KR102490641B1 - Deposition device and depositing method - Google Patents

Abstract

A deposition apparatus and a deposition method are provided.
For example, a deposition apparatus may include a plurality of substrate support units configured to support both ends of a substrate and to move up and down; a plurality of substrate clamping units disposed above each of the plurality of substrate support units so as to overlap both ends of the substrate, and configured to move up and down; a plurality of tension blocks disposed between each of the substrate supporters and each of the substrate clamping units and horizontally moving away from each other when each of the substrate clamping units moves downward to tension the substrate; and a plurality of push rods disposed inside each of the tension blocks to enable elevation and descent, and horizontally moving the tension blocks away from each other by the downward movement.

Description

Deposition apparatus and deposition method {DEPOSITION DEVICE AND DEPOSITING METHOD}

The present invention relates to a deposition apparatus and a deposition method.

As a display device, a liquid crystal display device, a plasma display device, an organic light emitting display device, and the like are widely used.

Such a display device may be manufactured by depositing a deposition material on a substrate through a deposition process to form a thin film.

In order to form a thin film on the substrate, an end of the substrate is supported so that the deposition surface of the substrate is exposed during the deposition process. However, as the size of the display device increases, the size of the substrate increases, resulting in large sagging in the center of the substrate. In this case, an error may occur in the process of aligning the substrate and the mask. Such an alignment error may cause distortion in a pattern of a thin film formed by depositing a deposition material on a substrate by reducing deposition accuracy.

Accordingly, an object to be solved by the present invention is to provide a deposition apparatus capable of increasing deposition precision by minimizing sagging of a substrate.

In addition, the problem to be solved by the present invention is to provide a deposition method capable of increasing deposition precision by minimizing sagging of a substrate.

The tasks of the present invention are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the following description.

A deposition apparatus according to an embodiment of the present invention for achieving the above object includes a plurality of substrate support units configured to support both ends of a substrate and to move up and down; a plurality of substrate clamping units disposed above each of the plurality of substrate support units so as to overlap both ends of the substrate and configured to move upward and downward; a plurality of tension blocks disposed between each of the substrate supporting parts and each of the substrate clamping parts, and horizontally moving away from each other when each of the substrate clamping parts moves downward to tension the substrate; and a plurality of push rods disposed inside each of the tension blocks to allow elevation and descent, and horizontally moving the tension blocks away from each other by the downward movement.

Each of the tension blocks may include a movement providing hole providing a space in which the push rod descends, and an insertion hole including an inclined hole for horizontally moving the tension block by guiding the push rod in an inclined direction when the push rod descends. .

Each of the tensile blocks and each of the push rods constitute a substrate tensioning unit, and the substrate tensioning unit includes a first guide unit disposed between each substrate clamping unit and each of the tensile blocks to guide the tensile block during horizontal movement, and each of the tensile blocks. An anti-slip pad disposed between the block and the substrate support to prevent slipping of each of the tensile blocks, and a moving holder disposed between each substrate support and the anti-slip pad to move together when the tensile block moves horizontally; A second guide part disposed between the movable holder and the substrate supporter to guide the movable holder when the movable holder moves horizontally may be further included.

The substrate extension part may further include an elastic body disposed between a side part of each substrate support part and a side part of the movable holder.

Each of the tensile blocks and each of the push rods constitutes a substrate tension unit, and the substrate tension unit includes a first guide unit disposed between each substrate clamping unit and each of the tension blocks to guide the tension block during horizontal movement, and each tension block. It may further include a sliding pad disposed between the block and the substrate support to slide the tensile block when the tensile block moves horizontally.

Each of the tensile blocks is arranged to be inserted into each of the substrate support parts and constitutes a substrate tensioning part together with the respective push rods, and the substrate tensioning part is disposed between each of the substrate clamping parts and each of the tensile blocks to guide the tensioning block during horizontal movement. an anti-slip pad disposed between the first guide unit and the substrate clamping unit to prevent slipping of the substrate moving by the horizontal movement of the first guide unit; The anti-slip pad may further include a slip pad disposed between the anti-slip pads to allow the substrate to slide.

The anti-slip pad may be made of a rubber material, and the slip pad may be made of Teflon.

In addition, the deposition apparatus includes an electrostatic chuck disposed between the substrate clamping parts; and a mask stage disposed under the electrostatic chuck and configured to support a mask and to move up and down, wherein the electrostatic chuck is configured to chuck the mask to the electrostatic chuck with an electrostatic force. A second electrode portion including a portion, insulated from the first electrode portion, and configured to chuck the substrate to the electrostatic chuck by electrostatic force.

The electrostatic chuck may further include a cooling layer disposed on the first electrode part.

The electrostatic chuck may further include a dielectric layer disposed on the second electrode unit and an embossing unit disposed on the dielectric layer.

A deposition apparatus according to another embodiment of the present invention for achieving the above object includes a plurality of substrate support units configured to support both ends of a substrate and to move up and down; a plurality of substrate clamping units disposed above each of the plurality of substrate support units so as to overlap both ends of the substrate and configured to move up and down; an electrostatic chuck disposed between the substrate clamping portions; and a mask stage disposed below the electrostatic chuck and configured to support a mask and to move up and down, wherein the electrostatic chuck includes a first electrode unit configured to chuck the mask to the electrostatic chuck by electrostatic force. and a second electrode portion that is insulated from the first electrode portion and configured to chuck the substrate to the electrostatic chuck by electrostatic force.

The first electrode part includes a connection part and a plurality of branch parts branched off from the connection part, and the second electrode part includes a first electrode and a second electrode disposed to be insulated from each other, and the first electrode includes the first connection part and the second electrode. A plurality of first branch portions branched from the first connection portion, wherein the second electrode includes a second electrode including a second connection portion and a plurality of second branch portions branched from the second connection portion; The part and the second branch part may be alternately disposed along one direction.

The electrostatic chuck may further include a cooling layer disposed on the first electrode part.

The electrostatic chuck may further include a dielectric layer disposed on the second electrode unit and an embossing unit disposed on the dielectric layer.

A deposition method according to an embodiment of the present invention for achieving the other object includes: seating the substrate on a plurality of substrate supports spaced apart from each other so that both ends of the substrate are supported; The plurality of substrate clamping units disposed on each of the plurality of substrate support units are lowered and moved so as to overlap both ends of the substrate, and the plurality of tension blocks disposed between each substrate support unit and each substrate clamping unit are horizontally moved away from each other. tensioning the substrate by moving a push rod inserted into each tensile block downward to move the substrate; and lowering the plurality of substrate supports to align the substrate with a mask disposed below the plurality of substrate supports.

The deposition method may further include, after aligning the mask and the substrate, lowering a cool plate disposed between the plurality of substrate clamping parts to bring it into close contact with the substrate; lowering a magnet assembly disposed on the cool plate to bring the substrate and the mask into close contact with each other; and depositing a deposition material on the substrate by spraying a deposition material toward the substrate using a deposition source disposed below the plurality of substrate supporters.

The deposition method may further include, after aligning the mask and the substrate, lowering an electrostatic chuck disposed between the plurality of substrate clamping parts and chucking the substrate to the electrostatic chuck using electrostatic force; chucking the mask using electrostatic force to the electrostatic chuck to bring the substrate and the mask into close contact with each other; and depositing a deposition material on the substrate by spraying a deposition material toward the substrate using a deposition source disposed below the plurality of substrate supporters.

A deposition method according to another embodiment of the present invention for achieving the above object includes placing a substrate on a plurality of substrate supports spaced apart from each other so that both ends of the substrate are supported; lowering the plurality of substrate supports toward a mask disposed below the plurality of substrate supports; It includes a first electrode part and a second electrode part disposed to be insulated from the first electrode part, and lowers an electrostatic chuck disposed between the plurality of substrate support parts, and lowers the substrate by electrostatic force using the second electrode part. chucking to the electrostatic chuck; aligning the mask and the substrate chucked by the electrostatic chuck; and a deposition step including chucking the mask to the electrostatic chuck by electrostatic force using the first electrode part.

The second electrode unit includes a first electrode and a second electrode insulated from each other, and in the chucking of the substrate to the electrostatic chuck, different voltages are applied to the first electrode and the second electrode, respectively. 1 may include blocking the voltage applied to the electrode unit.

The step of chucking the mask to the electrostatic chuck includes applying a voltage to the first electrode part to give a potential difference between the mask and the electrostatic chuck, and blocking the voltage applied to the second electrode part. can do.

Details of other embodiments are included in the detailed description and drawings.

According to embodiments of the present invention, at least the following effects are provided.

According to the deposition apparatus according to an embodiment of the present invention, deflection of the substrate is minimized, thereby increasing deposition accuracy.

Effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a schematic cross-sectional view of a deposition apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view of the substrate holder part, the substrate clamping part, and the substrate tensioning part of FIG. 1 .
3 is a perspective view of a tensile block and a push rod.
4 is a perspective view of the non-slip pad of FIG. 3;
5 and 6 are perspective views showing various embodiments of an anti-slip pad.
7 to 9 are cross-sectional views illustrating a deposition method using a deposition apparatus according to an embodiment of the present invention.
10 is an exemplary cross-sectional view of a display device formed by a deposition method using a deposition apparatus according to an embodiment of the present invention.
11 is an enlarged cross-sectional view of a substrate holder part, a substrate clamping part, and a substrate extension part of a deposition apparatus according to another embodiment of the present invention.
12 is an enlarged cross-sectional view of a substrate holder part, a substrate clamping part, and a substrate extension part of a deposition apparatus according to another embodiment of the present invention.
13 is a schematic cross-sectional view of a deposition apparatus according to another embodiment of the present invention.
FIG. 14 is a cross-sectional view showing a specific configuration of the electrostatic chuck of FIG. 13 .
FIG. 15 is a plan view of the first electrode part of FIG. 14 .
FIG. 16 is a plan view of the second electrode unit of FIG. 14 .
17 and 18 are cross-sectional views illustrating a deposition method using the deposition apparatus of FIG. 13 .
19 and 20 are cross-sectional views illustrating the operation of the electrostatic chuck of FIG. 13 as a substrate carrier.
21 is a schematic cross-sectional view of a deposition apparatus according to another embodiment of the present invention.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims.

When an element or layer is referred to as “on” another element or layer, it includes all cases where another element or layer is directly on top of another element or another layer or other element intervenes therebetween. Like reference numbers designate like elements throughout the specification.

Although first, second, etc. are used to describe various components, these components are not limited by these terms, of course. These terms are only used to distinguish one component from another. Accordingly, it goes without saying that the first element mentioned below may also be the second element within the technical spirit of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a schematic cross-sectional view of a deposition apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of a substrate holder part, a substrate clamping part, and a substrate tensioning part of FIG. 1, and FIG. 3 is a perspective view of a tensile block and a push rod. , FIG. 4 is a perspective view of the anti-skid pad of FIG. 3, and FIGS. 5 and 6 are perspective views showing various embodiments of the anti-skid pad.

Referring to FIG. 1 , the deposition apparatus 100 includes a chamber 101, a pressure control unit 102, a plurality of substrate holders 110, a plurality of substrate clamping units 120, and a plurality of substrate tensioning units 130. , Cool plate 140, magnet assembly 150, cool plate vertical moving part 160, cool plate horizontal moving part 170, vision camera 180, deposition source 190, and mask stage MS. can do.

The chamber 101 is formed to have an internal space in which a deposition process of forming a thin film by depositing a deposition material on the substrate S can be performed. The substrate S may be a large substrate having a size capable of forming a plurality of unit display devices.

The pressure control unit 102 is connected to one side of the chamber 101 and controls the pressure of the chamber 101 . For example, the pressure control unit 102 may adjust the pressure so that the inner space of the chamber 101 is in a vacuum state. The pressure control unit 102 may include a pipe 103 connected to the chamber 101 and a pump 104 installed in the pipe 103 . According to this configuration, the gas in the internal space of the chamber 101 is discharged to the outside through the pipe 103 according to the operation of the pump 104, so that the pressure in the internal space of the chamber 101 can be adjusted. .

A plurality of substrate holders 110 may be installed in the inner space of the chamber 101 . The plurality of substrate holders 110 may be spaced apart from each other to support both ends of the substrate S introduced into the inner space of the chamber 101 .

Each substrate holder unit 110 may be configured to be able to move up and down and move horizontally. For example, each substrate holder unit 110 may be configured to be movable in a first direction (X), a second direction (Y), and a third direction (Z). Each substrate holder unit 110 is substantially connected to the first driving shaft 111 disposed to enable vertical movement, horizontal movement, and a substrate connected to the first driving shaft 111 and supporting both ends of the substrate S. A support portion 112 may be included. The first driving shaft 111 may be connected to the first driving unit MT1 installed outside the chamber 101 . The first driving unit MT1 may include any device connected to the first driving shaft 111 such as a motor or a cylinder to allow the first driving shaft 111 to move up and down. Although not shown, a driving unit that is connected to the first driving shaft 111 and enables horizontal movement, such as a motor or a cylinder, may be connected to the first driving shaft 111 .

A plurality of substrate clamping units 120 may be installed in the inner space of the chamber 101 . The plurality of substrate clamping parts 120 may be disposed above each substrate branch 112 so as to overlap both ends of the substrate S.

Each substrate clamping unit 120 may be configured to be able to move up and down and move horizontally. For example, each substrate clamping part 120 may be configured to be movable in a first direction (X), a second direction (Y), and a third direction (Z). Each substrate clamping unit 120 may include a second drive shaft 121 , a support block 122 , an elastic body 123 and a clamping block 124 .

The second drive shaft 121 may be substantially arranged to enable elevation and descent and horizontal movement. The support block 122 is connected to the second driving shaft 121 and may provide a space in which the elastic body 123 is mounted. The elastic body 123 may be, for example, a spring, and the second driving shaft 121 moves downward to reduce the pressure impact when the clamping block 124 presses the substrate S, resulting in damage to the substrate S from the pressure impact. can reduce The clamping block 124 may press the substrate S when the second driving shaft 121 moves downward. Meanwhile, the second driving shaft 121 may be connected to the second driving unit MT2 installed outside the chamber 101 . The second drive unit MT2 may include any device connected to the second drive shaft 121 such as a motor or a cylinder to allow the second drive shaft 121 to move up and down. Although not shown, a driving unit that is connected to the second driving shaft 121 and enables left and right movement, such as a motor or a cylinder, may be connected to the second driving shaft 121 .

The plurality of substrate extension parts 130 may be disposed between each substrate holder part 110 and each substrate clamping part 120 . The plurality of substrate extension parts 130 may be configured to move horizontally so that the plurality of clamping parts 120 are farther apart from each other. When the substrate S held by the plurality of clamping units 120 is drooped, the plurality of substrate tensioning parts 130 may tension the sagging substrate S so that the substrate S becomes flat.

Each substrate tension unit 130 includes a tension block 131, a push bar 132, a first guide unit 133, an anti-slip pad 134, a movable holder 135, a second guide unit 134, and an elastic body. (137).

The tensile block 131 may be disposed between each substrate holder part 110 and each substrate clamping part 120 , specifically below the clamping block 124 . The tensile block 131 may move downward together with the downward movement of the substrate clamping unit 120, and may move horizontally by the downward movement of the push rod 132 described later. The tensile block 131 has a substantially rectangular parallelepiped shape, but is not limited to this shape.

The push rod 132 may be disposed inside the tension block 131 so as to be able to move up and down. In this case, the insertion hole 131a formed inside the tension block 131 to insert the push rod 132 is such that the push rod 132 descends and the tension block 131 presses the substrate S. The movement providing hole 131aa providing a space for the 132 to descend, and the push rod 132 in a state in which the substrate S is pressed, are guided in an inclined direction when the substrate S is lowered, thereby moving the tensile block 131 to the substrate S. ) It may include an inclined hole (131ab) for horizontal movement in the outward direction. Although not shown, the lifting and lowering of the push bar 132 may be performed by a driving unit such as a motor or a cylinder.

The first guide part 133 may be disposed between the clamping block 124 and the tension block 131 . The first guide part 133 guides the tensile block 131 to horizontally move outwardly of the substrate S by the operation of the push bar 132 . The first guide part 133 may be horizontally movable along the first guide rail 133a disposed below the clamping block 124 and the first guide rail 133a disposed above the tension block 131. A first guide block 133b may be included.

The anti-slip pad 134 may be disposed under the tensile block 131 . The anti-slip pad 134 may include a first surface TS contacting the tensile block 131 and a second surface BS contacting the substrate S. The first surface TS and the second surface BS of the anti-slip pad 134 may be flat surfaces. The anti-slip pad 134 may prevent slipping on the substrate S when the substrate S is pressed by the tension block 131 . The anti-slip pad 134 may be formed of a rubber material, for example, urethane-based rubber or fluorine-based rubber.

In another embodiment, the anti-slip pad 134a is a plurality of cylindrical protrusions 134P1 disposed on the second surface BS to further increase the sliding force of the tensile block 131 by increasing the frictional force with the substrate S. ) may further include (see FIG. 5). In another embodiment, the anti-slip pad 134b is a rectangular parallelepiped-shaped protrusion 134P2 disposed on the second surface BS to further increase the sliding force of the tensile block 131 by further increasing the frictional force with the substrate S. It may further include (see FIG. 6).

The movable holder 135 may be disposed between the substrate support 112 and the anti-slip pad 134, and substantially provides a space in which the substrate S is supported. The movable holder 135 moves horizontally when the tensile block 131 moves horizontally and tensions the substrate S together.

The second guide part 136 may be disposed below the movable holder 135 on the substrate support part 112 . The second guide part 136 guides the moving holder 135 to horizontally move together when the tensile block 131 moves horizontally outward from the substrate S by the operation of the push bar 132 . The second guide part 136 is disposed between the second guide rail 136a disposed between the substrate support part 112 and the movable holder 135, and disposed between the second guide rail 136a and the movable holder 135. It may include a second guide block 136b that can move horizontally along the two guide rails 136a.

The elastic body 137 may be disposed between the side of the substrate support 112 and the side of the movable holder 135 . The elastic body 137 may prevent the movable holder 135 from applying an impact to the substrate S due to the force of the movable holder 135 colliding with the substrate support 112 when the movable holder 135 moves horizontally. The elastic body 137 may be composed of, for example, a spring.

The substrate tensioning unit 130 constructed as described above can minimize the sagging of the substrate S by tensioning the substrate S, thereby reducing the occurrence of errors in the process of aligning the substrate S and the mask M. Accordingly, distortion in the pattern of the thin film formed by depositing the deposition material on the substrate S due to an alignment error between the substrate S and the mask M can be reduced.

The cool plate 140 is disposed between the substrate clamping portions 120 and is made of a material capable of preventing the substrate S from being deformed by high temperature when a deposition material is deposited on the substrate S. For example, the cool plate 140 may be formed of a material such as titanium. Cooling water pipes may be embedded in the cool plate 140 .

The magnet assembly 150 may be disposed above the cool plate 140 and spaced apart from the cool plate 140 . The magnet assembly 150 may include a support plate 151 and a plurality of magnets 152 . The support plate 151 provides a space in which the plurality of magnets 152 are mounted. The plurality of magnets 152 are disposed under the support plate 151 and may bring the mask M and the substrate S into close contact using magnetic force. The mask M has deposition openings of a pattern corresponding to the predetermined pattern so as to form a thin film having a predetermined pattern by depositing a deposition material on the substrate S. In addition, a sensor SEN for measuring the amount of deflection of the substrate S may be disposed at the center of the mask M.

Meanwhile, a connection block 145 is connected to a side of the cool plate 140 , and the connection block 145 is connected to an upper portion of the support plate 151 . In this case, when the cool plate 140 moves up and down, the magnet assembly 150 can move up and down together. Here, the magnet assembly 150 can move up and down independently of the up and down movement of the cool plate 140 by a separate driving unit. For example, when generating magnetic force using a plurality of magnets 152 to bring the mask M and the substrate S into close contact, the magnet assembly to bring the plurality of magnets 152 closer to the mask M. (150) can move down. At this time, the plurality of magnets 152 do not contact the cool plate 140 .

The cool plate vertical movement unit 160 may be disposed above the magnet assembly 150 to be connected to the magnet assembly 150 . The cool plate vertical movement unit 160 is configured to move the cool plate 140 connected to the support plate 151 through the connection block 145 up and down. The cool plate vertical moving unit 160 includes a moving block 161 connected to the support plate 151 and a third drive shaft 162 connected to the moving block 161 to move the moving block 161 up and down. can do. The third drive shaft 162 may be connected to the third drive unit MT3 installed outside the chamber 101 . The third drive unit MT3 may include any device connected to the third drive shaft 161 such as a motor or cylinder to allow the third drive shaft 163 to move up and down.

The cool plate horizontal moving unit 170 may be disposed outside the chamber 101 . The cool plate horizontal movement unit 170 is configured to horizontally move the cool plate 140 connected to the support plate 151 through the connection block 145 . The cool plate horizontal moving unit 170 may include a moving plate 171 , a first horizontal driving unit 172 , and a second horizontal driving unit 173 .

The moving plate 171 is configured to pass through the third driving shaft 162 and is movable in the first direction (X) and the second direction (Y). The first horizontal driving unit 172 is for moving the moving plate 171 in the first direction (X), and may include a driving shaft and a motor or cylinder connected to the driving shaft. The second horizontal driving unit 173 is for moving the moving plate 171 in the second direction (Y), and may include a driving shaft and a motor or cylinder connected to the driving shaft.

The vision camera 180 may be disposed on top of the moving plate 171 . The vision camera 180 is configured to photograph an alignment mark of the substrate S and the mask M in order to confirm that the substrate S and the mask M are accurately aligned. Meanwhile, an exposure hole may be formed in the moving plate 171 and a transparent window may be disposed in the chamber 101 so that the vision camera 180 checks an alignment mark between the substrate S and the mask M.

The mask stage MS may be disposed under the plurality of substrate holder units 110 . The mask stage MS may support an edge region of the mask M so as not to have a deposition opening pattern formed on the mask M. The mask stage MS may be selectively moved up and down by driving the fourth drive shaft MSA. The fourth drive shaft MSA may be connected to the fourth drive unit MT4 installed outside the chamber 101 . The fourth drive unit MT4 may include any device connected to the fourth drive shaft MSA such as a motor or a cylinder to allow the fourth drive shaft MSA to move up and down.

The deposition source 190 may be disposed below the mask stage MS. The deposition source 190 may store a deposition material therein, heat the deposition material, and spray the deposition material toward the substrate S.

Meanwhile, operations of the components may be controlled by a control unit (not shown), and the control unit may be implemented in a computer or similar device using hardware, software, or a combination thereof.

As described above, the deposition apparatus 100 according to an embodiment of the present invention uses a substrate tensioning unit 130 including a tensioning block 131 and a push rod 132, and is a simple device without using a complicated tensioning device. It is possible to minimize sagging of the substrate (S) by tensioning (S).

Accordingly, it is possible to reduce the occurrence of errors in the process of aligning the substrate S and the mask M. Accordingly, the deposition material is deposited on the substrate S due to the alignment error between the substrate S and the mask M. Distortion in the pattern of the thin film to be formed can be reduced.

Hereinafter, a deposition method using the deposition apparatus 100 of FIG. 1 will be described.

7 to 9 are cross-sectional views illustrating a deposition method using a deposition apparatus according to an embodiment of the present invention.

First, referring to FIG. 1 , a substrate S is introduced into the inner space of the chamber 101 and placed on the plurality of substrate support parts 112 of the plurality of substrate holder parts 110 . At this time, both ends of the substrate S may be supported by a plurality of substrate supporters 112, and the substrate S may be in a drooping state. Also, the mask M may be disposed on the mask stage MS.

Next, referring to FIGS. 1 and 7 , the clamping block 124 of each substrate clamping unit 120 and the push bar 132 of each substrate tensioning unit 130 are moved downward so that the tension block 131 is placed on the substrate ( S) clamp. Since the operation of lowering the clamping block 124 of the substrate clamping unit 120 and the push bar 132 of each substrate tensioning unit 130 has been described above, duplicate descriptions will be omitted.

Subsequently, referring to FIGS. 1 and 8, the tension block 131 of each substrate tension unit 130 is horizontally moved in a direction away from each other while maintaining the pressure of the clamping block 124 applied to the substrate S let it Then, the substrate S seated on the plurality of substrate supporters 112 in a drooping state may be tensioned and become flat as shown in FIG. 9 . Here, the tension of the substrate S may be controlled in consideration of the amount of deflection of the substrate S measured through the sensor SEN mounted on the mask M. Since the operation of horizontally moving the tension blocks 131 of each substrate tension unit 130 in a direction away from each other has been described above, redundant description will be omitted.

Subsequently, referring to FIG. 1 , the substrate S and the mask M are aligned in a state in which the plurality of substrate holder parts 110 are lowered and placed close to the mask M. The alignment of the substrate (S) and the mask (M) is confirmed by the information photographed by the vision camera 180, for example, the alignment marks of the substrate (S) and the mask (M), and then the substrate clamping unit 120 is horizontally This can be done by adjusting the direction. Alignment of the substrate S and the mask M can be precisely performed when the substrate S is flat.

Next, referring to FIG. 1 , the cool plate 140 is lowered to bring it into close contact with the substrate S, and some components of the substrate clamping portion 120 and the substrate tensioning portion 130 (that is, on top of the substrate S) placed component) is raised and lowered.

Next, referring to FIG. 1 , the plurality of substrate holder parts 110 are lowered to bring the substrate S and the mask M into contact, and the magnet assembly 150 is lowered to separate the substrate S and the mask M. close up

Subsequently, referring to FIG. 1 , the alignment of the substrate S and the mask M is checked. Checking the alignment of the substrate S and the mask M may be performed by checking information photographed by the vision camera 180, for example, alignment marks of the substrate S and the mask M. At this time, if it is confirmed that an error occurs in the alignment of the substrate S and the mask M, the substrate clamping unit 120 is adjusted horizontally to correct the alignment of the substrate S and the mask M.

Subsequently, referring to FIG. 1 , a thin film is formed on the substrate S by spraying and depositing a deposition material toward the substrate S using the deposition source 190 .

Next, referring to FIG. 1 , after the substrate clamping unit 120 is moved down, the substrate holder unit 110 is moved up and down, and the cool plate 140 is moved up and down, the substrate S is placed in the chamber 101. discharged to the outside of

10 is a cross-sectional view of a display device formed by a deposition method using a deposition apparatus according to an embodiment of the present invention. As the display device, a light emitting display device is exemplified.

Referring to FIG. 10 , a light emitting display formed by a deposition method using a deposition apparatus 100 according to an embodiment of the present invention includes a substrate 5, a first electrode 10, a pixel defining layer 20, It includes a hole injection layer 30 , a hole transport layer 40 , a light emitting layer 50 , an electron transport layer 60 , an electron injection layer 70 and a second electrode 80 .

The substrate 5 may be a substrate for one light emitting display device among a plurality of unit light emitting display devices formed on the substrate S of FIG. 1 by a deposition method using the deposition apparatus 100 . The substrate 5 may be formed of a transparent insulating material. For example, the substrate 5 may be formed of glass, quartz, ceramic, plastic, or the like. The substrate 5 may have a flat plate shape. According to some embodiments, the substrate 5 may be formed of a material that can be easily bent by an external force. The substrate 5 may support other components disposed on the substrate 5 . Although not shown, the substrate 5 may include a plurality of thin film transistors. Drain electrodes of at least some of the plurality of thin film transistors may be electrically connected to the first electrode 10 .

The first electrode 10 may be disposed on the substrate 5 for each pixel. The first electrode 10 may be an anode electrode that receives a signal applied to the drain electrode of the thin film transistor and provides holes to the light emitting layer 50 or a cathode electrode that provides electrons.

The first electrode 10 may be used as a transparent electrode, a reflective electrode, or a transflective electrode. When the first electrode 10 is used as a transparent electrode, it may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or In ₂ O ₃ . When the first electrode 10 is used as a reflective electrode, a reflective film is formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and their compounds, and then ITO, IZO, and ZnO are formed thereon. or In ₂ O ₃ It can be configured by forming. When the first electrode 10 is used as a transflective electrode, a thin reflective film is formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and their compounds, and then ITO is formed thereon. , IZO, ZnO or In ₂ O ₃ It can be configured by forming. The first electrode 10 may be formed through a photolithography method, but is not limited thereto.

The pixel defining layer 20 is disposed on the substrate 5 to have an opening 21 exposing the first electrode 10 and divides each pixel on the substrate 5 . The pixel defining layer 20 may be made of an insulating material. For example, the pixel defining layer 20 may include at least one organic material selected from benzocyclobutene (BCB), polyimide (PI), polyamide (PA), acrylic resin, and phenol resin. can be made including As another example, the pixel defining layer 20 may include an inorganic material such as silicon nitride. The pixel defining layer 20 may be formed through a photolithography process, but is not limited thereto.

The hole injection layer 30 may be formed on the first electrode 10 exposed through the opening 21 of the pixel defining layer 20 to cover the entirety of the pixel defining layer 20 . The hole injection layer 30 serves as a buffer layer that lowers the energy barrier between the first electrode 10 and the hole transport layer 40, and allows holes provided from the first electrode 10 to be easily injected into the hole transport layer 40. do The hole injection layer 30 is an organic compound such as MTDATA (4,4',4"-tris(3-methylphenylphenylamino)triphenylamine), CuPc (copper phthalocyanine) or PEDOT/PSS (poly(3,4-ethylenedioxythiphene) / polystyrene sulfonate), etc., but is not limited thereto, etc. Such a hole injection layer 30 may be formed by a deposition method using the deposition apparatus 100 of FIG.

The hole transport layer 40 is formed on the hole injection layer 30 . The hole transport layer 40 serves to transfer holes provided through the hole injection layer 30 to the light emitting layer 50 . The hole transport layer 40 is an organic compound, for example, TPD (N,N'-diphenyl-N,N'-bis(3-methylphenyl)-1,1'-bi-phenyl-4,4'-diamine) or NPB (N,N'-di(naphthalen-1-yl)-N,N'-diphenyl-benzidine), etc., but is not limited thereto. The hole transport layer 40 may be formed by a deposition method using the deposition apparatus 100 of FIG. 1 .

The light emitting layer 50 is formed on the hole transport layer 40 . The light emitting layer 50 emits light by recombination of holes provided from the first electrode 10 and electrons provided from the second electrode 80 . More specifically, when holes and electrons are provided to the light emitting layer 50, the holes and electrons combine to form excitons, and these excitons emit light while changing from an excited state to a ground state. The light emitting layer 50 may be formed by a deposition method using the deposition apparatus 100 of FIG. 1 . The light emitting layer 50 may include a red light emitting layer that emits red light, a green light emitting layer that emits green light, and a blue light emitting layer that emits blue light.

The red light emitting layer may include one red light emitting material or may include a host and a red dopant. Examples of the host of the red light emitting layer include Alq ₃ (tris (8-hydroxyquinolinato) aluminum), CBP (4,4'-N, N'-dicarbazol-biphenyl), PVK (ploy (n-vinylcarbazole)), ADN (9 ,10-Di(naphthyl-2-yl)anthracene), TPBI(1,3,5-tris(N-phenylbenzimidazole-2-yl)benzene), TBADN(3-tert-butyl-9,10-di(naphth -2-yl) anthracene), DSA (distyrylarylene), etc. may be used, but are not limited thereto. Also, as the red dopant, PtOEP, Ir(piq) ₃ , Btp ₂ Ir(acac), etc. may be used, but is not limited thereto.

The green light-emitting layer may include one green light-emitting material or may include a host and a green dopant. A host of the red light emitting layer may be used as a host of the green light emitting layer. And, as the green dopant, Ir(ppy) ₃ , Ir(ppy) ₂ (acac), Ir(mpyp) ₃ , etc. may be used, but is not limited thereto.

The blue light emitting layer may include one blue light emitting material or may include a host and a blue dopant. A host of the red light emitting layer may be used as a host of the blue light emitting layer. And, as the blue dopant, F ₂ Irpic, (F ₂ ppy) ₂ Ir(tmd), Ir(dfppz) ₃ , ter-fluorene, DPAVBi(4,4'-bis(4-di-p-tolylaminostyryl) biphenyl ), TBPe (2,5,8,11-tetra-tert-butyl perylene), etc. may be used, but is not limited thereto.

The electron transport layer 60 is formed on the light emitting layer 50 and serves to transfer electrons provided from the second electrode 80 to the light emitting layer 50 . The electron transport layer 60 is an organic compound such as Bphen (4,7-diphenyl-1,10-phenanthroline)), BAlq (aluminum (III) bis (2-methyl-8-hydroxyquinolinato) 4-phenylphenolate), Materials such as Alq ₃ (Tris(8-quinolinolato)aluminum), Bebq ₂ (berylliumbis(benzoquinolin-10-olate), TPBI (1,3,5-tris(N-phenylbenzimidazole-2-yl)benzene) can be used. The electron transport layer 60 may be formed by a deposition method using the deposition apparatus 100 of FIG. 1 .

The electron injection layer 70 is formed on the electron transport layer 60 and is a buffer layer that lowers the energy barrier between the electron transport layer 60 and the second electrode 80, and electrons supplied from the second electrode 80 are transferred to the electron transport layer. (60) serves to facilitate injection. The electron injection layer 70 may be formed of, for example, LiF or CsF, but is not limited thereto. The electron transport layer 70 may be formed by a deposition method using the deposition apparatus 100 of FIG. 1 .

The second electrode 80 may be disposed on the electron injection layer 70 . The second electrode 80 may be formed of the same material as the first electrode 10, but is not necessarily limited thereto. The second electrode 80 may be formed by a deposition method using the deposition apparatus 100 of FIG. 1 . According to some embodiments, the second electrode 80 may be a common electrode disposed in a plurality of pixels included in the light emitting display device. According to some embodiments, the second electrode 80 may be disposed on the entire upper surface of the electron injection layer 70 and the pixel defining layer 20 . Light emission of the light emitting layer 50 may be controlled according to a current flowing between the first electrode 10 and the second electrode 80 .

11 is an enlarged cross-sectional view of a substrate holder part, a substrate clamping part, and a substrate extension part of a deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 11 , a deposition apparatus according to another exemplary embodiment of the present invention has the same configuration as the deposition apparatus 100 of FIG. 1 except for the plurality of substrate extension parts 230 . Accordingly, in the deposition apparatus according to another embodiment of the present invention, only the plurality of substrate extension parts 230 will be described.

Each substrate tension unit 230 may include a tension block 131 , a push bar 132 , a first guide unit 133 , an anti-slip pad 134 and a slip pad 235 .

Since the tensile block 131, the push bar 132, the first guide part 133, and the anti-slip pad 134 have been described in the substrate tension part 130 of FIG. 1, duplicate descriptions will be omitted.

The slip pad 235 may be disposed on the bottom of the substrate support 112 . The sliding pad 235 slides the tensile block 131 and guides the tensile block 131 to horizontally move the substrate S in an outward direction by the operation of the push bar 132 . The sliding pad 235 may be formed of a material such as Teflon.

The substrate tensioning unit 230 configured as described above can minimize sagging of the substrate S by tensioning the substrate S without a complicated tensioning device using a simple sliding pad 235 .

Accordingly, it is possible to reduce the occurrence of errors in the process of aligning the substrate S and the mask (M in FIG. 1 ), and thus the substrate S due to the alignment error between the substrate S and the mask (M in FIG. 1 ). Distortion in the pattern of a thin film formed by depositing a deposition material on the surface can be reduced.

12 is an enlarged cross-sectional view of a substrate holder part, a substrate clamping part, and a substrate extension part of a deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 12, the deposition apparatus according to another embodiment of the present invention is different from the deposition apparatus 100 of FIG. have a configuration Accordingly, in the deposition apparatus according to another embodiment of the present invention, only the plurality of substrate holders 310 and the plurality of substrate extensions 330 will be described.

Each substrate holder unit 310 includes a first drive shaft (111 in FIG. 1 ) and a substrate support unit 312 , and is similar to each substrate holder unit 110 in FIG. 2 . However, the substrate support part 312 includes the insertion groove 312a providing a space in which the tensile block 331 and the first guide part 333 are installed.

Each substrate tension unit 330 may include a tension block 331 , a push rod 332 , a first guide unit 333 , an anti-slip pad 334 and a slip pad 335 .

The tensile block 331 may be disposed inside the insertion groove 312a of the substrate support 312 . The tensile block 331 may move horizontally by the downward movement of the push bar 332 described later. The tensile block 331 has a substantially rectangular parallelepiped shape, but is not limited to this shape.

The push bar 332 may be disposed inside the tension block 331 so as to be able to move up and down. Since the push rod 332 plays the same role as the push rod 132 of FIG. 2, duplicate descriptions will be omitted.

The first guide part 333 may be disposed between the tension block 331 and the clamping block 124 . The first guide part 333 guides the tensile block 331 to horizontally move outwardly of the substrate S by the operation of the push bar 332 . The first guide part 333 moves horizontally along the first guide rail 333a disposed above the tension block 331 and the first guide rail 333a disposed above the first guide rail 333a. It may include a first guide block (333b) that can be.

The anti-slip pad 334 may be disposed above the first guide block 333b. The anti-slip pad 334 may prevent the first guide block 333b from slipping on the substrate S.

The sliding pad 335 may be disposed below the clamping block 124 . The sliding pad 335 slides the substrate S and guides the tensile block 331 to horizontally move in the lateral direction of the substrate support 312 by the operation of the push bar 333 .

The substrate tensioning unit 330 configured as described above can minimize sagging of the substrate S by tensioning the substrate S without a complicated tensioning device using the simple anti-slip pad 334 and the slip pad 335.

Accordingly, it is possible to reduce the occurrence of errors in the process of aligning the substrate S and the mask (M in FIG. 1 ), and thus the substrate S due to the alignment error between the substrate S and the mask (M in FIG. 1 ). Distortion in the pattern of a thin film formed by depositing a deposition material on the surface can be reduced.

13 is a schematic cross-sectional view of a deposition apparatus according to another embodiment of the present invention, FIG. 14 is a cross-sectional view showing a specific configuration of the electrostatic chuck of FIG. 13, FIG. 15 is a plan view of the first electrode part of FIG. 14, and FIG. is a plan view of the second electrode part of FIG. 14 .

13 to 16, a deposition apparatus 400 according to another embodiment of the present invention includes a chamber 401, a pressure control unit 402, a plurality of substrate holders 410, and a plurality of substrate clamping units. 420, an electrostatic chuck 430, an electrostatic chuck vertical movement unit 450, an electrostatic chuck horizontal movement unit 460, a vision camera 470, a deposition source 480, and a mask stage MS. .

The chamber 401 is the same as the chamber 101 of FIG. 1 .

The pressure control unit 402 includes a pipe 403 and a pump 404 and plays the same role as the pressure control unit 102 of FIG. 1 .

The plurality of substrate holder units 410 are the same as the plurality of substrate holder units 110 of FIG. 1 . That is, each substrate holder part 410 includes a first drive shaft 411 and a substrate support part 412 .

The plurality of substrate clamping portions 420 are similar to the plurality of substrate clamping portions 120 of FIG. 2 . However, each substrate clamping unit 420 is connected to the second driving shaft 421 capable of lifting and lowering, and the second driving shaft 421, and is clamped to press the substrate S when the second driving shaft 421 moves downward. Block 422 may be included.

The electrostatic chuck 430 may be disposed between the substrate clamping parts 420 . The electrostatic chuck 430 can prevent the substrate S from sagging by coming into close contact with the substrate S seated on the plurality of substrate holder units 410, and when depositing a deposition material on the substrate S, high temperature It is configured to prevent the substrate S from being deformed. To this end, the electrostatic chuck 430 includes a first insulating layer 431, a first electrode part 432, a second insulating layer 433, second electrode parts 434 and 435, and a third insulating layer 436. , a dielectric layer 437, an embossing portion 438 and a cooling layer 439 may be included.

The first insulating layer 431 provides a space in which the first electrode unit 432 can be disposed. The first insulating layer 431 may be formed of an insulating material.

The first electrode part 432 may be disposed on the first insulating layer 431 , specifically, below the first insulating layer 431 . The first electrode part 432 is applied with a voltage that provides electrostatic power capable of being chucked to the electrostatic chuck 430 so that the mask M adheres to the substrate S first attached to the electrostatic chuck 430. do. As shown in FIG. 15 , the first electrode part 432 may include a connection part 432a providing a path through which the voltage is applied, and a plurality of branch parts 432b branched from the connection part 432a. Meanwhile, in FIG. 14 , it is shown that a negative voltage (−) is applied to the first electrode part 432, but a positive voltage (+) may also be applied.

The second insulating layer 433 covers the first electrode part 432 and provides a space in which the second electrode part 434 can be disposed. The second insulating layer 433 may be formed of an insulating material.

The second electrode parts 434 and 435 may be disposed on the second insulating layer 433 , specifically, below the second insulating layer 433 . These second electrode parts 434 and 435 allow the substrate S to be applied with a voltage providing electrostatic force capable of being chucked to the electrostatic chuck 430 . The second electrode units 434 and 435 may be divided into a first electrode 434 and a second electrode 435 so that different voltages may be applied thereto.

As shown in FIG. 16 , the first electrode 434 includes a first connection portion 434a providing a path to which a first voltage is applied and a plurality of first branch portions branched in the same direction from the first connection portion 434a. (434b). As shown in FIG. 16, the second electrode 435 includes a second connection portion 435a providing a path to which a second voltage different from the first voltage is applied, and a plurality of plural branches branched in the same direction from the second connection portion 435a. A second branch portion 435b of may be included. Here, the first branch portion 434b and the second branch portion 435b may be alternately disposed along one direction. Meanwhile, although it is shown in FIG. 14 that a negative voltage (-) is applied to the first electrode 434 and a positive voltage (+) is applied to the second electrode 435, a positive voltage ( +) may be applied and a negative voltage (−) may be applied to the second electrode 435 .

The third insulating layer 436 may be disposed between the first electrode 434 and the second electrode 435 to insulate the first electrode 434 and the second electrode 435 from each other.

The dielectric layer 437 may be formed on the third insulating layer 436 , specifically, below the third insulating layer 436 to cover the first electrode 434 and the second electrode 435 . The dielectric layer 437 may be formed of a material such as Al ₂ O ₃ .

The embossing portion 438 may be disposed on the dielectric layer 437 , specifically, at an edge portion at a lower portion of the dielectric layer 437 . When the mask M is chucked by the electrostatic chuck 430, the embossing portion 438 presses the edge portion of the substrate S where the electrostatic force is relatively smaller than other portions, thereby strengthening the adhesion between the substrate S and the mask M. can increase

The cooling layer 439 is disposed on the first insulating layer 431 , specifically, on top of the first insulating layer 431 . The cooling layer 439 is formed of a material capable of preventing the substrate S from being deformed by high temperature when the deposition material is deposited on the substrate S. For example, the cooling layer 439 may be formed of titanium or ceramic (SiC, Al ₂ O3, Si ₃ N ₄ , ZrO ₂ ). A cooling water pipe Pi may be embedded in the cooling layer 439 .

The electrostatic chuck 430 configured as described above can reduce the occurrence of an error in the process of aligning the substrate S and the mask M by minimizing sagging of the substrate S by chucking the substrate S. Accordingly, distortion in the pattern of the thin film formed by depositing the deposition material on the substrate S due to an alignment error between the substrate S and the mask M can be reduced.

The electrostatic chuck vertical movement unit 450 may be disposed above the electrostatic chuck 430 to be connected to the electrostatic chuck 430 . The electrostatic chuck vertical movement unit 160 is configured to move the electrostatic chuck 430 up and down. The electrostatic chuck vertical moving unit 450 includes a moving block 451 connected to the electrostatic chuck 430 and a third driving shaft 452 connected to the moving block 451 to move the moving block 451 up and down. can do. The third driving shaft 452 may be connected to the third driving unit MT3 installed outside the chamber 401 . The third drive unit MT3 may include any device connected to the third drive shaft 452 such as a motor or a cylinder to allow the third drive shaft 452 to move up and down.

The electrostatic chuck horizontal moving unit 460 may be disposed outside the chamber 401 . The electrostatic chuck horizontal moving unit 460 is configured to horizontally move the electrostatic chuck 430 . The electrostatic chuck horizontal moving unit 460 may include a moving plate 461 , a first horizontal driving unit 462 , and a second horizontal driving unit 463 .

The moving plate 461 is configured to pass through the third driving shaft 452 and is movable in the first direction (X) and the second direction (Y). The first horizontal driving unit 462 is for moving the moving plate 461 in the first direction (X), and may include a driving shaft and a motor or cylinder connected to the driving shaft. The second horizontal driving unit 463 is for moving the moving plate 461 in the second direction (Y), and may include a driving shaft and a motor or cylinder connected to the driving shaft.

The vision camera 470 may be disposed on top of the moving plate 461 . This vision camera 470 plays the same role as the vision camera 180 of FIG. 1 .

Since the mask stage MS has been described with reference to FIG. 1 , redundant description will be omitted.

The deposition source 480 may be disposed under the mask stage MS. The evaporation source 480 plays the same role as the evaporation source 190 of FIG. 1 .

As described above, the deposition apparatus 400 according to another embodiment of the present invention simply chucks the substrate S onto the electrostatic chuck 430 including the cooling unit 439 without using a complicated device such as a magnet assembly. Thus, sagging of the substrate S can be minimized.

Accordingly, it is possible to reduce the occurrence of errors in the process of aligning the substrate S and the mask M. Accordingly, the deposition material is deposited on the substrate S due to the alignment error between the substrate S and the mask M. Distortion in the pattern of the thin film to be formed can be reduced.

Hereinafter, a deposition method using the deposition apparatus 400 of FIG. 13 will be described.

17 and 18 are cross-sectional views illustrating a deposition method using the deposition apparatus of FIG. 13 .

First, referring to FIG. 13 , a substrate S is introduced into the inner space of the chamber 401 and placed on the plurality of substrate support parts 412 of the plurality of substrate holder parts 410 . At this time, both ends of the substrate S may be supported by a plurality of substrate supporters 412 and the substrate S may be in a drooping state. Also, the mask M may be disposed on the mask stage MS.

Subsequently, the plurality of substrate holders 410 are moved downward to position the substrate S close to the mask M.

Subsequently, the electrostatic chuck 430 is lowered, and the substrate S is chucked to the electrostatic chuck 430 using electrostatic force as shown in FIG. 17 . Accordingly, the substrate S supported on the plurality of substrate holder units 410 may be flattened. Electrostatic force for chucking the substrate S to the electrostatic chuck 430 may be generated by applying different voltages to the first electrode 434 and the second electrode 435 of the second electrode units 434 and 435 . there is.

Subsequently, referring to FIG. 13 , the substrate S and the mask M are aligned in a state in which the substrate S is placed close to the mask M. The alignment of the substrate (S) and the mask (M) is determined by checking the information photographed by the vision camera 470, for example, the alignment marks of the substrate (S) and the mask (M), and then moving the electrostatic chuck 430 in the horizontal direction. This can be done by adjusting Alignment of the substrate S and the mask M can be precisely performed when the substrate S is flat.

Subsequently, referring to FIG. 18 , the mask M is chucked to the electrostatic chuck 430 using electrostatic force to bring the substrate S and the mask M into close contact. Electrostatic force for chucking the mask M to the electrostatic chuck 430 may be formed by applying a voltage to the first electrode part 432 to give a potential difference between the electrostatic chuck 430 and the mask M. . At this time, the first voltage applied to the first electrode 434 of the second electrode units 434 and 435 and the second voltage applied to the second electrode 435 are blocked. As such, since the substrate S in a flat state and the mask M are brought into close contact with each other by the electrostatic chuck 430, an error in alignment between the substrate and the mask can be reduced when the substrate in a sagging state and the mask come into close contact.

Subsequently, referring to FIG. 13 , the alignment of the substrate S and the mask M is checked. Checking the alignment of the substrate (S) and the mask (M) can be performed by checking information photographed by the vision camera 470, for example, alignment marks of the substrate (S) and the mask (M). At this time, if it is confirmed that an error occurs in the alignment of the substrate S and the mask M, the alignment of the substrate S and the mask M is corrected by adjusting the electrostatic chuck 430 in a horizontal direction.

Subsequently, referring to FIG. 13 , a thin film is formed on the substrate S by spraying and depositing a deposition material toward the substrate S using the deposition source 480 .

Next, referring to FIG. 13 , the substrate clamping unit 420 is moved down, the mask M is dechucked from the electrostatic chuck 430, and the substrate clamping unit 120 is moved up and down, and then the substrate S is discharged to the outside of the chamber 401.

As a display device formed by the deposition method using the deposition device 400 of FIG. 13 , the display device of FIG. 10 may be exemplified.

Meanwhile, the electrostatic chuck 430 of FIG. 13 may be used as a substrate carrier capable of moving the substrate S.

19 and 20 are cross-sectional views illustrating the operation of the electrostatic chuck of FIG. 13 as a substrate carrier.

Referring to FIG. 19, an electrostatic chuck 430 is used as a substrate carrier capable of chucking a substrate S positioned outside a chamber (401 in FIG. 13) and moving the substrate S using electrostatic force. do. Here, electrostatic force for chucking the substrate S to the electrostatic chuck 430 is generated by applying different voltages to the first electrode 434 and the second electrode 435 of the second electrode units 434 and 435. It can be. In addition, the electrostatic chuck 430 chucks the mask M moved through a moving device such as a conveyor using electrostatic force. Here, electrostatic force for chucking the mask M to the electrostatic chuck 430 is generated by applying a voltage that can give a large potential difference between the electrostatic chuck 430 and the mask M to the first electrode part 432. It can be. At this time, the first voltage and the second voltage applied to the first electrode 434 and the second electrode 435 of the second electrode units 434 and 435 are blocked. Meanwhile, before the mask M is chucked by the electrostatic chuck 430, the substrate S and the mask M may be aligned through a separate alignment device.

The electrostatic chuck 430 is inserted into the chamber (401 in FIG. 13) in a state where the substrate S and the mask M are chucked, and a deposition process of depositing a deposition material on the substrate S can be performed. .

Thereafter, the electrostatic chuck 430 may be discharged to the outside of the chamber ( 401 in FIG. 13 ) in a state in which the substrate S and the mask M are chucked, and the mask M from the electrostatic chuck 430 is dechucked. It moves through a moving device such as a conveyor, and the substrate S can be dechucked from the electrostatic chuck 430 .

Meanwhile, the mask M can be dechuked from the electrostatic chuck 430 by blocking the voltage applied to the first electrode part 432, and at this time, the first electrode 434 of the second electrode parts 434 and 435 and the A state in which the substrate S is chucked to the electrostatic chuck 430 may be maintained by applying the first voltage and the second voltage to each of the two electrode parts 435 . Thereafter, the substrate S blocks the first voltage and the second voltage applied to the first and second electrodes 434 and 435 of the second electrode parts 434 and 435, respectively, so that the electrostatic chuck 430 does not can be chucked

Referring to FIG. 20 , an electrostatic chuck 430 is used as a substrate carrier capable of chucking a substrate S positioned outside a chamber (401 in FIG. 13 ) and moving the substrate S using electrostatic force. do. Here, electrostatic force for chucking the substrate S to the electrostatic chuck 430 is generated by applying different voltages to the first electrode 434 and the second electrode 435 of the second electrode units 434 and 435. It can be.

The electrostatic chuck 430 is inserted into the chamber ( 401 in FIG. 13 ) with the substrate S being chucked, and the mask stage ( 401 in FIG. 13 ) inside the substrate S and the chamber ( 401 in FIG. 13 ). The mask (M in FIG. 13) placed on the MS may be aligned through a separate alignment device.

Thereafter, the electrostatic chuck 430 chucks the mask (M in FIG. 13 ) using electrostatic force. Here, an electrostatic force for chucking the mask (M in FIG. 13) to the electrostatic chuck 430 may be applied to the first electrode unit 432 with a large potential difference between the electrostatic chuck 430 and the mask (M in FIG. 13). It can be generated by applying a voltage with At this time, the first voltage and the second voltage applied to the first electrode 434 and the second electrode 435 of the second electrode units 434 and 435 are blocked.

Thereafter, a deposition process of depositing a deposition material on the substrate S may be performed.

Thereafter, the mask (M of FIG. 13) may be de-chucked from the electrostatic chuck 430, and the electrostatic chuck 430 may be discharged to the outside of the chamber (401 of FIG. 13) in a state in which the substrate S is chucked. 13, and the mask (M in FIG. 13) may be discharged to the outside of the chamber (401 in FIG. 13) through a moving device such as a conveyor.

21 is a schematic cross-sectional view of a deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 21 , a deposition apparatus 500 according to another embodiment of the present invention, compared to the deposition apparatus 100 of FIG. 160), the cool plate horizontal movement unit 170, and the vision camera 180, the electrostatic chuck 430, the vertical movement unit 450 of the electrostatic chuck, the horizontal movement unit 460 of the electrostatic chuck, and the vision camera 470 shown in FIG. It has the same configuration except for applying .

That is, the deposition apparatus 500 according to another embodiment of the present invention includes a chamber 101, a pressure control unit 102, a plurality of substrate holders 110, a plurality of substrate clamping units 120, and a plurality of substrates. The tension unit 130, the electrostatic chuck 430, the vertical moving part 450 of the electrostatic chuck, the horizontal moving part 460 of the electrostatic chuck, the vision camera 470, the deposition source 190, and the mask stage MS. can

A chamber 101, a pressure control unit 102, a plurality of substrate holder parts 110, a plurality of substrate clamping parts 120, a plurality of substrate extension parts 130, an evaporation source 190, and a mask stage MS. Since is described in FIG. 1, redundant description is omitted.

Also, since the electrostatic chuck 430, the vertical movement unit 450, the horizontal movement unit 460, and the vision camera 470 have been described with reference to FIG. 13, duplicate descriptions will be omitted.

The deposition apparatus 500 configured as described above is a simple device without using a complicated tension device through the substrate tension unit 130 including the tension block (131 in FIG. 2) and the push rod (132 in FIG. 2). By simply chucking S) without using a complicated device such as a magnet assembly through the electrostatic chuck 430 including the cooling unit 439, the sagging of the substrate S can be minimized. can

Accordingly, it is possible to reduce the occurrence of errors in the process of aligning the substrate S and the mask M. Accordingly, the deposition material is deposited on the substrate S due to the alignment error between the substrate S and the mask M. Distortion in the pattern of the thin film to be formed can be reduced.

Hereinafter, a deposition method using the deposition apparatus 500 of FIG. 21 will be described.

First, the substrate S is introduced into the inner space of the chamber 101 and placed on the plurality of substrate support parts 112 of the plurality of substrate holder parts 110 . At this time, both ends of the substrate S may be supported by a plurality of substrate supporters 112, and the substrate S may be in a drooping state. Also, the mask M may be disposed on the mask stage MS.

Subsequently, the clamping block 124 of each substrate clamping unit 120 and the push bar ( 132 in FIG. 2 ) of each substrate tensioning unit 130 are moved downward so that the tension block ( 131 in FIG. 2 ) holds the substrate S. clamp Since the operation of moving the clamping block 124 of the substrate clamping unit 120 and the push bar ( 132 in FIG. 2 ) of each substrate tensioning unit 130 has been described above, duplicate descriptions will be omitted.

Next, while maintaining the pressure of the clamping block 124 applied to the substrate S, the tension blocks ( 131 in FIG. 2 ) of each substrate tension unit 130 are horizontally moved in directions away from each other. Then, the substrate S seated on the plurality of substrate supporters 112 in a drooping state may be stretched to be in a flat state. Here, the tension of the substrate S may be controlled in consideration of the amount of deflection of the substrate S measured through the sensor SEN mounted on the mask M. Since the operation of horizontally moving the tension blocks ( 131 in FIG. 2 ) of each substrate tension unit 130 in a direction away from each other has been described above, duplicate description will be omitted.

Subsequently, the substrate S and the mask M are aligned in a state in which the plurality of substrate holder parts 110 are lowered and placed close to the mask M. The alignment of the substrate (S) and the mask (M) is confirmed by the information photographed by the vision camera 470, for example, the alignment marks of the substrate (S) and the mask (M), and then the substrate clamping unit 120 is horizontally This can be done by adjusting the direction. Alignment of the substrate S and the mask M can be precisely performed when the substrate S is flat.

Subsequently, the electrostatic chuck 430 is lowered and the substrate S is chucked to the electrostatic chuck 430 using electrostatic force to maintain the flat state of the substrate S, and the substrate clamping part 120 and the substrate tensioning part ( 130) is moved up and down (that is, a component disposed on top of the substrate S). Since the chucking operation of the substrate S has been described above, redundant description will be omitted.

Subsequently, the mask M is chucked to the electrostatic chuck 430 using electrostatic force to bring the substrate S and the mask M into close contact. In this way, since the substrate S in a flat state and the mask M are brought into close contact with each other by the electrostatic chuck 430, errors in alignment between the substrate and the mask can be reduced when the substrate and the mask in a sagging state come into close contact. Since the chucking operation of (M) has been described above, duplicate descriptions are omitted.

Subsequently, the alignment of the substrate S and the mask M is checked. Checking the alignment of the substrate (S) and the mask (M) can be performed by checking information photographed by the vision camera 470, for example, alignment marks of the substrate (S) and the mask (M). At this time, if it is confirmed that an error occurs in the alignment of the substrate S and the mask M, the alignment of the substrate S and the mask M is corrected by adjusting the electrostatic chuck 430 in a horizontal direction.

Subsequently, a thin film is formed on the substrate S by spraying and depositing a deposition material toward the substrate S using the deposition source 190 .

Subsequently, the substrate clamping unit 120 is moved down, the mask M is de-chucked from the electrostatic chuck 430, and the substrate clamping unit 120 is moved up and down, and then the substrate S is placed in the chamber 401. discharge to the outside.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art to which the present invention pertains can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. you will be able to understand Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting.

100, 400, 500: deposition apparatus 101, 401: chamber
102, 402: pressure control unit 110, 410: plurality of substrate holding units
120, 420: a plurality of substrate clamping units 130, 230, 330: a plurality of substrate tensioning units
140: cool plate 150: magnet assembly
160: Cool plate vertical moving part 170: Cool plate horizontal moving part
180, 470: vision camera 190, 480: deposition source
430: electrostatic chuck 450: electrostatic chuck vertical moving part
460: electrostatic chuck horizontal moving unit

Claims (20)

a plurality of substrate supporters configured to support both ends of the substrate and to move up and down;
a plurality of substrate clamping units disposed above each of the plurality of substrate support units so as to overlap both ends of the substrate and configured to move upward and downward;
a plurality of tension blocks disposed between each of the substrate supporting parts and each of the substrate clamping parts, and horizontally moving away from each other when each of the substrate clamping parts moves downward to tension the substrate; and
Including a plurality of push rods disposed inside each of the tension blocks so as to be able to move up and down and horizontally move each of the tension blocks away from each other by the down movement,
Each of the tensile blocks includes a movement providing hole for providing a space in which the push rod descends, and an insertion hole including an inclined hole for horizontally moving the tensile block by guiding the push rod in an inclined direction when the push rod descends. . delete a plurality of substrate supporters configured to support both ends of the substrate and to move up and down;
a plurality of substrate clamping units disposed above each of the plurality of substrate support units so as to overlap both ends of the substrate and configured to move upward and downward;
a plurality of tension blocks disposed between each of the substrate supporting parts and each of the substrate clamping parts, and horizontally moving away from each other when each of the substrate clamping parts moves downward to tension the substrate; and
Including a plurality of push rods disposed inside each of the tension blocks so as to be able to move up and down and horizontally move each of the tension blocks away from each other by the down movement,
Each of the tensile blocks and each of the push rods constitute a substrate tension unit,
The substrate tensioning part includes a first guide part disposed between each substrate clamping part and each tensile block to guide the tensile block during horizontal movement, and a first guide part disposed between each tensile block and the substrate support part so that each tensile block slides. an anti-slip pad for preventing slipping, a movable holder disposed between each substrate supporter and the anti-slip pad and moved together when the tension block moves horizontally, and a movable holder disposed between the movable holder and the substrate supporter so that the movable holder moves horizontally The deposition apparatus further comprising a second guide unit for guiding the movable holder during movement. According to claim 3,
The deposition apparatus of claim 1 , wherein the substrate extension part further includes an elastic body disposed between a side part of each substrate support part and a side part of the movable holder. a plurality of substrate supporters configured to support both ends of the substrate and to move up and down;
a plurality of substrate clamping units disposed above each of the plurality of substrate support units so as to overlap both ends of the substrate and configured to move upward and downward;
a plurality of tension blocks disposed between each of the substrate supporting parts and each of the substrate clamping parts, and horizontally moving away from each other when each of the substrate clamping parts moves downward to tension the substrate; and
Including a plurality of push rods disposed inside each of the tension blocks so as to be able to move up and down and horizontally move each of the tension blocks away from each other by the down movement,
Each of the tensile blocks and each of the push rods constitute a substrate tension unit,
The substrate tension unit includes a first guide unit disposed between each substrate clamping unit and each tension block to guide the tension block during horizontal movement, and a first guide unit disposed between each tension block and the substrate support unit during horizontal movement of the tension block. The deposition apparatus further comprises a sliding pad for sliding the tensile block. a plurality of substrate supporters configured to support both ends of the substrate and to move up and down;
a plurality of substrate clamping units disposed above each of the plurality of substrate support units so as to overlap both ends of the substrate and configured to move upward and downward;
a plurality of tension blocks disposed between each of the substrate supporting parts and each of the substrate clamping parts, and horizontally moving away from each other when each of the substrate clamping parts moves downward to tension the substrate; and
Including a plurality of push rods disposed inside each of the tension blocks so as to be able to move up and down and horizontally move each of the tension blocks away from each other by the down movement,
Each of the tensile blocks is disposed to be inserted into each of the substrate support parts and constitutes a substrate tension unit together with each of the push rods,
The substrate tensioning part includes a first guide part disposed between each substrate clamping part and each tensile block to guide the tensile block during horizontal movement, and a first guide part disposed between the first guide part and the substrate clamping part to guide the tensile block when the tensile block moves horizontally. The deposition apparatus further includes an anti-slip pad to prevent the substrate moving by horizontal movement from slipping, and a slip pad disposed between each substrate clamping part and the anti-slip pad to allow the substrate to slide. According to claim 6,
The non-slip pad is formed of a rubber material, and the slip pad is formed of Teflon. According to claim 1,
an electrostatic chuck disposed between the substrate clamping portions; and
A mask stage disposed below the electrostatic chuck and configured to support a mask and move up and down;
The electrostatic chuck
a first electrode portion configured to chuck the mask to the electrostatic chuck by electrostatic force;
and a second electrode portion that is insulated from the first electrode portion and configured to chuck the substrate to the electrostatic chuck by electrostatic force. According to claim 8,
The electrostatic chuck further includes a cooling layer disposed on the first electrode part. According to claim 8,
The electrostatic chuck further includes a dielectric layer disposed on the second electrode unit, and an embossing unit disposed on the dielectric layer. a plurality of substrate supporters configured to support both ends of the substrate and to move up and down;
a plurality of substrate clamping units disposed above each of the plurality of substrate support units so as to overlap both ends of the substrate and configured to move up and down;
an electrostatic chuck disposed between the substrate clamping portions; and
a mask stage disposed below the electrostatic chuck and configured to support a mask and to move up and down;
The electrostatic chuck
a first electrode portion configured to chuck the mask to the electrostatic chuck by electrostatic force;
A second electrode portion insulated from the first electrode portion and configured to chuck the substrate to the electrostatic chuck by electrostatic force;
The first electrode part includes a connection part and a plurality of branch parts branched from the connection part,
The second electrode part includes a first electrode and a second electrode disposed to be insulated from each other, the first electrode includes a first connection part and a plurality of first branch parts branched from the first connection part, and the second electrode A deposition apparatus comprising a second electrode including a second connection portion and a plurality of second branch portions branched off from the second connection portion, wherein the first branch portion and the second branch portion are alternately disposed along one direction. delete According to claim 11,
The electrostatic chuck further includes a cooling layer disposed on the first electrode part. According to claim 11,
The electrostatic chuck further includes a dielectric layer disposed on the second electrode unit, and an embossing unit disposed on the dielectric layer. seating the substrate on a plurality of substrate support units spaced apart from each other so that both ends of the substrate are supported;
The plurality of substrate clamping units disposed on each of the plurality of substrate support units are lowered and moved so as to overlap both ends of the substrate, and the plurality of tension blocks disposed between each substrate support unit and each substrate clamping unit are horizontally moved away from each other. tensioning the substrate by moving a push rod inserted into each tensile block downward to move the substrate; and
Lowering the plurality of substrate supports to align the substrate with a mask disposed under the plurality of substrate supports,
Each of the tensile blocks includes a movement providing hole providing a space for the push rod to descend, and an insertion hole including an inclined hole for horizontally moving the tensile block by guiding the push rod in an inclined direction when the push rod descends. . According to claim 15,
After aligning the mask and the substrate,
lowering a cool plate disposed between the plurality of substrate clamping portions to bring it into close contact with the substrate;
lowering a magnet assembly disposed on the cool plate to bring the substrate and the mask into close contact with each other; and
The deposition method further comprising spraying a deposition material toward the substrate using a deposition source disposed below the plurality of substrate supporters and depositing the deposition material on the substrate. According to claim 15,
After aligning the mask and the substrate,
lowering an electrostatic chuck disposed between the plurality of substrate clamping parts and chucking the substrate to the electrostatic chuck using electrostatic force;
chucking the mask using electrostatic force to the electrostatic chuck to bring the substrate and the mask into close contact with each other; and
The deposition method further comprising spraying a deposition material toward the substrate using a deposition source disposed below the plurality of substrate supporters and depositing the deposition material on the substrate. seating the substrate on a plurality of substrate supporters spaced apart from each other so that both ends of the substrate are supported;
lowering the plurality of substrate supports toward a mask disposed below the plurality of substrate supports;
It includes a first electrode part and a second electrode part disposed to be insulated from the first electrode part, and lowers an electrostatic chuck disposed between the plurality of substrate support parts, and lowers the substrate by electrostatic force using the second electrode part. chucking to the electrostatic chuck;
aligning the mask and the substrate chucked by the electrostatic chuck; and
A deposition step including chucking the mask to the electrostatic chuck by electrostatic force using the first electrode part,
The second electrode unit includes a first electrode and a second electrode insulated from each other,
The step of chucking the substrate with the electrostatic chuck includes applying different voltages to the first electrode and the second electrode, respectively, and blocking the voltage applied to the first electrode part. delete seating the substrate on a plurality of substrate supporters spaced apart from each other so that both ends of the substrate are supported;
lowering the plurality of substrate supports toward a mask disposed below the plurality of substrate supports;
It includes a first electrode part and a second electrode part disposed to be insulated from the first electrode part, and lowers an electrostatic chuck disposed between the plurality of substrate support parts, and lowers the substrate by electrostatic force using the second electrode part. chucking to the electrostatic chuck;
aligning the mask and the substrate chucked by the electrostatic chuck; and
A deposition step including chucking the mask to the electrostatic chuck by electrostatic force using the first electrode part,
The step of chucking the mask to the electrostatic chuck may include applying a voltage to the first electrode to generate a potential difference between the mask and the electrostatic chuck, and blocking the voltage applied to the second electrode. Way.

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