying means 24 is formed with an opening so that the alignment mark of the mask 221 placed under the magnetic force applying means 24 can be seen from above.

When the relative positional deviation between the magnetic force applying means 24 and the mask exceeds the threshold value, the alignment stage 30 is moved horizontally to adjust the relative position of the magnetic force applying means 24 with respect to the mask 221 . According to the present invention, since the magnetic force applying means Z-axis elevating mechanism 32 is mounted on the alignment stage 30, by moving the alignment stage 30 in the horizontal direction, the position of the magnetic force applying means 24 can be precisely adjusted with respect to the mask 221. become able to.

When the alignment of the magnetic force applying means 24 is completed, as shown in FIG. 4(h), the magnetic force applying means Z-axis elevating mechanism 32 is driven to lower the magnetic force applying means 24 onto the substrate. The magnetic force applying means 24 lowered onto the substrate applies a magnetic force to the mask 221, pulling the mask 221 toward the substrate, thereby bringing the substrate and the mask into close contact. In this embodiment, the relative positions of the magnetic force applying means 24 and the mask 221 receiving the magnetic force therefrom are precisely adjusted through the magnetic force applying means alignment step (FIG. 4(g)), so that the adhesion accuracy between the substrate and the mask is enhanced. be able to

Subsequently, the shutter of the vapor deposition source 25 is opened, and the vapor deposition material evaporated from the vapor deposition source 25 is vapor-deposited on the lower surface of the substrate through the mask (FIG. 4(i)).

According to the present invention, the alignment of the substrate attracting means 23 with respect to the substrate and the alignment of the magnetic force applying means 24 with respect to the mask are possible. As a result, film formation accuracy is improved.

<Method for manufacturing electronic device>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described. The configuration and manufacturing method of an organic EL display device will be exemplified below as an example of an electronic device.

First, the organic EL display device to be manufactured will be described. FIG. 5(a) shows an overall view of the organic EL display device 60, and FIG. 5(b) shows a cross-sectional structure of one pixel.

As shown in FIG. 5A, in a display region 61 of an organic EL display device 60, a plurality of pixels 62 each having a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The term "pixel" as used herein refers to a minimum unit capable of displaying a desired color in the display area 61. FIG. In the case of the organic EL display device according to this embodiment, the pixel 62 is configured by a combination of the first light-emitting element 62R, the second light-emitting element 62G, and the third light-emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element and a white light emitting element. It is not limited.

FIG. 5(b) is a schematic partial cross-sectional view taken along line AB in FIG. 5(a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, any one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. and an organic EL element. Among these layers, the hole transport layer 65, the light emitting layers 66R, 66G and 66B, and the electron transport layer 67 correspond to organic layers. In this embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (also referred to as organic EL elements) that emit red, green, and blue, respectively. Also, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 to prevent short-circuiting between the first electrodes 64 and the second electrodes 68 due to foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

In FIG. 5B, the hole transport layer 65 and the electron transport layer 67 are shown as one layer, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. may be In addition, there is an energy band structure between the first electrode 64 and the hole transport layer 65 that can facilitate injection of holes from the first electrode 64 to the hole transport layer 65 . A hole injection layer can also be formed. Similarly, an electron injection layer can be formed between the second electrode 68 and the electron transport layer 67 as well.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a substrate 63 on which a circuit (not shown) for driving the organic EL display device and a first electrode 64 are formed is prepared.

An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the first electrode 64 is formed, thereby forming an insulating layer. form 69. This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material deposition apparatus, the substrate is held by the substrate holding table and the substrate adsorption means, and the hole transport layer 65 is attached to the first electrode 64 in the display area. is deposited as a common layer on the The hole transport layer 65 is deposited by vacuum deposition. In practice, the hole transport layer 65 is formed to have a size larger than that of the display area 61, so a high-definition mask is not required.

Next, the substrate 63 on which the holes up to the hole transport layer 65 are formed is carried into the second organic material film forming apparatus and held by the substrate holding table and the substrate adsorption means. The substrate and the mask are aligned, the substrate is placed on the mask, and a light-emitting layer 66R emitting red is formed on a portion of the substrate 63 where the element emitting red is to be arranged.

According to the present invention, by mounting the driving mechanisms of the substrate attracting means 23 and the magnetic force applying means 24 on the alignment stage 30, the relative positions of the substrate attracting means 23, the magnetic force applying means 24, the substrate 10, and the mask 221 can be adjusted. It can be adjusted effectively, thereby effectively reducing film formation defects.

Similarly to the deposition of the light-emitting layer 66R, the third organic material deposition apparatus is used to deposit a green-emitting light-emitting layer 66G, and the fourth organic material deposition apparatus is used to deposit a blue-emitting light-emitting layer 66B. . After the formation of the light-emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light-emitting layers 66R, 66G, and 66B.

The substrate on which the electron transport layer 67 has been formed is moved by a metallic evaporation material film-forming apparatus to form the second electrode 68 as a film.

After that, the substrate is moved to a plasma CVD apparatus to form a protective layer 70, and the organic EL display device 60 is completed.

If the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus and is exposed to an atmosphere containing moisture and oxygen until the film formation of the protective layer 70 is completed, the light emitting layer made of the organic EL material will be damaged. It may deteriorate due to moisture and oxygen. Therefore, in this example, substrates are carried in and out between film forming apparatuses under a vacuum atmosphere or an inert gas atmosphere.

The above-described embodiment merely shows an example of the present invention, and the configuration to which the present invention can be applied is not limited to the configuration of the above-described embodiment, and may be appropriately modified within the scope of the technical idea.

10: Substrate 20: Vacuum chamber 21: Substrate holder 22: Mask holder 23: Substrate attraction means 24: Magnetic force application means 30: Alignment stage 31: Substrate attraction means Z-axis elevation mechanism 32: Magnetic force application means Z-axis elevation mechanism

Claims (15)

A film forming apparatus for forming a film of a vapor deposition material on a substrate through a mask,
a vacuum chamber defining a space in which the deposition process takes place;
a substrate adsorption means installed in the vacuum chamber for adsorbing a substrate;
a magnetic force applying means provided on the substrate attracting means in the vacuum chamber for applying a magnetic force to the mask;
A substrate holding means for holding a substrate under the substrate adsorption means , comprising a first direction, a second direction intersecting the first direction, and a second direction intersecting the first direction and the second direction. a substrate holding means installed so as to be fixed in a rotational direction about three directions ;
a mask holding means installed under the substrate holding means for holding a mask, the mask holding means being installed so as to be fixed in the first direction, the second direction, and the rotational direction ; ,
The substrate attracting means which is installed on the first outer surface of the vacuum chamber and attracts the substrate held by the substrate holding means after the position thereof is adjusted in order to adjust the position of the magnetic force applying means with respect to the mask. and an alignment stage for commonly moving or rotating the magnetic force applying means in at least one of rotation directions about the first direction, the second direction, and the third direction;
substrate adsorption means driving means for moving the substrate adsorption means in the third direction;
a magnetic force applying means driving means for moving the magnetic force applying means in the third direction;
including
The substrate attracting means driving means and the magnetic force applying means driving means are a film forming apparatus mounted on the alignment stage . further comprising substrate holding means driving means for moving the substrate holding means in the third direction;
2. The film forming apparatus according to claim 1 , wherein said substrate holding means driving means is provided independently from said alignment stage on said first outer surface of said vacuum chamber. further comprising mask holding means driving means for moving the mask holding means in the third direction;
3. The film forming apparatus according to claim 1, wherein said mask holding means driving means is provided independently from said alignment stage on said first outer surface of said vacuum chamber. 4. The film forming apparatus according to claim 1 , wherein the substrate chucking means is provided with a substrate chucking means alignment mark. 5. The film forming apparatus according to claim 1 , wherein the magnetic force applying means is provided with a magnetic force applying means alignment mark. and an alignment mark formed on the substrate and the substrate chucking means alignment mark installed on the first outer surface of the vacuum chamber through a transparent window for adjusting the position of the substrate chucking means with respect to the substrate. 5. The film forming apparatus according to claim 4 , further comprising a first alignment camera for photographing. a magnetic force applying means alignment mark and an alignment mark formed on a mask, disposed on the first outer surface of the vacuum chamber through a transparent window, for aligning the magnetic force applying means with respect to the mask; 6. The film forming apparatus according to claim 5 , further comprising a first alignment camera for photographing. Alignment marks formed on the substrate and the mask are placed on the first outer surface of the vacuum chamber through a transparent window and the substrate attracted by the substrate attracting means is aligned with the mask. 8. The film forming apparatus according to claim 6 , further comprising a second alignment camera for photographing. A film formation method for depositing a deposition material on a substrate through a mask, comprising:
The step of placing the mask carried into the vacuum chamber of the film forming apparatus according to any one of claims 1 to 8 on the mask holding means;
loading a substrate into the vacuum chamber of the film forming apparatus and placing it on a substrate holding means;
a substrate chucking means alignment step of adjusting the position of the substrate chucking means with respect to the substrate placed on the substrate holding means;
adsorbing the substrate by the position-adjusted substrate adsorption means;
a substrate alignment step of adjusting the position of the substrate sucked by the substrate sucking means with respect to the mask placed on the mask holding means;
a magnetic force applying means alignment step of aligning the magnetic force applying means with respect to the mask;
placing the aligned substrate on the mask;
A film forming method comprising: moving the position-adjusted magnetic force applying means above the substrate to bring the substrate and the mask into close contact; and forming a film of a vapor deposition material on the substrate through the mask. The step of aligning the magnetic force applying means is performed after the step of aligning the substrate and before the step of placing the substrate on the mask. 10. The film forming method according to claim 9 , which is performed after the step of placing and before the step of forming a film of the vapor deposition material on the substrate through the mask. In the step of aligning the substrate chucking means, the alignment stage on which the driving means for the substrate chucking means is mounted is moved with respect to the substrate placed on the substrate holding means in the first direction, the second direction, and the rotating direction. 11. The film forming method according to claim 9 or 10 , wherein the position of said substrate adsorption means is adjusted with respect to said substrate by relatively moving or rotating it in at least one direction. In the step of aligning the magnetic force applying means, the alignment stage mounted with the driving means for the magnetic force applying means is rotated with respect to the mask placed on the mask holding means in at least one of the first direction, the second direction and the rotating direction. 11. The film forming method according to claim 10 , wherein the position of said magnetic force applying means is adjusted with respect to said mask by relatively moving or rotating it in one direction. In the step of aligning the substrate chucking means, an alignment mark provided on the substrate chucking means and an alignment mark formed on the substrate are photographed to measure a relative positional deviation between the substrate chucking means and the substrate. Item 12. The film forming method according to item 11 . In the step of aligning the magnetic force applying means, an alignment mark provided on the magnetic force applying means and an alignment mark formed on the mask are photographed to measure a relative positional deviation between the magnetic force applying means and the mask. Item 13. The film forming method according to Item 12 . A method of manufacturing an electronic device using the film forming method according to any one of claims 9 to 14 .

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